WO2014202282A1

WO2014202282A1 - Circuit board

Info

Publication number: WO2014202282A1
Application number: PCT/EP2014/059632
Authority: WO
Inventors: Michael Pechtold; Thomas Hofmann; Johannes Bock
Original assignee: Conti Temic Microelectronic Gmbh
Priority date: 2013-06-20
Filing date: 2014-05-12
Publication date: 2014-12-24

Abstract

The invention relates to a circuit board (1'), comprising internal and external conducting tracks (2', 3', 10), which are arranged on at least one conducting layer (L1 to Ln), and comprising at least two internal electronic components (4', 5'), which are connected to one of the conducting tracks (2', 3', 10) by means of at least one connection pin (4a' to 4c', 5a' to 5c'), wherein the at least two electronic components (4', 5') are arranged in the circuit board (1') in such a way that the connection pins (4a' to 4c', 5a' to 5c') thereof to be connected to each other are directed in the direction of a surface side (O1' or O2') of the circuit board (1').

Description

Description printed circuit board

The invention relates to a circuit carrier, such as a printed circuit board, with inner and outer conductor tracks and at least two electronic components. Furthermore, the invention relates to a method for producing a printed circuit board.

Circuit boards as circuit carriers of electronic circuits and components, such as control devices, sensors, in the

Generally surrounded by a housing, are well known. The assembly and integration of different packaged components, such as Hall sensors, acceleration sensors, is usually between outer layers or surfaces of a circuit board or a printed circuit board by means of different so-called "surface mounted" Techno ^¬ gies and "Embedding" technologies that are known from the printed circuit board technology are. Usually, all electronic components are currently integrated in the same way through the "embedding" technology.

Figures 1 to 3 to the prior art shows a circuit board 1, with tracks 2 and 3, wherein the tracks 2 (= upper tracks 2) on one surface side Ol and the other tracks 3 (= lower tracks 3) on the opposite surface side 02 of Printed circuit board 1 are arranged. The circuit board 1 is equipped with two identically oriented Transis ^¬ motors 4 and 5, in particular power transistors, which in particular are connected as a half-bridge H, as shown in FIG. 1 In this case, has a drain terminal 4c, 5c (= D1, D2) of all to be integrated in the circuit board 1 transistors 4, 5 (power transistors) on a surface side 02 (for

Example below), while a source terminal 4b, 5b (Sl, S2) and a gate terminal 4a, 5a (G1, G2) of the transistors 4, 5 (power transistors) to the other, opposite surface side Ol has (for example, up).

For a better overview, the illustration of a single MOSFET can be seen in FIG.

Such an equidirectional orientation of the transistors 4, 5 in the circuit board 1 in the interconnection of this to a semiconductor bridge H (see Figures 1 and 3) has the disadvantage that the upper source terminal 4b of a transistor 4 to the lower gate terminal 5c of other transistor 5 only by means of a compound 8 of the upper surface side Ol with the lower surface side 02 (for example in the form of a

Through-hole) can be accomplished.

This means an extended distance between the two transistors 4 and 5 and thus a higher ohmic resistance and a higher inductance of the connecting path, which not only come from inner leads 11 to terminals 4e, 5e, 5f for via, but especially through the via from terminal 4e in the upper conductor 2 to the terminal 5f in the lower conductor 3 and their connection 8 itself. The transistors 4 and 5 are connected via further leads 11 to the terminals 4d, 5d in the upper conductor tracks 2.

The invention has for its object to provide a very compact circuit board with at least two electronic components with the shortest possible links. Moreover, it is an object of the invention to provide a method for producing such a printed circuit board.

The object is achieved by the features specified in claim 1. With regard to the method, the object is achieved by the features specified in claim 8. Advantageous developments of the invention are the subject of the dependent claims.

The printed circuit board according to the invention comprises inner and outer conductor tracks, which are arranged on at least one conductor layer, and at least two internal, electronic components whose connection pins are connected to one of the conductor tracks, wherein the at least two electronic components are arranged in the circuit board in that their connection pins to be connected to one another are directed in the direction of a surface side of the printed circuit board.

The known from the prior art vias and long links of the electronic components can be significantly reduced or even avoided. In particular, the electrical paths or links are shorter by "flipping" one of the two electronic components, such as a transistor In addition, the interconnection of the electronic components is on the same board level ("ply") and / or on the same surface side of the board ^¬ terplatte possible.

By shortening the electrical connection distances, the ohmic resistances and inductances in the connection of the two electronic components, such as transistors, are reduced to one another. This in turn leads to lower power losses and better switching behavior in EMC terms.

Another advantage of this arrangement results in the case of a bridge circuit of two transistors. After the voltage connections come to lie on a surface side of the printed circuit board as a result of the inversion of the one transistor, one or more ceramic capacitors for decoupling the bridge circuit from the supply voltage can be connected on this surface side, whereby such components are generally smaller and smaller can be chosen cheaper and both the EMC and the performance of the bridge can be improved. In other words, an embodiment of the invention provides that further connection pins of the at least two electronic components to be connected to one another, in particular transistors of a bridge circuit, by means of a component or a component, such as a ceramic capacitor, from another circuit part, eg Supply voltage, are decoupled. In a further embodiment, the connection pins to be decoupled and the connection pins of the at least two electronic components to be directly connected to one another on opposite surface sides of the circuit board are decoupled or connected. This allows a simple and fast assembly and contacting during manufacture.

According to one possible embodiment, the at least two electronic components are each arranged in an associated molded cavity and are electrically connected to conductor tracks of at least one conductor layer, wherein the connection pins of the two electronic components to be connected to one another are connected in a conductor layer to a conductor track. By the connection with conductor tracks of a conductor layer are

Through holes reliably avoided and short connecting distances possible.

Preferably, the electronic components are spaced from each other. In addition, the respective connection pin of the electronic component (s) is designed as a bonding connection, which branches off in the manner of an arm from the associated electronic component and whose free end is contacted with one of the conductor tracks. The connection pins are contacted in particular in connection with several Lei ^¬ terbahnen in a conductor layer with the conductor tracks, in order to avoid plated-through holes.

In addition, at least one carrier layer, in particular a copper carrier above and / or below the electronic Be arranged component. Such a carrier layer formed of copper can serve as a conductor track and / or connection element, whereby the electrical connection links are further reduced.

The inventive method for producing a printed circuit board with internal and / or external conductor tracks and at least two internal electronic components provides that in the circuit board for each electronic component introduced a cavity, in particular lasered, and the electronic components in this cavity can be arranged such that their connection pins to be connected together are directed in the direction of a surface side of the circuit board and that these connecting pins to be connected to one of the conductor tracks of a conductor layer are connected and fixed together and then optionally the cavities with the positioned therein and electrically connected electronic components. Preferably, to be decoupled connection pins of the electronic components on an opposite surface side of

Printed circuit board connected to conductor tracks of a conductor layer and decoupled by means of a component between these interconnects.

The method is particularly simple and inexpensive and avoids vias.

Embodiments of the invention will be explained in more detail with reference to drawings. FIG. 4 to 9 show schematically different sectional views. FIG

Embodiments of a printed circuit board with inner and outer traces and a plurality of integrated electronic components, which are electrically interconnected.

Corresponding components are provided in all figures with the same reference numerals. Figure 4 shows an embodiment of a circuit board according to the invention 1 ^λ with external conductors 2 ^λ and 3 of which one conductor 2 ^λ on a surface side Ol ^λ in a conductor layer LI (= upper interconnects) and the other interconnects 3 ^λ on the opposite surface side 02 ^{λ of} the circuit board 1 ^λ are arranged in a further conductor layer L2.

The interconnects 2 ^λ , 3 ^λ are formed as copper surfaces or tracks, layers and serve the electrical connection of at least two electronic components 4 ^λ and 5 ^λ . For this purpose, the electronic components 4 ^λ , 5 ^λ with the Lei ^¬ terbahnen 2 ^λ , 3 ^λ connected, in particular cohesively ver ^¬ connected, for example, soldered.

In the embodiment of Figure 4, the electronic components 4 ^λ and 5 ^{λ are} inside lying in the circuit board 1 ^λ in ^¬ tegrated. Alternatively or additionally, further electronic components not shown in detail may be arranged inside and / or outside.

The printed circuit board 1 ^λ may be formed as a single-layer or ^multi- layered printed circuit board with inner and / or outer conductor tracks 2 ^λ and 3 ^λ .

The electronic components 4 ^λ , 5 ^λ may be Halbleitererbauele ^¬ elements, such as transistors, power transistors, sensors, diodes, capacitors and / or control devices. For connecting the two internal electronic components 4 ^λ , 5 in particular their connection pins 4a ^x to 4c 5a ^λ to 5c with the outer conductor tracks 2 ^λ , 3 in particular with terminals 4d 4e 5e 5d ^x in the outer tracks 2 ^λ , 3 are inner conductor tracks 10 or leads 11 ^λ provided.

The two internal electronic components 4 ^λ and 5 ^λ are in the embodiment of Figure 4 transistors which are connected to a Half bridge Η ^λ by means of the outer conductor tracks 2 ^λ , 3 ^λ and the inner leads 11 ^{λ are} connected, as shown by the circuit in Figure 5. The transistors are power transistors, in particular so-called MOSFETs.

In this case, the connection pins 4a ^λ to 4c ^λ of a Tran ^¬ sistors (= 4 ^λ ) form a gate terminal Gl (= 4a ^x ), a Sour- ce terminal Sl (= 4b ^x ) and a drain terminal Dl (= 4c ^x ), and the terminal pins 5a ^λ to 5c ^{λ of} the other transistor (= 5) ^λ a gate terminal G2 (= 5a ^x ), a source terminal S2 (= 5b ^λ ) and a drain terminal D2 (= 5c ^x ), as shown in FIG. In this case, the source terminal Sl of one transistor (= 4 ^λ ) with the drain terminal D2 of the other transistor (= 5 ^λ ) connected directly to each other electrically, wherein the

Drain terminal Dl of one transistor (= 4 ^λ ) from the Sour ^¬ ce terminal S2 of the other transistor (= 5 ^λ ) by means of a component 9, in particular a capacitor, for example a ceramic capacitor, is connected. The at least two electronic components 4 ^λ and 5 ^λ are arranged in the printed circuit board 1 ^λ such that their connection pins to be connected together 4b ^λ (= Soruce port Sl) and 5c ^λ (drain port D2) in the direction of a surface side 02 ^{λ of} the circuit board 1 ^{λ are} directed and thereby on the outer conductor 3 ^λ in a conductor layer L2 directly without

Through-connection are electrically connected to each other.

For this purpose, the connection pins 4b ^λ and 5c ^{λ to} be electrically connected are by means of the inner lead 11 ^λ or an electrically conductive layer 6, in particular an electrically conductive adhesive, with the relevant terminals 4e ^λ or 5f ^λ in the conductor 3 ^λ of a conductor layer L2 electrically connected.

The electrically conductive layer 6 ^λ serves the material-conclusive attachment of the respective electronic component 4 ^λ , 5 ^λ on the copper layer of the conductor 2 ^λ or 3 ^λ . The electronic components 4 5 ^λ may be integrated in the circuit substrate or circuit board 1 ^λ both as packaged as well as a "bare the" components. Figure 6 shows in detail the connection of the connecting pins 4c ^λ and 5b ^λ of at least two electronic components 4 ^λ or 5 ^λ by means of the component 9 ^λ or a decoupling element, in ^¬ particular of a capacitor on the outside of the surface ^¬ side Ol ^λ on the associated terminals 4f ^λ and 5f ^λ of upper tracks 2 ^λ in the one conductor layer LI is attached by means of an electrically conductive layer 6 in particular a elekt ^¬ driven conductive adhesive.

As shown in FIG. 6, the connection pins 4c ^λ and 5b ^λ to be decoupled and their terminals 4f ^λ and 5e ^λ in the upper interconnects 2 ^λ and the connection pins 4b ^λ and 5c ^λ and their interconnected directly to one another Terminals 4e ^λ and 5f ^{x arranged} on opposite surface sides of Ol ^λ and 02 ^{λ of} the circuit board 1 ^λ .

Below are based on MOSFETs "the bare" ^λ 4, and ^λ 5 by way of example different possible Reali ^¬ sierungsvarianten shown and described as an electronic component here means.:

"Face up": = source terminal Sl and gate terminal Gl oriented upward towards the upper surface side Ol.

"Face down": source S2 and gate G2 oriented down towards the lower surface side 02.

The following component carrier is in particular at least one conductor layer, which is arranged above and / or below the electronic component 4 ^λ and 5 ^λ and at least one of the interconnects 2 3 ^λ or 10 and one of the adjacent printed circuit board insulating LPl to LPm is formed. Figure 7 shows an embodiment for a multilayer printed circuit board 1 ^λ having a plurality of insulating layers LPL to LPm and a plurality of outer strip conductors 2 ^λ 3 ^λ and internal interconnects 10, in particular so-called copper intermediate layers in multiple conductor layers LI to Ln.

The at least two internal electronic components 4 5 ^λ are integrated into the second insulating layer LP2. In the circuit board 1 ^λ , the electronic components 4 ^λ and 5 ^λ are arranged spaced from each other.

The respective connection pin 4a ^λ to 4c ^λ and 5a ^λ to 5c ^{λ of} the electronic components 4 ^λ and 5 ^λ is formed as a bond connection, which in the manner of an arm of the associated electronic component 4 ^λ and 5 ^λ goes off and whose free end is contacted with one of the conductor tracks 2 ^λ , 3 ^λ or 10.

In this case, the electronic components 4 ^λ , 5 ^λ on a component carrier, for example a copper carrier,

Cu leadframe, Cu-laminated laminate foil, electrically conductively fixed, in particular by soldering, sintering, conductive bonding, etc ..

The component carrier is aligned and pressed "face up" or "face down" during the laying / stacking of the conductor layers LI to Lm and the insulating layers LP1 to LPm.

The component carrier is contacted by drilling and etching processes using micro-vias.

The electronic components 4 ^λ, 5 ^λ be ankontaktiert also by drilling and etching processes by micro-vias (supply lines 11 and ^¬ connections 4d ^x to 4f ^λ and 5d ^x to 5f ^λ. Figure 8 shows an alternative embodiment for a multilayer printed circuit board 1 ^λ . The at least two internal electronic components 4 5 ^λ are integrated into the second conductor layer L2.

In this case, the electronic components 4 ^λ and 5 ^{λ are introduced} into an associated cavity K of a component carrier and assembled and fixed electrically conductive, for example by soldering, sintering, Leitkleben.

The component carrier is aligned and pressed "face up" or "face down" when laying / stacking the conductor layers LI to Ln and the insulating layers LP1 to LPm.

The component carrier is contacted by drilling and etching processes by means of micro-vias (= inner leads 11 ^λ ).

The electronic components 4 ^λ and 5 ^λ are also by drilling and etching processes by micro vias (= leads 11 ^λ ) to the terminals 4d ^x to 4f ^λ and 5d ^x to 5f ^λ one of the inside and / or outside conductor tracks. 2 ^λ , 3 10 of a Leitlage LI to Ln ankontaktiert.

In this case, the at least two electronic components 4 ^λ and 5 ^{λ may be arranged} in each case in an associated molded cavity K and electrically connected to inner and / or outer conductor tracks 2 ^λ , 3 ^λ and 10 at least one conductor layer LI to Ln. In this case, the connection pins 4b ^λ and 5c ^{λ of} the two electronic components 4 ^λ and 5 ^λ to be connected to one another are connected in a conductor layer L3 to a conductor track 4e ^λ .

The exemplary embodiment according to FIG. 8 has the advantage over the ^exemplary embodiment according to FIG. 7 that no openings / "windows" in the laminate of the insulating layers LP1 to LPm in the area of the electronic components 4 are present when the prepreg layers or insulating layers LP1 to LPm are laid ^λ , 5, for example, a chip must be. The disadvantage is that the components or electronic components 4 ^λ , 5 ^λ in the embodiment of Figure 8 in a cavity K of one of the inner conductor tracks 10 of the respective conductor layer L2 and thus the copper must be assembled.

FIG. 9 shows a further alternative exemplary embodiment of a multilayer printed circuit board 1 ^λ with three insulating layers LP1 to LP3, of which two insulating layers LP1 and LP2 directly adjoin each other without intermediate conductor tracks, and with inner and outer conductor tracks 2 3 10 in three conductor layers LI to L3 are connected.

For this purpose, between the integrated in the insulating layer LP1 electronic component 4 ^λ and the adjacent insulating layer LP2 an electrically insulating adhesive 7 or other suitable electrically insulating material, in the manner of a layer ordered on ^¬ . The electronic components 4 ^λ , 5 ^λ are glued "face up" or "face down" on a Cu carrier film as a component carrier.

Subsequently, the structure of the inner layers and thus the iso ^¬ lierlagen LP1 and LP2 are laid and pressed. The core is drilled at the contact points and by chemical processes, the micro-via connections between the inner layers, the insulating layers LP1 to LP2 and the components 4 ^λ , 5 ^λ (top and bottom) generated.

Claims

claims

1. printed circuit board (1 ^λ ) with inner and outer lying Lei ^¬ terbahnen (2 3 10), which are arranged on at least one conductor layer (LI to Ln), and with at least two internal electronic components (4 ^λ , 5 ^λ ) which are connected by means of at least one connection pin (4a ^x to 4c 5a ^x to 5c ^x ) with one of the conductor tracks (2 ^λ , 3 10), wherein the at least two electronic components (4 5 ^λ ) in the circuit board (1 ^λ ) are arranged so that their connection pins to be connected together (4a ^x bis4c 5a ^x bis5c ^x ) in the direction of a surface side (Ol ^λ or 02 ^λ ) of the circuit board (1 ^λ ) are directed.

2. printed circuit board (1 ^λ ) according to claim 1,

wherein further each other to be connected to connection pins (4a to 4c ^λ ^λ 5a to 5c ^λ) of the at least two electronic Bautei ^¬ le (4 ^λ, ^λ 5) via a component are ^(λ 9) connected together.

3. printed circuit board (1 ^λ ) according to claim 2,

wherein the above, the component (9) to be connected to ^¬ circuit pins (4a ^x to 4c 5a ^x-5c ^x) and directly with each other to be connected to connection pins (4a ^λ to 4c 5a ^λ to 5c ^λ) of the at least two electronic Components (4 ^λ , 5 ^λ ) on opposite surface sides (01 02 ^λ ) of the circuit board (1 ^λ ) are connected.

4. printed circuit board (1 ^λ ) according to one of the preceding claims, wherein the at least two electronic components (4 5 ^λ ) in each case an associated potted cavity (K) and arranged electrically with conductor tracks (2 ^λ , 3 10) at least one conductor layer ( LI to Ln), wherein the connection pins (4a ^λ to 4c 5a ^λ to 5c ^λ ) to be connected to each other of the two electronic components (4 5 ^λ ) in a conductor layer (LI to Ln) with a conductor track (2 ^λ , 3 10) are connected.

5. printed circuit board (1 ^λ ) according to any one of the preceding claims, wherein the electronic components (4 5 ^λ ) are arranged spaced from each other.

6. printed circuit board (1 ^λ ) according to any one of the preceding claims, wherein the respective terminal pin (4a ^x to 4c 5a ^x to 5c ^x ) of the electronic components or (4 5 ^λ ) as a

Bond connection is formed, which in the manner of an arm of the associated electronic component (4 5 ^λ ) goes off and whose free end with one of the conductor tracks (2 ^λ , 3 10) is contacted.

7. printed circuit board (1 ^λ ) according to one of the preceding claims, wherein at least one carrier layer above and / or below the electronic component (4 5 ^λ ) is arranged.

8. A method for producing a printed circuit board (1 ^λ ) with inner and / or outer conductor tracks (2 ^λ , 3 10) and at least two internal electronic components (4 ^λ , 5 ^λ ) according to any one of the preceding claims,

wherein a cavity (K) is introduced into the printed circuit board (1 ^λ ) for each electronic component (4 5 ^λ ) and the electronic components (4 5 ^λ ) can be arranged in this cavity (K) in such a way that their connection to each other is closing pins (4a ^x to 4c 5a ^x to 5c ^x ) in the direction of a

Surface side (Ol ^λ or 02 ^λ ) of the circuit board (1 ^λ ) are directed and these connecting pins (4a ^x to 4c 5a ^x to 5c ^x ) with one of the tracks (2 ^λ , 3 10) of a conductor layer (LI to Ln) are connected and fixed together.

9. The method according to claim 8,

wherein over the component (9) to be connected to connection pins (4a ^λ to 4c 5a ^x-5c ^x) of the electronic parts (4 5 ^λ) on an opposite surface side (01 02 ^λ) of the circuit board (1 ^λ) (with conductor tracks 2 ^λ , 3 10) a Lei ^¬ terlage (LI to Ln) are connected and by means of a Bau ^¬ part (9 ^λ ) between these interconnects (2 ^λ , 3 10) are interconnected.