WO2014202274A1 - Vorrichtung und verfahren zur überwachung eines leistungshalbleiterschalters - Google Patents
Vorrichtung und verfahren zur überwachung eines leistungshalbleiterschalters Download PDFInfo
- Publication number
- WO2014202274A1 WO2014202274A1 PCT/EP2014/059283 EP2014059283W WO2014202274A1 WO 2014202274 A1 WO2014202274 A1 WO 2014202274A1 EP 2014059283 W EP2014059283 W EP 2014059283W WO 2014202274 A1 WO2014202274 A1 WO 2014202274A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power semiconductor
- semiconductor switch
- current
- voltage
- expected
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/327—Testing of circuit interrupters, switches or circuit-breakers
- G01R31/3271—Testing of circuit interrupters, switches or circuit-breakers of high voltage or medium voltage devices
- G01R31/3275—Fault detection or status indication
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/18—Modifications for indicating state of switch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
Definitions
- the invention relates to a device and a method for monitoring a power semiconductor switch for the purpose of ensuring the functional safety of the respective power semiconductor.
- the invention is based on the problem that, in the case of a device with a switching element, there must be a possibility with which it is possible to check whether the switching element is available if the device is to meet an increased safety level. The same applies if you want find a power ⁇ semiconductor switch used as a switching element. Accordingly, there is for a device with a power semiconductor switch as a switching element, such as an inverter, the emergency ⁇ necessity, the function of the power semiconductor switch re- regularly be inspected to ensure that it is available.
- the invention is therefore based on the object to provide a Vorrich ⁇ device and a method for monitoring a power semiconductor switch, or the no interference with the power circuit of the power semiconductor switch neces ⁇ ed.
- a device for monitoring a power semiconductor switch there is vorgese ⁇ hen that this the following functional units comprises: first means for applying the power semiconductor switch with a high-frequency voltage (RF voltage U HF) at a frequency above a switching threshold of the power semiconductor ⁇ conductor switch additionally to a control of the power semiconductor switch by means of an external An Kunststoffsig-, wherein the external drive signal leads to a drive signal corresponding to the switching state of the power semiconductor switch. Then means for detecting a due to the application of the power semiconductor switch with the RF voltage (U HF ) resulting RF current (I HF , i st) - The Wei ⁇ nic means for comparing the resulting RF current
- the Leis ⁇ semiconductor switch in addition to a control means of an external drive signal with a fructfrequen ⁇ th voltage (RF voltage U HF) having a frequency above a switching threshold of the power semiconductor switch is ⁇ controls.
- the external control signal leads to the on ⁇ control signal corresponding switching state of the power semiconductors switch.
- the resulting HF current ( ⁇ HF , i st) is supplied with a state of tion semiconductor switch due to the application of the power semiconductor switch with the RF voltage (U H F) erwar ⁇ teten HF current (I HF, S O II) compared. Depending on the result of this comparison He ⁇ a tripodleiterzu- status signal is generated.
- the advantage of the invention is that with the approach presented here, a device and a method are specified, which or which tests by means of the control of the power semiconductor switch whose functionality, without thereby engage in the actual power circuit ⁇ .
- FIG. 1 shows an equivalent circuit diagram of a power semiconductor switch in the form of a MOSFET
- FIG. 2 shows an equivalent circuit of a power semiconductor scarf ⁇ ters in the form of an IGBT
- 3 shows a drive circuit for driving a power semiconductor switch
- FIG. 4 shows a drive circuit of Figure 3 with a scarf ⁇ processing part for controlling the power semiconductor switch to the test of its ability to function
- FIG. 5 shows a monitoring circuit for evaluating the activation of the power semiconductor switch taking place by means of the circuit part in FIG. 4,
- FIG 6 shows a semiconductor module with a power semiconductor switch, a circuit part according to FIG 4 and a monitoring circuit according to FIG 5 and
- FIG. 1 and FIG. 2 show equivalent circuit diagrams of power semiconductor switches (power semiconductors) 10, which are suitable for safety functions today.
- the illustration in FIG. 1 shows the equivalent circuit diagram of a MOSFET 12 and the illustration in FIG. 2 shows the equivalent circuit diagram of an IGBT 14.
- a power semiconductor switch 10 in the form of a MOSFET 12 has a gate connection (G), a source connection (S) and a drain connection (D).
- a power semiconductor switch 10 in the form of an IGBT 14 has a gate terminal (G), a collector terminal (C) and an emitter terminal (E).
- the ent ⁇ speaking resultant of the component characteristics of capacitance is located in the equivalent circuits specifically for a MOSFET 12 in the form of a capacitor having the capacitance C G s between the gate terminal (G) and (the source terminal S ), a capacitor with the Capacitance C GD between the gate terminal (G) and the drain terminal (D) and a capacitor with the capacitance C D s between the drain terminal (D) and the source terminal (S).
- a capacitor with the Capacitance C GD between the gate terminal (G) and the drain terminal (D)
- a capacitor with the capacitance C D s between the drain terminal (D) and the source terminal (S).
- FIG. 1 the equivalent circuit diagram of an inverse diode 16 included in such a power semiconductor switch 10 is shown for the representation of the equivalent circuit diagram of a power semiconductor switch 10 in the form of a MOSFET 12.
- a power semiconductor switch 10 in particular a power semiconductor switch 10 in the form of a MOSFET 12 or in the form of an IGBT 14 is disturbed, this is reflected in an altered capacitive behavior.
- a disturbance of the power semiconductor switch 10 is understood a partial destruction of the respective component, but also a loss of at least one contact.
- a destruction of cell areas of a power semiconductor scarf ⁇ ters 10 has, for example, a reduction in the broughtskapa ⁇ capacity, so the gate capacitance C G s in the MOSFET 12 or ⁇ gate capacitance C GE in the IGBT 14, the consequence. Even smaller Störun ⁇ gen can be recognized.
- FIG. 3 and FIG. 4 show drive circuits 20 for driving a power semiconductor switch 10.
- the power semiconductor switch 10 is shown together with a parallel-connected inverse diode 16, as is the case, for example, in an input converter or an output converter of an AC / AC converter.
- the power semiconductor switch 10 is, depending on the switching position of one of the driving circuit 20 included the switch 22 with a positive or a negative driving potential, here in the form of a first, for example, +15 V supplied voltage source 24 and a second, for example, -15 V lie ⁇ fernden voltage source 26 shown, acted / driven.
- the drive circuit 20 shown in FIG. 3 corresponds to a drive circuit 20, as is known in the prior art.
- the drive circuit 20 shown in FIG. 3 corresponds to a drive circuit 20, as is known in the prior art.
- the drive circuit 20 shown in FIG. 3 corresponds to a drive circuit 20, as is known in the prior art.
- the drive circuit 20 shown in FIG. 3 corresponds to a drive circuit 20, as is known in the prior art.
- the drive circuit 20 shown in FIG. 3 corresponds to a drive circuit 20, as is known in the prior art.
- the circuit part 30 is correspondingly an example of means 30 for acting on the power semiconductor switch 10 with an RF voltage
- an HF voltage source 32 is shown as the basis for the high-frequency voltage (UHF). This is by means of one of the circuit portion 30 in a series circuit with the RF voltage source 32 included Abkoppelkondensators 34 with the capacity CHF combinfrequenzchip decoupled from the gate terminal of jewei ⁇ ligen power semiconductor switch 10.
- a current (I HF) resulting from the high-frequency voltage (UHF), which is referred to below as HF current is detected by means of a shunt resistor (RHF) 36.
- RHF shunt resistor
- the detection of the HF current (I HF) can also be done inductively, for example.
- the shunt resistor (RHF) 36 or an inductive Erfas ⁇ solution of the RF current (I HF) are in accordance with Examples of tel ⁇ for detecting the result of the impingement of the performance tion semiconductor switch (10) with the RF voltage (U HF ) re ⁇ sultierenden HF current (I H F, i st) -
- Frequency and amplitude of the high-frequency voltage (U HF ) are chosen so that the frequency is far above the switching frequency of the power semiconductor switch 10. Accordingly, the frequency is, for example, a frequency greater than 10 MHz into consideration.
- the amplitude of the high-frequency voltage (U HF) is provided, that this is far below the normal voltage values, such as are used for driving a power semiconductor switch ⁇ 10th Accordingly, an amplitude of about 1 V, for example, comes into consideration.
- the control circuit 20 is assigned a monitoring circuit 40.
- the monitoring circuit 40 is at a first input 42, the switching state of the switch 22 of the An Kunststoffschal ⁇ device 20 is supplied.
- the monitoring circuit 40 is fed directly or indirectly to the current (I HF ) resulting from the high-frequency voltage (U HF ) at a second input 44, for example in the form of a measure of the voltage which can be tapped across the shunt resistor 36. If the monitoring circuit 40 is a measure of the above
- the monitoring circuit 40 includes an HF current Istwert- determination device 46.
- the functionality of the RF current Istwertresvortechnisch 46 consists, for example, that from the supplied at the second input 44 measure for the tapped off the shunt resistor 36 and the voltage Known value of the resistance of the shunt resistor 36 of the Quo ⁇ tient is formed.
- the current HF current resulting from the high-frequency voltage (U HF ) is available at the output of the HF current actual value determination device 46 ( ⁇ HF, i st ) or a measure of the resulting current RF current ( ⁇ HF, is).
- the current RF current (LHF, i st) by means of a comparator 48 with a result of the high-frequency voltage (U HF) he ⁇ waiting RF current (I HF, soii) compared.
- the expected RF current (IHF, SOII) or a measure of the expected RF current (I H F, SOII) is provided by means of an RF current setpoint determination device 50. This processed as an input to the monitoring circuit 40 at the first input 42 supplied
- the functionality of the RF current setpoint determination device 50 may, for example, be realized in the form of a table which in a first table element is a measure of the expected HF current (I HF , SOIII ) for a first switch position the Schal ⁇ ters 22 and in a second table element, a measure of the expected RF current (I HF , SOII2 ) for a second switching position of the switch 22 includes.
- the comparator 48 carries out the actual comparison between the respectively expected HF current (I HF , SOII ) and the respective actual HF current (I HF , ist ) due to the high-frequency voltage (U HF ).
- the monitoring circuit 40 and which comprised Kompara- gate 48 are thus an example of means to compare the resulting RF current (LHF, i st) w ith the result of the Be ⁇ aufschlagung of the power semiconductor switch depending on the switching ⁇ state of the power semiconductor switch 10 10 the HF voltage (U H F) expected HF current (IHF, SOII) -
- the comparator 48 When the comparator 48 detects equality or equality within a predetermined or predeterminable tolerance range, the comparator 48 outputs at its output as the output. output 52 of the monitoring circuit 40 acting output from a good signal. If there is no equality or sufficient equality of the two currents or current values compared by means of the comparator 48, the comparator 48 outputs an error signal accordingly.
- a good signal and as Def ⁇ lersignal for example come a first defined signal level and a second of defined signal level into consideration, so that the signal provided at the output 52 of the monitoring circuit 40 can be processed as a binary signal and shows the state of each monitored power semiconductor switch 10 at ⁇ ,
- the monitoring circuit 40 may be implemented and operate on an analog or digital basis.
- the advantage of the proposed solution is that for monitoring the function of the power semiconductor switch 10 is not intervened in the respective power circuit 56, 58 (FIG 6).
- the monitoring circuit 40, together with the circuit part 30, can be integrated into an "intelligent" semiconductor module 60, as shown schematically in FIG. 6.
- FIG. 6 shows, in the form of a schematically simplified block diagram, a semiconductor module 60 which operates according to the approach described here.
- the semiconductor module 60 is correspondingly an example of a device for
- the semiconductor module 60 comprises at least the respective power semiconductor switch 10, possibly the power semiconductor switch 10 and the inverse diode 16, the circuit part 30 explained with reference to FIG. 4 and the monitoring circuit 40 explained with reference to FIG. 5.
- Such a semiconductor module 60 is provided by means of a switch 22 or the like controllable. A respectively resulting on control signal 62 is supplied to the power semiconductor switch 10 and the monitoring circuit 40.
- the cruschlei ⁇ terschalter 10 is also by means of the circuit part 30 and the generated there high-frequency voltage (U H F) with a RF signal 64 is driven at a frequency above the switching threshold of the power semiconductor switch 10 (horizontal arrow pointing to the right of the circuit portion 30 for Leis ⁇ semiconductor switch 10).
- a thereby flowing RF current (I HF) depends on the input capacitance of the power semiconductor switch ⁇ 10, by means of the circuit part 30, for example by means of a local shunt resistor 36, detected (horizontally to the left arrow from the power semiconductor switch ⁇ 10th to the circuit part 30) and to the monitoring circuit 40 (vertically downward white- emitting arrow from the circuit part 30 to the monitoring circuit 40).
- the drive signal 62 is the power semiconductor scarf ⁇ ter 10 and also supplied to the monitoring circuit 40 in parallel.
- a status-dependent expected HF current or a status-dependent measure for an expected HF current results within the monitoring circuit 40. This or this is compared by means of the monitoring circuit 40 with the actual HF current obtained by the circuit part 30 or the measure of the actual HF current received by the circuit part 30.
- At the output 52 of the monitoring circuit 40 and the coincident output of the semiconductor module 60 is dependent on the Er ⁇ result of comparison dependent linen HalbleiterSullivans- signal 66, which is evaluable for monitoring the power semiconductor switch 10 and evaluated during operation.
- the encompassed by the monitoring circuit 40 comparator 48 is therefore an example of a means for generating a power semiconductor status signal 66 in response to the He ⁇ result of comparing actual and expected RF power.
- the respective power circuit 56, 58 is connected to the drain and source terminal or to the collector and emitter terminal of the respective power semiconductor switch 10.
- At the output 52 of the monitoring circuit 40 of such a semiconductor module 60 can be tapped examschleiterSch- signal 66 indicates the functionality of the respective Leis ⁇ tung semiconductor switch 10th As long as there is a signal is indicative of an equality or an adequate DC ⁇ plurality of expected and actual RF current comprised of the semiconductor module 60 power semiconductor switch can 10 as safe
- the RF voltage can also be impressed there.
- the Dar ⁇ position in FIG 7 shows a corresponding circuit part 30 '.
- the ⁇ ses comprises a Abkoppeldiode 68 and one of the Abkoppeldiode 68 parallel-connected capacitance (the drive circuit 20 according to FIG 3 is shown in FIG 7, only as a function block).
- the functionality realized by means of the circuit part 30 ' can also be understood as a disconnection circuit.
- the capacitances included therein may not be much lower than the capacitance of the power semiconductor switch 10 to be measured, so that a sufficient measuring accuracy can be achieved.
- Switching threshold of the power semiconductor switch 10 means 36 for detecting a due to the application of the power semiconductor switch 10 with the RF voltage (U HF ) RF power (lHF, is) / means (40, 48) for comparing the resulting RF current (lHF, is) with one depending on
- Switching state of the power semiconductor switch 10 due to the application of the power semiconductor switch 10 with the RF voltage (U H F) expected RF current (I H F, S O II) and means 48 for generating a power semiconductor condition signal 66 depending on the result of the comparison includes, and a corresponding method for monitoring a power semiconductor switch ⁇ 10.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/897,160 US9829534B2 (en) | 2013-06-18 | 2014-05-07 | Device and method for monitoring a power semiconductor switch |
CN201480034065.6A CN105324675B (zh) | 2013-06-18 | 2014-05-07 | 用于监控功率半导体开关的装置和方法 |
EP14726091.3A EP2989476A1 (de) | 2013-06-18 | 2014-05-07 | Vorrichtung und verfahren zur überwachung eines leistungshalbleiterschalters |
RU2016101071A RU2633294C2 (ru) | 2013-06-18 | 2014-05-07 | Устройство и способ контроля силового полупроводникового переключателя |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013211411.7A DE102013211411A1 (de) | 2013-06-18 | 2013-06-18 | Vorrichtung und Verfahren zur Überwachung eines Leistungshalbleiterschalters |
DE102013211411.7 | 2013-06-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014202274A1 true WO2014202274A1 (de) | 2014-12-24 |
Family
ID=50792416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/059283 WO2014202274A1 (de) | 2013-06-18 | 2014-05-07 | Vorrichtung und verfahren zur überwachung eines leistungshalbleiterschalters |
Country Status (6)
Country | Link |
---|---|
US (1) | US9829534B2 (de) |
EP (1) | EP2989476A1 (de) |
CN (1) | CN105324675B (de) |
DE (1) | DE102013211411A1 (de) |
RU (1) | RU2633294C2 (de) |
WO (1) | WO2014202274A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3039905B1 (fr) * | 2015-08-07 | 2019-01-25 | STMicroelectronics (Alps) SAS | Source de tension |
DE102017219897A1 (de) * | 2017-11-09 | 2019-05-09 | Bayerische Motoren Werke Aktiengesellschaft | Schutzschaltung für ein Hochvoltbordnetz eines Kraftfahrzeugs, Hochvoltbordnetz sowie Kraftfahrzeug |
FR3084466B1 (fr) * | 2018-07-26 | 2021-01-15 | Continental Automotive France | Procede de detection in situ du dysfonctionnement d'un dispositif radiofrequence |
EP3696558A1 (de) * | 2019-02-15 | 2020-08-19 | Siemens Aktiengesellschaft | Vorrichtung und verfahren zur automatischen prüfung eines schaltorgans |
DE102019113717A1 (de) * | 2019-05-23 | 2020-11-26 | Bayerische Motoren Werke Aktiengesellschaft | Schutzschaltung für ein Hochvoltbordnetz eines Kraftfahrzeugs, Hochvoltbordnetz sowie Kraftfahrzeug |
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EP1083658A1 (de) * | 1999-09-08 | 2001-03-14 | Rolf Dr.-Ing. Melcher | Schaltungsanordnung zur Überwachung eines zum Steuern einer Last vorgesehenen elektronischen Schalters |
US20060107241A1 (en) * | 2002-12-25 | 2006-05-18 | Nec Corporation | Evaluation device and circuit design method used for the same |
DE102007026784A1 (de) * | 2007-06-09 | 2008-12-24 | Isle Gmbh | Verfahren zur Bestimmung von Kapazitäts-Spannungskennlinien elektronischer Schaltelemente |
DE102009006970A1 (de) * | 2009-02-02 | 2010-08-05 | Siemens Aktiengesellschaft | Potentialgetrennte Funktionsprüfung für Bauelemente |
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SU1075201A1 (ru) | 1982-02-16 | 1984-02-23 | Предприятие П/Я Х-5734 | Устройство дл измерени критического тока транзисторов |
JP2001125943A (ja) * | 1999-10-28 | 2001-05-11 | Nec Corp | 電源デカップリング回路の設計方法および設計支援システム |
US6405154B1 (en) | 1999-12-29 | 2002-06-11 | General Electric Company | Method and apparatus for power electronics health monitoring |
US6337804B1 (en) * | 2000-09-26 | 2002-01-08 | General Electric Company | Multilevel PWM voltage source inverter control at low output frequencies |
DE10308313B4 (de) | 2003-02-26 | 2010-08-19 | Siemens Ag | Halbleiterdiode, elektronisches Bauteil, Spannungszwischenkreisumrichter und Steuerverfahren |
DE10351387A1 (de) | 2003-11-04 | 2005-06-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schaltervorrichtung |
DE102004035789B4 (de) | 2004-07-23 | 2016-04-07 | Siemens Aktiengesellschaft | Traktionsstromrichter mit einem netzseitigen Vierquadrantensteller |
DE102005045957A1 (de) | 2005-09-26 | 2006-11-16 | Siemens Ag | Verfahren und Vorrichtung zur Übertragung von Signalen |
CN101896019B (zh) | 2006-06-02 | 2013-07-24 | 松下电器产业株式会社 | 用于高频介质加热功率的功率控制单元 |
DE102006042945B4 (de) | 2006-09-13 | 2011-07-21 | Siemens AG, 80333 | Verfahren zur Effizienzsteigerung von dieselelektrisch getriebenen Fahrzeugen und Fahrzeug zur Durchführung des Verfahrens |
DE102007006840B3 (de) | 2007-02-12 | 2008-04-24 | Siemens Ag | Dämpfungselement |
US20090085542A1 (en) * | 2007-09-27 | 2009-04-02 | Kabushiki Kaisha Toshiba | Drive system for power semiconductor device |
DE102007060188A1 (de) | 2007-12-14 | 2009-06-25 | Siemens Ag | Antriebssystem und zugehöriges Steuerverfahren |
KR101419993B1 (ko) * | 2009-06-16 | 2014-07-15 | 에이비비 테크놀로지 아게 | 스위칭 셀을 테스팅하기 위한 장치 |
JP5007754B2 (ja) | 2010-05-14 | 2012-08-22 | 株式会社デンソー | 電力変換システムの放電制御装置 |
DE102011105112A1 (de) * | 2011-06-21 | 2012-12-27 | Volkswagen Aktiengesellschaft | Verfahren und Vorrichtung zur Überwachung eines Schaltzustandes |
US9150108B2 (en) * | 2012-04-16 | 2015-10-06 | Ford Global Technologies, Llc | High-frequency signal injection based high voltage interlock |
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2013
- 2013-06-18 DE DE102013211411.7A patent/DE102013211411A1/de not_active Ceased
-
2014
- 2014-05-07 RU RU2016101071A patent/RU2633294C2/ru not_active IP Right Cessation
- 2014-05-07 WO PCT/EP2014/059283 patent/WO2014202274A1/de active Application Filing
- 2014-05-07 CN CN201480034065.6A patent/CN105324675B/zh not_active Expired - Fee Related
- 2014-05-07 EP EP14726091.3A patent/EP2989476A1/de not_active Withdrawn
- 2014-05-07 US US14/897,160 patent/US9829534B2/en not_active Expired - Fee Related
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EP1083658A1 (de) * | 1999-09-08 | 2001-03-14 | Rolf Dr.-Ing. Melcher | Schaltungsanordnung zur Überwachung eines zum Steuern einer Last vorgesehenen elektronischen Schalters |
US20060107241A1 (en) * | 2002-12-25 | 2006-05-18 | Nec Corporation | Evaluation device and circuit design method used for the same |
DE102007026784A1 (de) * | 2007-06-09 | 2008-12-24 | Isle Gmbh | Verfahren zur Bestimmung von Kapazitäts-Spannungskennlinien elektronischer Schaltelemente |
DE102009006970A1 (de) * | 2009-02-02 | 2010-08-05 | Siemens Aktiengesellschaft | Potentialgetrennte Funktionsprüfung für Bauelemente |
Also Published As
Publication number | Publication date |
---|---|
CN105324675B (zh) | 2018-07-27 |
US20160124040A1 (en) | 2016-05-05 |
US9829534B2 (en) | 2017-11-28 |
RU2633294C2 (ru) | 2017-10-11 |
DE102013211411A1 (de) | 2014-12-18 |
RU2016101071A (ru) | 2017-08-02 |
EP2989476A1 (de) | 2016-03-02 |
CN105324675A (zh) | 2016-02-10 |
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