WO2014200071A1 - Feuille adhésive - Google Patents

Feuille adhésive Download PDF

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Publication number
WO2014200071A1
WO2014200071A1 PCT/JP2014/065629 JP2014065629W WO2014200071A1 WO 2014200071 A1 WO2014200071 A1 WO 2014200071A1 JP 2014065629 W JP2014065629 W JP 2014065629W WO 2014200071 A1 WO2014200071 A1 WO 2014200071A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive sheet
parts
mass
Prior art date
Application number
PCT/JP2014/065629
Other languages
English (en)
Japanese (ja)
Inventor
友也 津久井
剛介 中島
Original Assignee
電気化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 電気化学工業株式会社 filed Critical 電気化学工業株式会社
Priority to JP2015522864A priority Critical patent/JPWO2014200071A1/ja
Publication of WO2014200071A1 publication Critical patent/WO2014200071A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3203—Polyhydroxy compounds
    • C08G18/3206—Polyhydroxy compounds aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
    • C08G18/8025—Masked aliphatic or cycloaliphatic polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
    • C08G18/8029—Masked aromatic polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8141—Unsaturated isocyanates or isothiocyanates masked
    • C08G18/815—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen
    • C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
    • C08G18/8175—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen with esters of acrylic or alkylacrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

L'invention porte sur une feuille adhésive qui est telle que la concentration en carbone organique total dans de l'eau de lavage pendant un processus de découpage en dés ou après le processus de découpage en dés est à un niveau extrêmement faible, il n'y a pas de projection de copeaux pendant le processus de découpage en dés, elle est facilement saisie et un résidu de colle se forme difficilement. La feuille adhésive selon la présente invention résulte de la stratification d'une couche adhésive sur un substrat, la couche adhésive étant une couche adhésive photodurcissable, la couche adhésive photodurcissable contenant 100 parties en masse d'un copolymère d'ester d'acide (méth)acrylique, 5 à 200 parties en masse d'un composé photodurcissable, 0,1 à 20 parties en masse d'un agent durcisseur isocyanate polyfonctionnel et 0,1 à 20 parties en masse d'un photoinitiateur, la masse moléculaire moyenne en poids du composé photodurcissable étant d'au moins 500, la feuille adhésive étant ajustée à la taille de 50 mm x 50 mm et la concentration en carbone organique total (COT) qui est lessivé hors de celle-ci lorsqu'elle est immergée dans 500 ml d'eau pure pendant 24 heures étant inférieure ou égale à 5,0 mg/l.
PCT/JP2014/065629 2013-06-14 2014-06-12 Feuille adhésive WO2014200071A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015522864A JPWO2014200071A1 (ja) 2013-06-14 2014-06-12 粘着シート

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013125316 2013-06-14
JP2013-125316 2013-06-14
JP2013-145675 2013-07-11
JP2013145675 2013-07-11

Publications (1)

Publication Number Publication Date
WO2014200071A1 true WO2014200071A1 (fr) 2014-12-18

Family

ID=52022357

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/065629 WO2014200071A1 (fr) 2013-06-14 2014-06-12 Feuille adhésive

Country Status (3)

Country Link
JP (1) JPWO2014200071A1 (fr)
TW (1) TWI639673B (fr)
WO (1) WO2014200071A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016148024A1 (fr) * 2015-03-13 2016-09-22 古河電気工業株式会社 Bande de fixation de plaquette, procédé de traitement pour plaquette semi-conductrice, et puce semi-conductrice
WO2017018270A1 (fr) * 2015-07-24 2017-02-02 デンカ株式会社 Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce de semi-conducteur ou de composant à semi-conducteur utilisant celle-ci
CN106862147A (zh) * 2016-12-30 2017-06-20 东莞美维电路有限公司 行辘在线清洗装置
JP2017186444A (ja) * 2016-04-05 2017-10-12 パナック株式会社 キャリアシート及びカット部材の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258408A (ja) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd 半導体加工用粘着フィルム、半導体ウエハ、半導体素子および半導体装置
JP2011225706A (ja) * 2010-04-19 2011-11-10 Denki Kagaku Kogyo Kk 粘着シート及び電子部品の製造方法
WO2012172959A1 (fr) * 2011-06-14 2012-12-20 電気化学工業株式会社 Feuille adhésive et procédé pour la fabrication d'un composant électronique

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258408A (ja) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd 半導体加工用粘着フィルム、半導体ウエハ、半導体素子および半導体装置
JP2011225706A (ja) * 2010-04-19 2011-11-10 Denki Kagaku Kogyo Kk 粘着シート及び電子部品の製造方法
WO2012172959A1 (fr) * 2011-06-14 2012-12-20 電気化学工業株式会社 Feuille adhésive et procédé pour la fabrication d'un composant électronique

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016148024A1 (fr) * 2015-03-13 2016-09-22 古河電気工業株式会社 Bande de fixation de plaquette, procédé de traitement pour plaquette semi-conductrice, et puce semi-conductrice
JP2016171261A (ja) * 2015-03-13 2016-09-23 古河電気工業株式会社 ウェハ固定テープ、半導体ウェハの処理方法および半導体チップ
CN107112222A (zh) * 2015-03-13 2017-08-29 古河电气工业株式会社 晶片固定带、半导体晶片的处理方法和半导体芯片
US20180012788A1 (en) * 2015-03-13 2018-01-11 Furukawa Electric Co., Ltd. Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip
US10699933B2 (en) 2015-03-13 2020-06-30 Furukawa Electric Co., Ltd. Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip
WO2017018270A1 (fr) * 2015-07-24 2017-02-02 デンカ株式会社 Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce de semi-conducteur ou de composant à semi-conducteur utilisant celle-ci
JP2017186444A (ja) * 2016-04-05 2017-10-12 パナック株式会社 キャリアシート及びカット部材の製造方法
CN106862147A (zh) * 2016-12-30 2017-06-20 东莞美维电路有限公司 行辘在线清洗装置

Also Published As

Publication number Publication date
TW201502234A (zh) 2015-01-16
JPWO2014200071A1 (ja) 2017-02-23
TWI639673B (zh) 2018-11-01

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