WO2014196773A1 - Metal liberation device of printed circuit board - Google Patents

Metal liberation device of printed circuit board Download PDF

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Publication number
WO2014196773A1
WO2014196773A1 PCT/KR2014/004898 KR2014004898W WO2014196773A1 WO 2014196773 A1 WO2014196773 A1 WO 2014196773A1 KR 2014004898 W KR2014004898 W KR 2014004898W WO 2014196773 A1 WO2014196773 A1 WO 2014196773A1
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WO
WIPO (PCT)
Prior art keywords
casing
pcb
metal
particles
main body
Prior art date
Application number
PCT/KR2014/004898
Other languages
French (fr)
Korean (ko)
Inventor
박재구
박승수
한요셉
김성민
진호
정인상
문향
권석제
한성수
서아람
Original Assignee
한양대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한양대학교 산학협력단 filed Critical 한양대학교 산학협력단
Priority to CN201480032417.4A priority Critical patent/CN105307775B/en
Publication of WO2014196773A1 publication Critical patent/WO2014196773A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B04CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04CAPPARATUS USING FREE VORTEX FLOW, e.g. CYCLONES
    • B04C5/00Apparatus in which the axial direction of the vortex is reversed
    • B04C5/08Vortex chamber constructions
    • B04C5/103Bodies or members, e.g. bulkheads, guides, in the vortex chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B02CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02CCRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C23/00Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in preceding groups or not specially adapted to apparatus covered by a single preceding group
    • B02C23/08Separating or sorting of material, associated with crushing or disintegrating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B02CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02CCRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/08Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives within vertical containers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B02CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02CCRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/16Details
    • B02C18/22Feed or discharge means
    • B02C18/2216Discharge means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B02CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02CCRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/16Details
    • B02C18/22Feed or discharge means
    • B02C18/2225Feed means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03BSEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
    • B03B9/00General arrangement of separating plant, e.g. flow sheets
    • B03B9/06General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
    • B03B9/061General arrangement of separating plant, e.g. flow sheets specially adapted for refuse the refuse being industrial
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B04CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04CAPPARATUS USING FREE VORTEX FLOW, e.g. CYCLONES
    • B04C5/00Apparatus in which the axial direction of the vortex is reversed
    • B04C5/02Construction of inlets by which the vortex flow is generated, e.g. tangential admission, the fluid flow being forced to follow a downward path by spirally wound bulkheads, or with slightly downwardly-directed tangential admission
    • B04C5/04Tangential inlets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B04CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04CAPPARATUS USING FREE VORTEX FLOW, e.g. CYCLONES
    • B04C5/00Apparatus in which the axial direction of the vortex is reversed
    • B04C5/08Vortex chamber constructions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B04CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04CAPPARATUS USING FREE VORTEX FLOW, e.g. CYCLONES
    • B04C5/00Apparatus in which the axial direction of the vortex is reversed
    • B04C5/12Construction of the overflow ducting, e.g. diffusing or spiral exits
    • B04C5/13Construction of the overflow ducting, e.g. diffusing or spiral exits formed as a vortex finder and extending into the vortex chamber; Discharge from vortex finder otherwise than at the top of the cyclone; Devices for controlling the overflow
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B04CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04CAPPARATUS USING FREE VORTEX FLOW, e.g. CYCLONES
    • B04C5/00Apparatus in which the axial direction of the vortex is reversed
    • B04C5/14Construction of the underflow ducting; Apex constructions; Discharge arrangements ; discharge through sidewall provided with a few slits or perforations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B04CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL PROCESSES
    • B04CAPPARATUS USING FREE VORTEX FLOW, e.g. CYCLONES
    • B04C9/00Combinations with other devices, e.g. fans, expansion chambers, diffusors, water locks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE
    • B09B3/00Destroying solid waste or transforming solid waste into something useful or harmless
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE
    • B09B5/00Operations not covered by a single other subclass or by a single other group in this subclass
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/178Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/52Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/82Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the present invention relates to an apparatus for separating a single metal of a printed circuit board, and more particularly, to an insulating layer made of a resin or glass fiber made of metal such as copper, gold, silver, etc., processed on a substrate surface by comminution of the printed circuit board.
  • the present invention relates to a metal strip separating device for a printed circuit board that can be efficiently separated from a substrate.
  • a printed circuit board (hereinafter referred to as "PCB") is a thin insulating layer base material of which glass wool is reinforced with epoxy resin or the like, and a thin copper layer is processed into a wiring pattern to process electronic components such as ICs.
  • the PCB is an electronic component that mounts various components and connects the components, and is widely used in all electronic devices such as TV, video, computer, and audio.
  • PCB grinding products obtained through the grinding process may be classified into three types: metal rich particles mainly composed of metal components, mixed particles of metal and plastic, or rich particles composed of plastic.
  • metal rich particles mainly composed of metal components
  • mixed particles of metal and plastic mixed particles of metal and plastic
  • rich particles composed of plastic mainly the metal rich particles are referred to as single particles (liberated particles), mainly for the metal rich particles, the screening, smelting process may be performed to increase the metal recovery rate. Therefore, the metal is recovered from the metal-rich particles separated by a single substance through sorting and smelting, which are post-processing processes.
  • the grinding device for crushing the PCB by compression and impact has a problem in that the degree of separation of metal components is not high.
  • the density is low and it is not only light but also has a layered structure. Therefore, it is difficult to grind with a general mill such as a ball mill, which has a compressive force and an impact force. There is a problem that the recovery efficiency is low.
  • the present invention has been proposed to solve the above problems, by inserting the compressed air in which the vortex is formed into the main body casing, while the PCB particles are swiveled upward, the separation of the metal surface layer of the PCB by the shearing force is maximized and accordingly Provided is a metal single separation device for a printed circuit board in which the single separation efficiency of metal on the PCB is increased.
  • the apparatus for separating a metal body of a printed circuit board according to the present invention has a hollow cone of which a top and a bottom are opened and a diameter increases from bottom to top so that PCB particles to be separated are introduced or discharged.
  • the metal layer separator may be a plurality of cutter blades disposed radially spaced apart from each other about an axis of the rotating body.
  • the inlet port is formed on the side of the lower casing connected to the raw material supply, the first discharge port is formed through the bottom of the lower casing Can be.
  • the inlet port may guide the PCB particles to flow in a tangential direction of the circumference of the lower casing.
  • the upper and lower ends of the main body casing may be formed with horizontal support plates respectively connected to the pivot shaft, and the horizontal support plates may be provided with a plurality of through holes arranged radially around the pivot shaft.
  • the body casing and the rotating body may be formed to increase in diameter from the bottom to the top in the longitudinal direction.
  • the upper casing is connected in communication with the upper end of the main body casing, and further comprises an upper casing having a second discharge port is formed in the center, the second discharge port may be formed to penetrate the upper casing and protrude into the rotating body.
  • the second discharge port may be disposed above the main body casing, the rotating body, the raw material supply unit, and the lower casing.
  • the PCB particles may move upward in the separation space to flow into the upper casing side to pivot inside and discharge through the through hole to the second discharge port.
  • the raw material supply unit a hopper to which the PCB particles are injected; A supply pipe interconnecting the hopper and the inlet port; And a main compressed air input nozzle connected to the supply pipe to introduce the PCB particles into the lower casing side.
  • It may include a plurality of auxiliary compressed air input nozzle connected in the tangential direction of the circumference of the main body casing to assist the rise of the PCB particles.
  • the rotating body may be a plurality of rotating plates arranged along the longitudinal direction of the pivot shaft.
  • the metal layer separating part may include a fixed blade provided along a circumference on an inner circumferential surface of the main body casing corresponding to the cutter blade, and the metal of the PCB particles may be separated by the interaction of the cutter blade and the fixed blade. have.
  • the cutter blade may include a vertical cutter blade bent upward from the end of the cutter blade, and a fixed blade support jaw for supporting the fixed blade may be provided on the inner circumferential surface of the main body casing.
  • the apparatus may further include a separation recovery unit configured to selectively collect and recover the PCB particles passing through the second discharge port.
  • the separation recovery unit the first cyclone is connected to the discharge port to the second discharge port to recover the metal particles of the PCB particles; A second cyclone connected to the first cyclone to recover resin particles in the PCB particles; And a recoverer connected to the second cyclone to recover the dust and the remainder of the PCB particles.
  • a single metal separation device of a printed circuit board is introduced into the main body casing by the compressed air in which the vortex is formed, while the PCB particles are swiveled upward to maximize the single separation of the metal surface layer of the PCB by the shearing force, and thus the entire PCB.
  • the recovery efficiency of the metal can be increased.
  • the metal single separation device of the printed circuit board according to the present invention can be accompanied with a dust collecting function in the single separation device can simplify the entire installation.
  • the metal single separation device of the printed circuit board according to the present invention can prevent the PCB particles from being caught between the metal layer separators, thereby reducing the tact time of the entire metal recovery process and maintaining and maintaining the metal single separation device of the printed circuit board. Maintenance time can be managed efficiently.
  • FIG. 1 is a partial cross-sectional view of an apparatus for separating metal from a printed circuit board according to an exemplary embodiment of the present invention.
  • FIG. 2 is a schematic plan view of a body casing according to an embodiment of the invention.
  • FIG. 3 is a cross-sectional view of the A-A line of FIG.
  • FIG. 4 is a view showing a movement path of the PCB particles in the metal single separation device of the printed circuit board according to an embodiment of the present invention.
  • FIG. 5 is a partial cross-sectional view of an apparatus for separating metal from a printed circuit board according to another exemplary embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of the B-B line of FIG.
  • FIG. 1 is a partial cross-sectional view of a metal single separation device of a printed circuit board according to an embodiment of the present invention
  • Figure 2 is a schematic plan view of a main body casing according to an embodiment of the present invention
  • Figure 3 is a line AA of Figure 1 It is a cross section.
  • the metal single separation device 10 of the printed circuit board according to the present invention is disposed inside the main body casing 100 and the main body casing 100 into which the PCB particles to be separated are introduced, and is located at the center of the main body casing 100.
  • Rotating body 110 is rotatably connected to the rotating shaft (not shown) disposed, and spaced apart space 102 between the body casing 100 and the rotating body 110 is arranged along the outer circumferential surface of the rotating body 110
  • the main body casing 100 is provided in a conical shape, the inside of which is inverted into a hollow type, as shown in FIG. 1. That is, the main body casing 100 is provided in a tapered shape so as to increase in diameter from the bottom to the top in the longitudinal direction.
  • the upper casing 150 and the lower casing 140 are coupled to the upper and lower portions of the main body casing 100, respectively, and the inside of the upper casing 150, the main casing 100, and the lower casing 140 is one closed space.
  • the PCB particles introduced from the raw material supply unit 130 to the lower casing 140 are moved upwardly from the lower casing 140 through the space 102, and in this process, the metal by the metal layer separation unit 120. To a single separation process of the metal layer.
  • the main body casing 100 is provided with a plurality of auxiliary compressed air injection nozzles 101 along the longitudinal direction.
  • the auxiliary compressed air injection nozzle 101 is connected in the tangential direction of the circumference of the main body casing 100 to provide air pressure in a counterclockwise direction when the PCB particles are moved along the separation space 102 to form the vortex in the PCB particles. Assist in the role of ascension.
  • the rotating body 110 is formed to correspond to the tapered shape of the body casing 100. Therefore, the rotating body 110 is also provided to increase in diameter from the bottom to the top along the longitudinal direction. And, the diameter of the rotating body 110 is formed relatively less than the diameter of the body casing (100). Accordingly, a space 102 may be provided between the main body casing 100 and the rotating body 110.
  • a second discharge port 151 and a horizontal support plate 113 connected to the pivot shaft disposed at the shaft center of the main body casing 100 are formed.
  • the second discharge port 151 coupled to the upper casing 150 is disposed to penetrate the upper surface of the rotating body 110, and supports the upper portion of the rotating body 110.
  • a friction reducing member 115 such as a washer or a bearing may be used between the rotating body 110 and the second discharge port 151.
  • the horizontal support plate 113 of the bottom surface is connected to and supported by the rotation shaft.
  • the plate surface of the horizontal support plate 113 is formed with a plurality of through holes 114 radially spaced apart from each other about a rotation shaft. The role of the through hole 114 will be described later in the description of the operation of the metal single separation device of the printed circuit board.
  • the rotation shaft is disposed on the shaft center of the main body casing 100, and is mounted on the driving shaft (not shown) of the drive motor (not shown) installed outside the main body casing 100.
  • the rotating shaft and the rotating body 110 connected thereto rotate in one direction by the driving power output from the driving motor, and the metal layer separation unit 120 provided on the rotating body 110 rotates and the metal to metal of the PCB particles is rotated. Can be separated.
  • the metal layer separator 120 in the present embodiment is provided with a plurality of cutter blades 121 that are radially spaced apart from each other about an axis of the rotating body 110.
  • the plurality of cutter blades 121 may be provided in the lower, center, and upper regions, respectively, along the longitudinal direction of the rotating body 110.
  • the raw material supply unit 130 may include a hopper 131 into which PCB particles are introduced, a supply pipe 132 interconnecting the hopper 131 and an inlet port 141, and a supply pipe 132. It may be connected to include a main compressed air input nozzle 133 to introduce the PCB particles to the lower casing 140 side.
  • the hopper 131 is supplied with PCB particles.
  • the PCB particles may be introduced into the hopper 131 after undergoing a pretreatment process of dividing the printed circuit board to increase the separation efficiency of the metal or metal.
  • the size of the PCB particles introduced into the hopper 131 may be formed to be approximately 3 to 4 mm.
  • Pneumatic pressure is provided through the main compressed air injection nozzle 133. Accordingly, the PCB particles introduced from the hopper 131 to the lower casing 140 are forcibly pushed upwards, and vortices can be formed in the counterclockwise direction.
  • the lower casing 140 is connected to the lower portion of the main body casing 100 to form a closed closed space consisting of the main body casing 100 and the lower casing 140.
  • An inlet port 141 to which the raw material supplier 130 is connected may be provided at a side of the lower casing 140.
  • the inlet port 141 serves to guide the PCB particles to flow in a tangential direction of the circumference of the lower casing 140. To this end, the inlet port 141 is provided in the tangential direction spaced apart by a predetermined interval based on the axis of the lower casing 140.
  • a first discharge port 142 penetrating downward may be provided at a bottom of the lower casing 140.
  • the upper casing 150 is connected to the upper portion of the body casing 100 to form a closed space consisting of the body casing 100 and the upper casing 150.
  • PCB particles moved to the upper side along the separation space 102 between the main body casing 100 and the rotating body 110 serves to pivot inside the upper casing 150 to the inner center.
  • a second discharge port 151 penetrates toward the main body casing 100 at the center of the upper casing 150.
  • the second discharge port 151 may be provided to protrude into the rotating body 110 through the horizontal support plate 113 of the rotating body 110.
  • the second discharge port 151 pivots the PCB particles introduced into the upper casing 150 side through the separation space 102 and passes through the through hole 114 to be discharged to the second discharge port 151. .
  • the self-weight acts on the PCB particles to prevent them from moving downward, forcibly pushes them upwards to contact the metal layer separation unit 120 and increases the time for crushing to separate the metal or metal layer from the PCB particles to increase the degree of separation. Can be increased.
  • the configuration of the upper casing 150 and the second discharge port 151 in the separation unit can perform a dust collecting function has the advantage that the entire installation is simplified.
  • FIG. 4 is a view showing a movement path of the PCB particles in the metal single separation device of the printed circuit board according to an embodiment of the present invention.
  • PCB particles are injected into the hopper 131 and move to the lower casing 140 along the supply pipe 132.
  • the compressed air is introduced from the main compressed air input nozzle 133 connected on the supply pipe 132, the PCB particles are rotated in the counterclockwise direction while being introduced into the lower casing 140, the lower casing by centrifugal force It is moved along the inner circumferential surface of 140 and may be moved upward.
  • the PCB particles enter the separation space 102 between the main body casing 100 and the rotating body 110 and meet the plurality of metal layer separators 120 disposed on the outer circumferential surface of the rotating body 110. In this process, the PCB particles may be finely crushed by the cutter blade 121.
  • the separation efficiency increases.
  • the self-weight acts on the PCB particles to prevent them from moving downward, forcibly pushes upwards to contact the metal layer separation unit 120 and increases the time to be crushed, thereby sufficiently separating the metal or metal from the PCB particles to separate them.
  • the efficiency can be increased.
  • the grinding process may be repeatedly performed while the PCB particles proceed upward.
  • the space 102 has a larger diameter in the upward direction along the longitudinal direction of the rotating body 110, the centrifugal force of the PCB particles rotating the space 102 is also increased upwards, thus the PCB Particles and the metal layer separation unit 120 also has the advantage that the efficiency of the crushing is increased.
  • PCB particles passing through the metal layer separation unit 120 by riding on the outer circumferential surface of the rotating body 110 are then pivoted through the inner space of the upper casing 150 and passed through the through hole 114 of the horizontal support plate 113. It may flow into the interior of the rotating body (110). In this process, particles having a heavy weight such as metal components may be moved downward by their own weight and discharged to the first discharge port 142.
  • the particles may be swiveled in the rotating body 110 for a predetermined time and then introduced into the second discharge port 151 and then discharged to the outside.
  • the second discharge port 151 of the upper casing 150 may perform a function of the cyclone type dust collecting apparatus. That is, the second discharge port 151 is provided to protrude by a predetermined length inside the rotating body, so that the PCB particles separated by the metal layer separating part 120 of the inner space of the upper casing 150 and the rotating body 110 It is forced to turn into the interior space, which in turn rotates in the interior space, allowing the PCB particles to sort naturally by weight.
  • the metal single separation device 10 of the printed circuit board may perform a function of a dust collecting processor such as a cyclone together with a role of separating metal from metal, and a separate cyclone or dust collecting processing device may be omitted. .
  • the separation or recovery efficiency of the PCB particles can be increased, and the device can be simplified, such as a separate metal cyclone separation apparatus of the printed circuit board, and a separate cyclone or dust collecting apparatus can be omitted.
  • the metal single separation device 10 of the printed circuit board 10 or the dust collection processing device may be added to the second discharge port 151 by further increasing the metal single separation efficiency or maximizing the dust collection efficiency. There will be.
  • FIG. 5 is a partial cross-sectional view of a metal single separation device of a printed circuit board according to another exemplary embodiment.
  • FIG. 6 is a cross-sectional view of the B-B line of FIG. 5.
  • the metal single separation device 20 of the printed circuit board according to another embodiment of the present invention is similar in structure to most of the metal single separation device 10 of the printed circuit board according to the first embodiment, but has a rotating body 210. And the structure of the metal layer separation unit 220 is different, and the configuration of the first cyclone 261, the second cyclone 262 and the recovery unit of the separation recovery unit 260 may be additionally provided. In the following, only a configuration different from the configuration of the above-described first embodiment will be described in order to avoid duplication of description.
  • the rotating body 210 may be provided with a plurality of rotating plates 210 connected to the rotating shaft 211.
  • the rotating body 110 of the simple separation apparatus 10 according to the first embodiment of the present invention is a conical member having a space formed therein
  • 210 is a plurality of rotating plates connected to the rotation shaft 211 and rotate inside the main body casing 100.
  • the rotating body of the simple separation device 20 according to another embodiment of the present invention is called a rotating plate (210).
  • the rotary body 110 of the simple separation device 10 according to the first embodiment of the present invention is a conical member having a space formed therein
  • the rotating body 210 may be formed of a plurality of rotating plates connected to the rotation shaft 211 and rotating inside the main body casing 100.
  • the rotating body is referred to as the rotating plate 210.
  • Horizontal support plate portions 113 are formed at upper and lower ends of the main body casing 100 and connected to the rotating shaft 211 disposed at the axial center of the main body casing 100.
  • a horizontal support plate 113 is formed between the upper casing 150 and the main casing 100 coupled to the upper end of the main casing 100, and the lower casing coupled to the lower end of the main casing 100 ( A horizontal support plate 113 is also formed between the 140 and the main body casing 100. On the plate surface of the horizontal support plate 113 is formed a plurality of through holes 114 radially spaced apart at predetermined intervals about the pivot shaft 211.
  • the PCB particles are introduced into the internal space of the main body casing 100 through the plurality of through holes 114 of the horizontal support plate 113 formed between the lower casing 140 and the main body casing 100.
  • PCB particles introduced into the inner space of the main body casing 100 pass through the metal layer separation unit 220 while riding on the inner circumferential surface of the main body casing 100.
  • PCB particles are smaller in size while the particles sequentially pass through the plurality of metal layer separators 220 formed inside the body casing 100.
  • PCB particles having a heavy weight such as metal components among the PCB particles are moved below the main body casing 100 by their own weight to pass through the space between the vertical cutter blade 222 and the fixed blade 223 of the metal layer separation unit 220.
  • the heavy PCB particles that pass through the metal layer separator 220 are discharged through the through holes 114 of the horizontal support plate 113 and are discharged to the outside through the first discharge port 142 of the lower casing 140. .
  • PCB particles having a light weight such as a resin component among the PCB particles are moved upwardly of the main body casing 100 to pass through the space between the vertical cutter blade 222 and the fixed blade 223 of the metal layer separator 220.
  • the light weight PCB particles passing through the metal layer separator 220 are discharged through the through holes 114 of the horizontal support plate 113 to be described below through the second discharge port 251 of the upper casing 150. Is recovered to the separated recovery unit 260.
  • the metal layer separation unit 220 is formed on a cutter blade 221 provided on the outer circumferential surface of the rotating plate 210 and a predetermined region of the inner circumferential surface of the main body casing 100, but the cutter blade 221 is formed. It may include a fixed blade 223 disposed in a position opposite to.
  • the cutter blade 221 may be provided along a circumference of the outer circumferential surface of the rotating plate, and a vertical cutter blade 222 bent upward may be provided at an end of the cutter blade 221.
  • the vertical cutter blade may be added to increase the contact area between the cutter blade 221 and the PCB particles, thereby increasing the separation efficiency of the PCB particles.
  • the fixed blade 223 may be provided along the circumference of the inner circumferential surface of the main body casing 100 to separate the metal or metal of the PCB particles by the interaction of the cutter blade 221 and the fixed blade 223.
  • the fixed blade 223 may be provided to be sequentially higher with reference to Figure 6, mainly.
  • a fixed blade support jaw 224 supporting the fixed blade 223 is further provided on the inner circumferential surface of the main body casing 100, and the height of the fixed blade support jaw 224 is provided to increase in height in the circumferential direction. Can be.
  • a distance between the cutter blade 221 and the fixed blade 223 may be differently provided along the circumferential direction. As the rotation body 110 rotates in the counterclockwise direction, the gap between the cutter blade 221 and the fixed blade 223 gradually decreases, thereby preventing the PCB particles from being caught between the metal layer separators 220.
  • the apparatus may further include a separation recovery unit 260 for selectively recovering PCB particles passing through the second discharge port 251.
  • Separation recovery unit 260 is connected to the first cyclone 261 and the first cyclone 261, which is connected to the second discharge port 251 to the discharge pipe 252 to recover the metal particles of the PCB particles. And a second cyclone 262 that recovers the resin particles of the PCB particles, and a recoverer that is connected to the second cyclone 262 to recover the remaining dust and PCB particles.
  • the first cyclone 261 and the second cyclone 262 refer to a device capable of separating and selecting PCB particles according to the particle size by centrifugal force.
  • the first cyclone 261 may collect metal particles, and the second cyclone 262 may selectively collect and collect the resin particles from the PCB particles. The suspended matter and the remaining recovered particles can be recovered and recovered through a recoverer.
  • the metal single separation device 20 of the printed circuit board may have a cutter by varying the height of the fixed blade support jaw 224 supporting the fixed blade 223 along the circumferential direction. The gap between the blade 221 and the fixed blade 223 is changed, thereby preventing the PCB particles from being pinched between the metal layer separator 220.
  • the present invention can be applied to the printed circuit board recycling field, a metal layer recovery device of a printed circuit board (PCB), a metal layer separation device of a printed circuit board.
  • PCB printed circuit board

Abstract

A metal liberation device of a printed circuit board according to the present invention comprises: a body casing of which upper and lower ends are opened so as to introduce or discharge a PCB particle to be separated, the body casing being formed to have a hollow conical shape with an increasing diameter from a lower portion to an upper portion; a rotation body arranged within the body casing, of which upper and lower ends are opened and which is formed to have a hollow conical shape with an increasing diameter from a lower portion to an upper portion, the rotation body being rotatably connected to a rotary shaft disposed in a shaft center along the longitudinal direction of the body casing; a lower casing into which the PCB particle is injected, the lower casing being connected to communicate with the lower end of the body casing; and at least one metal layer separation unit formed in the longitudinal direction along the inner circumferential surface of the body casing. The metal liberation device of a printed circuit board according to the present invention can maximize the liberation of the metal surface layer of PCB by shear stress from the PCB particle circling upwardly by injecting compressed air, in which a vortex is formed, into the body casing, thereby increasing the metal recovery yield of the entire PCB.

Description

인쇄회로기판의 금속 단체분리장치Metal Separation Device for Printed Circuit Board
본 발명은 인쇄회로기판의 금속 단체분리장치에 관한 것으로, 더 상세하게는 인쇄회로기판을 분쇄(comminution)하여 기판 표면에 처리된 구리, 금, 은 등의 금속이 수지 또는 유리섬유로 이루어진 절연층 기재와 효율적으로 단체분리(liberation)될 수 있도록 하는 인쇄회로기판의 금속 단체분리장치에 관한 것이다.The present invention relates to an apparatus for separating a single metal of a printed circuit board, and more particularly, to an insulating layer made of a resin or glass fiber made of metal such as copper, gold, silver, etc., processed on a substrate surface by comminution of the printed circuit board. The present invention relates to a metal strip separating device for a printed circuit board that can be efficiently separated from a substrate.
일반적으로 인쇄회로기판(Printed Circuit Board: 이하 "PCB"라 함)은 에폭시 수지 등에 유리섬유(glass wool)가 보강된 얇은 절연층 기재에 얇은 구리층이 배선패턴으로 가공되어 IC를 비롯한 전자부품을 작동시킬 수 있는 기판을 말한다. 이러한 PCB는 각종 부품을 실장하고 부품 상호 간을 연결하는 전자 부품으로서 TV, 비디오, 컴퓨터, 오디오 등 모든 전자 기기에 널리 사용되고 있다.In general, a printed circuit board (hereinafter referred to as "PCB") is a thin insulating layer base material of which glass wool is reinforced with epoxy resin or the like, and a thin copper layer is processed into a wiring pattern to process electronic components such as ICs. Refers to a substrate that can be operated. The PCB is an electronic component that mounts various components and connects the components, and is widely used in all electronic devices such as TV, video, computer, and audio.
최근에는 전자 기기의 라이프 사이클이 짧아지고, 새로운 기술이 하루가 다르게 발전함에 따라 구형 전자 기기가 쉽게 방치되고 폐기되는 실정이다. 따라서 이들 폐기되는 전자 기기에 내장된 PCB, 특히, 구리, 납 등의 금속 성분 등으로 인해 환경문제가 점점 심각해지고 있다.Recently, as the life cycle of electronic devices is shortened and new technologies are developed differently, older electronic devices are easily left and discarded. Therefore, environmental problems are getting serious due to PCBs embedded in these discarded electronic devices, particularly metal components such as copper and lead.
또한, PCB의 회로 배선을 구성하는 구리, 금, 은 등의 금속 성분은, 세계 원자재 가격이 폭등하고, 자원 문제가 제기되고 있는 현 시점과 맞물려, 재활용이 시급한 실정이다.In addition, metal components such as copper, gold, and silver constituting the circuit wiring of the PCB are urgently recycled due to the current time when world raw material prices are soaring and resource problems are raised.
PCB에서 금속 성분을 회수하는 방법으로 여러 가지 방안이 고려되고 있다. PCB을 고온에서 녹여서 금(Au), 동(Cu) 등 고가의 금속을 불순물과 분리하여 회수하는 건식법과, PCB를 파쇄 또는 분쇄한 후 물리적 선별 공정을 통해 얻은 금속 리치 입자(metal rich particle)를 적당한 용매로 용출시켜 회수하는 습식 제련법이 있다. 이들 방법 중, 습식 제련에 의해 PCB로부터 금속을 회수하기 위해서는 PCB 분쇄 공정이 필수적으로 요구된다. Various methods have been considered as a method of recovering metal components from the PCB. Drying method that melts PCB at high temperature and recovers expensive metals such as gold (Au), copper (Cu) from impurities and recovers them, and metal rich particles obtained through physical sorting process after crushing or crushing PCB. There is a wet smelting method which is eluted with a suitable solvent and recovered. Of these methods, a PCB grinding process is indispensable for recovering metal from the PCB by wet smelting.
분쇄 공정을 거치면 얻어지는 PCB 분쇄산물은 주로 금속성분으로 구성된 금속 리치 입자와, 금속과 플라스틱의 혼합입자 또는 플라스틱으로 이루어진 리치 입자의 세 종류로 분류될 수 있다. 이 때, 주로 금속 리치 입자를 단체분리된 입자(liberated particle)라 부르며, 주로 금속 리치 입자만을 대상으로, 선별, 제련 공정을 수행해야 금속 회수율이 증가될 수 있다. 따라서 단체분리된 금속 리치 입자로부터 후 처리 공정인 선별, 제련을 통해 금속을 회수하게 된다. PCB grinding products obtained through the grinding process may be classified into three types: metal rich particles mainly composed of metal components, mixed particles of metal and plastic, or rich particles composed of plastic. In this case, mainly the metal rich particles are referred to as single particles (liberated particles), mainly for the metal rich particles, the screening, smelting process may be performed to increase the metal recovery rate. Therefore, the metal is recovered from the metal-rich particles separated by a single substance through sorting and smelting, which are post-processing processes.
그러나, 앞에서 언급된 바와 같이, PCB는 수지로 된 얇은 판 표면에 각종 금속이 가공되어 있기 때문에 압축 및 충격에 의해 PCB를 분쇄하는 분쇄장치는 금속성분의 단체분리도가 높지 않은 문제점이 있다.However, as mentioned above, since the PCB is processed with various metals on the surface of the thin plate made of resin, the grinding device for crushing the PCB by compression and impact has a problem in that the degree of separation of metal components is not high.
또한, PCB의 경우 밀도가 낮아 가벼울 뿐만 아니라 층상구조를 하고 있기 때문에 압축력, 충격력이 주된 외력이 되는 볼밀 등의 일반 분쇄기로는 분쇄가 잘 이루어지지 않아 단체분리율이 저하되고 이에 따라 전체 PCB의 금속의 회수 효율이 떨어지는 문제점이 있다.In addition, in the case of PCB, the density is low and it is not only light but also has a layered structure. Therefore, it is difficult to grind with a general mill such as a ball mill, which has a compressive force and an impact force. There is a problem that the recovery efficiency is low.
본 발명은 상기와 같은 문제점을 해결하기 위하여 제안된 것으로, 와류가 형성되는 압축공기를 본체 케이싱에 투입하여 PCB 입자가 상방으로 선회하면서 전단력에 의해 PCB의 금속 표면층의 단체분리가 극대화되고 이에 따라 전체 PCB의 금속의 단체분리 효율이 증가되는 인쇄회로기판의 금속 단체분리장치를 제공한다.The present invention has been proposed to solve the above problems, by inserting the compressed air in which the vortex is formed into the main body casing, while the PCB particles are swiveled upward, the separation of the metal surface layer of the PCB by the shearing force is maximized and accordingly Provided is a metal single separation device for a printed circuit board in which the single separation efficiency of metal on the PCB is increased.
상기와 같은 목적을 달성하기 위한 본 발명에 의한 인쇄회로기판의 금속 단체분리장치는, 분리 대상인 PCB 입자가 유입 또는 배출되도록 상단 및 하단이 개방되고 하부에서 상부로 갈수록 직경이 증가하는 중공 타입의 원뿔 모양으로 형성된 본체 케이싱; 상단 및 하단이 개방되고 하부에서 상부로 갈수록 직경이 증가하는 중공 타입의 원뿔 모양으로 형성되어 상기 본체 케이싱의 내부에 배치되되, 상기 본체 케이싱의 상하방향을 따라 축심에 배치된 회동 샤프트에 회전 가능하게 연결되는 회전 몸체; 상기 본체 케이싱의 하단에 연통되게 연결되며, 상기 PCB 입자가 투입되는 하부 케이싱; 및 상기 본체 케이싱의 내주면을 따라 상하방향으로 적어도 하나 형성되는 금속층 분리부;를 포함할 수 있다.In order to achieve the object as described above, the apparatus for separating a metal body of a printed circuit board according to the present invention has a hollow cone of which a top and a bottom are opened and a diameter increases from bottom to top so that PCB particles to be separated are introduced or discharged. A main body casing formed into a shape; It is formed in a hollow conical shape of the upper and lower openings and the diameter increases from the bottom to the top is disposed inside the main body casing, rotatable to the rotating shaft disposed in the shaft center along the vertical direction of the main body casing A rotating body connected; A lower casing connected in communication with a lower end of the main body casing and into which the PCB particles are injected; And at least one metal layer separator formed in an up and down direction along an inner circumferential surface of the main body casing.
상기 금속층 분리부는 상기 회전 몸체의 축심을 중심으로 하여 방사상으로 서로 이격되게 배치되는 복수 개의 커터날일 수 있다.The metal layer separator may be a plurality of cutter blades disposed radially spaced apart from each other about an axis of the rotating body.
회수 대상이 되는 PCB 입자를 공급하는 원료 공급부를 더 포함하며, 상기 하부 케이싱의 측면에는 상기 원료 공급부와 연결되는 유입포트가 형성되고, 상기 하부 케이싱의 저면에는 하부로 관통되는 제1 배출포트가 형성될 수 있다.Further comprising a raw material supply for supplying the PCB particles to be recovered, the inlet port is formed on the side of the lower casing connected to the raw material supply, the first discharge port is formed through the bottom of the lower casing Can be.
상기 유입포트는 상기 PCB 입자를 상기 하부 케이싱의 원주의 접선 방향으로 유입되도록 안내할 수 있다.The inlet port may guide the PCB particles to flow in a tangential direction of the circumference of the lower casing.
상기 본체 케이싱의 상단과 하단에는 상기 회동 샤프트와 연결되는 수평 지지판부가 각각 형성되며, 상기 수평 지지판부에는 상기 회동 샤프트를 중심으로 방사상으로 배열된 복수의 관통공이 마련될 수 있다.The upper and lower ends of the main body casing may be formed with horizontal support plates respectively connected to the pivot shaft, and the horizontal support plates may be provided with a plurality of through holes arranged radially around the pivot shaft.
상기 본체 케이싱과 상기 회전 몸체는 길이 방향을 따라 하부에서 상부로 갈수록 직경이 증가하도록 형성될 수 있다.The body casing and the rotating body may be formed to increase in diameter from the bottom to the top in the longitudinal direction.
상기 본체 케이싱의 상단에 연통되게 연결되며, 중앙부에 제2 배출포트가 형성되는 상부 케이싱을 더 포함하며, 상기 제2 배출포트는 상기 상부 케이싱에 관통되며 상기 회전 몸체 내로 돌출되게 형성될 수 있다.The upper casing is connected in communication with the upper end of the main body casing, and further comprises an upper casing having a second discharge port is formed in the center, the second discharge port may be formed to penetrate the upper casing and protrude into the rotating body.
상기 제2 배출포트는 상기 본체 케이싱, 상기 회전 몸체, 상기 원료 공급부 및 상기 하부 케이싱보다 상대적으로 상부에 배치될 수 있다.The second discharge port may be disposed above the main body casing, the rotating body, the raw material supply unit, and the lower casing.
상기 PCB 입자는 상기 이격 공간 내를 상방으로 이동하여 상기 상부 케이싱 측으로 유입되어 내부에서 선회하고 상기 관통공을 통과해 상기 제2 배출포트로 배출될 수 있다.The PCB particles may move upward in the separation space to flow into the upper casing side to pivot inside and discharge through the through hole to the second discharge port.
상기 원료 공급부는, 상기 PCB 입자가 투입되는 호퍼; 상기 호퍼와 상기 유입포트를 상호 연결하는 공급배관; 및 상기 공급배관에 연결되어 상기 PCB 입자를 상기 하부 케이싱 측으로 유입시키는 주 압축공기 투입노즐을 포함할 수 있다.The raw material supply unit, a hopper to which the PCB particles are injected; A supply pipe interconnecting the hopper and the inlet port; And a main compressed air input nozzle connected to the supply pipe to introduce the PCB particles into the lower casing side.
상기 본체 케이싱의 원주의 접선 방향으로 연결되어 상기 PCB 입자의 상승을 보조하는 복수의 보조 압축공기 투입노즐을 포함할 수 있다.It may include a plurality of auxiliary compressed air input nozzle connected in the tangential direction of the circumference of the main body casing to assist the rise of the PCB particles.
상기 회전 몸체는 상기 회동 샤프트의 길이 방향을 따라 배열되는 복수의 회전판일 수 있다.The rotating body may be a plurality of rotating plates arranged along the longitudinal direction of the pivot shaft.
상기 금속층 분리부는, 상기 커터날에 대응되는 상기 본체 케이싱의 내주면 상에 원주 둘레를 따라 마련된 고정날을 포함하며, 상기 커터날과 상기 고정날의 상호 작용에 의해 상기 PCB 입자의 금속을 분리할 수 있다.The metal layer separating part may include a fixed blade provided along a circumference on an inner circumferential surface of the main body casing corresponding to the cutter blade, and the metal of the PCB particles may be separated by the interaction of the cutter blade and the fixed blade. have.
상기 커터날은 상기 커터날의 단부에서 상방으로 절곡되는 수직 커터날을 포함하며, 상기 본체 케이싱의 내주면 상에는 상기 고정날을 지지하는 고정날 지지턱이 마련될 수 있다.The cutter blade may include a vertical cutter blade bent upward from the end of the cutter blade, and a fixed blade support jaw for supporting the fixed blade may be provided on the inner circumferential surface of the main body casing.
상기 제2 배출포트를 통과한 상기 PCB 입자를 선별 회수하는 분리 회수부를 더 포함할 수 있다.The apparatus may further include a separation recovery unit configured to selectively collect and recover the PCB particles passing through the second discharge port.
상기 분리 회수부는, 상기 제2 배출포트에 배출배관으로 연결되어 상기 PCB 입자 중 금속 입자를 회수하는 제1 싸이클론; 상기 제1 싸이클론에 연결되어 상기 PCB 입자 중 수지 입자를 회수하는 제2 싸이클론; 및 상기 제2 싸이클론에 연결되어 분진 및 상기 PCB 입자 중 나머지를 회수하는 회수기를 포함할 수 있다.The separation recovery unit, the first cyclone is connected to the discharge port to the second discharge port to recover the metal particles of the PCB particles; A second cyclone connected to the first cyclone to recover resin particles in the PCB particles; And a recoverer connected to the second cyclone to recover the dust and the remainder of the PCB particles.
본 발명에 의한 인쇄회로기판의 금속 단체분리장치는, 와류가 형성되는 압축공기를 본체 케이싱에 투입하여 PCB 입자 가 상방으로 선회하면서 전단력에 의해 PCB의 금속 표면층의 단체분리가 극대화되고 이에 따라 전체 PCB의 금속의 회수 효율이 증가될 수 있다.According to the present invention, a single metal separation device of a printed circuit board is introduced into the main body casing by the compressed air in which the vortex is formed, while the PCB particles are swiveled upward to maximize the single separation of the metal surface layer of the PCB by the shearing force, and thus the entire PCB. The recovery efficiency of the metal can be increased.
본 발명에 의한 인쇄회로기판의 금속 단체분리장치는 단체분리장치 내에 집진 기능을 동반할 수 있기 때문에 전체 설비를 간소화할 수 있다.The metal single separation device of the printed circuit board according to the present invention can be accompanied with a dust collecting function in the single separation device can simplify the entire installation.
본 발명에 의한 인쇄회로기판의 금속 단체분리장치는 PCB 입자가 금속층 분리부 사이에 끼임을 방지할 수 있어 전체 금속 회수 공정의 택트 타임을 감소시키며 인쇄회로기판의 금속 단체분리장치의 유지 관리, 장치보수 시간을 효율적으로 관리할 수 있다.The metal single separation device of the printed circuit board according to the present invention can prevent the PCB particles from being caught between the metal layer separators, thereby reducing the tact time of the entire metal recovery process and maintaining and maintaining the metal single separation device of the printed circuit board. Maintenance time can be managed efficiently.
도 1은 본 발명의 실시예에 따른 인쇄회로기판의 금속 단체분리장치의 부분 단면도이다.1 is a partial cross-sectional view of an apparatus for separating metal from a printed circuit board according to an exemplary embodiment of the present invention.
도 2는 본 발명의 실시예에 따른 본체 케이싱의 개략적인 평면도이다.2 is a schematic plan view of a body casing according to an embodiment of the invention.
도 3은 도 1의 A-A라인의 단면도이다.3 is a cross-sectional view of the A-A line of FIG.
도 4는 본 발명의 실시예에 따른 인쇄회로기판의 금속 단체분리장치에서 PCB 입자의 이동 경로를 도시한 도면이다.4 is a view showing a movement path of the PCB particles in the metal single separation device of the printed circuit board according to an embodiment of the present invention.
도 5는 본 발명의 다른 실시예에 따른 인쇄회로기판의 금속 단체분리장치의 부분 단면도이다.5 is a partial cross-sectional view of an apparatus for separating metal from a printed circuit board according to another exemplary embodiment of the present invention.
도 6은 도 5의 B-B라인의 단면도이다.6 is a cross-sectional view of the B-B line of FIG.
이하 첨부된 도면을 참조하여 본 발명에 의한 인쇄회로기판의 금속 단체분리장치의 일 실시예를 상세히 설명한다. 이하에서는 설명의 편의를 위해 본 발명에 따른 인쇄회로기판의 금속 단체분리장치를 이용하여 인쇄회로기판에서부터 금속 또는 금속층을 분리하는 경우에 대해서 설명하지만, 본 발명에 따른 인쇄회로기판의 금속 단체분리장치가 인쇄회로기판에만 적용되는 것은 아님은 당연하다.Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of a metal strip separating apparatus of a printed circuit board according to the present invention. Hereinafter, a case of separating a metal or a metal layer from a printed circuit board using a metal single separation device of a printed circuit board according to the present invention will be described for convenience of description. However, the single metal separation device of a printed circuit board according to the present invention will be described. Of course, this does not only apply to printed circuit boards.
도 1은 본 발명의 실시예에 따른 인쇄회로기판의 금속 단체분리장치의 부분 단면도이고, 도 2는 본 발명의 실시예에 따른 본체 케이싱의 개략적인 평면도이며, 도 3은 도 1의 A-A라인의 단면도이다.1 is a partial cross-sectional view of a metal single separation device of a printed circuit board according to an embodiment of the present invention, Figure 2 is a schematic plan view of a main body casing according to an embodiment of the present invention, Figure 3 is a line AA of Figure 1 It is a cross section.
본 발명에 의한 인쇄회로기판의 금속 단체분리장치(10)는, 분리 대상인 PCB 입자가 유입되는 본체 케이싱(100)과, 본체 케이싱(100)의 내부에 배치되되, 본체 케이싱(100)의 축심에 배치된 회동 샤프트(미도시)에 회전 가능하게 연결되는 회전 몸체(110)와, 회전 몸체(110)의 외주면을 따라 배열되어 본체 케이싱(100)과 회전 몸체(110) 사이의 이격 공간(102)으로 유입된 PCB 입자의 금속 내지 금속을 분리하는 금속층 분리부(120)와, 단체분리 대상이 되는 PCB 입자를 공급하는 원료 공급부(130)와, 본체 케이싱(100)의 하부에 연결되며, 원료 공급부(130)가 연결되는 유입포트(141)가 마련되는 하부 케이싱(140)을 포함할 수 있다.The metal single separation device 10 of the printed circuit board according to the present invention is disposed inside the main body casing 100 and the main body casing 100 into which the PCB particles to be separated are introduced, and is located at the center of the main body casing 100. Rotating body 110 is rotatably connected to the rotating shaft (not shown) disposed, and spaced apart space 102 between the body casing 100 and the rotating body 110 is arranged along the outer circumferential surface of the rotating body 110 The metal layer separation unit 120 for separating the metal or metal of the PCB particles introduced into the raw material, the raw material supply unit 130 for supplying the PCB particles to be separated into a single body, and is connected to the lower portion of the main body casing 100, the raw material supply unit It may include a lower casing 140 is provided with an inlet port 141 is connected to (130).
본체 케이싱(100)은 도 1에 도시된 바와 같이, 내부가 중공 타입으로 뒤집어진 원뿔 형상으로 마련된다. 즉, 본체 케이싱(100)은 길이 방향을 따라 하부에서 상부로 갈수록 직경이 증가하도록 테이퍼진 형상으로 마련된다. 본체 케이싱(100)의 상부와 하부에는 각각 상부 케이싱(150)과 하부 케이싱(140)이 결합되며, 상부 케이싱(150), 본체 케이싱(100) 및 하부 케이싱(140)의 내부가 하나의 폐 공간을 형성한다. 이에 따라, 원료 공급부(130)로부터 하부 케이싱(140)으로 유입된 PCB 입자는 하부 케이싱(140)에서 상방 측으로 이격 공간(102)을 통하여 이동되며, 이 과정에서 금속층 분리부(120)에 의한 금속 내지 금속층의 단체분리 과정을 거친다.The main body casing 100 is provided in a conical shape, the inside of which is inverted into a hollow type, as shown in FIG. 1. That is, the main body casing 100 is provided in a tapered shape so as to increase in diameter from the bottom to the top in the longitudinal direction. The upper casing 150 and the lower casing 140 are coupled to the upper and lower portions of the main body casing 100, respectively, and the inside of the upper casing 150, the main casing 100, and the lower casing 140 is one closed space. To form. Accordingly, the PCB particles introduced from the raw material supply unit 130 to the lower casing 140 are moved upwardly from the lower casing 140 through the space 102, and in this process, the metal by the metal layer separation unit 120. To a single separation process of the metal layer.
본체 케이싱(100)에는 길이 방향을 따라 복수의 보조 압축공기 투입노즐(101)이 마련된다. 보조 압축공기 투입노즐(101)은 본체 케이싱(100)의 원주의 접선 방향으로 연결되어 PCB 입자가 이격 공간(102)을 따라 이동될 때 반시계 방향으로 공압을 제공하여 PCB 입자가 와류를 형성하며 상승하도록 하는 역할을 보조한다.The main body casing 100 is provided with a plurality of auxiliary compressed air injection nozzles 101 along the longitudinal direction. The auxiliary compressed air injection nozzle 101 is connected in the tangential direction of the circumference of the main body casing 100 to provide air pressure in a counterclockwise direction when the PCB particles are moved along the separation space 102 to form the vortex in the PCB particles. Assist in the role of ascension.
회전 몸체(110)는 본체 케이싱(100)의 테이퍼진 형상에 대응되게 형성된다. 따라서, 회전 몸체(110)도 길이 방향을 따라 하부에서 상부로 갈수록 직경이 증가하도록 마련된다. 그리고, 회전 몸체(110)의 직경이 본체 케이싱(100)의 직경보다 상대적으로 적게 형성된다. 이에 따라, 본체 케이싱(100)과 회전 몸체(110) 사이에는 이격 공간(102)이 마련될 수 있다.The rotating body 110 is formed to correspond to the tapered shape of the body casing 100. Therefore, the rotating body 110 is also provided to increase in diameter from the bottom to the top along the longitudinal direction. And, the diameter of the rotating body 110 is formed relatively less than the diameter of the body casing (100). Accordingly, a space 102 may be provided between the main body casing 100 and the rotating body 110.
회전 몸체(110)의 상면과 저면에는 각각, 제2 배출포트(151)와, 본체 케이싱(100)의 축심에 배치되는 회동 샤프트와 연결되는 수평 지지판부(113)가 형성된다. 상부 케이싱(150)에 결합된 제2 배출포트(151)가 회전 몸체(110)의 상면을 관통하여 배치되고, 회전 몸체(110)의 상부를 지지한다. 이를 위해, 회전 몸체(110)와 제2 배출포트(151) 사이에는 와셔, 베어링 등의 마찰저감부재(115)가 사용될 수 있다. 그리고, 저면의 수평 지지판부(113)는 회동 샤프트에 연결되어 지지된다. 한편, 수평 지지판부(113)의 판면에는 회동 샤프트를 중심으로 소정 간격 이격된 방사상으로 복수의 관통공(114)이 형성된다. 관통공(114)의 역할은 인쇄회로기판의 금속 단체분리장치의 동작에 대한 설명에서 후술하기로 한다.On the upper and lower surfaces of the rotating body 110, a second discharge port 151 and a horizontal support plate 113 connected to the pivot shaft disposed at the shaft center of the main body casing 100 are formed. The second discharge port 151 coupled to the upper casing 150 is disposed to penetrate the upper surface of the rotating body 110, and supports the upper portion of the rotating body 110. To this end, a friction reducing member 115 such as a washer or a bearing may be used between the rotating body 110 and the second discharge port 151. Then, the horizontal support plate 113 of the bottom surface is connected to and supported by the rotation shaft. On the other hand, the plate surface of the horizontal support plate 113 is formed with a plurality of through holes 114 radially spaced apart from each other about a rotation shaft. The role of the through hole 114 will be described later in the description of the operation of the metal single separation device of the printed circuit board.
비록 도면에서는 도시되지는 않았지만, 회동 샤프트는 본체 케이싱(100)의 축심에 배치되며, 본체 케이싱(100)의 외측에 설치되는 구동 모터(미도시)의 구동축(미도시)에 장착된다. 그리고, 구동 모터에서 출력되는 구동 동력에 의해 회동 샤프트 및 이에 연결된 회전 몸체(110)가 일방향으로 회전하게 되고, 회전 몸체(110)에 마련된 금속층 분리부(120)가 회전하며 PCB 입자의 금속 내지 금속을 분리할 수 있다.Although not shown in the drawings, the rotation shaft is disposed on the shaft center of the main body casing 100, and is mounted on the driving shaft (not shown) of the drive motor (not shown) installed outside the main body casing 100. In addition, the rotating shaft and the rotating body 110 connected thereto rotate in one direction by the driving power output from the driving motor, and the metal layer separation unit 120 provided on the rotating body 110 rotates and the metal to metal of the PCB particles is rotated. Can be separated.
본 실시예에서의 금속층 분리부(120)는 회전 몸체(110)의 축심을 중심으로 하여 방사상으로 서로 이격되게 배치되는 복수 개의 커터날(121)로 마련된다. 복수 개의 커터날(121)은 회전 몸체(110)의 길이 방향을 따라 하부, 중앙부 및 상부 영역에 각각 마련될 수 있다.The metal layer separator 120 in the present embodiment is provided with a plurality of cutter blades 121 that are radially spaced apart from each other about an axis of the rotating body 110. The plurality of cutter blades 121 may be provided in the lower, center, and upper regions, respectively, along the longitudinal direction of the rotating body 110.
원료 공급부(130)는 도 1을 참조하면, PCB 입자가 투입되는 호퍼(131)와, 호퍼(131)와 유입포트(141)를 상호 연결하는 공급배관(132)과, 공급배관(132)에 연결되어 PCB 입자를 하부 케이싱(140) 측으로 유입시키는 주 압축공기 투입노즐(133)을 포함할 수 있다.Referring to FIG. 1, the raw material supply unit 130 may include a hopper 131 into which PCB particles are introduced, a supply pipe 132 interconnecting the hopper 131 and an inlet port 141, and a supply pipe 132. It may be connected to include a main compressed air input nozzle 133 to introduce the PCB particles to the lower casing 140 side.
호퍼(131)에는 PCB 입자가 공급된다. PCB 입자는 금속 또는 금속의 분리 효율을 증가시키도록 인쇄회로기판을 잘게 쪼개는 전 처리 과정을 거친 다음, 호퍼(131)에 투입될 수 있다. 본 실시예에서 호퍼(131)에 투입되는 PCB 입자의 크기는 대략 3 ~ 4 mm로 형성되어 투입될 수 있다.The hopper 131 is supplied with PCB particles. The PCB particles may be introduced into the hopper 131 after undergoing a pretreatment process of dividing the printed circuit board to increase the separation efficiency of the metal or metal. In the present embodiment, the size of the PCB particles introduced into the hopper 131 may be formed to be approximately 3 to 4 mm.
주 압축공기 투입노즐(133)을 통해 공압이 제공된다. 이에 따라, 호퍼(131)로부터 하부 케이싱(140)으로 투입되는 PCB 입자를 상방으로 강제로 밀어 올리게 되며, 반시계 방향으로 와류를 형성시킬 수 있다.Pneumatic pressure is provided through the main compressed air injection nozzle 133. Accordingly, the PCB particles introduced from the hopper 131 to the lower casing 140 are forcibly pushed upwards, and vortices can be formed in the counterclockwise direction.
하부 케이싱(140)은 본체 케이싱(100)의 하부에 연결되어 본체 케이싱(100)과 하부 케이싱(140)으로 이루어지는 밀폐된 폐 공간을 형성시킨다. 하부 케이싱(140)의 측면에는 원료 공급부(130)가 연결되는 유입포트(141)가 마련될 수 있다.The lower casing 140 is connected to the lower portion of the main body casing 100 to form a closed closed space consisting of the main body casing 100 and the lower casing 140. An inlet port 141 to which the raw material supplier 130 is connected may be provided at a side of the lower casing 140.
유입포트(141)는 PCB 입자가 하부 케이싱(140)의 원주의 접선 방향으로 유입되도록 안내하는 역할을 한다. 이를 위해, 유입포트(141)는 하부 케이싱(140)의 축심을 기준으로 소정 간격 이격되어 접선 방향으로 마련된다. PCB 입자가 유입포트(141)를 통해 하부 케이싱(140) 내부로 유입되면, 하부 케이싱(140)의 내주면을 따라 반시계 방향으로 회전하면서 와류가 형성되며 상방으로 이동될 수 있다. 그리고, 하부 케이싱(140)의 저면에는 하부로 관통되는 제1 배출포트(142)가 마련될 수 있다.The inlet port 141 serves to guide the PCB particles to flow in a tangential direction of the circumference of the lower casing 140. To this end, the inlet port 141 is provided in the tangential direction spaced apart by a predetermined interval based on the axis of the lower casing 140. When the PCB particles are introduced into the lower casing 140 through the inflow port 141, vortices are formed while rotating counterclockwise along the inner circumferential surface of the lower casing 140 and may be moved upward. In addition, a first discharge port 142 penetrating downward may be provided at a bottom of the lower casing 140.
상부 케이싱(150)은 본체 케이싱(100)의 상부에 연결되어 본체 케이싱(100)과 상부 케이싱(150)으로 구성되는 폐 공간을 형성토록 한다. 본체 케이싱(100)과 회전 몸체(110) 사이의 이격 공간(102)을 따라 상부 측으로 이동된 PCB 입자는 상부 케이싱(150) 내에서 중앙 내측으로 선회시키는 역할을 한다. 한편, 상부 케이싱(150)의 중앙부에는 본체 케이싱(100) 측으로 관통되는 제2배출포트(151)가 형성된다. 제2 배출포트(151)는 회전 몸체(110)의 수평 지지판부(113)를 관통하여 회전 몸체(110)의 내부로 돌출되게 마련될 수 있다. 제2 배출포트(151)는 이격 공간(102)을 통과하여 상부 케이싱(150) 측으로 유입된 PCB 입자를 내부에서 선회시키고 관통공(114)으로 통과한 다음 제2 배출포트(151)로 배출시킨다.The upper casing 150 is connected to the upper portion of the body casing 100 to form a closed space consisting of the body casing 100 and the upper casing 150. PCB particles moved to the upper side along the separation space 102 between the main body casing 100 and the rotating body 110 serves to pivot inside the upper casing 150 to the inner center. Meanwhile, a second discharge port 151 penetrates toward the main body casing 100 at the center of the upper casing 150. The second discharge port 151 may be provided to protrude into the rotating body 110 through the horizontal support plate 113 of the rotating body 110. The second discharge port 151 pivots the PCB particles introduced into the upper casing 150 side through the separation space 102 and passes through the through hole 114 to be discharged to the second discharge port 151. .
이와 같은 구성을 통해, 와류가 형성되는 압축공기를 투입하여 PCB 입자를 상방으로 이동시키면서 단체분리 공정을 수행할 수 있어 종래보다 단체분리도가 증가되는 장점이 있다. 즉, PCB 입자에 자중이 작용하여 하방으로 이동되는 것을 저지하고, 상방으로 강제로 밀어 올려 금속층 분리부(120)와 접촉하고 분쇄되는 시간을 증가시켜 PCB 입자에서 금속 또는 금속층을 분리하여 단체분리도를 증가시킬 수 있다.Through such a configuration, it is possible to perform a simple separation process while moving the PCB particles upward by inputting compressed air in which the vortex is formed. That is, the self-weight acts on the PCB particles to prevent them from moving downward, forcibly pushes them upwards to contact the metal layer separation unit 120 and increases the time for crushing to separate the metal or metal layer from the PCB particles to increase the degree of separation. Can be increased.
또한, 단체분리장치 내에 상부 케이싱(150) 및 제2 배출포트(151)의 구성이 집진 기능을 수행할 수 있어 전체 설비가 간소화되는 장점이 있다.In addition, the configuration of the upper casing 150 and the second discharge port 151 in the separation unit can perform a dust collecting function has the advantage that the entire installation is simplified.
도 4는 본 발명의 실시예에 따른 인쇄회로기판의 금속 단체분리장치에서 PCB 입자의 이동 경로를 도시한 도면이다.4 is a view showing a movement path of the PCB particles in the metal single separation device of the printed circuit board according to an embodiment of the present invention.
이하, 본 실시예에 따른 인쇄회로기판의 금속 단체분리장치의 회동 동작을 주로 도 4를 참조하여 상세히 설명한다.Hereinafter, the rotational operation of the metal single separator of the printed circuit board according to the present embodiment will be described in detail with reference to FIG. 4.
도 4에 도시된 바와 같이, 호퍼(131)에 PCB 입자가 투입되고, 공급배관(132)을 따라 하부 케이싱(140) 측으로 이동한다. 이때, 공급배관(132) 상에 연결된 주 압축공기 투입노즐(133)로부터 압축 공기가 투입되고, 이에 따라 PCB 입자는 하부 케이싱(140)으로 투입되면서 반시계 방향으로 회전하고, 원심력에 의해 하부 케이싱(140)의 내주면을 따라 이동되며 상방으로 이동될 수 있다.As shown in FIG. 4, PCB particles are injected into the hopper 131 and move to the lower casing 140 along the supply pipe 132. At this time, the compressed air is introduced from the main compressed air input nozzle 133 connected on the supply pipe 132, the PCB particles are rotated in the counterclockwise direction while being introduced into the lower casing 140, the lower casing by centrifugal force It is moved along the inner circumferential surface of 140 and may be moved upward.
PCB 입자는 본체 케이싱(100)과 회전 몸체(110) 사이의 이격 공간(102)으로 진입되며 회전 몸체(110)의 외주면에 배치된 복수의 금속층 분리부(120)와 만나게 된다. 이 과정에서 커터날(121)에 의해 PCB 입자는 잘게 분쇄될 수 있다.The PCB particles enter the separation space 102 between the main body casing 100 and the rotating body 110 and meet the plurality of metal layer separators 120 disposed on the outer circumferential surface of the rotating body 110. In this process, the PCB particles may be finely crushed by the cutter blade 121.
PCB 입자는 상방으로 이동되면서 단체분리 효율이 증가한다. 즉, PCB 입자에 자중이 작용하여 하방으로 이동되는 것을 저지하고, 상방으로 강제로 밀어 올려 금속층 분리부(120)와 접촉하고 분쇄되는 시간을 증가시켜 PCB 입자에서 금속 또는 금속을 충분히 분리시켜 단체분리 효율을 증가시킬 수 있다.As PCB particles move upwards, the separation efficiency increases. In other words, the self-weight acts on the PCB particles to prevent them from moving downward, forcibly pushes upwards to contact the metal layer separation unit 120 and increases the time to be crushed, thereby sufficiently separating the metal or metal from the PCB particles to separate them. The efficiency can be increased.
또한, 금속층 분리부(120)는 회전 몸체(110)의 하부, 중앙부, 상부에 각각 마련되므로, PCB 입자가 상방으로 진행하면서 분쇄 과정이 반복 수행될 수 있다. 그리고, 이격 공간(102)은 회전 몸체(110)의 길이 방향을 따라 상방으로 갈수록 직경이 더 커지는 구조이므로, 이격 공간(102)을 회전하는 PCB 입자의 원심력도 상방으로 갈수록 증가하며, 이에 따라 PCB 입자와 금속층 분리부(120)가 상호 접촉하며 분쇄되는 효율이 증가되는 장점도 있다.In addition, since the metal layer separator 120 is provided on the lower, middle, and upper portions of the rotating body 110, the grinding process may be repeatedly performed while the PCB particles proceed upward. In addition, since the space 102 has a larger diameter in the upward direction along the longitudinal direction of the rotating body 110, the centrifugal force of the PCB particles rotating the space 102 is also increased upwards, thus the PCB Particles and the metal layer separation unit 120 also has the advantage that the efficiency of the crushing is increased.
회전 몸체(110)의 외주면을 타고 금속층 분리부(120)를 통과한 PCB 입자는 이후, 상부 케이싱(150)의 내부 공간을 선회하고, 수평 지지판부(113)의 관통공(114)을 통과하여 회전 몸체(110)의 내부로 유입될 수 있다. 이 과정에서, 금속 성분 등 무게가 무거운 입자는 자중에 의해 하방으로 이동되어 제1 배출포트(142)로 배출될 수 있다.PCB particles passing through the metal layer separation unit 120 by riding on the outer circumferential surface of the rotating body 110 are then pivoted through the inner space of the upper casing 150 and passed through the through hole 114 of the horizontal support plate 113. It may flow into the interior of the rotating body (110). In this process, particles having a heavy weight such as metal components may be moved downward by their own weight and discharged to the first discharge port 142.
그리고, PCB 입자 중 수지 입자 등 무게가 가벼운 입자의 경우, 회전 몸체(110) 내에서 일정 시간 선회하다가 제2 배출포트(151)로 인입된 다음 외부로 배출될 수 있다.In addition, in the case of particles having a light weight such as resin particles among PCB particles, the particles may be swiveled in the rotating body 110 for a predetermined time and then introduced into the second discharge port 151 and then discharged to the outside.
이와 같이 상부 케이싱(150)의 제2 배출포트(151)는, 싸이클론 타입의 집진 처리 장치의 기능을 수행할 수 있다. 즉, 제2 배출포트(151)가 회전 몸체 내부에 소정 길이만큼 돌출되게 마련됨으로써, 금속층 분리부(120)에 의해 분리된 PCB 입자가 상부 케이싱(150)의 내부 공간과 회전 몸체(110)의 내부 공간으로 선회하도록 강제하고, 이에 따라 내부 공간에서 회전하면서 자연적으로 무게에 따라 PCB 입자가 분류되도록 한다. 결국, 인쇄회로기판의 금속 단체분리장치(10)가 금속 내지 금속을 분리하는 역할과 함께 싸이클론 등과 같은 집진 처리기의 기능을 수행할 수 있으며, 별도의 싸이클론이나 집진 처리장치가 생략될 수 있다.As described above, the second discharge port 151 of the upper casing 150 may perform a function of the cyclone type dust collecting apparatus. That is, the second discharge port 151 is provided to protrude by a predetermined length inside the rotating body, so that the PCB particles separated by the metal layer separating part 120 of the inner space of the upper casing 150 and the rotating body 110 It is forced to turn into the interior space, which in turn rotates in the interior space, allowing the PCB particles to sort naturally by weight. As a result, the metal single separation device 10 of the printed circuit board may perform a function of a dust collecting processor such as a cyclone together with a role of separating metal from metal, and a separate cyclone or dust collecting processing device may be omitted. .
최종적으로 PCB 입자의 단체분리 내지 회수 효율이 증가될 뿐만 아니라 인쇄회로기판의 금속 단체분리장치가 별도의 싸이클론이나 집진 처리장치가 생략될 수 있는 등 장치 간소화를 이룰 수 있다.Finally, the separation or recovery efficiency of the PCB particles can be increased, and the device can be simplified, such as a separate metal cyclone separation apparatus of the printed circuit board, and a separate cyclone or dust collecting apparatus can be omitted.
물론, 금속 단체분리 효율을 더 증가시키거나, 집진 처리 효율을 극대화시킬 필요에 의해, 제2 배출포트(151)에 추가적인 인쇄회로기판의 금속 단체분리장치(10)나 집진 처리장치를 추가할 수도 있을 것이다. Of course, the metal single separation device 10 of the printed circuit board 10 or the dust collection processing device may be added to the second discharge port 151 by further increasing the metal single separation efficiency or maximizing the dust collection efficiency. There will be.
도 5는 본 발명의 다른 실시예에 따른 인쇄회로기판의 금속 단체분리장치의 부분 단면도이고, 도 6은 도 5의 B-B라인의 단면도이다.FIG. 5 is a partial cross-sectional view of a metal single separation device of a printed circuit board according to another exemplary embodiment. FIG. 6 is a cross-sectional view of the B-B line of FIG. 5.
본 발명의 다른 실시예에 따른 인쇄회로기판의 금속 단체분리장치(20)는, 제1 실시예에 따른 인쇄회로기판의 금속 단체분리장치(10)와 대부분 구성이 유사하나, 회전 몸체(210) 및 금속층 분리부(220)의 구성이 다르며, 분리 회수부(260)인 제1 싸이클론(261), 제2 싸이클론(262) 및 회수기의 구성이 추가적으로 마련될 수 있다. 이하, 설명의 중복을 피하기 위해 전술한 제1 실시예의 구성과 차별되는 구성에 대해서만 설명하기로 한다.The metal single separation device 20 of the printed circuit board according to another embodiment of the present invention is similar in structure to most of the metal single separation device 10 of the printed circuit board according to the first embodiment, but has a rotating body 210. And the structure of the metal layer separation unit 220 is different, and the configuration of the first cyclone 261, the second cyclone 262 and the recovery unit of the separation recovery unit 260 may be additionally provided. In the following, only a configuration different from the configuration of the above-described first embodiment will be described in order to avoid duplication of description.
도 5에 도시된 바와 같이, 회전 몸체(210)는 회동 샤프트(211)에 연결된 복수의 회전판(210)으로 마련될 수 있다. 본 발명의 제1실시예에 따른 단체분리장치(10)의 회전 몸체(110)는 내부에 공간이 형성된 원추형 부재인 반면에, 본 발명의 다른 실시예에 따른 단체분리장치(20)의 회전 몸체(210)는 회동 샤프트(211)에 연결되고 본체 케이싱(100)의 내부에서 회전하는 복수개의 회전판이다. 이하에서 본 발명의 다른 실시예에 따른 단체분리장치(20)의 회전 몸체는 회전판(210)이라고 한다.As shown in FIG. 5, the rotating body 210 may be provided with a plurality of rotating plates 210 connected to the rotating shaft 211. While the rotating body 110 of the simple separation apparatus 10 according to the first embodiment of the present invention is a conical member having a space formed therein, the rotating body of the simple separation apparatus 20 according to another embodiment of the present invention. 210 is a plurality of rotating plates connected to the rotation shaft 211 and rotate inside the main body casing 100. Hereinafter, the rotating body of the simple separation device 20 according to another embodiment of the present invention is called a rotating plate (210).
즉, 본 발명의 제1실시예에 따른 단체분리장치(10)의 회전 몸체(110)는 내부에 공간이 형성된 원추형 부재인 반면에, 본 발명의 다른 실시예에 따른 단체분리장치(20)의 회전 몸체(210)는 회동 샤프트(211)에 연결되고 본체 케이싱(100)의 내부에서 회전하는 복수개의 회전판으로 형성될 수 있다. 이하에서 본 발명의 다른 실시예에 따른 단체분리장치(20)에 있어서 회전 몸체는 회전판(210)이라고 한다.That is, while the rotary body 110 of the simple separation device 10 according to the first embodiment of the present invention is a conical member having a space formed therein, the simple separation of the simple separation device 20 according to another embodiment of the present invention The rotating body 210 may be formed of a plurality of rotating plates connected to the rotation shaft 211 and rotating inside the main body casing 100. Hereinafter, in the simple separation device 20 according to another embodiment of the present invention, the rotating body is referred to as the rotating plate 210.
본체 케이싱(100)의 상단과 하단에는 본체 케이싱(100)의 축심에 배치되는 회동 샤프트(211)와 연결되는 수평 지지판부(113)가 각각 형성된다.Horizontal support plate portions 113 are formed at upper and lower ends of the main body casing 100 and connected to the rotating shaft 211 disposed at the axial center of the main body casing 100.
구체적으로 살펴보면, 본체 케이싱(100)의 상단에 결합되는 상부 케이싱(150)과 본체 케이싱(100) 사이에 수평 지지판부(113)가 형성되고, 본체 케이싱(100)의 하단에 결합되는 하부 케이싱(140)과 본체 케이싱(100)의 사이에도 수평 지지판부(113)가 형성된다. 수평 지지판부(113)의 판면에는 회동 샤프트(211)를 중심으로 소정 간격으로 이격된 방사상으로 복수의 관통공(114)이 형성된다.Specifically, a horizontal support plate 113 is formed between the upper casing 150 and the main casing 100 coupled to the upper end of the main casing 100, and the lower casing coupled to the lower end of the main casing 100 ( A horizontal support plate 113 is also formed between the 140 and the main body casing 100. On the plate surface of the horizontal support plate 113 is formed a plurality of through holes 114 radially spaced apart at predetermined intervals about the pivot shaft 211.
PCB 입자는 하부 케이싱(140)과 본체 케이싱(100) 사이에 형성된 수평 지지판부(113)의 복수개의 관통공(114)을 통해 본체 케이싱(100)의 내부 공간으로 유입된다. 본체 케이싱(100)의 내부 공간으로 유입된 PCB 입자는 선회하면서 본체 케이싱(100)의 내주면을 타고 금속층 분리부(220)를 통과한다. PCB 입자는 입자의 크기가 본체 케이싱(100)의 내부에 형성된 복수개의 금속층 분리부(220)를 순차적으로 통과하면서 작아지게 된다.The PCB particles are introduced into the internal space of the main body casing 100 through the plurality of through holes 114 of the horizontal support plate 113 formed between the lower casing 140 and the main body casing 100. PCB particles introduced into the inner space of the main body casing 100 pass through the metal layer separation unit 220 while riding on the inner circumferential surface of the main body casing 100. PCB particles are smaller in size while the particles sequentially pass through the plurality of metal layer separators 220 formed inside the body casing 100.
PCB 입자 중 금속 성분 등 무게가 무거운 PCB 입자는 자중에 의해 본체 케이싱(100)의 하방으로 이동되어 금속층 분리부(220)의 수직 커터날(222)과 고정날(223)의 이격 공간을 통과한다. 금속층 분리부(220)를 통과한 무게가 무거운 PCB 입자는 수평지지판부(113)의 관통공(114)을 통해 배출되어 하부 케이싱(140)의 제1배출포트(142)를 통해 외부로 배출된다.PCB particles having a heavy weight such as metal components among the PCB particles are moved below the main body casing 100 by their own weight to pass through the space between the vertical cutter blade 222 and the fixed blade 223 of the metal layer separation unit 220. . The heavy PCB particles that pass through the metal layer separator 220 are discharged through the through holes 114 of the horizontal support plate 113 and are discharged to the outside through the first discharge port 142 of the lower casing 140. .
한편, PCB 입자 중 수지 성분 등 무게가 가벼운 PCB 입자는 본체 케이싱(100)의 상방으로 이동되어 금속층 분리부(220)의 수직 커터날(222)과 고정날(223)의 이격 공간을 통과한다. 금속층 분리부(220)를 통과한 무게가 가벼운 PCB 입자는 수평지지판부(113)의 관통공(114)을 통해 배출되어 상부 케이싱(150)의 제2배출포트(251)를 통해 아래에서 설명하게 되는 분리 회수부(260)로 회수된다.Meanwhile, PCB particles having a light weight such as a resin component among the PCB particles are moved upwardly of the main body casing 100 to pass through the space between the vertical cutter blade 222 and the fixed blade 223 of the metal layer separator 220. The light weight PCB particles passing through the metal layer separator 220 are discharged through the through holes 114 of the horizontal support plate 113 to be described below through the second discharge port 251 of the upper casing 150. Is recovered to the separated recovery unit 260.
금속층 분리부(220)는 도 6에 도시된 바와 같이, 회전판(210)의 외주면 상에 마련되는 커터날(221)과, 본체 케이싱(100)의 내주면의 일정 구역에 형성되되 커터날(221)에 대향되는 위치에 배치되는 고정날(223)을 포함할 수 있다.As shown in FIG. 6, the metal layer separation unit 220 is formed on a cutter blade 221 provided on the outer circumferential surface of the rotating plate 210 and a predetermined region of the inner circumferential surface of the main body casing 100, but the cutter blade 221 is formed. It may include a fixed blade 223 disposed in a position opposite to.
커터날(221)은 회전판의 외주면 둘레를 따라 마련되고, 커터날(221)의 단부에는 상방으로 절곡되는 수직 커터날(222)이 마련될 수 있다. 수직 커터날이 추가되어 커터날(221)과 PCB 입자와의 접촉 면적이 증가될 수 있고, 이에 따라 PCB 입자의 분리 효율을 증가시킬 수 있다.The cutter blade 221 may be provided along a circumference of the outer circumferential surface of the rotating plate, and a vertical cutter blade 222 bent upward may be provided at an end of the cutter blade 221. The vertical cutter blade may be added to increase the contact area between the cutter blade 221 and the PCB particles, thereby increasing the separation efficiency of the PCB particles.
고정날(223)은 본체 케이싱(100)의 내주면 상의 원주 둘레를 따라 마련되어 커터날(221)과 고정날(223)의 상호 작용에 의해 PCB 입자의 금속 또는 금속을 분리할 수 있다. 특히, 고정날(223)은 주로 도6을 참조하면, 순차적으로 높아지도록 마련될 수 있다. 이를 위해, 본체 케이싱(100) 내주면 상에는 고정날(223)을 지지하는 고정날 지지턱(224)이 더 마련되며, 고정날 지지턱(224)의 높이는 원주 방향을 따라 순차적으로 높이가 증가하도록 마련될 수 있다.The fixed blade 223 may be provided along the circumference of the inner circumferential surface of the main body casing 100 to separate the metal or metal of the PCB particles by the interaction of the cutter blade 221 and the fixed blade 223. In particular, the fixed blade 223 may be provided to be sequentially higher with reference to Figure 6, mainly. To this end, a fixed blade support jaw 224 supporting the fixed blade 223 is further provided on the inner circumferential surface of the main body casing 100, and the height of the fixed blade support jaw 224 is provided to increase in height in the circumferential direction. Can be.
이러한 구성의 금속층 분리부(220)를 통해, 커터날(221)과 고정날(223)의 간격이 원주 방향을 따라 다르게 마련될 수 있다. 회전 몸체(110)가 반시계 방향으로 회전함에 따라 커터날(221)과 고정날(223)의 간격이 점진적으로 줄어들게 함으로써, PCB 입자가 금속층 분리부(220) 사이에 끼임을 방지할 수 있다.Through the metal layer separator 220 having such a configuration, a distance between the cutter blade 221 and the fixed blade 223 may be differently provided along the circumferential direction. As the rotation body 110 rotates in the counterclockwise direction, the gap between the cutter blade 221 and the fixed blade 223 gradually decreases, thereby preventing the PCB particles from being caught between the metal layer separators 220.
PCB 입자가 금속층 분리부(220) 사이에 끼임이 방지되면, 전체 금속 또는 금속 회수 공정의 택트 타임(Tact time)을 감소시키며 인쇄회로기판의 금속 단체분리장치의 유지관리, 보수 시간을 효율적으로 관리할 수 있는 장점이 있게 된다.When the PCB particles are prevented from being pinched between the metal layer separators 220, it reduces the tact time of the entire metal or metal recovery process and efficiently manages the maintenance and repair time of the metal single separator of the printed circuit board. There is an advantage to this.
제2 배출포트(251)를 통과한 PCB 입자를 선별 회수하는 분리 회수부(260)를 더 포함할 수 있다.The apparatus may further include a separation recovery unit 260 for selectively recovering PCB particles passing through the second discharge port 251.
분리 회수부(260)는, 제2 배출포트(251)에 배출배관(252)으로 연결되어 PCB 입자 중 금속 입자를 회수하는 제1 싸이클론(261)과, 제1 싸이클론(261)에 연결되어 PCB 입자 중 수지 입자를 회수하는 제2 싸이클론(262)과, 제2 싸이클론(262)에 연결되어 분진 및 PCB 입자 중 나머지를 회수하는 회수기를 포함할 수 있다. Separation recovery unit 260 is connected to the first cyclone 261 and the first cyclone 261, which is connected to the second discharge port 251 to the discharge pipe 252 to recover the metal particles of the PCB particles. And a second cyclone 262 that recovers the resin particles of the PCB particles, and a recoverer that is connected to the second cyclone 262 to recover the remaining dust and PCB particles.
제1 싸이클론(261)과 제2 싸이클론(262)은, PCB 입자를 원심력에 의해 입자 크기에 따라 분리하고 선별할 수 있는 장치를 말한다. 제1 싸이클론(261)은 금속 입자를 포집하고, 제2 싸이클론(262)은 PCB 입자 중 수지 입자를 선별 회수할 수 있다. 부유물 및 나머지 회수 입자들은 회수기를 통해 선별 회수할 수 있다.The first cyclone 261 and the second cyclone 262 refer to a device capable of separating and selecting PCB particles according to the particle size by centrifugal force. The first cyclone 261 may collect metal particles, and the second cyclone 262 may selectively collect and collect the resin particles from the PCB particles. The suspended matter and the remaining recovered particles can be recovered and recovered through a recoverer.
이와 같이, 본 발명의 다른 실시예에 따른 인쇄회로기판의 금속 단체분리장치(20)는, 고정날(223)을 지지하는 고정날 지지턱(224)의 높이를 원주 방향을 따라 달리 함으로써, 커터날(221)과 고정날(223)의 간격이 달라지고, 이에 따라 PCB 입자가 금속층 분리부(220) 사이에 끼임을 방지할 수 있다.As described above, the metal single separation device 20 of the printed circuit board according to another exemplary embodiment of the present invention may have a cutter by varying the height of the fixed blade support jaw 224 supporting the fixed blade 223 along the circumferential direction. The gap between the blade 221 and the fixed blade 223 is changed, thereby preventing the PCB particles from being pinched between the metal layer separator 220.
PCB 입자가 금속층 분리부(220) 사이에 끼임이 방지되면, 전체 금속 또는 금속 회수 공정의 택트 타임을 감소시키며 인쇄회로기판의 금속 단체분리장치(20)의 유지 관리, 장치보수 시간을 효율적으로 관리할 수 있는 장점이 있게 된다.When the PCB particles are prevented from being pinched between the metal layer separators 220, it reduces the tact time of the entire metal or metal recovery process and efficiently manages the maintenance and maintenance of the metal single separation device 20 of the printed circuit board. There is an advantage to this.
이상과 같이 본 발명의 일 실시예에서는 구체적인 구성 요소 등과 같은 특정 사항들과 한정된 실시예 및 도면에 의해 설명되었으나 이는 본 발명의 보다 전반적인 이해를 돕기 위해서 제공된 것일 뿐, 본 발명은 상기의 실시예에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상적인 지식을 가진 자라면 이러한 기재로부터 다양한 수정 및 변형이 가능하다. 따라서, 본 발명의 사상은 설명된 실시예에 국한되어 정해져서는 아니 되며, 후술하는 특허청구범위뿐 아니라 이 특허청구범위와 균등하거나 등가적 변형이 있는 모든 것들은 본 발명 사상의 범주에 속한다고 할 것이다.As described above, in one embodiment of the present invention has been described by the specific embodiments, such as specific components and limited embodiments and drawings, but this is provided to help a more general understanding of the present invention, the present invention in the above embodiment The present invention is not limited thereto, and various modifications and variations can be made by those skilled in the art to which the present invention pertains. Therefore, the spirit of the present invention should not be limited to the described embodiments, and all of the equivalents and equivalents of the claims, as well as the following claims, will fall within the scope of the present invention. .
본 발명은 인쇄회로기판 재활용분야, 인쇄회로기판(PCB)의 금속층 회수장치, 인쇄회로기판의 금속층 분리장치 등에 적용될 수 있다.The present invention can be applied to the printed circuit board recycling field, a metal layer recovery device of a printed circuit board (PCB), a metal layer separation device of a printed circuit board.

Claims (16)

  1. 분리 대상인 PCB 입자가 유입 또는 배출되도록 상단 및 하단이 개방되고 하부에서 상부로 갈수록 직경이 증가하는 중공 타입의 원뿔 모양으로 형성된 본체 케이싱;A main body casing formed in the shape of a hollow conical shape in which the upper and lower ends are opened and the diameter increases from the lower part to the upper part so that the PCB particles to be separated are introduced or discharged;
    상단 및 하단이 개방되고 하부에서 상부로 갈수록 직경이 증가하는 중공 타입의 원뿔 모양으로 형성되어 상기 본체 케이싱의 내부에 배치되되, 상기 본체 케이싱의 상하방향을 따라 축심에 배치된 회동 샤프트에 회전 가능하게 연결되는 회전 몸체;It is formed in a hollow conical shape of the upper and lower openings and the diameter increases from the bottom to the top is disposed inside the main body casing, rotatable to the rotating shaft disposed in the shaft center along the vertical direction of the main body casing A rotating body connected;
    상기 본체 케이싱의 하단에 연통되게 연결되며, 상기 PCB 입자가 투입되는 하부 케이싱; 및A lower casing connected in communication with a lower end of the main body casing and into which the PCB particles are injected; And
    상기 본체 케이싱의 내주면을 따라 상하방향으로 적어도 하나 형성되는 금속층 분리부;At least one metal layer separator formed along the inner circumferential surface of the main body casing in up and down directions;
    를 포함하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.Separation device for a metal strip of a printed circuit board comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 금속층 분리부는 상기 회전 몸체의 축심을 중심으로 하여 방사상으로 서로 이격되게 배치되는 복수 개의 커터날인 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.The metal layer separation unit of claim 1, wherein the plurality of cutter blades are disposed radially spaced apart from each other about the axis of the rotating body.
  3. 제1항에 있어서,The method of claim 1,
    회수 대상이 되는 PCB 입자를 공급하는 원료 공급부를 더 포함하며,Further comprising a raw material supply for supplying the PCB particles to be recovered,
    상기 하부 케이싱의 측면에는 상기 원료 공급부와 연결되는 유입포트가 형성되고, 상기 하부 케이싱의 저면에는 하부로 관통되는 제1 배출포트가 형성되는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.An inlet port connected to the raw material supply part is formed on a side surface of the lower casing, and a first discharge port penetrating downward is formed on a bottom surface of the lower casing.
  4. 제3항에 있어서,The method of claim 3,
    상기 유입포트는 상기 PCB 입자를 상기 하부 케이싱의 원주의 접선 방향으로 유입되도록 안내하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.The inlet port guides the PCB particles to guide the metal particles to flow in the tangential direction of the circumference of the lower casing.
  5. 제1항에 있어서,The method of claim 1,
    상기 본체 케이싱의 상단과 하단에는 상기 회동 샤프트와 연결되는 수평 지지판부가 각각 형성되며,Horizontal support plate portions connected to the pivot shaft are respectively formed at upper and lower ends of the main body casing,
    상기 수평 지지판부에는 상기 회동 샤프트를 중심으로 방사상으로 배열된 복수의 관통공이 마련되는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And the horizontal support plate portion is provided with a plurality of through-holes arranged radially about the pivot shaft.
  6. 제1항에 있어서,The method of claim 1,
    상기 본체 케이싱과 상기 회전 몸체는 길이 방향을 따라 하부에서 상부로 갈수록 직경이 증가하도록 형성된 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And the main body casing and the rotatable body are formed to increase in diameter from the lower side to the upper side in the longitudinal direction.
  7. 제1항에 있어서,The method of claim 1,
    상기 본체 케이싱의 상단에 연통되게 연결되며, 중앙부에 제2 배출포트가 형성되는 상부 케이싱을 더 포함하며,It is further connected in communication with the upper end of the main casing, and further comprises an upper casing is formed in the second discharge port in the center,
    상기 제2 배출포트는 상기 상부 케이싱에 관통되며 상기 회전 몸체 내로 돌출되게 형성되는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And the second discharge port penetrates through the upper casing and protrudes into the rotating body.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 제2 배출포트는 상기 본체 케이싱, 상기 회전 몸체, 상기 원료 공급부 및 상기 하부 케이싱보다 상대적으로 상부에 배치되는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And the second discharge port is disposed above the main casing, the rotating body, the raw material supply part, and the lower casing.
  9. 제1항에 있어서,The method of claim 1,
    상기 PCB 입자는 상기 이격 공간 내를 상방으로 이동하여 상기 상부 케이싱 측으로 유입되어 내부에서 선회하고 상기 관통공을 통해 상기 제2 배출포트로 배출되는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.The PCB particle is moved to the upper space in the separation space is introduced into the upper casing side is rotated in the inside and discharged to the second discharge port through the through hole characterized in that the metal single separation device of the printed circuit board.
  10. 제3항에 있어서,The method of claim 3,
    상기 원료 공급부는,The raw material supply unit,
    상기 PCB 입자가 투입되는 호퍼;A hopper into which the PCB particles are injected;
    상기 호퍼와 상기 유입포트를 상호 연결하는 공급배관; 및A supply pipe interconnecting the hopper and the inlet port; And
    상기 공급배관에 연결되어 상기 PCB 입자를 상기 하부 케이싱 측으로 유입시키는 주 압축공기 투입노즐을 포함하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And a main compressed air inlet nozzle connected to the supply pipe to introduce the PCB particles into the lower casing side.
  11. 제1항에 있어서,The method of claim 1,
    상기 본체 케이싱의 원주의 접선 방향으로 연결되어 상기 PCB 입자의 상승을 보조하는 복수의 보조 압축공기 투입노즐을 포함하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치. And a plurality of auxiliary compressed air input nozzles connected in a tangential direction of the circumference of the main body casing to assist the rise of the PCB particles.
  12. 제1항에 있어서,The method of claim 1,
    상기 회전 몸체는 상기 회동 샤프트의 길이 방향을 따라 배열되는 복수의 회전판인 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And said rotating body is a plurality of rotating plates arranged along the longitudinal direction of said rotating shaft.
  13. 제2항에 있어서,The method of claim 2,
    상기 금속층 분리부는,The metal layer separator,
    상기 커터날에 대응되는 상기 본체 케이싱의 내주면 상에 원주 둘레를 따라 마련된 고정날을 포함하며,It includes a fixed blade provided along the circumference on the inner peripheral surface of the main body casing corresponding to the cutter blade,
    상기 커터날과 상기 고정날의 상호 작용에 의해 상기 PCB 입자의 금속을 분리하는 것을 특징으로 하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.The metal single separation device of the printed circuit board, characterized in that for separating the metal of the PCB particles by the interaction of the cutter blade and the fixed blade.
  14. 제13항에 있어서,The method of claim 13,
    상기 커터날은 상기 커터날의 단부에서 상방으로 절곡되는 수직 커터날을 포함하며,The cutter blade includes a vertical cutter blade bent upward from the end of the cutter blade,
    상기 본체 케이싱의 내주면 상에는 상기 고정날을 지지하는 고정날 지지턱이 마련되는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.On the inner circumferential surface of the main body casing, the metal single separation device of the printed circuit board, characterized in that the fixed blade support jaw for supporting the fixed blade is provided.
  15. 제7항에 있어서,The method of claim 7, wherein
    상기 제2 배출포트를 통과한 상기 PCB 입자를 선별 회수하는 분리 회수부를 더 포함하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And a separate recovery part configured to selectively collect and recover the PCB particles passing through the second discharge port.
  16. 제15항에 있어서,The method of claim 15,
    상기 분리 회수부는,The separation recovery unit,
    상기 제2 배출포트에 배출배관으로 연결되어 상기 PCB 입자 중 금속 입자를 회수하는 제1 싸이클론;A first cyclone connected to the second discharge port by a discharge pipe to recover metal particles of the PCB particles;
    상기 제1 싸이클론에 연결되어 상기 PCB 입자 중 수지 입자를 회수하는 제2 싸이클론; 및A second cyclone connected to the first cyclone to recover resin particles in the PCB particles; And
    상기 제2 싸이클론에 연결되어 분진 및 상기 PCB 입자 중 나머지를 회수하는 회수기를 포함하는 것을 특징으로 하는 인쇄회로기판의 금속 단체분리장치.And a recovery device connected to the second cyclone to recover dust and the remainder of the PCB particles.
PCT/KR2014/004898 2013-06-07 2014-06-02 Metal liberation device of printed circuit board WO2014196773A1 (en)

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