WO2014193186A1 - Battery pack and method for manufacturing same - Google Patents

Abstract

The present invention relates to a battery pack advantageous for integration and miniaturization, and the battery pack includes: a bare cell having a cap plate of a first polarity with a concave part forming a step downward, and an electrode terminal of a second polarity; a battery protective circuit package electrically connected to the electrode terminal and the cap plate with at least a part thereof arranged in the concave part; and a filling material for filling at least a part of the concave part so as to seal at least a part thereof and to fix the battery protective circuit package, wherein said battery protective circuit package includes a lead frame consisting of a plurality of isolated leads, a basic package for including protective circuit components on the lead frame, and a sealing material for sealing the protective circuit components by exposing a part of the lead frame, the filling material and sealing material being formed by injecting a molten resin.

Description

Battery pack and manufacturing method

The present invention relates to a battery pack and a method for manufacturing the same, and more particularly, to a battery pack and a method for manufacturing the battery pack configured to be miniaturized.

In general, batteries are used in portable terminals such as mobile phones and PDAs. Lithium-ion batteries are the most widely used batteries in portable terminals and the like. They generate heat during overcharging and overcurrent, and if the heating continues and the temperature rises, performance deterioration and risk of explosion occur. Therefore, in the conventional battery, a protection circuit module for detecting and blocking overcharge, overdischarge, and overcurrent is mounted, or a battery protection circuit package for detecting overcharge, overdischarge, and heat from outside the battery and blocking the operation of the battery is installed. Can be used. However, there is a problem in that the size of the battery pack is limited because the space occupied by protection integrated circuits, FETs, resistors, and capacitors constituting the battery protection circuit package is too large. have.

Disclosure of Invention The present invention has been made to solve various problems including the above problems, and an object thereof is to provide a battery pack and a method of manufacturing the battery pack configured to easily miniaturize and integrate the battery pack. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

A battery pack according to one aspect of the present invention is provided. The battery pack includes a bare cell having a first polarity and a cap plate including a concave portion to form a step downward, and an electrode terminal having a second polarity; A battery protection circuit package bonded to the electrode terminal and the cap plate to be electrically connected, wherein at least a part of the battery protection circuit package is disposed in the recess; And a filler that seals and fixes at least a portion of the battery protection circuit package by filling at least a portion of the recess, wherein the battery protection circuit package includes a lead frame and a lead composed of a plurality of leads spaced apart from each other. A base package having a protective circuit component on a frame and an encapsulant for sealing the protective circuit component while exposing a portion of the lead frame, wherein the filler and the encapsulant are integrally formed at the same time by injecting a melt of resin. Are joined.

In the battery pack, the electrode terminal and the battery protection circuit package may be located in the recess formed in the cap plate.

The top surface of the filler in the battery pack may form the same plane as the top surface of the cap plate around the recess.

The battery pack may further include an upper case disposed on the bare cell and the battery protection circuit package and including an opening exposing external connection terminals of the battery protection circuit package.

In the battery pack, the upper case may include at least one selected from the group consisting of aluminum, an alloy containing aluminum, SUS, and resin.

In the battery pack, the battery protection circuit package is mounted on the lead frame, and further includes a battery protection circuit element, including a protection IC, a field effect transistor (FET) and at least one passive element, The passive element is arranged to connect at least some of the plurality of spaced leads, and an electrical connection member for electrically connecting any two selected from the group consisting of the protection integrated circuit, the field effect transistor and the plurality of leads. By further providing, the battery protection circuit can be configured without using a separate printed circuit board.

In the battery pack, the lead frame is disposed at both edges, respectively, and includes a first internal connection terminal lead connected to the electrode terminal and a second internal connection terminal lead connected to the cap plate; An external connection terminal lead disposed between the first internal connection lead and the second internal connection lead and constituting an external connection terminal; And an element mounting lead disposed between the first internal connection lead and the second internal connection lead, in which the battery protection circuit element may be mounted.

The battery protection circuit package in the battery pack is a printed circuit board; And a battery protection circuit element including a protection IC, a field effect transistor, and at least one passive element disposed on the printed circuit board.

According to another aspect of the present invention, a method of manufacturing a battery pack is provided. The method of manufacturing the battery pack includes the steps of providing a bare cell having a first polarity and a cap plate including a concave portion to form a step downward and an electrode terminal having a second polarity; Arranging at least a portion of a basic package including a lead frame composed of a plurality of spaced leads and a protection circuit component on the lead frame in the recess and electrically connecting the electrode terminal and the cap plate; Forming an encapsulant that seals the protection circuit component while exposing a portion of the leadframe; And forming a filler bonded to the encapsulant and filling at least a portion of the recess, wherein the forming of the encapsulant and the forming of the filler may be simultaneously performed by injecting a melt of the resin. have.

In the method of manufacturing the battery pack, the forming of the encapsulant and the forming of the filler may be simultaneously performed by injecting a melt of the resin by a dispensing method or an injection molding method.

According to some embodiments of the present invention made as described above, it is possible to provide a battery pack and a method of manufacturing the same that is advantageous for integration and miniaturization. Of course, the scope of the present invention is not limited by these effects.

1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present invention.

2 is a diagram illustrating an arrangement structure of a stacked chip constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present disclosure.

3 is a plan view illustrating a structure of a lead frame constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present invention.

4 is a plan view illustrating a basic package constituting a part of a battery protection circuit package applied to a battery pack according to an embodiment of the present invention.

5A is a perspective view illustrating a basic package constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present disclosure.

5B and 5C are diagrams illustrating a battery protection circuit package applied to a battery pack according to some embodiments of the present invention.

6 is a schematic cross-sectional view illustrating a structure of a bare cell in a battery pack according to some embodiments of the present invention.

7 is an exploded perspective view illustrating a process of bonding a basic package on a bare cell in a method of manufacturing a battery pack according to an embodiment of the present invention.

8 is an exploded perspective view illustrating a process of bonding a basic package on a bare cell in a method of manufacturing a battery pack according to a modified embodiment of the present invention.

9 is a cross-sectional view illustrating a structure in which a basic package is bonded on a bare cell in a method of manufacturing a battery pack according to some embodiments of the present disclosure.

10 is a cross-sectional view illustrating a battery pack according to an embodiment of the present invention.

11 is a perspective view illustrating a battery pack according to an embodiment of the present invention.

12 is a perspective view illustrating a battery pack according to another embodiment of the present invention.

13 is a cross-sectional view illustrating a portion of a battery pack according to another embodiment of the present invention.

14 and 15 are perspective views illustrating a process of combining a battery protection circuit package with a battery can in a battery pack according to still another and modified embodiments of the present invention.

16 is a perspective view illustrating the appearance of a battery pack in accordance with some embodiments of the present disclosure.

17 and 18 are cross-sectional views and perspective views illustrating a part of a battery pack according to another embodiment of the present invention.

19 is a cross-sectional view illustrating a portion of a battery pack according to another embodiment of the present invention.

20 is a perspective view illustrating a PTC structure constituting a part of a battery protection circuit package in a battery pack according to another embodiment of the present invention.

21 is a diagram illustrating a battery protection circuit package in a battery pack according to another embodiment of the present invention.

Hereinafter, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, and the following examples can be modified in various other forms, and the scope of the present invention is It is not limited to an Example. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of description.

Throughout the specification, when referring to one component, such as a film, region or substrate, being positioned on, "connected", "stacked" or "coupled" to another component, said one configuration It may be interpreted that an element may be directly bonded onto, “connected”, “stacked” or “coupled” to another component, or there may be other components interposed therebetween. On the other hand, when one component is said to be located on another component "directly on", "directly connected", or "directly coupled", it is interpreted that there are no other components intervening therebetween. do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various members, parts, regions, layers, and / or parts, these members, parts, regions, layers, and / or parts are defined by these terms. It is obvious that not. These terms are only used to distinguish one member, part, region, layer or portion from another region, layer or portion. Thus, the first member, part, region, layer or portion, which will be discussed below, may refer to the second member, component, region, layer or portion without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "bottom" or "bottom" may be used herein to describe the relationship of certain elements to other elements as illustrated in the figures. It may be understood that relative terms are intended to include other directions of the device in addition to the direction depicted in the figures. For example, if the device is turned over in the figures, elements depicted as present on the face of the top of the other elements are oriented on the face of the bottom of the other elements. Thus, the exemplary term "top" may include both "bottom" and "top" directions depending on the particular direction of the figure. If the device faces in the other direction (rotated 90 degrees relative to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. Also, as used herein, "comprise" and / or "comprising" specifies the presence of the mentioned shapes, numbers, steps, actions, members, elements and / or groups of these. It is not intended to exclude the presence or the addition of one or more other shapes, numbers, acts, members, elements and / or groups.

Embodiments of the present invention will now be described with reference to the drawings, which schematically illustrate ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the inventive concept should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

The battery pack disclosed in the present invention includes a configuration in which at least a part of the battery protection circuit module package is disposed in a bare cell including a recess. First, the configuration of the battery protection circuit package will be described.

1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present invention.

As shown in FIG. 1, the battery protection circuit 10 applied to the battery protection circuit package 300 according to an embodiment of the present invention may include first and second internal connection terminals B + to be connected to a battery bare cell. , B-), the first to third external connection terminals (P +, CF, P) to be connected to the charger when charging, and to the electronic device (eg, portable terminal, etc.) operated by the battery power during the discharge -) Here, the first external connection terminal P + and the third external connection terminal P- among the first to third external connection terminals P +, CF, and P- are for power supply and the other external connection terminal is The second external connection terminal CF may be configured to charge the battery by classifying the battery. In addition, thermistor, a component that senses battery temperature during charging, can be applied. Other functions can be applied and used as terminals.

The battery protection circuit 10 includes a connection structure of the dual FET chip 110, the protection integrated circuit 120, the resistors R1, R2, and R3, the varistor V1, and the capacitors C1 and C2. Have The dual FET chip 110 includes a first field effect transistor FET1 and a second field effect transistor FET2 having a drain common structure. The protection IC 120 is connected to the first internal connection terminal B +, which is a positive terminal of the battery, through a resistor R1, and a charge voltage or a discharge voltage is applied through the first node n1. Terminal for sensing voltage and battery voltage (VDD terminal), reference terminal (VSS terminal) as a reference for the operating voltage inside the protection integrated circuit 110, sensing terminal for sensing the charge and discharge and overcurrent conditions (V- Terminal), the discharge interruption signal output terminal (DO terminal) for turning off the first field effect transistor FET1 in the overdischarge state, and the charge interruption signal output terminal (OFF) for turning off the second field effect transistor FET2 in the overcharge state ( C0 terminal).

In this case, the inside of the protection integrated circuit 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage and the charge / discharge voltage, an overcurrent detector, and a charge / discharge detector. The criterion for determining the state of charge and discharge may be changed to a specification required by the user, and the charge / discharge state is determined by recognizing the voltage difference of each terminal of the protection integrated circuit 120 according to the determined criterion.

When the protection integrated circuit 120 reaches an overdischarge state during discharge, the DO terminal goes low to turn off the first field effect transistor FET1, and when the overcharge state reaches the overcharge state, the CO terminal goes low. The second field effect transistor FET2 is turned off, and when the overcurrent flows, the second field effect transistor FET2 is turned off during charging and the first field effect transistor FET1 is turned off when discharging.

The resistor R1 and the capacitor C1 serve to stabilize fluctuations in the power supply of the protection integrated circuit 120. The resistor R1 is connected between the first node n1, which is the power supply V1 of the battery, and the VDD terminal of the protection integrated circuit 120, and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection integrated circuit. Is connected to. Here, the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +. When the resistor R1 is made larger, the detection voltage is increased by the current penetrating into the protection integrated circuit 120 when the voltage is detected. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K? Or less. In addition, the value of the capacitor (C1) has a suitable value of 0.01μF or more for stable operation.

In addition, the resistors R1 and R2 become current limiting resistors when the high voltage charger or the charger exceeding the absolute maximum rating of the protection integrated circuit 120 is connected upside down. The resistor R2 is connected between the V-terminal of the protection integrated circuit 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 KΩ. If the resistor R2 is too large, no recovery may occur after the overcharge cutoff, and thus the value of the resistor R2 is set to a value of 10 K? Or less.

The capacitor C2 is the source node S1 (or VSS terminal, the second internal connection terminal B) of the second node n2 (or the third external connection terminal P−) and the first field effect transistor FET1. -)) Has a structure that is connected between. The capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for the user's request or stability. The capacitor C2 is for the effect of stabilizing the system by improving resistance to voltage fluctuations or external noise.

The resistor R3 and the varistor V1 are elements for ESD protection and surge protection. The resistor R3 and the varistor V1 are connected to each other in parallel to each other so that the second external connection terminal CF and the second node n2 ( Or it is connected between the third external connection terminal (P-). The varistor (V1) is a device that lowers the resistance when an overvoltage occurs, and when the overvoltage occurs, the resistance is lowered to minimize circuit damage due to the overvoltage.

The present invention implements a package of a battery protection circuit configured by packaging the battery protection circuit 10 shown in FIG. 1 including external connection terminals (P +, P-, CF) and internal connection terminals (B +, B-). Doing.

The protection circuit according to an embodiment of the present invention described above is exemplary, and the configuration, number, arrangement, and the like of the protection integrated circuit, the field effect transistor, or the passive element may be appropriately modified according to the additional function of the protection circuit. As such an example, an exemplary embodiment of the configuration, number, arrangement, etc. of the protection integrated circuit and the field effect transistor will be described with reference to FIG.

2 is a diagram illustrating an arrangement structure of a stacked chip constituting a part of a battery protection circuit package applied to a battery pack according to an embodiment of the present invention.

As shown in FIG. 2, the arrangement of the dual FET chip 110 and the protection integrated circuit 120 has a structure in which the dual FET chip 110 and the protection integrated circuit 120 are stacked up and down or adjacent to each other. Has For example, the protection integrated circuit 120 may be stacked on the upper surface of the dual FET chip 110, or the dual FET chip 110 may be disposed adjacent to the left or right side of the protection integrated circuit 120. have.

The dual FET chip 110 includes a first field effect transistor having a common drain structure and a second field effect transistor, that is, two field effect transistors, and the external connection terminal includes a first gate terminal G1 of the first field effect transistor. ) And a first source terminal S1, a second gate terminal G2, and a second source terminal S2 of the second field effect transistor on the upper surface of the dual FET chip 110. In addition, the common drain terminal D may have a structure provided on the lower surface of the dual FET chip 110.

The protection integrated circuit 120 has a structure in which the protection integrated circuit 120 is stacked on the upper surface of the dual FET chip 110. The protection integrated circuit 120 is stacked in a region (for example, a central portion) except for a portion where external connection terminals on the dual FET chip 110 are disposed. In this case, an insulating film for insulation may be disposed between the protection integrated circuit 120 and the dual FET chip 110, and the protection integrated circuit 120 and the dual FET chip 110 may be bonded with an adhesive of an insulating material. . Since the size of the dual FET chip 110 is generally larger than that of the protection integrated circuit 120, an arrangement structure in which the protection integrated circuit 120 is stacked on the dual FET chip 110 is adopted.

After the protection integrated circuit 120 is stacked on the upper surface of the dual FET chip 110, the DO terminal DO of the protection integrated circuit 120 is electrically connected to the first gate terminal G1 through a wire or a wire. The CO terminal CO of the protection integrated circuit 120 is electrically connected to the second gate terminal G2 through a wire or a wire. The connection structure of the remaining terminals will be described later. The protection integrated circuit 120 and the dual FET chip 110 having the stacked structure as described above will be collectively referred to as a stacked chip 100a.

In the battery protection circuit package applied to the battery pack according to an embodiment of the present invention, a protection integrated circuit 120 having a stacked structure and a stacked chip 100a of a dual FET chip are introduced to be mounted on a lead frame to be described later. The area can be reduced, thereby miniaturizing or increasing the capacity of the battery.

The battery protection circuit package may include a printed circuit board and a battery protection circuit device disposed on the printed circuit board. Alternatively, the battery protection circuit package may include a lead frame and a battery protection circuit element disposed on the lead frame. Herein, the battery protection circuit device may include a protection integrated circuit, a field effect transistor, and at least one passive device. In embodiments of the present invention, the lead frame is a structure in which lead terminals are patterned on a metal frame, and may be distinguished from a printed circuit board having a metal wiring layer formed on an insulating core in its structure or thickness. Hereinafter, a package for disposing a battery protection circuit element on a lead frame will be described.

3 is a plan view illustrating a structure of a lead frame constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present invention, and FIG. 4 is a view of a battery pack according to an embodiment of the present invention. A plan view illustrating a basic package constituting part of a battery protection circuit package to be applied.

3 and 4, in the battery protection circuit package applied to the battery pack according to an embodiment of the present invention, the lead frame 50 includes a first internal connection terminal region A1 and an external connection terminal region A2. In this case, the protection circuit region and the second internal connection terminal region A5 of the device region A3 and the chip region A4 are sequentially arranged. The protection circuit region is disposed between the external connection terminal region A2 and the second internal connection terminal region A5, and the arrangement order of the device region A3 and the chip region A4 may be changed in various ways.

The first internal connection terminal area A1 and the second internal terminal area A5 are respectively provided at both edge portions of the package and are connected to the first internal connection terminal connected to the cap assembly 450 constituting the bare cell 400. The first internal connection terminal lead B + serving as a second internal connection terminal lead B- functioning as a second internal connection terminal is disposed, respectively.

The external connection terminal region A2 is adjacent to the first internal connection terminal region A1 and leads to the first to third external connection terminals P +, which are leads for a plurality of external connection terminals, which function as a plurality of external connection terminals. CF and P-) are each disposed sequentially. The order of arranging the first to third external connection leads P +, CF, and P− may vary. Here, the lead P + for the first external connection terminal and the lead B + for the first internal connection terminal are connected to each other. That is, the first internal connection lead B + is configured to extend from the first external connection lead P +, or the first external connection lead P + is formed from the first internal connection lead B +. It may be extended.

The device region A3 is for arranging a plurality of passive elements R1, R2, R3, C1, C2, and V1 constituting the battery protection circuit. The sixth passive element leads L1, L2, L3, L4, L5, L6 are disposed. For example, the first to third passive element leads L1, L2 and L3 may have a sequential arrangement structure on an upper side of the device region A3, and the fourth to sixth passive element leads L4, L5 and L6 may have a structure disposed below the device region A3.

For example, the first passive element lead L1 is disposed at a predetermined size in the element region A3 adjacent to the external connection terminal region A2, and the second passive element lead L2 is the first passive element. It is arranged in a predetermined size adjacent to the lead L1. The third passive element lead L3 is disposed at a predetermined size in the element region A3 adjacent to the chip region A4 and adjacent to the second passive element lead L2. The fourth passive element lead L4 is disposed in a predetermined size in the element region A3 adjacent to the external connection terminal region A2, and the fifth passive element lead L5 and the sixth passive element lead L6 are fixed. ) Is disposed adjacent to the fourth passive element lead L1 in such a manner that the fifth passive element lead L5 surrounds the sixth passive element lead L6.

The chip area A4 is an area for arranging a protection integrated circuit and a dual FET chip adjacent to the device area A3 and constituting a battery protection circuit. A die pad DP for mounting the stacked chip 100a is disposed. Can be. The die pad DP may be electrically connected to the common drain terminal of the dual FET chip 110 constituting the stacked chip 100a, and may be exposed during packaging of the subsequent process to function as an external connection terminal and to exhibit heat dissipation characteristics. It can be improved.

3 and 4, a plurality of passive elements R1, R2, R3, C1, C2, and V1 and a stacked chip 100a are disposed in the lead frame of FIG. 3, and FIG. The equivalent circuit shown in FIG.

First, the stacked chip 100a is mounted on the die pad DP of the chip region A4, and the reference voltage terminal VSS of the protection integrated circuit 120 constituting the stacked chip 100a is a first field effect transistor. The wire terminal and the third passive element lead (L3) of the wire bonding to perform the electrical connection.

In addition, the protection integrated circuit 120 electrically connects the terminal VDD to which the charge voltage and the discharge voltage are applied and detects the battery voltage through the wire L2 of the second passive element through wire bonding. In the integrated circuit 120, a sensing terminal V− for sensing a charge / discharge and an overcurrent state is electrically connected to the sixth passive element lead L6 through wire bonding.

The source terminal S1 of the first field effect transistor is electrically connected to the lead L3 for the third passive element through wire bonding, and the source terminal S2 of the second field effect transistor is the lead for the fifth passive element. It is electrically connected with the L5 through wire bonding.

Next, the first passive element lead L1 and the first external connection terminal lead P + are electrically connected through wire bonding, and the third passive element lead L3 and the second internal connection terminal are used. The lead B- is electrically connected through wire bonding or the like. The fourth passive element lead L4 is electrically connected to the second external connection terminal lead CF through wire bonding, and the fifth passive element lead L5 is the third external connection terminal lead L3. And is electrically connected through wire bonding or the like. The first resistor R1 of the plurality of passive elements is disposed between the first passive element lead L1 and the second passive element lead L2, and the second resistor of the passive elements is a second resistor. R2 is disposed between the fifth passive element lead L5 and the sixth passive element lead L6.

The third resistor R3 constituting the surge protection circuit among the plurality of passive elements is disposed between the fourth passive element lead L4 and the fifth passive element lead L5, and among the plurality of passive elements. The first capacitor C1 is disposed between the second passive element lead L2 and the third passive element lead L3, and the second capacitor C2 of the plurality of passive elements is used for the third passive element. It is arranged between the lead L3 and the fifth passive element lead L5. Varistor (V1) constituting the surge protection circuit of the plurality of passive elements is configured in parallel with the third resistor (R3) to the fourth passive element lead (L4) and the fifth passive element lead ( It is arranged between L5).

Meanwhile, in other embodiments of the present invention, the circuit diagram of the battery protection circuit shown in FIG. 1 and the basic package 200a shown in FIG. 4 implementing the same may be variously modified, and thus, various modified structures may be modified. It can be carried out including.

For example, in the modified first structure, the first field effect transistor FET1, the second field effect transistor FET2, and the protection integrated circuit may be provided integrated into one chip. The integrated single chip may be mounted on the lead frame 50 in the form of a flip chip. Flip chip has the advantage of improving the electrical conductivity, lowering production cost and process simplification compared to wire bonding since the external terminal is soldered and connected to the lead etc. which requires the electrical connection without the need for separate wire bonding. This has the advantage of reducing the volume occupied.

In addition, for example, in the modified second structure, the first field effect transistor FET1 and the second field effect transistor FET2 may be spaced apart from each other on the lead frame 50 without being implemented as a dual FET chip. Can be. In this case, in order to allow the drain of the first field effect transistor FET1 and the drain of the second field effect transistor FET2 to be electrically connected to each other, a conductive plate for connecting the lower surface of the lead frame 50 to each other is further provided. Can be placed.

5A is a perspective view illustrating a basic package constituting a part of a battery protection circuit package applied to a battery pack according to some embodiments of the present invention, and FIGS. 5B and 5C are batteries according to some embodiments of the present invention. A diagram illustrating a battery protection circuit package applied to a pack.

Referring to FIG. 5A, the basic package 200a implementing the battery protection circuit having the above-described arrangement structure may be understood as a structure before forming the encapsulant 250, and then molding the encapsulant 250. The battery protection circuit module package (300 of FIGS. 5B and 5C) is implemented through the process. That is, the protection circuit components 100a, 100b, and 130 are sealed in the basic package 200a, and the first internal connection lead B + and the second internal connection lead B which are part of the lead frame 50 are sealed. The encapsulant 250 that exposes-) may be formed to implement the battery protection circuit module package 300. The encapsulant 250 may include, for example, an epoxy molding compound (EMC). The protection circuit element 130 shown in FIG. 5A includes a plurality of passive elements R1, R2, R3, C1, C2, and V1 shown in FIG. 4.

In the battery protection circuit package 300 according to the exemplary embodiment of the present invention, the external connection terminals P +, CF, and P− may be exposed from an upper surface thereof, and the first internal connection terminal B + and the second internal parts thereof may be exposed to a lower surface thereof. The connecting terminal B- is configured to be exposed. Here, the upper surface of the package 300 may be packaged to further expose the lower surface (opposite side of the surface on which the stacked chip 100a is mounted) of the die pad DP according to heat dissipation or other needs. Meanwhile, at least one of the first internal connection lead B + and the second internal connection lead B- may be bent in a gull-form form. For example, the lead B + for the first internal connection terminal may be bent in a gull-form form to compensate for a step between the top surface of the electrode terminal 410 and the bottom surface of the recess 435. .

In the battery protection circuit package applied to the battery pack according to an embodiment of the present invention, the package 300 including the lead frame 50 may configure the battery protection circuit without using a separate printed circuit board. Such a configuration is arranged so that at least one passive element connects at least some of the plurality of spaced leads, and at least any one selected from the group consisting of the field effect transistor 110, the protection integrated circuit 120, and the plurality of leads. It can be implemented by providing an electrical connection member for electrically connecting the two. The electrical connection member may include a bonding wire or a bonding ribbon.

Since a circuit is formed by arranging an electrical connection member such as a bonding wire or a bonding ribbon on the lead frame 50, an important advantage of simplifying the process of designing and manufacturing the lead frame 50 for constructing a battery protection circuit. Has If the above-described electrical connection member is not introduced in implementing the battery protection circuit component in the embodiments of the present invention, since the configuration of the plurality of leads constituting the lead frame 50 becomes very complicated, an appropriate lead frame 50 may be used. It may not be easy to provide effectively.

In addition, the protection integrated circuit 120 and / or the field effect transistor 110 may not be inserted into and fixed in the form of a semiconductor package on the lead frame 50, but may be fixed by a surface mounting technology. On at least a portion of the surface of the c) may be mounted and fixed in the form of a chip die sawed on a wafer that is not sealed with a separate encapsulant. Here, a chip die is implemented by performing a sawing process without sealing with a separate encapsulant on a wafer on which a plurality of array-type structures (eg, a protection integrated circuit or a field effect transistor) are formed. Mean individual structures. That is, when mounting at least one selected from the group consisting of a protection integrated circuit and a field effect transistor (FET) on the lead frame 50, the subsequent encapsulant after mounting without sealing with a separate encapsulant Since the protection integrated circuit and the field effect transistor are sealed by the 250, the process of forming the encapsulant may be performed only once in implementing the battery protection circuit package 300. On the other hand, when the protection integrated circuit and / or the field effect transistor are separately inserted and fixed or mounted on a printed circuit board (PCB), one molding process is required for each component first, and then fixed on the printed circuit board Since another molding process is additionally required for each component mounted after mounting, the manufacturing process may be complicated and manufacturing cost may be high.

Subsequently, the bare cell 400 in which the basic package 200a may be mounted in the battery pack according to some embodiments of the present invention will be described.

6 is a schematic cross-sectional view illustrating a structure of a bare cell in a battery pack according to some embodiments of the present invention. Referring to FIG. 6, a battery pack according to some embodiments of the present disclosure includes a bare cell 400 having a cap plate 430 having a first polarity and an electrode terminal 410 having a second polarity.

In particular, by way of non-limiting example, the bare cell 400 includes an electrode assembly 405, a can 401 for receiving the electrode assembly 405, and a cap assembly 450 provided on an opening of the can 401. Can be done. The electrode assembly 405 is interposed between the positive electrode plate 402 formed by applying a positive electrode active material to a positive electrode current collector, the negative electrode plate 403 formed by applying a negative electrode active material to a negative electrode current collector, and between the positive electrode plate 402 and the negative electrode plate 403. The separator 404 may be formed to prevent short circuits of the electrode plates 402 and 403 and to allow movement of lithium ions.

The positive electrode plate 402 may be formed with a positive electrode non-coating portion, to which the positive electrode active material is not coated, and the negative electrode plate 403 may be formed with a negative electrode non-coated portion to which the negative electrode active material is not coated. The positive electrode tab 407 may be bonded to the positive electrode tab 407 electrically connected to the cap plate 430, and the negative electrode tab may be bonded to the negative electrode tab 408 electrically connected to the electrode terminal 410. At this time, the positive electrode tab 407 and the negative electrode tab 408 may be bonded to the positive electrode non-coating portion and the negative electrode non-coating portion, for example, by welding.

The positive electrode current collector may be stainless steel, nickel, aluminum, titanium or alloys thereof, or carbon, nickel, titanium, or silver surface treated on the surface of aluminum or stainless steel, and may include foil, film, sheet, and punched material. It may be provided in the form of a thing, a porous body, a blowing agent and the like. The positive electrode active material is a material capable of occluding or desorbing lithium ions, and may include at least one selected from a complex oxide with lithium, cobalt, manganese, and nickel.

The negative electrode current collector may be stainless steel, nickel, copper, titanium or alloys thereof, or carbon, nickel, titanium, or silver surface treated on the surface of copper or stainless steel, and may include foil, film, sheet, and punched material. It may be provided in the form of a thing, a porous body, a blowing agent and the like. As the negative electrode active material, a material capable of occluding or detaching lithium ions, a carbon material such as crystalline carbon, amorphous carbon, carbon composite, carbon fiber, lithium metal, lithium alloy, or the like may be used.

The separator 404 is formed of thermoplastic resin, such as polyethylene (PE) and polypropylene (PP), for example, and the surface has a porous membrane structure. Such a porous membrane structure may become an insulating film when the separator 404 is melted and clogged when the temperature inside the battery approaches the melting point of the thermoplastic resin. By changing to an insulating film as described above, the movement of lithium ions between the positive electrode plate 402 and the negative electrode plate 403 is blocked, and no further current flows, so that the temperature rise inside the battery can be stopped.

The can 401 may be formed of a metal material having an open upper end portion, accommodate the electrode assembly 405 and the electrolyte, and accommodate the insulating case 406 on the electrode assembly 405. As the metal material, light and ductile aluminum, aluminum alloy, stainless steel, or the like may be used. When the can 401 is formed of a metal material, the metal material may have polarity and may be used as an electrode terminal. The shape of the can 401 may be rectangular or oval with rounded corners, and the open upper end of the can 401 may be sealed by welding or heat fusion with the cap plate 430.

The cap assembly 450 may include an insulating case 406, a cap plate 430, a gasket 420, an electrode terminal 410, an insulating plate 412, a terminal plate 411, and an electrolyte inlet plug 415. Can be. The insulating case 406 is positioned above the electrode assembly 405 inserted into the can 401 to prevent the flow of the electrode assembly 405. In addition, the insulating case 406 spaces the positive electrode tab 407 and the negative electrode tab 408 a predetermined distance to prevent a short.

The cap plate 430 is coupled to the opening of the can 401 to seal the opening of the can 401, and a through hole through which the gasket 420 and the electrode terminal 410 may be inserted may be formed. The cap plate 430 is formed with an electrolyte injection hole that provides a passage for injecting the electrolyte into the can 401, and an electrolyte injection hole stopper 415 is coupled to seal the electrolyte injection hole.

The cap plate 430 includes a recess 435 to form a step below (eg, Z direction in FIG. 6). That is, the cap plate 430 has a step formed such that the level of the bottom surface of the recess 435 and the level around the recess 435 are different. The recess 435 may be understood as a hole, a cavity, a trench, or the like depending on shape and size. The cross-sectional shape of the recess 435 may have a polygonal, circular, elliptical or any amorphous shape. The recessed portion 435 may have a structure that is open upward (for example, opposite to the Z direction of FIG. 6).

The gasket 420 is coupled to a through hole formed in the cap plate 430, and is formed of an insulating material to insulate the electrode terminal 410 of the second polarity and the cap plate 430 of the first polarity. The second polarity is a negative electrode and the first polarity may be configured as an anode, but if necessary, the second polarity may be an anode and the first polarity may be configured as a negative electrode. A central portion of the gasket 420 may form a hole so that the electrode terminal 410 may be coupled. The electrode terminal 410 is inserted into a hole formed in the gasket 420 to be coupled to the cap plate 430, and the lower end of the electrode terminal 410 is connected to the terminal plate 411 while penetrating through the cap plate 430. do. The insulating plate 412 is disposed on the lower surface of the cap plate 430, and insulates the outer surface of the terminal plate 411 and forms a hole for connecting the electrode terminal 410 and the terminal plate 411. The terminal plate 411 is disposed on the lower surface of the insulating plate 412 and is made of a conductive material to be connected to the electrode terminal 410 to form an electrical path.

7 is an exploded perspective view illustrating a process of bonding a basic package on a bare cell in a method of manufacturing a battery pack according to an embodiment of the present invention, and FIG. 9 is a method of manufacturing a battery pack according to some embodiments of the present invention. Is a cross-sectional view illustrating a structure in which a basic package is bonded onto a bare cell.

7 and 9, at least a portion of the base package 200a including the lead frame 50 including the plurality of spaced leads and the protection circuit components on the lead frame 50 may have a recess 435. Can be disposed within. For example, the entirety of the base package 200a may be disposed in the space in the recess 435. Furthermore, the lead B + for the first internal connection terminal of the lead frame 50 constituting the basic package 200a is joined to be electrically connected to the cap plate 430 and the lead frame constituting the basic package 200a. The lead B- for the second internal connection terminal 50 may be joined to be electrically connected to the electrode terminal 410. The basic package 200a is bonded to the electrode terminal 410 and / or the cap plate 430 by laser welding, resistance welding, soldering and conductive adhesive (for example, conductive epoxy) and conductive tape. It may include any one selected from the group.

The first internal connection lead (B +) is electrically connected by bonding to the cap plate 430, and the second internal connection lead (B-) is electrically connected by bonding to the electrode terminal 410, In this case, the length of the lead frame 50 may correspond to the length L / 2 from one end of the cap plate 430 to the electrode terminal 410. According to this embodiment, since the battery protection circuit package 300 including the base package 200a is disposed using only one side area based on the electrode terminal 410 located in the center of the cap plate 430, the battery pack Miniaturization or high capacity can be achieved. For example, an additional cell may be formed in the remaining one side region based on the electrode terminal 410 to increase battery capacity or to place a chip having another additional function, thereby contributing to miniaturization of an application having such a battery.

Furthermore, a battery protection including a recess 435 is formed using a part of the space 414 located between the insulating case 406 and the cap plate 430 and includes a basic package 200a in the recess 435. By arranging at least a portion of the circuit package 300, the overall height of the battery pack can be lowered, and thus, an advantageous effect of realizing a high capacity battery pack can be expected by increasing the proportion of the electrode assembly 405 in the battery pack. have.

Meanwhile, referring to FIG. 7, the recess 435 in which the basic package 200a is disposed includes a space defined by a bottom surface and a side surface. Sides defining the recess 435 may be composed of two sides facing each other and perpendicular to the y axis and two sides facing each other and perpendicular to the x axis. The recess 435 may have a structure that is open upward (for example, opposite to the z direction). Since the side surface of the concave portion 435 is not an open structure, the effect that it is easy to fill the space in the concave portion 435 with the filler (555 in Fig. 10) can be expected.

8 is an exploded perspective view illustrating a process of bonding a basic package on a bare cell in a method of manufacturing a battery pack according to a modified embodiment of the present invention. Referring to FIG. 8, the recess 435 in which the battery protection circuit package 300 is disposed includes a space defined by a bottom surface and a side surface. The side defining the recess 435 may consist of only two sides perpendicular to the x-axis and facing each other. The recessed portion 435 may have a structure that is open upwards (eg, opposite the z direction) and laterally (eg, ± y direction). Since the side of the recess 435 has an open structure, the effect that the process of inserting and placing the basic package 200a in the recess 435 can be expected easily.

10 and 11 are cross-sectional views and perspective views illustrating a battery pack 600a according to an embodiment of the present invention.

10 and 11, an encapsulant 250 for sealing the protection circuit elements 100a and 130 of FIG. 9 is formed while exposing at least a part of the lead frame 50 constituting the basic package 200a. And forming a filler 555 that is bonded to the encapsulant 250 and fills at least a portion of the recess 435.

Forming the encapsulant 250 and forming the filler 555 may be performed simultaneously in one process. For example, the forming of the encapsulant 250 and the forming of the filler 555 may be simultaneously performed by one process of injecting a melt of the resin. Specifically, the forming of the encapsulant 250 and the forming of the filler 555 may be simultaneously performed by injecting a melt of the resin by a dispensing method or an insert injection molding method. Referring to FIG. 10, although the encapsulant 250 and the filler 555 are illustrated for convenience, the encapsulant 250 and the filler 555 are simultaneously formed by one process by injecting a melt of the same resin. It can be formed integrally with the same material without being distinguished. Since the forming of the encapsulant 250 and the forming of the filler 555 are simultaneously performed in one process, the process can be expected to be simplified, and the bonding force between the encapsulant 250 and the filler 555 is enhanced. Thus, the effect of securing structural stability of the battery pack can be expected.

Meanwhile, in the modified embodiment of the present invention, the forming of the encapsulant 250 and the forming of the filler 555 may be sequentially performed by individual processes instead of one process.

As the encapsulant 250 is formed on the basic package 200a, the battery protection circuit module package 300 is implemented. At least a portion of the battery protection circuit package 300 may be disposed in the recess 435. Furthermore, the top surface of the encapsulant 250 constituting the battery protection circuit package 300 may form the same plane as the top surface of the cap plate 430 around the recess 435. In addition, the upper surface of the filler 555 filling the recess 435 may have the same plane as the upper surface of the cap plate 430 around the recess 435. Accordingly, as shown in FIG. 11, the top surface of the battery pack 600a in which the encapsulant 250 and the filler 555 are formed may form a plane where no step is formed, and in this state, selectively labeling may be performed. The process may be performed to complete the battery pack of the final product.

12 is a perspective view illustrating a battery pack 600b according to another embodiment of the present invention. Referring to FIG. 12, the battery pack according to another embodiment of the present invention is implemented by further mounting the upper case 500 on the structure 600a illustrated in FIG. 11. The upper case 500 is disposed on the bare cell 400 and the battery protection circuit module package 300 and exposes external connection terminals (P +, CF, and P−) of the battery protection circuit module package 300. The opening 550 may be included. In the state of the battery pack 600b in which the upper case 500 is formed, a labeling process may be selectively performed to complete the battery pack of the final product. Such a battery pack may be generally understood as a battery inserted into a mobile phone or a terminal.

The upper case 500 may be made of resin. For example, after preparing the upper case 500 made of resin in advance, the upper portion of the structure shown in FIG. 11 may be cased with the upper case 500. In this case, the structure shown in FIG. 11 and the upper case 500 may be coupled in various ways such as bonding by prefabricated fastening, bonding by welding, and / or bonding by adhesive. On the other hand, unlike this manner, the upper case 500 may be implemented by placing the structure shown in FIG. 11 in an injection mold and injecting a melt of resin to insert injection molding.

The upper case 500 may be configured to include at least one selected from the group consisting of aluminum, an alloy including aluminum, and stainless steel (SUS) in addition to the above-described resin.

13 is a cross-sectional view illustrating a portion of a battery pack according to another embodiment of the present invention.

13 is a cross-sectional view illustrating a portion of a battery pack according to another embodiment of the present invention. Description of the configuration of the bare cell 400 shown in FIG. 13 has been described above with the same contents in FIG. 6, and thus will not be described herein. In FIG. 13, however, unlike FIG. 9, the base package 200a is mounted in the recess 435 configured to form a step below the cap plate 430 (for example, Z direction in FIG. 13). Rather, at least a part of the battery protection circuit package 300 including the encapsulant 250 is directly mounted. For example, the whole of the battery protection circuit package 300 may be disposed in a space in the recess 435. In addition, the upper surface of the encapsulant 250 constituting the battery protection circuit package 300 may have the same plane as the upper surface of the cap plate 430 around the recess 435. Description of the configuration of the battery protection circuit package 300 has been described with the same contents with reference to FIGS.

If necessary, the electrode terminal 410 may also be configured to be disposed in the recess 435. In the meantime, the battery protection circuit package 300 is bonded to the electrode terminal 410 and / or the cap plate 430 by laser welding, resistance welding, soldering and conductive adhesive (for example, conductive epoxy), It may include any one selected from the group consisting of a conductive tape.

A recess 435 is formed using a portion of the space 414 positioned between the insulating case 406 and the cap plate 430, and at least a portion of the battery protection circuit package 300 is disposed in the recess 435. As a result, the overall height of the battery pack may be lowered, and thus, an advantageous effect of increasing the ratio of the electrode assembly 405 in the battery pack to realize a high capacity battery pack may be expected.

14 and 15 are perspective views illustrating a process in which a battery protection circuit package is coupled to a battery can in a battery pack according to still another and modified embodiments of the present invention, and FIG. 16 is some embodiments of the present invention. Is a perspective view illustrating the appearance of a battery pack according to the present invention.

14 to 16, the battery protection circuit package 300 is inserted between the upper surface of the bare cell 400 and the upper case 500 illustrated in FIG. 13 to form a battery pack as shown in FIG. 16 ( 600c). The upper case 500 may include at least one selected from the group consisting of aluminum, an alloy including aluminum, stainless use steel (SUS), and a resin. The upper case 500 has an opening 550 which is a through hole in a portion corresponding to the external connection terminals P +, CF, and P− of the battery protection circuit package 300. The edge of the upper case 500 may be bonded to the can constituting the bare cell 400, for example, may be bonded by laser welding or mechanically fastened by bolts. The battery pack 600c may generally be understood as a battery inserted into a mobile phone or a terminal.

The lead B + for the first internal connection terminal may be electrically connected to the cap plate 430, and the lead B- for the second internal connection terminal may be electrically connected to the electrode terminal 410. In this case, the length of the lead frame 50 may correspond to the length L / 2 from one end of the cap plate 430 to the electrode terminal 410. According to this embodiment, since the battery protection circuit package 300 is mounted using only one side area based on the electrode terminal 410 positioned in the center of the cap plate 430, the battery pack can be miniaturized or increased in capacity. . For example, an additional cell may be formed in the remaining one side region based on the electrode terminal 410 to increase battery capacity or to place a chip having another additional function, thereby contributing to miniaturization of an application having such a battery.

Meanwhile, referring to FIG. 14, the recess 435 in which the battery protection circuit package 300 is disposed includes a space defined by a bottom surface and a side surface. The side defining the recess 435 may be composed of two sides perpendicular to the y-axis and facing each other and two sides perpendicular to the x-axis and facing each other. The recess 435 may have a structure that is open upward (for example, opposite to the z direction). Since the side surface of the concave portion 435 is not an open structure, the effect that it is easy to fill the space in the concave portion 435 with the sealing material (555 in Fig. 17) can be expected.

Referring to FIG. 15, the recess 435 in which the battery protection circuit package 300 is disposed includes a space defined by a bottom surface and a side surface. The side defining the recess 435 may be composed of two sides perpendicular to the x axis and facing each other. The recessed portion 435 may have a structure that is open upwards (eg, opposite the z direction) and laterally (eg, ± y direction). Since the side of the concave portion 435 is open, the effect of inserting and placing the battery protection circuit package 300 in the concave portion 435 can be expected to be easy.

Filling at least a portion of the recess 435 with the encapsulant prior to bonding the upper case 500 may optionally be performed. That is, after the battery protection circuit package 300 is bonded to the recess 435, the can constituting the bare cell 400 of the upper case 500 without filling at least a portion of the recess 435 with an encapsulant ( 401). On the other hand, after bonding the battery protection circuit package 300 in the recess 435, at least a portion of the recess 435 is filled with an encapsulant and the upper case 500 constitutes a bare cell 400. The can 401 can also be joined.

16 is a perspective view illustrating the appearance of a battery pack in accordance with some embodiments of the present disclosure.

Referring to FIG. 16, the battery pack 600c may be bonded by bonding the upper case 500 to the structure illustrated in FIG. 13 without filling the recess 435 formed in the cap plate 430 with the encapsulant 555. Can be implemented. External connection terminals P +, CF, and P− of the battery protection circuit package 300 may be exposed through the opening 550 of the upper case 500. In the state of the battery pack 600c in which the upper case 500 is formed, a labeling process may be selectively performed to complete the battery pack of the final product.

17 and 18 are cross-sectional and perspective views illustrating a part of a battery pack according to still another embodiment of the present invention.

17 and 18, the battery pack 600d may be implemented by preparing the structure illustrated in FIG. 13 and then filling the recess 435 with the encapsulant 555. In this case, the encapsulant 250 constituting the battery protection circuit package 300 and the encapsulant 555 filled with the recess 435 are not formed at the same time, but are formed in separate processes. Therefore, the materials constituting the encapsulant 250 constituting the battery protection circuit package 300 and the encapsulant 555 filled with the recess 435 may be the same or different from each other. Meanwhile, the battery pack may be implemented by bonding the upper case 500 to the structure illustrated in FIG. 18 as shown in FIG. 16. In the state of the battery pack in which the upper case 500 is formed, a labeling process may be selectively performed to complete the battery pack of the final product.

The top surface of the encapsulant 250 constituting the battery protection circuit package 300 may form the same plane as the top surface of the cap plate 430 around the recess 435. In addition, the upper surface of the filler 555 filling the recess 435 may have the same plane as the upper surface of the cap plate 430 around the recess 435. Thus, as shown in FIG. 18, the top surface of the battery pack 600d in which the encapsulant 250 and the filler 555 are formed may form a plane where no step is formed, and in this state, labeling may be selectively performed. The process may be performed to complete the battery pack of the final product.

19 is a cross-sectional view illustrating a portion of a battery pack according to another embodiment of the present invention.

Referring to FIG. 19, in the battery pack according to still another exemplary embodiment of the present invention, unlike in FIG. 13, the electrode terminal 410 is not positioned in the recess 435 that forms a step in the cap plate 430. This is provided. Since structures such as the electrode terminal 410 and the gasket 420 having a complicated structure are not located in the recess 435, it is easy to implement the recess 435. In addition, a recess 435 is formed using a portion of the space 414 positioned between the insulating case 406 and the cap plate 430, and at least a part of the battery protection circuit package 300 is formed in the recess 435. By lowering the overall height of the battery pack, it is possible to expect an advantageous effect that can implement a high capacity battery pack by increasing the proportion of the electrode assembly 405 in the battery pack.

However, since the electrode terminal 410 is located outside the recess 435, only a part of the battery protection circuit package 300 is located in a space in the recess 435, and the remaining part of the battery protection circuit package 300 is Since it is positioned to protrude upward in the space in the recess 435, the structure of the battery pack illustrated in FIG. 18 is difficult to implement, and the structure of the battery pack illustrated in FIG. 19 may finally be implemented.

Hereinafter, a PTC structure that can be additionally bonded to the battery protection circuit package 300 of some embodiments of the present invention described above will be described.

20 is a perspective view illustrating a PTC structure constituting a part of a battery protection circuit package in a battery pack according to another embodiment of the present invention, and FIG. 21 is a battery protection circuit in a battery pack according to another embodiment of the present invention. A diagram illustrating a package.

20 and 21, a battery protection circuit package according to another embodiment of the present invention includes a PTC structure 350. The PTC structure 350 may include the PTC device 310, the metal layer 320 attached to the first surface, which is one of the top and bottom surfaces of the PTC device 310, and the other of the top and bottom surfaces of the PTC device 310. It includes a conductive connecting member (330, 340) attached to the second surface of the surface. The metal layer 320 is bonded to one of the leads selected from the first internal connection lead (B +) and the second internal connection lead (B-), and the connection members 330 and 340 are electrode terminals (FIG. 1). 410). For example, the metal layer 320, the connection members 330 and 340, and / or the lead frame 50 may be made of nickel, copper, nickel plated copper, or other metal. The metal layer 320 may be formed of any one of the first internal terminal lead (B +) and the second internal terminal lead (B-) and laser welding, resistance welding, soldering, and a conductive adhesive (eg, For example, it may be bonded in any one manner selected from the group consisting of a conductive epoxy), a conductive tape.

The PTC (Positive Temperature Coefficient) element 310 can be formed by, for example, dispersing conductive particles in a crystalline polymer. Accordingly, the PTC element 310 becomes a passage through which current flows between the metal layer 320 and the conductive connection members 330 and 340 below the set temperature. However, when the temperature rises above the set temperature due to overcurrent, the crystalline polymer expands and the connection between the conductive particles dispersed in the crystalline polymer is separated, thereby rapidly increasing the resistance. Therefore, the flow of current between the metal layer 320 and the conductive connecting members 330 and 340 is blocked or the flow of current is reduced. As such, since the flow of current may be blocked by the PTC device 310, the PTC device 310 serves as a safety device for preventing the battery from being ruptured. When the temperature is lowered below the set temperature, the PTC device 310 contracts the crystalline polymer to restore the connection between the conductive particles, thereby smoothly flowing the current.

The lead frame 50 constituting the battery protection circuit package 300 is electrically connected to the electrode terminal 410 via a PTC structure. For example, the lead B- for the second internal connection terminal of the lead frame 50 may be electrically connected to the electrode terminal 410 of the battery bare cell through the PTC structure 350. That is, the lead B- of the second internal connection terminal of the lead frame 50 is bonded to the metal layer 320, and passes through the PTC element 310 to the conductive connection member 330 and 340, and then to the electrode of the battery bare cell. Is electrically connected to the terminal 410. In this case, the metal layer 320 is configured to be limited in the upper surface on the upper surface of the PTC element 310, the connection member 330, 340 is the electrode terminal 410 of the battery bare cell on the lower surface of the PTC element 310 It can be configured to stretch until. The connecting members 330 and 340 of the PTC structure are connected to the first connecting member 330 and the first connecting member 330 attached to one surface of the PTC element 310 to extend to the electrode terminal 410 of the battery bare cell. It may be composed of a second connecting member 340. Since the second connection member 340 should have an appropriate level to be bonded to the electrode terminal 410, a portion where the first connection member 330 and the second connection member 340 are connected may be bent. Meanwhile, the second connection member 340 is any one selected from the group consisting of an electrode terminal 410 of the battery bare cell, laser welding, resistance welding, soldering, conductive adhesive (for example, conductive epoxy), and conductive tape. Can be joined in one way.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (21)

1. A bare cell having a first polarity and having a cap plate including a recess to form a step below and an electrode terminal having a second polarity;

   A battery protection circuit package bonded to the electrode terminal and the cap plate to be electrically connected, wherein at least a part of the battery protection circuit package is disposed in the recess; And

   And a filler filling and sealing at least a portion of the battery protection circuit package by filling at least a portion of the recess.

   The battery protection circuit package includes a base package including a lead frame composed of a plurality of spaced leads and a protection circuit component on the lead frame, and an encapsulant sealing the protection circuit component while exposing a portion of the lead frame. Include,

   The filler and the encapsulant are bonded while being formed integrally at the same time by injecting a melt of resin.
2. The method of claim 1,

   And the electrode terminal and the battery protection circuit package are located in the recess formed in the cap plate.
3. The method of claim 1,

   The top surface of the filler is in the same plane as the top surface of the cap plate around the recess, the battery pack.
4. The method of claim 1,

   And an upper case disposed on the bare cell and the battery protection circuit package and including an opening exposing external connection terminals of the battery protection circuit package.
5. The method of claim 4, wherein

   The upper case includes at least any one selected from the group consisting of aluminum, an alloy containing aluminum, SUS and resin.
6. The method of claim 1,

   The battery protection circuit package

   A battery protection circuit element mounted on the lead frame and including a protection IC, a field effect transistor (FET), and at least one passive element;

   The passive element is arranged to connect at least some of the spaced plurality of leads, and electrically connects any two selected from the group consisting of the protection integrated circuit, the field effect transistor, and the plurality of leads. The battery pack further comprises a member, whereby a battery protection circuit is configured without using a separate printed circuit board.
7. The method of claim 6,

   The lead frame,

   A lead for a first internal connection terminal which is respectively disposed at both edge portions, and a lead for a second internal connection terminal which is joined to the electrode terminal and a cap plate;

   An external connection terminal lead disposed between the first internal connection lead and the second internal connection lead and constituting an external connection terminal; And

   A device mounting lead disposed between the first internal connection lead and the second internal connection lead, and on which the battery protection circuit element may be mounted;

   Including, a battery pack.
8. The method of claim 1,

   The battery protection circuit package

   Printed circuit board; And

   A battery protection circuit device including a protection IC, a field effect transistor (FET), and at least one passive device disposed on the printed circuit board;

   Including, a battery pack.
9. Providing a bare cell having a first polarity and having a cap plate including a recess to form a step below and an electrode terminal having a second polarity;

   Arranging at least a portion of a basic package including a lead frame composed of a plurality of spaced leads and a protection circuit component on the lead frame in the recess and electrically connecting the electrode terminal and the cap plate;

   Forming an encapsulant that seals the protection circuit component while exposing a portion of the leadframe; And

   Forming a filler that is bonded to the encapsulant and fills at least a portion of the concave portion.
10. The method of claim 9,

    The forming of the encapsulant and the forming of the filler are simultaneously performed by injecting a melt of resin.
11. The method of claim 9,

    The forming of the encapsulant and the forming of the filler are simultaneously performed by injecting a melt of the resin by a dispensing method or an injection molding method.
12. A bare cell having an electrode terminal of a first polarity and a cap plate of a second polarity; And

    And a battery protection circuit package electrically connected to the electrode terminal and the cap plate.

    And the cap plate includes a recess to form a step downward, and at least a portion of the battery protection circuit package is disposed in the recess.
13. The method of claim 12,

    And the electrode terminal and the battery protection circuit package are located in the recess formed in the cap plate.
14. The method of claim 12,

    And an upper case disposed on the bare cell and the battery protection circuit package and including an opening exposing external connection terminals of the battery protection circuit package.
15. The method of claim 12,

    And an encapsulant that seals and fixes at least a portion of the battery protection circuit package by filling at least a portion of the recess formed in the cap plate.
16. The method of claim 15,

    The encapsulant is configured to expose an external connection terminal of the battery protection circuit package, the upper surface of the encapsulant forms the same plane as the upper surface of the cap plate around the recess.
17. The method of claim 15,

    And an upper case disposed on the bare cell and the battery protection circuit package and including an opening exposing external connection terminals of the battery protection circuit package.
18. The method according to claim 14 or 17,

    The upper case includes at least one selected from the group consisting of aluminum, an alloy containing aluminum, SUS, and a resin.
19. The method of claim 12,

    The battery protection circuit package

    A lead frame comprising a plurality of leads spaced apart from each other and bonded to the electrode terminal and the cap plate; And

    A battery protection circuit element mounted on the lead frame and including a protection IC, a field effect transistor (FET), and at least one passive element;

    The passive element is arranged to connect at least some of the spaced leads, and electrically connects any two selected from the group consisting of the protection integrated circuit, the field effect transistor, and the plurality of leads. By further comprising an electrical connection member, a battery protection circuit is configured without using a separate printed circuit board, the battery pack.
20. The method of claim 19,

    The lead frame,

    A lead for a first internal connection terminal which is respectively disposed at both edge portions, and a lead for a second internal connection terminal which is joined to the electrode terminal and a cap plate;

    An external connection terminal lead disposed between the first internal connection terminal lead and the second internal connection terminal lead and constituting the external connection terminal; And

    A device mounting lead disposed between the first internal connection lead and the second internal connection lead, and on which the battery protection circuit element may be mounted;

    Including, a battery pack.
21. The method of claim 12,

    The battery protection circuit package

    Printed circuit board; And

    A battery protection circuit device including a protection IC, a field effect transistor (FET), and at least one passive device disposed on the printed circuit board;

    Including, a battery pack.

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