WO2014192096A1

WO2014192096A1 - Electronic part mounting device

Info

Publication number: WO2014192096A1
Application number: PCT/JP2013/064889
Authority: WO
Inventors: 知克久保田; 今井　美津男
Original assignee: 富士機械製造株式会社
Priority date: 2013-05-29
Filing date: 2013-05-29
Publication date: 2014-12-04
Also published as: JPWO2014192096A1; JP6096292B2

Abstract

　An electronic part mounting device of the present invention is provided with: a feeder; a mounting head for transporting an electronic part supplied from the feeder to a circuit board and mounting the electronic part thereon; a moving device for moving the mounting head to the circuit board; and a collecting container for collecting the electronic part released from the mounting head. The mounting head has a plurality of nozzles, and the plurality of nozzles can rotate about the mounting head such that the respective nozzles move to a first retrieval position, a first release position, a second retrieval position, and a second release position, in this order. When the respective nozzles are in the first or second retrieval position, the nozzles retrieve the electronic part from the feeder, and when the respective nozzles are in the first or second release position, the nozzles selectively release the held electronic part. The collecting container moves together with the mounting head due to the moving device, and is located below both nozzles in the first and second release positions regardless of the position of the mounting head.

Description

Electronic component mounting machine

The present specification relates to an electronic component mounting machine (also referred to as a surface mounter or a chip mounter) that mounts electronic components on a circuit board.

Japanese Unexamined Patent Application Publication No. 2010-129606 describes an electronic component mounting machine. The electronic component mounting machine includes a feeder that supplies electronic components, a mounting head that holds electronic components supplied from the feeder, a moving device that moves the mounting head relative to a circuit board, and electrons emitted from the mounting head. And a collection container for collecting the parts. The mounting head has a plurality of nozzles that each attract an electronic component. The plurality of nozzles can circulate with respect to the mounting head, and each nozzle sequentially moves between the pick-up position, the inspection position, and the discharge position.

In the electronic component mounting machine described above, when each nozzle is in the pick-up position, the electronic component is picked up from the feeder. When the nozzle holding the electronic component moves to the inspection position, whether the electronic component held by the nozzle is good or bad is determined. If the posture of the electronic component held by the nozzle is defective, the electronic component cannot be correctly mounted on the circuit board. Therefore, when the posture of the electronic component is determined to be defective, the electronic component is discharged from the nozzle when the nozzle moves to the discharge position. The released electronic component is collected by the collection container. The collection container is fixed to the mounting head, and the electronic components emitted from the nozzle can be collected regardless of the position of the mounting head.

In the electronic component mounting machine described above, only one nozzle at the pick-up position can pick up the electronic component from the feeder. In this regard, for example, as in an electronic component mounting machine described in JP2013-69798A, it is conceivable to provide a plurality of pick-up positions on the circulation path of the nozzle. With this configuration, some nozzles pick up electronic components from the feeder at one pick-up position, and some other nozzles pick up electronic components from the feeder at other pick-up positions. The pick-up position of the electronic component differs depending on the nozzle.

When a plurality of pick-up positions are provided on the circulation path of the nozzle, one or several nozzles pick up electronic components at a pick-up position relatively distant from the discharge position. Here, the electronic component held in a defective posture by the nozzle tends to fall from the nozzle. Therefore, when the nozzle holds the electronic component in a defective posture, there is a concern that the electronic component falls before the nozzle moves to the discharge position.

This specification aims to provide an electronic component mounting machine capable of preventing or reducing the above-described problems.

In order to solve the above problem, it is preferable to provide a plurality of pick-up positions and a plurality of discharge positions on the circulation path of the nozzle. The pick-up position here means the position where the nozzle picks up the electronic component from the feeder, and the discharge position means the position where the nozzle selectively discharges the electronic component and the electronic component is recovered by the recovery container. Means. According to such a configuration, one or a plurality of discharge positions can be provided in the vicinity of each pick-up position. Therefore, if necessary (for example, when the posture of the electronic component to be held is poor or the electronic component When the device itself is defective), the electronic component held by the nozzle can be quickly collected in the collection container.

Based on the above-described technology, this specification discloses a new and useful electronic component mounting machine. The electronic component mounting machine includes a feeder that supplies electronic components, a mounting head that holds electronic components supplied from the feeder, a moving device that moves the mounting head relative to a circuit board, and electrons emitted from the mounting head. And a collection container for collecting the parts. The mounting head has a plurality of nozzles that each attract an electronic component. The plurality of nozzles can circulate with respect to the mounting head so that each of the nozzles sequentially moves in the first pick-up position, the first discharge position, the second pick-up position, and the second discharge position.

Each nozzle picks up an electronic component from the feeder when in the first pick-up position or the second pick-up position, and selectively selects the electronic component to be held when in the first discharge position or the second discharge position. Can be released. The collection container is moved together with the mounting head by the moving device, and can accept electronic components discharged from both nozzles at the first discharge position and the second discharge position regardless of the position of the mounting head.

In the electronic component mounting machine described above, if each nozzle is necessary (for example, when the posture of the electronic component to be held is defective or when the electronic component itself is defective), the first discharge position and the second discharge position are set. At any of the discharge positions, the held electronic component can be discharged to the collection container. In particular, the first discharge position is located between the first pick-up position and the second pick-up position, and the second discharge position is located between the second pick-up position and the first pick-up position. Yes. Therefore, each of the nozzles can quickly discharge the held electronic component to the collection container regardless of whether the electronic component is picked up at the first pick-up position or the electronic component is picked up at the second pick-up position. Thereby, the problem that an electronic component falls unintentionally from a nozzle is prevented or reduced.

The figure which shows the external appearance of an electronic component mounting machine. The figure which shows a mounting head. The figure which shows a 2nd feeder with a mounting head. The figure which shows a some nozzle typically. Sectional drawing in the VV line | wire in FIG. The figure which shows the nozzle in a 1st stop position (1st pick-up position) and a 7th stop position (3rd test | inspection position). The figure which shows the nozzle in a 2nd stop position (1st test position) and an 8th stop position (2nd test position). The figure which shows the nozzle in a 3rd stop position (1st discharge position) and a 9th stop position (2nd discharge position). The figure which shows the nozzle in a 5th stop position (2nd pick-up position) and an 11th stop position.

In one embodiment of the present technology, the collection container preferably has an opening located below both nozzles at the first discharge position and the second discharge position. According to such a configuration, since the electronic component discharged from the nozzle can fall into the collection container by its own weight, a guide for guiding the electronic component to the collection container is not necessarily required. However, in other embodiments, a guide for guiding the electronic component to the collection container may be provided. In this case, the collection container does not necessarily have an opening located below both nozzles at the first discharge position and the second discharge position.

In an embodiment of the present technology, the electronic component mounting machine includes a first inspection device that determines whether the posture of the electronic component held by the nozzle located between the first pick-up position and the first discharge position is good. It is preferable to further include a second inspection device that determines whether the posture of the electronic component held by the nozzle located between the second pick-up position and the second discharge position is good. According to such a configuration, the posture of the electronic component picked up by the nozzle at the first pick-up position is inspected by the first inspection device, and the posture of the electronic component picked up by the nozzle at the second pick-up position is Two inspection devices can be used for inspection. That is, the posture of the electronic component can be inspected near each pick-up position.

In the above-described embodiment, when each of the nozzles determines that the posture of the electronic component is defective by the first inspection device, the electronic component is discharged at the first discharge position, and the posture of the electronic component is defective by the second inspection device. When it is determined that the electronic component is released at the second emission position. According to such a configuration, the electronic component held in a defective posture by the nozzle can be quickly collected into the collection container.

The first inspection apparatus described above has a first imaging device that is moved together with the mounting head by a moving device, and the first imaging device is disposed on a nozzle located between the first pick-up position and the first discharge position. It is preferable to image the held electronic component. Similarly, the above-described second inspection apparatus includes a second imaging device that is moved together with the mounting head by the moving device, and the second imaging device is located between the second pick-up position and the second discharge position. It is preferable that the electronic component held by the nozzle is picked up. According to such a configuration, the first and second inspection apparatuses can determine whether the posture of the electronic component is good or not by processing the images captured by the first and second imaging apparatuses, respectively. However, the first and second inspection devices may include other sensors that can detect the relative positions of the nozzle and the electronic component, instead of the first and second imaging devices, respectively.

In one embodiment of the present technology, it is preferable that the electronic component mounting machine further includes a third inspection device that determines the quality of the electronic component held by the nozzle. In this case, it is preferable that each nozzle emits the electronic component at the first emission position or the second emission position when the third inspection apparatus determines that the electronic component is defective. According to such a configuration, when the electronic component held by the nozzle is a defective product or a different type of electronic component, the electronic component can be collected in the collection container.

It is preferable that the above-described third inspection apparatus has a third imaging device that images the electronic component that is moved together with the mounting head by the moving device and held by the nozzle. According to such a configuration, the third inspection apparatus can determine the quality of the electronic component by processing the image captured by the third imaging apparatus. However, the third inspection apparatus may include another sensor that can detect a feature point of the electronic component instead of the third imaging apparatus.

In an embodiment of the present technology, it is preferable that the feeder described above includes a first feeder and a second feeder. In this case, when at least one of the plurality of nozzles picks up the electronic component from the first feeder when in the first pick-up position, and at least one of the plurality of nozzles is in the second pick-up position It is preferable to pick up electronic components from the second feeder. According to such a configuration, the mounting head can efficiently pick up electronic components supplied from the first feeder and the second feeder.

In the above-described embodiment, it is preferable that at least one of the first feeder and the second feeder is moved together with the mounting head by the moving device. According to such a configuration, when picking up the electronic component from at least one of the first feeder and the second feeder, it is not necessary to move the mounting head by the moving device. Therefore, the electronic component can be picked up in a short time.

It is preferable that at least one of the first feeder and the second feeder described above is a bulk feeder. Here, the bulk feeder means a feeder that sends out electronic components one by one from a storage container that stores a plurality of electronic components in a loose state. The bulk feeder is a feeder suitable for a relatively small electronic component, and has a feature that its size is also relatively small. Therefore, by adopting a bulk feeder, the electronic component mounting machine can be downsized. In particular, it is preferable to employ a bulk feeder for the first feeder and / or the second feeder moved together with the mounting head by the moving device.

The electronic component mounting machine 10 according to the embodiment will be described with reference to the drawings. The electronic component mounting machine 10 is a device for mounting (mounting) electronic components on a circuit board. The electronic component mounting machine 10 is also referred to as a surface mounter or a chip mounter. The electronic component mounting machine 10 is fixed to the system base 12 together with other electronic component mounting machines 10. Usually, a solder printing device, a plurality of electronic component mounting machines 10 and an inspection device are provided on the left and right, and they constitute a series of component mounting lines. In the following description, the direction in which the electronic component mounting machines 10 are arranged in FIG. 1 is defined as the Y direction and the horizontal X direction perpendicular thereto.

The electronic component mounting machine 10 includes a frame 20 and a plurality of first feeders 30 fixed to the frame 20. The plurality of first feeders 30 are detachably attached to the front portion of the frame 20. Each first feeder 30 accommodates a plurality of electronic components and supplies the electronic components to the mounting head 22 described later. The 1st feeder 30 of a present Example is a tape type feeder which accommodates a some electronic component in a carrier tape. The first feeder 30 may be another type of feeder, and is not limited to a tape feeder. For example, the first feeder 30 may be a tray type feeder that accommodates a plurality of electronic components on a tray.

The electronic component mounting machine 10 includes two substrate transfer devices 26. Each substrate transport device 26 transports the circuit board in the Y direction. Each substrate transfer device 26 is connected in series with the substrate transfer device 26 of another adjacent electronic component mounting machine 10. In other words, the board transport device 26 receives the circuit board from the electronic component mounting machine 10 (or solder printing apparatus) adjacent to one side and mounts the circuit board on which the electronic component has been mounted to the electronic component mounting adjacent to the other side. Send to machine 10 (or inspection device). The specific configuration of the substrate transfer device 26 is not particularly limited.

The electronic component mounting machine 10 includes a mounting head 22 and a head moving device 24 that moves the mounting head 22 in the X direction and the Y direction. The mounting head 22 is moved in a predetermined order by the head moving device 24 with respect to the plurality of first feeders 30 and the circuit board on the substrate transport device 26. The mounting head 22 picks up and holds the electronic component from the first feeder 30 and transports and mounts the electronic component onto the circuit board on the substrate transport device 26.

As shown in FIG. 2, the mounting head 22 includes a plurality of nozzles 40 and a revolving device 42 that revolves the plurality of nozzles 40. The plurality of nozzles 40 are attached to the main body 44 of the mounting head 22 via the rotating device 42, and can rotate around the main body 44 of the mounting head 22. Each nozzle 40 is a holder for sucking and releasing the electronic component, and the mounting head 22 can hold the electronic component to each nozzle 40. Although it is an example, the mounting head 22 of the present embodiment has 12 nozzles 40 and can simultaneously hold up to 12 electronic components. The circling device 42 circulates the plurality of nozzles 40 intermittently by the pitch angle. For example, in the present embodiment, since the pitch angle of the 12 nozzles 40 is 30 degrees, the circulating device 42 rotates the 12 nozzles 40 intermittently by 30 degrees.

As shown in FIG. 3, the electronic component mounting machine 10 includes a second feeder 32. The second feeder 32 accommodates a plurality of electronic components and supplies the electronic components to the nozzle 40 of the mounting head 22. The second feeder 32 is fixed to the mounting head 22 and is moved together with the mounting head 22 by the head moving device 24 described above. Although it is an example, the 2nd feeder 32 of a present Example is a bulk feeder. The second feeder (bulk feeder) 32 includes an accommodating portion 34 that accommodates a plurality of electronic components in a loose state, and a supply arm 36 that extends from the accommodating portion 34 to below the nozzle 40. The supply arm 36 is provided with a supply groove 38. The second feeder 32 sends out the electronic components in the housing portion 34 along the supply groove 38 to the lower side of the nozzle 40. However, the 2nd feeder 32 is not limited to a bulk feeder, The feeder of another aspect may be sufficient.

4 and 5, the plurality of nozzles 40 circulate intermittently in the R direction with respect to the mounting head 22 by the circulator 42. As a result, each nozzle 40 has a first stop position A, a second stop position B, a third stop position C, a fourth stop position D, a fifth stop position E, a sixth stop position F, and a seventh stop position G. The eighth stop position H, the ninth stop position I, the tenth stop position J, the eleventh stop position K, and the twelfth stop position L are sequentially moved. Hereinafter, the configuration and operation of the electronic component mounting machine 10 will be described with respect to the respective stop positions A to L.

As shown in FIG. 6, the first stop position A is a first pick-up position where each nozzle 40 picks up the electronic component 4 from the first feeder 30. When picking up the electronic component 4 from the first feeder 30, the mounting head 22 moves the corresponding nozzle 40 to the first stop position A (first pick-up position), and the electronic component 4 supplied by the first feeder 30 is moved to the nozzle. Adsorbed by 40. At this time, the mounting head 22 can move the nozzle 40 at the first stop position A (first pick-up position) in the vertical direction.

The first stop position A is also a mounting position where each nozzle 40 mounts the electronic component 4 on the circuit board. After all (or some of) the nozzles 40 hold the electronic component 4, the mounting head 22 is moved above the substrate transfer device 26 by the head moving device 24. A circuit board on which the electronic component 4 is to be mounted is supported on the board transfer device 26. The mounting head 22 mounts the electronic component 4 on the circuit board while sequentially moving the nozzle 40 that holds the electronic component 4 to the first stop position A. At this time, the head moving device 24 sequentially moves the mounting head 22 relative to the circuit board in accordance with the mounting location of each electronic component 4 defined on the circuit board.

As shown in FIG. 7, the second stop position B is a first inspection position for determining whether or not the posture of the electronic component 4 held by the nozzle 40 is good. For this purpose, the electronic component mounting machine 10 includes a first imaging device 54. The first imaging device 54 is fixed to the head main body 44 in the vicinity of the second stop position B (first inspection position). The first imaging device 54 images the nozzle 40 at the second stop position B and the electronic component 4 held by the nozzle 40. The first imaging device 54 images the nozzle 40 and the electronic component 4 from the side (a direction that forms an angle with respect to the axial direction of the nozzle 40). The first imaging device 54 is connected to the control device 50 of the electronic component mounting machine 10. The control device 50 can determine whether the posture of the electronic component 4 held by the nozzle 40 (position and orientation with respect to the nozzle 40) is good or bad by processing an image captured by the first imaging device 54. Thus, the 1st imaging device 54 comprises the 1st test | inspection apparatus which determines the quality of the attitude | position of the electronic component 4 hold | maintained at the nozzle 40 with the control apparatus 50. FIG.

As shown in FIG. 8, the third stop position C is a first discharge position where each nozzle 40 selectively discharges the electronic component 4. Each nozzle 40 has a third stop position C (first discharge position) when the first inspection device (the first imaging device 54 and the control device 50) determines that the posture of the electronic component 4 is defective. ), The suction of the electronic component 4 is released, and the electronic component 4 is released. In order to collect the released electronic component 4, the electronic component mounting machine 10 of this embodiment includes a collection container 60. The collection container 60 is attached to the head main body 44 and is moved together with the mounting head 22 by the head moving device 24. The opening 62 of the collection container 60 is located below the nozzle 40 at the third stop position C, and the electronic component 4 discharged from the nozzle 40 is collected in the collection container 60 by its own weight.

The fourth stop position D is omitted because there is no matter that needs to be explained in this specification.

As shown in FIG. 9, the fifth stop position E is a second pick-up position where each nozzle 40 picks up the electronic component 4 from the second feeder 32. When picking up the electronic component 4 from the second feeder 32, the mounting head 22 moves the corresponding nozzle 40 to the fifth stop position E (second pick-up position), and the electronic component 4 supplied by the second feeder 32 is moved to the nozzle. Adsorbed by 40. At this time, the mounting head 22 can move the nozzle 40 at the fifth stop position E (second pick-up position) in the vertical direction. That is, in the electronic component mounting machine 10 of the present embodiment, each nozzle 40 picks up the electronic component 4 from the first feeder 30 at the first stop position A (first pick-up position) described above, or the fifth stop position. The electronic component 4 is picked up from the second feeder 32 at E (second pick-up position).

The sixth stop position F is not required to be described in this specification, so the description thereof is omitted.

Returning to FIG. 6, the seventh stop position G is a third inspection position for determining whether the electronic component 4 held by the nozzle 40 is good or bad. For this purpose, the electronic component mounting machine 10 includes a third imaging device 52. The third imaging device 52 is fixed to the head main body 44 in the vicinity of the seventh stop position G (third inspection position). The third imaging device 52 images the electronic component 4 held by the nozzle 40 at the seventh stop position G. The third imaging device 52 images the electronic component 4 held by the nozzle 40 from below (a direction parallel to the axial direction of the nozzle 40). The third imaging device 52 is connected to the control device 50 of the electronic component mounting machine 10. The control device 50 can determine whether the electronic component 4 held by the nozzle 40 is good or bad by processing an image captured by the third imaging device 52. As described above, the third imaging device 52 and the control device 50 constitute a third inspection device that determines the quality of the electronic component 4 held by the nozzle 40.

As shown in FIG. 7, the eighth stop position H is a second inspection position for determining whether the posture of the electronic component 4 held by the nozzle 40 is good or bad. For this purpose, the electronic component mounting machine 10 includes a second imaging device 56. The second imaging device 56 is fixed to the head body 44 in the vicinity of the eighth stop position H (second inspection position). The second imaging device 56 images the nozzle 40 at the eighth stop position H and the electronic component 4 held by the nozzle 40. Note that the second imaging device 56 images the nozzle 40 and the electronic component 4 from the side (a direction that forms an angle with respect to the axial direction of the nozzle 40). The second imaging device 56 is connected to the control device 50 of the electronic component mounting machine 10. The control device 50 can determine whether the posture of the electronic component 4 held by the nozzle 40 (position and orientation with respect to the nozzle 40) is good or bad by processing the image captured by the second imaging device 56. In this way, the second imaging device 56 and the control device 50 constitute a second inspection device that determines the quality of the electronic component 4 held by the nozzle 40.

As shown in FIG. 8, the ninth stop position I is a second discharge position where each nozzle 40 selectively discharges the electronic component 4. Each nozzle 40 has a ninth stop position I (second discharge position) when the second inspection device (second imaging device 56 and control device 50) determines that the posture of the electronic component 4 is defective. ), The suction of the electronic component 4 is released, and the electronic component 4 is released. Alternatively, each nozzle 40 also has the ninth stop position I (second discharge) when the electronic component 4 itself is determined to be defective by the above-described third inspection device (the third imaging device 52 and the control device 50). At the position), the suction of the electronic component 4 is released and the electronic component 4 is released. The opening 62 of the recovery container 60 described above is located not only at the nozzle 40 at the third stop position C but also below the nozzle 40 at the ninth stop position I. Thereby, the electronic component 4 discharged from the nozzle 40 at the ninth stop position I is also collected in the collection container 60 by its own weight.

The tenth, eleventh and twelfth stop positions J, K, and L are not described in the present specification, and thus the description thereof is omitted.

As described above, in the electronic component mounting machine 10 of the present embodiment, each nozzle 40 picks up the electronic component 4 from the first feeder 30 at the first stop position A (first pick-up position), or the first 5 The electronic component 4 can be picked up from the second feeder 32 at the stop position E (second pick-up position). The pick-up positions where the nozzle 40 picks up the electronic component 4 are provided at two places on the circulation path of the nozzle 40.

When the nozzle 40 picks up the electronic component 4 at the first stop position A (first pick-up position), whether the posture of the electronic component 4 is good or not is determined at the second stop position B (first inspection position). When the posture is determined to be defective, the electronic component 4 is discharged from the nozzle 40 and collected by the collection container 60 at the adjacent third stop position C (first discharge position). On the other hand, when the nozzle 40 picks up the electronic component 4 at the fifth stop position E (second pick-up position), whether the posture of the electronic component 4 is good or not is determined at the eighth stop position H (second inspection position). Is done. When it is determined that the posture is defective, the electronic component 4 is discharged from the nozzle 40 and recovered by the recovery container 60 at the adjacent ninth stop position I (second discharge position). Here, the collection container 60 is configured to move integrally with the mounting head 22. Regardless of the position of the mounting head 22, the nozzle 40 and the ninth nozzle at the third stop position C (first discharge position) are used. It continues to be positioned below both of the nozzles 40 at the stop position I (second discharge position). Therefore, when the electronic component 4 is recovered by the recovery container 60, it is not necessary to move the mounting head 22 by the head moving device 24.

Thus, the electronic component mounting machine 10 of the present embodiment can collect the electronic component 4 held by the nozzle 40 in the vicinity of the pick-up positions A and E where the nozzle 40 picks up the electronic component 4. When the posture of the electronic component 4 held by the nozzle 40 is defective, the electronic component 4 is unintentionally dropped from the nozzle 40 by quickly collecting the unstablely held electronic component 4. Can be avoided.

Whether the electronic component 4 itself held by the nozzle 40 is good or bad is determined at the seventh stop position G (third inspection position) regardless of the pick-up positions A and E. This is because the electronic component 4 is less likely to fall from the nozzle 40 if the posture of the electronic component 4 held by the nozzle 40 is normal. Therefore, regarding the quality of the electronic component 4 itself held by the nozzle 40, the configuration of the mounting head 22 is avoided from being complicated as a configuration that is performed only at one place on the circulation path of the nozzle 40.

Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

For example, not only the first and second picking positions but also three or more picking positions may be provided on the circulation path of the nozzle 40. That is, each nozzle 40 may be configured to pick up the electronic component 4 from the first or second feeder 30, 32 (or other feeder) at three or more pick-up positions. In this case, the nozzle 40 may discharge the electronic component 4, and the discharge positions where the electronic component 4 is recovered by the recovery container 60 may be provided at three or more locations on the circulation path of the nozzle 40.

Alternatively, the collection container 60 is not limited to a single container, and may be composed of two or more containers. For example, the collection container 60 is below the first collection container disposed below the nozzle 40 at the first position (first discharge position) and below the nozzle 40 at the ninth stop position I (second discharge position). You may provide the 2nd collection container arrange | positioned. Further, the collection container 60 may be one that distinguishes and collects the non-defective electronic component 4 and the defective electronic component 4. In this case, it is preferable that each nozzle 40 changes the position at which the electronic component 4 is discharged when the posture of the electronic component 4 is determined to be defective and when the electronic component 4 itself is determined to be defective. .

The technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

4: Electronic component 10: Electronic component mounting machine 22: Mounting head 24: Head moving device 26: Substrate transport device 30: First feeder 32: Second feeder 40: Nozzle 42: Circulation device 50: Control device 52: Third imaging Device 54: First imaging device 56: Second imaging device 60: Collection container 62: Opening of collection container

Claims

An electronic component mounting machine for mounting electronic components on a circuit board,
A feeder for supplying electronic components;
A mounting head for holding an electronic component supplied from the feeder;
A moving device for moving the mounting head relative to the circuit board;
A collection container for collecting the electronic components released from the mounting head,
The mounting head has a plurality of nozzles each of which sucks an electronic component;
The plurality of nozzles can circulate with respect to the mounting head such that each nozzle sequentially moves through a first pick-up position, a first discharge position, a second pick-up position, and a second discharge position,
Each nozzle picks up an electronic component from the feeder when in the first pick-up position or the second pick-up position, and holds when it is in the first discharge position or the second discharge position. Selectively release electronic components,
The collection container is moved together with the mounting head by the moving device and receives electronic components discharged from both nozzles at the first discharge position and the second discharge position regardless of the position of the mounting head.
Electronic component mounting machine.
The electronic component mounting machine according to claim 1, wherein the collection container has an opening located below both nozzles at the first discharge position and the second discharge position.
A first inspection device that determines whether or not the posture of the electronic component held by the nozzle located between the first pick-up position and the first discharge position is good;
A second inspection device for determining whether or not the posture of the electronic component held by the nozzle located between the second pick-up position and the second discharge position is good;
The electronic component mounting machine according to claim 1, further comprising:
Each nozzle emits an electronic component at the first discharge position when the first inspection device determines that the posture of the electronic component is defective, and the second inspection device determines that the posture of the electronic component is defective. When the electronic component is released at the second emission position,
The electronic component mounting machine according to claim 3.
The first inspection device includes a first imaging device that is moved together with the mounting head by the moving device,
The first imaging device images an electronic component held by a nozzle located between the first pick-up position and the first discharge position.
The electronic component mounting machine according to claim 3 or 4.
The second inspection device includes a second imaging device that is moved together with the mounting head by the moving device,
The second image pickup device picks up an image of an electronic component held by a nozzle located between the second pick-up position and the second discharge position;
The electronic component mounting machine according to any one of claims 3 to 5.
A third inspection device for determining the quality of the electronic component held by the nozzle;
Each nozzle emits an electronic component at the first emission position or the second emission position when the third inspection apparatus determines that the electronic component is defective.
The electronic component mounting machine according to any one of claims 1 to 6.
The third inspection apparatus includes a third imaging device that images the electronic component that is moved together with the mounting head by the moving device and held by the nozzle.
The electronic component mounting machine according to claim 7.
The feeder includes a first feeder and a second feeder,
At least one of the plurality of nozzles picks up an electronic component from the first feeder when in the first pick-up position;
At least one of the plurality of nozzles picks up an electronic component from the second feeder when in the second pick-up position;
The electronic component mounting machine according to any one of claims 1 to 8.
10. The electronic component mounting machine according to claim 9, wherein at least one of the first feeder and the second feeder is moved together with the mounting head by the moving device.
The electronic component mounting machine according to claim 9 or 10, wherein at least one of the first feeder and the second feeder is a bulk feeder.