WO2014187299A1 - 一种安装组件 - Google Patents
一种安装组件 Download PDFInfo
- Publication number
- WO2014187299A1 WO2014187299A1 PCT/CN2014/077823 CN2014077823W WO2014187299A1 WO 2014187299 A1 WO2014187299 A1 WO 2014187299A1 CN 2014077823 W CN2014077823 W CN 2014077823W WO 2014187299 A1 WO2014187299 A1 WO 2014187299A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hard disk
- radiator
- fixing
- heat sink
- fixing holes
- Prior art date
Links
- 238000009434 installation Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
Definitions
- the utility model relates to hardware technology, in particular to a mounting component. Background technique
- CPU Central Processing Unit
- a heat sink For a larger heat sink, it is usually fixed to the main board to ensure sufficient mounting strength.
- some computer motherboards also install hard drives, such as industrial computers.
- the size of the hard disk and the heat sink are very large. Therefore, in the case of installing the hard disk on the motherboard, the layout and structure of the hard disk and the heat sink are important issues to be considered, and it is necessary to reduce the occupation of the motherboard area and ensure the installation is firm. Good heat dissipation.
- the conventional way is to arrange the two separately and install them separately.
- the advantage of this method is that the structure is simple and the installation is convenient, but it is necessary to open a plurality of mounting holes on the motherboard, which not only reduces the strength of the motherboard, but also occupies a valuable motherboard area. At the same time, because both of them are large in size, it is easy to block each other's heat dissipation ducts and affect the heat dissipation effect.
- a method of stacking a hard disk and a heat sink for example, a method of stacking a hard disk and a CPU heat sink on the same side of the motherboard, including a chassis, a motherboard, and an expansion board having a front panel. , hard drive and heat sink.
- the main board is fixed on the lower part of the inner wall of the front panel.
- the heat sink and the hard disk are stacked from bottom to top and fixed together on the main board.
- the top surface of the hard disk is flush with the top surface of the front panel, and the expansion board is disposed above the main board and fixed on the inner wall of the front panel.
- this method has the following disadvantages: 1.
- the patent places the hard disk and the heat sink on the same side of the main board, and the heat sink is closely attached to the lower part of the hard disk.
- the heat radiated from the heat sink is directly radiated to the bottom of the hard disk, thereby causing the temperature of the hard disk to rise.
- the hard disk is located at the top of the heat sink, far from the motherboard, the hard disk socket can not be soldered on the motherboard, and only the additional expansion board can indirectly lead the hard disk interface signal to the motherboard, the signal path is long, and And through a plurality of sockets, affecting the signal quality;
- the hard disk needs to design an additional fixing frame;
- the expansion board needs to be fixed by the main board panel, and the motherboard panel needs to design an additional fixing device; 5.
- the overall structure is complicated, and the components are too More, affecting structural strength. Summary of the invention
- the embodiment of the present invention provides a mounting assembly, which can ensure the heat dissipation effect of the heat sink while ensuring the strength of the motherboard, and has a simple structure and a stable connection.
- the embodiment of the present invention provides a mounting assembly, the mounting assembly includes: a main board, a heat sink, and a hard disk; the heat sink and the hard disk are respectively mounted on two sides of the main board, and the heat sink is mounted on the main board and has a heat One side of the component.
- the four corner ends of the heat sink are provided with a heat sink fixing hole
- the four corner ends of the hard disk are provided with a hard disk fixing hole corresponding to the heat sink fixing hole.
- the size of the hard disk fixing hole and the spacing between the hard disk fixing holes correspond to the size of the heat sink fixing hole and the distance between the hard disk fixing holes.
- the main board is provided with a mounting fixing hole corresponding to the heat sink fixing hole and the hard disk fixing hole.
- the hard disk fixing hole is a screw hole.
- the heat sink and the hard disk are fixedly mounted on both sides of the main board by a heat sink fixing bolt and a hard disk fixing stud.
- the heat sink fixing bolt is composed of a screw and a bolt head located at the top of the screw, and the upper surface of the bolt head is provided with a cross groove.
- the hard disk fixing stud includes: a screw hole portion matched with the screw; a thread portion matching the hard disk fixing hole; wherein the screw hole portion and the thread portion are an integral structure.
- the installation component further includes a hard disk socket connected to the hard disk, the hard A disk socket is fixed to the main board.
- the heat sink and the hard disk share the mounting holes and the mounting bolts, thereby reducing the number of openings of the main board, thereby ensuring the strength of the main board.
- the utility model does not need an additional expansion board and a fixing bracket, and has a simple structure and a firm installation.
- FIG. 1 is a schematic view showing the structure of each part of the embodiment of the present invention when it is not assembled;
- FIG. 2 is a perspective view showing the structure of each part of the embodiment of the present invention after assembly;
- FIG. 3 is a side view of the structure of each part of the embodiment of the present invention.
- the embodiment of the present invention provides a mounting assembly.
- the mounting assembly includes: a main board 1, a heat sink 2, and a hard disk 3;
- the main board 1 includes various necessary components required for the electrical equipment corresponding to the mounting component, and the components include a large number of heating components, such as a CPU;
- the heat sink 2 is configured to assist heat dissipation of the heat generating component
- the hard disk 3 is configured to store data pre-stored by the electrical device.
- the heat sink 2 and the hard disk 3 are respectively disposed on two sides of the main board 1 , and the main board 1 is provided with four mounting fixing holes 4 through which the heat sink 2 and the hard disk 3 pass.
- the mounting holes 4 are correspondingly mounted on both sides of the main board 1.
- the heat sink 2 and the hard disk 3 share the mounting fixing holes 4 formed on the main board, so that the heat sink 2 and the hard disk 3 are reduced in occupation on the main board 1.
- the area saves space for the main board 1 and reduces the number of openings of the main board to ensure the strength of the main board.
- the heat sink 2 is mounted on the side of the main board 1 having the heat generating components, thereby improving the heat dissipation performance of the main board 1 and simultaneously dissipating heat.
- the device 2 is also capable of improving the heat dissipation performance of other heat generating components adjacent to the electrical equipment corresponding to the mounting assembly.
- the four corner ends of the heat sink 2 are provided with heat dissipation corresponding to the mounting fixing holes 4.
- the fixing holes 21 of the device, and the four corner ends of the hard disk 3 are also provided with a hard disk fixing hole 31 corresponding to the mounting fixing hole 4.
- the fixing hole 21 of the heat sink corresponds to the fixing hole 31 of the hard disk; the size of the fixing hole 31 of the hard disk and the spacing between the fixing holes of the hard disk correspond to the size of the fixing hole 21 of the heat sink and the distance between the fixing holes of the hard disk.
- the fastener is selected from the heat sink fixing bolt 5 and the hard disk fixing stud 6; correspondingly, the heat sink 2 and the hard disk 3 are installed by the heat sink fixing bolt 5 and the hard disk fixing stud 6
- the heat sink fixing bolt 5 is composed of a screw 51 and a bolt head 52 at the top of the screw.
- the upper surface of the bolt head is provided with a cross groove;
- the hard disk fixing stud 6 is The end is a screw hole portion 61, and the other end is a threaded portion 62 that is connected to the screw hole portion 61. As shown in FIG. 1 and FIG.
- the screw hole portion 61 of the hard disk fixing stud 6 is matched with the screw 51 of the heat sink fixing bolt 5; the threaded portion 62 of the hard disk fixing stud 6 is The hard disk fixing holes 31 are matched, and the hard disk fixing holes 31 are screw holes.
- the mounting component further includes a hard disk socket 7 connected to the hard disk, and the hard disk socket 7 is fixed on the main board 1.
- the specific installation process is as follows: First, solder the hard disk socket to the motherboard, and fix the hard disk to the stud 6
- the threaded portion 62 is screwed into the thread of the hard disk fixing hole, and the hard disk 3 to which the hard disk fixing stud 6 is screwed is inserted into the hard disk socket 7; at this time, the screw hole portion 61 of the hard disk fixing stud 6 is aligned with the main board.
- the heat sink fixing bolt 5 is sequentially passed through the heat sink fixing hole 21 and the mounting fixing hole 4, and then screwed. Insert into the screw hole portion of the hard disk fixing stud 6 to complete the mounting to obtain the mounting assembly as described in FIGS. 2 and 3.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型实施例公开了一种硬盘和散热器的组件,包括:主板、散热器和硬盘;其中,所述散热器和硬盘分别安装在主板的两面,所述散热器安装在所述主板的具有发热元器件的一面。
Description
一种安装组件 技术领域
本实用新型涉及硬件技术, 尤其涉及一种安装组件。 背景技术
在计算机的主板上, 通常需要为发热量较大的器件如中央处理器
( CPU, Central Processing Unit )配备散热器,对于体积较大的散热器来说, 为保证足够的安装强度, 一般要固定到主板上。 同时, 一些计算机主板上 还会安装硬盘, 如工业计算机。 硬盘和散热器的体积都很大, 因此在这种 主板上安装硬盘的情况下, 硬盘和散热器的布局与结构是需要重点考虑的 问题, 既需要减少占用主板面积, 又要保证安装牢固, 散热良好。
常规的方式是二者分开布置, 各自安装。 这种方式的优点是结构简单, 安装方便, 但需要在主板上开多个安装孔, 这不但降低了主板强度, 也占 用了宝贵的主板面积。 同时, 由于二者体积都很大, 很容易挡住彼此的散 热风道, 影响散热效果。
现有技术中, 还有釆用将硬盘和散热器叠放的方式, 例如: 将硬盘和 CPU散热器叠放, 置于主板同一面的方法, 包括设有前面板的机箱、 主板、 扩展板、 硬盘和散热器。 主板固定在前面板内壁下部, 散热器、 硬盘从下 至上叠放, 一起固定在主板上, 硬盘顶面与前面板顶面齐平, 扩展板设置 在主板上方并固定在前面板内壁上。 但这种方式存在以下不足: 一、 该专 利把硬盘和散热器放在主板的同一面, 散热器紧贴硬盘下部, 散热器散发 的热量会直接辐射到硬盘的底部, 从而导致硬盘温度升高, 影响硬盘工作; 二、 硬盘位于散热器的顶部, 距离主板较远, 硬盘插座无法焊接在主板上, 而只能通过额外的扩展板将硬盘接口信号间接引到主板, 信号路径长, 而
且经过多个插座, 影响信号质量; 三、 硬盘需要设计额外的固定架; 四、 扩展板需要借助主板面板来固定, 主板面板上需要设计额外的固定装置; 五、 整体结构复杂, 组成部分太多, 影响结构强度。 发明内容
为解决上述技术问题, 本实用新型实施例提供一种安装组件, 能在保 证主板强度的同时, 使散热器的散热效果良好, 且结构简单, 连接稳固。
本实用新型实施例的技术方案是这样实现的:
本实用新型实施例提供了一种安装组件, 所述安装组件包括: 主板、 散热器和硬盘; 所述散热器和硬盘分别安装在主板的两面, 所述散热器安 装在所述主板的具有发热元器件的一面。
上述方案中, 所述散热器的四个角端开设有散热器固定孔, 所述硬盘 的四个角端开设有与所述散热器固定孔相对应的硬盘固定孔。
上述方案中, 所述硬盘固定孔的尺寸、 硬盘固定孔之间的间距对应于 散热器固定孔的尺寸、 硬盘固定孔之间的距离相同。
上述方案中, 所述主板上开设有对应于所述散热器固定孔和硬盘固定 孔的安装固定孔。
上述方案中, 所述硬盘固定孔为螺孔。
上述方案中, 所述散热器和硬盘通过散热器固定螺栓和硬盘固定螺柱 相配合安装固定到所述主板的两面。
上述方案中, 所述散热器固定螺栓由螺杆和位于螺杆顶部的螺栓头组 成, 所述螺栓头的上表面设置有十字槽。
上述方案中, 所述硬盘固定螺柱包括: 与所述螺杆相匹配的螺孔部; 与所述硬盘固定孔相匹配的螺紋部; 其中, 所述螺孔部和螺紋部为一体结 构。
上述方案中, 所述安装组件还包括连接所述硬盘的硬盘插座, 所述硬
盘插座固定在所述主板上。
本实用新型的有益效果体现在以下方面:
1 )本实用新型实施例通过将散热器和硬盘分别安装在主板两面, 既能 减少占用的主板面积, 又能够保证较好的散热效果。
2 )本实用新型实施例散热器和硬盘共用安装孔和安装螺栓, 减少了主 板开孔数量, 从而保证了主板强度。
3 )本实用新型无需额外的扩展板和固定支架, 结构简单, 安装牢固。 附图说明
图 1是本实用新型实施例各部分结构未装配时的示意图;
图 2是本实用新型实施例各部分结构装配后的立体结构示意图; 图 3是本实用新型实施例各部分结构装配后的侧视图。
附图标记说明
1、 主板, 2、 散热器, 21、 散热器固定孔, 3、 硬盘, 31、 硬盘固定孔, 4、 安装固定孔, 5、 散热器固定螺栓, 51、 螺杆, 52、 螺栓头, 6、 硬盘固 定螺柱, 61、 螺孔部, 62、 螺紋部, 7、 硬盘插座。 具体实施方式
本实用新型实施例提供一种安装组件, 如图 1至图 3所示, 所述安装 组件包括: 主板 1、 散热器 2和硬盘 3 ; 其中,
所述主板 1,包含所述安装组件对应的电器设备工作所需的各种必要的 元器件, 这些元器件中包含有大量发热元器件, 如 CPU;
所述散热器 2, 用于协助发热元器件散热;
所述硬盘 3, 用于存储所述电器设备预存储的数据。
具体的, 如图 1所示, 所述散热器 2和硬盘 3分别设置在主板 1的两 面, 并且主板 1上开设有四个安装固定孔 4,散热器 2和硬盘 3通过所述安
装固定孔 4对应的安装在主板 1的两面, 如此, 所述散热器 2和硬盘 3共 用主板上开设的安装固定孔 4, 使得所述散热器 2和硬盘 3减少了在主板 1 上的占用面积, 为主板 1 节省了空间, 同时减少了主板的开孔数量, 保证 了主板强度; 所述散热器 2安装在主板 1的具有发热元器件的一面, 提高 了主板 1的散热性能, 同时散热器 2还能够提高与所述安装组件对应的电 器设备相邻的其他发热元器件的散热性能。
在一实施例中, 为了将散热器 2和硬盘 3仅通过四个安装固定孔 4安 装在主板 1上,相对应的,散热器 2的四个角端开设有对应于安装固定孔 4 的散热器固定孔 21, 硬盘 3的四个角端也开设有对应于安装固定孔 4的硬 盘固定孔 31。 所述散热器固定孔 21与硬盘固定孔 31相对应; 所述硬盘固 定孔 31的尺寸、 硬盘固定孔之间的间距对应于散热器固定孔 21 的尺寸、 硬盘固定孔之间的距离相同, 如此, 在安装时, 能够通过相适配的紧固件 依次穿过散热器固定孔 21、 安装固定孔 4、 硬盘固定孔 31将散热器 2和硬 盘 3牢固地固定到主板的两面。
在一实施例中, 所述紧固件选用散热器固定螺栓 5和硬盘固定螺柱 6; 对应地, 所述散热器 2和硬盘 3通过散热器固定螺栓 5和硬盘固定螺柱 6 相配合安装固定到所述主板的两面; 其中, 所述散热器固定螺栓 5 由螺杆 51和位于螺杆顶部的螺栓头 52组成, 所述螺栓头的上表面设置有十字槽; 所述硬盘固定螺柱 6—端为螺孔部 61,另一端为与螺孔部 61—体连接的螺 紋部 62。 为了安装牢固, 如图 1、 2所示, 所述硬盘固定螺柱 6的螺孔部 61与所述散热器固定螺栓 5的螺杆 51相匹配; 硬盘固定螺柱 6的螺紋部 62与所述硬盘固定孔 31相匹配, 所述硬盘固定孔 31为螺孔。
在一实施例中, 所述安装组件还包括连接所述硬盘的硬盘插座 7, 所述 硬盘插座 7固定在所述主板 1上。
具体安装过程如下: 首先将硬盘插座焊接在主板上, 将硬盘固定螺柱 6
的螺紋部 62拧入所述硬盘固定孔的螺紋中, 将拧有硬盘固定螺柱 6的硬盘 3插装在硬盘插座 7中; 此时将硬盘固定螺柱 6的螺孔部 61对准主板 1的 安装固定孔 4, 同时散热器 2的散热器固定孔 21也对准主板 1的安装固定 孔 4之后, 将散热器固定螺栓 5依次穿过散热器固定孔 21、 安装固定孔 4 后拧入硬盘固定螺柱 6的螺孔部中, 完成安装得到如图 2和图 3所述的安 装组件。
尽管上述对本实用新型做了详细说明, 但本实用新型不限于此, 本技 术领域的技术人员可以根据本实用新型的原理进行修改, 因此, 凡按照本 实用新型的原理进行的各种修改都应当理解为落入本实用新型的保护范 围。
以上所述, 仅为本实用新型的较佳实施例而已, 并非用于限定本实用 新型的保护范围。
Claims
1、 一种安装组件, 包括: 主板、 散热器和硬盘; 所述散热器和硬盘分 别安装在主板的两面, 所述散热器安装在所述主板的具有发热元器件的一 面。
2、 根据权利要求 1所述的安装组件, 其中, 所述散热器的四个角端开 设有散热器固定孔, 所述硬盘的四个角端开设有与所述散热器固定孔相对 应的硬盘固定孔。
3、 根据权利要求 2所述的安装组件, 其中, 所述硬盘固定孔的尺寸、 硬盘固定孔之间的间距对应于散热器固定孔的尺寸、 硬盘固定孔之间的距 离相同。
4、 根据权利要求 3所述的安装组件, 其中, 所述主板上开设有对应于 所述散热器固定孔和硬盘固定孔的安装固定孔。
5、 根据权利要求 2至 4任一项所述的安装组件, 其中, 所述硬盘固定 孔为螺孔。
6、 根据权利要求 5所述的安装组件, 其中, 所述散热器和硬盘通过散 热器固定螺栓和硬盘固定螺柱相配合安装固定到所述主板的两面。
7、 根据权利要求 6所述的安装组件, 其中, 所述散热器固定螺栓由螺 杆和位于螺杆顶部的螺栓头组成, 所述螺栓头的上表面设置有十字槽。
8、 根据权利要求 7所述的安装组件, 其中, 所述硬盘固定螺柱包括: 与所述螺杆相匹配的螺孔部;
与所述硬盘固定孔相匹配的螺紋部;
其中, 所述螺孔部和螺紋部为一体结构。
9、 根据权利要求 8所述的安装组件, 其中, 所述安装组件还包括连接 所述硬盘的硬盘插座, 所述硬盘插座固定在所述主板上。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14801804.7A EP3001277B1 (en) | 2013-05-21 | 2014-05-19 | Mounting assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320277680.2U CN203422701U (zh) | 2013-05-21 | 2013-05-21 | 一种硬盘和散热器的组件 |
CN201320277680.2 | 2013-05-21 |
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Citations (6)
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CN1609752A (zh) * | 2004-08-23 | 2005-04-27 | 许东升 | 计算机主机整体散热方案 |
CN201007917Y (zh) * | 2007-02-07 | 2008-01-16 | 大连光洋科技工程有限公司 | 一种减震主板 |
US7386796B1 (en) * | 2002-08-12 | 2008-06-10 | Newisys Inc. | Method and equipment adapted for monitoring system components of a data processing system |
CN201392495Y (zh) * | 2009-03-06 | 2010-01-27 | 研祥智能科技股份有限公司 | 一种CompactPCI工业计算机 |
CN202008591U (zh) * | 2011-02-23 | 2011-10-12 | 北京航天测控技术有限公司 | 一种无线缆紧凑强固式嵌入式系统控制器 |
CN203422701U (zh) * | 2013-05-21 | 2014-02-05 | 中兴通讯股份有限公司 | 一种硬盘和散热器的组件 |
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US6389499B1 (en) * | 1999-06-09 | 2002-05-14 | Western Digital Ventures, Inc. | Integrated computer module |
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2014
- 2014-05-19 EP EP14801804.7A patent/EP3001277B1/en active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US7386796B1 (en) * | 2002-08-12 | 2008-06-10 | Newisys Inc. | Method and equipment adapted for monitoring system components of a data processing system |
CN1609752A (zh) * | 2004-08-23 | 2005-04-27 | 许东升 | 计算机主机整体散热方案 |
CN201007917Y (zh) * | 2007-02-07 | 2008-01-16 | 大连光洋科技工程有限公司 | 一种减震主板 |
CN201392495Y (zh) * | 2009-03-06 | 2010-01-27 | 研祥智能科技股份有限公司 | 一种CompactPCI工业计算机 |
CN202008591U (zh) * | 2011-02-23 | 2011-10-12 | 北京航天测控技术有限公司 | 一种无线缆紧凑强固式嵌入式系统控制器 |
CN203422701U (zh) * | 2013-05-21 | 2014-02-05 | 中兴通讯股份有限公司 | 一种硬盘和散热器的组件 |
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EP3001277A1 (en) | 2016-03-30 |
EP3001277A4 (en) | 2016-07-20 |
CN203422701U (zh) | 2014-02-05 |
EP3001277B1 (en) | 2019-04-24 |
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