WO2013067876A1 - 一种cpu散热装置 - Google Patents

一种cpu散热装置 Download PDF

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Publication number
WO2013067876A1
WO2013067876A1 PCT/CN2012/082870 CN2012082870W WO2013067876A1 WO 2013067876 A1 WO2013067876 A1 WO 2013067876A1 CN 2012082870 W CN2012082870 W CN 2012082870W WO 2013067876 A1 WO2013067876 A1 WO 2013067876A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
cpu
heat dissipation
dissipation device
cpu heat
Prior art date
Application number
PCT/CN2012/082870
Other languages
English (en)
French (fr)
Inventor
仲志
Original Assignee
Zhong Zhi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhong Zhi filed Critical Zhong Zhi
Publication of WO2013067876A1 publication Critical patent/WO2013067876A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink, and more particularly to a heat sink for a CPU in a computer case. Background technique
  • the increase in CPU performance leads to an increase in heat generation.
  • the heat sink is only fixed to the main board through the clip on the base, and the weight of the CPU heat sink completely falls on the main board.
  • the motherboard is installed in the mainstream vertical chassis, the main part of the heat sink has no bearing focus in the direction of gravity, and is horizontally suspended. Because the load capacity of the main board is relatively poor, the heavier heat sink often causes the main board to Twisted, deformed, easily lead to computer failure, if the weight of the radiator is too large, it will even directly cause damage to the motherboard.
  • the present invention is to solve the above-mentioned deficiencies in the prior art, and proposes a CPU heat dissipating device which is simple in structure, ingeniously designed, and capable of achieving weight bearing of a heavy radiator and obtaining better heat dissipation performance.
  • the technical solution of the present invention is: a CPU heat sink comprising a heat sink 2 and a base 1 in contact with the CPU, characterized in that: further comprising a longitudinal fastener 3 perpendicular to the ground, the CPU heat sink passing The longitudinal fastener 3 is coupled to the upper portion of the chassis 4.
  • the invention has the following advantages:
  • the CPU heat sink of this type of structure has a simple structure, ingenious design and reasonable layout. It fully considers the defects of the prior art, and the problem that the heat sink has a large weight causes distortion of the main board, and is designed to pass through the ground perpendicular to the ground.
  • the CPU heat sink has a simple manufacturing process, low manufacturing cost, and various advantages, and is particularly suitable for popularization and application in the computer heat sink industry.
  • Figure 1 is a side cross-sectional view showing an embodiment of the present invention.
  • Figure 2 is a plan view of an embodiment of the present invention.
  • a CPU heat sink comprises a base 1 in contact with a CPU, the base 1 is connected to the main board 6 via a clip 5, and is in contact with the CPU; the heat pipe 7 is worn in the base 1, and the upper end of the heat pipe 7 is connected with the heat sink 2, the above-mentioned base 1, heat pipe 7 and heat sink 2 together constitute the basic structure of the heat sink, and a heat sink frame 8 is arranged outside the heat sink 2, which can form the heat sink 2 to form an integral structure, which is convenient for bearing.
  • a matching hole 9 is formed in the heat sink 2 and the heat sink frame 8, and a long screw (ie, a form of the longitudinal fastener 3) is worn in the hole 9, and a nut 10 is provided at a lower end of the long screw.
  • the upper end is inserted into the long hole 11 opened in the upper end surface of the chassis 4, and the long screw can be adjusted in the long hole 11 according to the specific position of the heat sink to adapt to the position of the CPU interface socket of different main boards in the horizontal direction.
  • the nut can be adjusted to the fixed height of the long screw as needed to accommodate the vertical position of the CPU interface sockets of different motherboards. This allows the structure to be well compatible with motherboards with different CPU interface socket locations.
  • the CPU heat sink When the heat sink is installed in the chassis, the CPU heat sink is fixedly connected to the chassis in a vertical direction, and the gravity action direction of the main body portion of the heat sink is on the same straight line as the anchorage, and the heat sink is fixed firmly and reasonably.
  • the chassis is subject to a larger heat sink weight.
  • the longitudinal fastener 3 of the present invention is not limited to screws, bolts, etc., but may be other structures that can be longitudinally fixed, such as a clamped fixed load-bearing rod.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开一种 CPU散热装置，包括散热片（2）和与 CPU相接触的底座（1），其特征在于：还包括垂直于地面的纵向紧固件（3），所述的 CPU散热装置通过纵向紧固件（3）与机箱（4）的上部相连接。这是一种结构简单，设计巧妙，能够实现重量较大散热器的承重、以获得更好的散热性能的 CPU散热装置，解决了主板对 CPU散热器承重能力较差的问题。

Description

一种 CPU散热装置 技术领域
本发明涉及一种散热装置， 特别是一种用于电脑机箱中 CPU的散热装置。 背景技术
CPU性能的提高， 导致发热量增大， 为了保障 CPU 的正常工作， 人们在 CPU上加装散热器， 并不断地提高 CPU散热器的散热性能。 按照当前的风冷散 热器的制造工艺， 提高散热性能， 就需要相应地增加散热器的重量。 而按照传 统的散热器固定方式， 散热器只是通过底座上的扣具固定在主板上， CPU散热 器的重量完全落在主板上。 当主板安装至主流的立式机箱中时， 散热器的主体 部分在重力方向上无承重点， 呈水平悬空状态， 由于主板的载重能力相对较差， 因此较重的散热器往往会造成主板的扭曲、 变形， 容易导致电脑的故障， 如果 散热器重量太大， 甚至会直接导致主板损坏。
上述情况限制了人们为了追求高散热性能而设计和使用重量较大的散热 器， 从而限制了 CPU性能的发挥和提高， 制约了电脑的整体性能提升。 因此现 在需要一种能够解决上述问题的新型 CPU散热装置。
发明内容
本发明是为了解决现有技术所存在的上述不足， 提出一种结构简单， 设计 巧妙， 能够实现重量较大散热器的承重， 以获得更好的散热性能的 CPU散热装 置。
本发明的技术解决方案是：一种 CPU散热装置，包括散热片 2和与 CPU相 接触的底座 1， 其特征在于： 还包括垂直于地面的纵向紧固件 3， 所述的 CPU 散热装置通过纵向紧固件 3与机箱 4的上部相连接。
本发明同现有技术相比， 具有如下优点：
本种结构形式的 CPU散热装置， 其结构简单， 设计巧妙， 布局合理， 它充 分考虑了现有技术的缺陷， 针对散热器重量较大时会造成主板扭曲变形的问题， 设计出通过垂直于地面的纵向紧固件与机箱壳体相连接的散热装置。 当该散热 装置安装到机箱中时， CPU散热器在垂直方向上与机箱连接固定在一起， 散热 器主体部分的重力作用方向与其承重点处于同一条直线上， 散热器固定得结实、 合理， 便于机箱承受更大的散热器重量。 这样机箱就较多地承担了散热器的重 量， 而主板则很少地承担散热器的重量， 因此保证了主板不会发生扭曲变形。 这种结构， 解决了长期以来散热器受到重量的限制而无法充分提高性能的困局， 为高性能、 大重量的 CPU散热装置产品的研发与使用提供了有力的技术支持。
这种 CPU散热装置的制作工艺简单， 制造成本低廉， 具备多种优点， 特别 适合于在电脑散热装置行业中推广应用。
附图说明
图 1是本发明实施例的侧剖视图。
图 2是本发明实施例的俯视图。
具体实施方式
下面将结合附图说明本发明的具体实施方式。 如图 1、 图 2所示，
具体实施例：
一种 CPU散热装置， 包括与 CPU相接触的底座 1， 底座 1通过扣具 5连接 在主板 6上， 并与 CPU相接触； 在底座 1内穿有热管 7， 热管 7的上端则与散 热片 2相连，上述的底座 1、热管 7和散热片 2共同组成了本散热器的基本结构， 在散热片 2外设置有散热片框架 8， 它可以让散热片 2形成一个整体结构， 便于 承重， 在散热片 2和散热片框架 8上均开设有相配的孔 9， 在孔 9内穿有长螺丝 (即纵向紧固件 3的一种形式）， 长螺丝的下端配有螺母 10， 长螺丝的上端插接 在开设于机箱 4上端面的长孔 11内， 长螺丝可以根据散热器的具体位置在长孔 11内做一定范围的调整， 以适应不同主板的 CPU接口插座位置在水平方向上的 变化。 螺母可根据需要调整其在长螺丝上的固定高度， 以适应不同主板的 CPU 接口插座位置在垂直方向上的变化。 这样就使得该结构对不同 CPU接口插座位 置的主板都能良好地兼容。
当该散热装置安装到机箱中时， CPU散热器在垂直方向上与机箱连接固定 在一起， 散热器主体部分的重力作用方向与其承重点处于同一条直线上， 散热 器固定得结实、 合理， 便于机箱承受更大的散热器重量。
本发明所述的纵向紧固件 3 不仅仅限于螺丝、 螺栓等， 还可以是其他可以 实现纵向连接固定的结构， 例如夹紧固定的承重杆等。
以上所述， 仅为本发明较佳的具体实施方式， 但本发明的保护范围并不局 限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 根据本 发明的技术方案及其发明构思加以等同替换或改变， 都应涵盖在本发明的保护 范围之内。

Claims

要 求 书
1、 一种 CPU散热装置， 包括散热片（2)和与 CPU相接触的底座（1)， 其 特征在于： 还包括垂直于地面的纵向紧固件 （3)， 所述的 CPU散热装置通过纵 向紧固件 （3) 与机箱 （4) 的上部相连接。
PCT/CN2012/082870 2011-11-07 2012-10-12 一种cpu散热装置 WO2013067876A1 (zh)

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CN201120435152.6 2011-11-07

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202331329U (zh) * 2011-11-07 2012-07-11 仲志 一种cpu散热装置
CN104914948A (zh) * 2015-05-25 2015-09-16 铜陵宏正网络科技有限公司 一种具有顶部悬挂结构的cpu散热器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2616732Y (zh) * 2002-12-13 2004-05-19 联想(北京)有限公司 集成式并路热管散热器
CN101290537A (zh) * 2008-06-12 2008-10-22 上海爱瑞科技发展有限公司 一种工控机的大面积cpu储热散热结构
CN201607676U (zh) * 2010-04-16 2010-10-13 山东高效能服务器和存储研究院 一种cpu散热器的固定装置
CN202331329U (zh) * 2011-11-07 2012-07-11 仲志 一种cpu散热装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2616732Y (zh) * 2002-12-13 2004-05-19 联想(北京)有限公司 集成式并路热管散热器
CN101290537A (zh) * 2008-06-12 2008-10-22 上海爱瑞科技发展有限公司 一种工控机的大面积cpu储热散热结构
CN201607676U (zh) * 2010-04-16 2010-10-13 山东高效能服务器和存储研究院 一种cpu散热器的固定装置
CN202331329U (zh) * 2011-11-07 2012-07-11 仲志 一种cpu散热装置

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