WO2014187016A1 - 显示器基板质量检测装置及检测方法 - Google Patents

显示器基板质量检测装置及检测方法 Download PDF

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Publication number
WO2014187016A1
WO2014187016A1 PCT/CN2013/078346 CN2013078346W WO2014187016A1 WO 2014187016 A1 WO2014187016 A1 WO 2014187016A1 CN 2013078346 W CN2013078346 W CN 2013078346W WO 2014187016 A1 WO2014187016 A1 WO 2014187016A1
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Prior art keywords
substrate
ultrasonic
receiver
transmitter
positioning device
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French (fr)
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李良
任伯阳
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/123,226 priority Critical patent/US20140345383A1/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/041Analysing solids on the surface of the material, e.g. using Lamb, Rayleigh or shear waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/26Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/265Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/023Solids
    • G01N2291/0231Composite or layered materials

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  • the present invention relates to a substrate production technology, and more particularly to a display substrate quality detecting device and a detecting method.
  • the fragment is mainly found by the photoelectric type detection method or the image type detection method.
  • the photoelectric type is detected by the light emitting device to emit light to the substrate to be detected, and then the light reflected from the substrate is received by the light sensor, and the intensity change of the reflected light is detected to determine whether the substrate is cracked.
  • a detection method is affected by the process of the substrate, and the process area of the substrate cannot receive the reflected light well, so that it is impossible to detect whether there is crack in the process area.
  • the image type detection method irradiates the substrate through the backlight, and then receives the real-time image of the substrate through the CCD lens, and compares the gray value of the real-time image with the gray value of the normal substrate image to determine whether there is a fragment. Since the above comparison cannot be performed in the process area, this detection method cannot detect whether there is crack in the process area.
  • the existing detection methods cannot detect the process area of the substrate, resulting in low reliability of detection, and it is impossible to completely detect the broken substrate.
  • An object of the present invention is to provide a display substrate quality detecting device and a detecting method to solve the above defects, in view of the fact that the conventional substrate detecting method cannot effectively detect the processing area of the substrate and cannot completely detect the broken substrate. .
  • the solution to the above problem is to construct a display substrate quality detecting device for detecting the quality of the substrate of the display.
  • the substrate includes a front surface of the substrate opposite to the back surface of the substrate opposite to the front surface of the substrate, and a processing area of the semiconductor array is disposed on the front surface of the substrate.
  • the process area is provided with a non-process area
  • the display substrate quality detecting device comprises an ultrasonic transmitter and an ultrasonic receiver disposed on the back surface of the substrate, the ultrasonic transmitter emitting ultrasonic waves for detecting the quality of the substrate to the back of the substrate; and the ultrasonic receiver receiving the reflection from the substrate
  • the ultrasonic; the display substrate quality detecting device further includes an ultrasonic analyzer connected to the ultrasonic receiver for analyzing the received ultrasonic wave to determine whether the substrate is broken.
  • the emission angle of the ultrasonic transmitter is equal to the receiving angle of the ultrasonic receiver
  • the display substrate quality detecting device further comprises a transmitter positioning device, the ultrasonic transmitter is mounted on the transmitter positioning device, and the transmitter positioning device drives the ultrasonic transmitter to rotate or translate.
  • the display substrate quality detecting device further comprises a receiver positioning device, and the ultrasonic receiver is mounted on the receiver positioning device, and the receiver positioning device drives the ultrasonic receiver to rotate or translate, so that the ultrasonic transmitter is predetermined
  • the emission angle emits ultrasonic waves toward the back side of the substrate.
  • the display substrate quality detecting device of the present invention further comprises a production line for driving the horizontal movement of the substrate, wherein the plurality of ultrasonic receivers are arranged in a row in a direction perpendicular to a direction in which the substrate moves the substrate, and the plurality of ultrasonic receivers are arranged.
  • the length of one column is matched to the width of the substrate.
  • the invention also relates to a method for detecting quality of a display substrate, comprising the following steps:
  • a process area and a non-process area are disposed on a front surface of the substrate, and an ultrasonic transmitter and an ultrasonic receiver are disposed on the back surface of the substrate, and the ultrasonic transmitter emits ultrasonic waves for detecting the quality of the substrate to the back surface of the substrate;
  • the ultrasonic receiver receives ultrasonic waves reflected from the substrate
  • An ultrasonic analyzer connected to the ultrasonic receiver analyzes the received ultrasonic waves to determine whether or not the substrate is broken.
  • the method for detecting quality of a display substrate of the present invention further comprises the following steps:
  • the emission angle of the ultrasonic transmitter is set to be equal to the reception angle of the ultrasonic receiver.
  • the method for detecting quality of a display substrate of the present invention further comprises the following steps:
  • the ultrasonic transmitter is mounted on the transmitter positioning device, and the transmitter positioning device drives the ultrasonic transmitter to rotate to a predetermined emission angle or to a predetermined emission position, and then the ultrasonic transmitter emits ultrasonic waves toward the back surface of the substrate at a predetermined emission angle. .
  • the method for detecting quality of a display substrate of the present invention further comprises the following steps:
  • the method for detecting quality of a display substrate of the present invention further comprises the following steps:
  • the horizontal movement of the substrate is driven by the production line
  • the plurality of ultrasonic receivers are arranged in a line in a direction perpendicular to the direction in which the substrate moves the substrate to receive the ultrasonic waves, and the lengths of the columns arranged by the plurality of ultrasonic receivers match the width of the substrate.
  • the fragment detection can be performed on any position of the substrate, the comprehensive blocking of the damaged substrate can be realized, the damage of the damaged substrate to the production line and the product can be prevented, and the clue basis for the finding of the fragmentation can be provided, and the maintenance of the production line can be conveniently performed. repair.
  • Figure 1 is a plan view of a substrate tested by the present invention
  • Figure 2 is a side view of the substrate detected by the present invention.
  • FIG. 3 is a schematic structural view of a display substrate quality detecting device of the present invention.
  • Figure 4 is a schematic structural view of an ultrasonic transmitter
  • Figure 5 is a schematic structural view of an ultrasonic receiver
  • Figure 6 is a schematic view showing the structure of a single row of ultrasonic receivers.
  • the substrate 100 as shown in FIGS. 1 and 2, for example, in a TFT-LCD.
  • the front side of the substrate 100 includes a process area 110 and a non-process area 120.
  • the process area 110 is an area in which a semiconductor array is disposed
  • the non-process area 120 is an area in which no circuit pattern is printed
  • the non-process area 120 surrounds the process area 110. Since the process area 110 has a semiconductor array, the optical type substrate detection technology cannot perform effective detection in the process area 110. For example, the photoelectric type detection method and the image type detection method cannot be effectively operated.
  • the back surface opposite to the front surface on which the process area 110 and the non-process area 120 are formed does not need to be provided with a circuit, which is generally smooth and flat, and the ultrasonic direction can be directional on a smooth and flat plane. Good reflection. Therefore, the present invention utilizes the feature that the back surface of the substrate 100 has flatness, and realizes the comprehensive substrate fragment detection by utilizing the directivity of the ultrasonic waves.
  • the specific detection device is shown in Figure 3.
  • an ultrasonic reflector 200 and an ultrasonic receiver 300 are disposed on the back surface of the substrate.
  • the ultrasonic transmitter 200 emits ultrasonic waves toward the substrate 100 in a manner inclined to the plane of the substrate, and the ultrasonic waves are reflected by the substrate 100 and then received by the ultrasonic receiver 300.
  • the ultrasonic receiver The converted ultrasonic wave is converted into an electrical signal and sent to an ultrasonic analyzer 400 connected thereto for analysis comparison.
  • the reflection state of the ultrasonic wave at the rupture will be different from that of the general flat area, and the ultrasonic analyzer 400 will detect the abrupt signal peak, thereby detecting the damage of the substrate 100.
  • the incident angle of the ultrasonic transmitter 200 is set equal to the reception angle of the ultrasonic receiver 300, so that the quality of the display substrate can be accurately reflected.
  • the incident angle of the ultrasonic transmitter 200 refers to the angle between the emission direction of the ultrasonic transmitter 200 and the normal direction of the plane of the display substrate;
  • the reception angle of the ultrasonic receiver 300 refers to the receiving direction of the ultrasonic receiver 300. The angle with the normal direction of the plane of the display substrate.
  • the ultrasonic transmitter 200 and the ultrasonic receiver 300 are mounted on a positioning device, and the ultrasonic transmitter 200 is mounted on the transmitter positioning device 201 so that the ultrasonic transmitter 200 can rotate around the transmitter positioning device 201.
  • the ultrasonic receiver 300 is mounted on the receiver positioning device 301, the ultrasonic receiver 300 is rotatable about the receiver positioning device 301, and can be positioned along the receiver Device 301 translates.
  • the ultrasonic transmitter 200 transmits ultrasonic waves to the substrate 100 at different angles
  • the ultrasonic receiver 300 is translated to a corresponding position and rotated to a suitable receiving angle to receive ultrasonic waves.
  • the position of the two positioning devices 201/301 the range of ultrasonic detection on the substrate 100 is determined, and the position of the damage on the substrate 100 is determined.
  • the ultrasonic transmitter 200 and the ultrasonic receiver 300 can also be detected at a fixed angle, in which case the ultrasonic transmitter 200 and the ultrasonic receiver 300 cooperatively translate, through the specific positions to which the ultrasonic transmitter 200 and the ultrasonic receiver 300 are moved, It is determined that the range of ultrasonic inspection on the substrate 100 is determined, and the position of the damage on the substrate 100 is determined.
  • the ultrasonic receiver 300 employs a single row of ultrasonic receivers. That is, multiple receiver probes are arranged in a row while receiving the transmitted ultrasonic waves.
  • the substrate 100 moves along the arrow direction in FIG. 6 on the production line, and the ultrasonic receiver 300 adopts a single-row arrangement ultrasonic receiver that matches the width of the substrate 100 (ie, perpendicular to the substrate moving direction) when the substrate moves.
  • the ultrasonic receiver 300 is capable of detecting the damage condition of the substrate 100 in its entire width direction at one time. The detection efficiency is higher.

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Abstract

一种显示器基板(100)质量检测装置及检测方法,用于检测基板(100)中是否存在破裂。检测装置包括设置在与制程区(110)相背一侧的超声波发射器(200)、超声波接收器(300)和与超声波接收器(300)连接的超声波分析器(400)。超声波发射器(200)向基板(100)发射用于检测的超声波,超声波接收器(300)接收从基板(100)反射的超声波,超声波接收器(300)连接的超声波分析器(400)对接收的超声波进行分析以判断出基板(100)是否存在破裂。检测装置能够对基板(100)包括制程区(110)和非制程区(120)的任意位置进行破片检测,能够实现对破损的基板(100)的全面拦捡,防止破损的基板(100)对生产线和产品的损伤,并为破片原因的查找提供线索依据,方便对生产线进行维护修理。

Description

显示器基板质量检测装置及检测方法 技术领域
本发明涉及基板生产技术,更具体地说,涉及一种显示器基板质量检测装置及检测方法。
背景技术
    在TFT-LCD等类型的基板生产过程中,需要对基板的生产质量进行检测,以发现基板中有无出现破片的状况。在现有的生产技术中,主要通过光电型的检测方式或者图像型的检测方式来发现破片。
    光电型的检测方式是通过光线发射装置向待检测的基板发射光线,再通过光线传感器接收从基板反射的光线,通过检测反射光线的强度变化,作为判断基板是否存在破裂。但是这样的检测方式会受到基板的制程影响,基板的制程区无法很好的接收到反射的光线,因此无法检测到制程区是否存在破裂。
    而图像型的检测方式则通过背光源照射基板,再通过CCD镜头接收基板的实时图像,通过比较实时图像的灰度值与正常基板图像的灰度值,来确定是否存在破片。由于在有制程区域无法进行上述的比较,因此这种检测方式也无法检测到制程区是否存在破裂。
现有的检测方式都无法检测到基板的制程区,导致检测的可靠性较低,无法完全检测出有破裂的基板。
发明内容
    本发明的目的在于,针对现有的基板检测方式无法对基板的制程区进行有效的检测,无法完全检测出有破裂的基板的问题,提供一种显示器基板质量检测装置及检测方法以解决上述缺陷。
    本发明解决上述问题的方案是,构造一种显示器基板质量检测装置,用于检测显示器的基板质量,基板包括基板正面与位于基板正面相对的基板背面,基板正面设有半导体阵列的制程区,围绕制程区设置有非制程区,显示器基板质量检测装置包括设置在基板背面的超声波发射器和超声波接收器,超声波发射器向基板背面发射用于检测基板质量的超声波;超声波接收器接收从基板反射的超声波;显示器基板质量检测装置还包括与超声波接收器连接的超声波分析器,用于对接收的超声波进行分析以判断出基板是否出现破裂。
    本发明的显示器基板质量监测装置,超声波发射器的发射角与超声波接收器的接收角相等
    本发明的显示器基板质量检测装置,显示器基板质量检测装置还包括发射器定位装置,超声波发射器安装在发射器定位装置上,发射器定位装置带动超声波发射器旋转或平移。
    本发明的显示器基板质量检测装置,显示器基板质量检测装置还包括接收器定位装置,超声波接收器安装在接收器定位装置上,接收器定位装置带动超声波接收器旋转或平移,使超声波发射器以预定的发射角度向基板背面发射超声波。
    本发明的显示器基板质量检测装置,,还包括用于带动基板水平运动的生产线,多个超声波接收器沿与生产线带动基板运动的方向相互垂直的方向排成一列,且多个超声波接收器所排成的一列的长度与基板的宽度相匹配。
    本发明还涉及一种显示器基板质量检测方法,包括以下步骤:
    在基板正面设置制程区和非制程区,在基板背面设置超声波发射器和超声波接收器,超声波发射器向基板背面发射用于检测基板质量的超声波;
    超声波接收器接收从基板反射的超声波;
    与超声波接收器连接的超声波分析器对接收的超声波进行分析以判断出基板是否出现破裂。
    本发明的显示器基板质量检测方法,还包括以下步骤:
    设置所述超声波发射器的发射角与所述超声波接收器的接收角相等。
        本发明的显示器基板质量检测方法,还包括以下步骤:
    将超声波发射器安装在发射器定位装置上,由发射器定位装置带动超声波发射器旋转到预定的发射角度或平移到预定的发射位置,然后由超声波发射器以预定的发射角度向基板背面发射超声波。
    本发明的显示器基板质量检测方法,还包括以下步骤:
    将超声波接收器安装在接收器定位装置上,由接收器定位装置带动所述超声波接收器旋转或平移
    本发明的显示器基板质量检测方法,还包括以下步骤:
    由生产线带动基板水平运动;
    将多个超声波接收器沿与生产线带动基板运动的方向相互垂直的方向排成一列以接收超声波,且多个超声波接收器所排成的一列的长度与基板的宽度相匹配。
实施本发明,能够对基板的任意位置进行破片检测,能够实现对破损基板的全面拦捡,防止破损的基板对生产线和产品的损伤,并为破片原因的查找提供线索依据,方便对生产线进行维护修理。
附图说明
   以下结合附图对本发明进行说明,其中:
   图1为本发明检测的基板的俯视图;
   图2为本发明检测的基板的侧视图;
   图3为本发明显示器基板质量检测装置的结构示意图;
   图4为超声波发射器的结构示意图;
   图5为超声波接收器的结构示意图;
图6为单列排布的超声波接收器的结构示意图。
具体实施方式
    以下结合附图和具体实施方式对本发明进行对本发明进行详细说明。
    在本发明中需要检测的是如图1和图2所示的基板100,例如在TFT-LCD 中使用的玻璃基板等。基板100的正面包括制程区110和非制程区120,制程区110为设置有半导体阵列的区域,非制程区120为没有印刷有电路图案的区域,非制程区120围绕制程区110。由于制程区110具有半导体阵列,光学型的基板检测技术无法在制程区110进行有效的检测,例如光电型的检测方式和图像型的检测方式都无法有效进行工作。
    然而,在一般的显示器基板中,与形成有制程区110和非制程区120的正面相对的背面并不需要设置电路,通常是光滑平整的,而在光滑平整的平面上超声波能够发生方向性较好的反射。因此,本发明利用基板100的背面具有平整性的特点,利用超声波的方向性实现全面型的基板破片检测。具体的检测装置如图3所示。
    在基板的背面,设置有超声波反射器200和超声波接收器300,超声波发射器200以倾斜于基板平面的方式向基板100发射超声波,超声波被基板100反射后由超声波接收器300接收,超声波接收器300将接收到的超声波转换为电信号,并发送到与之相连接的一个超声波分析器400进行分析比对。当出现基板破裂状况的时候,超声波在破裂处的反射状况将与一般的平整区域的反射状况相异,则超声波分析器400将会检测到突变的信号峰,从而发现基板100的破损情况。
    由于超声波在光滑平整的面上具有镜面反射的特性,超声波发射器200的入射角与超声波接收器300的接收角设置为相等,这样就能够准确反映出显示器基板的质量。在本发明中,超声波发射器200的入射角是指超声波发射器200的发射方向与显示器基板所在平面的法线方向的夹角;超声波接收器300的接收角是指超声波接收器300的接收方向与显示器基板所在平面的法线方向的夹角。
    为了实现对破损处的定位,超声波发射器200和超声波接收器300安装在定位装置上,超声波发射器200安装在发射器定位装置201上,使得超声波发射器200能够绕着发射器定位装置201旋转,以实现采用不同角度向基板100发射超声波;另一方面,超声波接收器300安装在接收器定位装置301上,超声波接收器300能够绕着接收器定位装置301旋转,且能够沿着接收器定位装置301进行平移。当超声波发射器200以不同的角度向基板100发射超声波时,超声波接收器300平移到对应的位置上,并旋转到合适的接收角度,接收超声波。通过两个定位装置201/301的位置,确定出在基板100上进行超声波检测的范围,进而确定基板100上的破损所在的位置。
    超声波发射器200和超声波接收器300还可以采用固定的角度进行探测,此时超声波发射器200和超声波接收器300协同平移,通过超声波发射器200和超声波接收器300所移动到的具体位置,能够确定确定出在基板100上进行超声波检测的范围,进而确定基板100上的破损所在的位置。
    在本发明的另一则实施例中,超声波接收器300采用单列排布式的超声波接收器。即多个接收器探头排列成行,同时接受发射的超声波。基板100在生产线上沿着图6中的箭头方向运动,超声波接收器300采用与基板100的宽度(即垂直于基板运动方向)相匹配的单列排布式的超声波接收器,当基板运动的时候,超声波接收器300能够一次检测基板100在其整个宽度方向上的受损状况。检测的效率较高。
以上仅为本发明具体实施方式,不能以此来限定本发明的范围,本技术领域内的一般技术人员根据本创作所作的均等变化,以及本领域内技术人员熟知的改变,都应仍属本发明涵盖的范围。

Claims (10)

  1.     一种显示器基板质量检测装置,用于检测显示器的基板质量,所述基板包括基板正面与位于所述基板正面相对的基板背面,所述基板正面设置有半导体阵列的制程区,围绕所述制程区设置有非制程区,其中,所述显示器基板质量检测装置包括设置在基板背面的超声波发射器和超声波接收器,所述超声波发射器向所述基板背面发射用于检测基板质量的超声波;所述超声波接收器接收从所述基板反射的超声波;显示器基板质量检测装置还包括与所述超声波接收器连接的超声波分析器,用于对接收的超声波进行分析以判断出所述基板是否出现破裂。
  2. 根据权利要求1所述的显示器基板质量检测装置,其中,所述超声波发射器的发射角与所述超声波接收器的接收角相等。
  3. 根据权利要求1所述的显示器基板质量检测装置,其中,所述显示器基板质量检测装置还包括发射器定位装置,所述超声波发射器安装在所述发射器定位装置上,所述发射器定位装置带动所述超声波发射器旋转或平移。
  4. 根据权利要求3所述的显示器基板质量检测装置,其中,所述显示器基板质量检测装置还包括接收器定位装置,所述超声波接收器安装在所述接收器定位装置上,所述接收器定位装置带动所述超声波接收器旋转或平移,且所述超声波发射器以预定的发射角度向基板背面发射超声波。
  5. 根据权利要求1所述的显示器基板质量检测装置,其中,还包括用于带动所述基板水平运动的生产线,多个所述超声波接收器沿与生产线带动基板运动的方向相互垂直的方向排成一列,且所述多个超声波接收器所排成的一列的长度与基板的宽度相匹配。
  6. 一种显示器基板质量检测方法,其中,包括以下步骤:
        在基板正面设置半导体阵列的制程区和围绕所述制程区的非制程区,在基板背面设置超声波发射器和超声波接收器,超声波发射器向基板背面发射用于检测基板质量的超声波;
        超声波接收器接收从基板反射的超声波;
        与超声波接收器连接的超声波分析器对接收的超声波进行分析以判断出基板是否出现破裂。
  7. 根据权利要求6所述的显示器基板质量检测方法,其中,还包括以下的步骤:
    设置所述超声波发射器的发射角与所述超声波接收器的接收角相等。
  8. 根据权利要求6所述的显示器基板质量检测方法,其中,还包括以下步骤:
        将所述超声波发射器安装在发射器定位装置上,由所述发射器定位装置带动所述超声波发射器旋转到预定的发射角度或平移到预定的发射位置,然后由超声波发射器以预定的发射角度向基板背面发射超声波。
  9. 根据权利要求8所述的显示器基板质量检测方法,其中,还包括以下步骤:
        将所述超声波接收器安装在接收器定位装置上,由所述接收器定位装置带动所述超声波接收器旋转或平移。
  10. 根据权利要求6所述的显示器基板质量检测方法,其中,还包括以下步骤:
        由生产线带动所述基板水平运动;
        将多个所述超声波接收器沿与生产线带动基板运动的方向相互垂直的方向排成一列以接收超声波,且所述多个超声波接收器所排成的一列的长度与基板的宽度相匹配。
PCT/CN2013/078346 2013-05-22 2013-06-28 显示器基板质量检测装置及检测方法 Ceased WO2014187016A1 (zh)

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