WO2014176960A1

WO2014176960A1 - Temperature control method and device

Info

Publication number: WO2014176960A1
Application number: PCT/CN2014/074973
Authority: WO
Inventors: 刘斌; 刘凤鹏; 李林
Original assignee: 中兴通讯股份有限公司
Priority date: 2013-08-30
Filing date: 2014-04-09
Publication date: 2014-11-06
Also published as: CN104423403B; CN104423403A

Abstract

A temperature control method and a device. The method comprises: providing a distribution network for detecting the temperature on heat dispersing materials of a terminal (s102); polling and detecting the temperature of the distribution network (s104); adjusting the work state of a work module of the terminal when the detected temperature is higher than a preset threshold (s106). The temperature control method and device can acquire a more exact user application temperature without a complicated test or a modeling, make the temperature range of the terminal to be distributed evenly, and improve the user experience effectively on the premise of exerting the system performance adequately.

Description

TECHNICAL FIELD The present invention relates to the field of communications, and in particular, to a temperature control method and apparatus. BACKGROUND With the advancement of technology, mobile phones and other mobile terminals are getting faster and faster, and the thickness of products is becoming thinner and thinner. The user experience and various security problems brought about by heat are becoming more and more obvious. As various terminals are used more and more widely, various usage scenarios are also different. For example, mobile phones, people are often used to make calls, people are often used to play games, and people are often used to play videos. Thermal design is a topic of concern in the industry. At present, the main methods for reducing terminal heating are: using a large-area PCB circuit board or a structural design that facilitates heat dissipation in the early stage, and using a special heat-dissipating heat-dissipating material such as a heat-dissipating film or a thermal-conductive adhesive. , so that the heat is evenly distributed inside the terminal such as the mobile phone, thereby reducing the excessive temperature of a certain part and improving the user experience. The industry also has other methods such as frequency reduction, such as detecting the internal temperature of the chip. When it is higher than a certain threshold, it reduces the operating frequency of the CPU, thereby reducing the operating power consumption of the terminal and lowering the temperature. The above heat dissipation method has its limitations. First, the terminal tends to be compact and easy to carry. In order to increase product competitiveness, the thickness of the terminal products such as mobile phones is also becoming thinner and thinner. These can only be added later by adding thinner graphite sheets. Materials such as thermal adhesives passively reduce the operating temperature of the terminal; in addition, methods such as CPU down-clocking for chip temperature are difficult to implement, and the internal temperature of the chip or the temperature on the board and the temperature that the user can feel are too different. Circuit design, different operating environments, different structural design will bring great difference between the two. J, each design needs to do a lot of experiments to build the model, even if this still does not reflect the user actually feels temperature. In view of the problem that there is no effective terminal cooling method in the related art, an effective solution has not been proposed yet. SUMMARY OF THE INVENTION In view of the problem that there is no effective terminal heat dissipation method in the related art, the present invention provides a temperature control method and apparatus for solving the above technical problems. According to an aspect of the invention, the present invention provides a temperature control method, wherein the method comprises: providing a distribution network for temperature detection on a heat dissipation material of a terminal; polling and detecting a temperature of the distribution network; When the above temperature is higher than the set threshold, the working state of the working module of the terminal is adjusted. Preferably, after the foregoing distribution network for temperature detection is disposed on the heat dissipation material of the terminal, the method further includes: setting a one-to-one correspondence between the distribution network and the working module of the terminal. Preferably, when detecting that the temperature is higher than a set threshold, adjusting an operating state of the working module of the terminal includes: searching for a work corresponding to the distributed network when detecting that the temperature of the distributed network is higher than the set threshold Module, adjust the working state of the working module. Preferably, adjusting the working state of the working module of the terminal includes: adjusting operating states of the working module by using different algorithms according to module properties and application scenarios of different working modules. According to another aspect of the present invention, the present invention further provides a temperature control device, wherein the device comprises: a network setting module, configured to set a distribution network for temperature detection on a heat dissipation material of the terminal; a temperature detection module, The polling module is configured to detect the temperature of the distribution network, and the adjusting module is configured to adjust the working state of the working module of the terminal when the temperature detecting module detects that the temperature is higher than a set threshold. Preferably, the device further includes: a corresponding setting module, configured to set a one-to-one correspondence between the distribution network and the working module of the terminal. Preferably, the adjusting module includes: a searching unit configured to: when detecting that the temperature of the distribution network is higher than the set threshold, searching for a working module corresponding to the distribution network; and adjusting, configured to adjust the working of the working module status. Preferably, the adjusting unit includes: an adjusting subunit, configured to adjust an working state of the working module by using different algorithms according to module properties and application scenarios of different working modules. Preferably, the temperature detecting module includes: a temperature collecting unit configured to collect a temperature of the distribution network; and a temperature acquiring unit configured to acquire a temperature collected by the temperature collecting unit; wherein the temperature collecting unit and the temperature acquiring unit pass I2C two-wire serial bus or SPI serial peripheral interface connection. According to the technical solution provided by the foregoing embodiment of the present invention, a distribution network for temperature detection is set on the heat dissipation material of the terminal, and then the temperature of the distribution network is polled and detected, and when the temperature is detected to be higher than a set threshold, the adjustment is performed. The working state of the working module of the above terminal. The invention solves the problem that there is no effective terminal heat dissipation method in the related art, and it is possible to obtain a more accurate user use temperature without complicated experiment and modeling, and the temperature of the terminal can be evenly distributed, and the system performance can be fully utilized while being effective. Improve the user experience. The above description is only an overview of the technical solutions of the present invention, and the technical means of the present invention can be more clearly understood, and can be implemented in accordance with the contents of the specification, and the above and other objects, features and advantages of the present invention can be more clearly understood. Specific embodiments of the invention are set forth below. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a flow chart of a temperature control method according to an embodiment of the present invention; FIG. 2 is a structural block diagram of a temperature control device according to an embodiment of the present invention; FIG. 3 is a function of an intelligent temperature control system according to an embodiment of the present invention. FIG. 4 is a flow chart of a method for intelligent temperature control according to an embodiment of the present invention; and FIG. 5 is a schematic structural view of a heat dissipating material device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION In order to solve the problem that there is no effective terminal heat dissipation method in the prior art, the present invention provides a temperature control method and apparatus. The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The present embodiment provides a temperature control method, which can be implemented on the terminal side. FIG. 1 is a flowchart of a temperature control method according to an embodiment of the present invention. As shown in FIG. 1, the method includes the following steps (step S102). - step S106): step S102, providing a distribution network for temperature detection on the heat dissipation material of the terminal; step S104, polling and detecting the temperature of the distribution network; step S106, when detecting that the temperature is higher than a set threshold, Adjust the working status of the working module of the above terminal. Through the above method, a distribution network for temperature detection is set on the heat dissipation material of the terminal, and then the temperature of the distribution network is polled, and when the temperature is detected to be higher than the set threshold, the working state of the working module of the terminal is adjusted. . The invention solves the problem that there is no effective terminal heat dissipation method in the related art, and it is possible to obtain a more accurate user use temperature without complicated experiment and modeling, and the temperature of the terminal can be evenly distributed, and the system performance can be fully utilized while being effective. Improve the user experience. After the distribution network is disposed on the heat dissipation material, preferably, a one-to-one correspondence between the distribution network and the working modules of the terminal may be set, for example, the heat dissipation material shape information and the terminal design information are imported into an automatic computer-aided design software (Auto Computer Aided). Design, abbreviated as AutoCAD), in the mapping software tool, by superimposing the information in the vertical direction, the one-to-one correspondence between the distribution network on the specific heat dissipation material and each working module of the terminal can be obtained. In this way, when it is detected that the temperature of the distribution network is higher than the set threshold, the search is performed. A working module corresponding to the distribution network adjusts the working state of the working module. Through the above preferred manner, it is possible to more accurately determine which working module is too high in temperature, need to lower the temperature, and improve the temperature control efficiency and effect. The local temperature of the terminal is too high, which will affect the service life of the terminal, and seriously affect the user experience and subjectivity. Feeling, especially in the position that some users can touch, through the above precise positioning, the excessive temperature of the point can be lowered, the high temperature is prevented from forming damage to the terminal, and the user experience is improved. When the working state of the working module of the terminal is adjusted, preferably, different working states of the working module can be adjusted according to the module properties and application scenarios of different working modules. For example, the temperature of the power module of the terminal is detected by the temperature distribution network. High, knowing that the terminal is currently charging, the master chip (such as the central processing unit CPU) can issue a control command to properly reduce the charging current or stop charging until the detected temperature is lower than the set threshold. Corresponding to the temperature control method introduced in the above embodiment, the present embodiment provides a temperature control device, which can be disposed on the terminal side to implement the above embodiment. 2 is a structural block diagram of a temperature control device according to an embodiment of the present invention. As shown in FIG. 2, the device includes: a network setting module 10, a temperature detecting module 20, and an adjusting module 30. The structure is described in detail below. The network setting module 10 is configured to set a distribution network for temperature detection on the heat dissipation material of the terminal; the temperature detection module 20 is connected to the network setting module 10, and is configured to poll and detect the temperature of the distribution network. Specifically, the network setting module 10 is distributed with a temperature sensitive network, and each temperature sensitive module in the temperature sensitive network is connected to the temperature detecting module 20 by a certain manner (for example, the two are connected by wires), and the temperature detecting module 20 The information of each temperature sensitive module is obtained by polling the time-division method, and the information is saved and reported to the adjustment module 30. The adjustment module 30 is connected to the temperature detecting module 20, and is configured to adjust the working state of the corresponding working module by the above algorithm when the temperature detecting module 20 detects that the temperature is higher than the set threshold, so that the temperature in the area is lowered to Within the preset threshold. The following is an example of a mobile terminal device. Generally, when the mobile terminal device is at about 45 °C, the user's subjective use experience begins to deteriorate, but considering the user experience of the mobile phone charging time, the charging module can be used. The temperature threshold of the zone is set to 50 °C, and the temperature detection network covers the entire rear case of the mobile phone, and the corresponding temperature sensitive module corresponds to the charging module area on the mobile phone circuit board. When the mobile phone detects that it is currently charging, and the corresponding temperature sensitive module detects that the temperature of the area exceeds 50 ° C, the mobile phone starts the charging control module, and gradually reduces the charging current value until the temperature sensitive module detects the temperature. The temperature is controlled within 50 °C. Specifically, when the temperature detecting module 20 reports the temperature information of the temperature sensitive network to the adjusting module 30, the adjusting module 30 filters out the temperature information value higher than the set threshold, and finds the corresponding terminal working module by using a table lookup method or the like. In a specific practice, the network setting module 10 is a temperature detection distribution network, the module The block is generally implemented by hardware; the temperature detecting module 20 and the adjusting module 30 are generally implemented by a combination of software and hardware, and are implemented based on software on the hardware circuit. For example, the temperature detecting module 20 can be a small single-chip computer system, and the adjusting module 30 It can be a CPU central processor unit. Through the above device, the network setting module 10 sets a distribution network for temperature detection on the heat dissipation material of the terminal, and then the temperature detection module 20 polls and detects the temperature of the distribution network, and adjusts when the temperature is detected to be higher than the set threshold. The module 30 adjusts the working state of the working module of the above terminal. For example, mobile terminal equipment, in general, when the temperature is around 45 °C, the user's subjective use experience begins to deteriorate, so that the temperature threshold of the area that the user can touch when holding the mobile phone can be set to 45 ° C; or in the mobile phone In the charging situation, in order to ensure the fast charging of the mobile phone and to ensure that the device is not damaged, the temperature threshold of the charging module area can be set to 50 °C. The device solves the problem that there is no effective terminal heat dissipation method in the related art, and more complicated user use temperature can be obtained without complicated experiment and modeling, and the temperature of the terminal can be evenly distributed, and the system performance can be fully utilized. , effectively improve the user experience. After the distribution network is disposed on the heat dissipating material, the device may further include: a corresponding setting module, configured to set a one-to-one correspondence between the distribution network and the working module of the terminal. The adjustment module 30 includes: a searching unit configured to: when detecting that the temperature of the distribution network is higher than a set threshold, by searching the distribution network corresponding to the distribution network and the terminal working module of the adjustment module 30 in advance, searching for the corresponding distribution network The working module; the adjustment unit, set to and adjust the working state of the working module. By the above preferred method, it is possible to more accurately determine which of the working modules is too hot, and it is necessary to lower the temperature, thereby improving the temperature control efficiency and effect. Preferably, the adjusting unit includes: an adjusting subunit, configured to adjust an operating state of the working module according to a module property and an application scenario of different working modules, for example, detecting a temperature of the power module of the terminal through a temperature distribution network. High, knowing that the terminal is currently charging, the main control chip can issue a control command to properly reduce the charging current or stop charging until the detected temperature is lower than the threshold. Preferably, the temperature detecting module 20 includes: a temperature collecting unit configured to collect a temperature of the distribution network; a temperature acquiring unit configured to acquire a temperature collected by the temperature collecting unit; wherein the temperature collecting unit and the temperature acquiring unit Connected via an I2C 2-wire serial bus or SPI serial peripheral interface. The technical solution of the present invention will be described in detail below through specific embodiments. 3 is a schematic structural diagram of an apparatus having a function of an intelligent temperature control system according to an embodiment of the present invention. As shown in FIG. 3, the apparatus includes: a main control chip 101 (the main control chip of the terminal is located on the main board), and includes temperature detection. The heat dissipation material 102 of the network and the temperature acquisition chip 103. A temperature detecting network is distributed on the heat dissipating material 102, and the network divides the heat dissipating material 102 into different regions. Generally, according to the size area S of the heat dissipating material 102 of the terminal, the heat dissipating material is further according to the area of the area responsible for the single temperature sensitive module. The size area S of 102 is equally divided into a plurality of small areas of equal area. Each temperature-sensitive module contains a temperature-sensitive material inside, which has temperature-sensitive characteristics. When the ambient temperature changes, the material properties change, and the external circuit can be used to change the characteristic values such as resistance, voltage or current. These characteristic values are collected by the temperature collecting chip 103, and then inversely pushed by the formula, the temperature value can be obtained. In the specific implementation process, different temperature-sensitive materials have different temperature-sensitive characteristics, and the algorithm is different. Taking a simple temperature-sensitive resistor as an example, the temperature value can be calculated by the following formula: Rt=R*EXP (B* (1/T1-1/T2)). Where Rt is the resistance of the thermistor at T1 temperature, R is the nominal resistance of the thermistor at T2 normal temperature, B is the parameter of the thermistor, EXP is the nth power of e, T1 and T2 Refers to K degrees, ie Kelvin temperature, K degree = 273.15 (absolute temperature) ten degrees Celsius. When the temperature changes, its resistance value changes, causing the voltage across the temperature sensitive resistor to change. According to the collected voltage value, the temperature value can be obtained in turn. The temperature collecting chip 103 has the same function as the temperature collecting unit in the above embodiment, and the temperature values of different regions on the heat dissipating material 102 can be collected. Generally, the chip having the ADC analog-to-digital conversion function can perform the above functions. The main control chip 101 has the same function as the temperature acquisition unit in the above embodiment, and the main control chip 101 and the temperature acquisition chip 103 pass through a two-wire serial bus (Inter-Integrated Circuit, I2C for short), serial peripherals. The interface (Serial Peripheral Interface, SPI for short) or other communication methods are connected to obtain temperature values of different regions on the heat dissipating material 102. Specifically, the acquisition interface of the temperature acquisition chip 103 may be an ADC analog-to-digital conversion interface, and the temperature dissipation chip 102 may be a temperature sensitive resistor, and the temperature acquisition chip 103 is connected to the temperature sensitive resistor on the heat dissipation material 102 through the wire. The resistance of the temperature sensitive resistor (Rt) changes with the ambient temperature, resulting in a change in the voltage value on the Rt. The voltage value is transmitted to the ADC interface through the wire, and the temperature collecting chip 103 obtains the voltage value, and obtains the ambient temperature value through the reverse push. And saved in the register. Generally, the temperature collecting chip 103 is placed and integrated close to the heat dissipating material 102 (similar to a touch screen, an LCD, etc., and the detecting control chip and components are combined together for convenient integration). The physical connector of the FPC or the like is connected to the main control chip 101 on the main board through a communication interface such as I2C or SPI, so that the main control chip 101 can obtain the temperature value on each area of the heat dissipating material 102 by the instruction, and pass the The algorithm described above controls and schedules various circuit modules on the main board according to the module nature and application scenarios of different working modules, thereby reducing power consumption and heat generation. For example, during the operation of the terminal, the temperature collecting chip 103 detects that the temperature of the e-zone is higher than the threshold and is significantly higher than the temperature of other regions, and if the circuit corresponding to the e-zone is the charging management module, the charging current operation can be reduced, if it is an application. Processing the chip, you can perform down-frequency down-core processing; if b area and If the temperature in the adjacent C area is high, the power consumption of the circuit corresponding to the two areas can be reduced at the same time, or the power consumption of one of the circuits can be reduced first, and then the temperature detection is compared. The temperature collecting chip 103 detects the distribution network on the heat dissipating material 102 by polling, and observes the temperature distribution of the product during operation in real time. Different algorithms can be used to control the working state of each module of the terminal, so that the heat is evenly distributed inside the product. In the embodiment of the invention, the temperature collection system, the real-time polling collection is closer to the temperature value of each area experienced by the user experience, and the operating state of each module is dynamically adjusted to uniformly distribute the product temperature. Since the heat dissipating material is generally placed close to the end product housing and closer to the user's actual use, the temperature on the graphite sheet is more accurate than detecting the temperature of the chip or the temperature on the main board, and it is more accurate without complicated experiment and modeling. Users can use the temperature to better utilize the system's capabilities and enhance the user experience. The device with the function of the intelligent temperature control system introduced in this embodiment is connected with the temperature acquisition chip through the terminal control chip of the terminal, and the real-time polling acquisition detects the temperature of each local network on the heat dissipation material, and dynamically adjusts the state of each working module of the terminal. Reduce power consumption, solve local heat and improve user experience. 4 is a flowchart of a method for intelligent temperature control according to an embodiment of the present invention. As shown in FIG. 4, the method includes the following steps (step S402 - step S406): Step S402, the main control chip of the terminal is distributed on the heat dissipation material. The polling detection is performed at each temperature point. In step S404, it is detected whether the temperature value is greater than a preset threshold. If yes, step S406 is performed, and if no, step S402 is performed again. Step S406, marking the area, the distribution network on the heat dissipation material and the working module on the motherboard circuit have physical one-to-one correspondence, and the corresponding working module is found through the mark, according to different module properties, different applications. Scenes, etc., start the corresponding algorithm to reduce module power consumption and heat generation in the area. The intelligent temperature control method introduced in this embodiment, through the terminal's own main control chip, the temperature detecting chip and the special heat dissipating material containing the network distribution, polls and detects the current temperature value of each area and compares it with the preset threshold value, according to the application. The scenario adjusts the corresponding working module to reduce the power consumption and heat generation in the area, so that the heat is evenly distributed inside the terminal, and the user experience is improved. The heat dissipating material will be described below by way of examples. FIG. 5 is a schematic structural view of a heat dissipating material device according to an embodiment of the present invention. As shown in FIG. 5, the method includes: a heat dissipating material 301, a temperature sensitive material 302, and a conductor material 303. Specifically, the heat dissipating material 301 may be a heat dissipating material such as a graphite sheet or a copper foil. The temperature sensitive material 302 may be a temperature sensitive resistor, a triode or the like having a temperature sensitive property, and the conductor material 303 may be a conductor material such as a copper wire. The temperature sensitive material 302 may be distributed in the heat dissipating material 301 or may be separately applied from the heat dissipating material 301. The temperature sensitive materials 302a, 302b to 302n divide the heat dissipating material 301 into different independent n regions, through the conductor. The 303 forms a network and is connected to a temperature collecting chip or circuit of the outside world. Since the temperature sensitive material 302 has temperature sensitive characteristics, when the ambient temperature changes, the material properties change, and the external circuit can be expressed as a change in the characteristic value such as resistance, voltage or current. When these eigenvalues are acquired, they can be reversed to obtain the temperature values sensed on each of the small temperature sensitive materials 302a, 302b through 302n. From the above description, it can be seen that the present invention increases the temperature detection network on the heat dissipation and heat conduction materials such as the graphite sheet, and uses the communication interfaces such as I2C and SPI to poll the current temperature of each local area and dynamically adjust the operation state of the corresponding module. , to evenly distribute the temperature. Since the heat dissipating material such as graphite sheet is placed close to the end product housing and closer to the user's actual use, the temperature on the detecting heat dissipating material is more accurate than detecting the temperature of the chip or the temperature on the main board, and the system system can be fully utilized to enhance the user experience. While the preferred embodiments of the present invention have been disclosed for purposes of illustration, those skilled in the art will recognize that various modifications, additions and substitutions are possible, and the scope of the invention should not be limited to the embodiments described above.

Claims

A request for rights, a method of temperature control, including:

Setting a distribution network set to temperature detection on the heat dissipation material of the terminal;

Polling to detect the temperature of the distribution network;

When it is detected that the temperature is higher than a set threshold, the working state of the working module of the terminal is adjusted. The method of claim 1, wherein, after the distribution network configured for temperature detection is set on the heat dissipation material of the terminal, the method further includes:

Setting a one-to-one correspondence between the distribution network and a working module of the terminal. The method of claim 2, wherein, when detecting that the temperature is higher than a set threshold, adjusting an operating state of the working module of the terminal includes:

When it is detected that the temperature of the distribution network is higher than the set threshold, the working module corresponding to the distribution network is searched, and the working state of the working module is adjusted. The method according to any one of claims 1 to 3, wherein adjusting the working state of the working module of the terminal comprises:

According to the module nature and application scenarios of different working modules, different working algorithms are used to adjust the working state of the working module. , a temperature control device, comprising:

a network setting module, configured to set a distribution network for temperature detection on the heat dissipation material of the terminal; and a temperature detection module configured to poll and detect the temperature of the distribution network;

The adjusting module is configured to adjust an working state of the working module of the terminal when the temperature detecting module detects that the temperature is higher than a set threshold. The device of claim 5, wherein the device further comprises: a corresponding setting module, configured to set a one-to-one correspondence between the distribution network and the working module of the terminal. The apparatus according to claim 6, wherein the adjustment module comprises: a searching unit, configured to: when detecting that the temperature of the distribution network is higher than the set threshold, searching for a working module corresponding to the distribution network;

The adjustment unit is set to adjust the working state of the working module. The apparatus according to claim 7, wherein the adjusting unit comprises: an adjusting subunit, configured to adjust an working state of the working module by using different algorithms according to module properties and application scenarios of different working modules. The device as claimed in claim 6, wherein the temperature detecting module comprises:

a temperature collecting unit configured to collect a temperature of the distribution network;

The temperature acquiring unit is configured to acquire the temperature collected by the temperature collecting unit; wherein the temperature collecting unit and the temperature acquiring unit are connected through an I2C two-wire serial bus or an SPI serial peripheral interface.