WO2015176507A1

WO2015176507A1 - Intelligent temperature control device, method and terminal, and computer storage medium

Info

Publication number: WO2015176507A1
Application number: PCT/CN2014/091326
Authority: WO
Inventors: 刘斌; 刘凤鹏; 孙银川; 于冰; 高婧
Original assignee: 西安中兴新软件有限责任公司
Priority date: 2014-05-23
Filing date: 2014-11-17
Publication date: 2015-11-26
Also published as: CN105094251A; CN105094251B

Abstract

Disclosed is an intelligent temperature control device. The device comprises a temperature detection component, a temperature collection chip and a main control chip. The temperature detection component is configured to detect temperature information of various different regions divided in a terminal. The temperature collection chip is configured to collect, by polling, the temperature information of the different regions detected by the temperature detection component, convert the temperature information into specific temperature values and send the specific temperature values to the main control chip. The main control chip is configured to control power consumption of various functional modules in the terminal according to the acquired temperature values. Also disclosed are an intelligent temperature control method, an intelligent temperature control terminal, and a computer storage medium.

Description

Intelligent temperature control device, method, terminal and computer storage medium

Technical field

The invention relates to the field of terminal temperature control, and in particular to an intelligent temperature control device, method, terminal and computer storage medium.

Background technique

With the advancement of technology, mobile terminals such as mobile phones are operating faster and faster, and the thickness of the mobile terminal itself is getting thinner and thinner, and the volume is getting smaller and smaller. Therefore, the user experience caused by the heat of the mobile terminal itself is poor. Various security issues have become more apparent. With the increasing use of terminals, mobile terminals are currently used in different scenarios, such as mobile phones, where people use to make calls, people use games, and people use them to play videos.

At present, the thermal design of the terminal is a topic of concern in the industry. At present, the methods for reducing the heating of the terminal mainly include the following: one is to use a large-area printed circuit board (PCB, Printed Circuit Board) in the design of the previous scheme. ) or structural design that facilitates heat dissipation; the other is the use of heat-dissipating heat-dissipating materials such as heat-dissipating film and thermal conductive glue in the later stage to make heat dissipate in the terminal, thereby reducing the excessive temperature of a certain part and improving the user experience.

However, the above-mentioned heat dissipation method has certain limitations. First, in order to increase product competitiveness, the terminal tends to be compact and convenient for users to carry. Therefore, the design of a large-area PCB or a heat-dissipating structure cannot meet the current terminal design. Demand; Moreover, the method of reducing the operating temperature of the terminal by adding thin graphite sheets, thermal conductive adhesives and the like in the later stage can only have a small effect on the heat dissipation of the terminal.

Summary of the invention

In view of this, embodiments of the present invention are expected to provide an intelligent temperature control device, method, terminal, and Computer storage media.

An embodiment of the present invention provides an intelligent temperature control device, where the device includes a temperature detecting device, a temperature collecting chip, and a main control chip;

The temperature detecting device is configured to detect temperature information of each of the different regions divided in the terminal;

The temperature collecting chip is configured to poll the temperature information of different regions detected by the collecting temperature detecting device, and convert the temperature information into a specific temperature value, and then send the temperature information to the main control chip;

The main control chip is configured to perform power consumption control on each functional module in the terminal according to the obtained temperature value.

In the above solution, the temperature detecting device includes, but is not limited to, a liquid crystal display (LCD) distributed on the terminal or a thermistor of the touch display member.

In the above solution, the temperature collecting chip is configured to poll the temperature information of the different areas of the terminal detected by the temperature detecting device through the temperature collecting interface;

The temperature acquisition interface includes, but is not limited to, an analog to digital conversion (ADC) interface.

In the above solution, the temperature collecting chip is configured to send the temperature value to the main control chip through a connection mode of a mobile industrial processor interface (MIPI) and an internal integrated circuit (I2C).

In the above solution, the device further includes a memory configured to store function module information corresponding to different areas of the terminal.

In the above solution, the main control chip is configured to: when the acquired temperature value is higher than a preset threshold, perform power control on a function module or an adjacent function module in an area where the temperature value is higher than a preset threshold. .

In the above solution, the main control chip is further configured to: when the acquired temperature value is not higher than the preset threshold, stop performing the function module or the adjacent function module in the region where the temperature value is higher than the preset threshold. Power control.

The embodiment of the invention further provides an intelligent temperature control method, which divides the terminal into multiple regions, The method further includes:

Detecting temperature information in different areas;

Polling to collect temperature information of different detected regions, and converting the temperature information into specific temperature values;

According to the obtained temperature value, power consumption control is performed on each functional module in the terminal.

In the above solution, the temperature information of the different regions detected by the polling collection includes: polling the temperature information of different regions of the terminal detected by the temperature detecting device through the temperature collecting interface.

In the above solution, the method further includes: sending the converted specific temperature value to the main control chip;

The sending the specific temperature value to the main control chip comprises: transmitting the temperature value to the main control chip through a connection manner of the MIPI and the internal integrated circuit I2C.

In the above solution, the controlling the power consumption of each circuit module in the terminal according to the obtained temperature value includes: when the acquired temperature value is higher than a preset threshold, in a region where the temperature value is higher than a preset threshold The function module or its adjacent function module performs power consumption control.

In the above solution, the controlling the power consumption of each circuit module in the terminal according to the obtained temperature value further includes: stopping, when the acquired temperature value is not higher than the preset threshold, stopping the temperature value being higher than a preset threshold The function modules in the area or their adjacent function modules perform power consumption control.

The embodiment of the invention further provides an intelligent temperature control terminal, wherein the terminal comprises the intelligent temperature control device according to any one of the above.

The embodiment of the present invention further provides a computer storage medium, the computer storage medium comprising a set of instructions, when executed, causing at least one processor to execute the intelligent temperature control method.

The intelligent temperature control device, method, terminal and computer storage medium provided by the embodiments of the present invention divide the terminal into multiple regions, detect temperature information of different regions, and poll and collect temperature information of different detected regions, and The temperature information is converted into a specific temperature value; according to the obtained temperature The degree value is used to control the power consumption of each functional module in the terminal; thus, the real-time polling acquisition is closer to the temperature value of the user experience area, and the operating state of the corresponding module is dynamically adjusted to uniformly distribute the temperature. The detection temperature is more accurate, closer to the user's real experience, and the system can be fully utilized to enhance the user experience.

DRAWINGS

In the drawings, which are not necessarily to scale, the Like reference numerals with different letter suffixes may indicate different examples of similar components. The drawings generally illustrate the various embodiments discussed herein by way of example and not limitation.

1 is a schematic structural diagram of an intelligent temperature control device according to an embodiment of the present invention;

2 is a schematic diagram of an application scenario of an intelligent temperature control device according to Embodiment 2 of the present invention;

3 is a schematic diagram of an application scenario of an intelligent temperature control device according to Embodiment 3 of the present invention;

4 is a schematic diagram of a corresponding area of a function module of a terminal board according to an embodiment of the present invention;

FIG. 5 is a schematic flowchart of an intelligent temperature control method according to an embodiment of the present invention; FIG.

FIG. 6 is a schematic flowchart of an intelligent temperature control method corresponding to the third embodiment of the present invention.

detailed description

In the embodiment of the present invention, the terminal is divided into multiple regions, and temperature information of different regions is detected; the temperature information of the detected different regions is collected by polling, and the temperature information is converted into a specific temperature value; according to the obtained temperature Value, power control of each functional module in the terminal.

Here, the detecting temperature information of different regions is performed by a temperature detecting device including, but not limited to, two or more thermistors distributed on the LCD of the terminal or the touch display member.

Specifically, the temperature detecting device includes more than one thermistors, and each of the thermistors may be distributed on the LCD or the touch display component of the terminal, but the range is not limited; The degree detecting device collects temperature value information of each area in a plurality of areas divided by the LCD or the touch display part of the terminal through the resistance change of the thermistor according to the change of the temperature.

The polling acquisition and conversion of the temperature information to a specific temperature value may be performed by the temperature acquisition chip; the power consumption control of each functional module in the terminal may be completed by the main control chip.

The temperature collecting chip polls the temperature information of the different regions detected by the temperature detecting device, and the temperature collecting chip polls the temperature information of different regions of the terminal detected by the temperature detecting device through the temperature collecting interface; the temperature collecting interface includes But not limited to the ADC interface.

The temperature collecting chip is connected to the temperature detecting device through a wire. Taking the thermistor as an example, when the temperature in a certain area of the terminal changes, the resistance value of the thermistor changes with the ambient temperature, resulting in the temperature detecting device. The voltage value changes, and the voltage value is transmitted to the ADC interface of the temperature collecting chip through the wire, and the temperature collecting chip converts the collected voltage value into a specific temperature value and stores it in a register of the terminal.

The temperature collecting chip sends the temperature value to the main control chip, including but not limited to the temperature collecting chip, and sends the temperature value to the main control chip through a connection manner of MIPI and I2C.

Among them, the temperature acquisition chip can be designed together with the main control chip, or can be designed separately, using a physical connector such as a flexible circuit board (FPC), and connected to the main control chip on the main board through a communication interface such as MIPI or I2C;

The correspondence information between the area divided by the terminal and each functional module in the main board is stored in the memory.

Here, due to the different internal structures of different terminals, the locations of the functional modules in different terminals may be greatly different. For example, terminal A and terminal B are equally divided into N regions, and for the X region of the central location of terminal A, the internal The structure is a display module; and for the X area of the central location of the terminal B, the corresponding internal structure is an audio play module. Therefore, corresponding to different terminals, it is necessary to establish a correspondence between the divided areas and each functional module in the main board, and save the corresponding relationship in a memory for the main control chip to query.

The main control chip performs power consumption control on each circuit module in the terminal according to the obtained temperature value, and includes: when the acquired temperature value is higher than a preset threshold, the function in the region where the temperature value is higher than a preset threshold The module or its adjacent function module performs power consumption control; wherein the power consumption control is to reduce the power consumption of the corresponding function module.

The controlling, by the main control chip, the power consumption of each circuit module in the terminal according to the obtained temperature value, further includes: when the acquired temperature value is not higher than a preset threshold, stopping the region where the temperature value is higher than a preset threshold The function module inside or its adjacent function module performs power consumption control.

The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings and specific embodiments. In the embodiment of the invention, the temperature detecting device is located in the LCD or the touch display component of the terminal, so that the temperature information of the region closer to the user's feeling can be collected, and the user experience is improved in real time. It should be noted that, in practical applications, each of the components in the embodiments of the present invention may be combined with each other as permitted.

1 is a schematic structural diagram of an intelligent temperature control device according to an embodiment of the present invention. As shown in FIG. 1, the device includes a temperature detecting device 11, a temperature collecting chip 12, and a main control chip 13;

The temperature detecting device 11 is configured to detect temperature information of each different area in which the terminal is divided;

The division manner of the terminal LCD/touch display component 14 may be an equal division manner, or the terminal LCD/touch display component 14 may be divided according to the position and area corresponding to the main function module in the terminal motherboard 15;

The temperature detecting device 11 includes, but is not limited to, a thermistor distributed on the LCD/touch display component 14 of the terminal;

Here, the area division of the terminal may be divided into N areas according to the size of the LCD or the touch display part 14 according to actual needs, or may be divided according to the position of each functional module in the middle end main board 15, and is not limited to the figure. The division manner shown in Fig. 1, any division manner capable of realizing the object of the invention of the embodiment of the present invention is preferable.

The temperature collecting chip 12 is configured to poll the temperature information of different regions detected by the temperature detecting device 11 and convert the temperature information into a specific temperature value and then sent to the main control chip 13;

The temperature collecting chip 12 polls the temperature information of the different areas of the terminal detected by the temperature detecting device 11 through the temperature collecting interface; the temperature collecting interface includes but is not limited to an ADC interface.

The main control chip 13 is configured to perform power consumption control on each functional module in the terminal according to the obtained temperature value;

The temperature collecting chip 12 sends the temperature value to the main control chip 13 including but not limited to: the temperature collecting chip 12 transmits the temperature value to the main control chip 13 through a connection manner of MIPI and I2C.

The device further includes a memory configured to store function module information corresponding to different areas of the terminal.

The main control chip 13 is configured to: when the acquired temperature value is higher than a preset threshold, perform power consumption control on a function module or an adjacent function module in an area where the temperature value is higher than a preset threshold; The power consumption control is to reduce the power consumption of the corresponding functional module.

The main control chip is configured to stop power consumption control on a function module or an adjacent function module in an area where the temperature value is higher than a preset threshold when the acquired temperature value is not higher than a preset threshold.

2 is a schematic diagram of an application scenario of an intelligent temperature control device according to Embodiment 2 of the present invention. In this embodiment, the temperature detecting device 11 detects temperature information of each region through a thermistor, as shown in FIG. 2, the intelligent temperature control of the embodiment of the present invention is shown in FIG. The working process of the device is as follows:

A1. During the charging process, the temperature collecting chip polls and collects the voltage values detected by the temperature detecting device 11 in each region;

B1, because the charging current is too large or the heat dissipation is blocked during the charging process, The temperature of the e region rises, thereby causing a change in the resistance value of the thermistor distributed in the e region, resulting in a change in the voltage value detected by the temperature detecting device;

C1. The temperature collecting chip polls and collects the voltage value detected by the temperature detecting device in each area, converts the voltage value into a specific temperature value, and sends the temperature value information to the main control chip;

Here, the specific temperature value into which the voltage value detected by the temperature detecting means in the e region is converted has been remarkably increased.

D1. The main control chip determines whether the received temperature value is greater than a preset threshold. When the temperature value in the area is greater than a preset threshold, a control command is sent to the corresponding function module to control power consumption of the function module.

For example, if it is determined that the temperature value in the e area is greater than the preset threshold value of 50 ° C, the function module corresponding to the e area on the terminal main board 15 is queried; if the e area corresponding to the charging management module 21 is queried in the memory, the charging management module 21 is applied to the charging management module 21 Sending a control command to reduce the charging current of the charging management module 21;

As the charging current decreases, the temperature of the charging management module 21 decreases. When the temperature of the e region is less than the temperature alarm threshold of 50 ° C, the main control chip stops the intervention of the charging current; thereby effectively controlling the temperature of the terminal region. However, the charging current is not excessively reduced, so that the charging time is extended and the user experience is affected.

FIG. 3 is a schematic diagram of an application scenario of an intelligent temperature control device according to Embodiment 3 of the present invention. As shown in FIG. 3, the working process of the intelligent temperature control device according to the embodiment of the present invention is as follows:

A2. During use, the temperature acquisition chip polls and collects the voltage value detected by the temperature detecting device 11 in each area;

B2. The temperature of the a, b, and c regions rises due to the operation of the terminal, thereby causing a change in the resistance value of the thermistor distributed in the areas a, b, and c, resulting in a change in the voltage value detected by the temperature detecting device;

C2, the temperature acquisition chip polls and collects the voltage value detected by the temperature detecting device in each area, Converting the voltage value into a specific temperature value; and transmitting the temperature value to the main control chip;

Here, the specific temperature value converted by the voltage value detected by the temperature detecting means in the areas a, b, and c has been significantly increased;

D2. The main control chip determines whether the received temperature value is greater than a preset threshold. When the temperature value in the area is greater than a preset threshold, a control command is issued to the corresponding function module to control power consumption of the function module.

For example, if the temperature value in the b region is greater than the preset threshold value by 50 ° C, the temperature of the adjacent a and c regions is increased but the temperature value does not exceed the preset threshold value of 50 ° C, and the a, b, and the memory are queried. The c area corresponds to the Bluetooth module 31, the audio play module 32, and the application processing module 33 respectively corresponding to the terminal board 15. At this time, the main control chip can send a control instruction to the audio play module, reducing the playback volume of the audio play module 32, so that the temperature of the b area is lowered below the threshold; if it is considered that reducing the playback power consumption of the audio play module 32, the music play is bound to be played. The quality may be affected, and the control command may be sent to the Bluetooth module 31 and/or the application processing module 33 to reduce the power consumption of the Bluetooth module 31 in the a-area, and/or the power consumption of the application processing module 33 in the c-area, so that a, and / Or the temperature of the two areas is reduced, the heat of the b area is diffused to both sides, and the temperature value of the b area is decreased; or the blue, parallel, and corresponding Bluetooth modules 31 and audio playback modules are selected. 32. The power consumption of the application processing module 33.

As the power consumption of the audio playback module 32, and/or the Bluetooth module 31, and/or the application processing module 33 decreases, the temperature of the b region decreases, and when the temperature of the b region is less than the temperature alarm threshold of 50 ° C, the pair stops. Intervention of the above module operating frequency.

In the embodiment of the present invention, the power consumption of the audio playback module 32 that reduces the b area or the power consumption of the Bluetooth module 31 and the application processing module 33 in the a and c areas may be preset according to actual conditions. For example, for a certain type of mobile phone, which is characterized by high-quality music playing function, when the above situation occurs, the selection ensures that the music playing is not affected, and the Bluetooth module 31 and the application processing of the adjacent a and c areas of the b area are reduced. Power consumption of module 33; for another model of hand The machine is characterized in that it can be interconnected with the user wearable device through Bluetooth. Then, when the above situation occurs, the power consumption of the audio play module 32 of the b area is selected to ensure that the Bluetooth module 31 of the area a is not affected; A mobile phone without special function requirements may select to simultaneously reduce the power consumption of the audio playback module 32 of the b area and the Bluetooth module 31 of the a, c area, and the application processing module 33.

Corresponding to different terminals, the internal structure will have a big difference. When the LCD/touch display unit 14 performs area division on the terminal, there may be a case where the same area corresponds to a plurality of function modules or a plurality of areas correspond to one function module. As shown in FIG. 4, the terminal board 15 is an embodiment of the present invention. Schematic diagram of the corresponding area of the function module: the function module X, the function module Y and the function module Z on the corresponding motherboard in the b area, each function block is a tile structure; the f area corresponds to the function block M and the function block N on the terminal main board 15, each The function block is a layered structure; the d area and the e area jointly correspond to the same functional module P, and in the e area, the function module Q adjacent to the function module P on the terminal main board 15 is also corresponding.

When the function of the function module in the b area causes the temperature of the b area to exceed the preset threshold, the control chip determines the control strategy according to the actual situation and the different requirements of the terminal according to the second embodiment or the third embodiment, and selects the control function module X. And/or the operating power consumption of the functional module Y, and/or the functional module Z, or may choose to reduce the power consumption of its adjacent functional modules; for example, for the b region, its adjacent a region, c region or Power consumption of functional modules in the e-zone.

When the function of the function module in the f-region causes the temperature of the f-zone to exceed the preset threshold, the control chip determines the control strategy according to the actual situation and the different requirements of the terminal according to the second embodiment or the third embodiment, and selects the control function module M, And/or the operating power consumption of the function module N, it is also possible to preferentially select the power consumption of the function module closer to the area that the user can easily perceive such as the LCD/touch display component, for example, the function module N is closer to the touch display component, and the lowering function is preferentially selected. The power consumption of module N may alternatively be reduced by the power consumption of its adjacent functional modules; for example, for the f-region, the power consumption of functional modules of its adjacent c-region, e-region or n-region may be selected.

When the operation of the function module P causes the temperature of the d area and the e area to exceed the preset threshold, the main control chip determines the control strategy according to the actual situation and the different requirements of the terminal according to the second embodiment and the third embodiment, and selects the control function module P. Operating power consumption, or controlling the power consumption of a functional module adjacent to the functional module P in the d region and/or the e region, for example, reducing the power consumption of the functional module Q in the e region, or an adjacent region thereof, such as a Power consumption of functional modules in the b, f, and f regions.

When the embodiment of the present invention is applied to a specific terminal, the area division may be performed according to the actual situation of the terminal, and the control of each function module in the terminal may also be set according to actual conditions, for example, according to terminal characteristics or user requirements. The priority order of each functional module, when a temperature in a certain area of the terminal is overheated, the power consumption control of a specific functional module may be preferentially selected, and the intervention and control of the core functional module of the terminal may be reduced as much as possible; Power control can also be implemented directly on all involved functional modules in the area.

The embodiment of the present invention further provides an intelligent temperature control method, and FIG. 5 is a schematic flowchart of an intelligent temperature control method according to an embodiment of the present invention. As shown in FIG. 5, the intelligent temperature control method of the embodiment of the present invention first divides the terminal into multiple The area includes the following steps:

Step 501: Detect temperature information of different areas;

Here, the area division of the terminal may be divided into N areas according to the actual needs according to the size of the LCD or the touch display component; or the position corresponding to the main function module in the main board, the area-to-terminal LCD/touch display part The division is performed; however, the specific division manner is not limited, and any division manner capable of achieving the object of the present invention is desirable.

Step 502: Polling and collecting temperature information of different detected regions, and converting the temperature information into specific temperature values;

The temperature information of the different areas detected by the polling collection includes: polling the temperature information of different areas of the terminal detected by the temperature detecting device through the temperature collecting interface.

The method further includes: transmitting the converted specific temperature value to the main control chip;

Send the specific temperature value converted to the main control chip, through the connection side of MIPI and I2C The temperature value is sent to the master chip.

Step 503: Perform power consumption control on each functional module in the terminal according to the obtained temperature value.

Here, the controlling the power consumption of each circuit module in the terminal according to the obtained temperature value includes: when the acquired temperature value is higher than a preset threshold, the function module in the region where the temperature value is higher than a preset threshold Or the adjacent function module performs power consumption control; when the acquired temperature value is not higher than the preset threshold, stopping power consumption of the function module or its adjacent function module in the region where the temperature value is higher than the preset threshold Control; wherein the power consumption is controlled to reduce power consumption of the corresponding functional module.

FIG. 6 is a schematic flowchart of an intelligent temperature control method according to Embodiment 3 of the present invention. As shown in FIG. 6, the method includes the following steps:

Step 601: Divide the LCD/touch display component of the terminal into a plurality of regions, and the temperature detecting device detects temperature information of each different region in which the terminal is divided;

The dividing manner of the terminal LCD/touch display component may be an equal division manner, or the terminal LCD/touch display component may be divided according to the position and area corresponding to the main functional module in the main board;

Step 602: The temperature collection chip polls and collects temperature information of different detected regions.

Here, due to the operation of the terminal, the temperature of the plurality of regions in the terminal is increased, thereby causing a change in the resistance value of the thermistor distributed in the corresponding plurality of regions, resulting in a change in the voltage value detected by the temperature detecting device;

Step 603: The temperature collecting chip converts the temperature information into a specific temperature value; and sends the temperature value to the main control chip;

Step 604: The main control chip determines whether the temperature value of at least one area is greater than a preset threshold; when the detected temperature value in one or more areas is greater than the preset threshold, step 605 is performed; otherwise, return to step 602;

Here, the preset threshold may be set according to actual conditions; for example, setting a temperature threshold The value is 50 ° C. When the temperature value of a certain area received is higher than 50 ° C, the temperature value of the area is considered to exceed the preset threshold.

Step 605: Send a control instruction to a function module or an adjacent function module in an area where the temperature value is higher than a preset threshold, and control power consumption of the function module.

The power consumption control is to reduce power consumption of the corresponding functional module.

For example, the master chip determines that the temperature value in the b region is greater than the preset threshold of 50 ° C, and the temperature of the adjacent a and c regions increases but the temperature value does not exceed the preset threshold of 50 ° C, and the a The b, c areas correspond to the Bluetooth module, the audio play module, and the application processing module respectively corresponding to the terminal board. At this time, the main control chip can send a control command to the audio play module to lower the play volume, so that the temperature of the b area is lower than the threshold; if it is considered that reducing the playback power consumption of the audio play module will inevitably affect the music playback quality, The control command may be sent to the Bluetooth module and/or the application processing module to reduce the operating frequency of the a region bluetooth module and/or the c region application processing module, so that the temperatures of the two regions a and c are lowered, and the heat in the b region is It will spread to both sides, and the temperature value of the b area will decrease. Alternatively, the power consumption of the corresponding Bluetooth module, audio playback module, and application processing module corresponding to the a, b, and c regions will be reduced.

In the embodiment of the present invention, selecting the power consumption of the audio play module in the b area or reducing the power consumption of the Bluetooth module and the application processing module in the a and c areas may be preset according to actual conditions.

Corresponding to different terminals, the internal structure will have a big difference. When the LCD/touch display component divides the terminal into regions, there may be cases where the same region corresponds to multiple functional modules or multiple regions correspond to one functional module. The main control chip determines the control strategy according to actual conditions and different requirements of the terminal. .

When the embodiment of the present invention is applied to a specific terminal, the area division may be performed according to the actual situation of the terminal, and the control of each function module in the terminal may also be set according to actual conditions, for example, according to terminal characteristics or user requirements. The priority order of each function module can preferentially control the power consumption of a specific function module when the temperature of a certain area of the terminal is overheated. For the core function module of the terminal, the intervention and control of the terminal are reduced as much as possible; and the power consumption control of all the functional modules involved in the area can be directly implemented.

Step 606: Continue to detect whether the temperature of the temperature higher than the preset threshold area has decreased below the preset threshold under the power consumption control of the main control module; when the temperature of the area is lower than the preset threshold, step 607 is performed. Otherwise, step 606 is repeated;

Step 607: Stop the power consumption control of the function module or its adjacent function module in the corresponding area, and the process ends, and returns to step 602.

For example, as the power consumption of the audio playback module, and/or the Bluetooth module, and/or the application processing module decreases, the temperature in the b region decreases, and when the temperature in the b region is less than the temperature alarm threshold of 50 ° C, the above is stopped. Intervention of the module's operating frequency.

The embodiment of the invention further provides an intelligent temperature control terminal, which comprises the above intelligent temperature control device of any one of FIG. 1 to FIG.

The implementation functions of the respective devices in the intelligent temperature control device shown in FIGS. 1 to 4 can be understood by referring to the related description of the intelligent temperature control method. It should be understood by those skilled in the art that the functions of the devices in the intelligent temperature control device shown in FIG. 1 to FIG. 4 can be implemented by specific logic circuits, such as a central processing unit (CPU), a microprocessor (MPU), Digital signal processor (DSP), or field programmable gate array (FPGA) implementation; the memory can also be implemented by a variety of storage media.

In the several embodiments provided by the present invention, it should be understood that the disclosed method and apparatus may be implemented in other manners. The above-mentioned separation components may or may not be physically separated, and some or all of the components may be selected according to actual needs to achieve the objectives of the embodiments of the present embodiment.

Those skilled in the art will appreciate that embodiments of the present invention can be provided as a method, system, or computer program product. Accordingly, the present invention can take the form of a hardware embodiment, a software embodiment, or a combination of software and hardware. Moreover, the present invention may employ computer-usable storage media (including but not limited to disks) in one or more of the computer-usable program code embodied therein. A form of computer program product embodied on a memory and optical storage, etc.).

The present invention has been described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (system), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or FIG. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing device to produce a machine for the execution of instructions for execution by a processor of a computer or other programmable data processing device. Means for implementing the functions specified in one or more of the flow or in a block or blocks of the flow chart.

The computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture comprising the instruction device. The apparatus implements the functions specified in one or more blocks of a flow or a flow and/or block diagram of the flowchart.

These computer program instructions can also be loaded onto a computer or other programmable data processing device such that a series of operational steps are performed on a computer or other programmable device to produce computer-implemented processing for execution on a computer or other programmable device. The instructions provide steps for implementing the functions specified in one or more of the flow or in a block or blocks of a flow diagram.

Based on this, an embodiment of the present invention further provides a computer storage medium, the computer storage medium comprising a set of instructions, when executed, causing at least one processor to execute the intelligent temperature control method.

The present invention is an example of the intelligent temperature control device described in the above example, but is not limited thereto, and those skilled in the art should understand that the technical solutions described in the foregoing embodiments may still be modified, or Equivalent replacement of some or all of the technical features; and these modifications or substitutions do not detract from the essence of the corresponding technical solutions. The scope of the program.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention.

Claims

An intelligent temperature control device, the device comprising a temperature detecting device, a temperature collecting chip and a main control chip; wherein

The temperature detecting device is configured to detect temperature information of each of the different regions divided in the terminal;

The temperature collecting chip is configured to poll the temperature information of different regions detected by the collecting temperature detecting device, and convert the temperature information into a specific temperature value, and then send the temperature information to the main control chip;

The main control chip is configured to perform power consumption control on each functional module in the terminal according to the obtained temperature value.
The apparatus according to claim 1, wherein said temperature detecting means comprises, but is not limited to, a liquid crystal display LCD distributed to the terminal or a thermistor of the touch display member.
The device according to claim 1, wherein the temperature collecting chip is configured to poll the temperature information of the different regions of the terminal detected by the temperature detecting device through the temperature collecting interface;

The temperature acquisition interface includes, but is not limited to, an analog to digital conversion ADC interface.
The apparatus of claim 1, wherein the temperature acquisition chip is configured to transmit the temperature value to the master chip via a connection mode of the mobile industry processor interface MIPI and the inter-integrated circuit I2C.
The apparatus of claim 1, wherein the apparatus further comprises a memory configured to store functional module information corresponding to different areas of the terminal.
The device according to claim 1, wherein the main control chip is configured to: when the acquired temperature value is higher than a preset threshold, a function module in an area where the temperature value is higher than a preset threshold or an adjacent The function module performs power control.
The device according to claim 6, wherein the main control chip is further configured to: when the acquired temperature value is not higher than a preset threshold, stop function modules in an area where the temperature value is higher than a preset threshold or Its adjacent function modules perform power consumption control.
An intelligent temperature control method for dividing a terminal into multiple areas, the method further includes:

Detecting temperature information in different areas;

Polling to collect temperature information of different detected regions, and converting the temperature information into specific temperature values;

According to the obtained temperature value, power consumption control is performed on each functional module in the terminal.
The method according to claim 8, wherein the polling collecting the detected temperature information of different regions comprises: polling the temperature information of the different regions of the terminal detected by the temperature detecting device through the temperature collecting interface.
The method according to claim 8, wherein the method further comprises: transmitting the converted specific temperature value to the main control chip;

The sending the specific temperature value to the main control chip comprises: transmitting the temperature value to the main control chip through a connection manner of the MIPI and the internal integrated circuit I2C.
The method according to claim 8, wherein the controlling the power consumption of each circuit module in the terminal according to the acquired temperature value comprises: when the acquired temperature value is higher than a preset threshold, the temperature value is higher than the pre- The function module in the threshold area or its adjacent function module performs power consumption control.
The method of claim 11, wherein the controlling the power consumption of each circuit module in the terminal according to the obtained temperature value further comprises: stopping the temperature value when the acquired temperature value is not higher than a preset threshold The function module in the area above the preset threshold or its adjacent function module performs power consumption control.
An intelligent temperature control terminal comprising the intelligent temperature control device according to any one of claims 1 to 7.
A computer storage medium comprising a set of instructions that, when executed, cause at least one processor to perform the intelligent temperature control method of any one of claims 8 to 12.