WO2014173238A1 - 一种led灯泡光机模组 - Google Patents

一种led灯泡光机模组 Download PDF

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Publication number
WO2014173238A1
WO2014173238A1 PCT/CN2014/075242 CN2014075242W WO2014173238A1 WO 2014173238 A1 WO2014173238 A1 WO 2014173238A1 CN 2014075242 W CN2014075242 W CN 2014075242W WO 2014173238 A1 WO2014173238 A1 WO 2014173238A1
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WO
WIPO (PCT)
Prior art keywords
led
transparent
template
circular
circular substrate
Prior art date
Application number
PCT/CN2014/075242
Other languages
English (en)
French (fr)
Inventor
张继强
张哲源
Original Assignee
贵州光浦森光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201310140138.7A external-priority patent/CN103196064B/zh
Priority claimed from CN201310140136.8A external-priority patent/CN103236434B/zh
Application filed by 贵州光浦森光电有限公司 filed Critical 贵州光浦森光电有限公司
Publication of WO2014173238A1 publication Critical patent/WO2014173238A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED bulb optomechanical module, in particular to an LED bulb optomechanical module for constructing an LED bulb.
  • LED bulbs are LEDs that use LEDs as illuminators that can be used independently, interchangeably and interchangeably, and are non-destructible by non-destructive means. These technologies have laid the foundation for the establishment of LED lighting-centered lighting industry architecture, which has made LED bulbs (lighting sources), lamps and lighting control the basic concept of independent production and application of end products.
  • LED light bulb structural components with advanced concepts and easier standardization has far-reaching significance for large-scale promotion of LED lighting, especially as a light machine module for the core components of LED bulbs.
  • the conventional LED lighting technology is mounted on an aluminum-based PCB substrate or a ceramic-based PCB substrate with an LED chip, and the heat sink is connected to the back of the substrate. Since the substrate is a non-transparent material, LED illumination is currently one-sided unidirectional illumination.
  • the luminous efficiency depends on the internal quantum efficiency and the external quantum efficiency of the LED. The current internal quantum efficiency has exceeded 90%, and the lifting space is small, but the external quantum efficiency, that is, the light extraction efficiency is extremely low.
  • the LED chip emits light and the lower exit light can escape the LED chip, most of the light is refracted and propagated inside the chip, and finally converted into a chip in which heat remains. Since the current solution chip is placed on a non-transparent substrate, the outgoing light will also disappear in the mounting structure.
  • To improve the luminous efficiency of LEDs on the one hand, it is necessary to increase the light emitted from the front side of the chip, and on the other hand, it is necessary to make the light reflected toward the substrate and then pass through the chip to shoot from the front side, which is extremely difficult and has a poor effect. How to take an effective way to make this part of the light escape from the chip is the focus of current LED chip research.
  • An LED bulb optomechanical module comprising: a optomechanical template having a notch on both sides, an LED related component disposed on the optomechanical template, the LED related component comprising an LED chip
  • the group and related components and circuits are then covered with a transparent encapsulant and/or a transparent cover to expose only the associated pads on the LED-related components.
  • the optomechanical template of the LED bulb optomechanical module can also be set as a transparent substrate to form an LED bulb optomechanical module of the transparent substrate to improve the luminous efficiency of the LED. Since the optomechanical module of the present invention needs to be immersed in the transparent insulating thermal fluid when in use, the thermal conductivity requirements of the templating template and the transparent cover are lowered. Therefore, the present invention can select a transparent, lower-priced silica-based material to replace a conventional material having a higher thermal conductivity of transparent alumina to produce a transparent optomechanical template and a transparent cover.
  • the method for covering the LED-related components by using the transparent encapsulant and/or the transparent cover plate is: filling a small amount of transparent glue between the components on the LED-related components to make the LED
  • a transparent adhesive is formed between the surface of the chip and the transparent cover as little as possible, and is covered with a transparent cover having the same contour as the optical template.
  • the transparent cover is provided with an opening area for exposing the pad; or Fill a small amount of transparent adhesive between the components on the LED-related components, and then cover it with a transparent cover with a profile smaller than the template of the light machine. Then, cover the transparent cover with a transparent sealant to make the outline and light of the transparent sealant.
  • the machine template is flush, and the transparent cover is provided with an opening area for exposing the pad; or, the LED related component is directly coated with the transparent sealing glue, so that the contour of the transparent sealing glue is flush with the optical template, and the transparent plastic An open area is provided for exposing the pads.
  • the optomechanical template is a circular substrate, and two circular arc gaps are symmetrically arranged on both sides of the circular substrate, and the center of the circular arc gap is Outside the circular substrate Concentric circles of the portion;
  • the optical machine template is further provided with a circular hole for connecting with the pins of the electrical connector, the pads are located on the LED related components and located at the position of the circular hole, and the electrical connector is inserted The needle is inserted into the round hole and soldered to the pad.
  • the optomechanical template is a circular substrate, and the two circular arcs of the circular substrate are symmetrically cut off on both sides of the circular substrate to form two symmetry. a notch; the optical machine template is further provided with a circular hole with an alignment pin, the circular hole is used for the alignment connection with the electrical connector; the LED related component is disposed at the circular hole through the flexible switching circuit Wherein, the electrical connector is inserted into the circular hole and soldered to the pad on the flexible switching circuit 44.
  • the optomechanical template is a circular substrate, and two circular notches are provided on both sides of the circular substrate, and each notch is located along the circular substrate.
  • a chord of a circle is cut, and both ends of the chord are inclined outward by 120 degrees, and transition to a circle of a circular substrate through a circular arc;
  • the pad is located inside the notch of the circular substrate, and the pads are respectively disposed at The insides of the two notches are concentrated or placed inside one of the notches.
  • the diameter d G of the circular substrate is 11 mm or 16 mm; when the diameter d G of the circular substrate is 11
  • the center of the two arc notches is on a circle having a diameter of 13 mm (ie, the distance between the two centers), and the radius of the two arc notches is 3. 2 mm; when the diameter of the circle in which the circular substrate is located is 16 mm, two 5 ⁇
  • the radius of the circle of the circle is a diameter of 19 to the circle (that is, the distance between the two centers), the radius of the two arc notches is 3. 6mm.
  • the circular holes connected to the pins of the electrical connector are four, symmetrically distributed at equal intervals, and the pitch is 3. 5 mm, the center of the four circular holes is 2 mm away from the center of the circular substrate, and the centers of the four circular holes The distance from the two notches is equal.
  • the diameter d G of the circle where the circular substrate is located is 18 mm or 25 mm; when the diameter d G of the circle where the circular substrate is located is 18 mm, it is cut off.
  • the chord length of the two bows is 8. 2 mm, and the distance between the two strings is 16 mm; when the diameter d G of the circle of the circular substrate is 25, the length of the two bows to be cut is 9. 8 Let, the distance between the two strings is 23, the center of the circle is 2 mm away from the center of the circular substrate, and the center of the circular hole is equal to the distance between the two notches.
  • the circular substrate is located
  • the diameter de of the circle is 20mm, 38mm or 50mm, the length of the chord in the notch minus the outwardly inclined portion of the two ends is 10mm, the radius of the arc for transition is 1mm; the two corresponding to the two notches
  • the strings are parallel to each other; when the diameter d G of the circle where the circular substrate is located is 20 mm, the distance between the two strings is 15 mm; when the diameter of the circle where the circular substrate is located is 38 mm, the distance between the two strings is 33 mm When the diameter d G of the circle where the circular substrate is located is 50 mm, the distance between the two strings is 45.
  • the transparent cover is coated with a phosphor and coated with a protective layer; or the transparent cover is a transparent phosphor formed by a mold.
  • the transparent phosphor is prepared by mixing a fluorescent material and a transparent material in a weight ratio of 5 to 30:100.
  • the invention seals the LED related components between the optomechanical template and the transparent encapsulant or the transparent cover, the LED chip is close to the transparent cover, the transparent adhesive is less and the phosphor is transparent.
  • the outside of the cover plate can be away from the LED chip, so that the phosphor and the transparent adhesive are not easily aged, and the luminous efficiency of the LED is improved.
  • the notch on both sides of the optomechanical template is convenient for connecting external wires, and at the same time, it can work well in a liquid atmosphere.
  • the optomechanical module is installed in the inner cover of the LED bulb with transparent insulating thermal fluid, and is heated.
  • the transparent insulating thermal fluid can complete the unimpeded flow through the gap for thermal cycling, so that the optomechanical module of the invention can have excellent heat dissipation effect during operation, thereby improving the luminous efficiency of the LED.
  • the applicant of the present invention has repeatedly researched, tested and summarized, and has different gaps in shape and size for different size optical machine templates, so that it can achieve the best without affecting the arrangement space of LED related components.
  • the liquid flow effect in order to achieve the best heat dissipation.
  • the LED lighting realizes universal and interchangeable, and the optical machine module is sharply reduced to three types, a total of seven specific products, due to the optical module
  • the total amount of specifications is small, and it covers the lighting requirements of most lighting environments.
  • This enables the upstream and downstream LED and packaging companies to adjust the R&D and production focus to a limited number of optomechanical modules for scale and intensive Conditions for production can be reduced on a large scale
  • the manufacturing cost of LED lighting equipment has completely solved the fatal defect that traditional integrated LED lamps cannot be universally and interchangeably.
  • FIG. 1 is a schematic view showing the outline of a optomechanical module using a transparent cover having the same contour as that of the optomechanical template in Embodiment 1;
  • Figure 2 is a split view of the optomechanical module shown in Figure 1;
  • Embodiment 3 is an outline view of a optomechanical module using a transparent sealant in Embodiment 1;
  • FIG. 4 is a schematic structural view of a optomechanical module using a transparent cover having a profile smaller than a templating template; and FIG. 5 is a split view of the optomechanical module shown in FIG.
  • FIG. 6 is a schematic view showing the opening of the optomechanical template of Embodiment 1;
  • FIG. 7 is a schematic view showing the installation of the optomechanical template and the connector of Embodiment 1;
  • Embodiment 8 is a schematic structural view of an application of Embodiment 1;
  • Embodiment 9 is an outline view of a optomechanical module using a transparent sealant in Embodiment 2;
  • Figure 10 is a split view of the optomechanical module of the embodiment 2 using a transparent cover having the same contour as the optomechanical template;
  • Figure 11 is a schematic view showing the structure of a optomechanical module using a transparent cover having a profile smaller than that of a templating template
  • Figure 12 is a schematic view showing the installation of the optomechanical template and the connector of the second embodiment
  • Figure 13 is a schematic view showing the opening of the optomechanical template of Embodiment 2;
  • Figure 14 is a schematic view showing the application structure of Embodiment 2;
  • Figure 15 is an outline view of a optomechanical module using a transparent sealant in Embodiment 3;
  • Figure 16 is a split view of the optomechanical module of the embodiment 3 using a transparent cover having the same profile as the optomechanical template;
  • Figure 17 is a schematic view showing the structure of a optomechanical module using a transparent cover having a profile smaller than that of a templating template in Embodiment 3;
  • Figure 18 is a schematic view showing the opening of the optomechanical template of Embodiment 3.
  • 19 is a schematic structural view of an application of Embodiment 3; 20 is a schematic structural view of an LED light bulb assembled using the optomechanical module of the present invention;
  • Figure 21 is a schematic view showing the principle of light emission of a GaN-based LED according to Embodiment 4 of the present invention.
  • the markings in the drawing are: 3-heat-conductive bracket, 4-light machine module, 8-lens snap ring, 7-light distribution optical lens, 11-electric connector, 15-fixed end, 16-waterproof rubber ring, 31 - Reflective layer, 41- LED related components, 42-transparent cover, 43-optical template, 44-flexible transfer circuit, 45-transparent sealant, 61-bulb concave inner cover, 61.
  • 1-pressure relief Hole 61. 2 - Pressure relief film, 81- Inner snap ring, 105-Lamp fixing screw, 431- Counter pin.
  • Embodiment 1 An LED bulb optomechanical module for a small-sized LED bulb, comprising a optomechanical template 43 having a notch on both sides, and an LED-related component 41 disposed on the optomechanical template 43
  • the device 41 includes an LED chipset and associated components and circuitry, and then the LED-related component 41 is covered with a transparent encapsulant 45 and/or a transparent cover 42 to expose only the pads of the LED-related component 41.
  • the method for covering the LED-related component 41 by the transparent encapsulant 45 and/or the transparent cover 42 transparent cover plate is as follows: as shown in FIG. 1 and FIG. 2, a small amount of transparent glue is filled between the components on the LED-related component 41.
  • the transparent cover 42 is provided with an opening area for use. Or exposing the pad; or, as shown in FIGS. 4 and 5, a small amount of transparent glue is filled between the components on the LED-related component 41 to form a transparent adhesive as little as possible between the surface of the LED chip and the transparent cover, and then The transparent cover 42 having a smaller profile than the templating template 43 is overlaid thereon, and then the transparent encapsulant 45 is wrapped around the transparent cover 42 so that the outline of the transparent encapsulant 45 is flush with the illuminating template 43 on the transparent cover 42.
  • An opening area is provided for exposing the pad; or, as shown in FIG. 3, the transparent encapsulant 45 is directly coated on the LED-related component 41, so that the outline of the transparent encapsulant 45 is flush with the optomechanical template 43, transparent An opening area is provided on the glue 45 for exposing the welding
  • the transparent cover 42 is further coated with a phosphor and coated with a protective layer; or the transparent cover 42 is a transparent phosphor formed by a mold.
  • the transparent phosphor is prepared by mixing a fluorescent material and a transparent material in a weight ratio of 1:10.
  • the shape of the illuminating plate 43 is as shown in FIG. 6 , which is a circular substrate.
  • the two sides of the circular substrate are symmetrically provided with two inner arc notches, and the center of the arc notch is on the concentric circle outside the circular substrate.
  • the cutting mode is d e diameter
  • the symmetrical X axis is 1 ⁇ as the length
  • R is the radius
  • the chord length and the two sides of the cut circle form two circular notches of radius R.
  • the purpose of the notch is that when the optomechanical module is used for the liquid heat dissipation scheme, the heated transparent insulating thermal fluid can be thermally circulated from the gap; the optomechanical template 43 is further provided with a pin for the electrical connector 11 Connected circular holes; the pads are on the LED-related component 41 and located at the position of the circular hole, and the pins of the electrical connector 11 are inserted into the circular holes and soldered to the pads, as shown in FIG.
  • the circular holes are connected to the pins of the electrical connector 11 and are symmetrically distributed at equal intervals.
  • the pitch is 3. 5 mm.
  • the center of the four circular holes is 2 mm away from the center of the circular substrate, and the four circular holes are The center is equidistant from the two notches.
  • a circular hole having a diameter of 1.4 is symmetrically distributed at a pitch of 3.5 as a center in the X-axis of the tempering template 43.
  • the diameter of the circle where the circular substrate is located is 11 mm or 16 mm; when the diameter of the circle of the circular substrate is dc; when the diameter is 11 mm, the center of the two arc notches is on a circle having a diameter of 13 mm, and two arc gaps a radius of 3. 2mm; when the substrate where the circular diameter of a circle of de 16 mm, two notches of the center arc on a circle 19mm in diameter, the radii of the two arcs of notch 3. 6mm.
  • the electrical connector 11 passes through the thermal conductive bracket 3 and is bonded, and the pin of the electrical connector 11 is inserted into the circular hole of the optomechanical template 43 and the pad on the LED-related component 41 Welding, the LED bulb light machine module is provided with a concave inner cover 61, and the final LED bulb light machine module is suspended in the confined space between the heat conducting bracket 3 and the concave inner cover 61, and the light bulb of the LED bulb light machine module
  • the outer diameter of the template closely fits the inner diameter of the concave inner cover 61.
  • the venting of the inner surface of the recessed inner cover 61 is provided with a transparent insulating heat-conducting liquid (a recessed inner cover 61 is provided with a pressure relief hole 61. 1 and a pressure relief film for sealing 61. 2) , as shown in Figure 8.
  • Embodiment 2 An LED bulb optomechanical module for a medium-sized LED bulb, comprising a optomechanical template 43 having a notch on both sides, an LED-related component 41 disposed on the optomechanical template 43, and then transparent
  • the encapsulant 45 and/or the transparent cover 42 covers the LED-related component 41 to expose only the associated pads on the LED-related component 41.
  • the method for covering the LED-related component 41 by the transparent encapsulant 45 and/or the transparent cover 42 is: filling a small amount of transparent glue between the components on the LED-related component 41 to make the surface of the LED chip and the transparent cover
  • a transparent adhesive is formed between the plates 42 as little as possible, and is covered with a transparent cover 42 having the same contour as the optical template 43.
  • the transparent cover 42 is provided with an opening area for exposing the pads, as shown in FIG.
  • a small amount of transparent glue is filled between the components of the LED-related component 41 to form a transparent glue between the surface of the LED chip and the transparent cover 42 as little as possible, and a transparent cover having a smaller profile than the optical template 43 is used.
  • the plate 42 is covered thereon, and then a transparent sealant 45 is wrapped around the transparent cover 42 so that the outline of the transparent seal 45 is flush with the templating template 43.
  • the transparent cover 42 is provided with an opening area for exposing the solder.
  • the disk as shown in FIG. 11; or, as shown in FIG.
  • the transparent sealing adhesive 45 is directly coated on the LED-related component 41, so that the outline of the transparent sealing compound 45 is flush with the optomechanical template 43, the transparent sealing adhesive 45 An open area is provided for exposing the pads.
  • the transparent cover 42 is further coated with a phosphor and coated with a protective layer; or the transparent cover 42 is a transparent phosphor formed by a mold.
  • the transparent phosphor is prepared by mixing a fluorescent material and a transparent material in a weight ratio of 1:10.
  • the illuminator template 43 is a circular substrate. As shown in FIG. 13 , the two circular arcs of the circle in which the circular substrate is located are symmetrically cut out on both sides of the circular substrate to form two symmetrical notches; There is a circular hole with an alignment pin, and the circular hole is used for the alignment connection with the electrical connector 11; the diameter is symmetrical with respect to the X-axis, which is the chord length, and the two sides of the cut circle form a gap.
  • the purpose of the notch is that when the optomechanical module is used in a liquid heat dissipation scheme, the heated transparent insulating thermal fluid can be thermally circulated from the notch, see FIG.
  • the center is rounded, and the diameter 8 is rounded, and the alignment pin 431 of the electrical connector 11 is arranged on the circle, as shown in FIG. 13; the flexible switching circuit 44 is associated with the LED.
  • Component 41 is soldered to the joint.
  • the circular base plate where d e is the diameter of a circle 18mm or 25mm; when the diameter of the circle where the circular base plate 4 is 18mm, the chord length of two arcuate cut away to 8.
  • the diameter of the circular hole is 8mm, the center of the circle is offset from the center of the circular substrate 2, and the distance between the center of the circular hole and the two notches is equal, that is, the X-axis of the optomechanical template 43 is 2
  • an 8 mm diameter circle is opened, and the alignment pin 431 of the electrical connector 11 is provided on the circle.
  • the LED-related component 41 is disposed at the location of the circular hole through the flexible switching circuit 44, and the electrical connector 11 is inserted into the circular hole and soldered to the pad, as shown in FIG.
  • the electrical connector 11 is fixed on the heat conducting bracket 3 through the fixed end 15, and the electrical connector 11 is inserted into the circular hole with the alignment pin of the optomechanical template 43 and the flexible switching circuit 44
  • the soldering on the upper surface of the LED bulb is provided with a concave inner cover 61.
  • the final LED light bulb module is suspended in a confined space between the heat conducting bracket 3 and the concave inner cover 61.
  • the outer diameter of the set of optomechanical templates 43 closely fits the inner diameter of the concave inner cover 61.
  • the venting of the inner surface of the recessed inner cover 61 is provided with a transparent insulating heat transfer liquid (a recessed inner cover 61 is provided with a pressure relief hole 61. 1 and a pressure relief film for sealing 61.2) , as shown in Figure 14 and Figure 20.
  • Embodiment 3 An LED bulb optomechanical module includes a optomechanical template 43 having a notch on both sides, an LED related component 41 is disposed on the optomechanical template 43, and then a transparent encapsulant 45 and/or a transparent cover is used.
  • the transparent cover covers the LED-related component 41, and only the associated pads of the LED-related component 41 are exposed.
  • the method for covering the LED-related component 41 by the transparent encapsulant 45 and/or the transparent cover 42 transparent cover is: filling a small amount of transparent glue between the components on the LED-related component 41 to make the surface of the LED chip and the transparent cover A transparent adhesive is formed between the plates 42 as little as possible, and is covered with a transparent cover 42 having the same contour as the optical template 43.
  • the transparent cover 42 is provided with an opening area for exposing the pads, as shown in FIG.
  • a small amount of transparent adhesive is placed between the components of the LED-related component 41 to form a transparent adhesive between the surface of the LED chip and the transparent cover 42 as little as possible, and a transparent cover having a smaller profile than the optical template 43 is used.
  • the plate 42 is covered thereon, and then a transparent sealant 45 is wrapped around the transparent cover 42 so that the outline of the transparent sealant 45 is flush with the templating template 43.
  • the transparent cover 42 is provided with an opening area for exposing the solder.
  • the disk is as shown in FIG.
  • the transparent sealing compound 45 is directly coated on the LED-related component 41, so that the outline of the transparent sealing compound 45 is flush with the illuminating template 43, and the transparent adhesive 45 is provided with an opening area. Yu Lu Pads and fixed holes 15 as shown in FIG.
  • the illuminating plate template 43 is a circular substrate, and two circular notches are provided on both sides of the circular substrate, and each notch is cut along a string of a circle in which the circular substrate is located, and the Both ends of the string are tilted outward It is inclined by 120 degrees and transitions through a circular arc to the circle where the circular substrate is located.
  • the notch is that when the optomechanical module is used in a liquid heat dissipation scheme, the heated transparent insulating thermal fluid can be thermally circulated from the gap.
  • the diameter d G of the circle in which the circular substrate is located is 20 mm, 38 mm or 50 mm, and the length of the chord in the notch minus the outwardly inclined portion of the both ends is 10 mm, and the radius of the arc for transition 1mm; the two chords corresponding to the two notches are parallel to each other; when the diameter d e of the circle where the circular substrate is located is 20 mm, the distance between the two chords is 15; when the diameter of the circle where the circular substrate is located d e When it is 38mm, the distance between the two strings is 33mm; when the diameter d e of the circle where the circular substrate is located is 50mm, the distance between the two strings is 45.
  • the pads are located inside the notch of the circular substrate, and the pads are respectively disposed inside the two notches or concentrated inside one of the
  • the transparent cover 42 is further coated with a phosphor and coated with a protective layer; or the transparent cover 42 is a transparent phosphor formed by a mold.
  • the transparent phosphor is prepared by mixing a fluorescent material and a transparent material by a ratio of 1:10; the optical template 43 is further provided with a fixing hole for fixing.
  • the number of fixing holes is two, two fixing holes on the circular center of the circular symmetry of the substrate, and the distance between the two fixing holes d G -6, diameter of the fixing holes is 2. 2mm; two The connection of the fixing holes is orthogonal to the line connecting the centers of the two notches; when c ⁇ SOmm, a fixing hole is opened on one side, as shown in Fig. 18.
  • the heat conducting bracket 3 is provided with an opening, the connector 11 is inserted into the opening and fixed on the heat conducting bracket 3 through the fixing end 15, and the electrical connector 11 passes through the flexible switching circuit 44.
  • the pad is soldered to the LED-related component 41.
  • the LED bulb module is disposed in a sealed space between the heat-conducting bracket 3 and the concave inner cover 61.
  • the concave inner cover 61 is provided with a step, and the LED bulb is optically molded. The group rests on the step and is fixed to the step by the outer edge of the illuminator template, and the outer diameter of the optomechanical template of the LED bulb illuminator module closely fits the inner diameter of the concave inner cover 61.
  • the connector is located outside the concave inner cover 61, which is connected to the pad of the LED-related component 41 in the concave inner cover 61 through the flexible switching circuit 44, and finally in the concave
  • the inside of the inner cover 61 is filled with a transparent insulating heat transfer liquid (the inner cover 61 is provided with a pressure relief hole 61. 1 and a pressure relief film for sealing 61.2), thus forming a core of the LED light bulb.
  • Heart structure as shown in Figure 19.
  • a light distribution optical lens 7 may be disposed outside the concave inner cover 61.
  • the light distribution optical lens 7 is fixed to the heat conduction bracket 3 through the inner snap ring 81 and the lens retaining ring 8. on.
  • Example 4 The optomechanical template of any of the LED bulb illuminator modules of Embodiments 1 to 3 is replaced by a transparent substrate, which can realize double-sided illuminating. Taking a GaN-based LED as an example, the working principle is as shown in FIG. 21.
  • the following seven specifications of the LED light machine module are realized, and the seven specifications of the light machine module can meet most of the lighting requirements:

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED灯泡光机模组，包括一个两侧设有缺口的光机模板（43），光机模板（43）上设置LED相关元器件（41），然后使用透明封胶（45）和/或透明盖板（42）对LED相关元器件（41）进行覆盖，仅露出LED相关元器件（41）上的关连焊盘。该光机模组通用型强、规格少、便于标准化和规模化制作，使LED灯泡更易大规模化和标准化制作。

Description

一种 LED灯泡光机模组
技术领域
本发明涉及一种 LED灯泡光机模组， 特别是一种用于构建 LED灯泡的 LED 灯泡光机模组。
背景技术
申 请 号 为 201210253590. X 、 201210253702. 1 、 201210253639. 1 、 201210253844. 8、 201210255564、 201110024636. 6 等中国专利申请公开了多个 结构方案、可通用和互换的 LED灯泡， 上述及相关专利描述的 LED灯泡， 是采用 LED作为发光体， 可以独立使用、 可互换和更换， 用非破坏性手段不可拆分的光 源结构。这些技术为建立以 LED灯泡为中心的照明产业架构， 使 LED灯泡（照明 光源）、灯具、照明控制成为独立生产、应用的终端产品的基本理念奠定了基础。 进一步创造理念先进、更易标准化的 LED灯泡结构部件对于大规模推广 LED照明 意义深远， 尤其是作为 LED灯泡核心组件的光机模组。 而且传统的 LED照明技术以 LED芯片贴装在铝基 PCB基板或陶瓷基 PCB基板 上， 基板背部连接散热器。 由于基板为非透明材料， 目前 LED照明为单面单向发 光。以 GaN基的 LED结构为例，发光效率取决于 LED的内量子效率和外量子效率， 当前内量子效率已超过 90%， 提升空间较少， 但外量子效率， 也就是出光效率却 极低。虽然 LED芯片的上出射光和下出射光能逃逸出 LED芯片，但是绝大部分光 在芯片内部折射传播，最终转变成热量留存的芯片中。 由于现行方案芯片在非透 明基板贴装布置， 下出射光也将消失在贴装结构中。提高 LED发光效率， 一方面 要增加芯片正面出射光，另一方面要让射向基板的光反射再穿越芯片从正面射出， 难度极大， 效果也差。 如何采取有效的方式使这部分光逃逸出芯片是当前 LED 芯片的研究的重点。 采用在蓝宝石衬底上粗糙化、 衬底微图形化、 光栅衍射、 填 充光子晶体材料、芯片倒装等方案是当前提高芯片出光效率的主要措施，这些综 合措施的利用在当前能使芯片达到约 30%的出光率， 70%的能量在光线的内部折 射传播中最终变成了热量而反过来危及芯片的安全。在单面单向贴装的 LED照明 结构下， 要大幅度提高芯片发光效率难度较大，提高 LED照明的放光效率需要从 芯片的布置结构加以调整。
发明内容
本发明的目的在于，提供一种 LED灯泡光机模组。它可为 LED灯泡提供通用 型强、规格少、便于标准化和规模化制作的光机模组， 使 LED灯泡的更易大规模 化和标准化制作。
本发明的技术方案： 一种 LED灯泡光机模组， 其特点是： 包括一个两侧设有 缺口的光机模板， 光机模板上设置 LED相关元器件， 所述 LED相关元器件包括 LED芯片组和相关元器件及电路， 然后使用透明封胶和 /或透明盖板对 LED相关 元器件进行覆盖， 仅露出 LED相关元器件上的关连焊盘。
还可将上述 LED灯泡光机模组的光机模板设置为透明基板，构成透明基板的 LED灯泡光机模组， 以提高 LED的发光效率。 由于本发明的光机模组当使用时是 需要浸置于透明绝缘导热液中的，对光机模板和透明盖板的材质导热性能要求降 低。因此本发明可选择透明度更好，价格更低的氧化硅类材料来替代传统的导热 性更高的透明氧化铝等材料来生产透明的光机模板和透明盖板。
前述的 LED灯泡光机模组中， 所述使用透明封胶和 /或透明盖板对 LED相关 元器件进行覆盖的方法分别是：在 LED相关元器件上元件间填充少许透明胶找平， 使 LED芯片表面与透明盖板之间尽可能少地形成透明胶，再采用轮廓与光机模板 相同的透明盖板加盖其上， 透明盖板上设有开口区域， 用于露出焊盘； 或者， 在 LED相关元器件上元件间填充少许透明胶找平， 再采用轮廓小于光机模板的透明 盖板加盖其上， 然后在透明盖板周围包覆透明封胶，使透明封胶的轮廓与光机模 板齐平， 透明盖板上设有开口区域， 用于露出焊盘； 或者， 在 LED相关元器件上 直接包覆透明封胶，使透明封胶的轮廓与光机模板齐平，透明胶上设有开口区域， 用于露出焊盘。
前述的 LED灯泡光机模组中，对于小尺寸的光机模板，所述光机模板为圆形 基板， 圆形基板的两侧对称设有两个内圆弧缺口， 圆弧缺口的圆心在圆形基板外 部的同心圆上； 所述光机模板上还设有用于与电气接插件的插针相连的圆孔，所 述焊盘在 LED相关元器件上并位于圆孔所在处，电气接插件的插针插入圆孔后与 焊盘相焊接。
前述的 LED灯泡光机模组中，对于中型尺寸的光机模板，所述光机模板为圆 形基板， 圆形基板两侧对称地切除圆形基板所在圆的两个弓形， 形成两个对称缺 口； 所述光机模板上还设有带对位销的圆孔， 圆孔用于与电气接插件对位连接； 所述 LED相关元器件通过柔性转接电路将焊盘设置于圆孔所在处，所述电气接插 件插入圆孔后与柔性转接电路 44上的焊盘相焊接。
前述的 LED灯泡光机模组中，对于较大型尺寸的光机模板，所述光机模板为 圆形基板， 圆形基板的两侧设有两个对称缺口，每个缺口沿圆形基板所在圆的一 条弦切割而成的， 而且所述弦两端向外倾斜 120度， 并通过圆弧过渡到圆形基板 所在圆； 所述焊盘位于圆形基板的缺口内侧，焊盘分别设在两个缺口内侧或集中 设在其中一个缺口内侧。
前述的 LED灯泡光机模组中，对于小尺寸的光机模板，所述圆形基板所在圆 的直径 dG为 11 mm或 16mm; 当圆形基板所在圆的直径 dG为 11讓时， 两个圆弧 缺口的圆心在直径为 13mm 的圆上 （即两圆心的间距）， 两个圆弧缺口的半径为 3. 2mm; 当圆形基板所在圆的直径 de为 16 mm时， 两个圆弧缺口的圆心在直径为 19讓的圆上 （即两圆心的间距）， 两个圆弧缺口的半径为 3. 6mm。 所述的与电气 接插件的插针相连的圆孔为 4个， 等间距对称分布， 间距 3. 5mm， 4个圆孔的中 心在偏离圆形基板圆心 2mm处， 且 4个圆孔的中心与两个缺口的距离相等。
前述的 LED灯泡光机模组中，对于中型尺寸的光机模板，所述圆形基板所在 圆的直径 dG为 18mm或 25mm; 当圆形基板所在圆的直径 dG为 18mm时，被切除的 两个弓形的弦长为 8. 2mm，两条弦之间的距离为 16mm; 当圆形基板所在圆的直径 dG为 25讓时， 被切除的两个弓形的弦长为 9. 8讓， 两条弦之间的距离为 23讓， 其圆心在偏离圆形基板圆心 2mm处， 且圆孔中心与两个缺口的距离相等。
前述的 LED灯泡光机模组中，对于较大尺寸的光机模板，所述圆形基板所在 圆的直径 de为 20mm、 38mm或 50mm， 所述缺口中的弦长减去两端向外倾斜的部 分后长度为 10mm， 过渡用的圆弧的半径为 1mm; 两个缺口所对应的两条弦相互平 行； 当圆形基板所在圆的直径 dG为 20mm时， 两条弦之间的距离为 15mm; 当圆 形基板所在圆的直径 de为 38mm时， 两条弦之间的距离为 33mm; 当圆形基板所 在圆的直径 dG为 50mm时， 两条弦之间的距离为 45讓。
前述的 LED灯泡光机模组中，所述透明盖板上还涂敷有荧光粉并加涂保护层； 或者所述透明盖板外为模具成型的透明荧光体。透明荧光体为荧光材料与透明材 料按重量比为 5~30： 100配制制成。
前述的 LED灯泡光机模组中，所述光机模板上还设有用于固定的固定孔，所 述固定孔的数量为两个，两个固定孔关于圆形基板的圆形中心对称， 且两个固定 孔之间的距离为 4-6， 固定孔的直径为 2. 2mm; 两个固定孔的连线， 与两个缺口 中心的连线相互正交； 当 de=20mm时， 单边开一个固定孔。
与现有技术相比，本发明通过将 LED相关元器件密封在光机模板和透明封胶 或透明盖板之间， LED芯片紧挨透明盖板， 透明胶较少且将荧光粉设在透明盖板 外可远离 LED芯片， 这样荧光粉和透明胶不易老化， 提高了 LED的发光效率。而 且光机模板上两侧的缺口设计，便于连接外部导线， 同时使其能很好的在液体氛 围中工作，光机模组安装在 LED灯泡带透明绝缘导热液的内罩中后， 受热的透明 绝缘导热液可以穿过缺口完成畅通的流动以便进行热循环，这样就使本发明的光 机模组在工作时能具有极优的散热效果， 从而提高了 LED的发光效率。而且本发 明的申请人经过反复研究、试验和总结，对于不同尺寸的光机模板开设形状大小 均不同的缺口， 使其在不影响 LED相关元器件的布置空间的情况下，可以达到最 佳的液态流动效果，进而实现最好的散热效果。更为重要的是 LED照明采用前述 灯泡方案后， LED照明实现了通用和互换， 而其中的光机模组锐减集中到 3种类 型， 共计 7个具体产品上， 由于光机模组的规格总量少， 且覆盖了大多数照明环 境的用灯要求，这样就具备了让 LED中上游企业和封装企业将研发和生产重心调 整到有限规格品种的光机模组上来进行规模化和集约化生产的条件，可大规模减 少 LED照明设备制造成本，彻底解决了传统一体式 LED灯无法通用和互换的致命 缺陷。
附图说明
图 1是实施例 1中使用轮廓与光机模板相同的透明盖板的光机模组的外形示 意图；
图 2是图 1所示的光机模组的拆分图；
图 3是实施例 1使用透明封胶的光机模组外形图；
图 4是实施例 1中使用轮廓小于光机模板的透明盖板的光机模组结构示意图； 图 5是图 4所示的光机模组的拆分图；
图 6是实施例 1的光机模板开孔示意图；
图 7是实施例 1的光机模板与接插件的安装示意图；
图 8是实施例 1的应用结构示意图；
图 9是实施例 2使用透明封胶的光机模组外形图；
图 10是实施例 2中使用轮廓与光机模板相同的透明盖板的光机模组的拆分 图；
图 11是实施例 2中使用轮廓小于光机模板的透明盖板的光机模组结构示意 图；
图 12是实施例 2的光机模板与接插件的安装示意图；
图 13是实施例 2的光机模板的开孔示意图；
图 14是实施例 2的应用结构示意图；
图 15是实施例 3使用透明封胶的光机模组外形图；
图 16是实施例 3中使用轮廓与光机模板相同的透明盖板的光机模组的拆分 图；
图 17是实施例 3中使用轮廓小于光机模板的透明盖板的光机模组结构示意 图；
图 18是实施例 3的光机模板开孔示意图；
图 19是实施例 3的应用结构示意图； 图 20是使用本发明的光机模组组建的 LED灯泡结构示意图;
图 21是本发明实施例 4的 GaN基 LED的发光原理示意图。
附图中的标记为： 3-导热支架， 4-光机模组， 8-透镜卡环， 7-配光光学透 镜， 11-电气接插件， 15-固定端， 16-防水胶圈， 31-反光层， 41- LED相关元器 件， 42-透明盖板， 43-光机模板， 44-柔性转接电路， 45-透明封胶， 61-灯泡凹 形内罩， 61. 1-卸压孔， 61. 2 -卸压膜， 81-内卡环， 105-灯泡固定螺钉， 431- 对位销。
具体实施方式
下面结合附图和实施例对本发明作进一步的说明，但并不作为对本发明限制 的依据。
实施例 1 : 一种用于小尺寸 LED灯泡的 LED灯泡光机模组， 包括一个两侧设 有缺口的光机模板 43，光机模板 43上设置 LED相关元器件 41，所述 LED相关元 器件 41包括 LED芯片组和相关元器件及电路， 然后使用透明封胶 45和 /或透明 盖板 42， 对 LED相关元器件 41进行覆盖， 仅露出 LED相关元器件 41的焊盘。 所述透明封胶 45和 /或透明盖板 42透明盖板对 LED相关元器件 41进行覆盖的方 法有：如图 1和图 2所示，在 LED相关元器件 41上元件间填充少许透明胶找平， 使 LED芯片表面与透明盖板之间尽可能少地形成透明胶，再采用轮廓与光机模板 43相同的透明盖板 42加盖其上，透明盖板 42上设有开口区域，用于露出焊盘； 或者， 如图 4和 5所示， 在 LED相关元器件 41上元件间填充少许透明胶找平， 使 LED芯片表面与透明盖板之间尽可能少地形成透明胶，再采用轮廓小于光机模 板 43的透明盖板 42加盖其上， 然后在透明盖板 42周围包覆透明封胶 45，使透 明封胶 45的轮廓与光机模板 43齐平， 透明盖板 42上设有开口区域， 用于露出 焊盘； 或者， 如图 3所示， 在 LED相关元器件 41上直接包覆透明封胶 45，使透 明封胶 45的轮廓与光机模板 43齐平， 透明胶 45上设有开口区域， 用于露出焊 所述透明盖板 42 上还涂敷有荧光粉并加涂保护层； 或者所述透明盖板 42 为模具成型的透明荧光体。 透明荧光体为荧光材料与透明材料按重量比为 1 : 10 配制制成。
所述光机模板 43的形状如图 6所示， 为圆形基板， 圆形基板的两侧对称设 有两个内圆弧缺口， 圆弧缺口的圆心在圆形基板外部的同心圆上，其切割方式时 以 de直径， 对称 X轴以 1^为长度， R为半径， 为弦长， 切下圆的两边形成两个 半径为 R的圆缺口。缺口的用途为当光机模组用于液态散热方案时，被加热的透 明绝缘导热液可从缺口处进行热循环； 所述光机模板 43上还设有用于与电气接 插件 11的插针相连的圆孔;所述焊盘在 LED相关元器件 41上并位于圆孔所在处， 电气接插件 11的插针插入圆孔后与焊盘相焊接， 如图 7所示。 所述的与电气接 插件 11的插针相连的圆孔为 4个， 等间距对称分布， 间距 3. 5mm， 4个圆孔的中 心在偏离圆形基板圆心 2mm处， 且 4个圆孔的中心与两个缺口的距离相等。即在 光机模板 43 的 X轴正 2讓处为中心， 以 3. 5为间距， 对称分布 4个直径 1. 4讓 的圆孔。 所述圆形基板所在圆的直径 de为 11 mm或 16mm; 当圆形基板所在圆的 直径 dc;为 11mm时， 两个圆弧缺口的圆心在直径为 13mm的圆上， 两个圆弧缺口 的半径为 3. 2mm; 当圆形基板所在圆的直径 de为 16 mm时， 两个圆弧缺口的圆 心在直径为 19mm的圆上， 两个圆弧缺口的半径为 3. 6mm。
本发明的 LED灯泡光机模组的应用：电气接插件 11穿过导热支架 3并粘接， 电气接插件 11的插针插入光机模板 43的圆孔与 LED相关元器件 41上的焊盘焊 接， LED灯泡光机模组外设有凹形内罩 61，最终 LED灯泡光机模组悬空于导热支 架 3和凹形内罩 61之间密闭空间内， LED灯泡光机模组的光机模板外径与凹形 内罩 61的内径紧密贴合。 这样就构成了一个 LED灯泡的核心结构， 最后在凹形 内罩 61内注入透明绝缘导热液 （凹形内罩 61上设有泄压孔 61. 1和密封用的泄 压膜 61. 2)， 如图 8所示。
实施例 2: —种用于中型尺寸 LED灯泡的 LED灯泡光机模组， 包括一个两侧 设有缺口的光机模板 43，光机模板 43上设置 LED相关元器件 41，然后使用透明 封胶 45和 /或透明盖板 42， 对 LED相关元器件 41进行覆盖， 仅露出 LED相关元 器件 41上的关连焊盘。所述透明封胶 45和 /或透明盖板 42透明盖板对 LED相关 元器件 41进行覆盖的方法是：在 LED相关元器件 41上元件间填充少许透明胶找 平， 使 LED芯片表面与透明盖板 42之间尽可能少地形成透明胶， 再采用轮廓与 光机模板 43相同的透明盖板 42加盖其上， 透明盖板 42上设有开口区域， 用于 露出焊盘， 如图 10所示； 或者， 在 LED相关元器件 41上元件间填充少许透明胶 找平， 使 LED芯片表面与透明盖板 42之间尽可能少地形成透明胶， 再采用轮廓 小于光机模板 43的透明盖板 42加盖其上， 然后在透明盖板 42周围包覆透明封 胶 45，使透明封胶 45的轮廓与光机模板 43齐平，透明盖板 42上设有开口区域， 用于露出焊盘， 如图 11所示； 或者， 如图 9所示， 在 LED相关元器件 41上直接 包覆透明封胶 45，使透明封胶 45的轮廓与光机模板 43齐平， 透明封胶 45上设 有开口区域，用于露出焊盘。所述透明盖板 42上还涂敷有荧光粉并加涂保护层； 或者所述透明盖板 42为模具成型的透明荧光体。 透明荧光体为荧光材料与透明 材料按重量比为 1： 10配制制成。
所述光机模板 43为圆形基板， 如图 13所示， 圆形基板两侧对称地切除圆形 基板所在圆的两个弓形， 形成两个对称缺口； 所述光机模板 43上还设有带对位 销的圆孔， 圆孔用于与电气接插件 11对位连接； 以 直径， 对称 X轴以 为长 度， 为弦长， 切下圆的两边形成缺口。 缺口的用途为当光机模组用于液态散热 方案时， 被加热的透明绝缘导热液可从缺口处进行热循环， 参见图 14。 在光机 模板 43 的 X轴正 2讓处为圆心， 开出 8讓直径圆， 圆上设有电气接插件 11的 对位销 431， 如图 13所示； 柔性转接电路 44与 LED相关元器件 41接点焊接。 所述圆形基板所在圆的直径 de为 18mm或 25mm; 当圆形基板所在圆的直径 4为 18mm时， 被切除的两个弓形的弦长为 8. 2mm， 两条弦之间的距离为 16讓； 当圆 形基板所在圆的直径 dG为 25mm时， 被切除的两个弓形的弦长为 9. 8mm, 两条弦 之间的距离为 23mm; 所述的带对位销的圆孔直径为 8mm，其圆心在偏离圆形基板 圆心 2讓处，且圆孔中心与两个缺口的距离相等，即在光机模板 43 的 X轴正 2讓 处为圆心， 开出 8mm直径圆， 圆上设有电气接插件 11 的对位销 431。 所述 LED 相关元器件 41通过柔性转接电路 44将焊盘设置于圆孔所在处，所述电气接插件 11插入圆孔后与焊盘相焊接， 如图 12所示。
本发明的 LED灯泡光机模组的应用：电气接插件 11通过固定端 15固定在导 热支架 3上，电气接插件 11插入光机模板 43的带对位销的圆孔与柔性转接电路 44上的焊盘焊接， LED灯泡光机模组外设有凹形内罩 61， 最终 LED灯泡光机模 组悬空于导热支架 3和凹形内罩 61之间密闭空间内， LED灯泡光机模组的光机 模板 43外径与凹形内罩 61的内径紧密贴合。这样就构成了一个 LED灯泡的核心 结构， 最后在凹形内罩 61 内注入透明绝缘导热液 （凹形内罩 61上设有泄压孔 61. 1和密封用的泄压膜 61. 2)， 如图 14和图 20所示。
实施例 3: —种 LED灯泡光机模组， 包括一个两侧设有缺口的光机模板 43， 光机模板 43上设置 LED相关元器件 41，然后使用透明封胶 45和 /或透明盖板 42 透明盖板，对 LED相关元器件 41进行覆盖，仅露出 LED相关元器件 41之关连焊 盘。所述透明封胶 45和 /或透明盖板 42透明盖板对 LED相关元器件 41进行覆盖 的方法是： 在 LED相关元器件 41上元件间填充少许透明胶找平， 使 LED芯片表 面与透明盖板 42之间尽可能少地形成透明胶，再采用轮廓与光机模板 43相同的 透明盖板 42加盖其上， 透明盖板 42上设有开口区域， 用于露出焊盘， 如图 16 所示； 或者， 在 LED相关元器件 41上元件间填充少许透明胶找平， 使 LED芯片 表面与透明盖板 42 之间尽可能少地形成透明胶， 再采用轮廓小于光机模板 43 的透明盖板 42加盖其上， 然后在透明盖板 42周围包覆透明封胶 45，使透明封胶 45的轮廓与光机模板 43齐平， 透明盖板 42上设有开口区域， 用于露出焊盘， 如图 17所示； 或者， 在 LED相关元器件 41上直接包覆透明封胶 45，使透明封胶 45的轮廓与光机模板 43齐平， 透明胶 45上设有开口区域， 用于露出焊盘和固 定孔， 如图 15。
所述光机模板 43如图 18所示， 为圆形基板， 圆形基板的两侧设有两个对称 缺口，每个缺口沿圆形基板所在圆的一条弦切割而成的， 而且所述弦两端向外倾 斜 120度， 并通过圆弧过渡到圆形基板所在圆。 它的形状是， 以 直径， 对称 X 轴以 为长度， we为弦长， 在弦长 We端向外倾斜 120度， 以 R=1. 0mm圆弧向直 径 过度， 切下圆的两边形成缺口。 缺口的用途为当光机模组用于液态散热方 案时， 被加热的透明绝缘导热液可从缺口处进行热循环。 如图 18， 所述圆形基 板所在圆的直径 dG为 20mm、 38mm或 50mm， 所述缺口中的弦长减去两端向外倾斜 的部分后长度为 10mm， 过渡用的圆弧的半径为 1mm; 两个缺口所对应的两条弦相 互平行； 当圆形基板所在圆的直径 de为 20mm时， 两条弦之间的距离为 15讓； 当 圆形基板所在圆的直径 de为 38mm时， 两条弦之间的距离为 33mm; 当圆形基板所 在圆的直径 de为 50mm时， 两条弦之间的距离为 45讓。所述焊盘位于圆形基板的 缺口内侧，各个焊盘分别设在两个缺口内侧或集中设在其中一个缺口内侧，接插 件 11通过柔性转接电路 44与焊盘相连。
所述透明盖板 42 上还涂敷有荧光粉并加涂保护层； 或者所述透明盖板 42 为模具成型的透明荧光体。 透明荧光体为荧光材料与透明材料按重量比为 1 : 10 配制制成； 所述光机模板 43上还设有用于固定的固定孔。 所述固定孔的数量为 两个， 两个固定孔基于圆形基板的圆形中心对称， 且两个固定孔之间的距离为 dG-6, 固定孔的直径为 2. 2mm; 两个固定孔的连线， 与两个缺口中心的连线相互 正交； 当 c^SOmm时， 单边开一个固定孔， 如图 18。
本发明的 LED灯泡光机模组的应用： 导热支架 3的上设有开孔， 接插件 11 插入开孔并通过固定端 15固定在导热支架 3上，电气接插件 11通过柔性转接电 路 44与 LED相关元器件 41上的焊盘焊接， LED灯泡光机模组设于导热支架 3和 凹形内罩 61之间密闭空间内， 凹形内罩 61上设有台阶， LED灯泡光机模组搁置 在台阶上， 并用通过光机模板外沿与台阶固定， 且 LED灯泡光机模组的光机模板 外径与凹形内罩 61的内径紧密贴合。 不同于实施例 1和 2的地方在于， 接插件 位于凹形内罩 61之外， 它通过柔性转接电路 44与凹形内罩 61内的 LED相关元 器件 41的焊盘相连， 最后在凹形内罩 61 内注入透明绝缘导热液 （凹形内罩 61 上设有泄压孔 61. 1和密封用的泄压膜 61. 2)， 这样就构成了一个 LED灯泡的核 心结构， 如图 19所示。
图 20是本发明在一种灯泡中的应用图例，在凹形内罩 61外还可设置配光光 学透镜 7， 配光光学透镜 7通过内卡环 81和透镜卡环 8固定在导热支架 3上。
实施例 4。将实施例 1至 3中任一 LED灯泡光机模组的光机模板替换为透明 基板， 可以实现双面出光， 以 GaN基 LED为例， 其工作原理如图 21所示。
以上四个实施例， 实现了以下 7种规格的 LED光机模组，这 7种规格的光机 模组能够满足大部分的照明要求：
模板类型 dG/mm lG/mm Wc/mm he/mm 备注
11 13 3. 2
实施例 1
16 19 3. 6
0. 6—3. 0
18 16 8. 2
实施例 2 U子度 1乂作多
25 23 9. 8
考， 不做强制
20 15 10. 0
要求）
实施例 3 38 33 10. 0
50 45 10. 0

Claims

权 利 要 求 书
1、 一种 LED灯泡光机模组， 其特征在于： 包括一个两侧设有缺口的光机模 板（43)，光机模板（43)上设置 LED相关元器件（41)，所述 LED相关元器件（41) 包括 LED芯片组和相关元器件及电路， 所述 LED相关元器件（41)上使用透明封 胶 （45) 和 /或透明盖板 （42) 对进行覆盖， 仅露出 LED相关元器件 （41) 上的 关连焊盘。
2、 一种透明基板的 LED灯泡光机模组， 其特征在于： 包括一个两侧设有缺 口的光机模板 （43)， 所述光机模板 （43) 为透明基板， 且光机模板 （43) 上设 置 LED相关元器件 （41)， 所述 LED相关元器件 （41) 包括 LED芯片组和相关元 器件及电路， 所述上 LED相关元器件 （41) 使用透明封胶 （45) 和 /或透明盖板
(42) 对进行覆盖， 仅露出 LED相关元器件 （41) 上的关连焊盘。
3、 根据权利要求 1或 2所述的 LED灯泡光机模组， 其特征在于， 所述使用 透明封胶 （45) 和 /或透明盖板 （42) 对 LED相关元器件 （41) 进行覆盖的方法 是： 在 LED相关元器件（41)上的元件间填充少许透明胶找平， 使 LED芯片表面 与透明盖板（42)之间尽可能少地形成透明胶， 再采用轮廓与光机模板（43)相 同的透明盖板（42)加盖其上，透明盖板（42)上设有开口区域，用于露出焊盘； 或者， 在 LED相关元器件（41)上的元件间填充少许透明胶找平， 使 LED芯片表 面与透明盖板（42)之间尽可能少地形成透明胶，再采用轮廓小于光机模板（43) 的透明盖板 （42) 加盖其上， 然后在透明盖板 （42) 周围包覆透明封胶 (45)，使 透明封胶（45)的轮廓与光机模板（43)齐平，透明盖板（42)上设有开口区域， 用于露出焊盘； 或者， 在 LED相关元器件 （41) 上直接包覆透明封胶 (45)，使透 明封胶 （45) 的轮廓与光机模板 （43)齐平， 透明胶 （45) 上设有开口区域， 用 于露出焊盘。
4、 根据权利要求 1或 2所述的 LED灯泡光机模组， 其特征在于： 所述光机 模板（43)为圆形基板， 圆形基板的两侧对称设有两个内圆弧缺口， 圆弧缺口的 圆心在圆形基板外部的同心圆上； 所述光机模板（43 )上还设有用于与电气接插 件（11 ) 的插针相连的圆孔， 所述焊盘在 LED相关元器件（41 )上并位于圆孔所 在处， 电气接插件 （11 ) 的插针插入圆孔后与焊盘相焊接。
5、 根据权利要求 1或 2所述的 LED灯泡光机模组， 其特征在于： 所述光机 模板 （43 ) 为圆形基板， 圆形基板两侧对称地切除圆形基板所在圆的两个弓形， 形成两个对称缺口； 所述光机模板（43 )上还设有带对位销的圆孔， 圆孔用于与 电气接插件（ 11 )对位连接；所述 LED相关元器件（41 )通过柔性转接电路（44) 将焊盘设置于圆孔所在处，所述电气接插件（ 11 )插入圆孔后与柔性转接电路 ( 44) 上的焊盘相焊接。
6、 根据权利要求 1或 2所述的 LED灯泡光机模组， 其特征在于： 所述光机 模板（43 )为圆形基板， 圆形基板的两侧设有两个对称缺口， 每个缺口沿圆形基 板所在圆的一条弦切割而成的， 而且所述弦两端向外倾斜 120度， 并通过圆弧过 渡到圆形基板所在圆； 所述焊盘位于圆形基板的缺口内侧，焊盘分别设在两个缺 口内侧或集中设在其中一个缺口内侧。
7、 根据权利要求 4所述的 LED灯泡光机模组， 其特征在于： 所述圆形基板 所在圆的直径 dG为 11mm或 16mm; 当圆形基板所在圆的直径 dG为 11mm时，两个 圆弧缺口的圆心在直径为 13mm的圆上， 两个圆弧缺口的半径为 3. 2mm; 当圆形 基板所在圆的直径 dG为 16mm时， 两个圆弧缺口的圆心在直径为 19mm的圆上， 两个圆弧缺口的半径为 3. 6mm ;所述的与电气接插件（11 )的插针相连的圆孔为 4 个，等间距对称分布，间距 3. 5mm, 4个圆孔的中心在偏离圆形基板圆心 2mm处， 且 4个圆孔的中心与两个缺口的距离相等。
8、 根据权利要求 5所述的 LED灯泡光机模组， 其特征在于： 所述圆形基板 所在圆的直径 dG为 18mm或 25mm; 当圆形基板所在圆的直径 dG为 18mm时，被切 除的两个弓形的弦长为 8. 2mm，两条弦之间的距离为 16mm; 当圆形基板所在圆的 直径 de为 25mm时，被切除的两个弓形的弦长为 9. 8mm，两条弦之间的距离为 23mm; 所述的带对位销的圆孔直径为 8mm， 其圆心在偏离圆形基板圆心 2mm处， 且圆孔 中心与两个缺口的距离相等。
9、 根据权利要求 6所述的 LED灯泡光机模组， 其特征在于： 所述圆形基板 所在圆的直径 dG为 20mm、 38mm或 50mm， 所述缺口中的弦长减去两端向外倾斜 的部分后长度为 10mm， 过渡用的圆弧的半径为 1mm; 两个缺口所对应的两条弦相 互平行； 当圆形基板所在圆的直径 dG为 20mm时， 两条弦之间的距离为 15mm; 当圆形基板所在圆的直径 为 38mm时， 两条弦之间的距离为 33mm; 当圆形基 板所在圆的直径 dc;为 50mm时， 两条弦之间的距离为 45mm。
10、根据权利要求 3所述的 LED灯泡光机模组， 其特征在于： 所述透明盖板
( 42 )上还涂敷有荧光粉并加涂保护层； 或者所述透明盖板（42 )为模具成型的 透明荧光体。
11、根据权利要求 9所述的 LED灯泡光机模组， 其特征在于： 所述光机模板
( 43 )上还设有用于固定的固定孔， 所述固定孔的数量为两个， 两个固定孔基于 圆形基板的圆形中心对称， 且两个固定孔之间的距离为 4-6， 固定孔的直径为 2. 2mm; 两个固定孔的连线， 与两个缺口中心的连线相互正交； 当 de=20mm时， 单边开一个固定孔。
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CN102810625A (zh) * 2011-06-01 2012-12-05 乐利士实业股份有限公司 液冷式发光装置
CN202302870U (zh) * 2011-10-21 2012-07-04 东莞柏泽光电科技有限公司 灯具模块
CN202473919U (zh) * 2011-12-31 2012-10-03 苏州晶品光电科技有限公司 柔性电路基板双面出光led阵列光源
CN102777797A (zh) * 2012-07-23 2012-11-14 贵州光浦森光电有限公司 互换性和通用性强的led灯泡构成方法及法兰式支架led灯泡
CN103196064A (zh) * 2013-04-22 2013-07-10 贵州光浦森光电有限公司 一种led灯泡光机模组
CN103236434A (zh) * 2013-04-22 2013-08-07 贵州光浦森光电有限公司 一种透明基板的led灯泡光机模组

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