WO2014171757A1 - Boîtier de module de circuit de protection de batterie - Google Patents

Boîtier de module de circuit de protection de batterie Download PDF

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Publication number
WO2014171757A1
WO2014171757A1 PCT/KR2014/003345 KR2014003345W WO2014171757A1 WO 2014171757 A1 WO2014171757 A1 WO 2014171757A1 KR 2014003345 W KR2014003345 W KR 2014003345W WO 2014171757 A1 WO2014171757 A1 WO 2014171757A1
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WO
WIPO (PCT)
Prior art keywords
protection circuit
terminal
battery protection
battery
circuit module
Prior art date
Application number
PCT/KR2014/003345
Other languages
English (en)
Korean (ko)
Inventor
황호석
김영석
박성범
안상훈
정태환
박승욱
박재구
문명기
이현석
정다운
Original Assignee
주식회사 아이티엠반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130043291A external-priority patent/KR101450221B1/ko
Application filed by 주식회사 아이티엠반도체 filed Critical 주식회사 아이티엠반도체
Priority to US14/784,324 priority Critical patent/US20160056444A1/en
Priority to CN201480021858.4A priority patent/CN105264691B/zh
Publication of WO2014171757A1 publication Critical patent/WO2014171757A1/fr
Priority to US16/253,433 priority patent/US10950845B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/296—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by terminals of battery packs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/547—Terminals characterised by the disposition of the terminals on the cells
    • H01M50/55—Terminals characterised by the disposition of the terminals on the cells on the same side of the cell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/552—Terminals characterised by their shape
    • H01M50/553—Terminals adapted for prismatic, pouch or rectangular cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a package of a battery protection circuit module, and more particularly, to a package of a battery protection circuit module that can be miniaturized and easily mountable in a battery pack or a battery can.
  • batteries are used in portable terminals such as mobile phones and PDAs.
  • Lithium-ion batteries are the most widely used batteries in portable terminals and the like. They generate heat during overcharging and overcurrent, and if the heating continues and the temperature rises, performance deterioration and risk of explosion occur. Therefore, a normal battery is equipped with a protection circuit module for detecting and blocking overcharge, overdischarge and overcurrent, or install a protection circuit for detecting overcharge, overdischarge, overheating and blocking operation of the battery outside the battery.
  • Such a conventional protection circuit is generally formed by soldering a protection integrated circuit (IC), a field effect transistor (FET), a resistor, and a capacitor to a printed circuit board (PCB) by soldering. .
  • Such a conventional protection circuit has a problem in that the space occupied by the protection IC, the FET, the resistor, the capacitor, and the like is too large to limit the miniaturization.
  • the protection circuit is mounted on the battery pack, a separate work is required, and after mounting the protection circuit, the external connection terminal or the internal connection through a separate wiring or wire bonding or a pattern of the PCB board or an exposed terminal of the PCB board There is a problem that the work is complicated, such as the need to connect to the connectors.
  • the present invention has been made to solve various problems including the above problems, and an object thereof is to provide a battery protection circuit module package that is advantageous for integration and miniaturization.
  • these problems are exemplary, and the scope of the present invention is not limited thereby.
  • Battery protection circuit module package is disposed at both edge portions, respectively, and includes a lead for a first internal connection terminal and a lead for a second internal connection terminal, and a lead for the first internal connection terminal, which are electrically connected to electrode terminals of a battery bare cell. And a terminal lead frame disposed between the second internal connection terminal leads and including the external connection terminal leads constituting the plurality of external connection terminals. And a substrate mounted on the terminal leadframe to be electrically connected to the terminal leadframe and including a substrate on which a battery protection circuit element is disposed. It is provided.
  • the device package may have an exposed terminal on a lower surface thereof.
  • the device package may have exposed terminals on upper and lower surfaces, respectively.
  • the exposed terminal formed on the surface may be an NFC connection terminal formed to electrically connect the NFC antenna and the NFC matching element.
  • the device package may include an authentication chip circuit component disposed on the substrate; And an encapsulant that exposes the exposed terminal and seals the battery protection circuit element and the authentication chip circuit component. Any one of the plurality of external connection terminals may be an authentication chip external connection terminal.
  • the device package may include a fuel gauge circuit component disposed on the substrate; And an encapsulant that exposes the exposed terminal and seals the battery protection circuit element and the fuel gauge circuit component. Any one of the plurality of external connection terminals may be a fuel gauge external connection terminal.
  • the exposed terminal formed on the lower surface of the device package in the battery protection circuit module package may be electrically connected to at least a portion of the terminal lead frame.
  • An encapsulant may be further provided to expose the exposed terminals of the battery protection circuit module package and seal the battery protection circuit element.
  • the device package may be mounted on the terminal leadframe using surface mount technology.
  • the substrate includes a mounting lead frame having a plurality of mounting leads spaced apart from each other, and the battery protection circuit device is a protection IC and a field effect transistor mounted directly on the mounting lead frame. (FET) and at least one passive element, the passive element being arranged to connect at least some of the spaced plurality of mounting leads, wherein the protection IC, the field effect transistor, and the plurality of mounting leads
  • FET field effect transistor
  • the electrical connection member may include a bonding wire or a bonding ribbon.
  • the passive element may be mounted and fixed on at least a part of the surface of the mounting lead frame by surface mounting technology, rather than being inserted and fixed on the mounting lead frame.
  • the protection IC and the field effect transistor (FET) are not inserted into and fixed in the form of a semiconductor package on the mounting lead frame, but are mounted at least on the surface of the mounting lead frame by surface mounting technology. On some, it may be mounted and fixed in the form of a chip die that is not sealed with a separate encapsulant.
  • the substrate includes a printed circuit board
  • the battery protection circuit device includes a protection IC, a field effect transistor, and at least one passive element disposed on the printed circuit board. can do.
  • an electrode terminal of the battery bare cell includes a plate having a first polarity and an electrode cell having a second polarity disposed in the center of the plate having the first polarity, and the lead for the first internal connection terminal. Is directly connected to the plate of the first polarity and electrically connected, and the lead for the second internal connection terminal may be electrically connected to the electrode cell of the second polarity.
  • the terminal leadframe and the device package may be disposed on one side of the battery bare cell with respect to the electrode cell of the second polarity.
  • the lead for the first internal connection terminal may be bent in a form of a form to bond with an electrode terminal of the battery bare cell.
  • the lead for the first interconnection terminal and the lead for the second interconnection terminal are laser welded, resistance welded, soldered and conductive adhesive (for example, the electrode terminal of the battery bare cell).
  • Conductive epoxy), and a conductive tape can be bonded in any one manner selected from the group consisting of.
  • the lead frame may be made of nickel, copper, nickel plated copper, or other metal.
  • the plurality of external connection terminals may include four or more external connection terminals.
  • the battery protection circuit module package includes a PTC layer, a metal layer attached to a first surface of any one of an upper surface and a lower surface of the PTC element, and a connection attached to a second surface of the other of the upper and lower surfaces of the PTC element.
  • a PTC structure including a member, wherein the metal layer is electrically connected to one of the first internal connection lead and the second internal connection lead, and the connection member is connected to the battery bare.
  • the electrode terminal of the cell may be bonded and electrically connected.
  • FIG. 1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 2 is a diagram illustrating an arrangement structure of a stacked chip constituting a part of a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 3 is a diagram conceptually illustrating a configuration of a lead frame and a protection circuit element constituting a part of a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 4 is a plan view illustrating in detail the structure of a lead frame constituting a part of a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 5 is a plan view illustrating in detail an arrangement structure of a protection circuit element constituting a part of a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 6 is a diagram illustrating a part of a battery protection circuit module package according to an embodiment of the present invention.
  • FIG. 7 is a diagram illustrating a part of a battery protection circuit module package according to a comparative example of the present invention.
  • FIG. 8A is a circuit diagram of a battery protection circuit that forms part of a battery protection circuit module package according to another embodiment of the present invention.
  • 8B is a circuit diagram of a battery protection circuit that forms part of a battery protection circuit module package according to another embodiment of the present invention.
  • 8C is a block diagram illustrating a battery protection circuit and a fuel gauge circuit that form part of a battery protection circuit module package according to another exemplary embodiment of the present invention.
  • FIGS. 9A and 10A are perspective views illustrating a device package of a battery protection circuit module package according to some embodiments of the present invention.
  • 9B and 10B are perspective views illustrating a device package of a battery protection circuit module package according to some other embodiments of the present invention.
  • FIG. 11 is a partial cutaway perspective view of portion E of FIG. 9A or 9B.
  • FIG. 12A is a diagram illustrating a process of mounting a device package on a terminal leadframe in a battery protection circuit module package according to some embodiments of the present invention.
  • 12B is a diagram illustrating a process of mounting a device package on a terminal leadframe in a battery protection circuit module package according to some other embodiments of the present invention.
  • FIG. 13A is a perspective view illustrating a battery protection circuit module package according to some embodiments of the present disclosure.
  • FIG. 13B is a perspective view illustrating a battery protection circuit module package according to some other embodiments of the present invention.
  • FIG. 14 is a perspective view illustrating a battery protection circuit module package according to embodiments of the present invention.
  • FIG. 15 is a perspective view illustrating a process in which a battery protection circuit module package is coupled with a battery can according to at least some embodiments of the present disclosure.
  • FIG. 16 is a perspective view illustrating a PTC structure constituting a battery protection circuit module package according to at least some embodiments of the present disclosure.
  • 17 is a diagram illustrating a battery protection circuit module package according to at least some embodiments of the present invention.
  • FIG. 18 is a perspective view illustrating a process in which a battery protection circuit module package is coupled with a battery can according to at least some embodiments of the present disclosure.
  • FIG. 19 is a perspective view illustrating an appearance of a battery pack to which a battery protection circuit module package according to at least some embodiments of the present disclosure is mounted.
  • 20 is a flowchart illustrating an exemplary method of manufacturing a device package in a battery protection circuit module package according to at least some embodiments of the present disclosure.
  • first, second, etc. are used herein to describe various members, parts, regions, layers, and / or parts, these members, parts, regions, layers, and / or parts are defined by these terms. It is obvious that not. These terms are only used to distinguish one member, part, region, layer or portion from another region, layer or portion. Thus, the first member, part, region, layer or portion, which will be discussed below, may refer to the second member, component, region, layer or portion without departing from the teachings of the present invention.
  • top or “above” and “bottom” or “bottom” may be used herein to describe the relationship of certain elements to other elements as illustrated in the figures. It may be understood that relative terms are intended to include other directions of the device in addition to the direction depicted in the figures. For example, if the device is turned over in the figures, elements depicted as present on the face of the top of the other elements are oriented on the face of the bottom of the other elements. Thus, the exemplary term “top” may include both “bottom” and “top” directions depending on the particular direction of the figure. If the device faces in the other direction (rotated 90 degrees relative to the other direction), the relative descriptions used herein can be interpreted accordingly.
  • the lead frame is a structure in which lead terminals are patterned on a metal frame, and may be distinguished from a printed circuit board having a metal wiring layer formed on an insulating core in structure or thickness thereof.
  • FIG. 1 is a circuit diagram of a battery protection circuit for configuring a battery protection circuit module package according to an embodiment of the present invention.
  • the battery protection circuit 10 may be connected to a charger when the first and second internal connection terminals B + and B ⁇ are connected to a battery cell and are charged.
  • first to third external connection terminals P +, CF, and P ⁇ are connected to electronic devices (eg, portable terminals, etc.) operated by battery power.
  • the first external connection terminal P + and the third external connection terminal P- among the first to third external connection terminals P +, CF, and P- are for power supply and the other external connection terminal is
  • the second external connection terminals CF and ID divide the batteries so as to be charged according to the batteries.
  • the second external connection terminals CF and ID may apply a thermistor, which is a component that senses the battery temperature during charging, and may be used as a terminal to which other functions are applied.
  • the battery protection circuit 10 has a connection structure of the dual FET chip 110, the protection IC 120, the resistors R1, R2, and R3, the varistor V1, and the capacitors C1 and C2. .
  • the dual FET chip 110 includes a first field effect transistor FET1 and a second field effect transistor FET2 having a drain common structure.
  • the protection IC 120 is connected to the first internal connection terminal B +, which is a positive terminal of the battery, through a resistor R1, and a charge voltage or a discharge voltage is applied through the first node n1.
  • the inside of the protection IC 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage and the charge / discharge voltage, an overcurrent detector, and a charge / discharge detector.
  • the criterion for determining the charge and discharge states can be changed to a specification required by the user, and the charge / discharge state is determined by recognizing the voltage difference of each terminal of the protection IC 120 according to the determined criterion.
  • the DO terminal goes low to turn off the first field effect transistor FET1
  • the overcharge state reaches the overcharge state
  • the CO terminal goes low.
  • the field effect transistor FET2 is turned off, and when the overcurrent flows, the second field effect transistor FET2 is charged during charging and the first field effect transistor FET1 is turned off when discharging.
  • the resistor R1 and the capacitor C1 serve to stabilize the fluctuation of the power supply of the protection IC 120.
  • the resistor R1 is connected between the first node n1, which is the power supply V1 of the battery, and the VDD terminal of the protection IC 120, and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection IC. do.
  • the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +.
  • the resistor R1 is made larger, the detection voltage is increased due to the current penetrating into the protection IC 120 during voltage detection. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K? Or less.
  • the value of the capacitor (C1) has a suitable value of 0.01 ⁇ F or more for stable operation.
  • the resistors R1 and R2 become current limiting resistors when the high voltage charger or the charger exceeding the absolute maximum rating of the protection IC 120 is connected upside down.
  • the resistor R2 is connected between the V-terminal of the protection IC 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ⁇ . If the resistor R2 is too large, no recovery may occur after the overcharge cutoff, and thus the value of the resistor R2 is set to a value of 10 K? Or less.
  • the capacitor C2 is the source node S1 (or VSS terminal, the second internal connection terminal B) of the second node n2 (or the third external connection terminal P ⁇ ) and the first field effect transistor FET1. -)) Has a structure that is connected between.
  • the capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for the user's request or stability.
  • the capacitor C2 is for the effect of stabilizing the system by improving resistance to voltage fluctuations or external noise.
  • the resistor R3 and the varistor V1 are elements for ESD protection and surge protection.
  • the resistor R3 and the varistor V1 are connected to each other in parallel to each other so that the second external connection terminal CF and the second node n2 ( Or it is connected between the third external connection terminal (P-).
  • the varistor (V1) is a device that lowers the resistance when an overvoltage occurs, and when the overvoltage occurs, the resistance is lowered to minimize circuit damage due to the overvoltage.
  • a battery protection circuit module configured by packaging the battery protection circuit 10 of FIG. 1 into one including an external connection terminal (P +, P-, CF) and an internal connection terminal (B +, B-). Implement a package of.
  • the protection circuit according to the embodiment of the present invention described above is exemplary, and the configuration, number, arrangement, and the like of the protection IC, the FET, or the passive element may be appropriately modified according to the additional function of the protection circuit.
  • FIG. 2 is a diagram illustrating an arrangement structure of a stacked chip constituting a battery protection circuit module package according to an embodiment of the present invention.
  • the arrangement of the dual FET chip 110 and the protection IC 120 has a structure in which the dual FET chip 110 and the protection IC 120 are stacked up and down or adjacent to each other. It has a structure.
  • the protection IC 120 may be stacked on the upper surface of the dual FET chip 110, or the dual FET chip 110 may be disposed adjacent to the left or right side of the protection IC 120. .
  • the dual FET chip 110 includes a first field effect transistor having a common drain structure and a second field effect transistor, that is, two field effect transistors (FETs), and the external connection terminal has a first gate of the first field effect transistor.
  • the terminal G1 and the first source terminal S1, the second gate terminal G2 and the second source terminal S2 of the second field effect transistor are provided on the upper surface of the dual FET chip 110.
  • the common drain terminal D may have a structure provided on the lower surface of the dual FET chip 110.
  • the protection IC 120 has a structure in which the protection IC 120 is stacked on the upper surface of the dual FET chip 110.
  • the protection IC 120 is stacked in a region (for example, a central portion) except for a portion where external connection terminals on the dual FET chip 110 are disposed.
  • an insulating film for insulation may be disposed between the protection IC 120 and the dual FET chip 110, and the protection IC 120 and the dual FET chip 110 may be bonded with an adhesive of an insulating material. Since the size of the dual FET chip 110 is generally larger than that of the protection IC 120, an arrangement structure in which the protection IC 120 is stacked on the dual FET chip 110 is adopted.
  • the DO terminal DO of the protection IC 120 is electrically connected to the first gate terminal G1 through a wire or a wire.
  • the CO terminal CO of the protection IC 120 is electrically connected to the second gate terminal G2 through a wire or a wiring.
  • the connection structure of the remaining terminals will be described later.
  • the protection IC 120 and the dual FET chip 110 having the stacked structure as described above will be collectively referred to as a 'laminated chip 100a'.
  • the battery protection circuit module package by introducing a protection IC 120 having a stacked structure and a stacked chip 100a of a dual FET chip, an area mounted on a lead frame to be described later may be reduced. Accordingly, miniaturization or high capacity of the battery can be realized.
  • FIG. 3 is a view conceptually illustrating the configuration of a lead frame and a protection circuit element constituting a battery protection circuit module package according to an embodiment of the present invention
  • Figures 4 and 5 are the structure of the lead frame illustrated in FIG.
  • a plan view illustrating in detail the arrangement structure of the protection circuit elements.
  • the protection circuit structure 200a constituting a package of a battery protection circuit module according to an embodiment of the present invention is disclosed.
  • the protection circuit structure 200a includes a lead frame 50 and battery protection circuit elements 130 and 100a mounted on the lead frame 50.
  • the lead frame 50 includes the first internal connection terminal region A1, the external connection terminal region A2, the protection circuit region of the device region A3 and the chip region A4, and the second internal connection terminal region A5. It has a structure arranged sequentially.
  • the protection circuit region is disposed between the external connection terminal region A2 and the second internal connection terminal region A5, and the arrangement order of the device region A3 and the chip region A4 may be changed in various ways.
  • the upper surface 50a of the lead frame 50 may be a surface on which the battery protection circuit elements 130 and 100a are mounted, and the lower surface 50b of the lead frame 50 may be opposite to the upper surface 50a.
  • a portion corresponding to the external connection terminal region A2 may be plated in whole or in part.
  • the plating material may be at least one selected from gold, silver, nickel, tin and chromium.
  • the first internal connection terminal area A1 and the second internal connection terminal area A5 are provided at both edge portions of the module package, respectively, and function as first internal connection terminals connected to the battery bare cells embedded in the battery can. Leads B + for the first internal connection terminals and leads B- for the second internal connection terminals respectively functioning as second internal connection terminals are disposed.
  • the external connection terminal region A2 is adjacent to the first internal connection terminal region A1 and leads to the first to third external connection terminals P +, which are leads for a plurality of external connection terminals, which function as a plurality of external connection terminals.
  • CF and P-) are each disposed sequentially.
  • the order of arranging the first to third external connection leads P +, CF, and P ⁇ may vary.
  • the lead P + for the first external connection terminal and the lead B + for the first internal connection terminal are connected to each other. That is, the first internal connection lead B + is configured to extend from the first external connection lead P +, or the first external connection lead P + is formed from the first internal connection lead B +. It may be extended.
  • the device region A3 a plurality of passive elements R1, R2, R3, C1, C2, and V1 constituting the battery protection circuit are disposed.
  • the device region A3 is illustrated as being composed of a single lead, but in practice, for example, for the first to sixth passive devices composed of a plurality of conductive lines, as shown in FIG. 4.
  • Leads L1, L2, L3, L4, L5, L6 may be configured to be disposed.
  • the first to third passive element leads L1, L2 and L3 may have a sequential arrangement structure on an upper side of the device region A3, and the fourth to sixth passive element leads L4, L5 and L6 may have a structure disposed below the device region A3.
  • the first passive element lead L1 is disposed in a predetermined size in the element region A3 adjacent to the external connection terminal region A2, and the second passive element lead L2 is the first passive element lead L1. It is arranged adjacent to the predetermined size.
  • the third passive element lead L3 is disposed at a predetermined size in the element region A3 adjacent to the chip region A4 and adjacent to the second passive element lead L2.
  • the fourth passive element lead L4 is disposed in a predetermined size in the element region A3 adjacent to the external connection terminal region A2, and the fifth passive element lead L5 and the sixth passive element lead L6 are fixed. ) Is disposed adjacent to the fourth passive element lead L1 in such a manner that the fifth passive element lead L5 surrounds the sixth passive element lead L6.
  • the chip area A4 is an area for arranging the protection IC and the dual FET chip constituting the battery protection circuit adjacent to the device area A3.
  • the stacked chip 100a shown in FIG. 2 is mounted.
  • the die pad DP may be disposed.
  • the die pad DP may be electrically connected to the common drain terminal of the dual FET chip 110 constituting the stacked chip 100a, and may be exposed during packaging of the subsequent process to function as an external connection terminal and to exhibit heat dissipation characteristics. It can be improved.
  • a plurality of passive elements R1, R2, R3, C1, C2, and V1 and a stacked chip 100a are disposed in the lead frame illustrated in FIG. 4, and the wire bonding 220 is disposed.
  • the equivalent circuit shown in FIG. 1 is configured through the same.
  • the stacked chip 100a is mounted on the die pad DP of the chip region A4, and the reference voltage terminal VSS of the protection IC 120 constituting the stacked chip 100a is formed of the first field effect transistor. Electrical bonding is performed by wire bonding with the source terminal or the third passive element lead L3.
  • the protection IC 120 electrically connects the terminal VDD to which the charge voltage and the discharge voltage are applied and detects the battery voltage through the lead L2 for the second passive element through wire bonding, and the protection IC.
  • the sensing terminal V- for detecting the state of charge and discharge and overcurrent is electrically connected to the sixth passive element lead L6 through wire bonding.
  • the source terminal S1 of the first field effect transistor is electrically connected to the lead L3 for the third passive element through wire bonding, and the source terminal S2 of the second field effect transistor is the lead for the fifth passive element. It is electrically connected with the L5 through wire bonding.
  • the first passive element lead L1 and the first external connection terminal lead P + are electrically connected through wire bonding, and the third passive element lead L3 and the second internal connection terminal are used.
  • the lead B- is electrically connected through wire bonding or the like.
  • the fourth passive element lead L4 is electrically connected to the second external connection terminal lead CF through wire bonding, and the fifth passive element lead L5 is the third external connection terminal lead L3. And is electrically connected through wire bonding or the like.
  • the first resistor R1 of the plurality of passive elements is disposed between the first passive element lead L1 and the second passive element lead L2, and the second resistor of the passive elements is a second resistor.
  • R2 is disposed between the fifth passive element lead L5 and the sixth passive element lead L6.
  • the third resistor R3 constituting the surge protection circuit among the plurality of passive elements is disposed between the fourth passive element lead L4 and the fifth passive element lead L5, and among the plurality of passive elements.
  • the first capacitor C1 is disposed between the second passive element lead L2 and the third passive element lead L3, and the second capacitor C2 of the plurality of passive elements is used for the third passive element. It is arranged between the lead L3 and the fifth passive element lead L5.
  • Varistor (V1) constituting the surge protection circuit of the plurality of passive elements is configured in parallel with the third resistor (R3) to the fourth passive element lead (L4) and the fifth passive element lead ( It is arranged between L5).
  • the circuit diagram of the battery protection circuit illustrated in FIG. 1 and the protection circuit structure 200a illustrated in FIG. 5 implementing the same may be variously modified, and thus may be implemented in various modified structures.
  • the first field effect transistor FET1, the second field effect transistor FET2, and the protection IC may be provided integrated into one chip.
  • the integrated single chip may be mounted on the lead frame 50 in the form of a flip chip.
  • Flip chip has the advantages of improved electrical conductivity, lower production cost and process simplification compared to wire bonding, since the external terminal is soldered and connected to the lead that requires electrical connection without additional wire bonding. There is an advantage that can be reduced.
  • the first field effect transistor FET1 and the second field effect transistor FET2 may be disposed apart from each other on the lead frame 50 without being implemented as a dual FET chip.
  • a conductive plate for connecting the lower surface of the lead frame 50 to each other is further provided. Can be placed.
  • the package module 300 is configured by packaging the protective circuit structure 200a shown in FIG. 5 or the above-described modified structures with the encapsulant 250, as shown in FIG. 6. .
  • FIG. 6A illustrates a bottom surface of the package 300 of the battery protection circuit module according to an embodiment of the present invention
  • FIG. 6B illustrates an upper surface of the module package 300.
  • the lower surface of the package 300 of the battery protection circuit module corresponds to the upper surface 50a of the lead frame 50
  • the upper surface of the package 300 of the battery protection circuit module is the lead frame 50. It may correspond to the lower surface 50b.
  • the package 300 of the battery protection circuit module according to an embodiment of the present invention is exposed to the external connection terminals (P +, CF, P-) on the upper surface, the first internal connection terminal (B +) on the lower surface And the second internal connection terminal B- is exposed.
  • the upper surface of the module package 300 may be packaged to further expose the lower surface (opposite side of the surface on which the stacked chip 100a is mounted) of the die pad DP according to heat dissipation or other needs.
  • at least one of the first internal connection lead B + and the second internal connection lead B- may be bent in a gull-form form.
  • FIG. 7 is a diagram illustrating a part of a battery protection circuit module package according to a comparative example of the present invention.
  • Battery protection circuit module package 300 according to a comparative example of the present invention, as shown in Figure 7, in addition to the three external connection terminals (P +, CF, P-) on the top surface additional external connection terminals ( 50-1 and 50-2 may be exposed to the area D.
  • additional external connection terminals ( 50-1 and 50-2 may be exposed to the area D.
  • the battery protection circuit module package 300 Should be increased in length.
  • the battery protection circuit module package 300 is mounted on the top surface of the battery bare cell, the length of the battery protection circuit module package 300 is limited.
  • the battery protection circuit module package 300 may not be easy to implement when the number of external connection terminals is four or more.
  • a battery protection circuit module package according to another embodiment of the present invention which can be integrated and miniaturized even when the number of external connection terminals is four or more, will be described.
  • FIGS. 13A and 14 illustrate a process of mounting an element package on a terminal leadframe in a battery protection circuit module package according to some embodiments.
  • FIGS. 13A and 14 illustrate a battery protection circuit module package according to some embodiments of the present disclosure.
  • 15 is a perspective view illustrating a process of combining a battery protection circuit module package with a battery can according to at least some embodiments of the present disclosure
  • FIG. 19 is a diagram illustrating at least some embodiments of the present disclosure. Is a perspective view illustrating the appearance of a battery pack mounted with a battery protection circuit module package according to the present invention.
  • the battery protection circuit module package 304a may include a terminal leadframe 70 and an element package. 302a.
  • the terminal lead frame 70 is disposed at both edge portions, respectively, for the first internal connection terminal lead 70-1 and the second internal connection terminal electrically connected to the electrode terminals 420 and 430 of the battery bare cell.
  • the plurality of external connection terminals may include four or more external connection terminals.
  • the terminal leadframe 70 may include the leads 70-5 for the fourth external connection terminal in addition to the leads P +, CF, and P ⁇ for the first to third external connection terminals. And a fifth external connection terminal lead 70-6.
  • the fifth external connection terminal lead 70-6 is configured to be connected to the second internal connection terminal lead 70-7 by changing the design of the terminal lead frame 70, for example. It may be used when evaluating the electrical characteristics of the protective circuit module package 304a.
  • the terminal leadframe 70 may be made of nickel, copper, nickel plated copper, or other metal.
  • the lead for the external connection terminal of the terminal lead frame 70 may be plated all or part of the surface (surface shown in FIG. 15) facing the outside of the battery.
  • the plating material may be at least one selected from gold, silver, nickel, tin and chromium.
  • the device package 302a includes a substrate on which the battery protection circuit elements 110, 120, and 130 are disposed.
  • the device package 302a may include a substrate on which the field effect transistor 110, the protection IC 120, and the passive device 130 are disposed.
  • the device package 302a may further include an encapsulant 250 for sealing the battery protection circuit devices 110, 120, and 130.
  • the encapsulant 250 may include, for example, an epoxy molding compound (EMC).
  • EMC epoxy molding compound
  • the device package 302a is mounted on the terminal leadframe 70 to be electrically connected to the terminal leadframe 70.
  • the device package 302a may be mounted on the terminal leadframe 70 using surface mounting technology.
  • At least one exposed terminal 60-3, 60-4, 60-5, 60-6, or 60-7 may be formed on the bottom surface of the device package 302a. Further, in the device package 302a, at least one exposed terminal 60-1 or 60-2 may be formed on an upper surface thereof.
  • the encapsulant 250 for sealing the battery protection circuit elements 110, 120, and 130 is exposed terminals 60-1, 60-2, 60-3, 60-4, 60-5, 60-6, and 60-7 Can be formed to expose. Meanwhile, at least one exposed terminal 60-3, 60-4, 60-5, 60-6, 60-7 formed on the bottom surface of the device package 302a is bonded to at least a portion of the terminal lead frame 70. And electrically connected, it is possible to configure at least part of the circuit shown in FIGS. 1, 8A-8C.
  • the substrate on which the battery protection circuit elements 110, 120, and 130 may be disposed in the device package 302a may include a lead frame, a printed circuit board, a ceramic substrate, and a glass substrate.
  • the substrate may include a mounting lead frame 60 having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit element mounted directly on the substrate may include a field effect transistor 110, a protection IC 120, and at least one passive element 130.
  • the passive element 130 may include a capacitor, a resistor, and / or a varistor.
  • the device package 302a including the mounting lead frame 60 may configure the battery protection circuit without using a separate printed circuit board. This configuration is arranged such that at least one passive element 130 connects at least some of the plurality of mounting leads spaced apart, and includes a protection IC 120, a field effect transistor 110, and the plurality of mounting leads.
  • the passive element 130 may not be inserted into and fixed on the mounting lead frame 60 but may be mounted and fixed on at least a part of the surface of the mounting lead frame 60 by a surface mounting technique.
  • the electrical connection member may include a bonding wire or a bonding ribbon.
  • an electrical connection member such as a bonding wire or a bonding ribbon is disposed on the mounting lead frame 60. Since the circuit is constructed, the process of designing and manufacturing the mounting leadframe 60 for constructing the battery protection circuit has a significant advantage. If the electrical connection member is not introduced in the battery protection circuit in the embodiments of the present invention, since the configuration of the plurality of leads constituting the mounting lead frame 60 becomes very complicated, an appropriate mounting lead frame 60 may be used. It may not be easy to provide effectively.
  • a protection IC and a field effect transistor are inserted in the form of a semiconductor package on the mounting leadframe 60.
  • Chip die sawed on a wafer that is not sealed with a separate encapsulant on at least a portion of the surface of the mounting leadframe 60 by surface mounting technology. In the form, it can be mounted and fixed.
  • a chip die is implemented by performing a sawing process without sealing a separate encapsulant on a wafer on which a plurality of array-type structures (eg, a protection IC and a field effect transistor) are formed. Mean individual structures.
  • the protection IC and the field effect transistor (FET) are mounted on the mounting lead frame 60, the protection IC and the field effect transistor (FET) are not sealed with a separate encapsulant and then mounted on the encapsulation member 250 subsequent to the encapsulation.
  • the process of forming the encapsulant may be performed only once in implementing the battery protection circuit module package 304a.
  • the passive element, the protection IC, and the field effect transistor (FET) are separately inserted and fixed or mounted on a printed circuit board (PCB), one molding process is required for each component first. Since another molding process is additionally required for each component mounted after being fixed or mounted on a printed circuit board, the manufacturing process is complicated and the manufacturing cost is high.
  • 20 is a flowchart illustrating an exemplary method of manufacturing a device package in a battery protection circuit module package according to at least some embodiments of the present disclosure.
  • an embodiment method of fabricating an element package 302a which configures the substrate with a mounting leadframe 60, provides a mounting leadframe 60 including a plurality of spaced leads.
  • Step S10 Mounting a protection integrated circuit (IC) and a field effect transistor (FET) on the mounting lead frame 60 (S20); Before and after step S20, mounting the passive element 130 to connect at least some of the spaced plurality of leads on the mounting lead frame 60 (S30); Disposing an electrical connection member electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of leads (S40); Exposing a portion of the mounting lead frame 60 and forming an encapsulant 250 for sealing the protection IC, the field effect transistor, and the passive element (S50).
  • IC protection integrated circuit
  • FET field effect transistor
  • a protection integrated circuit (IC) and a field effect transistor (FET) are mounted on a mounting leadframe.
  • the step of mounting in a die form (S20) and the step of mounting the passive element to connect at least some of the spaced plurality of leads on the mounting leadframe (S30) proceeds in sequence, in reverse order, or at the same time Or may be mixed.
  • Mounting a protection integrated circuit (IC) and a field effect transistor (FET) on the mounting leadframe (S20) may include chip die sawed on a wafer not sealed with a separate encapsulant. Mounting the protection IC and the field effect transistor (FET) on the mounting leadframe by surface mount technology.
  • IC protection integrated circuit
  • FET field effect transistor
  • the substrate on which the battery protection circuit elements 110, 120, and 130 may be disposed in the device package 302a may include a printed circuit board.
  • the battery protection circuit element 110 may be used.
  • 120 and 130 may be disposed on the printed circuit board.
  • FIG. 15 and FIG. 19 which is a perspective view illustrating an appearance of a battery pack on which a battery protection circuit module package according to embodiments of the present disclosure is mounted, the package 304a of the battery protection circuit module having the above-described structure.
  • the upper case 500 is a plastic material and has a through hole 550 in a corresponding portion so that the external connection terminals P +, CF, and P- and the additional external connection terminals 70-5 and 70-6 may be exposed.
  • the battery pack 600 may generally be understood as a battery inserted into a mobile phone or a terminal.
  • the upper case 500 is a plastic material and has a through hole 550 in a corresponding portion so that external connection terminals P +, CF, and P- and additional external connection terminals 70-5 and 70-6 may be exposed. Is formed.
  • the battery bare cell includes an electrode assembly and a cap assembly.
  • the electrode assembly is interposed between a positive electrode plate formed by applying a positive electrode active material to a positive electrode current collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode current collector, and between the positive electrode plate and the negative electrode plate to prevent short circuit between the two electrode plates and to move lithium ions.
  • the separator can be made.
  • the positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out to the electrode assembly.
  • the cap assembly includes a negative electrode terminal 410, a gasket 420, a cap plate 430, and the like.
  • the cap plate 430 may serve as a positive electrode terminal.
  • the negative electrode terminal 410 may be referred to as a negative electrode cell or an electrode cell.
  • the gasket 420 may be formed of an insulating material to insulate the negative electrode terminal 410 from the cap plate 430. Accordingly, the electrode terminal of the battery bare cell may include the negative electrode terminal 410 and the cap plate 430.
  • the electrode terminal of the battery bare cell is the plate 430 of the first polarity (for example, the anode) and the electrode cell 410 of the second polarity (for example, the cathode) disposed in the center of the plate 430.
  • the lead B + for the first internal connection terminal of the terminal leadframe 70 is electrically connected to the plate 430 of the first polarity (for example, the anode) by being directly connected to each other.
  • the lead B- for the second internal connection terminal 70 may be electrically connected to the electrode cell 410 of the second polarity (for example, the negative electrode) by direct contact.
  • the length of the terminal leadframe 70 is the length from one end of the plate 430 of the first polarity (for example, the anode) to the electrode cell 410 of the second polarity (for example, the cathode).
  • L / 2 The battery protection circuit module package 304a according to this embodiment has four or more external connection terminals 70-2, 70-3, 70-4, 70-5, and 70-6, and has a second polarity (
  • the battery protection circuit module package 304a is mounted using only one side area of the upper portion with respect to the electrode cell 410 of the cathode, the battery can be miniaturized or high in capacity.
  • an additional cell may be formed in the other side region of the electrode cell 410 to increase battery capacity or to place a chip having another additional function, thereby contributing to miniaturization of an application having such a battery.
  • first internal connection lead (B +, 70-1) and the second internal connection lead (B-, 70-7) may be formed in a form of a gal form to be connected to the electrode terminal of the battery bare cell. Can be bent.
  • first internal connection lead (B +, 70-1) may be bent in the form of a gull form in order to be directly bonded to the plate 430 of the first polarity (for example, the anode).
  • Leads B- and 70-7 for the second internal connection terminals are bonded to and fixed to the negative terminal 410 of the second polarity (for example, negative electrode).
  • the bonding may be performed in any one manner selected from the group consisting of laser welding, resistance welding, soldering and conductive adhesive (eg, conductive epoxy), conductive tape. Accordingly, the battery protection circuit module package 304a can be stably fixed because the first internal connection lead B + and the second internal connection lead B- are bonded to the electrode terminal of the battery bare cell. . Therefore, according to the embodiments of the present invention, since the side of the lead frame is not bent separately, the side of the bent lead frame does not have to be separately bonded to the battery can 400 having the battery bare cell, thereby simplifying the manufacturing process. The product battery can be miniaturized.
  • the electrode terminal of the battery bare cell may have a terminal of a first polarity (not shown) instead of the plate 430 of the first polarity (for example, a positive electrode). have.
  • the first internal connection lead (B +) is directly connected to the terminal of the first polarity terminal (not shown) and electrically connected
  • the second internal connection lead (B-) is of the second polarity (eg For example, it may be directly connected to the electrode cell 410 of the cathode) to be electrically connected.
  • the length of the lead frame 50 may correspond to the length from the terminal (not shown) of the first polarity to the electrode cell 410 of the second polarity (for example, the cathode). Even in this case, since the battery protection circuit module package 304a is mounted using only a region on one side based on the electrode cell 410 of the second polarity (for example, the cathode), the battery can be miniaturized or increased in capacity. .
  • the above-described configuration of the battery protection circuit module package and the battery pack may be applied to implement the exemplary battery protection circuit shown in FIGS. 8A to 8C.
  • FIG. 8A is a circuit diagram of a battery protection circuit that forms part of a battery protection circuit module package according to another embodiment of the present invention.
  • an NFC circuit 131 may be added in addition to the configuration of the battery protection circuit illustrated in FIG. 1 to support near field communication (NFC).
  • the added NFC circuit 131 may include, for example, an NFC external connection terminal NFC1, NFC connection terminals PD1 and PD2, and NFC matching elements C3, C4, C5, and C6.
  • the NFC connection terminals PD1 and PD2 may be in contact with ends of an NFC antenna (not shown) disposed around the battery pack.
  • the NFC antenna may be, for example, a loop type antenna.
  • NFC matching elements C3, C4, C5, C6
  • the NFC matching elements C3, C4, C5, and C6 may be, for example, capacitors for frequency matching.
  • both ends of the NFC loop antenna is connected to a capacitor which is the NFC matching element to form a closed loop, and by using the resonance generated from the NFC antenna and the capacitor to generate a frequency region for NFC communication of 13.56 MHz Communicate with an NFC device.
  • the NFC circuit 131 when the NFC circuit 131 is configured in addition to the configuration of the battery protection circuit shown in Figure 1, in addition to the three external connection terminals (P +, CF, P-) NFC external connection terminal (NFC1) is Since it is configured, the number of external connection terminals implemented in the battery protection circuit module package is four or more. As described above with reference to FIG. 7, the battery protection circuit module package 300 according to an embodiment of the present invention may not be easily implemented when the number of external connection terminals is four or more.
  • the NFC external connection terminal NFC1 may correspond to the fourth external connection terminal 50-1 in the battery protection circuit module package 300 shown in FIG. 7.
  • the terminal lead frame 70 is a lead 70-2, 70-3, 70-4, 70- for an external connection terminal constituting a plurality of external connection terminals. 5, 70-6).
  • the plurality of external connection terminals may include four or more external connection terminals.
  • the terminal leadframe 70 may include the leads 70-5 for the fourth external connection terminal in addition to the leads P +, CF, and P ⁇ for the first to third external connection terminals.
  • a fifth external connection terminal lead 70-6 may be the NFC external connection terminal NFC1 of FIG. 8A.
  • the fifth external connection terminal lead 70-6 is configured to be connected to the second internal connection terminal lead 70-7 by changing the design of the terminal lead frame 70, for example. It may be used when evaluating the electrical characteristics of the protective circuit module package 304a.
  • the device package 302a includes a substrate on which the battery protection circuit elements 110, 120, and 130 are disposed.
  • the device package 302a may include a substrate on which the field effect transistor 110, the protection IC 120, and the passive device 130 are disposed.
  • NFC matching elements C3, C4, C5, and C6 illustrated in FIG. 8A may be disposed on the substrate.
  • the device package 302a may further include an encapsulant 250 that seals the battery protection circuit elements 110, 120, and 130 and the NFC matching elements C3, C4, C5, and C6.
  • the encapsulant 250 may include, for example, an epoxy molding compound (EMC).
  • At least one exposed terminal 60-3, 60-4, 60-5, 60-6, or 60-7 may be formed on the bottom surface of the device package 302a. Further, in the device package 302a, at least exposed terminals 60-1 and 60-2 may be formed on the upper surface thereof.
  • the exposed terminals 60-1 and 60-2 formed on the upper surface of the device package 302a may be, for example, NFC connection terminals PD1 and PD2 illustrated in FIG. 8A.
  • NFC connection terminals (PD1, PD2) may be in contact with the end of the NFC antenna, the NFC matching elements (C3, C4, C5, C6) and the NFC antenna is electrically connected to close the loop (closed loop) Can be formed.
  • the encapsulant 250 sealing the battery protection circuit elements 110, 120, 130 and the NFC matching elements C3, C4, C5, and C6 may be exposed terminals 60-1, 60-2, 60-3, and 60-. 4, 60-5, 60-6, 60-7). Meanwhile, at least one exposed terminal 60-3, 60-4, 60-5, 60-6, 60-7 formed on the bottom surface of the device package 302a is bonded to at least a portion of the terminal lead frame 70. And electrically connected to implement at least part of the circuit configuration shown in FIG. 8A.
  • the arrangement and number of the exposed terminals 60-1, 60-2, 60-3, 60-4, 60-5, 60-6, and 60-7 mentioned in this embodiment are exemplary, and the battery It may be variously modified according to the function and use of the circuit protection circuit and the NFC additional circuit.
  • the substrate on which the battery protection circuit elements 110, 120, 130 and the NFC matching elements C3, C4, C5, and C6 may be disposed in the device package 302a may include a lead frame, a printed circuit board, It may include a ceramic substrate and a glass substrate.
  • the substrate may include a mounting lead frame 60 having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit element mounted directly on the substrate may include a field effect transistor 110, a protection IC 120, and at least one passive element 130.
  • the passive element 130 may include a capacitor, a resistor, and / or a varistor.
  • the device package 302 including the mounting lead frame 60 may configure a battery protection circuit without using a separate printed circuit board.
  • This configuration is arranged to connect at least some of the plurality of mounting leads at least one passive element 130 and / or NFC matching elements (C3, C4, C5, C6), the protection IC 120, It can be implemented by providing an electrical connection member for electrically connecting any two selected from the group consisting of the field effect transistor 110 and the plurality of mounting leads.
  • the electrical connection member may include a bonding wire or a bonding ribbon.
  • 8B is a circuit diagram of a battery protection circuit that forms part of a battery protection circuit module package according to another embodiment of the present invention.
  • the authentication chip circuit component 132 is added to the battery protection circuit component including the battery protection circuit configured in FIG. 1 or the battery protection circuit component including the battery protection circuit configured by modifying FIG. 1. It is possible to support the authentication function.
  • This authentication function may include any additional function for authentication or identification of a battery, a terminal with the battery, a user using the terminal, and the like.
  • the additional authentication chip circuit configuration unit 132 may include, for example, an ID chip 134 and at least one passive element C5, V1, R4, and R5.
  • the number, types, and arrangement of passive elements constituting the authentication chip circuit configuration unit 132 illustrated in FIG. 8B are exemplary, and may be changed according to the purpose or arrangement of the authentication function.
  • the authentication chip circuit component 132 may be connected to the outside through the authentication chip external connection terminal (ID).
  • the authentication chip circuit configuration unit 132 is configured in addition to the configuration of the battery protection circuit shown in Figure 1, in addition to the three external connection terminals (P +, TH, P-) authentication chip external connection terminal Since the ID is configured, the number of external connection terminals implemented in the battery protection circuit module package is four or more. As described above with reference to FIG. 7, the battery protection circuit module package 300 according to an embodiment of the present invention may not be easily implemented in terms of miniaturization of the package when the number of external connection terminals is four or more.
  • the authentication chip external connection terminal ID may correspond to the fourth external connection terminal 50-1 in the battery protection circuit module package 300 shown in FIG. 7.
  • 9B, 10B, 11, 12B, 13B, and 12C show a battery protection circuit module package and a battery pack according to another embodiment of the present invention, which can be integrated and miniaturized even when the number of external connection terminals is four or more. 14, FIG. 15, and FIG. 19 are demonstrated. However, the previously described parts are duplicated and are omitted here.
  • the terminal lead frame 70 is a lead 70-2, 70-3, 70-4, 70 for an external connection terminal constituting a plurality of external connection terminals. -5, 70-6).
  • the plurality of external connection terminals may include four or more external connection terminals.
  • the terminal lead frame 70 may include the leads 70-5 for the fourth external connection terminal in addition to the leads P +, TH, and P ⁇ for the first to third external connection terminals.
  • a fifth external connection terminal lead 70-6 may be an authentication chip external connection terminal ID of FIG. 8B.
  • the fifth external connection terminal lead 70-6 is configured to be connected to the second internal connection terminal lead 70-7 by changing the design of the terminal lead frame 70, for example. It may be used when evaluating the electrical characteristics of the protective circuit module package 304.
  • the device package 302b includes a substrate on which the battery protection circuit components 110, 120, and 130 and the authentication chip circuit components 132 are disposed.
  • the device package 302b may include a substrate on which the field effect transistor 110, the protection IC 120, and at least one first passive device 130 are disposed.
  • the at least one first passive element 130 may include the passive element shown in FIG. 1 or may include passive elements other than the authentication chip circuit component 132 shown in FIG. 8B.
  • an ID chip 134 and at least one second passive element C5, V1, R4, and R5 constituting the authentication chip circuit component 132 illustrated in FIG. 8B may be disposed on the substrate.
  • the device package 302b may further include an encapsulant 250 that seals the battery protection circuit components 110, 120, and 130 and the authentication chip circuit components 132.
  • the encapsulant 250 may include, for example, an epoxy molding compound (EMC).
  • the device package 302b is mounted on the terminal leadframe 70 to be electrically connected to the terminal leadframe 70.
  • the device package 302b may be mounted on the terminal leadframe 70 using surface mounting technology.
  • At least one exposed terminal 60-1, 60-2, 60-3, 60-4, or 60-5 may be formed on the bottom surface of the device package 302b.
  • the encapsulant 250 sealing the battery protection circuit components 110, 120, and 130 and the authentication chip circuit components 132 are exposed terminals 60-1, 60-2, 60-3, 60-4, and 60. -5) to expose. Meanwhile, at least one exposed terminal 60-1, 60-2, 60-3, 60-4, 60-5 formed on the bottom surface of the device package 302b is bonded to at least a portion of the terminal lead frame 70.
  • the substrate on which the battery protection circuit components 110, 120, 130 and the authentication chip circuit component 132 may be disposed in the device package 302b includes a lead frame, a printed circuit board, a ceramic substrate, It may include a glass substrate.
  • the substrate may include a mounting lead frame 60 having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit component mounted on the mounting lead frame 60 may include a field effect transistor 110, a protection IC 120, and at least one first passive element 130.
  • the first passive element 130 may include a capacitor, a resistor, and / or a varistor.
  • the authentication chip circuit configuration unit 132 mounted on the mounting lead frame 60 may include an ID chip 134 and at least one second passive element (C5, V1, R4, R5).
  • step S10 may include a mounting leadframe 60 including a plurality of spaced leads. And providing a protection integrated circuit (IC), a field effect transistor (FET), and an ID chip on the mounting leadframe 60, and step S20.
  • Steps S30 performed before and after the first passive element 130 and / or the second passive element C5, V1, and R4 may be performed to connect at least some of the plurality of spaced leads on the mounting leadframe 60.
  • step S40 includes an electrical connection member for electrically connecting at least two selected from the group consisting of the protection IC, the field effect transistor, an ID chip, and the plurality of leads.
  • step S50 may include exposing a portion of the mounting lead frame 60 and forming an encapsulant 250 for sealing the protection IC, the field effect transistor, the ID chip, and the passive elements. do.
  • 8C is a block diagram illustrating a battery protection circuit and a fuel gauge circuit that form part of a battery protection circuit module package according to another exemplary embodiment of the present invention.
  • a fuel gauge circuit is configured in the battery protection circuit configuration unit 131 including the battery protection circuit configured in FIG. 1 or the battery protection circuit configuration unit 131 including the battery protection circuit configured by modifying FIG. 1.
  • a unit 135 may be added to support the fuel gauge function.
  • the battery protection circuit component 131 may include a field effect transistor 110, a protection IC 120, and at least one passive element 130.
  • the fuel gauge function may include any or all of the additional functionality for the fuel gauge for a battery, a terminal with the battery, and the like.
  • the fuel gauge circuit configuration unit 135 may include, for example, a function of measuring the temperature, current, and / or voltage of the mobile phone battery in order to determine the remaining capacity of the mobile phone battery.
  • the added fuel gauge circuit component 135 may include, for example, a fuel gauge device (F / G device).
  • the fuel gauge device may include a multiplexer and an A / D converter.
  • the fuel gauge device may optionally further include a microprocessor and an oscillator having an internal memory.
  • the number, type, arrangement, and the like of the fuel gauge circuit configuration unit 135 illustrated in FIG. 8C are exemplary, and may be changed according to the use or arrangement of the fuel gauge function.
  • the fuel gauge circuit component 135 may be connected to the outside through the fuel gauge external connection terminal FG.
  • Fuel gauge external connection terminal (FG) may be composed of one terminal or two or more terminals according to the configuration, arrangement, function of the fuel gauge circuit component 135, and further, the second external connection terminal (TH) Terminals can also be used in common.
  • the first internal connection terminal B +, the second internal connection terminal B ⁇ , and / or the external connection terminals P +, P ⁇ , TH, and FG may include the battery protection circuit configuration unit ( 131 and / or the configuration that is electrically connected to the fuel gauge circuit component 135 is omitted, but any electrical connection is possible to implement the functions of the battery protection circuit and fuel gauge.
  • the fuel gauge external connection terminal is added to three external connection terminals P +, TH, and P-. Since the FG may be configured, the number of external connection terminals implemented in the battery protection circuit module package may be four or more. As described above with reference to FIG. 7, the battery protection circuit module package 300 according to an embodiment of the present invention may not be easily implemented in terms of miniaturization of the package when the number of external connection terminals is four or more.
  • the fuel gauge external connection terminal FG may correspond to the fourth external connection terminal 50-1 in the battery protection circuit module package 300 shown in FIG. 7.
  • 9B, 10B, 11, 12B and 13B illustrate a battery protection circuit module package and a battery pack according to another embodiment of the present invention, which can be integrated and miniaturized even when the number of external connection terminals is four or more. 14, 15, and 19 will be described. However, the previously described parts are duplicated and are omitted here.
  • the battery protection circuit module package 304b includes a terminal leadframe 70 and an element package 302b.
  • the terminal lead frame 70 includes leads 70-2, 70-3, 70-4, 70-5, and 70-6 for external connection terminals constituting a plurality of external connection terminals.
  • the plurality of external connection terminals may include four or more external connection terminals.
  • the terminal lead frame 70 may include the leads 70-5 for the fourth external connection terminal in addition to the leads P +, TH, and P ⁇ for the first to third external connection terminals.
  • a fifth external connection terminal lead 70-6 for example, the lead 70-5 for the fourth external connection terminal may be the fuel gauge external connection terminal FG of FIG. 8C.
  • the fifth external connection terminal lead 70-6 is configured to be connected to the second internal connection terminal lead 70-7 by changing the design of the terminal lead frame 70, for example.
  • the fuel gauge external connection terminal (FG) is composed of two or more of the plurality of terminals, if necessary, additional terminal for the external connection terminal may be further provided in the terminal lead frame 70.
  • the device package 302b includes a substrate on which battery protection circuit components 110, 120, and 130 and fuel gauge circuit components 135 are disposed.
  • the device package 302b may include a substrate on which the field effect transistor 110, the protection IC 120, and at least one passive element 130 are disposed.
  • the at least one passive element 130 may include the passive element shown in FIG. 1 or may include passive elements other than the fuel gauge circuit component 135 shown in FIG. 8C.
  • a fuel gauge element (F / G element) and at least one second passive element constituting the fuel gauge circuit component 135 illustrated in FIG. 8C may be disposed on the substrate.
  • the fuel gauge device may include at least one portion selected from the group consisting of a multiplexer, an A / D converter, a microprocessor having an internal memory, and an oscillator. Further, the fuel gauge device (F / G device) is a one-chip type device having at least two or more selected from the group consisting of a multiplexer, an A / D converter, a microprocessor having an internal memory, and an oscillator. It may also include.
  • the device package 302b may further include an encapsulant 250 that seals the battery protection circuit components 110, 120, and 130 and the fuel gauge circuit components 135.
  • the encapsulant 250 may include, for example, an epoxy molding compound (EMC).
  • the device package 302b is mounted on the terminal leadframe 70 to be electrically connected to the terminal leadframe 70.
  • the device package 302b may be mounted on the terminal leadframe 70 using surface mounting technology.
  • At least one exposed terminal 60-1, 60-2, 60-3, 60-4, or 60-5 may be formed on the bottom surface of the device package 302b.
  • the encapsulant 250 sealing the battery protection circuit components 110, 120, and 130 and the fuel gauge circuit components 135 are exposed terminals 60-1, 60-2, 60-3, 60-4, and 60. -5) to expose. Meanwhile, at least one exposed terminal 60-1, 60-2, 60-3, 60-4, 60-5 formed on the bottom surface of the device package 302b is bonded to at least a portion of the terminal lead frame 70.
  • the substrate on which the battery protection circuit components 110, 120, 130 and the fuel gauge circuit component 135 may be disposed in the device package 302b includes a lead frame, a printed circuit board, a ceramic substrate, It may include a glass substrate.
  • the substrate may include a mounting lead frame 60 having a plurality of mounting leads spaced apart from each other.
  • the battery protection circuit component mounted on the mounting leadframe 60 may include a field effect transistor 110, a protection IC 120, and at least one passive element 130.
  • the passive element 130 may include a capacitor, a resistor, and / or a varistor.
  • the fuel gauge circuit component 135 mounted on the mounting leadframe 60 may include a fuel gauge device (F / G device) and at least one second passive device.
  • the device package 302b including the mounting lead frame 60 may configure a battery protection circuit without using a separate printed circuit board. This configuration is arranged such that at least one passive element 130 and / or at least one or more second passive elements connect at least some of the spaced plurality of mounting leads, the field effect transistor 110, the protection IC. 120, a fuel gauge device (F / G device) and at least two selected from the group consisting of a plurality of mounting leads can be implemented by providing an electrical connection member for electrically connecting.
  • the electrical connection member may include a bonding wire or a bonding ribbon.
  • step S10 may include a mounting leadframe 60 including a plurality of spaced leads. And providing a protection integrated circuit (IC), a field effect transistor (FET), and a fuel gauge device on the mounting leadframe 60, and performing step S20.
  • Step (S30) is performed before and after), mounting the passive element 130 and / or the second passive element to connect at least some of the spaced plurality of leads on the mounting lead frame 60
  • the step S40 includes disposing an electrical connection member for electrically connecting at least two selected from the group consisting of the protection IC, the field effect transistor, the fuel gauge element, and the plurality of leads.
  • step (S50) exposing a portion of the mounting leadframe 60, and forming an encapsulant 250 for sealing the protection IC, the field effect transistor, the fuel gauge element and the passive element. It includes.
  • step (S20) and step (S30) may be performed in sequence, in reverse order, at the same time, or may be mixed with each other.
  • FIG. 15 is a perspective view illustrating a PTC structure constituting a battery protection circuit module package according to at least some embodiments of the present invention
  • FIG. 16 is a battery protection circuit module package according to at least some embodiments of the present invention
  • 17 is a perspective view illustrating a process of combining a battery protection circuit module package with a battery can according to at least some embodiments of the present disclosure.
  • a battery protection circuit module package includes a PTC structure 350.
  • the PTC structure 350 may include the PTC device 310, the metal layer 320 attached to the first surface, which is one of the top and bottom surfaces of the PTC device 310, and the other of the top and bottom surfaces of the PTC device 310. It includes a conductive connecting member (330, 340) attached to the second surface of the surface.
  • the metal layer 320 is bonded to any one of the leads selected from the first internal connection lead B + and the second internal connection lead B-, and the connection members 330 and 340 are electrodes of the battery bare cell. It may be bonded to the terminal 410 of FIG. 18.
  • the metal layer 320, the connection members 330 and 340, and the lead frame 50 may be made of nickel, copper, nickel plated copper, or other metal.
  • the metal layer 320 may be formed of any one of the first internal terminal lead (B +) and the second internal terminal lead (B-) and laser welding, resistance welding, soldering, and a conductive adhesive (eg, For example, it may be bonded in any one manner selected from the group consisting of a conductive epoxy), a conductive tape.
  • the PTC (Positive Temperature Coefficient) element 310 can be formed by, for example, dispersing conductive particles in a crystalline polymer. Accordingly, the PTC element 310 becomes a passage through which current flows between the metal layer 320 and the conductive connection members 330 and 340 below the set temperature. However, when the temperature rises above the set temperature due to overcurrent, the crystalline polymer expands and the connection between the conductive particles dispersed in the crystalline polymer is separated, thereby rapidly increasing the resistance. Therefore, the flow of current between the metal layer 320 and the conductive connecting members 330 and 340 is blocked or the flow of current is reduced.
  • the PTC device 310 serves as a safety device for preventing the battery from being ruptured.
  • the PTC device 310 shrinks the crystalline polymer and restores the connection between the conductive particles, thereby smoothly flowing the current.
  • the terminal leadframe 70 constituting the packages 304a and 304b of the battery protection circuit module is electrically connected to the electrode terminals of the battery bare cell via the PTC structure.
  • the second internal connection lead (B-, 70-7) of the terminal lead frame 70 may be electrically connected to the negative electrode terminal 410 of the battery bare cell through the PTC structure 350. have.
  • the second internal connection lead (B-, 70-7) of the terminal lead frame 70 is bonded to the metal layer 320 and through the conductive element 330, 340 via the PTC element 310 It is electrically connected to the negative terminal 410 of the battery bare cell.
  • the metal layer 320 is defined within the upper surface on the upper surface of the PTC device 310
  • the connection member 330, 340 is the negative terminal 410 of the battery bare cell on the lower surface of the PTC device 310 It can be configured to stretch until.
  • the connecting members 330 and 340 of the PTC structure are connected to the first connecting member 330 and the first connecting member 330 attached to one surface of the PTC element 310 to extend to the negative electrode terminal 410 of the battery bare cell. It may be composed of a second connecting member 340. Since the second connection member 340 should have an appropriate level so that the second connection member 340 can be bonded to the negative electrode terminal 410, a portion where the first connection member 330 and the second connection member 340 are connected may be bent.
  • the second connection member 340 is selected from the group consisting of the negative electrode terminal 410 of the battery bare cell, laser welding, resistance welding, soldering (soldering) and conductive adhesive (for example, conductive epoxy), conductive tape It can be joined in either way.
  • the length of the terminal leadframe 70 in the packages 304a and 304b of the battery protection circuit module having the above-described structure is such that the terminal leadframe 70 is the center of the upper surface of the battery bare cell (for example, the negative electrode). It may be configured to be disposed on one side with respect to the terminal (410). Furthermore, the packages 304a and 304b of the battery protection circuit module coupled with the PTC structure shown in FIG. 18 are disposed on one side of the battery bare cell based on the center of the upper surface of the battery bare cell (for example, the negative electrode terminal 410). It can be configured to. For example, the lengths of the packages 304a and 304b of the battery protection circuit module to which the PTC structure 350 is coupled may be half (L / 2) of the total length L of the cap plate 430.
  • the second internal connection lead (B-) and the PTC element 310 may be disposed directly below the lead B- for the internal connection terminal. Due to the above-described configuration of the PTC structure 350 and the configuration in which the device packages 302a and 302b are mounted on the terminal leadframe 70, the battery protection circuit module packages 304a and 304b according to some embodiments of the present invention.
  • the battery protection circuit module package may be mounted using only one side of the cap plate 430 based on the negative electrode terminal 410 of the battery, thereby miniaturizing or increasing the capacity of the battery.
  • an additional cell is formed in the other side region of the negative terminal 410 in which the packages 304a and 304b of the battery protection circuit module are not arranged to increase battery capacity or to place a chip having another additional function. This can contribute to miniaturization of the application product having such a battery.
  • the battery protection circuit module package is mounted using only one side area with respect to the center of the top surface of the battery bare cell while having four or more external connection terminals.
  • the battery can be miniaturized or high in capacity.
  • the battery protection circuit module package according to the embodiments of the present invention is not limited to this one-sided use, and may be configured to use the entire area of the top of the electrode cell of the battery.
  • a protection circuit is mounted on a printed circuit board (PCB) and a separate lead is mounted on the printed circuit board.
  • the lead frame can be formed using only the lead frame and can be connected to the battery cell at the same time, thereby reducing the manufacturing cost and significantly reducing the overall height. have. That is, since the printed circuit board typically has a thickness of about 2 mm, the lead frame has a thickness of about 0.8 mm, so that the battery can be miniaturized by the thickness difference or the battery size can be increased by the thickness difference. Can be implemented.
  • an electrical connection member such as a bonding wire or a bonding ribbon is disposed on the lead frame to configure a circuit
  • the process of designing and manufacturing a lead frame for constructing a battery protection circuit has an important advantage. If the electrical connection member is not introduced in the battery protection circuit in the embodiments of the present invention, it is difficult to effectively provide an appropriate lead frame because the configuration of the plurality of leads constituting the lead frame becomes very complicated.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

La présente invention concerne un boîtier de module de circuit de protection de batterie, lequel présente des avantages d'intégration et de réduction de taille. Ce boîtier comprend : un cadre de couvercle de borne ; et un boîtier de dispositif. Le cadre de couvercle terminal comprend : un premier couvercle de borne à connexion interne et un second couvercle de borne à connexion interne, lesquels sont disposés sur les deux parties de bord et lesquels sont connectés électriquement à une borne d'électrode d'un élément nu de batterie ; et un couvercle de borne à connexion externe, disposé entre le premier couvercle de borne à connexion interne et le second couvercle de borne à connexion interne, pour former un pluralité de bornes de connexion externe. Le boîtier de dispositif est installé sur le cadre de couvercle de borne de manière à être connecté électriquement au cadre de couvercle de borne et comprend un substrat sur lequel un dispositif de protection de batterie est disposé.
PCT/KR2014/003345 2013-04-17 2014-04-17 Boîtier de module de circuit de protection de batterie WO2014171757A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/784,324 US20160056444A1 (en) 2013-04-17 2014-04-17 Battery protection circuit module package
CN201480021858.4A CN105264691B (zh) 2013-04-17 2014-04-17 电池保护电路模块封装
US16/253,433 US10950845B2 (en) 2013-04-17 2019-01-22 Battery protection circuit module package

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
KR10-2013-0042566 2013-04-17
KR1020130042566 2013-04-17
KR10-2013-0043289 2013-04-19
KR1020130043291A KR101450221B1 (ko) 2013-04-17 2013-04-19 배터리 보호회로 모듈 패키지
KR1020130043290A KR101450220B1 (ko) 2013-04-17 2013-04-19 배터리 보호회로 모듈 패키지
KR1020130043289A KR101450219B1 (ko) 2013-04-17 2013-04-19 배터리 보호회로 모듈 패키지
KR10-2013-0043291 2013-04-19
KR10-2013-0043290 2013-04-19
KR10-2013-0046036 2013-04-25
KR1020130046036A KR101450222B1 (ko) 2013-04-17 2013-04-25 배터리 보호회로 모듈 패키지

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US14/784,324 A-371-Of-International US20160056444A1 (en) 2013-04-17 2014-04-17 Battery protection circuit module package
US16/253,433 Division US10950845B2 (en) 2013-04-17 2019-01-22 Battery protection circuit module package

Publications (1)

Publication Number Publication Date
WO2014171757A1 true WO2014171757A1 (fr) 2014-10-23

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PCT/KR2014/003345 WO2014171757A1 (fr) 2013-04-17 2014-04-17 Boîtier de module de circuit de protection de batterie

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WO (1) WO2014171757A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070044544A (ko) * 2005-10-25 2007-04-30 엘지이노텍 주식회사 하이브리드칩형 배터리 보호회로모듈
KR100791551B1 (ko) * 2007-08-17 2008-01-07 주식회사 퓨처라인 보호회로모듈과 이를 포함하는 전지 및 상기보호회로모듈을 포함하는 전지 제조 방법
KR20090081649A (ko) * 2008-01-24 2009-07-29 엘지이노텍 주식회사 배터리 팩 제조 방법
KR101087046B1 (ko) * 2007-11-29 2011-11-25 주식회사 엘지화학 Ｐｔｃ 소자가 장착된 탑 캡을 포함하는 전지팩

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070044544A (ko) * 2005-10-25 2007-04-30 엘지이노텍 주식회사 하이브리드칩형 배터리 보호회로모듈
KR100791551B1 (ko) * 2007-08-17 2008-01-07 주식회사 퓨처라인 보호회로모듈과 이를 포함하는 전지 및 상기보호회로모듈을 포함하는 전지 제조 방법
KR101087046B1 (ko) * 2007-11-29 2011-11-25 주식회사 엘지화학 Ｐｔｃ 소자가 장착된 탑 캡을 포함하는 전지팩
KR20090081649A (ko) * 2008-01-24 2009-07-29 엘지이노텍 주식회사 배터리 팩 제조 방법

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