WO2014171640A1

WO2014171640A1 - Instantaneous cooling device for cold water

Info

Publication number: WO2014171640A1
Application number: PCT/KR2014/002452
Authority: WO
Inventors: 권택율; 윤영균; 성기혁
Original assignee: 주식회사 리빙케어
Priority date: 2013-04-19
Filing date: 2014-03-24
Publication date: 2014-10-23
Also published as: KR101498047B1; CN105121983A; KR20140125638A; CN105121983B

Abstract

The present invention relates to an instantaneous cooling device for cold water, comprising: a finishing plate having a sealed flow path formed on the back side thereof and having an inlet pipe and an outlet pipe connected to the ends of the flow path; a thermoelectric module for thermoelectrically cooling water flowing inside the flow path of the finishing plate; a heat transfer plate interposed between the finishing plate and the thermoelectric module; and a water jacket which comes into close contact with the back side of the thermoelectric module and cools a radiating surface of the thermoelectric module using a water cooling manner. The present invention provides the advantages of: implementing a subminiature water purifier or the like when applied to a water purifier or the like having cold-water functions since the invention may be thin; saving electricity since cold water is extracted only in case of necessity; enabling users to continuously drink clean water since there is no need to install a cold water storage bin; enabling use in businesses due to the unlimited extraction of water; and allowing users to adjust the desired temperature of cold water.

Description

Instant chill water chiller

The present invention relates to a cooling device for instantaneous cold water, and more particularly, to a cooling device for instantaneous cold water, which is additionally installed in an electronic product such as a water purifier to supply cold water instantaneously.

Recently, as the size of electronic products is gradually reduced, various parts accommodated therein are also required to be reduced in size.

Recently, water purifiers are getting smaller and smaller, but their functions are the same or superior to existing products. Such a water purifier is typically provided with a water storage tank for storing water, and the water storage tank is provided with a cooling device to cool the stored water and make it cold. Since the size of such a cooling device is influenced by the size of electronic products, a thin cooling device is applied in consideration of the size.

A technology related to such a cooling device has been proposed in Patent Registration No. 0884645 and Patent Registration No. 1244476.

Hereinafter, the instantaneous cooling device for water purifier and the instantaneous cooling device for water purifier disclosed in Patent Registration No. 0884645 and Patent Registration No. 1244476 will be briefly described.

Figure 1 is a schematic diagram of the instantaneous cooling device for water purifiers in the patent registration No. 084645 (hereinafter referred to as 'prior art 1'). As shown in FIG. 1, the instantaneous cooling apparatus for the water purifier of the prior art 1 includes an antifreeze tank 110 accommodating an antifreeze 111 therein, and an antifreeze cooling unit configured to cool the antifreeze 111 in the antifreeze tank 110. 130, an antifreeze circulating unit 140 for circulating the antifreeze in the antifreeze tank 110 through a circulation pipe 141 provided outside the antifreeze tank 110, and an antifreeze and purification inside the circulation pipe 141. And a heat exchanger 160 for cooling the purified water inside the purified water pipe 163 by heat-exchanging purified water inside the purified water pipe 163 through which purified water flows in. The circulation pipe 141 is provided in the heat exchanger 160. The control unit 170 may further include an amount of heat exchange between the antifreeze inside and the purified water inside the purified water pipe 163.

However, the instantaneous cooling device for water purifiers according to the prior art 1 has a problem in that the volume of a refrigerant supply-related accessory device for cooling water increases, and the consumption of electricity due to the driving of the cooling coil increases.

Figure 2 is a configuration diagram showing the instantaneous cooling device for water purifier in the patent registration No. 1244476 (hereinafter referred to as 'prior art 2'). As shown in FIG. 2, the instantaneous cooling apparatus for a water purifier according to the related art includes a plurality of purified water filters 10 for filtering raw water supplied from raw water supply means, and a purified water tank for storing purified water filtered by the purified water filter 10. (20), the cooling tank 40 is connected to the purified water tank 20 through a cooling pipe 30 to cool the purified water, and the cooling tank 40 is cooled to a cryogenic state so that the purified water cooling tank 40 In the water purifier including a cooling cycle 50 to be cooled by the cooling and the water discharge pipe 70 is connected to the cooling tank 40 and the cold water intake coke 60 to allow the cooled cold water to be discharged. A control valve 110 installed in the cooling pipe 30 adjacent to the cooling tank 40 to open and close the cooling pipe 30 so that the flow rate of the purified water flowing in the cooling pipe 30 is controlled; A cooling structure (120) configured inside the cooling tank (40) to extend a contact area at the same time as extending the moving path of purified water introduced into the cooling tank (40); A hydraulic valve 130 installed at the cooling tube 30 to allow the purified water to flow into the cooling tank 40 at a constant water pressure when the cooling tube 30 is opened by the control valve 110; An air filter (140) installed at an upper side of the control valve (110) to prevent contaminants from being introduced from the outside through a through hole (115) formed in the control valve (110); And control means 150 for controlling the control valve 110 to open the cold water pipe 40 when the cold water intake coke 60 is opened. The control valve 110 includes the purified water tank. It is a water intake valve connecting the cooling pipe 30 between the 30 and the cooling tank 40 so as to be bent in a '-' shape, and between the inlet portion 31 and the outlet portion 32 of the cooling tube 30. Cork valve body 111 to connect the letter 'a', the cock opening and closing member 113 is inserted into the cock valve body 111 to open and close the cold water passage 112, and the cock opening and closing member 113 Is coupled to the elevating means 114 and the coke opening and closing member 114 to open or close the cold water passage 112 by moving the cock opening and closing member 113 up or down when the operation signal of the control means 150 is provided. An elastic spring 115 provided on the upper side and the inside of the cock valve body 111, and a through hole formed in the longitudinal direction in the cock opening and closing member 113 (1) 16).

However, the instantaneous cooling device for water purifier according to the prior art 2 increases the volume of the refrigerant supply-related accessories for cooling the water, increases the electricity consumption according to the operation of the cooling cycle, and includes a cooling tank to cool the water over time. There was a problem that the quality of the water stored in the tank is degraded.

An object of the present invention is to solve the problems of the prior art as described above, it is possible to implement a thin water, so when applied to a water purifier with a cold water function is possible to implement a micro water purifier, etc. It is possible to save energy, and it is not necessary to have a cold water reservoir, and it is possible to drink clean water at all times, and it is possible to use it for commercial use because it can be infinitely extracted, and it provides an instant cold water cooling device that can adjust the cold water temperature desired by the user. It is.

According to a feature of the present invention for achieving the above object, the present invention, the sealing plate is formed on the rear surface, the closing plate is connected to the inlet pipe and the discharge pipe at both ends of the flow path; A thermoelectric module for thermoelectric cooling of water flowing in the flow path of the closing plate; A heat transfer plate interposed between the closure plate and the thermoelectric module; And a water jacket in close contact with the rear surface of the thermoelectric module and cooling the heat dissipating surface of the thermoelectric module in a water cooling manner.

In addition, the present invention may further include a closing plate that is in close contact with the rear surface of the closing plate is formed in a separate flow path formed on the surface symmetrical to communicate with the flow path of the closing plate.

In addition, the present invention may further include a closing plate in close contact with the rear surface of the flow path plate.

In addition, the finishing plate in the present invention may be formed of silicon or Teflon material.

In addition, the present invention is provided with a valve provided to control the flow rate of the water flowing into the inlet pipe and a temperature sensor for sensing the temperature of the water discharged to the discharge pipe is provided to control the outlet temperature through the temperature of the water sensed by the sensor The control unit may be further provided.

In addition, the thermoelectric module in the present invention may be provided with a bulk (bulk) type or skeleton (skeleton) type.

In addition, the thermoelectric module according to the present invention has a skeleton-like, P-type and N-type elements sequentially arranged, coating layers formed on both sides of the P-type and N-type elements, and on both sides of the P-type and N-type elements. An electrode may be alternately attached, and a bonding layer may be interposed between the both-side coating layers of the P-type and N-type elements and both sides of the electrode to temporarily fix the electrode.

According to the present invention, since it is possible to implement a thinner, when applied to a water purifier provided with a cold water function, it is possible to implement a micro water purifier, etc., and to extract electricity only when necessary, thus saving electricity and eliminating the need for a cold water reservoir. It is possible to drink clean water, and infinitely extractable, so it can be used enough for commercial use, and it is possible to adjust the cold water temperature desired by the user.

1 is a schematic diagram of an instantaneous cooling apparatus for a water purifier according to the prior art 1. FIG.

2 is a block diagram showing the instantaneous cooling device for water purifier according to the prior art 2.

3 is an exploded perspective view of an apparatus for cooling instantaneous cold water according to a first embodiment of the present invention.

4 is a cross-sectional view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention.

5 is a combined perspective view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention.

6 is a schematic diagram illustrating a state in which the instantaneous cold water cooling apparatus according to the first embodiment of the present invention is associated with a control unit.

7 and 8 are a side view and a process diagram of the skeletal thermoelectric module in the instantaneous cold water cooling apparatus according to the first embodiment of the present invention.

9 is a cross-sectional view of an instant chill water cooling apparatus according to a second embodiment of the present invention.

The terms or words used in the present specification and claims are meant to be consistent with the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to best explain his invention. It must be interpreted as and concepts.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless otherwise stated. In addition, the term "... unit" described in the specification means a unit for processing at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software.

Hereinafter, with reference to the drawings will be described in detail the configuration of the embodiment for the instantaneous cold water cooling apparatus according to the present invention.

3 is an exploded perspective view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention, and FIG. 4 is a cross-sectional view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention. 5 is a combined perspective view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention, and FIG. 6 is a schematic diagram of a state in which the instantaneous cold water cooling apparatus according to the first embodiment of the present invention is associated with a control unit. 7 and 8 illustrate a skeletal thermoelectric module in the instantaneous cold water cooling apparatus according to the first embodiment of the present invention.

According to these drawings, the instantaneous cold water cooling apparatus 100 according to the first embodiment of the present invention is the flow path plate 110, the closing plate 120, the heat transfer plate 130, the thermoelectric module 140, the water jacket ( 150) and the controller (C).

In the flow path plate 110, through

holes

112 and 114 are formed in both ends of an upper surface thereof in a thickness direction, and a semicircular flow path 116 is formed on a bottom surface thereof. In this case, the through

holes

112 and 114 are formed at both ends of the flow path 116, respectively.

In addition, a groove having a set depth is formed on the bottom surface of the flow path plate 110 so as to accommodate the finish plate 120, the heat transfer plate 130, and the thermoelectric module 140, which will be described later, on the inner side of the flow path plate 110. On the other hand, the flow path plate 110 is formed of a material such as synthetic resin.

The closing plate 120 is formed of a silicon material or the like and is in close contact with the bottom surface of the flow path plate 110, and has a semicircular flow path 126 formed to communicate with the flow path 116 formed on the bottom surface of the flow path plate 110. Is formed on the upper surface.

That is, the closing plate 120 is connected to both ends of the flow path 126 in the inlet pipe 122 and the discharge pipe 124 in the orthogonal direction is in close contact with the bottom surface of the flow path plate 110 the inlet pipe 122 And the discharge pipe 124 is inserted into the through

holes

112 and 114 and exposed to the outside.

And the inlet pipe 122 is provided with an automatic valve (V) to control the inflow flow rate, the discharge pipe 124 is provided with a temperature sensor (S) for sensing the temperature of the water discharged.

The heat transfer plate 130 is provided to increase the heat transfer efficiency to the finish plate 120 according to the heat absorption in the thermoelectric module 140 disposed in close contact with the bottom surface of the finish plate 120. In this case, the heat transfer plate 130 is illustrated as being made of sus (Stainless Use Steel) material, but is not limited thereto and may be changed to ceramic, aluminum, and high temperature glass.

A plurality of thermoelectric modules 140 are in close contact with the bottom surface of the heat transfer plate 130, and when power is applied, the thermoelectric module 140 absorbs heat at one junction and emits heat at the other junction according to the Peltier effect. Here, the thermoelectric module is an environmentally friendly energy material capable of converting thermal energy and electrical energy. The p-type and n-type thermoelectric semiconductors in the form of chips are electrically mounted in series with ceramic substrates such as alumina interposed therebetween. have. In particular, when electrical energy is applied to the thermoelectric module, the charges (electrons, holes) inside the thermoelectric semiconductor absorb the thermal energy at one end of the thermoelectric module and move to the opposite side, whereby one side of the thermoelectric module is cooled and the opposite side is Fever occurs. At this time, the thermoelectric module 140 is in close contact with the bottom surface of the heat transfer plate 130, the heat dissipation surface is in close contact with the water jacket 150 to be described later.

On the other hand, the thermoelectric module 140 may be applied to the bulk (bulk) type or skeleton (skeleton) type.

Although not illustrated in the drawing, the bulk type thermoelectric module 140 includes P-type and N-type devices electrically connected to the upper and lower substrates on which electrode patterns are formed and soldered on the electrode patterns of the upper and lower substrates. do. In this case, an insulating layer may be formed on surfaces of the upper and lower substrates, and terminal lines are soldered and attached to apply power to both ends of the electrode patterns.

Further, the P-type and N-type elements are alternately arranged in the electrode patterns of the upper and lower substrates. That is, upper surfaces of one P-type and N-type devices are electrically connected through electrode patterns formed on the bottom of the upper substrate, and lower surfaces of the other N-type and P-type devices are electrically connected through the electrode patterns formed on the upper surface of the lower substrate. Are alternately connected.

7 and 8 are skeletal thermoelectric modules in a vehicle steering wheel capable of temperature control according to the present invention are shown in side and process views.

If the thermoelectric module 140 is skeletal, the structure of the thermoelectric module 140 has upper and

lower electrodes

142 and 144 and upper and

lower bonding layers

142a and 144a as shown in FIG. 7. , Upper and lower coating layers 142b and 144b, an N-type element 146 and a P-type element 148, and in order to maximize the amount of current generation, it is preferable to increase the temperature difference between the heat absorbing surface and the heat generating surface.

The thermoelectric module 140 of the present invention has a structure in which an upper coating layer 142b, an upper bonding layer 142a, and an upper electrode 142 are sequentially stacked on the upper surfaces of the N-type element 146 and the P-type element 148. The lower coating layer 144b, the lower bonding layer 144a, and the lower electrode 144 are sequentially stacked on the bottom surfaces of the N-type element 146 and the P-type element 148.

The upper and

lower bonding layers

142a and 144a are formed on the opposite surfaces (electrode attachment surfaces) of the upper and lower

ceramic substrates

140a and 140b as temporary substrates by printing according to the upper and lower electrode patterns according to models. (Glue) An adhesive layer by an adhesive or the like or an adhesive layer by an adhesive may be formed.

The upper and

lower electrodes

142 and 144 may be formed of a material such as copper (oxygen-free copper), and may be changed to a material having excellent electric and thermal conductivity, and the anode and the cathode may be connected to the double lower electrode 144. .

The n-type element 146 and the P-type element 148 are π-type so that a plurality of elements are sequentially installed between the upper and

lower electrodes

142 and 144 so as to be energized by the upper and

lower electrodes

142 and 144. While being connected in series.

In this case, the N-type device 146 and the P-type device 148 are formed on both surfaces thereof to form coating layers 142b and 144b to improve adhesion to the upper and

lower electrodes

142 and 144, and the N-type device ( 146 and the P-type element 148 and the upper and

lower electrodes

142 and 144 may be prevented from interdiffusion.

Thus, in the state where the N-type element 146 and the P-type element 148 are alternately arranged, both surfaces of the N-type element 146 and the P-type element 148 are provided through the upper and

lower electrodes

142 and 144. It is alternately connected, and the connection shape through the upper and

lower electrodes

142 and 144 may be arranged in a zigzag shape or the like to widen the temperature transfer area.

Method of manufacturing a skeletal thermoelectric module according to the present embodiment is a device preparation step, electrode preparation step, electrode alignment step, bonding layer forming step, electrode temporary fixing step, solder printing step, device mounting step, A soldering step and a substrate and jig stripping step.

The device preparation step is to improve adhesion to the upper and

lower electrodes

142 and 144 on both surfaces of the N-type element 146 and the P-type element 148, that is, the electrode attachment surface, and the N-type element 146 and the P Forming the coating layers 142b and 144b for the purpose of preventing mutual diffusion between the type device 148 and the upper and

lower electrodes

142 and 144.

Here, the device preparation step is subdivided into a primary coating layer shape step and a secondary coating layer forming step when the upper and lower coating layers 142b and 144b are formed.

The primary coating layer formed by the primary coating layer shape step is a layer coated with Ni (nickel), W (tungsten), Mo (molybdenum) and the like. The secondary coating layer formed by the secondary coating layer forming step is a layer coated with Au (gold), Sn (tin), or the like.

Meanwhile, when forming the upper and lower coating layers 142b and 144b, the first coating layer may be omitted and only the second coating layer may be formed. Furthermore, the upper and lower coating layers 142b and 144b may be formed by a plating method or a deposition method, and may be embodied by an electric or electroless method as the plating method, and the sputtering method as the deposition method. , Ion plating, spray coating, or the like.

The electrode preparation step is to prepare the upper and

lower electrodes

142 and 144 formed of a material such as copper (oxygen-free copper). In this case, the upper and

lower electrodes

142 and 144 may be changed to a material having excellent electric and thermal conductivity.

Meanwhile, in the electrode preparation step, a step of forming a coating layer on the upper and

lower electrodes

142 and 144 may be further included, and the coating layer may include the N-type element 146 and the P-type element 148 in the device preparation step. The upper and lower coating layers 142b and 144b formed on both surfaces may be performed in advance in the same purpose and method.

Here, the electrode preparation step may be implemented by a plating method such as electric or electroless. The upper and

lower electrodes

142 and 144 may be used without a coating layer.

In the electrode alignment step, the upper and

lower electrodes

142 and 144 may be aligned using an alignment jig (not shown) to match the electrode pattern for each model of the thermoelectric module 140. At this time, the electrode aligning step is not shown in the figure, the electrode alignment jig (electrode fixing) film (adhesive tape) is attached to the electrode alignment jig in which the upper and lower electrodes (142, 144) is inserted and temporarily fixed and then electrode alignment This is the step of aligning the position through the automatic (vibration / vibration method). In other words, the electrode aligning step is to align through the electrode alignment jig inserted into each of the upper and

lower electrodes

142 and 144.

The bonding layer forming step may be performed by printing the upper and

lower bonding layers

142a and 144a on the opposing surfaces (electrode attachment surfaces) of the upper and lower

ceramic substrates

140a and 140b as temporary substrates according to the upper and lower electrode patterns for each model. In the step of forming through, the upper and

lower bonding layers

142a and 144a may be formed through an adhesive layer by a glue adhesive or an adhesive layer by an adhesive. (See Fig. 8 (a), (b), (e), (f))

Here, the upper and lower

ceramic substrates

140a and 140b are not limited thereto, and may be changed to a substrate made of various materials used to temporarily adhere the electrodes.

Further, in the bonding layer forming step, the upper and

lower bonding layers

142a and 144a are alternately arranged on opposite surfaces of the upper and lower

ceramic substrates

140a and 140b. This is because the elements are continuously arranged in the order of the N-type element 146, the P-type element 148, the N-type element 146, and the P-type element 148, so that the adjacent N-type element 146 of the elements and The upper bonding layer 142a is formed to be arranged to connect the upper surface of the P-type element 148 to the upper electrode 142 through the upper bonding layer 142a, and the N-type and the neighboring P-type element 148 are formed. The lower bonding layer 144a may be arranged to connect the bottom surface of the device 146 to the lower electrode 144 through the lower bonding layer 144a. Thus, the upper and

lower electrodes

142 and 144 alternately connect the N-type element 146 and the P-type element 148 in the upper and lower surfaces.

The electrode temporary fixing step is a step of bonding and fixing the upper and

lower electrodes

142 and 144 arranged on the upper and

lower bonding layers

142a and 144a of the upper and lower

ceramic substrates

140a and 140b in a predetermined pattern, respectively. . (See Fig. 8 (c), (g))

The solder printing step is to print the upper and

lower solder layers

143a and 143b on the upper and

lower electrodes

142 and 144 respectively mounted on the upper and lower

ceramic substrates

140a and 140b in a set pattern. (See Fig. 8 (d), (h))

Here, in the solder printing step, the upper and

lower solder layers

143a and 143b may be formed on the upper and

lower electrodes

142 and 144 mounted on the upper and lower

ceramic substrates

140a and 140b by solder. Through the printing step according to the pattern, or alternatively through the electrode alignment step without going through the bonding layer forming step and the electrode temporary fixing step, the upper electrode, the lower electrode (142, 144) is inserted into the alignment jig in the state, The upper and

lower solder layers

143a and 143b may be printed on the exposed surfaces of the

lower electrodes

142 and 144 in accordance with the electrode pattern for each model.

In this case, the upper and

lower solder layers

143a and 143b are modeled using solder on the upper and

lower electrodes

142 and 144 mounted on the upper and lower

ceramic substrates

140a and 140b which are one of the solder printing steps. The printing according to the star electrode pattern may be performed through a solder printer. In addition, the upper and lower electrodes 142 are inserted into the alignment jig while the upper and

lower electrodes

142 and 144 are inserted into the alignment jig through the electrode alignment step without the bonding layer forming step and the electrode temporary fixing step. The printing of the upper and

lower solder layers

143a and 143b according to the electrode pattern for each model using solder on the exposed surface of the 144 may also be performed through a solder printer.

In the device mounting step, the N-type device 146 and the P-type device 148 are sequentially mounted on the lower solder layer 143b printed on the lower ceramic substrate 140b. The N-type device 146 And a first detailed step of sequentially arranging the P-type elements 148 on the lower ceramic substrate 140b on which the lower solder layer 143b is printed, and printing the lower solder layer 1143b. A second detailed step of aligning and mounting the N-type element 146 and the P-type element 148 on the lower ceramic substrate 140b, and the N-type after aligning the lower electrode 144. The element 146 and the P-type element 148 may be performed in any one of the third detailed steps of mounting the aligned element alignment jig. (See FIG. 8 (i), (j))

That is, the first sub-step of the device mounting step includes device adsorption of the N-type element 146 and the P-type element 148 in a device alignment jig in which the N-type element 146 and the P-type element 148 are aligned. The lower solder layer 143b is mounted on the printed lower electrode 144 after being adsorbed by a mounting mount or the like.

In the second detailed step of the device mounting step, an element alignment jig is mounted on the lower electrode 144 on which the lower solder layer 143b is printed, and the N-type element 146 and the P-type element 148 are mounted. It shows how to align and mount.

Lastly, in the third detailed step of the device mounting step, the N-type device 146 is formed by adsorbing the lower electrode 144 onto the device alignment jig in which the lower electrode 144 is aligned, such as an element adsorption mounting mounter. ) And the P-type element 148 are mounted on the aligned alignment jig.

In particular, in the first, second, and third detailed steps, the N-type element 146 and the P-type element 148 are inserted into holes in the device alignment jig (holes are formed in the pattern of the element) and then the element is aligned. The jig for stirring is used to align the N-type element 146 and the P-type element 148.

The soldering step is a step of soldering the first substrate S1 which is the upper substrate after sequential mounting of the N-type element 146 and the P-type element 148 on the first substrate S2 which is the lower substrate. [See FIG. 8 (k)]

In this case, the soldering step may be divided into a first sub-step and a second sub-step, and any one of these steps may be alternatively performed.

In this case, the first detailed step of the soldering step may include mounting the N-type device 146 and the P-type device 148 and then attaching the N-type device 146 and the P-type device 148 to the first substrate S1. It is a step of mounting on the soldering process.

Next, the second sub-step of the soldering step may be performed by performing the second and third sub-steps of the device mounting step so that the jig for aligning the device is mounted after the N-type device 146 and the P-type device 148 are mounted. This is the step of soldering while bonded.

In addition, the soldering step may be implemented through a reflow furnace or hot plate process.

The substrate and jig removal step is to remove the upper and lower

ceramic substrates

140a and 140b and the alignment jig from the manufactured thermoelectric module 140. (See FIG. 8 (l), (m))

More specifically, the substrate and jig stripping step may be performed by continuously performing the first sub-step of the soldering step, and the soldered N-type element 146 and P-type element 148 are temporary substrates through washing solution and ultrasonic cleaning. The first sub-step of separating the lower

ceramic substrates

140a and 140b and the second sub-step of the soldering step are successively soldered to the N-type element 146 and the P-type element 148 and the alignment jig. The second detailed step of separating from the thermoelectric module 140 through the washing solution and ultrasonic cleaning can be performed alternatively.

The water jacket 150 is in close contact with the bottom surface of the thermoelectric module 140 while the bottom edge of the flow path plate 110 is in close contact with the top edge to cool the heat dissipation surface of the thermoelectric module 140 by water cooling. At this time, the water jacket 150 is formed so that the cold water flows therein, the cold water inlet pipe and the cold water discharge pipe is in communication with each other.

The control unit (C) controls the operation of the automatic valve (V) installed in the inlet pipe (122) so as to control the amount of current and whether or not the current is applied to the thermoelectric module (140) and to control the flow rate of the incoming water, According to the result of the temperature sensor S installed in the 124, the temperature control of the cold water desired by the user can be controlled by controlling the thermoelectric module 140.

On the other hand, the control unit (C) includes a control board (not shown in the figure) that can control the water exit temperature by sensing the water exit unit temperature.

Therefore, the instantaneous cold water cooling device 100 according to the present invention is installed inside the water purifier, and when the user is required to use cold water, power is applied to the thermoelectric module 140 through the control of the controller C.

Next, the heat absorbing surface of the thermoelectric module 140 is absorbed while flowing along the

flow paths

116 and 126 of the flow path plate 110 and the closing plate 120 through the heat transfer plate 130 in close contact with the heat absorbing surface. Cold water is transferred to the water to become cold water. On the other hand, the heat dissipation surface of the thermoelectric module 140 is cooled by the cooling water of the water jacket 150 in close contact with the heat dissipation surface. As such, the cold water is continuously discharged through the inlet pipe 122 while being discharged through the discharge pipe 124.

In addition, when the temperature control of the cold water is required, the temperature sensor S installed in the discharge pipe 124 detects the temperature of the discharge water and then controls the amount of current applied from the controller C to the thermoelectric module 140.

After all, the present invention is installed in a cold water cooler to minimize the charge area, so it is possible to implement an ultra-small cold water cooler, and to save electricity by applying power to the thermoelectric module 140 only when cold water is required to extract cold water. It is possible to supply clean water at all times by instantaneous cold water storage without separate cold water reservoir, and can be used for commercial use by infinite extraction by instantaneous cold watering, and can control cold water discharge temperature by checking the temperature of cold water. have.

9 is a cross-sectional view of an apparatus for cooling instantaneous cold water according to a second embodiment of the present invention.

According to this figure, the instantaneous cold water cooling apparatus 200 according to the second embodiment of the present invention is the flow path plate 210, the closing plate 220, heat transfer plate 230, thermoelectric module 240, water jacket ( 250 and a control unit C, wherein the flow path plate 210, the heat transfer plate 230, the thermoelectric module 240, the water jacket 250, and the control unit C, except for the closing plate 220, are included. Has the same structure and function as that of the first embodiment, and thus a detailed description thereof will be omitted.

Unlike the first embodiment, the closing plate 220 does not have a flow path formed on the upper surface of the flow path plate 210, which is in contact with the bottom surface of the flow path plate 210, and is formed of silicon or Teflon material. As such, since the water flows through the flow path 216 formed on the bottom surface of the flow path plate 210, the flow path may be omitted on the top surface of the finish plate 220.

On the other hand, although not shown in the drawing, the closing plate 220 is not sealed with the flow path 216 of the flow path plate 210 by the closing plate 220, and only the portion of the flow path 216 is subjected to a separate sealing process. Can be omitted.

On the other hand, reference numeral 222, which is not described, is an inlet pipe, and 224 is an outlet pipe.

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains various modifications and variations from such descriptions. This is possible.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims below but also by the equivalents of the claims.

The present invention relates to a chiller for instantaneous cold water, the present invention, the sealing plate is formed on the rear surface, the closing plate is connected to the inlet pipe and the discharge pipe at both ends of the flow path; A thermoelectric module for thermoelectric cooling of water flowing in the flow path of the closing plate; A heat transfer plate interposed between the closure plate and the thermoelectric module; And a water jacket in close contact with the rear surface of the thermoelectric module to cool the heat dissipation surface of the thermoelectric module in a water cooling manner.

Claims

A flow path plate formed on a rear surface of the flow path, the inflow pipe and the discharge pipe connected to both ends of the flow path;

A thermoelectric module for thermoelectric cooling of water flowing in the passage of the passage plate;

A heat transfer plate interposed between the flow path plate and the thermoelectric module; And

And a water jacket in close contact with the rear surface of the thermoelectric module and cooling the heat dissipating surface of the thermoelectric module in a water cooling manner.
The method of claim 1,

And a finishing plate in close contact with the back surface of the flow path plate and having a separate flow path symmetrically formed to communicate with the flow path of the flow path plate.
The method of claim 1,

Cooling device for the instant cold water further comprises a closing plate in close contact with the back surface of the flow path plate.
The method according to claim 2 or 3,

Cooling device for instantaneous cold water is formed in the finishing plate is made of silicon or Teflon material.
The method of claim 1,

A valve is provided to control the flow rate of the water flowing into the inlet pipe, and a temperature sensor for sensing the temperature of the water discharged to the discharge pipe is further provided to control the outlet water through the temperature of the water sensed by the sensor Cooling device for instant cold water provided.
The method of claim 1,

The thermoelectric module is a bulk type (bulk) or skeleton (skeleton) type instantaneous cold water cooling device.
The method of claim 6,

The thermoelectric module has a skeleton type, sequentially arranged P-type and N-type elements, coating layers formed on both sides of the P-type and N-type elements, electrodes alternately attached to both sides of the P-type and N-type elements, and And a bonding layer interposed between both surfaces of the P-type and N-type elements and both surfaces of the electrode to temporarily fix the electrode.