KR101498047B1 - Cooling device for instant cold water - Google Patents

Abstract

The present invention relates to a cooling device for instantaneous cold water. The present invention relates to a cooling device for instantaneous cold water, comprising: a finishing plate having a sealed flow path formed on its back surface and connected to both ends of the flow path; A thermoelectric module for thermo-cooling the water flowing in the flow path of the finishing plate; A heat transfer plate interposed between the finishing plate and the thermoelectric module; And a water jacket closely attached to the back surface of the thermoelectric module to cool the heat radiating surface of the thermoelectric module by a water cooling method.
According to the present invention, since it can be implemented thinly, it is possible to realize a miniature water purifier or the like when applied to a water purifier provided with a cold water function, and can save electricity by extracting cold water only when necessary, It is possible to drink clean water and can be used indoors because it can be infinitely extracted, and it is possible to control the cold water temperature desired by the user.

Description

TECHNICAL FIELD [0001] The present invention relates to a cooling device for instantaneous cold water,

The present invention relates to a cooling device for instantaneous cold water, and more particularly, to a cooling device for instantaneous cold water that is installed in an electronic product such as a water purifier to instantaneously supply cold water.

2. Description of the Related Art In recent years, as the size of electronic products has been gradually reduced, various components accommodated therein have also been required to be reduced in size.

As the size of water purifiers that have been released recently is getting smaller, the function is the same as existing ones, or the demand is rising due to superiority of existing ones. Such a water purifier typically has a water storage tank for storing water, and the water storage tank is provided with a cooling device for cooling the stored water to cool water. Since the size of the cooling device is influenced by the size of the electronic product, a thin cooling device is applied when considering the size.

Technologies relating to such a cooling device have been proposed in Patent Registration No. 0884645 and Patent Registration No. 1244476. [

Hereinafter, the instantaneous cooling device for a water purifier and the instantaneous cooling device for a water purifier disclosed in the patent registration No. 0884645 and the patent registration No. 1244476 are described briefly.

1 is a schematic view of an instantaneous cooling device for a water purifier in Patent Registration No. 0884645 (hereinafter referred to as "Prior Art 1"). 1, an instantaneous cooling device for a water purifier according to the prior art 1 includes an antifreeze tank 110 for containing an antifreezing liquid 111 therein, an antifreeze liquid cooling unit for cooling the antifreeze liquid 111 in the antifreeze tank 110 An antifreeze liquid circulation unit 140 for circulating the antifreeze liquid in the antifreeze tank 110 through a circulation pipe 141 installed outside the antifreeze tank 110 and an anti- And a heat exchanging unit 160 for exchanging the purified water in the purified water pipe 163 through which purified purified water flows into the purified water pipe 163 to cool the purified water in the purified water pipe 163. In the heat exchanging unit 160, And a control unit 170 for controlling an amount of heat exchange between the antifreeze inside the purified water pipe 163 and the purified water inside the purified water pipe 163. [

However, the instantaneous cooling apparatus for a water purifier according to the prior art 1 has a problem in that the volume of a refrigerant supply-related accessory for cooling water is increased, and the amount of electricity consumed by driving the cooling coil is increased.

2 is a configuration diagram showing an instantaneous cooling device for a water purifier in Patent Registration No. 1244476 (hereinafter referred to as "Prior Art 2"). As shown in FIG. 2, the instantaneous cooling apparatus for a water purifier according to the related art includes a plurality of water filters 10 for filtering the raw water supplied from the water supply means, a purified water tank 10 for storing the purified water by the water filter 10, A cooling tank 40 connected to the purified water tank 20 through a cooling pipe 30 to cool the purified water and a cooling water tank 40 for cooling the cooling tank 40 to a cryogenic temperature, And a water outlet pipe (70) connected to the cooling tank (40) and the cold water intake cock (60) to allow the cooled cold water to flow out, characterized in that the water purifier A control valve 110 installed in the cooling pipe 30 adjacent to the cooling tank 40 to open and close the cooling pipe 30 so as to control the flow rate of the purified water flowing in the cooling pipe 30; A cooling structure 120 formed inside the cooling tank 40 for extending a flow path of purified water introduced into the cooling tank 40 and increasing a contact area; A water pressure valve (130) installed in the cooling pipe (30) and allowing the purified water to flow into the cooling tank (40) at a constant water pressure when the cooling pipe (30) is opened by the control valve (110); An air filter 140 installed at an upper portion of the control valve 110 to prevent contaminants from being introduced from the outside through a through hole 115 formed in the control valve 110; And a control means (150) for controlling the control valve (110) to open the cold water pipe (40) in operation for opening the cold water intake cock (60), wherein the control valve Is a water intake valve for connecting the cooling pipe 30 between the cooling water tank 30 and the cooling tank 40 so as to be bent in the shape of an letter A. The cooling water pipe 30 is connected between the inlet 31 and the outlet 32 A cock opening and closing member 113 which is inserted into the cock valve body 111 and opens and closes the cold water passage 112; The elevating means 114 for opening and closing the cold water path 112 by raising or lowering the cock opening and closing member 113 when the operation signal of the control means 150 is provided, An elastic spring 115 provided on the upper side of the cock valve body 111 and an inner side of the through hole 1 formed in the longitudinal direction of the cock opening and closing member 113, 16).

However, in the instant cooling device for a water purifier according to the prior art 2, the volume of a refrigerant supply-related accessory for cooling water is increased, the amount of electricity consumed by driving the cooling cycle is increased, The quality of the water stored in the tank is deteriorated.

KR 0884645 B1 KR 1244476 B1

An object of the present invention is to solve the problems of the prior art as described above, and it is possible to implement a thin water purifier when it is applied to a water purifier provided with a cold water function, It is not necessary to provide a cold water reservoir and thus it is possible to always drink clean water, to be infinitely extracted, to be used for business purposes sufficiently, and to provide an instantaneous cold water cooling device capable of adjusting a desired cold water temperature .

According to an aspect of the present invention, there is provided a vacuum cleaner comprising: a finishing plate having a channel-sealed channel formed on a back surface thereof, and an inlet pipe and a discharge pipe being connected to both ends of the channel; A thermoelectric module for thermo-cooling the water flowing in the flow path of the finishing plate; A heat transfer plate interposed between the finishing plate and the thermoelectric module; And a water jacket which is in close contact with the back surface of the thermoelectric module and cools the radiating surface of the thermoelectric module by a water cooling method.

According to another aspect of the present invention, there is further provided a finishing plate having a surface formed on the rear surface of the finishing plate, the finishing plate having a symmetrically formed flow path communicating with the path of the finishing plate.

In addition, the present invention may further include a finishing plate that is in close contact with the back surface of the flow path plate.

Further, the finishing plate in the present invention may be formed of silicon or Teflon.

According to the present invention, there is provided a valve for controlling the flow rate of water flowing into the inflow pipe and a temperature sensor for sensing the temperature of water discharged to the discharge pipe, and controlling the outflow temperature through the temperature of the water sensed by the sensor A control unit may be further provided.

Further, the thermoelectric module in the present invention may be provided in a bulk type or a skeleton type.

The thermoelectric module according to the present invention is a thermoelectric module including a P-type and an N-type device sequentially arranged in a skeletal form, a coating layer formed on both surfaces of the P-type and N-type devices, And a bonding layer interposed between the both-side coating layer of the P-type and N-type elements and both surfaces of the electrode to temporarily fix the electrode.

According to the present invention, since it can be implemented thinly, it is possible to realize a miniature water purifier or the like when applied to a water purifier provided with a cold water function, and can save electricity by extracting cold water only when necessary, It is possible to drink clean water and can be used indoors because it can be infinitely extracted, and it is possible to control the cold water temperature desired by the user.

1 is a schematic view of an instantaneous cooling device for a water purifier according to the prior art 1. Fig.
2 is a configuration diagram showing an instantaneous cooling device for a water purifier according to the prior art 2. Fig.
3 is an exploded perspective view of a cooling device for instantaneous cold water according to the first embodiment of the present invention.
4 is a cross-sectional view of the cooling device for instantaneous cold water according to the first embodiment of the present invention.
5 is an assembled perspective view of a cooling apparatus for instantaneous cold water according to a first embodiment of the present invention.
FIG. 6 is a schematic view showing a state where the cooling device for instantaneous cold water according to the first embodiment of the present invention is associated with a control part.
7 and 8 are a side view and a process view of the skeleton type thermoelectric module in the instantaneous cold water cooling apparatus according to the first embodiment of the present invention.
9 is a cross-sectional view of a cooling device for instantaneous cold water according to a second embodiment of the present invention.

The terms or words used in the present specification and claims are intended to mean that the inventive concept of the present invention is in accordance with the technical idea of the present invention based on the principle that the inventor can appropriately define the concept of the term in order to explain its invention in the best way Should be interpreted as a concept.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise. Also, the term " part "in the description means a unit for processing at least one function or operation, which may be implemented by hardware or software or a combination of hardware and software.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the configuration of an embodiment of a cooling apparatus for instantaneous cold water according to the present invention will be described in detail with reference to the drawings.

≪ Example 1 >

FIG. 3 is an exploded perspective view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention. FIG. 4 is a sectional view of the instantaneous cold water cooling apparatus according to the first embodiment of the present invention, 5 shows a cooling apparatus for instantaneous cold water according to the first embodiment of the present invention in an assembled perspective view, and FIG. 6 shows a state in which the instantaneous cold water cooling apparatus according to the first embodiment of the present invention is connected to a control unit. And FIGS. 7 and 8 are a side view and a process view of the skeletal thermoelectric module in the instantaneous cold water cooling apparatus according to the first embodiment of the present invention.

1, the cooling device 100 for instantaneous cold water according to the first embodiment of the present invention includes a flow path plate 110, a finishing plate 120, a heat transfer plate 130, a thermoelectric module 140, a water jacket 150 and a control unit C. [

The flow path plate 110 is formed with through holes 112 and 114 at both ends thereof in the thickness direction and a semicircular flow path 116 at the bottom surface. At this time, the through holes 112 and 114 are formed at both ends of the flow path 116, respectively.

A groove having a predetermined depth is formed on the bottom surface of the flow path plate 110 so as to receive a finishing plate 120, a heat transfer plate 130 and a thermoelectric module 140 described later. Meanwhile, the flow path plate 110 is formed of a synthetic resin or the like.

The finishing plate 120 is formed of a silicone material and is in close contact with the bottom surface of the flow path plate 110 and symmetrically formed with the flow path 116 formed on the bottom surface of the flow path plate 110, Is formed on the upper surface.

That is, when the inlet pipe 122 and the outlet pipe 124 communicate with each other in the orthogonal direction at both ends of the flow path plate 126 and come in close contact with the bottom surface of the flow path plate 110, And the discharge pipe 124 are inserted into the through holes 112 and 114 and are exposed to the outside.

The inlet pipe 122 is provided with an automatic valve V to control the flow rate of the inflow water and the outlet pipe 124 is provided with a temperature sensor S for sensing the temperature of the water to be discharged.

The heat transfer plate 130 is provided in close contact with the bottom surface of the finishing plate 120 to increase the heat transfer efficiency to the finishing plate 120 according to the heat absorption in the thermoelectric module 140 disposed at the lower side. In this case, the heat transfer plate 130 is made of stainless steel, but the present invention is not limited thereto. For example, the heat transfer plate 130 may be made of ceramics, aluminum, or high temperature glass.

A plurality of thermoelectric modules 140 are closely attached to the bottom surface of the heat transfer plate 130. When power is applied, the thermoelectric module 140 absorbs heat at one joint portion and dissipates heat at the other joint portion according to the Peltier effect. Here, the thermoelectric module is an environmentally friendly energy material capable of converting heat energy and electric energy, and has a form in which chip type p-type and n-type thermoelectric semiconductors are electrically connected in series via a ceramic substrate such as alumina have. In particular, when the electric energy is applied to the thermoelectric module, the charge (electrons, holes) inside the thermoelectric module absorbs the heat energy at one end of the thermoelectric module and moves to the opposite side. As a result, Heat is generated. At this time, the heat absorbing surface of the thermoelectric module 140 is closely attached to the bottom surface of the heat transfer plate 130, and the heat radiating surface is closely attached to the water jacket 150 to be described later.

The thermoelectric module 140 may be a bulk type or a skeleton type.

The bulk-type thermoelectric module 140 includes P-type and N-type devices, which are not shown in the figure, but are electrically connected to upper and lower substrates on which electrode patterns are formed and electrode patterns of the upper and lower substrates through soldering do. At this time, an insulating layer may be formed on the surfaces of the upper and lower substrates, and terminal wires are soldered and attached to both ends of the electrode patterns so as to apply power.

Further, the P-type and N-type elements are alternately arranged on the electrode patterns of the upper and lower substrates. That is, the upper surfaces of the one side P type and the N type device are electrically connected through the electrode pattern formed on the bottom surface of the upper substrate, and the bottom side of the other side N type and the P type device are electrically connected through the electrode pattern formed on the upper surface of the lower substrate And are alternately connected.

7 and 8 show a skeletal type thermoelectric module in a vehicle steering wheel capable of temperature control according to the present invention in a side view and a process view.

If the thermoelectric module 140 is a skeleton type, the structure of the thermoelectric module 140 may include upper and lower electrodes 142 and 144, upper and lower bonding layers 142a and 144a, The upper and lower coating layers 142b and 144b, the N-type device 146 and the P-type device 148. It is preferable to increase the temperature difference between the heat absorbing surface and the heat generating surface in order to maximize the amount of current generation.

The thermoelectric module 140 of the present invention is formed in such a structure that an upper coating layer 142b, an upper bonding layer 142a and an upper electrode 142 are sequentially stacked on the upper surfaces of the N-type device 146 and the P- And a lower coating layer 144b, a lower bonding layer 144a and a lower electrode 144 are sequentially stacked on the bottom surfaces of the N-type device 146 and the P-

The upper and lower bonding layers 142a and 144a are formed on the opposing surfaces (electrode mounting surfaces) of the upper and lower ceramic substrates 140a and 140b as a temporary substrate by printing or the like in accordance with the model and the lower electrode pattern, An adhesive layer made of a glue adhesive or the like or an adhesive layer made of a pressure-sensitive adhesive may be formed.

The upper and lower electrodes 142 and 144 are formed of a material such as copper (oxygen free copper) or the like and can be changed to a material excellent in electricity and thermal conductivity, and the anode and the cathode are connected to the lower electrode 144 .

The N-type device 146 and the P-type device 148 are sequentially provided between the upper and lower electrodes 142 and 144 so as to be electrically connected to the upper and lower electrodes 142 and 144, And connected in series.

At this time, the coating layers 142b and 144b are formed on both sides of the N-type device 146 and the P-type device 148 to improve adhesion with the upper and lower electrodes 142 and 144, 146 and the P-type device 148 and the upper and lower electrodes 142, 144, respectively.

In this way, the N-type device 146 and the P-type device 148 are alternately disposed and arranged on both surfaces of the N-type device 146 and the P-type device 148 via the upper and lower electrodes 142, And connection shapes through the upper and lower electrodes 142 and 144 may be arranged in a zigzag shape or the like to widen the temperature transfer area.

As shown in FIG. 8, the method of manufacturing a skeletal thermoelectric module according to the present embodiment includes the steps of preparing an element, preparing an electrode, aligning an electrode, forming a bonding layer, fixing an electrode, A soldering step, and a substrate and jig removal step.

The element preparation step is an improvement in adhesion between the upper and lower electrodes 142 and 144 on both surfaces of the N-type element 146 and the P-type element 148, 144b for the purpose of preventing mutual diffusion between the upper electrode 142 and the lower electrode 142 and the lower electrode 142 and the lower electrode 142. [

Here, the device preparation step is divided into a first coating layer forming step and a second coating layer forming step in forming the upper and lower coating layers 142b and 144b.

The primary coating layer formed by the primary coating layer forming step is a layer coated with Ni (nickel), W (tungsten) and Mo (molybdenum). The secondary coating layer formed by the secondary coating layer forming step is a layer coated with Au (gold) and Sn (tin).

On the other hand, when forming the upper and lower coating layers 142b and 144b, the primary coating layer may be omitted and only the secondary coating layer may be formed. The upper and lower coating layers 142b and 144b may be formed by a plating method or a deposition method. The plating method may be implemented by electric or electroless plating. The deposition method may include sputtering, , Ion plating, spray coating, or the like.

The electrode preparation step is a step of preparing upper and lower electrodes 142 and 144 formed of a material such as copper (oxygen free copper). At this time, the upper and lower electrodes 142 and 144 can be changed to materials having excellent electrical properties and thermal conductivity.

Meanwhile, in the electrode preparation step, a step of forming a coating layer on the upper and lower electrodes 142 and 144 may be further included, and the coating layer may be formed on the surface of the N-type device 146 and the P- The upper and lower coating layers 142b and 144b formed on both sides can be performed in advance by the same purpose and method.

Here, the electrode preparation step may be realized by a plating method such as electric or electroless plating. The upper and lower electrodes 142 and 144 may be used without a coating layer.

The electrode alignment step is a step of arranging the upper and lower electrodes 142 and 144 according to the electrode pattern of each model of the thermoelectric module 140 using an alignment jig (not shown). Although not shown in the drawing, the electrode aligning step may be performed by attaching and fixing an electrode fixing film (adhesive tape) to the electrode aligning jig into which the upper and lower electrodes 142 and 144 are inserted, (Automatic / vibration type). In other words, the electrode aligning step aligns the upper and lower electrodes 142 and 144 through the electrode aligning jig inserted therein.

In the bonding layer forming step, the upper and lower bonding layers 142a and 144a are printed on the opposite faces (electrode mounting faces) of the upper and lower ceramic substrates 140a and 140b, which are temporary substrates, The upper and lower bonding layers 142a and 144a may be formed of an adhesive layer of a glue adhesive or the like or an adhesive layer of a pressure sensitive adhesive. (See Figs. 8 (a), (b), (e), and (f)

Here, the upper and lower ceramic substrates 140a and 140b are not limited thereto, and can be changed to substrates of various materials used for temporarily adhering the electrodes.

Further, in the bonding layer forming step, the upper and lower bonding layers 142a and 144a are alternately arranged on the opposed faces of the upper and lower ceramic substrates 140a and 140b. This is because the elements are successively arranged in the order of the N-type element 146, the P-type element 148, the N-type element 146 and the P-type element 148, The upper bonding layer 142a is arranged so as to connect the upper surface of the P-type device 148 to the upper electrode 142 through the upper bonding layer 142a, and the adjacent P-type device 148 and the N- The lower bonding layer 144a is arranged so that the lower surface of the device 146 can be connected to the lower electrode 144 through the lower bonding layer 144a. The upper and lower electrodes 142 and 144 connect the N-type device 146 and the P-type device 148 on the upper and lower surfaces, respectively.

The electrode fixing step is a step of bonding the upper and lower electrodes 142 and 144 arranged on the upper and lower bonding layers 142a and 144a of the upper and lower ceramic substrates 140a and 140b in accordance with the setting pattern . (See Figs. 8 (c) and 8 (g)

The solder printing step is a step of printing the upper and lower solder layers 143a and 143b in a set pattern on the upper and lower electrodes 142 and 144 of the upper and lower ceramic substrates 140a and 140b, respectively. (See Figs. 8 (d) and 8 (h)

In the solder printing process, upper and lower solder layers 143a and 143b are formed on upper and lower electrodes 142 and 144 mounted on the upper and lower ceramic substrates 140a and 140b using solder, Alternatively, the upper and lower electrodes 142 and 144 may be arranged in the aligning jig through the electrode aligning step without performing the bonding layer forming step and the electrode fixing step, And printing the upper and lower solder layers 143a and 143b on the exposed surfaces of the lower electrodes 142 and 144 in conformity with the electrode pattern of each model using solder.

At this time, upper and lower solder layers 143a and 143b are formed on the upper and lower electrodes 142 and 144 mounted on the upper and lower ceramic substrates 140a and 140b, which is one of the solder printing steps, The step of printing according to the star electrode pattern can be carried out through a solder printer or the like. The upper and lower electrodes 142 and 144 are inserted into the alignment jig through the electrode alignment step without the bonding layer forming step and the electrode fixing step being the other of the solder printing steps, And 144 may be printed on the exposed surface of the upper and lower solder layers 143a and 143b using a solder in accordance with the electrode pattern of each model using a solder printer or the like.

The device mounting step is a step of sequentially mounting N-type device 146 and P-type device 148 on the lower solder layer 143b printed on the lower ceramic substrate 140b, And the P-type device 148 and then mounting the lower solder layer 143b on the printed lower ceramic substrate 140b; and a second sub-step of mounting the lower solder layer 1143b on the printed A second detailed step of aligning and mounting the N-type device 146 and the P-type device 148 on the lower ceramic substrate 140b after aligning the lower electrode 144, And a third detailed step in which the device 146 and the P-type device 148 are mounted on the aligned device alignment jig. (See Figs. 8 (i) and (j)).

That is, the first sub-step of the device mounting step is to attach the N-type device 146 and the P-type device 148 to the device-aligning jig in which the N-type device 146 and the P- And then the lower solder layer 143b is mounted on the printed lower electrode 144 after being adsorbed by a mounting mounter or the like.

The second sub-step of the device mounting step is to mount the element alignment jig on the lower electrode 144 on which the lower solder layer 143b is printed and to electrically connect the N-type device 146 and the P- Are aligned and mounted.

Finally, in the third detailed step of the element mounting step, the lower electrode 144 is sucked to the element aligning jig in which the lower electrode 144 is aligned by the element adsorption mounting mounter or the like, and then the N-type element 146 And the P-type device 148 are mounted on the aligned alignment jig.

Particularly, in the first, second, and third detailed steps, the N-type device 146 and the P-type device 148 are inserted into the holes (processed in the pattern of the device) in the device aligning jig, The jig is vibrated and agitated to align the N-type device 146 and the P-type device 148. [

The soldering step is a step of soldering the first substrate S1 as the upper substrate after sequentially mounting the N-type device 146 and the P-type device 148 on the first substrate S2 as the lower substrate. (See Fig. 8 (k)).

Here, the soldering step may be divided into a first sub-step and a second sub-step, and any one of the steps may be selected.

At this time, the first sub-step of the soldering step is to connect the first substrate S1 to the N-type device 146 and the P-type device 148 after mounting the N-type device 146 and the P- And soldering is performed.

Next, the second sub-step of the soldering step is continuously performed in the second and third sub-steps of the device mounting step, so that after the N-type device 146 and the P-type device 148 are mounted, And soldering is performed in a combined state.

Moreover, the soldering step may be implemented through a reflow furnace or a hot plate process.

The step of removing the substrate and the jig is a step of removing the upper and lower ceramic substrates 140a and 140b and the alignment jig from the thermoelectric module 140 manufactured. (See Figs. 8 (1) and (m))

In more detail, the substrate and jig stripping step is performed by continuously performing the first sub-steps of the soldering step to clean the soldered N-type device 146 and the P-type device 148 through the cleaning liquid and ultrasonic cleaning, The first sub-step of separating the N-type device 146 and the P-type device 148 from the lower ceramic substrate 140a and 140b and the second sub-step of the soldering step, To the thermoelectric module 140 through the cleaning solution and the ultrasonic cleaning.

The water jacket 150 is brought into close contact with the bottom surface of the thermoelectric module 140 with the bottom edge of the channel plate 110 being in close contact with the top edge of the channel plate 110 to cool the surface of the thermoelectric module 140 in a water- At this time, a space is formed in the water jacket 150 to allow the cold water to flow therein, and the cold water inflow pipe and the cold water discharge pipe communicate with each other.

The control unit C controls the operation of the automatic valve V provided in the inflow pipe 122 so as to control the amount of current and current applied to the thermoelectric module 140 and control the flow rate of the inflow water, Temperature control of the desired cold water according to the result value of the temperature sensor S installed in the thermoelectric module 124 enables the thermoelectric module 140 to be controlled.

On the other hand, the control unit C includes a control board (not shown) which can control the outflow temperature by sensing the outflow temperature.

Therefore, the cooling device 100 for instantaneous cold water according to the present invention is installed in a water purifier or the like, and power is supplied to the thermoelectric module 140 through the control of the controller C when the user requests to use cold water.

The endothermic surface of the thermoelectric module 140 is absorbed and flows along the flow paths 116 and 126 of the flow path plate 110 and the finishing plate 120 through the heat transfer plate 130 adhered to the heat absorption surface Cold water is transferred to water to become cold water. On the other hand, the heat dissipation surface of the thermoelectric module 140 is cooled through the cooling water of the water jacket 150 adhered to the heat dissipation surface. In this way, the cold water is discharged through the discharge pipe (124), and the water flows continuously through the inflow pipe (122).

Further, when temperature control of the cold water is required, the temperature sensor S installed in the discharge pipe 124 senses the temperature of the discharged water, and the amount of current applied to the thermoelectric module 140 in the control unit C is controlled.

As a result, the present invention can be implemented in a water cooler or the like to minimize a charge area, so that it is possible to implement a micro-cooler or the like, and electric power can be saved by extracting cold water by applying power to the thermoelectric module 140 only when cold water is required , It is possible to supply clean water constantly by cold water instantly without a separate cold water reservoir, and it is possible to use infinite extraction according to the instantaneous cold water, so it can be used sufficiently for business use and can control the cold water discharge temperature by checking the temperature of cold water have.

≪ Example 2 >

9 is a cross-sectional view of a cooling apparatus for instantaneous cold water according to a second embodiment of the present invention.

The cooling apparatus 200 for instantaneous cold water according to the second embodiment of the present invention includes a flow path plate 210, a finishing plate 220, a heat transfer plate 230, a thermoelectric module 240, a water jacket The heat transfer plate 230, the thermoelectric module 240, the water jacket 250, and the control unit C, except for the finishing plate 220. The flow path plate 210, the heat transfer plate 230, Are the same in structure and function as those in the first embodiment, and thus detailed description thereof will be omitted.

Unlike the first embodiment, the finishing plate 220 does not have a flow path formed on an upper surface contacting the bottom surface of the flow path plate 210, and is formed of silicon, Teflon or the like. In this way, since the water can be utilized as a passage through which the water flows through the flow path 216 formed on the bottom surface of the flow path plate 210, the flow path formation on the top surface of the finishing plate 220 can be omitted.

Although not shown in the drawing, the sealing plate 220 is not sealed with the flow path 216 of the flow path plate 210, and only the sealing portion of the flow path 216 is sealed, Can be omitted.

On the other hand, a reference numeral 222 is an inlet pipe, and 224 is a discharge pipe.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. This is possible.

Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the equivalents of the appended claims, as well as the appended claims.

100, 200: cooling device for instantaneous cold water 110, 210:
116, 126, 216: a flow path 120, 220: a finishing plate
122, 222: inlet pipe 124, 224: outlet pipe
130, 230: heat transfer plate 140, 240: thermoelectric module
150, 250: Water jacket C: Control unit
S: Temperature sensor V: Automatic valve

Claims (7)

A flow path plate in which a sealed flow path is formed on the back surface and an inlet pipe and a discharge pipe are connected to both ends of the flow path;
A thermoelectric module for thermoelectrically cooling water flowing in the flow path of the flow path plate;
A heat transfer plate interposed between the flow path plate and the thermoelectric module; And
And a water jacket closely attached to the back surface of the thermoelectric module to cool the heat radiating surface of the thermoelectric module by a water cooling method
And a finishing plate which is formed on the surface of the flow path plate so as to be in close contact with the back surface of the flow path plate and has a symmetrically formed flow path communicating with the flow path of the flow path plate.
delete The method according to claim 1,
And a finishing plate that is in close contact with a back surface of the flow path plate.
The method of claim 3,
Wherein the finishing plate is formed of silicon or Teflon material.
The method according to claim 1,
A control valve for controlling an outflow temperature through the temperature of the water sensed by the sensor is further provided with a valve provided to control the flow rate of water flowing into the inflow pipe and a temperature sensor for sensing the temperature of water discharged to the discharge pipe Cooling apparatus for instantaneous cold water.
The method according to claim 1,
Wherein the thermoelectric module is of bulk or skeleton type.
The method according to claim 6,
The thermoelectric module includes a P-type and an N-type device arranged in a frame, sequentially arranged, a coating layer formed on both surfaces of the P-type and N-type devices, an electrode bridgingly attached to both surfaces of the P- And a bonding layer interposed between the both-side coating layer of the P-type and N-type elements and both surfaces of the electrode to temporarily fix the electrode.

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