WO2014167988A1

WO2014167988A1 - Resin multilayer substrate and method for manufacturing same

Info

Publication number: WO2014167988A1
Application number: PCT/JP2014/058006
Authority: WO
Inventors: 喜人大坪
Original assignee: 株式会社村田製作所
Priority date: 2013-04-10
Filing date: 2014-03-24
Publication date: 2014-10-16
Also published as: JPWO2014167988A1; JP5773105B2

Abstract

A resin multilayer substrate (101) is provided with: a laminated body (1) formed by laminating a plurality of resin layers (2) including a first resin layer (2a); a component (3) disposed in the laminated body (1); and a connecting conductor (6) electrically connected to the component (3). Each of the resin layers (2) is a thermoplastic resin layer. The first resin layer (2a) extends from one side of the component (3) to the other side of the component (3) via the upper side or the lower side of the component (3).

Description

Resin multilayer substrate and manufacturing method thereof

The present invention relates to a resin multilayer substrate and a method for producing the same.

An example of a resin multilayer substrate with a built-in component is described in Japanese Patent Application Laid-Open No. 2006-73763 (Patent Document 1). In the resin multilayer substrate described in Patent Document 1, through holes are provided in advance in some resin layers located in the middle of the thickness direction in order to form a cavity for housing components inside the laminate. By laminating these resin layers, a cavity is formed by a series of through holes arranged in the thickness direction. According to Patent Document 1, after placing parts in a cavity and stacking predetermined resin layers so as to block the cavity, the whole resin layer is bonded to each other by heating while pressing the whole, and the resin multilayer A substrate is to be obtained.

電気 Electrical connection to the component is usually made via some connection conductor to the upper or lower surface of the component. The connection conductor is formed in the resin layer adjacent to the upper side or the lower side of the component.

JP 2006-73763 A

In the case where a resin multilayer substrate having a built-in component is produced by the manufacturing method described in Patent Document 1, at the time immediately before the step of heating the entire laminate (hereinafter referred to as “thermocompression step”) while applying pressure. The side surface of the built-in component faces the cross section of the surrounding resin layer. In order to ensure that the part is received in the cavity, the cavity is formed slightly larger than the outer shape of the part. Therefore, even when the component is placed in the cavity, there is a gap between the side surface of the component and the inner surface of the cavity. In the manufacturing method described in Patent Document 1, several protrusions are provided on the inner surface of the cavity, and when the component is placed in the cavity, the component is pushed in such a manner that the tip of the protrusion is crushed. . Parts placed in the cavity are fixed by these protrusions.

In this state, when the thermocompression bonding process is performed, the material of the resin layer exhibits fluidity and moves to flow into the gap around the part. This is called “resin flow”. The gap around the part is scheduled to be filled with resin flow.

Since the resin flow generated in the thermocompression process does not always occur uniformly on either side of the part, the part is pushed to the side by the resin flow, and as a result, the position of the part itself is likely to shift or rotate. . When the component is displaced or rotated in this way, there is a problem that a connection failure between the component and the connection conductor is caused.

Such problems are caused by thermoplastic foils such as LCP (Liquid Crystal Polymer), PEEK (Polyether Ether Ketone), PEI (Polyetherimide), PPS (Polyphenylene Sulfide), Thermoplastic PI (Polyimide), etc. It is likely to occur in a resin multilayer substrate produced by laminating attached resin sheets.

Therefore, an object of the present invention is to provide a resin multilayer substrate that can reduce the problem of poor connection between a component and a connection conductor caused by a resin flow generated in a thermocompression bonding process.

In order to achieve the above object, a resin multilayer board according to the present invention includes a laminate formed by laminating a plurality of resin layers including a first resin layer, and a component disposed inside the laminate. The first resin layer from one side of the component to the other side of the component through the upper side or the lower side of the component. So as to extend.

According to the present invention, the upper and lower surfaces, not the cross section of the resin layer, are exposed in at least a part of the portion where the cross section of the resin layer is exposed toward the side surface of the component in the related art. Generation | occurrence | production of the resin flow which pushes to a side can be suppressed, As a result, the problem of the connection failure between the components and connection conductor caused by the resin flow which arises in a thermocompression bonding process can be reduced.

It is sectional drawing of the resin multilayer substrate in Embodiment 1 based on this invention. It is sectional drawing of the modification of the resin multilayer substrate in Embodiment 1 based on this invention. It is sectional drawing of the 1st example of the resin multilayer substrate in Embodiment 2 based on this invention. It is sectional drawing of the 2nd example of the resin multilayer substrate in Embodiment 2 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 3 based on this invention. It is sectional drawing of the modification of the resin multilayer substrate in Embodiment 3 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 4 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 5 based on this invention. It is a flowchart of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 1st process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 2nd process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 3rd process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 4th process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 5th process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 6th process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the 7th process of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the modification of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is a flowchart of the preferable 1st example of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is a flowchart of the 2nd preferable example of the manufacturing method of the resin multilayer substrate in Embodiment 6 based on this invention. It is explanatory drawing of the manufacturing method of the resin multilayer substrate in Embodiment 7 based on this invention. It is a flowchart of the manufacturing method of the resin multilayer substrate in Embodiment 8 based on this invention. It is explanatory drawing of the manufacturing method of the resin multilayer substrate in Embodiment 8 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 9 based on this invention. It is sectional drawing of the resin multilayer substrate in Embodiment 10 based on this invention.

(Embodiment 1)
(Constitution)
With reference to FIG. 1, the resin multilayer substrate 101 in Embodiment 1 based on this invention is demonstrated.

The resin multilayer substrate 101 according to the present embodiment includes a laminate 1 formed by laminating a plurality of resin layers 2 including the first resin layer 2a, a component 3 disposed inside the laminate 1, And a connection conductor 6 electrically connected to the component 3. Each of the plurality of resin layers 2 is a thermoplastic resin layer. The first resin layer 2 a extends from one side of the component 3 so as to reach the other side of the component 3 through the upper side or the lower side of the component 3.

The first resin layer 2 a is one of the plurality of resin layers 2 constituting the laminate 1. The connection conductor 6 is connected to the conductor pattern 7. Each component 3 has a rectangular parallelepiped outer shape, and includes electrodes at both ends. The electrodes at both ends of the component 3 are electrically connected to the connection conductor 6 respectively. However, the form of the component 3 is merely an example, and the outer shape of the component and the arrangement of the electrodes in the component are not limited thereto. Although FIG. 1 shows an example in which two parts 3 are arranged, the number and arrangement of parts are not limited to this. The number of parts 3 may be one or plural. The same applies to the following embodiments.

An outer electrode 18 is provided on the lowermost surface of the laminate 1. The external electrode 18 is basically a metal film equivalent to the conductor pattern 7 exposed to the outside. A plating film may be appropriately formed on the external electrode 18. Although FIG. 1 shows an example in which the external electrode is provided only on the lowermost surface, the external electrode may be provided on the uppermost surface of the laminate 1 and is provided on both the uppermost surface and the lowermost surface. Also good.

The first resin layer 2a is originally a flat resin layer 2 and is deformed in accordance with the shape of the component 3 by being laminated in combination with the component 3, resulting in the shape shown in FIG.

In FIG. 1, a minute gap 9 is generated in the vicinity of the lower end of the side surface of the component 3 at a position where the first resin layer 2 a is bent near the lower end of the side surface of the component 3. There may be such a gap 9 as the final state of the resin multilayer substrate 101 manufactured through the thermocompression bonding process. However, such a gap 9 may be completely filled and disappear through a thermocompression bonding process. If the void 9 can be eliminated, that is preferable.

In FIG. 1, no gap is drawn around the portion where the first resin layer 2 a bends in the vicinity of the upper end of the side surface of the component 3. This is because the gap is sometimes filled by resin flow starting from the cross section of the surrounding resin layer 2. However, voids may remain at this location. However, it is preferable if such voids can be eliminated through a thermocompression bonding process.

(Action / Effect)
Generally, the surface of the resin sheet is relatively harder than the other portions because the surface of the resin sheet is different from other portions in the orientation state of resin molecules. Therefore, when the resin sheet is exposed to high-temperature and high-pressure conditions such as thermocompression bonding for integrating the laminate, a resin flow is more likely to occur from the cross section than from the main surface.

The resin multilayer substrate 101 in the present embodiment includes a laminate 1 configured by laminating a plurality of resin layers 2. Since the resin layer 2 is originally formed as a separate resin sheet, if attention is paid to the individual resin layers 2, a resin flow is more likely to occur in the cross section than in the upper and lower surfaces of the resin layer 2 during thermocompression bonding. . When the cross section of the resin layer 2 is exposed at a position facing the side surface of the component 3, there is a possibility that a resin flow may be generated from the cross section and swept the component 3, but in the present embodiment, in the periphery of the component 3, Since the first resin layer 2a extends from one side of the component 3 so as to reach the other side of the component 3 through the upper side or the lower side of the component 3, the side surface of the component 3 is conventionally used. The upper and lower surfaces, not the cross section of the resin layer 2, may be exposed in at least a part, preferably all, of the portion where the cross section of the resin layer 2 is exposed toward the surface. Therefore, generation | occurrence | production of the direct resin flow which pushes the components 3 to the side can be suppressed. In the present embodiment, such a resin flow is suppressed, so that the problem of poor connection between the component 3 and the connection conductor 6 caused by the resin flow generated in the thermocompression bonding process can be reduced. As a result, the reliability of the electrical connection between the component and the connection conductor can be improved.

The resin multilayer substrate 101 exemplified in the present embodiment extends so that the first resin layer 2 a reaches from the one side of the component 3 to the other side of the component 3 through the upper side of the component 3. Although the configuration is described, the present embodiment is not limited to such a configuration. For example, like the resin multilayer substrate 102 shown in FIG. 2, the first resin layer 2 a extends from one side of the component 3 so as to reach the other side of the component 3 through the lower side of the component 3. It may be a configuration. In the resin multilayer substrate 102, there is a gap 9 near the upper end of the side surface of the component 3. The void 9 is depicted as remaining in FIG. 2, but it is preferable if it can be completely eliminated by the thermocompression bonding process. The situation regarding such a gap shown in FIGS. 1 and 2 is the same in the following drawings.

In the present embodiment, the connection between the component 3 and the connection conductor 6 can be performed in a state where the first resin layer 2a is flat, so that the component 3 can be easily mounted. As was done in the prior art, when a cavity is provided in advance and a component is placed inside the cavity to be connected to a connection conductor, the cavity becomes smaller as the size of the component decreases. There was a problem that the placement of parts became difficult and the bottom surface of the cavity raised, so when trying to mount the parts, the parts bounced back and caused a so-called bounce phenomenon, In the present embodiment, since the component 3 can be surface-mounted on the flat upper surface of the resin layer, mounting is easy even if the size of the component is small, and there is no fear of a bounce phenomenon.

In the present embodiment, even when the distance between the components 3 is narrow, it can be dealt with by reducing the thickness of the first resin layer. It is no longer necessary to accurately form a wall structure that separates parts. As a resin layer, for example, a resin layer having a thickness of 12 μm can be generally procured. Therefore, by using such a thin resin layer, it is possible to sufficiently cope with a case where the distance between the parts 3 is narrow, and a wall structure is formed. Easier than to do. Therefore, it becomes easy to cope with a narrow gap. According to the present embodiment, components can be arranged even at a position close to the edge of the board, so that the component mountable area is widened and the degree of freedom in design is increased.

(Embodiment 2)
(Constitution)
With reference to FIG. 3 and FIG. 4,

resin multilayer substrates

103 and 104 in the second embodiment based on the present invention will be described.

The present invention may have a configuration such as the resin multilayer substrate 103 shown in FIG. 3 or the resin multilayer substrate 104 shown in FIG. In the

resin multilayer substrates

103 and 104, the first resin layer 2 a is provided for each of the components 3 with respect to the plurality of components 3 arranged at the same height from one side of the components 3 above or below the components 3. Rather than extending to the other side of the part 3 through the side, the assembly of the parts 3 from one side of the assembly of the parts 3 in a lump for the assembly of the parts 3 Extends to the other side of the assembly of parts 3. Between the components 3, the resin layer 2 that is not the first resin layer 2 a is arranged in a state where one or more layers overlap each other.

In the

resin multilayer substrates

103 and 104, the component 3 is one of a component group that is an assembly of a plurality of components 3, and the component group is formed on the first resin layer 2 a inside the laminate 1. They are arranged in contact with the same surface.

(Action / Effect)
In the case of the present embodiment, since there is a portion where the cross section of the resin layer 2 is exposed close to the side surface of the component 3, the resin multilayer substrate 101, Although the effect is inferior to that of 102, in the past, at least a portion of the portion where the cross section of the resin layer 2 was exposed toward the side surface of the component 3 is exposed, not the cross section of the resin layer 2, but the upper surface or the lower surface. Therefore, generation | occurrence | production of the resin flow which pushes the components 3 to the side can be suppressed. Therefore, it is possible to obtain a certain effect in reducing the problem of poor connection between the component and the connection conductor caused by the resin flow generated in the thermocompression bonding process.

(Embodiment 3)
(Constitution)
With reference to FIG. 5, the resin multilayer substrate 105 in Embodiment 3 based on this invention is demonstrated. The basic structure of the resin multilayer substrate 105 is the same as that of the resin multilayer substrate described in the first embodiment, but differs from the first embodiment in the following points.

In the resin multilayer substrate 105, the first resin layer 2 a passes through the lower side of the component 3, and the plurality of resin layers 2 pass from one side of the component 3 to the upper side of the component 3 to the other side of the component 3. The second resin layer 2b extending so as to reach the sides of the first resin layer 2b.

In the present embodiment, the component 3 is sandwiched between the first resin layer 2a covering from the lower side and the second resin layer 2b covering from the upper side. On the side of the component 3, the first resin layer 2a and the second resin layer 2b are in direct contact with each other. When viewed in a cross-sectional view, the first resin layer 2a and the second resin layer 2b branch from one side of the component 3 to the bottom and top and cover the lower surface and the upper surface of the component 3, respectively. 3 are again in direct contact with each other on the other side.

In the resin multilayer substrate 105, the component 3 is one of a component group that is an assembly of a plurality of components 3, and the component group is disposed on the upper surface of the first resin layer 2 a inside the multilayer body 1. They are arranged so as to be in contact with and in contact with the lower surface of the second resin layer 2b.

(Action / Effect)
In the present embodiment, since the component 3 is sandwiched between the first resin layer 2a and the second resin layer 2b, a portion where the cross section of the resin layer 2 is exposed toward the side surface of the component 3 in the past. Of these, at least a part, preferably all, of the resin layer 2 can be configured such that the upper and lower surfaces are exposed. Therefore, the resin flow which pushes the component 3 to the side can be suppressed. Therefore, also in this embodiment, the problem of poor connection between the component and the connection conductor caused by the resin flow generated in the thermocompression bonding process can be reduced. Since this embodiment is configured to wrap the component using two upper and lower resin layers, compared to the first embodiment, which is configured to wrap the component using only one of the upper and lower resin layers. It is easy to handle even thick parts.

A preferred configuration that can be read from the resin multilayer substrate 105 in the present embodiment will be further described. As shown in the present embodiment, the plurality of resin layers 2 include the third resin layer 2c above the second resin layer 2b, and the third resin layer 2c is in an area corresponding to the projection area of the component 3. It is preferable to have an opening 8c for accommodating at least a part of any one of the resin layers 2 below the third resin layer 2c. By adopting this configuration, since the resin layer 2 below the third resin layer 2c is accommodated by the opening 8c of the third resin layer 2c, the flatness of the entire laminate 1 can be improved. . In the example shown in FIG. 5, a part of the second resin layer 2b is accommodated in the opening 8c of the third resin layer 2c.

The third resin layer 2c is preferably adjacent to the upper side of the second resin layer 2b. By adopting this configuration, a part of the second resin layer 2b is accommodated in the opening 8c of the third resin layer 2c adjacent immediately above the second resin layer 2b, so that the second resin layer 2b is a component. Steps caused by bypassing 3 can be absorbed.

The plurality of resin layers 2 include a fourth resin layer 2d below the first resin layer 2a, and the fourth resin layer 2d is located above the fourth resin layer 2d in an area corresponding to the projection area of the component 3. It is preferable to have an opening 8d for accommodating at least a part of any one of the resin layers 2. By adopting this configuration, since the resin layer 2 located above the fourth resin layer 2d is accommodated by the opening 8d of the fourth resin layer 2d, the flatness of the entire laminate 1 can be improved. In the example shown in FIG. 5, a part of the first resin layer 2a is accommodated in the opening 8d of the fourth resin layer 2d.

The fourth resin layer 2d is preferably adjacent to the lower side of the first resin layer 2a. By adopting this configuration, a part of the first resin layer 2a is accommodated in the opening 8d of the fourth resin layer 2d adjacent to the lower side of the first resin layer 2a, so that the first resin layer 2a is A level difference caused by bypassing the component 3 can be absorbed.

In the resin multilayer substrate 105 shown in FIG. 5, the connection conductor 6 is connected to the component 3 from the lower side, but the connection conductor 6 may be connected to the component 3 from the upper side. Further, it is not necessarily connected only from either the upper side or the lower side, and for example, as in the resin multilayer substrate 106 shown in FIG. 6, the component 3 is connected from the lower side or the upper side. Thus, the connection conductor 6 may be arranged.

(Embodiment 4)
(Constitution)
With reference to FIG. 7, the resin multilayer substrate 107 in Embodiment 4 based on this invention is demonstrated. In the resin multilayer substrate 107, the two resin layers 2 are detoured to the lower side of the component 3, and the two resin layers 2 are detoured to the upper side of the component 3, so that the component 3 is wrapped. Although the component 3 has a large thickness, by wrapping the resin layer 2 in the upper and lower two layers in this way, the component 3 is wrapped without exposing the cross section of the resin layer 2 to the side surface of the component 3. Is done. In this way, a configuration may be employed in which a plurality of resin layers are stacked on the lower side or the upper side of the component 3 to make a detour.

The opening that accommodates the resin layer that bypasses the part is provided not only in the resin layer adjacent to the first resin layer 2a or the second resin layer 2b that is in direct contact with the part, but also in a resin layer at a farther position. The size of the opening may be set larger in the portion that accommodates the resin layer that is in direct contact with the component, and may be set smaller as the distance from the resin layer directly in contact with the component is increased.

(Action / Effect)
By adopting the configuration as in the present embodiment, it is possible to easily wrap a component having a large dimension in the thickness direction.

(Embodiment 5)
(Constitution)
When the dimension in the thickness direction of the component 3 is further increased from the fourth embodiment, a configuration as shown in FIG. With reference to FIG. 8, resin multilayer substrate 108 according to the fifth embodiment of the present invention will be described.

The resin multilayer substrate 108 is common to the resin multilayer substrate 107 shown in FIG. 7 in the basic configuration, but is different in the following points. The resin multilayer substrate 108 includes one or more intermediate resin layers 2i that are resin layers disposed so as to surround the component 3 between the first resin layer 2a and the second resin layer 2b. The intermediate resin layer 2 i is one of the resin layers 2 constituting the laminated body 1 and has an opening corresponding to the component 3. Since the component 3 is disposed so as to penetrate the opening of the intermediate resin layer 2 i, the intermediate resin layer 2 i extends so as to surround the component 3. Although only one layer is displayed as the intermediate resin layer 2i in FIG. 8, this is only an example, and two or more intermediate resin layers 2i may be arranged in an overlapping manner.

(Action / Effect)
In the present embodiment, the part 3 having a large dimension in the thickness direction can be dealt with by adjusting the number of intermediate resin layers 2i.

(Embodiment 6)
(Production method)
With reference to FIGS. 9 to 16, a method for manufacturing a resin multilayer substrate in accordance with the sixth embodiment of the present invention will be described. FIG. 9 shows a flowchart of the method for manufacturing the resin multilayer substrate in the present embodiment.

The manufacturing method of the resin multilayer substrate in the present embodiment is for obtaining the resin multilayer substrate described in any of Embodiments 2 to 5. The method for manufacturing the resin multilayer substrate includes a step S1 for arranging the first resin layer 2a having a flat upper surface, a step S2 for arranging the component 3 on the upper surface of the first resin layer 2a, and a first step so as to cover the component. The first resin layer 2a and the second resin layer 2b are deformed according to the shape of the component 3 by stacking the second resin layer 2b having a flat lower surface above the first resin layer 2a and by thermocompression bonding. And thermocompression bonding step S10 for sealing component 3. Step S1 and step S2 may be performed in this order, but may be performed in the reverse order. Here, a case where the resin multilayer substrate 105 shown in FIG. 5 is manufactured will be described as an example.

First, as shown in FIG. 10, a resin sheet 12 having a metal foil 17 formed on one side is prepared. By patterning the metal foil 17 of the resin sheet 12, the conductor pattern 7 is formed as shown in FIG. Further, a through hole is provided at a desired position by laser processing or the like, and the connecting conductor 6 is formed by filling the through hole with a conductive paste. In this way, a resin layer as shown in FIG. 12 is prepared. In FIG. 12, the image is displayed upside down compared to that shown in FIG. In addition, the order demonstrated here is an example to the last, and is not restricted to this. The conductor pattern 7 may be formed after the connection conductor 6 is formed first.

For example, the structure shown in FIG. 13 is obtained by performing step S2. The resin layer 2 included in this structure becomes the first resin layer 2a.

As shown in FIG. 14, the structure shown in FIG. 13 is arranged on the lower resin layer 2 appropriately laminated. Since this is a step of arranging the first resin layer 2a, it corresponds to step S1. The presence of the resin layer 2 below the first resin layer 2a is not essential, but it is preferable that one or more resin layers 2 are laminated below the first resin layer 2a.

As shown in FIG. 15, as the step S3, the second resin layer 2b having a flat lower surface is stacked. Further, the upper resin layer 2 is appropriately laminated. As a whole, for example, the layers are stacked as shown in FIG. In FIG. 16, for convenience of explanation, the parts that are stacked and displayed in FIG. 15 are also disassembled and displayed. Next, the thermocompression bonding step S10 is performed. That is, as shown by

arrows

91 and 92 in FIG. 16, heating is performed while applying pressure in the vertical direction. Alternatively, pressure is applied while heating. Thereby, the first resin layer 2a and the second resin layer 2b are deformed according to the shape of the component 3, and the component 3 is sealed. As a result, the resin multilayer substrate 105 shown in FIG. 5 is obtained.

(Action / Effect)
In this Embodiment, it can suppress that the resin flow which pushes the component 3 to the side at the time of a thermocompression bonding process generate | occur | produces. In the present embodiment, since such a resin flow is unlikely to occur, the problem of poor connection between the component 3 and the connection conductor 6 caused by the resin flow generated in the thermocompression bonding process can be reduced. A resin multilayer substrate with improved reliability of electrical connection with the connection conductor 6 can be obtained.

In FIG. 16, except that the component 3 is mounted on the upper surface of the first resin layer 2 a, all the resin layers 2 are separated and the state of performing the thermocompression bonding process is shown. Only the two resin layers 2 sandwiching the component 3 may be bonded together and integrated as shown in FIG. The first resin layer 2a and the second resin layer 2b are directly bonded together, and the component 3 is sealed between them. It is preferable to prepare the structure in this state first because the component 3 is securely held and protected by the resin layer 2. By preparing the structure in this state in advance, the risk of the component 3 falling off during the work can be reduced, so that it is easy to handle. In the structure in this state, the

convex portions

10a and 10b are formed at positions corresponding to the parts 3 on the upper surface and the lower surface, and the surface is not flat. However, as shown in FIG. 17, the

protrusions

10a and 10b can be formed by laminating together with the other resin layers 2 including the third resin layer 2c, the fourth resin layer 2d, etc. as appropriate, and performing a thermocompression bonding process. It is possible to obtain the laminated body 1 that fits in the

openings

8d and 8c of the resin layer 2 and has high flatness as a whole.

In addition, the preferable form of the manufacturing method demonstrated here is demonstrated below.
First, FIG. 18 shows a flowchart of a preferred first example of a method for producing a resin multilayer substrate in the present embodiment. A preferable method of manufacturing a resin multilayer substrate as a first example is a method of manufacturing a resin multilayer substrate for obtaining a resin multilayer substrate such as the resin multilayer substrate 105, and includes a first resin layer 2a having a flat upper surface. Step S1 of placing, step S2 of placing the component 3 on the upper surface of the first resin layer 2a, and stacking the second resin layer 2b having a flat lower surface above the first resin layer 2a so as to cover the component 3 The first resin layer 2a is formed by thermocompression bonding with the step S3, the step S4 of stacking the third resin layer 2c provided with the opening 8c in advance in the region corresponding to the component 3, and the second resin layer 2b. The second resin layer 2b is deformed according to the shape of the component 3 to seal the component 3, and any one of the resin layers 2 below the third resin layer 2c is formed in the opening 8c of the third resin layer 2c. Thermocompression bonding step S11 in which at least a part is inserted Including the. Step S1 and step S2 may be performed in this order, but may be performed in the reverse order. FIG. 16 can be said to show the state of step S11. In the thermocompression bonding step S11, as compared with the thermocompression bonding step S10 shown in FIG. 9, at least a part of any one of the resin layers 2 below the third resin layer 2c is fitted into the opening 8c of the third resin layer 2c. It is different in that it is essential to do. However, it is not intended to limit that such insertion does not occur in the thermocompression bonding step S10. By implementing the method for producing the resin multilayer substrate as shown in FIG. 18, the resin layer 2 below the third resin layer 2c is accommodated by the opening 8c of the third resin layer 2c, so that the laminate The flatness of 1 whole can be improved, and the resin multilayer substrate excellent in flatness can be obtained.

FIG. 19 shows a flowchart of a second preferred example of the method for producing a resin multilayer substrate in the present embodiment. A preferred method of manufacturing a resin multilayer substrate as a second example is a method of manufacturing a resin multilayer substrate for obtaining a resin multilayer substrate such as the resin multilayer substrate 105, and includes an opening 8d in a region corresponding to the component 3. The step S5 of disposing the fourth resin layer 2d provided in advance, the step S6 of stacking the first resin layer 2a having a flat upper surface above the fourth resin layer 2d, and the component 3 on the upper surface of the first resin layer 2a. By placing the second resin layer 2b having a flat lower surface on the upper side of the first resin layer 2a so as to cover the component 3, and by thermocompression bonding, the first resin layer 2a and The second resin layer 2b is deformed according to the shape of the component 3 to seal the component 3. At least one of the resin layers 2 above the fourth resin layer 2d is formed in the opening 8d of the fourth resin layer 2d. The thermocompression bonding step S12 in which the part is inserted Including. Step S6 and step S2 may be performed in this order, but may be performed in the reverse order. You may perform in order of process S2, process S5, and process S6. FIG. 16 can be said to show the state of the thermocompression bonding step S12. In the thermocompression bonding step S12, as compared with the thermocompression bonding step S10 shown in FIG. 9, at least a part of any one of the resin layers 2 above the fourth resin layer 2d is fitted into the opening 8d of the fourth resin layer 2d. This is different in that it is essential. However, it is not intended to limit that such insertion does not occur in the thermocompression bonding step S10.

(Embodiment 7)
(Production method)
With reference to FIG. 20, the manufacturing method of the resin multilayer substrate in Embodiment 7 based on this invention is demonstrated. The manufacturing method of the resin multilayer substrate in the present embodiment is for obtaining the resin multilayer substrate 107 described in the fourth embodiment.

As shown in FIG. 20, only some resin layers 2 sandwiching the component 3 are bonded together. This structure includes a first resin layer 2a and a second resin layer 2b. The first resin layer 2a and the second resin layer 2b are directly bonded together, and the component 3 is sealed between them. Another resin layer 2 is also overlapped and joined so as to sandwich the first resin layer 2a and the second resin layer 2b from the outside.

(Action / Effect)
As shown in the present embodiment, it is preferable to prepare the structure for sealing the component 3 first because the component 3 is securely held and protected by the resin layer 2. By preparing the structure in this state in advance, the risk of the component 3 falling off during the work can be reduced, so that it is easy to handle. A laminated body 1 having a high flatness as a whole can be obtained by laminating as shown in FIG. 20 together with the other resin layers including this structure and performing a thermocompression bonding process.

Here, an example in which a structure that seals the component 3 is previously shown is shown, but the resin multilayer described in the fourth embodiment can also be obtained by stacking all the resin layers 2 apart and thermocompression bonding. The substrate 107 can be obtained.

(Embodiment 8)
(Production method)
With reference to FIGS. 21 to 22, a method for manufacturing a resin multilayer substrate in accordance with the eighth embodiment of the present invention will be described. FIG. 21 shows a flowchart of the method for manufacturing the resin multilayer substrate in the present embodiment.

The manufacturing method of the resin multilayer substrate in the present embodiment is for obtaining the resin multilayer substrate 108 described in the fifth embodiment. The method for manufacturing the resin multilayer substrate includes a step S1 of arranging the first resin layer 2a having a flat upper surface, a step S2 of arranging the component 3 on the upper surface of the first resin layer S1, and an upper side of the first resin layer 2a. In step S7, one or more intermediate resin layers 2i are stacked so as to surround the component 3, and in step S8, a second resin layer 2b having a flat lower surface is stacked above the intermediate resin layer 2i so as to cover the component 3. A thermocompression bonding step S13 in which the first resin layer 2a and the second resin layer 2b are deformed in accordance with the shape of the component by thermocompression bonding, and the component 3 is sealed by combining with the intermediate resin layer 2i. Including. As a whole, they are stacked and thermocompression bonded as shown in FIG. By this method for producing a resin multilayer substrate, the resin multilayer substrate 108 described in Embodiment 5 with reference to FIG. 8 can be obtained.

(Action / Effect)
In the present embodiment, at least part of the portion where the cross section of the resin layer 2 has been exposed toward the side surface of the component 3 is exposed instead of the cross section of the resin layer 2. be able to. Therefore, generation | occurrence | production of the resin flow which pushes the components 3 to the side can be suppressed.

In the present embodiment, since the intermediate resin layer 2i is stacked between the first resin layer 2a and the second resin layer 2b, the component 3 having a large dimension in the thickness direction can be sufficiently handled. .

In FIG. 22, the state in which the resin layers 2 are stacked in a separated state is displayed. However, as described with reference to FIG. 20, several resin layers 2 sandwiching the component 3 are bonded together in advance to form a structure. It is good also as performing the whole lamination after producing.

(Embodiment 9)
(Constitution)
With reference to FIG. 23, a resin multilayer substrate 109 according to the ninth embodiment of the present invention will be described. The basic structure of the resin multilayer substrate 109 in this embodiment is the same as that of the resin multilayer substrate 101 described in Embodiment 1, but is different in the following points.

In the resin multilayer substrate 101, another resin layer 2 is stacked on the upper side of the first resin layer 2a, and the uppermost surface is flat. However, in the present embodiment, the first resin layer 2 is stacked. No other resin layer is stacked on the upper side of 2a, and the first resin layer 2a is the uppermost surface as it is. Therefore, the unevenness caused by the deformation of the first resin layer 2a along the outer shape of the component 3 appears to some extent on the outer shape.

(Action / Effect)
Also in the present embodiment, the same effect as described in the first embodiment can be obtained. In the case where it is not necessary to flatten the top surface, the configuration shown in this embodiment is effective. In the present embodiment, the step of stacking the additional resin layer 2 on the upper side can be omitted.

Similarly, the resin multilayer substrate 108 shown in the fifth embodiment may have a configuration in which the upper and lower resin layers are omitted. That is, as a modified example of the resin multilayer substrate 108, a shape having irregularities on the uppermost surface and the lowermost surface may be used.

Similarly, the

resin multilayer substrates

103 and 104 shown in the second embodiment may have a configuration in which an additional resin layer on the upper side or the lower side is omitted. That is, as a modification of the resin multilayer substrate 103, a shape having unevenness on the uppermost surface may be used. As a modified example of the resin multilayer substrate 104, a shape having irregularities on the lowermost surface may be used.

(Embodiment 10)
(Constitution)
With reference to FIG. 24, the resin multilayer substrate 110 in Embodiment 10 based on this invention is demonstrated. The basic structure of the resin multilayer substrate 110 in this embodiment is the same as that of the resin multilayer substrate 107 described in Embodiment 4, but is different in the following points.

In the resin multilayer substrate 107, the uppermost surface and the lowermost surface are flattened by further overlapping other resin layers on the upper side and the lower side of the resin layer 2 deformed along the outer shape of the component 3, respectively. In this form, the resin layer 2 deformed along the outer shape of the component 3 is the uppermost surface and the lowermost surface as it is. Therefore, the resin multilayer substrate 110 has a shape having irregularities on the uppermost surface and the lowermost surface. However, the resin layer which becomes the uppermost surface and the lowermost surface is not necessarily the first resin layer 2a or the second resin layer 2b. In the example shown in FIG. 24, not the first resin layer 2 a and the second resin layer 2 b, but the resin layer 2 further layered on each of the upper and lower surfaces constitutes the uppermost surface and the lowermost surface. The configuration shown in FIG. 24 is merely an example, and the first resin layer 2a may be the bottom surface. The second resin layer 2b may be a top surface.

(Action / Effect)
Also in the present embodiment, the same effect as described in the fourth embodiment can be obtained. In the case where it is not necessary to flatten the uppermost surface and the lowermost surface, the configuration shown in this embodiment is effective. In the present embodiment, the step of stacking additional resin layers 2 on the upper side and the lower side can be omitted.

The same applies to the

resin multilayer substrates

105 and 106 shown in the third embodiment.
In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 laminate, 2 resin layer, 2a first resin layer, 2b second resin layer, 2c third resin layer, 2d fourth resin layer, 2i intermediate resin layer, 3 parts, 6 connection conductor, 7 conductor pattern, 8c, 8d opening, 9 gap, 91, 92 arrows, 101, 102, 103, 104, 105, 106, 107, 108 resin multilayer substrate.

Claims

A laminate formed by laminating a plurality of resin layers including the first resin layer;
Components arranged inside the laminate;
A connection conductor electrically connected to the component;
Each of the plurality of resin layers is a thermoplastic resin layer,
The first resin layer extends from one side of the component so as to reach the other side of the component through the upper side or the lower side of the component.
The first resin layer passes under the component,
2. The resin according to claim 1, wherein the plurality of resin layers include a second resin layer that extends from one side of the component through the upper side of the component to reach the other side of the component. Multilayer board.
The plurality of resin layers include a third resin layer above the second resin layer,
The third resin layer has an opening for accommodating at least a part of any one of the resin layers below the third resin layer in a region corresponding to a projection region of the component. The resin multilayer substrate described in 1.
The resin multilayer substrate according to claim 3, wherein the third resin layer is adjacent to an upper side of the second resin layer.
The plurality of resin layers include a fourth resin layer below the first resin layer,
The said 4th resin layer has an opening part for accommodating at least one part of any resin layer above the said 4th resin layer in the area | region corresponding to the projection area | region of the said component. 4. The resin multilayer substrate according to any one of 4 above.
The resin multilayer substrate according to claim 5, wherein the fourth resin layer is adjacent to a lower side of the first resin layer.
The resin according to any one of claims 2 to 6, comprising one or more intermediate resin layers that are resin layers arranged so as to surround the component between the first resin layer and the second resin layer. Multilayer board.
The component is one of a component group that is an aggregate of a plurality of components, and the component group is arranged in contact with the same surface of the first resin layer inside the laminate. The resin multilayer substrate according to claim 1.
The component is one of a component group that is an aggregate of a plurality of components, and the component group is in contact with the upper surface of the first resin layer and the second resin layer inside the laminate. The resin multilayer substrate according to claim 2, wherein the resin multilayer substrate is arranged so as to be in contact with the lower surface.
A method for producing a resin multilayer substrate for obtaining the resin multilayer substrate according to any one of claims 2 to 7,
Disposing the first resin layer having a flat upper surface;
Placing the component on the top surface of the first resin layer;
Stacking a second resin layer having a flat lower surface above the first resin layer so as to cover the component;
A method for manufacturing a resin multilayer substrate, comprising: a thermocompression bonding step in which the first resin layer and the second resin layer are deformed in accordance with a shape of the component to seal the component by thermocompression bonding.
A method for producing a resin multilayer substrate for obtaining the resin multilayer substrate according to claim 3 or 4,
Disposing a first resin layer having a flat upper surface;
Placing a component on the top surface of the first resin layer;
Stacking a second resin layer having a flat lower surface on the upper side of the first resin layer so as to cover the component;
A step of stacking a third resin layer in which an opening is provided in advance in a region corresponding to the component above the second resin layer;
By thermocompression bonding, the first resin layer and the second resin layer are deformed according to the shape of the component to seal the component, and the opening of the third resin layer is formed from the third resin layer. A method for producing a resin multilayer substrate, comprising: a thermocompression bonding step in which at least a part of any one of the lower resin layers is fitted.
A method for producing a resin multilayer substrate for obtaining the resin multilayer substrate according to claim 5,
Disposing the fourth resin layer provided with an opening in a region corresponding to the component;
Stacking the first resin layer having a flat upper surface above the fourth resin layer;
Placing the component on the top surface of the first resin layer;
Stacking the second resin layer having a flat lower surface above the first resin layer so as to cover the component;
By thermocompression bonding, the first resin layer and the second resin layer are deformed according to the shape of the component to seal the component, and the opening of the fourth resin layer is more than the fourth resin layer. A method for producing a resin multilayer substrate, comprising: a thermocompression bonding step in which at least a part of any one of the upper resin layers is fitted.
A method for producing a resin multilayer substrate for obtaining the resin multilayer substrate according to claim 7,
Disposing the first resin layer having a flat upper surface;
Placing the component on the top surface of the first resin layer;
Stacking one or more intermediate resin layers so as to surround the component above the first resin layer;
Stacking the second resin layer having a flat lower surface on the upper side of the intermediate resin layer so as to cover the component;
A thermocompression bonding step in which the first resin layer and the second resin layer are deformed according to the shape of the component by thermocompression bonding, and the component is sealed by combining with the intermediate resin layer. The manufacturing method of a resin multilayer substrate.