WO2014166242A1 - 压接头和压接装置 - Google Patents

压接头和压接装置 Download PDF

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Publication number
WO2014166242A1
WO2014166242A1 PCT/CN2013/086536 CN2013086536W WO2014166242A1 WO 2014166242 A1 WO2014166242 A1 WO 2014166242A1 CN 2013086536 W CN2013086536 W CN 2013086536W WO 2014166242 A1 WO2014166242 A1 WO 2014166242A1
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WO
WIPO (PCT)
Prior art keywords
crimping
chip
resistance
bonding
joint
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Application number
PCT/CN2013/086536
Other languages
English (en)
French (fr)
Inventor
夏龙
Original Assignee
合肥京东方光电科技有限公司
京东方科技集团股份有限公司
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Application filed by 合肥京东方光电科技有限公司, 京东方科技集团股份有限公司 filed Critical 合肥京东方光电科技有限公司
Publication of WO2014166242A1 publication Critical patent/WO2014166242A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Definitions

  • Embodiments of the invention relate to a crimp joint and a crimping device. Background technique
  • a printed circuit board is generally used as a carrier for electrical connection of a chip, a circuit pattern is printed on the printed circuit board, and a connecting wire for connecting the terminals of each chip is mounted, and then the chip is mounted on a corresponding pattern, which avoids manual Wiring errors ensure the quality of electronic equipment.
  • electronic devices that use a substrate as a carrier for electrical connection of a chip, such as a display device, forming a pattern of gate lines and data lines on a display substrate by a patterning process, and forming a connection lead pattern of each chip terminal, and then mounting the chip. Go to the corresponding lead pattern.
  • the chip installation includes the fixing of the chip and the electrical connection between the terminals of the chip and the corresponding terminal wires on the circuit board (or the substrate), which can be divided into two types of plugging and bonding.
  • ACF anisotropic conductive film
  • the ACF is widely used in the mounting process of chips. For example, when the display device is connected to the driving circuit chip, the ACF is first attached to the substrate side for connecting the lead region of the chip, and the ACF is cured under the action of high temperature and high pressure, and the corresponding terminals on the chip and the corresponding leads on the substrate are reliable. Connected to form a vertical conduction, lateral insulation stable structure.
  • ACF usually contains conductive particles and insulating rubber.
  • the general conductive particles are metal spherical particles.
  • a conventional crimping joint for a crimping chip includes a crimping joint body 10, and a crimping surface W' provided on the crimping joint body 10.
  • the main factors affecting the quality of chip mounting are the ACF adhesive press fit and the number of metal spheres.
  • the ACF glue may also be combined, which may cause the metal ball particles between the adjacent two chip terminals to aggregate and accumulate, which is easy to cause. The connection between two adjacent chip terminals is short-circuited. Summary of the invention
  • Embodiments of the present invention provide a crimping joint and a crimping device that can overcome chip mounting, The area without the chip terminals is also connected, which easily causes the metal ball ions between the adjacent two chip terminals to gather and accumulate, so that the adjacent two chip terminals are short-circuited.
  • An aspect of the invention provides a press fitting including a press joint body, the press joint body is provided with a crimping surface; the crimping surface has a plurality of groove structures; the plurality of groove structures span The opposite sides of the crimping surface; and the groove tops of the plurality of groove structures are flush, forming a plurality of convex structures.
  • the plurality of groove structures are disposed in parallel.
  • the plurality of groove structures are equally spaced.
  • the pressure connector may further include a plurality of resistance testers and data acquisition devices; each of the two ends of the resistance tester is electrically connected to the corresponding crimped portion of the adjacent two convex structures, for measuring a resistance value between two adjacent crimped portions; the data acquisition device is coupled to the plurality of resistance testers for collecting a resistance value measured by the resistance tester.
  • the pressure connector may further include a display device, and the display device is connected to the data collection device for displaying the resistance value collected by the data acquisition device in real time.
  • the pressure connector may further include an alarm device, and the alarm device is connected to the data acquisition device for alarming when an abnormality of the resistance value collected by the data acquisition device occurs.
  • Another aspect of the present invention provides a crimping apparatus including a plurality of crimping joint mounting positions, at least one of the crimping joint mounting positions is mounted with the crimping joint of any of the above, and the crimping joint is configured to be Disassemble the structure.
  • Figure 1 is a schematic view showing the structure of a conventional crimping joint
  • FIG. 2 is a schematic structural view of a flexible circuit board bonded to a chip
  • Figure 3 is a left side view of Figure 2;
  • FIG. 4 is a schematic structural view of a pressure joint according to an embodiment of the present invention.
  • FIG. 5 is a schematic view showing the working principle of a pressure joint according to an embodiment of the present invention. detailed description
  • a process of mounting a chip-attached flexible circuit board (Chip On Flex or Chip On Film, "COF") on a printed circuit board (or substrate) is taken as an example to specifically describe the structure of the press joint. And working principle. It will be understood that the pressure joint of the embodiment of the present invention is not limited to the specific structure described, and the pressure joint of the embodiment of the present invention can be applied to any process requiring multiple press or discontinuous press.
  • COF Chip On Flex or Chip On Film
  • Figure 2 is a schematic view showing the structure of a flexible circuit board to which a chip is bonded;
  • Figure 3 is a left side view of Figure 2.
  • a chip 1 and a plurality of chip terminal wires 30 corresponding to the terminals of the chip 1 are fixed on the COF 2, and one end of each chip terminal wire 30 and one terminal of the chip 1 are fixed. Electrical connection.
  • the chip terminal wire 30 may be coated with an insulating layer 60 (for example, an organic polymer material such as a tree or a polyimide), and the other end of the chip terminal wire 30 is exposed as a crimped portion.
  • the COF 2 is mounted on a printed circuit board (or substrate) by crimping with corresponding metal leads on a printed circuit board (or substrate). It should be noted that the COF is exemplified here, but the present invention is not limited thereto.
  • the crimping head provided by the embodiments of the present invention is suitable for a fitting installation process of all chips or other processes requiring multiple points of pressing.
  • FIG. 4 is a schematic structural view of a pressure joint according to an embodiment of the present invention
  • FIG. 5 is a schematic view showing the working principle of a pressure joint according to an embodiment of the present invention.
  • the pressure joint in the embodiment of the present invention includes a pressure joint body 10, a pressure joint surface W is disposed on the pressure joint body 10, and a plurality of groove structures 20 are disposed on the pressure joint surface W. And the groove tops of the plurality of groove structures 20 are flush, and a plurality of convex structures 21 are formed opposite to the groove bottom.
  • the plurality of groove structures 20 span the opposite side edges of the crimping surface W such that the crimping surface W of the press fitting is a discontinuous structure.
  • the non-lead area (ie, the area without the chip terminal lead 3) corresponds to The groove structure 20, the chip terminal wires 30 and the metal wires 40 correspond to the convex structure 21 so that the non-lead regions are not crimped, so that the metal ball ions 50 between the adjacent two chip terminal wires 30 no longer gather, Stacking overcomes the problem that the adjacent two chip terminal wires 30 are short-circuited during the COF installation process.
  • the chip terminal wires 30 are generally equally spaced and parallel distributed, correspondingly, the plurality of groove structures 20 are also disposed at equal intervals and in parallel, and the position of the chip terminal wires 30 and the convex structure can be realized during the crimping process. correspond.
  • the chip crimping connector in this embodiment may further include a plurality of resistance testers 90 and a data collecting device 100.
  • the two ends of each resistance tester 90 are electrically connected to the crimped portions corresponding to the adjacent two convex structures (ie, the crimped portions of the chip terminal wires 30) for measuring the adjacent two chip terminal wires 30.
  • the resistance between the two adjacent chip terminal wires 30 is monitored to ensure the quality of the crimping; the data collecting device 100 is connected to the plurality of resistance testers 90 for collecting the resistance value measured by the resistance tester 90.
  • an insulating layer via 80 may be formed at a position corresponding to the chip terminal lead 30 on the insulating layer 60 on the COF. As shown in FIG. 5, adjacent two chip terminal wires 30 are connected to both ends of a resistance tester 90 through the insulating layer via 80, thereby realizing measurement and collection of resistance between adjacent two chip terminal wires 30. .
  • the resistance between adjacent two chip terminals can be realized according to the specific structure of the chip, and details are not described herein again. It can be understood that, since the embodiment described herein is described by electrically connecting the chip to the printed circuit board or the substrate, the quality of the crimping is judged by testing the resistance of the crimping portion, of course, for other non-electrical connections. The process can also be judged by other measurement methods.
  • an embodiment may further include a display device 110 coupled to the data collection device 100 for displaying the resistance values collected by the data acquisition device 100 in real time by numbering each of the resistance testers 90. Therefore, when the resistance between the two adjacent chip terminal wires 30 is found to be less than the set value, the position where the crimping is unacceptable can be determined and re-crimped, thereby improving the crimping yield and efficiency.
  • An embodiment may further provide an alarm device 120 that is coupled to the data collection device 100. Pick up. When it is found that the resistance between two adjacent chip terminal wires 30 is less than the set value, and an abnormality occurs, an alarm is issued, and the crimping failure is found in time. By numbering each of the resistance testers 90, it is also possible to determine the position where the crimping is unacceptable and re-compress, thereby improving the crimping yield and efficiency.
  • an ACF glue 70 covering all of the metal leads 40 on the printed circuit board 130 (or substrate) is applied. Thereafter, the crimped portions of the chip terminal wires 30 on the COF are placed on the printed circuit board 130 (or substrate), and each chip terminal wire 30 is ensured to correspond to the position of the corresponding metal lead 40.
  • the chip terminal lead 30 and the printed circuit board 130 are pressed by the crimping face W of the press fitting.
  • the resistance value between the adjacent two chip terminal wires 30 is monitored in real time, and when the resistance value between the two adjacent chip terminal wires 30 is found to be less than the set value, the crimping is performed again.
  • the embodiment of the invention further provides a chip crimping device comprising a plurality of crimping joint mounting positions, at least one of the crimping joint mounting positions is mounted with the above-mentioned crimping joint, and the crimping joint is provided in a detachable structure.
  • the pressure connector is configured as a detachable structure, and the pressure connector can be designed in various specifications according to different terminal position designs on the respective chips, and the chip crimping device selects different pressure connectors according to actual needs. Achieve compatibility with a variety of chip structures.
  • the chip press joint provided by the embodiment of the present invention includes a press joint body, by providing a crimping surface on the press joint body, and providing a plurality of groove structures on the crimping surface, and The groove top of the groove structure is flush, forming a plurality of convex structures.
  • the plurality of groove structures span the opposite side edges of the crimping surface, so that the crimping surface of the pressure joint is a non-joining structure.
  • the non-lead area corresponds to the groove structure, and the chip terminal corresponds to the convex structure, so that the non-lead area is not crimped.
  • the metal ball ions between the adjacent two chip terminals no longer gather and accumulate, which overcomes the problem that the two adjacent chip terminals are short-circuited during the chip mounting process.
  • the chip crimping device is used
  • the above-mentioned pressure joint can realize the simultaneous pressure connection of the multi-side terminals of the chip by providing a plurality of the above-mentioned pressure joints, and the detachable structure of the pressure joint can be pressed, so that the crimping device can crimp the chips of various specifications.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

一种压接头和采用该压接头的压接装置。压接头包括压接头本体（10），在压接头本体（10）上设置有压接面（W），并在压接面（W）上设置多个凹槽结构（20），且凹槽结构（20）的槽顶齐平，形成多个凸面结构（21）。多个凹槽结构（20）横跨压接面（W）的相对的两侧边，使得压接头的压接面（W）为不连接结构。压接头克服了芯片安装过程中易造成相邻两个芯片端子连接短路的问题。

Description

压接头和压接装置 技术领域
本发明的实施例涉及一种压接头和压接装置。 背景技术
随着集成电路的发展， 许多电路均被集成到芯片中， 而且为了实现某种 功能经常需要多个芯片。 现有技术中， 一般以印刷电路板作为芯片电气连接 的载体,在印刷电路板上印刷电路图案以及用于连接各芯片端子的连接导线， 然后将芯片安装到对应的图案上， 这避免了人工接线的差错， 保证了电子设 备的质量。 也有一些电子设备是以基板作为芯片的电气连接的载体， 如显示 装置， 通过构图工艺在显示基板上形成栅线和数据线的图案， 并形成各芯片 端子的连接引线图案， 然后再将芯片安装到对应的引线图案上。 芯片的安装 包括芯片的固定及芯片各端子与电路板 (或基板 )上对应端子导线的电连接， 可以分为插接和贴合两种。 由于各向异性导电胶膜 ( Anisotropic Conductive Film, 筒称" ACF" )具有单向导电及胶合的特性， 所以被广泛应用于芯片的 贴合式安装过程中。如在显示装置连接驱动电路芯片时，需要先把 ACF贴覆 于基板一侧用于连接芯片的引线区域， 利用 ACF在高温高压的作用下固化， 把芯片的各端子和基板上的对应引线可靠的连接起来， 形成垂直导通， 横向 绝缘的稳定结构。 ACF通常包含导电粒子及绝缘胶材两部分， 一般导电粒子 为金属球粒子。
如图 1所示， 传统的用于压接芯片的压接头包括压接头本体 10, 以及设 置在压接头本体 10上的压接面 W'。影响芯片安装质量的主要因素为 ACF胶 压合情况及金属球粒子数。在实际使用过程中， 由于压接面 W'为整体的平面 结构， 在没有芯片端子的区域， ACF胶也会 合， 易造成相邻两个芯片端 子之间的金属球粒子聚集、 堆积， 容易造成相邻两个芯片端子的连接短路。 发明内容
本发明的实施例提供一种压接头和压接装置， 可克服芯片安装时， 由于 没有芯片端子的区域也会 接， 易造成相邻两芯片端子之间的金属球离子 聚集、 堆积， 使得相邻两芯片端子连接短路的问题。
本发明的一个方面提供一种压接头， 包括压接头本体， 所述压接头本体 上设置有压接面； 所述压接面上具有多个凹槽结构； 所述多个凹槽结构横跨 所述压接面的相对的两侧边； 且所述多个 槽结构的槽顶齐平， 形成多个凸 面结构。
如上所述的压接头中， 例如， 所述多个凹槽结构平行设置。
如上所述的压接头中， 例如， 所述多个凹槽结构等间距分布。
例如， 所述压接头还可以包括多个电阻测试仪和数据采集装置； 每个所 述电阻测试仪的两端分别与相邻两个凸面结构对应的被压接部电性连接， 用 于测量相邻两个被压接部之间的电阻值； 所述数据采集装置与所述多个电阻 测试仪连接， 用于采集电阻测试仪测量的电阻值。
例如， 所述压接头还可以包括显示装置， 所述显示装置与所述数据采集 装置连接， 用于实时显示所述数据采集装置采集的电阻值。
例如， 所述压接头还可以包括报警装置， 所述报警装置与所述数据采集 装置连接， 用于所述数据采集装置采集的电阻值发生异常时进行报警。
本发明的另一个方面还提供一种压接装置， 包括多个压接头安装位置， 至少一个所述压接头安装位置安装有上述任一项所述的压接头， 且所述压接 头设置为可拆卸结构。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为传统的压接头的结构示意图；
图 2为绑定芯片的柔性电路板的结构示意图；
图 3为图 2的左视图；
图 4为本发明实施例中压接头的结构示意图；
图 5为本发明实施例中压接头的工作原理示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例中将以绑定芯片的柔性电路板 ( Chip On Flex或 Chip On Film, 筒称" COF" )安装在印刷电路板（或基板）上的过程为例来具体说明 压接头的结构和工作原理。 可以理解的是， 本发明实施例的压接头并不限于 所描述的具体结构， 对于任何需要多点压合或者不连续压合的过程中都可以 应用本发明实施例的压接头。
图 2所示为绑定芯片的柔性电路板的结构示意图； 图 3所示为图 2的左 视图。
结合图 2和图 3所示，在 COF 2上固定有芯片 1及与该芯片 1的端子一 一对应的多条芯片端子导线 30, 且每一条芯片端子导线 30的一端与芯片 1 的一个端子电性连接。 在芯片端子导线 30上还可涂覆有绝缘层 60 (如： 树 月旨、 聚酰亚胺等有机高分子材料）， 并棵露出芯片端子导线 30的另一端， 作 为被压接部分， 以和印刷电路板（或基板）上相应的金属引线进行压接， 从 而将 COF 2 安装在印刷电路板（或基板）上。 需要说明的是， 在此只是以 COF为例来举例说明， 但是本发明并不限于此。 本发明实施例所提供的压接 头适用于所有芯片的贴合式安装过程或者其他需要多点压合的过程。
下面将具体介绍本发明实施例中压接头的结构：
图 4所示为本发明实施例中压接头的结构示意图； 图 5所示为本发明实 施例中压接头的工作原理示意图。
结合图 4和图 5所示， 本发明实施例中的压接头包括压接头本体 10, 在 压接头本体 10上设置有压接面 W, 在压接面 W上设置有多个凹槽结构 20, 且多个 槽结构 20的槽顶齐平， 相对槽底形成多个凸面结构 21。 多个 槽 结构 20横跨压接面 W的相对的两侧边，使得压接头的压接面 W为不连续结 构。 在压接头对芯片端子导线 30与印刷电路板 130 (或基板）上的金属引线 40进行压接的过程中， 非引线区域（即没有芯片端子导线 3的区域）对应于 凹槽结构 20,芯片端子导线 30和金属引线 40对应于凸面结构 21 ,从而不会 对非引线区域进行压接， 使得相邻两个芯片端子导线 30之间的金属球离子 50不再会聚集、 堆积， 克服了 COF安装过程中易造成相邻两个芯片端子导 线 30连接短路的问题。
由于芯片端子导线 30—般为等间距且平行分布，相应地，设置多个凹槽 结构 20也等间距且平行分布， 在压接过程中， 能够实现芯片端子导线 30与 凸面结构的位置——对应。
为了高效、 实时监测芯片压接头的压接状态， 本实施例中的芯片压接头 还可以包括多个电阻测试仪 90和数据采集装置 100。 每个电阻测试仪 90的 两端分别与相邻两个凸面结构对应的被压接部（即芯片端子导线 30的压接部 分）电性连接， 用于测量相邻两个芯片端子导线 30之间的电阻， 以监测相邻 两个芯片端子导线 30之间是否短路，保证压接质量；数据采集装置 100与多 个电阻测试仪 90连接， 用于采集电阻测试仪 90测量的电阻值。 为了实现电 中可以在 COF上的绝缘层 60上与芯片端子导线 30对应的位置处开设绝缘层 过孔 80。 如图 5所示， 通过绝缘层过孔 80将相邻两个芯片端子导线 30连接 到一个电阻测试仪 90的两端上， 实现对相邻两个芯片端子导线 30之间电阻 的测量和采集。
对于其他芯片的贴合式安装过程中， 均可以根据芯片的具体结构来实现 集相邻两个芯片端子之间的电阻， 在此不再赘述。 可以理解的是， 因为这里 描述的实施例以芯片与印刷电路板或基板压合实现电连接进行说明， 因此通 过测试压接部的电阻来判断压接质量的好坏，当然对于其他非电连接的过程， 还可以通过其他测量方式进行判断。
进一步地，一个实施例还可以包括显示装置 110,其与数据采集装置 100 连接， 用于实时显示数据采集装置 100采集的电阻值， 通过给每个电阻测试 仪 90进行编号。 因此当发现某两个相邻芯片端子导线 30之间的电阻小于设 定值时， 就能够确定压接不合格的位置， 重新压接， 从而提高了压接良率及 效率。
一个实施例也可以进一步设置报警装置 120, 其与数据采集装置 100连 接。 当发现某两个相邻芯片端子导线 30之间的电阻小于设定值，而发生异常 时， 进行报警， 及时发现压接不合格现象。通过给每个电阻测试仪 90进行编 号， 由此还可以确定压接不合格的位置， 重新压接， 从而提高了压接良率及 效率。
下面将参照图 5 具体介绍本发明一个实施例中压接头的工作过程和原 理。
首先， 涂覆覆盖印刷电路板 130 (或基板）上所有金属引线 40的 ACF 胶 70。 之后， 将 COF上芯片端子导线 30的压接部分放置到印刷电路板 130 (或基板 )上，并保证每个芯片端子导线 30与相应的金属引线 40位置对应。
然后， 利用压接头的压接面 W压合芯片端子导线 30和印刷电路板 130
(或基板 )上的金属引线 40, 经过一段时间的加热及加压使位于芯片端子导 线 30和印刷电路板 130 (或基板）上的金属引线 40之间的 ACF胶 70固化。 同时， 实时监测相邻两个芯片端子导线 30之间的电阻值， 当发现某两个相邻 芯片端子导线 30之间的电阻值小于设定值时， 再重新进行压接。
本发明实施例还提供了一种芯片压接装置，其包括多个压接头安装位置， 至少一个所述压接头安装位置安装有上述的压接头， 且所述压接头设置为可 拆卸结构。
显然， 通过在芯片压接装置上设置多个本发明实施例中的压接头， 还可 以实现对芯片多侧端子的同时压接。 当然， 所述压接头设置为可拆卸结构， 且根据各个芯片上端子位置设计的不同， 所述压接头可以设计成多种规格， 所述芯片压接装置根据实际需要选用不同规格的压接头， 实现对多种芯片结 构的兼容性。
由以上实施例可以看出， 本发明实施例所提供的芯片压接头， 其包括压 接头本体， 通过在压接头本体上设置压接面， 并在压接面上设置多个凹槽结 构， 且 槽结构的槽顶齐平， 形成多个凸面结构。 其中， 多个 槽结构横跨 压接面的相对的两侧边， 使得压接头的压接面为不连接结构。 在压接头对芯 片端子与印刷电路板或基板上的金属引线进行压接的过程中， 非引线区域对 应于凹槽结构，芯片端子对应于凸面结构，从而不会对非引线区域进行压接， 使得相邻两芯片端子之间的金属球离子不再会聚集、 堆积， 克服了芯片安装 过程中易造成相邻两芯片端子连接短路的问题。 而芯片压接装置由于使用了 上述压接头， 可以通过设置多个上述压接头， 实现对芯片多侧端子的同时压 接， 可以压接头的可拆卸结构， 使得该压接装置可以对多种规格的芯片进行 压接。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种压接头， 包括压接头本体， 其中， 所述压接头本体上设置有压接 面； 所述压接面上具有多个凹槽结构； 所述多个凹槽结构横跨所述压接面的 相对的两侧边； 且所述多个 槽结构的槽顶齐平， 形成多个凸面结构。
2、 根据权利要求 1所述的压接头， 其中， 所述多个凹槽结构平行设置。
3、根据权利要求 1或 2所述的压接头， 其中， 所述多个凹槽结构等间距 分布。
4、根据权利要求 1-3任一项所述的压接头，还包括多个电阻测试仪和数 据采集装置；
其中， 每个所述电阻测试仪的两端分别与相邻两个凸面结构对应的被压 接部电性连接， 用于测量相邻两个被压接部之间的电阻值； 所述数据采集装 置与所述多个电阻测试仪连接， 用于采集电阻测试仪测量的电阻值。
5、 根据权利要求 4所述的压接头， 还包括显示装置，
其中， 所述显示装置与所述数据采集装置连接， 用于实时显示所述数据 采集装置采集的电阻值。
6、 根据权利要求 4或 5所述的压接头， 还包括报警装置，
其中， 所述报警装置与所述数据采集装置连接， 用于所述数据采集装置 采集的电阻值发生异常时进行报警。
7、一种压接装置， 包括多个压接头安装位置， 至少一个所述压接头安装 位置安装有如权利要求 1-6任一项所述的压接头， 且所述压接头设置为可拆 卸结构。
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