WO2014162668A1 - Commutateur de type à capacitance - Google Patents
Commutateur de type à capacitance Download PDFInfo
- Publication number
- WO2014162668A1 WO2014162668A1 PCT/JP2014/001488 JP2014001488W WO2014162668A1 WO 2014162668 A1 WO2014162668 A1 WO 2014162668A1 JP 2014001488 W JP2014001488 W JP 2014001488W WO 2014162668 A1 WO2014162668 A1 WO 2014162668A1
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- WIPO (PCT)
- Prior art keywords
- dielectric constant
- electrode plate
- plate
- high dielectric
- constant material
- Prior art date
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
- H03K17/9622—Capacitive touch switches using a plurality of detectors, e.g. keyboard
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960755—Constructional details of capacitive touch and proximity switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960785—Capacitive touch switches with illumination
Definitions
- the invention disclosed herein relates to a capacitance type switch that operates on and off in accordance with a capacitance change caused by a contact operation with an operating body.
- Patent Document 1 discloses a capacitance type switch including an operation plate that forms an operation surface that is touched and operated by a user's fingertip, and an electrode plate that is disposed on the back side of the operation plate. This capacitance type switch is turned on and off according to the change in capacitance generated between the electrode plate and the fingertip.
- Patent Document 2 discloses a capacitance-type switch that includes an operation plate that forms an operation surface that is touched by a user's fingertip on the surface, and an electrode sheet that is attached to the back surface of the operation plate. Yes.
- the electrode sheet is configured by vapor-depositing electrodes and wirings on a flexible film, and the electrodes are arranged to face the operation surface.
- a detection signal representing a change in capacitance generated between the fingertip and the electrode is output to a determination circuit through a wire connected to the electrode, and the determination circuit determines whether the operation surface has been touched based on the detection signal. Determine whether.
- the operation plate may be turned on only by touching the vicinity of the operation surface of the operation plate.
- the capacitance change also occurs for the electrode plate facing the adjacent operation surface. There is a concern that a large ON may occur and the ON operation is erroneously performed.
- the invention disclosed herein has been made in view of the above problems, and an object of the invention is to provide a capacitance type switch that improves sensitivity and suppresses malfunction.
- the invention disclosed herein has been made in view of the above problems, and an object of the invention is to provide a capacitance type switch that eliminates the need for attaching an electrode sheet.
- One disclosed invention employs the following technical means to achieve the above object.
- symbol in the parenthesis described in the claim shows the correspondence with the specific means as described in embodiment mentioned later as one aspect, Comprising: The technical scope of the disclosed invention is limited Not what you want.
- an operation plate (10) that forms an operation surface (11a, 11b) that is operated by contact with the operation body (F), and an electrode plate (20, 201, 202, 203, 204), and is assumed to be a capacitance type switch that operates on and off in accordance with a change in capacitance generated between the operating body and the electrode plate.
- a high dielectric constant material (22, 221, 222, 223, 224) having a higher dielectric constant than that of the operation plate is disposed on the outer peripheral portion (20a) of the electrode plate.
- the electric lines of force that emerge from the opposite side of the operation surface (the back surface of the electrode plate) of the electrode plate are attracted to the high dielectric constant material and guided toward the operation surface. Therefore, since the lines of electric force penetrating the operation surface increase, the sensitivity can be improved.
- the invention that achieves the above object is characterized by the following points. That is, an operation plate (10) that forms an operation surface (11a, 11b) that is operated by contact with the operation body (F), an electrode plate (20) that is disposed on the opposite side of the operation surface with respect to the operation plate, It is assumed that the switch is a capacitance type switch that is turned on and off in response to a change in capacitance generated between the operating body and the electrode plate.
- the operation plate is integrally formed of resin by multicolor molding of a plate-like substrate (13) and a high dielectric constant material (15, 16, 151, 152) having a dielectric constant higher than that of the substrate.
- the dielectric constant material is arranged in the projection range (13a) of the electrode plate.
- the invention that achieves the above object is characterized by the following points. That is, an operation plate (10) that forms an operation surface (11a, 11b) that is operated by contact with the operation body (F), an electrode plate (20) that is disposed on the opposite side of the operation surface with respect to the operation plate, It is assumed that the switch is a capacitance type switch that is turned on and off in response to a change in capacitance generated between the operating body and the electrode plate.
- the operation plate includes a plate-shaped substrate (13) and a high dielectric constant material (14, 141, 142) that is disposed on the surface of the substrate and forms an operation surface, and has a higher dielectric constant than the substrate. It is characterized by comprising.
- an operation plate (10) that forms an operation surface (11a, 11b) that is operated by contact with the operation body (F)
- an electrode plate (14) that is disposed on the opposite side of the operation surface with respect to the operation plate, Is provided.
- the present invention includes a determination circuit (42) for determining whether or not the operation surface has been touched in accordance with a change in capacitance generated between the operating body and the electrode plate, and a determination circuit connected to the electrode plate for determination.
- Wiring (55) for outputting a signal to the circuit.
- the operation plate, the electrode plate, and the wiring are integrally formed of resin by multicolor molding.
- the electrode plate and the wiring are multicolor molded together with the operation plate, the electrode plate and the wiring are integrated with the operation plate, and the work of attaching the electrode plate and the wiring to the operation plate can be eliminated. Therefore, the pasting operation of the electrode sheet, which has been conventionally required, can be eliminated, and the manufacturing cost of the capacitance type switch can be reduced.
- FIG. 3 is an overall view of the capacitance type switch according to the first embodiment, taken along the line II in FIG. II arrow line view of FIG.
- FIG. 18 is an overall view of a capacitive switch according to a tenth embodiment, and is a cross-sectional view taken along the line XVI-XVI of FIG. 17.
- the XVII arrow directional view of FIG. The figure which shows a comparative example. The figure which shows distribution of the electric force line which comes out of an electrode plate. In 11th Embodiment, the top view which looked at the electrode plate from the back surface side.
- FIG. 23 is an overall view of a capacitive switch according to a twelfth embodiment, and is a cross-sectional view taken along XXI-XXI in FIG. 22.
- XXII arrow line view of FIG. The figure which shows distribution of the electric force line which comes out of an electrode plate.
- FIG. 28 is an overall view of a capacitive switch according to a fifteenth embodiment, and is a cross-sectional view taken along the line XXVI-XXVI of FIG. XXVII arrow directional view of FIG. Sectional drawing of the electrostatic capacitance type switch which concerns on 16th Embodiment.
- FIG. 31 is an overall view of a capacitive switch according to a seventeenth embodiment and is a cross-sectional view taken along XXIX-XXIX in FIG. 30. XXX arrow line view of FIG. The figure which shows a comparative example. The figure which shows distribution of the electric force line which comes out of an electrode plate.
- the operation plate 10 shown in FIG. 1 has a plate shape formed of a resin having translucency.
- resin material forming the operation plate 10 include polycarbonate (PC), acrylic, acrylonitrile-butadiene-styrene (ABS), and the like.
- the surface of the operation plate 10, that is, the user-side surface of the operation plate 10 is a design surface 11 that is visually recognized by the user.
- the specific ranges DA and DB of the design surface 11 function as the operation surfaces 11a and 11b.
- the operation surfaces 11a and 11b are touched by the user's fingertip F (operation body). On the operation surfaces 11a and 11b, characters, symbols and the like representing the operation target are printed.
- the design surface 11 three or more operation surfaces are densely arranged in a limited range.
- two operation surfaces 11a and 11b are illustrated.
- the distance between the two operation surfaces 11a and 11b is smaller than the length of the operation surfaces 11a and 11b in the direction in which the two operation surfaces 11a and 11b are arranged (the left-right direction in FIG. 1).
- the electrode plate 20 is disposed on the opposite side of the design surface 11 with respect to the operation plate 10.
- the electrode plate 20 has a sheet shape formed of a resin having translucency.
- Specific examples of the resin material that forms the electrode plate 20 include conductive polymers such as indium tin oxide (ITO) and polyethylenedioxythiophene-polystyrene sulfonic acid (PEDOT-PSS).
- ITO indium tin oxide
- PEDOT-PSS polyethylenedioxythiophene-polystyrene sulfonic acid
- the shape and size of the electrode plate 20 are the same as those of the operation surfaces 11a and 11b.
- the electrode plate 20 is applied to the back surface of the film material 21, that is, the surface of the film material 21 opposite to the operation plate 10 by a method such as vapor deposition.
- the film material 21 is formed of a resin material having flexibility and translucency, and a specific example of the resin material is polyethylene terephthalate (PET).
- PET polyethylene terephthalate
- the surface of the film material 21 is attached to the back surface 12 of the operation plate 10 with an adhesive 30.
- the electrode plate 20 is attached to the back surface 12 of the operation plate 10 while being held by the film material 21 (holding member).
- the film material 21 is provided with wiring (not shown), and one end of the wiring is connected to the electrode plate 20.
- the other end of the wiring is connected to a connector 41 provided on the circuit board 40.
- the detection signal output from the electrode plate 20 is input to the microcomputer (microcomputer 42) mounted on the circuit board 40.
- This detection signal is a voltage change signal corresponding to a change in capacitance generated between the fingertip F and the electrode plate 20.
- the electrode plate 20 is arrange
- the microcomputer 42 determines whether or not the fingertip F is in contact with the operation surfaces 11a and 11b based on the change in the detection signal, and outputs an ON signal to the operation target when determining that the fingertip F is in contact.
- the operation target is operated so as to perform a desired operation. Specific examples of the operation target include activation of an air conditioner mounted on the vehicle, air volume setting, temperature setting, volume setting of an audio device mounted on the vehicle, music selection, destination setting of a navigation device mounted on the vehicle, etc. Is mentioned.
- the determination it may be determined that the contact is made when the detection signal changes by a predetermined value or more with respect to the reference voltage.
- the contact is made when the above-described capacitance increases by a predetermined amount or more.
- a light source 43 such as a light emitting diode is disposed on the opposite side of the design surface 11 with respect to the electrode plate 20.
- the light source 43 is mounted on the front side of the circuit board 40.
- the light source 43 is disposed to face each electrode plate 20.
- Light emitted from the light source 43 is guided to the corresponding electrode plate 20 by a light guide member (not shown), and passes through the electrode plate 20, the film material 21, the adhesive material 30, and the operation plate 10.
- the paint which has light-shielding property is printed in parts other than operation surface 11a, 11b among the design surfaces 11.
- a high dielectric constant material 22 made of a material having a higher dielectric constant than that of the operation plate 10 is disposed on the outer peripheral portion 20 a of the electrode plate 20.
- the high dielectric constant material 22 is formed by mixing a material having a higher dielectric constant than that of the resin, such as a glass filler, a carbon filler, or the like, for example, in a resin such as polycarbonate, acrylic, or ABS. Further, the high dielectric constant material 22 has a higher dielectric constant than the film material 21.
- the “outer peripheral portion 20a” is a portion of a predetermined range adjacent to the outer peripheral end surface 20b of the electrode plate 20 in the back surface 20r of the electrode plate 20, that is, the surface on the opposite side of the design surface 11 of the electrode plate 20.
- the shape of the outer peripheral portion 20a of the electrode plate 20 is annular, and in this embodiment, the high dielectric constant material 22 is disposed so as to cover the entire outer peripheral portion 20a.
- the high dielectric constant material 22 is not disposed in a part of the central portion of the back surface 20r of the electrode plate 20 other than the outer peripheral portion 20a.
- the high dielectric constant material 22 according to the present embodiment is formed in an annular shape.
- the high dielectric constant material 22 has an extending portion 22p extending in a direction away from the outer peripheral end surface 20b in a horizontal direction (left and right direction in FIG. 1) with the back surface 20r of the electrode plate 20.
- the outer peripheral end 22 a of the high dielectric constant material 22 is located outside the outer peripheral end surface 20 b of the electrode plate 20 when viewed from the direction perpendicular to the plate surface of the electrode plate 20 as shown in FIG.
- the high dielectric constant material 22 has a shape that covers the entire outer peripheral end surface 20 b of the electrode plate 20.
- the dotted line in FIG. 3 shows the electric force line distribution when the high dielectric constant material is abolished against the present invention
- the dotted line in FIG. 4 shows the electric force line distribution in the case of this embodiment.
- the electric lines of force exiting from the electrode plate 20 exit from both the front surface 20f and the back surface 20r.
- the electric lines of force that emerge from the surface 20 f lead to the fingertip F that functions as an electrode through the film material 21, the adhesive 30, and the operation plate 10.
- a part of the lines of electric force coming out from the back surface 20r becomes a route toward the fingertip F after coming out into the air.
- the directivity of the electric lines of force emitted from the back surface 20r to the corresponding operation surface 11a is strong. Become. Therefore, it can suppress that the detection signal of the electrode plate 20 changes between the fingertips which are contacting the adjacent operation surface 11b. Therefore, it is possible to suppress a malfunction such that an operation target corresponding to an adjacent operation surface not intended by the user is turned on.
- the number of electric lines of force leading to the fingertip F in contact with the corresponding operation surface 11a is increased due to the strong directivity as described above, this occurs when the fingertip F is in contact with the operation surface 11a.
- the change in the detection signal of the electrode plate 20 can be increased. Therefore, even if the operation surface 11a is lightly touched, that is, even when the contact area of the fingertip F with the operation surface 11a is small, the detection signal changes by a predetermined value or more with respect to the reference voltage. Therefore, the sensitivity of the switch can be improved.
- the high dielectric constant material 22 is formed in a shape surrounding the electrode plate 20 by being disposed on the entire outer peripheral portion 20a. Therefore, compared with the case where the high dielectric constant material 22 is arranged only in a part of the outer peripheral portion 20a, the above-described effects of improving directivity and increasing the number of lines of electric force can be increased. Therefore, the effects of suppressing malfunction and improving sensitivity are promoted.
- the high dielectric constant material 22 has an extending portion 22p extending in a direction away from the outer peripheral end surface 20b of the electrode plate 20. Therefore, since the electrode plate 20 is not positioned between the back surface of the extended portion 22p, that is, the extended portion back surface 22b shown in FIG. 4 and the fingertip F, the electric lines of force coming out from the extended portion back surface 22b are linear. It can promote going to the fingertip F. Therefore, the directivity of the electric lines of force drawn to the high dielectric constant material 22 to the corresponding operation surface 11a can be improved. Therefore, the effect of suppressing malfunction is promoted.
- the extension part back surface 22b is made to contact the film material 21, the electric lines of force which come out from the extension part back surface 22b do not go out in the air, but the film material 21, the adhesive material 30, and the operation plate.
- the fingertip F is reached through 10. Therefore, it is possible to improve the density of the lines of electric force that come out of the extended portion back surface 22b and reach the fingertip F, and the effects of suppressing malfunction and improving sensitivity are promoted.
- the shape of the electrode plate 20 according to the first embodiment is deformed, and accordingly, the shape of the high dielectric constant material 22 is also deformed.
- Other structures are the same as those in the first embodiment.
- the electrode plate 201 of this embodiment shown in FIG. 5 has a shape in which a through hole 20h is formed at the center. Therefore, the electrode plate 201 has an inner peripheral portion 20c in addition to the outer peripheral portion 20a.
- the portion of the high dielectric constant material (inner high dielectric constant material 221a) that covers the inner peripheral portion 20c is disposed so as to cover the entire inner peripheral portion 20c, and is formed in an annular shape along the inner peripheral portion 20c. .
- the inner high dielectric constant material 221 a is separated from the inner peripheral end surface 20 d of the electrode plate 201 in a direction horizontal to the rear surface 20 r of the electrode plate 20. It has the extension part 22q extended in direction.
- the inner high dielectric constant material 221a has a shape that covers the entire inner peripheral end face 20d of the electrode plate 20.
- the back surface of the extended portion 22q is also in contact with the film material 21 in the same manner as the extended portion back surface 22b.
- the high dielectric constant material (inner high dielectric constant material 221a) is also applied to the inner peripheral portion 20c of the electrode plate 201. Deploy. Therefore, a part of the electric lines of force in the air coming out from the back surface 20r are attracted even by the inner high dielectric constant material 221a. Therefore, the effects of improving the directivity and increasing the number of lines of electric force can be increased, and the effects of suppressing malfunction and improving sensitivity can be promoted.
- the electrode plate 201 is rectangular, and the outer peripheral portion 20a and the inner peripheral portion 20c of the electrode plate 201 are rectangular.
- the electrode plate 202 is circular (strictly, elliptical), and the outer peripheral portion 20a and the inner peripheral portion 20c of the electrode plate 202 are circular. Therefore, the inner high dielectric constant material 222a disposed so as to cover the entire inner peripheral portion 20c is circular, and the high dielectric constant material 222 disposed so as to cover the entire outer peripheral portion 20a has an annular shape. Note that the portions with halftone dots in FIG. 8 are the high dielectric constant materials 222 and 222a.
- the high dielectric constant materials 222 and 222a can be arranged similarly to the second embodiment, and the same effect as the second embodiment can be exhibited. Can do.
- one electrode plate 20, 201, 202 is arranged for each of the plurality of operation surfaces 11a, 11b.
- a plurality of electrode plates 203 are arranged on one operation surface.
- the plurality of electrode plates 203 are connected by a high dielectric constant material 223.
- the high dielectric constant materials 22, 221 and 222 of the above embodiments are arranged so as to cover the entire outer peripheral portion 20a of the electrode plates 20, 201, and 202, the high dielectric constant materials according to the present embodiment. 223 is arrange
- the electrode plate 202 has a circular shape having a through hole 20h, and the high dielectric constant material 222 is disposed so as to cover the entire outer peripheral portion 20a of the electrode plate 202. Yes.
- the electrode plate 204 has a circular shape having no through hole, and the high dielectric constant material 224 covers a part of the outer peripheral portion 20 a of the electrode plate 204. Is arranged.
- the high dielectric constant material 224 can be arranged as shown in the figure to improve directivity and increase the number of lines of electric force. The effect of suppressing operation and improving sensitivity can be exhibited.
- the operation plate 10 includes a plate-like substrate 13 and a second high dielectric constant material 14.
- the substrate 13 has a plate shape made of a resin such as ABS.
- the second high dielectric constant material 14 is formed of a translucent material having a higher dielectric constant than that of the substrate 13.
- the second high dielectric constant material 14 is made of the same resin material as the high dielectric constant material 22.
- the second high dielectric constant material 14 is applied (potted) to a portion corresponding to each of the electrode plates 20 in the operation surface side surface (design surface 11) of the substrate 13. It is raised on the side.
- a part of the design surface 11 functions as the operation surfaces 11 a and 11 b
- the second high dielectric constant material 14 is formed.
- the surface functions as the operation surfaces 11a and 11b. Note that characters, symbols, and the like representing the operation target are printed on the design surface 11 where the second high dielectric constant material 14 is disposed.
- the second high dielectric constant material 14 is disposed so as to cover the entire projection range 13 a of the electrode plate 20 in the design surface 11.
- the “projection range 13a” is a range that overlaps the electrode plate 20 in the design surface 11 when the operation plate 10 is viewed from the back surface 20r of the electrode plate 20 in a direction perpendicular to the back surface 20r. . Therefore, the shape and size of the projection range 13a are the same as those of the electrode plate 20. In the example of FIG. 11, the second high dielectric constant material 14 also has the same shape and size as the electrode plate 20.
- the second high dielectric constant material 14 is disposed on the design surface 11, and the surface of the second high dielectric constant material 14 is caused to function as the operation surfaces 11a and 11b. Therefore, the electric lines of force that have come out of the electrode plate 20 are attracted to the second high dielectric constant material 14 and communicate with the fingertip F, so that the number of electric lines of force connecting the electrode plate 20 and the fingertip F is increased. And switch sensitivity can be increased.
- an electric force line directed to the operation surface 11b located next to the operation surface 11a corresponding to the electrode plate 20 is a second high dielectric constant that forms the operation surface 11a. It will be drawn to the material 14. Therefore, since the directivity of the electric lines of force coming out from the back surface 20r of the electrode plate 20 toward the fingertip F that contacts the corresponding operation surface 11a is increased, the effect of suppressing malfunction is promoted.
- the second high dielectric constant material 14 is disposed so as to cover the entire projected range 13a of the electrode plate 20 in the design surface 11. Therefore, compared with the case where it arrange
- the second high dielectric constant material 14 is applied to a portion corresponding to each of the electrode plates 20 in the operation surface side surface (design surface 11) of the substrate 13, and a flat design surface.
- the shape is raised from 11 to the user side. Therefore, the user who is bringing the fingertip F into contact with the second high dielectric constant material 14 can recognize by touch that the contact portions are the operation surfaces 11a and 11b, and can perform a blind operation.
- the operation plate 10 includes a plate-like substrate 13, third high dielectric constant materials 15 and 16, and a low dielectric constant material 17.
- the substrate 13 has a plate shape made of a resin such as ABS.
- the third high dielectric constant materials 15 and 16 are made of a light-transmitting material having a higher dielectric constant than that of the substrate 13.
- the same resin material as that of the high dielectric constant material 22 is used for the third high dielectric constant materials 15 and 16.
- the low dielectric constant material 17 is formed of a material having a lower dielectric constant than that of the substrate 13.
- the third high dielectric constant materials 15 and 16, the low dielectric constant material 17 and the substrate 13 are integrally formed of resin by multicolor molding.
- Multicolor molding is a method of molding different materials (materials) in one piece. Specifically, the molten resin is injected into a portion of the mold that becomes the substrate 13, molded in the mold, and then into the same mold with the substrate 13 remaining, the third high dielectric constant material 15 and 16 and the molten resin of the low dielectric constant material 17 are injected.
- the third high dielectric constant materials 15 and 16, the low dielectric constant material 17 and the substrate 13 which are different materials are integrally molded with resin.
- the third high dielectric constant materials 15 and 16 are disposed so as to cover the entire projection range 13a of the electrode plate 20 in the operation plate 10.
- the “projection range 13a” is a range that overlaps the electrode plate 20 when the operation plate 10 is viewed from the back surface 20r of the electrode plate 20 in a direction perpendicular to the back surface 20r. Therefore, the shape and size of the projection range 13a are the same as those of the electrode plate 20.
- the third high dielectric constant materials 15 and 16 have the same shape and size as the electrode plate 20.
- One third high dielectric constant material 15 shown in the figure is disposed over the entire thickness of the substrate 13.
- the other third high dielectric constant material 16 shown in the figure is arranged so as not to be exposed on the surface of the operation plate 10 on which the design surface 11 is formed. Therefore, the operation surface 11a corresponding to one third high dielectric constant material 15 is formed by the surface of the third high dielectric constant material 16, and the operation surface 11b corresponding to the other third high dielectric constant material 16 is the substrate. 13 surfaces.
- the low dielectric constant material 17 is disposed between the third high dielectric constant materials 15 and 16 adjacent to each other in the operation plate 10 and is disposed over the entire board 13 in the thickness direction.
- the operation plate 10 is integrally formed by multicolor molding of the third high dielectric constant materials 15 and 16 and the substrate 13, and the third high dielectric constant materials 15 and 16 are connected to the electrodes. It arrange
- the low dielectric constant material 17 is multi-color molded in addition to the third high dielectric constant materials 15 and 16, and the low dielectric constant material 17 is disposed between the adjacent third high dielectric constant materials 15 and 16. To do. For this reason, it is possible to promote increasing the directivity so that the lines of electric force emitted from the electrode plate 20 are directed to the desired operation surface 11a.
- one third high dielectric constant material 15 is arranged over the entire thickness of the substrate 13. Therefore, compared with the case where it arrange
- the other third high dielectric constant material 16 is arranged so as not to be exposed on the surface (design surface 11) on the operation plate 10 side on which the operation surface is formed. Therefore, since the boundary line between the third high dielectric constant material 16 and the substrate 13 is not exposed to the design surface 11, the appearance of the design surface 11 can be improved.
- the electrode plate 20 is applied to the film material 21, and the film material 21 is attached to the operation plate 10.
- the electrode plate 20 is attached to the operation plate 10 via the film material 21.
- the electrode plate 20 is directly attached to the operation plate 10 as shown in FIG.
- the electrode plate 20 is applied to the operation plate 10, and the high dielectric constant material 22 is applied from above the applied electrode plate 20.
- the high dielectric constant material 22 is disposed on the outer peripheral portion a of the electrode plate 20. Further, the back surface of the extended portion 22 p of the high dielectric constant material 22 is in contact with the operation plate 10.
- the high dielectric constant material 22 can be disposed in the same manner as in the first embodiment, and the same effects as in the first embodiment can be obtained. It can be demonstrated.
- (Ninth embodiment) 14 and 15 show the voltage value (signal intensity SGV) of the detection signal output from the electrode plate 20, and the lower stage shows the determination DET of the microcomputer 42.
- the horizontal axis is time t.
- the microcomputer 42 determines to be on as shown in the lower part of the figure. That is, if the corresponding operation surfaces 11a and 11b are touched, the microcomputer 42 determines contact.
- FIG. 14 shows a waveform of signal intensity when the fingertip F is brought into contact with the operation surfaces 11a and 11b.
- FIG. 15 shows a waveform of the signal intensity when the fingertip F is brought close to the operation surfaces 11a and 11b without touching. For example, this waveform appears when a touch operation is performed on an adjacent operation surface.
- Reference sign Vb in FIGS. 14 and 15 indicates a value (base value) of the signal intensity when the fingertip F is not approaching the operation surfaces 11a and 11b.
- the threshold values THa, THb, THc, and THd are values based on the base value Vb.
- the signal intensity exceeds the threshold value THc and is determined to be on even though no contact operation is performed.
- the threshold value it is necessary to adjust the threshold value to be increased. For example, if the threshold value is increased to the threshold value THd, the OFF determination is normally maintained as shown in the lower part of FIG.
- the microcomputer 42 has a function that allows an operator such as a user to adjust the threshold value. Specifically, when a plurality of operation surfaces 11a and 11b are operated with a preset pattern, the adjustment mode is adjustable. As a specific example of the pattern, it is possible to simultaneously operate a predetermined combination of the operation surfaces 11a and 11b.
- one of the operation surfaces 11a and 11b functions as a switch for increasing the threshold value, and the other functions as a switch for decreasing the threshold value. Therefore, the operator can adjust the threshold value by operating these switches.
- the microcomputer 42 since the microcomputer 42 has a function of adjusting the threshold value, the sensitivity of the switch can be adjusted according to the wetness of the user's fingertip and the fingertip area. Accordingly, it is possible to reduce the chances of occurrence of a malfunction that is not determined to be ON due to insufficient sensitivity even though the contact operation is performed, or a problem that is determined to be ON due to excessive sensitivity although the contact operation is not performed.
- the operation plate 10 shown in FIG. 16 includes a plate-like substrate 13, high dielectric constant materials 15 and 16, and a low dielectric constant material 17.
- substrate 13 is the plate shape formed with resin which has translucency.
- the surface of the substrate 13, that is, the surface on the user side of the substrate 13 is a design surface 11 that is visually recognized by the user.
- FIG. 17 illustration of the adhesive 30 and the film material 21 is omitted.
- the electrode plate 20 is rectangular, and the high dielectric constant materials 15 and 16 are circular.
- the high dielectric constant materials 15 and 16 are arranged so as to overlap the projection range 13 a of the electrode plate 20.
- the “projection range 13a” is a range that overlaps the electrode plate 20 in the design surface 11 when the operation plate 10 is viewed from the back surface 20r of the electrode plate 20 in a direction perpendicular to the back surface 20r.
- FIGS. 18 and 19 correspond to FIGS. 3 and 4, respectively.
- the U-turn is promoted as the electric lines of force coming out from the back surface 20 r make a U-turn toward the fingertip F in the case of FIG. 19 compared to the case of FIG. Therefore, the directivity of the electric force lines coming out from the back surface 20r toward the fingertip F contacting the corresponding operation surface 11a is increased, and the number of electric force lines leading to the fingertip F is increased.
- malfunctions can be suppressed by disposing the high dielectric constant materials 15 and 16 in the projection range 13 a of the electrode plate 20.
- the sensitivity of the switch can be improved.
- the low dielectric constant material 17 is also multi-color molded, and the low dielectric constant material 17 is disposed between the adjacent high dielectric constant materials 15 and 16. For this reason, it is possible to promote increasing the directivity so that the lines of electric force emitted from the electrode plate 20 are directed to the desired operation surface 11a.
- one high dielectric constant material 15 is arranged over the entire thickness of the substrate 13. Therefore, compared with the case where it arrange
- the other high dielectric constant material 16 is disposed so as not to be exposed on the surface (design surface 11) on the operation plate 10 side on which the operation surface is formed. Therefore, since the boundary line between the high dielectric constant material 16 and the substrate 13 is not exposed to the design surface 11, the appearance of the design surface 11 can be improved.
- the high dielectric constant materials 15 and 16 are arranged so as to overlap a part of the projection range 13 a of the electrode plate 20.
- the high dielectric constant material 151 shown on the left side in the drawing is arranged so as to cover the entire projection range 13 a of the electrode plate 20.
- the high dielectric constant material 151 is disposed so as to cover the entire projection range 13a of the electrode plate 20, the directivity improvement described above is achieved as compared with the case where it is disposed so as to cover a part of the projection range 13a.
- the effect of increasing the number of lines of electric force can be increased. Therefore, the effects of suppressing malfunction and improving sensitivity are promoted.
- the high dielectric constant material 151 is circular, whereas the high dielectric constant material 152 shown on the right side in the figure is rectangular. As described above, the high dielectric constant materials 15, 151, and 152 are not limited to a circle as long as they are arranged so as to overlap at least a part of the projection range 13 a.
- the operation plate 10 shown in FIG. 21 includes a plate-like substrate 13 and a high dielectric constant material 14.
- the high dielectric constant material 14 is applied (potted) to a specific range of the surface (design surface 11) on the operation surface side of the substrate 13, and rises from the flat design surface 11 to the user side.
- the surface of the high dielectric constant material 14 functions as the operation surfaces 11a and 11b.
- the operation surfaces 11a and 11b are touched by the user's fingertip F (operation body).
- characters, symbols and the like representing the operation target are printed on the operation surfaces 11a and 11b. Note that characters, symbols, and the like representing the operation target are printed on a portion of the design surface 11 where the high dielectric constant material 14 is disposed.
- the high dielectric constant material 14 is arranged so as to cover a part of the projected range 13 a of the electrode plate 20 in the design surface 11.
- FIG. 23 corresponds to FIG.
- the high dielectric constant material 14 is arranged on the design surface 11, it is promoted to make a U-turn in which electric lines of force in air are strongly attracted to the high dielectric constant material 14.
- malfunctions can be suppressed by disposing the high dielectric constant material 14 in the projected range 13 a of the electrode plate 20 in the design surface 11.
- the sensitivity of the switch can be improved.
- the high dielectric constant material 14 is disposed so as to cover a part of the projection range 13 a of the electrode plate 20 in the design surface 11.
- the high dielectric constant material 141 shown on the left side in the figure is arranged so as to cover the entire projection range 13 a of the electrode plate 20 in the design surface 11.
- the high dielectric constant material 14 is arranged so as to cover the entire projection range 13a of the electrode plate 20 in the design surface 11, compared to the case where it is arranged so as to cover a part of the projection range 13a, the above-described effects of improving directivity and increasing the number of lines of electric force can be increased. Therefore, the effects of suppressing malfunction and improving sensitivity are promoted.
- the high dielectric constant material 141 is circular, whereas the high dielectric constant material 142 shown on the right side in the figure is rectangular. As described above, the high dielectric constant materials 14, 141, and 142 are not limited to a circle as long as they are arranged so as to cover at least a part of the projection range 13 a.
- the operation plate 10 includes a plate-like substrate 13, a high dielectric constant material 14, second high dielectric constant materials 15 and 16, and a low dielectric constant material 17.
- the second high dielectric constant materials 15 and 16 are made of a light-transmitting material having a higher dielectric constant than that of the substrate 13.
- the same resin material as that of the high dielectric constant material 14 is used for the second high dielectric constant materials 15 and 16.
- the low dielectric constant material 17 is formed of a material having a lower dielectric constant than that of the substrate 13.
- the second high dielectric constant materials 15 and 16, the low dielectric constant material 17 and the substrate 13 are integrally formed of resin by multicolor molding.
- Multicolor molding is a method of molding different materials (materials) in one piece. Specifically, the molten resin is injected into a portion of the mold that becomes the substrate 13, molded in the mold, and then into the same mold where the substrate 13 remains, the second high dielectric constant material 14 and 15 and a molten resin of the low dielectric constant material 17 are injected. Thereby, the second high dielectric constant materials 14 and 15, the low dielectric constant material 17 and the substrate 13 which are different materials are integrally molded with resin.
- the second high dielectric constant materials 15 and 16 are arranged so as to cover the entire projection range 13a of the electrode plate 20 in the operation plate 10.
- the second high dielectric constant materials 15 and 16 have the same shape and size as the electrode plate 20.
- the effect of suppressing malfunction is promoted. Furthermore, in this embodiment, it can promote strengthening directivity. Furthermore, in this embodiment, it can promote strengthening directivity. Furthermore, in this embodiment, the appearance of the design surface 11 can be improved.
- the operation plate 10 shown in FIG. 26 includes a plate-like substrate 13 and an operation unit 53 formed of a light-transmitting resin.
- resin materials include PC (polycarbonate), acrylic, ABS (acrylonitrile-butadiene-styrene) and the like.
- the substrate 13 and the operation unit 53 are integrally formed of resin by multicolor molding. It is not necessary to use a light-transmitting material for the substrate 13, but when a light-transmitting material is used, it is desirable to print a light-shielding paint.
- the operation plate 10 is provided with an electrode plate 54.
- the electrode plate 54 is made of a material having translucency and having a dielectric constant higher than that of the substrate 13. Specific examples of the material forming the electrode plate 54 include a material in which a conductive material (for example, glass filler, carbon filler, etc.) is mixed into a resin (for example, polycarbonate, acrylic, ABS, etc.).
- the electrode plate 54 is integrally formed of resin together with the substrate 13 and the operation unit 53 by multicolor molding.
- the electrode plate 54 is arranged so as not to be exposed on the design surface 11.
- the electrode plate 54 and the operation unit 53 are stacked in a direction perpendicular to the design surface 11 (up and down direction in FIG. 26) and are in contact with each other.
- a wiring 55 connected to the electrode plate 54 is provided on the back surface 12 of the operation plate 10.
- the wiring 55 is formed of a conductive material, and is integrally formed of resin by multicolor molding together with the substrate 13, the operation unit 53, and the electrode plate 54.
- the wiring 55 is a high dielectric constant material having a higher dielectric constant than the electrode plate 54. It is not necessary to use a light-transmitting material for the wiring 55.
- One end of the wiring 55 is connected to the electrode plate 54.
- the other end of the wiring 55 is connected to the circuit board 40 via a connection wiring (flat cable 21).
- the detection signal output from the electrode plate 54 is input to the microcomputer (microcomputer 42) mounted on the circuit board 40 through the wiring 55 and the flat cable 21.
- the microcomputer 42 determines whether or not the fingertip F is in contact with the operation surfaces 11a and 11b based on the change in the detection signal, and outputs an ON signal to the operation target when determining that the fingertip F is in contact.
- the operation target is operated so as to perform a desired operation.
- the microcomputer 42 at the time of determining the presence / absence of the contact operation corresponds to a “determination circuit”.
- the light emitted from the light source 43 is guided to the corresponding electrode plate 54 by a light guide member (not shown) and passes through the electrode plate 54 and the operation unit 53.
- the electrode plate 54 and the operation unit 53 are rectangular.
- the operation unit 53 is disposed so as to overlap the projection range of the electrode plate 54.
- the “projection range” is a range of the design surface 11 that overlaps the electrode plate 54 when the operation plate 10 is viewed from the back surface 54r of the electrode plate 54 in a direction perpendicular to the back surface 54r.
- the wiring 55 has an annular portion 55 a that extends in an annular shape so as to surround the electrode plate 54. The inner peripheral end surface of the annular portion 55 a is in contact with the outer peripheral end surface of the electrode plate 54. The wiring 55 and the electrode plate 54 are exposed on the back surface 12 of the operation plate 10.
- the substrate 11, the electrode plate 54, and the wiring 55 of the operation plate 10 are integrally formed of resin by multicolor molding. This eliminates the need for attaching the electrode plate 54 and the wiring 55 to the operation plate 10. Therefore, the pasting operation of the electrode sheet, which has been conventionally required, can be eliminated, and the manufacturing cost of the capacitance type switch can be reduced.
- the wiring 55 has an annular portion 55 a surrounding the electrode plate 54. For this reason, the entire outer peripheral end face of the electrode plate 54 and the wiring 55 come into contact with each other, so that the contact area can be increased as compared with a case in which a part of the outer peripheral end face of the electrode plate 54 contacts. Therefore, since the coupling capacitance between the electrode plate 54 and the wiring 55 is increased, the voltage change of the detection signal transmitted through the wiring 55 can be increased. Therefore, even if the operation surface 11a is lightly touched, that is, even when the contact area of the fingertip F with the operation surface 11a is small, the detection signal changes by a predetermined value or more with respect to the reference voltage. Therefore, the sensitivity of the switch can be improved.
- the operation portion 53 and the electrode plate 54 of the operation plate 10 are formed of a light-transmitting material. Therefore, it is possible to realize transmission illumination of the operation surfaces 11a and 11b while the electrode plate 54 is integrally formed with the substrate 13 and the resin.
- the operation unit 53 is formed of a material having translucency, so that light emitted from the light source 59 is transmitted through the operation unit 53 and is transmitted and illuminated.
- the operation unit 53 is abolished, the substrate 13 is formed of a material having translucency, and the design surface 11 is excluded from the specific ranges DA and DB. Light-shielding paint is printed.
- the specific ranges DA and DB are located in the projection range of the electrode plate 54, and the specific ranges DA and DB of the substrate 13 function as the operation surfaces 11a and 11b.
- the light emitted from the light source 59 is guided to the corresponding electrode plate 54 by a light guide member (not shown), and passes through the electrode plate 54 and the substrate 13.
- transmits the corresponding operation surface among several operation surfaces 11a and 11b is permeate
- the design surface 11 is subjected to transmission illumination by performing light-shielding printing. Becomes feasible.
- a high dielectric constant material 60 described below is further added to the structure of the fifteenth embodiment.
- the wiring 55 according to the fifteenth embodiment has an annular portion 55a, whereas the annular portion 55a is eliminated in this embodiment.
- the high dielectric constant material 60 is formed of a material having a higher dielectric constant than that of the substrate 13.
- the high dielectric constant material 60 corresponds to the high dielectric constant material 22 of the preceding embodiment.
- the high dielectric constant material 60 is disposed on the outer peripheral portion 54 a of the electrode plate 54.
- the high dielectric constant material 60 is disposed so as to cover the entire outer peripheral portion 54a.
- the high dielectric constant material 60 is not disposed in a part of the central portion of the back surface 54r of the electrode plate 54 other than the outer peripheral portion 54a.
- FIGS. 31 and 32 correspond to FIGS. 3 and 4, respectively. According to the present embodiment, it is possible to suppress malfunction by disposing the high dielectric constant material 60 on the outer peripheral portion 54a of the electrode plate 54. Moreover, the sensitivity of the switch can be improved.
- the high dielectric constant material 60 has an extending portion 60 p that extends in a direction away from the outer peripheral end face 54 b of the electrode plate 54. Therefore, since the electrode plate 54 is not positioned between the back surface of the extending portion 60p (the extended portion back surface 60b shown in FIG. 32) and the fingertip F, the effect of suppressing malfunction is promoted. (Other embodiments)
- the present invention is not limited to the description of the above embodiment, and may be modified as follows. Moreover, you may make it combine the characteristic structure of each embodiment arbitrarily, respectively.
- the operation plate 10 since the operation plate 10 has a flat plate shape with a uniform thickness, the distance between the operation surfaces 11a and 11b and the electrode plates 20 and 54 can be kept uniform. On the other hand, when the operation plate 10 has a non-uniform thickness or has an uneven shape, the distance between the operation surfaces 11a and 11b and the electrode plates 20 and 54 cannot be kept uniform.
- the present invention is applicable. In such a case, by adjusting the shape and size of the high dielectric constant materials 14, 141, 142, 15, 16, 60, 151, 152, 22, 221, 222, 223, 224, the desired It can be adjusted so that the capacitance changes.
- the electrode plates 20 and 54 are formed of conductive resin, but the electrode plates 20 and 54 may be formed of metal.
- the transmission illumination may be eliminated and the electrode plates 20 and 54 may be formed of a material that does not have translucency.
- the high dielectric constant materials 14, 141, 142, 151, 152, 22, 221, 222, 223, 224 and the substrate 13 may be formed of a material that does not have translucency.
- the shape and size of the electrode plates 20 and 54 and the shape and size of the operation surfaces 11a and 11b can be set to be the same or different.
- the electrode plates 20 and 54 may be formed in a shape larger than the projection range while covering the entire projection range of the operation surfaces 11a and 11b, or the electrode plate 20 in a shape covering a part of the projection range. , 54 may be formed.
- the high dielectric constant material 22 is disposed in a range that covers a part of the electrode plate 20, but may be disposed in a range that covers the entire surface.
- the high dielectric constant material 22 has the extending portion 22p, and the outer peripheral end portion 22a of the high dielectric constant material 22 is located outside the outer peripheral end surface 20b of the electrode plate 20.
- the outer peripheral end 22a may be positioned on the outer peripheral end surface 20b or may be positioned on the inner side of the outer peripheral end surface 20b using the high dielectric constant material 22 that does not have the extending portion 22p.
- the structure shown in FIG. 11 and the structure shown in FIG. 12 may be combined to include the high dielectric constant material 22, the second high dielectric constant material 14, and the third high dielectric constant materials 15 and 16. Good. Note that the low dielectric constant material 17 shown in FIG. 12 may be eliminated.
- the second high dielectric constant material 14 shown in FIGS. 11 and 21 has a shape raised from the flat surface of the substrate 13 to the user side.
- the second high dielectric constant material 14 is formed with a concave portion in the substrate 13 and the second high dielectric constant material is formed in the concave portion. 14 may be embedded.
- the second high dielectric constant material 14 is provided in a thin film so that the user cannot recognize that it is raised, and the second high dielectric constant material 14 forms a flat surface that is substantially the same as the design surface 11. May be.
- the low dielectric constant material 17 shown in FIGS. 12, 16, and 25 is disposed over the entire thickness of the substrate 13, but on the surface of the operation plate 10 on the side on which the design surface 11 is formed.
- a low dielectric constant material 17 may be disposed so as not to be exposed.
- the third high dielectric constant materials 15 and 16 and the low dielectric constant material 17 are exposed on the back surface of the substrate 13 and are in contact with the adhesive 30 or the film material 21.
- the third high dielectric constant materials 15 and 16 and the low dielectric constant material 17 may be arranged so as not to be exposed on the back surface of the substrate 13.
- the electrode plate 20 is applied to the operation plate 10, but the electrode plate 20 may be attached to the operation plate 10 with an adhesive, or the substrate 13, the electrode plate 20,
- the operation plate 10 may be formed by integrally performing multicolor molding with resin.
- the user's fingertip F is operated by contacting the operation surfaces 11a and 11b, and the fingertip F is used as the operating body.
- the operation member other than the human body may be used as the operation body.
- the present invention is applied to a capacitive switch provided with a plurality of operation surfaces 11a and 11b.
- the present invention is applied to a capacitive switch provided with one operation surface. May be.
- the signal intensity corresponding to the capacitance is represented by a voltage value, but the present invention is not limited to representing the magnitude of the capacitance by the voltage value.
- a circuit that repeatedly charges and discharges a virtual capacitor formed by the electrode plate 20 may be provided, the number of discharges may be counted, and the capacitance may be represented by the count value.
- the low dielectric constant material 17 may be eliminated. Further, both of the plurality of second high dielectric constant materials 15 and 16 may be arranged over the entire thickness direction of the substrate 13, or both of them may be arranged so as not to be exposed on the design surface 11. Also good.
- the electrode plate 20 is applied to the film material 21 and the film material 21 is attached to the operation plate 10.
- the electrode plate 20 is attached to the operation plate 10 via the film material 21.
- the electrode plate 20 may be configured to be directly attached to the operation plate 10.
- the electrode plate 20 may be vapor-deposited on the back surface 12 of the substrate 13, the electrode plate 20 may be attached to the substrate 13 with an adhesive, or the substrate 11 and the electrode plate 20 may be integrated with resin in multiple colors.
- the operation plate 10 may be formed by molding.
- the wiring 55 is a conductor
- the electrode plate 54 is formed of a material having a lower dielectric constant than the wiring 55.
- the electrode plate 54 may also be formed of a conductor.
- the electrode plate 54 and the wiring 55 may be formed of the same material to improve the workability of multicolor molding. .
- the operation surfaces 11a and 11b are configured to transmit light, but the structure of the transmitted light may be abolished and the electrode plate 54 may be formed of a material that does not have translucency.
- the high dielectric constant material 60 is disposed in a range covering a part of the electrode plate 54, but may be disposed in a range covering the entire surface.
- the high dielectric constant material 60 has the extending portion 60 p, and the outer peripheral end portion 60 a of the high dielectric constant material 60 is located outside the outer peripheral end surface 54 b of the electrode plate 54.
- the outer peripheral end 60a may be positioned on the outer peripheral end surface 54b or may be positioned on the inner side of the outer peripheral end surface 54b by using the high dielectric constant material 60 that does not have the extending portion 60p.
Landscapes
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/780,991 US9608629B2 (en) | 2013-04-01 | 2014-03-17 | Use of relative permittivity in different materials to enhance capacitive switch sensitivity |
CN201480019807.8A CN105074863B (zh) | 2013-04-01 | 2014-03-17 | 静电电容式开关 |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013076201A JP6098305B2 (ja) | 2013-04-01 | 2013-04-01 | 静電容量式スイッチ |
JP2013-076201 | 2013-04-01 | ||
JP2013-076203 | 2013-04-01 | ||
JP2013-076200 | 2013-04-01 | ||
JP2013-076202 | 2013-04-01 | ||
JP2013076200 | 2013-04-01 | ||
JP2013076203A JP6040841B2 (ja) | 2013-04-01 | 2013-04-01 | 静電容量式スイッチ |
JP2013076202A JP6044423B2 (ja) | 2013-04-01 | 2013-04-01 | 静電容量式スイッチ |
JP2013-257240 | 2013-12-12 | ||
JP2013257240A JP6040925B2 (ja) | 2013-04-01 | 2013-12-12 | 静電容量式スイッチ |
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WO2014162668A1 true WO2014162668A1 (fr) | 2014-10-09 |
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PCT/JP2014/001488 WO2014162668A1 (fr) | 2013-04-01 | 2014-03-17 | Commutateur de type à capacitance |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02312123A (ja) * | 1989-05-26 | 1990-12-27 | Matsushita Electric Ind Co Ltd | ガラスタッチパネル |
JPH03225719A (ja) * | 1990-01-29 | 1991-10-04 | Matsushita Electric Works Ltd | 非接触スイッチ |
JP2005317422A (ja) * | 2004-04-30 | 2005-11-10 | Pentel Corp | 静電容量型スイッチ装置 |
JP2007242571A (ja) * | 2006-03-13 | 2007-09-20 | Fujikura Ltd | 静電容量式スイッチ |
WO2012058841A1 (fr) * | 2010-11-04 | 2012-05-10 | 江苏惠通集团有限责任公司 | Procédé d'évaluation de boutons tactiles de type capacitif |
-
2014
- 2014-03-17 WO PCT/JP2014/001488 patent/WO2014162668A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02312123A (ja) * | 1989-05-26 | 1990-12-27 | Matsushita Electric Ind Co Ltd | ガラスタッチパネル |
JPH03225719A (ja) * | 1990-01-29 | 1991-10-04 | Matsushita Electric Works Ltd | 非接触スイッチ |
JP2005317422A (ja) * | 2004-04-30 | 2005-11-10 | Pentel Corp | 静電容量型スイッチ装置 |
JP2007242571A (ja) * | 2006-03-13 | 2007-09-20 | Fujikura Ltd | 静電容量式スイッチ |
WO2012058841A1 (fr) * | 2010-11-04 | 2012-05-10 | 江苏惠通集团有限责任公司 | Procédé d'évaluation de boutons tactiles de type capacitif |
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