WO2014157051A1 - Method for producing pattern structure - Google Patents

Abstract

This embodiment of a method for producing a pattern structure forms a lift-off material (12) on a substrate (10) using a coating device (20) having a brush (34). Next, a functional film (14) is formed on the substrate (10) and the lift-off material (12) by means of an atomic layer deposition method. Next, a pattern (14a) is formed from the functional film (14) on the substrate (10) by means of eliminating the lift-off material (12) by means of a lift-off method.

Description

Method for manufacturing pattern structure

The present invention relates to a method for manufacturing a pattern structure.

In International Publication No. 2012/161051, after a lift-off material is formed on a substrate by an inkjet method, a functional film is formed on the lift-off material and the substrate by an atomic layer deposition method, and a pattern is formed from the functional film by a lift-off method. A method of forming is described.

In the above method, since the lift-off material is formed on the substrate by a non-contact ink jet method, the amount of application of the lift-off material is suppressed compared to the case of using a normal dispenser. Since the amount of the coating is relatively small, a portion that cannot be concealed easily occurs. In addition, there is a burden of introducing an inkjet printer, and it is necessary to design the ink so that the ink is suitably ejected from the inkjet printer.

One embodiment of the present invention is capable of relatively reducing the amount of lift-off material applied as compared with a dispenser method, and is a simple facility that does not have a capital investment burden as in the ink jet method, and is an ink jet method. An object of the present invention is to provide a method of manufacturing a pattern structure that can increase the thickness uniformity of the lift-off material without requiring such a complicated ink design.

The pattern structure manufacturing method according to one aspect of the present invention includes a step of forming a lift-off material on a base material using a coating apparatus having a contact-type coating portion, and an atomic layer on the base material and the lift-off material. Forming a functional film by a deposition method, and forming a pattern from the functional film on the substrate by removing the lift-off material by a lift-off method.

In this method, since a coating apparatus having a contact-type coating unit is used, the amount of lift-off material applied on the substrate can be relatively reduced, and the thickness uniformity of the lift-off material can be increased. Can do.

The coating device may be deformable when the contact-type coating unit contacts the substrate.

In this case, the pressure applied to the base material from the contact-type coating portion is reduced by the contact-type coating portion contacting the base material and the coating device being deformed. Therefore, the damage which a contact-type application part gives to a base material can be made small.

The contact-type application unit may include a brush.

In this case, damage to the base material by the contact-type application part can be further reduced. Further, the application area becomes variable.

The lift-off material may be formed by applying an ink containing a resin and a solvent on the substrate and then removing the solvent.

The base material may have a convex portion, and the lift-off material may be formed on the convex portion.

The base material may be a polymer film.

In the low temperature process, a polymer film can be used. As a result, various devices and flexible printed wiring boards (FPC) can be manufactured at low cost.

The lift-off material may include a solvent-soluble material.

In this case, the lift-off material can be easily removed with a solvent.

After forming the pattern, the process may return to the step of forming the lift-off material.

Thereby, a plurality of patterns can be laminated on the substrate by repeating pattern formation.

According to an embodiment of the present invention, it is possible to provide a method for manufacturing a pattern structure that can reduce the coating amount of the lift-off material and can increase the uniformity of the thickness of the lift-off material.

It is a figure which shows typically each process of the manufacturing method of the pattern structure concerning an embodiment. It is a figure which shows typically an example of the coating device which has a contact-type application part. FIG. 3 is a cross-sectional view of the coating apparatus along the line III-III in FIG. 2. It is a figure which shows typically the applicator of the coating device of FIG. FIG. 5 is a cross-sectional view of the applicator along the line VV in FIG. 4. It is a figure which shows typically the holder of the coating device of FIG. FIG. 7 is a cross-sectional view of the holder along the line VII-VII in FIG. 6. It is a figure which shows typically the apply | coating apparatus of FIG. 2 which deform | transformed. It is a figure which shows typically the other example of the coating device which has a contact-type application part. It is a figure which shows typically the apply | coating apparatus of FIG. 9 which deform | transformed. It is a figure which shows typically the other example of the coating device which has a contact-type application part. FIG. 12 is a cross-sectional view of the coating apparatus along the line XII-XII in FIG. 11. It is a figure which shows typically the applicator of the coating device of FIG. FIG. 14 is a cross-sectional view of the applicator along the line XIV-XIV in FIG. 13. It is a figure which shows typically the apply | coating apparatus of FIG. 11 which deform | transformed. It is a figure which shows typically the other example of the coating device which has a contact-type application part. It is a figure which shows typically the apply | coating apparatus of FIG. 16 which deform | transformed. It is a figure which shows typically the other example of the coating device which has a contact-type application part. It is a figure which shows typically the apply | coating apparatus of FIG. 18 which deform | transformed. It is a figure which shows typically the other example of an applicator. FIG. 22 is a cross-sectional view of the applicator along the XXI-XXI line in FIG. 20. It is a figure which shows a part of applicator of FIG. 20 typically. It is a figure which shows typically the other example of the coating device which has a contact-type application part. FIG. 24 is a cross-sectional view of the coating apparatus along the line XXIV-XXIV in FIG. 23. It is a figure which shows typically the applicator of the coating device of FIG. FIG. 26 is a cross-sectional view of the applicator along the line XXVI-XXVI in FIG. 25. It is a figure which shows typically the other example of the coating device which has a contact-type application part. It is sectional drawing of the coating device along the XXVIII-XXVIII line of FIG. It is a figure which shows typically the coating device of FIG. 27 which decomposed | disassembled. It is a figure which shows typically the example of the shape of a contact-type application part.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are used for the same or equivalent elements, and redundant descriptions are omitted.

FIG. 1 is a diagram schematically showing each step of the method for manufacturing a pattern structure according to the embodiment. The manufacturing method of the pattern structure according to the present embodiment is performed as follows, for example.

(Lift-off material formation process)
First, as shown in FIG. 1A, a lift-off material 12 is formed on a base material using a coating apparatus 20 having a brush 34 as a contact-type coating unit. The coating device 20 is, for example, a dispenser device. The applicator 20 may include an applicator 30 having a brush 34 and a holder 40 into which the applicator 30 is fitted. The applicator 30 is, for example, a pen body. The detailed structure of the coating apparatus 20 will be described later.

The base material 10 may have the convex part 10a. The lift-off material 12 may be formed on the convex portion 10a. The convex portion 10 a extends in the first direction Y along the surface 10 b of the base material 10. The lift-off material 12 may be formed to extend in the second direction X that intersects the first direction Y along the surface 10 b of the substrate 10. The first direction Y may be orthogonal to the second direction X. The cross-sectional shape of the lift-off material 12 in the plane perpendicular to the second direction X is, for example, a rectangle, but the cross-sectional shape is not limited to this. The cross-sectional shape of the convex portion 10a on the surface perpendicular to the first direction Y is, for example, a rectangle, but the cross-sectional shape is not limited to this. The convex portion 10a may be integrated with the base material 10, or may be a separate body. When the width of the protrusion 10a is L and the height is h, h / L may be 100 or less, or 10 or less. When the distance between adjacent convex portions 10a is W, W / h may be 100 or less, or 10 or less.

The base material 10 may be, for example, a glass substrate, a silicon substrate, a polymer film, a flexible base material, or a combination thereof. In the low temperature process, a polymer film can be used as the substrate 10. As a result, for example, a flexible printed circuit board (FPC) can be manufactured at low cost. The base material 10 may be a thermosetting film such as a polyimide film, a thermoplastic resin film such as a polypropylene film, or a transparent polyester base material.

The lift-off material 12 may include a material soluble in a solvent. In this case, the lift-off material 12 can be easily removed with a solvent in a pattern forming step (see FIG. 1C) described later.

Examples of the solvent include water and organic solvents. The organic solvent may be a water-soluble organic solvent or an organic solvent compatible with the water-soluble organic solvent. The solvent may be, for example, a mixture of water and an organic solvent that is infinitely or partially soluble in water. Alternatively, the solvent may be an organic solvent insoluble in water or a mixture of two or more. Examples of the organic solvent include alcohols, glycols, polyhydric alcohols, ketones, pyrrolidones, glycol ethers, glycol diethers, alkylene glycols, alkyl ethers, and mixed solvents thereof. The organic solvent may be, for example, alcohols, polyhydric alcohols, glycol ethers, hydrocarbons and the like. Examples of alcohols include ethanol, n-propanol, isopropanol, n-butanol, isobutanol, tert-butyl alcohol, 1-pentanol, isoamyl alcohol, sec-amyl alcohol, 3-pentanol, tert-amyl alcohol, n-hexanol, methyl amyl alcohol, 2-ethylbutanol, n-heptanol, 2-heptanol, 3-heptanol, n-octanol, 2-octanol, 2-ethylhexanol, 3,5,5-trimethylhexanol, nonanol, n -Decanol, undecanol, n-decanol, trimethylnonyl alcohol, tetradecanol, heptadecanol, cyclohexanol, 2-methylcyclohexanol, benzyl alcohol, 2-phenoxyethanol, etc. It is. Examples of polyhydric alcohols include ethylene glycol, diethylene glycol, 3-methyl-1,3-butanediol, triethylene glycol, propylene glycol, dipropylene glycol, 1,3-propanediol, 1,3-butanediol, Examples include 1,5-pentanediol, hexylene glycol, octylene glycol, glycerin and the like. Examples of glycol ethers include methyl isopropyl ether, ethyl ether, ethyl propyl ether, ethyl butyl ether, isopropyl ether, butyl ether, hexyl ether, 2-ethylhexyl ether, ethylene glycol monohexyl ether, ethylene glycol monophenyl ether, ethylene glycol mono -2-Ethylbutyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, 3- Tyl-3-methoxy-1-butanol, 3-methoxy-1-butanol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol phenyl ether, propylene glycol tertiary butyl ether , Dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monobutyl ether, tetrapropylene glycol monobutyl ether, and the like. Examples of hydrocarbons include cyclohexane, xylene, methyl isobutyl ketone, methyl ethyl ketone, and the like.

The lift-off material 12 includes, for example, a resin. Examples of the resin include materials that are soluble in the solvent. Examples of the resin include ketone resin, sulfoamide resin, maleic acid resin, terpene resin, terpene phenol resin, ester gum, xylene resin, alkyd resin, phenol resin, rosin, polyvinyl pyrrolidone, polyvinyl butyral, polyvinyl alcohol, acrylic resin, One kind or two or more kinds of natural and synthetic resins such as melamine resin and cellulose resin can be used. Examples of the resin include cellulose (carboxyl cellulose, hydroxyethyl cellulose), synthetic polymer (sodium polyacrylate, polyacrylamide, polyvinyl alcohol, polyethylene imine, polyethylene oxide, polyvinyl pyrrolidone, polyvinyl acetal, vinyl acetate-vinyl pyrrolidone copolymer). Etc. Among these, polyvinyl acetal and vinyl acetate-vinyl pyrrolidone copolymer are particularly preferable.

The lift-off material 12 may include a non-curing resin. In this case, the lift-off material 12 can be formed at a low temperature simply by volatilizing the solvent without curing. The glass transition temperature (Tg) of the resin is, for example, 100 ° C. or less. In this case, by heating the lift-off material 12 to a temperature equal to or higher than the glass transition temperature (Tg) of the resin, the stress on the surface of the lift-off material 12 is relieved and the surface shape changes. As a result, lift-off is further facilitated.

The lift-off material 12 may include a color material for identifying the coating film. Examples of the color material include dyes, pigment dispersions, and materials that emit light by UV irradiation or the like (for example, fluorescent materials and phosphorescent materials).

The lift-off material 12 may include any other material. The lift-off material 12 may include, for example, a rust preventive, a preservative, a pH adjuster, a surfactant, a moisturizer, a saccharide, a natural polysaccharide, and the like. Examples of the rust preventive include benzotriazole, tolyltriazole, dicyclohexylammonium nitrite and the like. Examples of the preservative include phenol, sodium omadin, sodium benzoate, and benzimidazole compounds. Examples of the pH adjuster include triethanolamine and aminomethylpropanol. Examples of the surfactant include fluorine-based, acetylene glycol-based, polyoxyethylene alkyl ether, polyoxyethylene alkyl ester, and sucrose ester. Examples of the humectant include urea. Examples of the saccharide include monosaccharides, disaccharides, oligosaccharides, dextrin, and starch degradation products. Examples of natural polysaccharides include xanthan gum, succinoglycan, welan gum, and carrageenan.

The lift-off material 12 may be made of a material that does not require a curing process. The height of the lift-off material 12 from the surface 10b of the base material 10 (the thickness of the lift-off material 12) is, for example, 1 to 500 μm.

The lift-off material 12 is formed by, for example, applying an ink containing a resin and a solvent on the substrate 10 and then removing the solvent by drying. The ink may contain an optional additive. When removing the ink solvent, it is not always necessary to remove all the solvent. That is, the solvent may remain in the lift-off material 12. Examples of the solvent removal method include natural drying of a volatile solvent, hot air drying, and the like.

The viscosity of the ink is a viscosity at which the ink is suitably ejected from the coating device 20, for example. The viscosity of the ink is, for example, 1 to 1000 mPa · s at 25 ° C. and a shear rate of 3.8 s ⁻¹ . Even an ink having a high viscosity exceeding 1000 mPa · s or an ink having thixotropy can be heated or pressurized to eject the ink.

(Film formation process)
Next, as shown in FIG. 1B, a functional film 14 is formed on the base material 10 and the lift-off material 12 by an atomic layer deposition method. For example, first, the first raw material of the functional film 14 is supplied onto the base material 10 and the lift-off material 12, and then the purge gas is supplied. Thereafter, a second raw material such as an oxidant is supplied onto the base material 10 and the lift-off material 12, and then a purge gas is supplied. By repeating such a cycle, the functional film 14 is formed.

When the atomic layer deposition method is used, it is possible to improve the film thickness uniformity of the functional film 14 over a wide area, and to form the functional film 14 having a stoichiometric composition having a three-dimensional conformality. In addition, the film thickness of the functional film 14 can be controlled with high accuracy. Furthermore, even when dust particles are present, the functional film 14 is formed in a place that is in the shadow of the dust particles, so that it is relatively difficult to be affected by the dust particles.

The functional film 14 may be, for example, a conductor film, a semiconductor film, an insulating film, an inorganic film, an organic film, a nanolaminate film, a composite oxide film, a metal oxide film, or a combination thereof. When the functional film 14 contains a metal, examples of such a metal include aluminum, copper, hafnium, ruthenium, tantalum, titanium, tungsten, zinc, and zirconium. As the first raw material of the functional film 14, for example, TMA (AL (CH ₃ ) ₃ ), TDMAH (Hf [N (CH ₃ ) ₂ ] ₄ ), Ru (C ₅ H ₄ —C ₂ H ₅ ) ₂ , ( CH ₃ ) ₃ CN = Ta (N (C ₂ H ₅ ) ₂ ) ₃ , TDMAT (Ti [N (CH ₃ ) ₂ ] ₄ ), ((CH ₃ ) ₃ CN) ₂ W (N (CH ₃ ) ₂ ) ₂ , Zn (C ₂ H ₅ ) ₂ , TDMAZ (Zr [N (CH ₃ ) ₂ ] ₄ ), or the like can be used. The functional film 14 may be an ITO film. The functional film 14 may be a passivation film made of, for example, SiO ₂ or Al ₂ O ₃ . The functional film 14 may be a semiconductor film made of, for example, a ZnO semiconductor or an IGZO semiconductor.

(Pattern formation process)
Next, as shown in FIG. 1C, a pattern 14 a is formed from the functional film 14 on the substrate 10 by removing the lift-off material 12 by a lift-off method. Thereby, the pattern structure 100 is manufactured. The lift-off material 12 may be removed using a solvent. Scratches or holes may be formed on the surface of the functional film 14 before using the solvent. Examples of the method of forming scratches or holes on the surface of the functional film 14 include at least one of laser, ultrasonic wave, water jet, dry ice blast, and the difference in thermal expansion coefficient between the lift-off material 12 and the substrate 10. It is done. When using the difference in thermal expansion coefficient between the lift-off material 12 and the substrate 10, the lift-off material 12 can be removed by solubilizing the lift-off material 12 with heat or light (for example, ultraviolet rays). You may return to the said lift-off material formation process after forming the pattern 14a. Thereby, the several pattern 14a can be laminated | stacked on the base material 10 by repeating pattern formation. The plurality of patterns 14a may be different from each other. The pattern 14a may be a wiring pattern.

The pattern structure 100 includes, for example, an integrated circuit, a display, a solar cell, an imaging device, a sensor, a semiconductor device, an electronic device, an optical device, an organic EL element, an inorganic EL element, a thin film transistor (TFT), a shift register, a printed wiring board, A flexible printed circuit board (FPC) or a combination thereof may be used. In the case of FPC, a transparent polyester base material is used as the base material 10, and a bit line circuit wiring is used as the pattern 14a. For example, a word line circuit wiring formed by an inkjet method, a screen printing method, or the like can be used. In the case of a TFT, the pattern structure 100 may further include a shift register, and the base material 10 may have a large area with a width of 300 mm or more and a length of 2000 mm or more. In the case of an organic EL element, an organic EL layer can be used as the pattern 14a.

In the pattern structure manufacturing method according to the present embodiment, since the coating apparatus 20 having the brush 34 is used, the amount of the lift-off material 12 applied on the base material 10 can be relatively reduced, The uniformity of the thickness of the lift-off material 12 can be improved. As a result, the lift-off material 12 having a thin and uniform thickness can be formed. Furthermore, the position where the lift-off material 12 is formed can be controlled with high accuracy.

In addition, in the atomic layer deposition method, the functional film 14 can be formed at a lower temperature (for example, room temperature to 400 ° C.) than a normal film formation method. In the lift-off method, the pattern 14a can be formed at a lower temperature and at a lower cost than in a normal photolithography method. Therefore, the base material 10 (for example, a polymer film) that is easily damaged by heat can be used. Further, the pattern structure 100 can be manufactured by a lift-off method that is difficult to apply by a normal atomic layer deposition method.

Furthermore, in the atomic layer deposition method, since the process can be performed at a low pressure, the continuous process with the application of the lift-off material and the lift-off method becomes possible. In addition, a so-called roll-to-roll process in which the substrate 10 is wound to form a roll becomes possible.

FIG. 2 is a diagram schematically showing an example of a coating apparatus having a contact-type coating unit. FIG. 3 is a cross-sectional view of the coating apparatus along the line III-III in FIG. The applicator 20 shown in FIGS. 2 and 3 includes an applicator 30 shown in FIGS. 4 and 5 and a holder 40 shown in FIGS. 6 and 7.

The applicator 30 includes a shaft body 31, a storage body 32, a relay core 33, a brush 34, a holder member 35, and a tail plug 36. The shaft body 31 has, for example, a cylindrical shape. A storage body 32 such as a batting is accommodated in the shaft body 31. The storage body 32 can store ink in the fiber bundle by capillary action. Openings are formed in the front and rear portions of the shaft body 31. The rear portion of the relay core 33 is inserted into the opening formed in the front portion of the shaft body 31. An opening formed in the rear portion of the shaft body 31 is sealed by a tail plug 36. The front part of the relay core 33 is connected to the rear part of the brush 34. The rear part of the brush 34 is held by a holder member 35 connected to the relay core 33. The front portion of the brush 34 projects outward from the holder member 35. The ink in the storage body 32 is supplied onto the substrate 10 through the relay core 33 and the brush 34.

The brush 34 includes a large number of fibers. The fibers of the brush 34 are welded to the ring-shaped member 134 at the rear part of the brush 34. Examples of the brush 34 include a round brush, a flat brush, and a brush.

Examples of the fibers of the brush 34 include synthetic resin fibers and animal hair. Examples of the synthetic resin fiber material include polyester resins such as polybutylene terephthalate, polyethylene terephthalate, polymethylene terephthalate, and polybutylene naphthalate, polyolefin resins such as polyethylene and polypropylene, nylon 6, nylon 610, and nylon 612. Examples include polyamide resins, acrylic resins, polyurethane resins, polyacetal resins, polycarbonate resins, polyether resins, polyphenylene resins, and polyvinyl resins. Examples of animal hair include horse, weasel, raccoon dog, and squirrel hairs.

The fibers of the brush 34 have, for example, a straight shape with a constant thickness, a tapered shape whose cross-sectional area decreases toward the end, a curly shape (crimp) shape, and the like. The cross section of the fiber of the brush 34 may be circular or polygonal. The fibers of the brush 34 may have a modified cross-sectional shape such as a triangle, a star, or a clover. In this case, many minute voids can be formed between the fibers.

The diameter of the fiber of the brush 34 is, for example, 0.05 to 0.3 mm. The length of the fibers of the brush 34 is, for example, 5 to 100 mm.

The holder 40 includes a holder main body 41, a fixing member 42, and a lid 43. The applicator 30 is inserted into the holder main body 41. The holder main body 41 has, for example, a cylindrical shape that is coaxial with the shaft body 31. Openings are formed in the front and rear portions of the holder body 41. A fixing member 42 for fixing the applicator 30 is connected to the opening formed in the front portion of the holder main body 41. The opening formed in the rear part of the holder body 41 is sealed with a lid 43.

FIG. 8 is a diagram schematically showing the deformed coating apparatus of FIG. As shown in FIG. 8, the brush 34 can be deformed by contacting the substrate 10. Therefore, the pressure applied to the base material 10 from the brush 34 becomes small. Therefore, the damage which the brush 34 gives to the base material 10 can be made small. For example, the ink application area can be changed by changing the shape of the brush 34, the force with which the brush 34 is pressed against the substrate 10, and the like. Furthermore, even if a positional deviation occurs in the coating apparatus 20 in the normal direction of the surface 10b of the substrate 10, the positional deviation can be corrected by the deformation of the brush 34.

FIG. 9 is a diagram schematically illustrating another example of a coating apparatus having a contact-type coating unit. The applicator 20a shown in FIG. 9 includes an applicator 30a and a holder 40. The applicator 30a has a structure similar to that of the applicator 30 except that it includes a pen core 34a instead of the brush 34 and a front shaft 32a instead of the holder member 35. The pen core 34a is held by the tip shaft 32a. The pen core 34a is an elastic member having pores, for example. Examples of the material of the elastic member include elastomer, rubber, sponge, and the like. The ink in the applicator 30a is supplied onto the substrate 10 through the pen core 34a.

FIG. 10 is a diagram schematically showing the deformed coating apparatus of FIG. As shown in FIG. 10, the pen core 34 a can be elastically deformed by contacting the base material 10. Therefore, the pressure applied to the base material 10 from the pen core 34a becomes small. Therefore, damage to the base material 10 by the pen core 34a can be reduced. In the coating apparatus 20a, the same effect as the coating apparatus 20 is obtained.

FIG. 11 is a diagram schematically illustrating another example of a coating apparatus having a contact-type coating unit. 12 is a cross-sectional view of the coating apparatus along the line XII-XII in FIG. The applicator 20b shown in FIGS. 11 and 12 includes an applicator 30a shown in FIGS. The applicator 30a is a so-called valve-type applicator.

The applicator 30a includes a main body rear shaft 31a, a front shaft 32a, a valve stem 33a, a pen core 34a as a contact-type application unit, a valve seat 35a, a spring 36a, a spring receiver 37a, and a sponge 38a. Is provided. The applicator 30a does not include a relay core. The rear shaft 31a has a hollow shape, for example. An opening is formed in the front part of the rear shaft 31a, but no opening is formed in the rear part. Ink can be stored in the rear shaft 31a. The front portion of the rear shaft 31a is fitted in the rear portion of the front shaft 32a. The front shaft 32a has a hollow shape, for example. The rear portion of the valve rod 33a is inserted into the opening formed in the front portion of the rear shaft 31a. The front part of the valve rod 33a is in contact with the rear part of the pen core 34a. The front portion of the pen core 34a protrudes outward from the front portion of the tip shaft 32a. In the front shaft 32a, a sponge 38a is disposed around the front part of the valve stem 33a and the rear part of the pen core 34a. A spring 36a is disposed around the valve rod 33a, and a spring receiver 37a is disposed at the rear end of the spring 36a. A large diameter portion is formed at the center of the valve stem 33a. The front end of the spring 36a is in contact with the large diameter portion of the valve rod 33a. The spring 36a can be expanded and contracted between the large diameter portion of the valve rod 33a and the spring receiver 37a. The valve seat 35a holds the large diameter portion of the valve rod 33a and is connected to the front shaft 32a. As the spring 36a expands and contracts back and forth, the pen core 34a also expands and contracts back and forth.

The pen core 34a may be made of, for example, a felt, a fiber bundle, a sintered body, or a capillary. A felt is obtained by compressing a fiber and then processing the resin. A fiber bundle is obtained by bundling fibers together in a certain direction. The sintered body is obtained by bonding and sintering plastic powder. The capillary tube is obtained by forming a rod shape while providing a slit in the resin.

The pen core 34a is, for example, a general resin such as a polyethylene resin, a polyester resin, a polyacetal resin, a polyamide resin, an acrylic resin, a polyurethane resin, a polyolefin resin, a polyether resin, or a polyphenylene resin. A resin material or an elastomer molded material may be used. For example, the pen core 34a may be obtained by cutting or polishing a fiber core in which fiber bundles such as fibers of various resin materials, vegetable fibers, and animal fibers are fixed by resin processing or the like. Furthermore, a porous body having a capillary force composed of felt, sponge, or a sintered body such as a resin particle sintered body or a resin fiber sintered body may be appropriately processed and used. The pen core 34a may be a brush-like one.

FIG. 15 is a diagram schematically showing the deformed coating apparatus of FIG. As shown in FIG. 15, the pen core 34 a is retracted into the front shaft 32 a by contacting the base material 10. That is, the pen core 34 a is displaced in the normal direction of the surface 10 b of the substrate 10 by contacting the substrate 10. Therefore, the applicator 30 a can be deformed by contacting the base material 10. In the coating apparatus 20b, the same effect as the coating apparatus 20a is obtained.

FIG. 16 is a diagram schematically illustrating another example of a coating apparatus having a contact-type coating unit. The applicator 20c shown in FIG. 16 includes an applicator 30b and a holder 40a. The applicator 30b has a structure similar to that of the applicator 30a except that the applicator 30b has no mechanism relating to the spring 36a.

FIG. 17 is a diagram schematically showing the deformed coating apparatus of FIG. In the applicator 30b, the applicator 30b is not deformed even if the pen core 34a contacts the base material 10. The holder 40a has the same structure as the holder 40 except that it further includes a mechanism (for example, a spring) that displaces the applicator 30b. In the coating apparatus 20c, the pen tool 34b is retracted into the holder 40a when the pen core 34a contacts the base material 10. That is, the applicator 30 b is displaced in the normal direction of the surface 10 b of the substrate 10 by contacting the substrate 10. Therefore, the coating device 20 c can be deformed by contacting the base material 10. In the coating apparatus 20c, the same effect as the coating apparatus 20b is obtained.

FIG. 18 is a diagram schematically illustrating another example of a coating apparatus having a contact-type coating unit. The applicator 20d shown in FIG. 18 includes an applicator 30b and a holder 40b. The holder 40b has a structure similar to that of the holder 40 except that the holder 40b further includes a telescopic part 44 such as a bellows part.

FIG. 19 is a diagram schematically showing the deformed coating apparatus of FIG. In the applicator 20d, the applicator 30b is not deformed. When the pen core 34a contacts the base material 10, the holder 40b is deformed. Therefore, the coating device 20 d can be deformed by contacting the base material 10. When the pen core 34a contacts the base material 10, members other than the holder 40b in the coating apparatus 20d may be deformable. In the coating apparatus 20d, the same effect as the coating apparatus 20c is obtained.

FIG. 20 is a diagram schematically showing another example of the applicator. FIG. 21 is a cross-sectional view of the applicator along the line XXI-XXI in FIG. FIG. 22 is a diagram schematically showing a part of the applicator of FIG. An applicator 30c shown in FIGS. 20 and 21 includes a shaft body 31b, a storage body (filling) 32b, a relay core 33b, a pen tip 34b as a contact-type application unit, a holder member 35, and a tail plug 36b. With. The shaft body 31b has a cylindrical shape, for example. A storage body 32b such as a batting is accommodated in the shaft body 31b. The storage body 32b can store ink in the fiber bundle by capillary action. Openings are formed in the front and rear portions of the shaft body 31b. The rear portion of the relay core 33b is inserted into the opening formed in the front portion of the shaft body 31b. The opening formed in the rear part of the shaft body 31b is sealed with a tail plug 36b. The front portion of the relay core 33b is connected to the pen tip 34b. The front portion of the relay core 33b and the pen tip 34b are held by a holder member 35b. The ink in the storage body 32b is supplied onto the substrate 10 through the relay core 33b and the pen tip 34b. Examples of the material of the pen tip 34b include the same materials as the material of the pen core 34a.

The applicator 30c may be used instead of the applicators 30, 30a, 30b. Since the applicator 30c includes the pen tip 34b as a contact-type applicator, the application amount of the lift-off material 12 applied on the substrate 10 can be relatively reduced, and the thickness of the lift-off material 12 can be reduced. Uniformity can be improved. Furthermore, the position where the lift-off material 12 is formed can be controlled with high accuracy.

FIG. 23 is a diagram schematically illustrating another example of a coating apparatus having a contact-type coating unit. 24 is a cross-sectional view of the coating apparatus along the line XXIV-XXIV in FIG. The applicator 20e shown in FIGS. 23 and 24 includes an applicator 30d shown in FIGS. 25 and 26 and a holder 40.

The applicator 30d includes a shaft body 31d, a joint 32d, a relay core 33d, a pen tip 34d as a contact-type applicator, and a collector member (ink reservoir) 35d. The shaft body 31d has a hollow shape, for example. An opening is formed in the front part of the shaft body 31d, but no opening is formed in the rear part. Ink can be stored in the shaft body 31d. A joint 32d is connected to the front portion of the shaft body 31d. The joint 32d has a hollow shape, for example. A relay core 33d and a collector member 35d are inserted into the opening formed in the front portion of the shaft body 31d. The collector member 35d is disposed around the relay core 33d. The collector member 35d suppresses ink leakage due to pressurization or decompression of air in the shaft body 31d. The front portion of the relay core 33d is in contact with the pen tip 34d. Ink is supplied onto the substrate 10 from the collector member 35d through the relay core 33d and the pen tip 34d.

The applicator 30d may not include the relay core 33d. In that case, the rear part of the pen tip 34d is inserted into the opening formed in the front part of the shaft body 31d. The applicator 30d may be used in place of the applicators 30, 30a, 30b, 30c. In the applicator 30d, the same effect as the applicator 30c is obtained.

FIG. 27 is a diagram schematically illustrating another example of a coating apparatus having a contact-type coating unit. FIG. 28 is a cross-sectional view of the coating apparatus along the line XXVIII-XXVIII in FIG. FIG. 29 is a diagram schematically showing the exploded coating apparatus of FIG. The applicator 20f shown in FIGS. 27 to 29 includes an applicator 30e shown in FIG. 29 (b) and a holder 40c shown in FIG. 29 (a). The applicator 30e is an attachment attached to the holder 40c.

The applicator 30e includes a fixing member 31c, a relay core 33c, a brush 34c, and a holder member 35c. The fixing member 31c is disposed around the relay core 33c and is detachably fixed to the holder 40b. The rear part of the relay core 33c is inserted into the holder 40c. The front part of the relay core 33c is connected to the rear part of the brush 34c. The rear part of the brush 34c is held by a holder member 35c. The holder member 35c is connected to the fixing member 31c.

The holder 40c includes a holder body 41b and a lid body 43b. The holder main body 41b has a cylindrical shape, for example. Openings are formed in the front and rear portions of the holder main body 41b. An applicator 30e is attached to the opening formed in the front portion of the holder body 41b. The opening formed in the rear part of the holder main body 41b is sealed with a lid 43b. A tube 50 communicating with the inside of the holder main body 41b is connected to the lid body 43b. Thereby, the inside of the holder main body 41b can be pressurized or depressurized.

In the application device 20f, the application tool 30e can be easily replaced. Further, in the coating device 20f, the same function and effect as the coating device 20 can be obtained. The brush 34c may be replaced with a pen core 34a, a pen tip 34b, or a pen tip 34d.

FIG. 30 is a diagram schematically showing an example of the shape of the contact-type application part. The contact application unit such as the brush 34, the pen core 34a, the pen tip 34b, the pen tip 34d, or the brush 34c may have any shape. As shown in FIGS. 30 (a) and 30 (e), the contact-type application unit may have a cylindrical main body and a tip having a curved surface. As shown in FIGS. 30B and 30F, the contact-type application unit may have a conical shape. As shown in FIGS. 30C and 30G, the contact-type application unit may have a cylindrical shape, and the circular edge of the tip may be chamfered. As shown in FIGS. 30D and 30H, the contact-type application unit has a rectangular parallelepiped shape, and four sides connecting the four side surfaces may be chamfered.

The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the above embodiments. The components of the coating apparatus described above can be arbitrarily combined with each other.

The application device is not limited to the dispenser device, and may be a printing machine such as a lithographic printing machine, an intaglio printing machine (for example, a gravure printing machine), and a relief printing machine. The contact-type coating unit of the coating apparatus is not limited to a brush, a pen core, or a pen tip, and may be an arbitrary member.

Moreover, the base material 10 does not have the convex part 10a, but may have a flat surface 10b.

DESCRIPTION OF SYMBOLS 10 ... Base material, 10a ... Convex part, 10b ... Surface of base material, 12 ... Lift-off material, 14 ... Functional film, 14a ... Pattern, 20, 20a, 20b, 20c, 20d, 20e, 20f ... Coating apparatus, 34, 34c ... brush (contact type application part), 34a ... pen core (contact type application part), 34b, 34d ... pen tip (contact type application part), 100 ... pattern structure, X ... second direction, Y ... first 1 direction.

Claims (8)

1. Forming a lift-off material on a substrate using a coating apparatus having a contact-type coating unit;
   Forming a functional film on the substrate and the lift-off material by an atomic layer deposition method;
   Forming a pattern from the functional film on the substrate by removing the lift-off material by a lift-off method;
   The manufacturing method of a pattern structure containing this.
2. The manufacturing method of the pattern structure according to claim 1, wherein the coating device is deformable when the contact-type coating unit contacts the substrate.
3. The method for producing a pattern structure according to claim 2, wherein the contact-type application unit includes a brush.
4. The pattern structure according to any one of claims 1 to 3, wherein the lift-off material is formed by applying an ink containing a resin and a solvent onto the substrate and then removing the solvent. Production method.
5. The substrate has a convex portion;
   The pattern structure manufacturing method according to any one of claims 1 to 4, wherein the lift-off material is formed on the convex portion.
6. The method for producing a patterned structure according to any one of claims 1 to 5, wherein the substrate is a polymer film.
7. The method for manufacturing a pattern structure according to any one of claims 1 to 6, wherein the lift-off material includes a material soluble in a solvent.
8. The method for manufacturing a pattern structure according to any one of claims 1 to 7, wherein after the pattern is formed, the process returns to the step of forming the lift-off material.

Images