WO2014147681A1 - Carte garnie, élément de pression et dispositif électronique - Google Patents

Carte garnie, élément de pression et dispositif électronique Download PDF

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Publication number
WO2014147681A1
WO2014147681A1 PCT/JP2013/006163 JP2013006163W WO2014147681A1 WO 2014147681 A1 WO2014147681 A1 WO 2014147681A1 JP 2013006163 W JP2013006163 W JP 2013006163W WO 2014147681 A1 WO2014147681 A1 WO 2014147681A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
leg
pressing member
circuit unit
attached
Prior art date
Application number
PCT/JP2013/006163
Other languages
English (en)
Japanese (ja)
Inventor
圭介 大石
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014147681A1 publication Critical patent/WO2014147681A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a mounting substrate, a pressing member, and an electronic device.
  • the cooling device includes a first heat receiving unit, a second heat receiving unit, a first pressing unit, a second pressing unit, and a fixing member.
  • the first heat receiving unit receives the heat of the first heating element.
  • the second heat receiving part receives the heat of the second heating element.
  • the first pressing unit is a single member that extends along the first heating element and the second heating element, and presses the first heat receiving unit against the first heating element.
  • the second pressing portion presses the second heat receiving portion against the second heating element.
  • the fixing member includes a first fixing portion, an intermediate fixing portion, and a second fixing portion.
  • the first fixing portion is fixed to the substrate on the side opposite to the second pressing portion side when viewed from the first pressing portion.
  • the intermediate fixing part is fixed to the substrate in the middle between the first pressing part and the second pressing part.
  • the second fixing part is fixed to the substrate on the side opposite to the first pressing part side when viewed from the second pressing part.
  • This provides an electronic device in which the structure of the cooling device for cooling the heating element is simplified.
  • the mounting substrate in the present disclosure includes a substrate, a first circuit disposed on the substrate, a second circuit disposed on the substrate, a first body, and a first body provided on the first body.
  • a first heat dissipating member having a leg and having a first fixing portion attached to the substrate by a fixing member at a part of the first leg, and when attached to the substrate, is located above the first circuit.
  • the pressing member mounted on the mounting substrate in the present disclosure is provided on the body disposed above the first circuit and attached to the body when attached to the substrate, and is partially attached to the substrate by a fixing member.
  • a leg having a fixing portion, and when attached to the substrate, an end is disposed above a second circuit different from the first circuit, and the end presses the second circuit toward the substrate And a leg.
  • a second pressing member having a second fixing portion attached to the substrate by the fixing member, and when the second pressing member is attached to the substrate, the second pressing member A second body is disposed above the road, an end of the second leg is disposed above the first circuit, and the end of the second leg presses the first circuit toward the substrate side; 2 pressing members.
  • a mounting substrate in which a plurality of circuits having different thicknesses are held in close positions, a pressing member that presses a circuit disposed in a plurality of adjacent positions having different thicknesses, and a plurality of circuits having different thicknesses are in proximity It is possible to provide an electronic device held at the position.
  • FIG. 1 is an exploded perspective view of the tablet terminal 100.
  • FIG. 2 is a top view showing a state where the back cabinet 101 is removed from the tablet terminal 100.
  • FIG. 3 is a schematic view showing components arranged on the substrate 103 from the side.
  • FIG. 4 is an exploded perspective view in which components arranged on the substrate 103 are disassembled.
  • FIG. 5 is a top view showing a state of the pressing member 108 disposed on the metal plate 121.
  • FIG. 6 is a side view showing the pressing member 108 from the side.
  • FIG. 7 is a top view showing the state of the pressing member 108 disposed on the metal plate 121 and the metal plate 120.
  • FIG. 1 is an exploded perspective view of the tablet terminal 100.
  • FIG. 2 is a top view showing a state where the back cabinet 101 is removed from the tablet terminal 100.
  • FIG. 3 is a schematic view showing components arranged on the substrate 103 from the side.
  • FIG. 4 is an exploded perspective view in which components
  • FIG. 8 is a top view showing the state of the metal plate 121, the pressing member 108 disposed on the metal plate 120, and the pressing member 109.
  • FIG. 9 is a schematic view showing the leg 127 and its periphery from the side.
  • FIG. 10 is a top view showing a partial shape of a pressing member according to another embodiment.
  • FIG. 2 is a top view showing a state where the back cabinet 101 is removed from the tablet terminal 100.
  • FIG. 3 is a schematic view showing components arranged on the substrate 103 from the side.
  • FIG. 4 is an exploded perspective view in which components arranged on the substrate 103 are disassembled.
  • the heat radiating sheet 106 and the heat radiating sheet 107 are heat conductive sheets formed in a sheet shape.
  • the heat dissipating sheet 106 is disposed on and in contact with the CPU 104 in order to conduct heat generated by the CPU 104.
  • the heat dissipating sheet 107 is disposed in contact with the GPU 105 in order to conduct heat generated by the GPU 105.
  • the difference between the height of the stud 112 and the sum of the height of the GPU 105, the heat radiation sheet 107, and the metal plate 120 is that the leg provided on the pressing member 108 and the pressing member 109 is the pressing member 108 and the pressing member 109. It is smaller than the height of warping against the torso. Therefore, when the pressing member 108 and the pressing member 109 are fixed to the substrate 103, the components sandwiched between the pressing member 108 and the substrate 103 by the elastic force of the legs provided on the pressing member 109 are fixed to the substrate 103. Press in 103 direction.
  • the leg 127 includes a leg part 123, a fixing part 124, a leg part 125, and a tip part 126.
  • the leg portion 123 is warped upward with respect to the body 133.
  • the fixing part 124 is a hole for inserting the screw 113.
  • the leg portion 125 warps downward with respect to the fixed portion 124.
  • the distal end portion 126 warps slightly upward with respect to the distal end of the leg portion 125.
  • the pressing member 108 is fixed to the substrate 103 by inserting a screw 113 into the hole at the distal end portion of the leg 128 and the fixing portion 124.
  • the body 133 of the pressing member 108 presses the metal plate 121 toward the substrate 103 by the elastic force of the leg 128 and the leg portion 123. That is, in this state, the body 133 presses components such as the CPU 104 disposed below the metal plate 121 toward the substrate 103.
  • the tip 126 provided at the tip of the leg 127 presses the metal plate 120 toward the substrate 103 by the elastic force of the leg 125. That is, in this state, the tip end portion 126 presses a component such as the GPU 105 disposed below the metal plate 120 toward the substrate 103.
  • the pressing member 109 is further fixed to the substrate 103 by inserting a screw 113 into the hole at the tip of the leg 135 and the fixing portion 130.
  • the body 134 of the pressing member 109 presses the metal plate 120 toward the substrate 103 by the elastic force of the legs 135 and the leg portions 129. That is, in this state, the body 134 presses components such as the GPU 105 disposed below the metal plate 120 toward the substrate 103.
  • the distal end portion 132 presses the metal plate 121 toward the substrate 103 by the elastic force of the leg portion 131.
  • the tip end portion 132 presses a component such as the CPU 104 disposed below the metal plate 121 toward the substrate 103 side.
  • the distal end portion 132 can press the metal plate 121 toward the substrate 103 with a margin.
  • the substrate 103 is an example of a substrate.
  • the configuration including the CPU 104, the heat dissipation sheet 106, and the metal plate 121 is an example of a first circuit unit.
  • the configuration including the GPU 105, the heat dissipation sheet 107, and the metal plate 120 is an example of a second circuit unit.
  • the pressing member 108 is an example of a first pressing member.
  • the pressing member 109 is an example of a second pressing member.
  • the heat pipe 151 is an example of a first heat conducting member.
  • the fan provided in the fan unit 110 is an example of a first fan.
  • the heat pipe 152 is an example of a second heat conducting member.
  • the fan provided in the fan unit 111 is an example of a second fan.
  • the mounting substrate according to the present embodiment includes the substrate 103, the CPU 104, the heat dissipation sheet 106, and the metal plate 121, and the GPU 105, the heat dissipation sheet 107, and the metal plate 120. And a pressing member 108.
  • a configuration including the CPU 104, the heat dissipation sheet 106, and the metal plate 121 is disposed on the substrate 103.
  • a configuration including the GPU 105, the heat dissipation sheet 107, and the metal plate 120 is disposed on the substrate 103.
  • the pressing member 108 includes a body 133 and a leg 127 provided on the body 133, and a fixing portion 124 that is attached to the substrate 103 with a screw 113 at a part of the leg 127.
  • the body 133 is disposed above the configuration including the CPU 104, the heat dissipation sheet 106, and the metal plate 121.
  • the tip end portion 126 of the leg 127 is disposed above part of the leg 127, and the tip end portion 126 of the leg 127 presses the configuration including the GPU 105, the heat dissipation sheet 107, and the metal plate 120 toward the substrate 103.
  • an extension amount X2 is generated in the leg portion 125.
  • the size of the inner diameter of the fixing portion 124 is kept constant. That is, if the tip 126 has been fixed at a specific position on the pressing member 109, when the screw 113 is fastened to the stud 112, the leg 123 or the leg 125 of the leg 127 is bent as a result. become.
  • the tip end portion 126 is not fixed at a specific position on the pressing member 109.
  • the body 133 is disposed above the configuration including the CPU 104, the heat radiating sheet 106, and the metal plate 121, and the GPU 105, the heat radiating sheet 107, and
  • the tip portion 126 of the leg 127 is disposed above a part of the configuration made of the metal plate 120, and the tip portion 126 of the leg 127 only presses the configuration made of the GPU 105, the heat radiation sheet 107, and the metal plate 120 to the substrate 103 side. It is.
  • the mounting board of the present disclosure has a thickness that is smaller than the case where the metal plate 121 and the metal plate 120 are held on the substrate 103 by a pressing member having four legs such as the legs 128. Different CPUs 104 and GPUs 105 can be held in closer positions.
  • the pressing member 108 of the present disclosure can press the configuration including the CPU 104, the heat radiating sheet 106, and the metal plate 121 to the substrate 103 side with the body 133, and the GPU 105, the heat radiating sheet 107, and the The structure which consists of the metal plate 120 can be pressed.
  • the configuration in which only one leg 127 is provided on the pressing member 108 is illustrated.
  • a configuration in which the leg 127 is added to the corner of the pressing member 108 where the leg 127 and the leg 128 are not provided, and the two legs 128 are omitted may be employed.
  • the front ends 126 of the two legs 127 are arranged at the two corners where the legs 128 are omitted.
  • the pressing member that presses the circuit units at both ends among the plurality of circuit units arranged continuously is provided with a leg such as the leg 128 at the end where the circuit does not exist next. It will be.
  • the pressing member 108 has two legs 128. However, it is not necessarily limited to such a configuration.
  • the pressing member 108 may be configured to have another fixing portion other than the two legs 128.
  • the leg 127 is exemplified as the leg of the pressing member 108.
  • the leg may be configured as shown in FIG.
  • FIG. 10 is a schematic view showing another embodiment of the leg.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne une carte garnie comportant un substrat, une première unité de circuit posée par-dessus ledit substrat, une deuxième unité de circuit posée par-dessus le substrat, et un élément (108) de pression. Ledit élément (108) de pression comprend un corps (133), un pied (127) placé sur ledit corps (133) et une partie fixe (124), dans une section du pied (127), qui est rattachée au substrat par un élément de fixation. Lorsque l'élément (108) de pression est rattaché au substrat, ledit corps (133) est positionné au-dessus de la première unité de circuit, une extrémité du pied (127) est positionnée au-dessus de la deuxième unité de circuit, et ladite extrémité exerce une pression sur la deuxième unité de circuit en direction du substrat.
PCT/JP2013/006163 2013-03-22 2013-10-17 Carte garnie, élément de pression et dispositif électronique WO2014147681A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013059525 2013-03-22
JP2013-059525 2013-03-22

Publications (1)

Publication Number Publication Date
WO2014147681A1 true WO2014147681A1 (fr) 2014-09-25

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ID=51579423

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PCT/JP2013/006163 WO2014147681A1 (fr) 2013-03-22 2013-10-17 Carte garnie, élément de pression et dispositif électronique

Country Status (1)

Country Link
WO (1) WO2014147681A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3716323A1 (fr) * 2019-03-29 2020-09-30 INTEL Corporation Dissipateur thermique segmenté

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166715A (ja) * 2003-11-28 2005-06-23 Toshiba Corp 電子機器
JP2008269353A (ja) * 2007-04-20 2008-11-06 Toshiba Corp 電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166715A (ja) * 2003-11-28 2005-06-23 Toshiba Corp 電子機器
JP2008269353A (ja) * 2007-04-20 2008-11-06 Toshiba Corp 電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3716323A1 (fr) * 2019-03-29 2020-09-30 INTEL Corporation Dissipateur thermique segmenté
US11251103B2 (en) 2019-03-29 2022-02-15 Intel Corporation Segmented heatsink

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