WO2014134809A1 - 液晶模组及其固定构件 - Google Patents

液晶模组及其固定构件 Download PDF

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Publication number
WO2014134809A1
WO2014134809A1 PCT/CN2013/072297 CN2013072297W WO2014134809A1 WO 2014134809 A1 WO2014134809 A1 WO 2014134809A1 CN 2013072297 W CN2013072297 W CN 2013072297W WO 2014134809 A1 WO2014134809 A1 WO 2014134809A1
Authority
WO
WIPO (PCT)
Prior art keywords
fixing member
circuit board
side wall
fixing
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2013/072297
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English (en)
French (fr)
Inventor
李全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/824,387 priority Critical patent/US8982297B2/en
Publication of WO2014134809A1 publication Critical patent/WO2014134809A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Definitions

  • the present invention relates to the technical field of liquid crystal displays, and in particular to a novel fixing member of the circuit board and a novel manner of assembling the liquid crystal module using the fixing member. Background technique
  • the size or circuit layout of the boards is different in order to meet various component or circuit function requirements.
  • the circuit board is mounted on a magnetic backplane, and a plurality of integrally formed convex hulls 80 or rivet posts (shown in FIG. 1) and grooves on the circuit board are generally disposed on the magnetic backing plate. Or the card slots correspond to each other and are fixed to each other.
  • the backplane manufacturing process since it is necessary to meet the connection requirements of various types of circuit boards and their backplanes, it is necessary to provide more convex hulls 80 of different shapes and sizes for compatibility. However, too much convex hull 80 not only increases the complexity of the mold, but also affects the flatness of the back sheet, and also increases the risk of the back sheet in mass production, which will ultimately affect the quality of the product. Summary of the invention
  • the present invention provides a novel liquid crystal module and a fixing member thereof, which can greatly improve the compatibility of the back board to different circuit boards.
  • the fixing member comprises a side wall and a top plate and a bottom plate fixed to the side wall, wherein the top plate and the bottom plate cooperate with the side wall to form a magnet receiving cavity; the bottom edge of the bottom plate is provided with a stop portion, The magnet is fixed in the receiving cavity.
  • the side wall protrudes above the top plate to form a protrusion for increasing the stability of the connection between the fixing member and the circuit board.
  • a protrusion is extended outside the side wall for limiting the shield disposed above the circuit board.
  • the bottom plate is provided with a limiting slot for limiting the insulating partition disposed on the bottom plate.
  • the top plate is provided with a plurality of slots for fixed connection between the top plate and the circuit board.
  • the side wall, the top panel and the bottom panel are integrally formed.
  • the materials of the side wall, the top plate and the bottom plate are all conductive materials.
  • the present invention also provides another liquid crystal module, including a magnetic backplane, and further comprising:
  • circuit board with a plurality of copper areas at the bottom;
  • a plurality of fixing members including a side wall and a top plate and a bottom plate fixed to the side wall, the top plate and the bottom plate and the side wall cooperate to form a magnet receiving cavity; the bottom plate edge is provided with a stop portion For fixing the magnet in the receiving cavity;
  • the top plate of the fixing member is connected to the circuit board corresponding to the copper cloth region for fixing the circuit board to the magnetic backing plate by magnetic force.
  • an insulating spacer is further disposed between the backboard and the circuit board, and the insulating spacer is pressed on the backboard by a limiting slot of the fixing member.
  • the circuit board is soldered to the fixing member.
  • the method further includes a shield disposed above the circuit board, the shield being mounted outside the fixing member by a boss of the fixing member.
  • the invention also provides a third liquid crystal module, comprising a magnetic backing plate, further comprising a circuit board having a plurality of copper areas at the bottom, and a connecting piece corresponding to the magnetic connection of the copper area.
  • a magnet is disposed between the connecting piece and the back plate for fixing the circuit board to the back plate by magnetic attraction; the circuit board and the back plate are also connected by a conductive column.
  • the connecting piece is made of stainless steel; the conductive column is made of conductive foam.
  • Advantageous Effects The fixing member of the present invention and the liquid crystal module assembled by the fixing member realize that the fixing of the circuit board does not depend on the convex hull or the stud of the back plate, and the circuit boards of different shapes or figures can be assembled by magnetic attraction. On the simplified, relatively flat backplane, there is no need to install additional double-sided tape or screw to improve the compatibility of the backplane to different boards.
  • FIG. 1 is a schematic structural view of a back plate of a conventional liquid crystal module.
  • FIG. 2 is a schematic structural view of a fixing member according to Embodiment 1 of the present invention.
  • Fig. 3 is a schematic view showing another structure of a fixing member according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural view of a liquid crystal module according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural view of a bottom surface of a circuit board according to Embodiment 1 of the present invention.
  • Figure 6 is a schematic view showing the structure of a fixing member of Embodiment 2 of the present invention.
  • FIG. 7 is a schematic structural view of a liquid crystal module according to Embodiment 2 of the present invention.
  • Figure 8 is a schematic view showing the structure of a fixing member of Embodiment 3 of the present invention.
  • FIG. 9 is a schematic structural view of a liquid crystal module according to Embodiment 3 of the present invention.
  • FIG. 10 is a schematic structural view of a liquid crystal module according to Embodiment 4 of the present invention. detailed description
  • this embodiment provides a fixing member 20 connected between the circuit board 10 and the magnetic backing plate 30.
  • the fixing member 20 includes a side wall 21 and a top plate 22 and a bottom plate 23 fixed to the side wall 21.
  • the top plate 22 and the bottom plate 23 and the side wall 21 cooperate to form a magnet receiving cavity 24;
  • the edge of the bottom plate 23 is provided with a stopper 25 for fixing the magnet in the accommodating chamber 24.
  • the geometric configuration of the fixing member 20 itself is not particularly limited, and the fixing member 20 may be formed in a cylindrical shape, a rectangular column shape, a prism shape, or the like, and different expressions of these geometric configurations are mainly concentrated on the structural change of the side wall 21.
  • the total height of the fixing member 20 is generally designed to be not less than 4 mm. Since the fixing member 20 functions by being connected to the bottom surface of the circuit board 10, for example, it may be connected to the bottom corner, the rim or the center of the circuit board 10. In order for the fixing member 20 to better engage with the circuit board 10, the fixing member 20 is required to be adjusted in accordance with the connection position.
  • the fixing member 20 is disposed at the corner of the bottom surface of the circuit board 10, and the side wall 21 thereof can be bent into two planes according to the corner angle to form the two side walls 21 on the fixing member 20, the approximately rectangular bottom plate 23 and the top plate 22 Then, the adjacent two rims are respectively connected to the side wall 21.
  • the fixing member 20 disposed at the center of the edge of the circuit board 10 may have only one side wall 21 as the side wall 21, and the bottom plate 23 or the top plate 22 may be connected to the side wall 21 with only one rim.
  • the stopping portion 25 can also be correspondingly Adjustment, for example, a stop portion 25 may be formed partially or entirely on the exposed rim of the bottom plate 23, so that it is preferable to facilitate the placement of the magnet and stabilize the magnet from slipping out.
  • the side wall 21 of the fixing member 20 protrudes above the top plate 22 to form a projection 27.
  • the top plate 22 and the protruding portion 27 are respectively adhered to the bottom surface and the side surface of the circuit board 10, so as to better limit the circuit board 10.
  • the fixing member 20 is welded to the circuit board 10 by SMT method.
  • a plurality of inner recesses 26 are provided on the top plate 22, see FIG. Or Figure 3.
  • the side wall 21, the top plate 22 and the bottom plate 23 of this embodiment are preferably integrally formed.
  • the fixing member 20 is made of a conductive material such as a metal material such as stainless steel, aluminum, copper or silver.
  • the liquid crystal module includes a magnetic backing plate 30, and further includes a circuit board 10 having a plurality of copper regions 11 at the bottom, and a plurality of the fixing members 20; a magnet disposed in the accommodating cavity 24 of the fixing member 20; a top plate 22 of the fixing member 20 is connected to the circuit board 10 through the corresponding copper region 11 for fixing the circuit board 10 by magnetic force On the magnetic backsheet 30.
  • the circuit board 10 is generally fabricated by using a PCB board, and a plurality of copper areas 11 on the bottom surface thereof are used for soldering to the top plate 22 of the corresponding fixing member 20, as shown in FIG.
  • the copper area 11 (and the fixing member 20 is disposed) is generally evenly spaced on the bottom surface of the circuit board 10, for example, at the corners or edges of the bottom surface, and may also be disposed on the circuit board 10. Center of the bottom.
  • the magnet 40 can be first engaged in the accommodating cavity 24 of the fixing member 20, and the bottom edge 23 - the exposed edge is provided with a stopper portion 25, which can prevent the magnet 40 from slipping out after being engaged.
  • the top of the fixing member 20 is aligned with the copper portion (not shown) at the corner of the circuit board 10, and the projection 27 of the side wall 21 is in close contact with the edge of the circuit board 10 to maintain the side wall. 21 is perpendicular to the plane in which the board 10 is located.
  • the top plate 22 is soldered to the circuit board 10 by the SMT method. As previously described, the plurality of slots 26 on the top plate 22 facilitate solder assembly and improve the flatness of the components.
  • the fixing member 20 at other positions may Refer to the assembly.
  • the fixing member 20 is fastened to the magnetic backing plate 30. Since the fixing member 20 is provided with the magnet 40, the magnet 40 adsorbs the backing plate 30 to the fixing member 20 by magnetic force.
  • the bottom plate 23 is under.
  • the fixing member 20 is made of a conductive stainless steel, and therefore is grounded by the fixing member 20 in good contact with the backing plate 30. Since the circuit board 10 is magnetically attracted to the backing plate 30 by the fixing member 20, it is not necessary to design a plurality of convex hulls on the backing plate 30, and the back surface of the backing plate 30 can be ensured to have good flatness.
  • Some magnetic module modules need to be equipped with a magnetic shielding cover, and only the size and root configuration of the shielding cover can be matched with the circuit board pattern and the fixing member 20 structure.
  • the shield cover is sleeved on the circuit board, the root portion thereof is fitted to the outer side wall of the fixing member 20, and the magnetic shield is applied to the shield cover by the magnet in the fixing member 20 to fix the shield cover.
  • the distance between the circuit board 10 and the back board 30 needs to be reduced (H ⁇ 4 mm), and an insulating spacer is needed to isolate the circuit board 10 from the back board 30.
  • the present embodiment improves the fixing member 20.
  • the structure of the fixing member 20 of the present embodiment is different from that of the first embodiment.
  • a limiting groove 28 is provided on the bottom plate 23 of the fixing member 20 for the pair of the bottom plate 23.
  • the insulating spacer 50 is limited. When assembled, the insulating spacer 50 is placed on the magnetic backing plate 30, and the circuit board 10 to which the fixing member 20 is attached is placed on the partition 50, and the partition 50 is pressed by the limiting groove 28 of the plurality of fixing members 20. Fitted on the backboard 30.
  • the embodiment 1 For the rest of the structure or assembly method, please refer to the embodiment 1.
  • the present embodiment provides a further improvement to the fixing member 20.
  • the fixing member 20 of the present embodiment is improved on the basis of the second embodiment.
  • a protrusion 29 extends outside the side wall 21 of the fixing member 20 for being disposed above the circuit board 10 .
  • the shield 60 is limited.
  • the height of the boss 29 is preferably no higher than the maximum mounting height of the magnet 40. This design enables the root of the shield case 60 placed on the face of the boss 29 to obtain a magnetic attraction force directed to the inside of the fixing member 20, and a downward magnetic attraction force directed to the back plate 30, which can more stably fix the shield case 60.
  • Example 4 For the rest of the structure or assembly method, please refer to Embodiment 1 or Embodiment 2.
  • the liquid crystal module includes a magnetic backing plate 30, and further includes a plurality of copper cloth regions at the bottom (refer to FIG. 5).
  • the board 10 is fixed on the back board 30; the circuit board 10 and the back board 30 are also connected by a conductive post 70.
  • the fixing member of the embodiment is simplified as a magnetic connecting piece 90.
  • the connecting piece 90 is welded to the copper-plated area 11 of the circuit board 10, and the magnet 40-end is directly attracted to the connecting piece having the magnetism, and One end is attracted to the magnetic backing plate 30, so that the magnet 10 is fixed while the connection between the circuit board 10 and the backing plate 30 is realized, and the assembly structure is further simplified.
  • the connecting piece 90 is made of a magnetically permeable stainless steel, and other magnetically permeable materials may be used.
  • the size of the connecting piece 90 is relatively loose, which makes the operation more convenient and simple.
  • the conductive pillars 70 are generally made of a conductive material. In this embodiment, the conductive pillars 70 are made of conductive foam.
  • the fixing member of the invention and the liquid crystal module assembled by the fixing member realize that the fixing of the circuit board does not depend on the convex hull or the stud of the back plate, and the circuit boards of different shapes or figures can be simplified by the magnetic attraction assembly. On the back of the relatively flatter backplane, there is no need to install additional double-sided tape or screw to improve the compatibility of the backplane to different boards.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Liquid Crystal (AREA)

Abstract

一种液晶模组及其固定构件。所述固定构件（20），包括侧墙（21）以及固定于所述侧墙（21）上的顶板（22）和底板（23），所述顶板（22）和底板（23）与所述侧墙（21）相互配合形成一磁体容纳腔（24），所述底板（23）边缘设有止档部（25），用于将磁体（40）固定于容纳腔（24）中。所述液晶模组采用所述固定构件（20）或简化固定构件。实现了电路板的固定不依赖于背板上的凸包或铆柱，不同形状或图形的电路板均可以磁吸力装配在简化后的相对更平整的背板上，也不需要另外装设双面胶或螺钉固定，提升了背板对不同电路板的兼容性。

Description

液晶模组及其固定构件
技术领域
本发明涉及液晶显示器的技术领域， 尤其提供该电路板的新型固定构件， 以及采用这种固定构件组装的液晶模组的新型方式。 背景技术
在大尺寸液晶模组中或液晶显示器中， 为了满足各种元器件或电路功能需 要，电路板的尺寸大小或电路布设各不相同。该电路板装设在一磁吸性背板上， 一般是在磁吸性背板上布设有多个一体成型的凸包 80或者铆钉柱 （如图 1所 示） 与电路板上的凹槽或卡槽对应而相互固定。 对于背板制作工序来说， 由于 需要满足各种类型的电路板与其背板的连接要求， 因此需要设置更多形状不 一、 大小不同的凸包 80来进行兼容。 但是， 凸包 80过多不仅会增大模具的复 杂程度， 影响背板平整度， 而且还会增大背板在量产中的风险， 最终会影响产 品质量。 发明内容
为解决上述问题， 本发明提供新型的液晶模组及其固定构件， 能大大提升 背板对不同电路板的兼容性。
这种固定构件， 包括侧墙以及固定于所述侧墙上的顶板和底板， 所述顶板 和底板与所述侧墙相互配合形成一磁体容纳腔； 所述底板边缘设有止档部， 用 于将磁体固定于容纳腔中。
优选地， 所述侧墙突伸于所述顶板上方形成凸出部， 用于增大所述固定构 件与电路板连接的稳定性。
优选地， 所述侧墙外侧延伸一凸台， 用于对设置在电路板上方的屏蔽罩进 行限位。 优选地， 所述底板上设有一限位槽， 用于对设置在所述底板上的绝缘隔板 进行限位。
优选地， 所述顶板上设有多个槽穴， 用于顶板与电路板固定连接。 优选地， 所述侧墙、 顶板和底板是一体成型的。
优选地， 所述侧墙、 顶板和底板的材质均为导电材料。
本发明还提供另一种液晶模组， 包括磁吸性背板， 还包括：
底部设有多个布铜区的电路板；
多个固定构件， 其包括侧墙以及固定于所述侧墙上的顶板和底板， 所述顶 板和底板与所述侧墙相互配合形成一磁体容纳腔； 所述底板边缘设有止档部， 用于将磁体固定于容纳腔中；
以及装设在所述固定构件容纳腔内的磁体；
所述固定构件的顶板对应于所述布铜区与所述电路板连接， 用于使所述电 路板通过磁力固定在所述磁吸性背板上。
优选地， 在所述背板及所述电路板之间还包括一绝缘隔板， 所述绝缘隔板 通过所述固定构件的限位槽压合在所述背板上。
优选地， 所述电路板与所述固定构件焊接。
优选地， 还包括设置于所述电路板上方的屏蔽罩， 所述屏蔽罩通过所述固 定构件的凸台装设在所述固定构件外侧。
本发明还提供第三种液晶模组， 包括磁吸性背板， 还包括底部设有多个布 铜区的电路板， 以及对应于所述布铜区固定连接一磁吸性的连接片， 所述连接 片与所述背板之间设有一磁体， 用于通过磁吸力将所述电路板固定于所述背板 上； 所述电路板及所述背板之间还通过导电柱相连。
优选地， 所述连接片的材质为不锈钢； 所述导电柱的材质为导电泡棉。 有益效果： 本发明的固定构件以及利用固定构件组装的液晶模组， 实现了 电路板的固定不依赖于背板上的凸包或铆柱， 不同形状或图形的电路板均可以 通过磁吸力装配在简化后的相对更平整的背板上， 也不需要另外装设双面胶或 螺钉固定， 提升了背板对不同电路板的兼容性。 附图说明
图 1为现有液晶模组的背板结构示意图。
图 2为本发明实施例 1固定构件的结构示意图。 图 3为本发明实施例 1固定构件的另一结构示意图。
图 4为本发明实施例 1液晶模组的结构示意图。
图 5为本发明实施例 1电路板的底面结构示意图。
图 6为本发明实施例 2固定构件的结构示意图。
图 7为本发明实施例 2液晶模组的结构示意图。
图 8为本发明实施例 3固定构件的结构示意图。
图 9为本发明实施例 3液晶模组的结构示意图。
图 10为本发明实施例 4液晶模组的结构示意图。 具体实施方式
下面， 将结合附图对本发明实施方式作详细说明。
实施例 1
如图 2、 图 4所示， 本实施例提供一种连接于电路板 10和磁吸性背板 30 之间的固定构件 20。 这种固定构件 20， 包括侧墙 21 以及固定于所述侧墙 21 上的顶板 22和底板 23，所述顶板 22和底板 23与所述侧墙 21相互配合形成一 磁体容纳腔 24; 所述底板 23边缘设有止挡部 25， 用于将磁体固定于所述容纳 腔 24中。 固定构件 20本身的几何构型没有特别限制，固定构件 20可以形成圆柱状、 矩形柱状、 棱柱状等等， 并且这些几何构型的不同体现主要集中在侧墙 21 的 结构变化上。为了保证电路板 10与背板 30具有安全距离（H 4mm)， 一般设 计固定构件 20的总高度不小于 4mm。 由于固定构件 20是通过连接于电路板 10底面发挥作用的， 例如可以是连接在电路板 10的底面边角、 缘边或中心位 置等。 为了让固定构件 20更好地与电路板 10接合， 需要固定构件 20根据连 接位置的不同而调整构型。例如，设置在电路板 10底面边角处的固定构件 20， 其侧墙 21可以根据边角角度弯折成两平面形成固定构件 20上的两个侧壁 21， 近似矩形的底板 23和顶板 22则分别依靠相邻的两缘边与侧墙 21连接。 类似 地， 设置在电路板 10边缘中部的固定构件 20，可以仅保留一面侧壁 21作为侧 墙 21， 底板 23或顶板 22分别仅用一条缘边与侧墙 21相连。 另外， 随着固定 构件 20构型的变化， 为满足固定磁体的要求， 所述止挡部 25也可以作出相应 调整， 例如可以在底板 23外露的缘边上部分或全部形成止挡部 25， 以达到既 便于磁体的放置又能稳定磁体不滑出为佳。
为了进一歩提高固定构件 20与电路板 10的连接稳定性， 如图 3所示， 所 述固定构件 20的侧墙 21突伸于所述顶板 22上方形成凸出部 27。 组装时， 该 顶板 22和凸出部 27分别紧贴于电路板 10底面和侧面， 能更好地对电路板 10 起到限位作用。
本实施例中， 固定构件 20是采用 SMT法焊接在所述电路板 10上的， 为 了进一歩加强焊接的固定效果， 在所述顶板 22上设有多个内凹槽穴 26， 参见 图 2或图 3。
本实施例的侧墙 21、顶板 22和底板 23优选是一体成型的。并且， 为了满 足电路板 10与背板 30形成接地连接， 所述固定构件 20的材质为导电材料， 如不锈钢、 铝、 铜、 银等金属材料。
下面介绍包含有这种固定构件 20的液晶模组其结构和组装方式。
如图 4、 图 5所示， 这种液晶模组包括磁吸性背板 30， 还包括底部设有多 个布铜区 11的电路板 10， 和多个所述的固定构件 20; 以及装设在所述固定构 件 20容纳腔 24内的磁体； 所述固定构件 20的顶板 22通过对应的所述布铜区 11与所述电路板 10连接，用于使所述电路板 10通过磁力固定在所述磁吸性背 板 30上。
其中， 电路板 10—般采用 PCB板制作， 其底面的多个布铜区 11用于与 对应的固定构件 20顶板 22焊接， 如图 5所示。 为了获得较佳的连接效果， 布 铜区 11 (及固定构件 20布设位置） 一般是间隔均匀地布设在电路板 10底面， 例如在底面的边角或边缘处， 也可以设置在电路板 10的底面中心。
结合图 3、 图 4所示， 介绍本实施例其中一种固定构件 20固定在电路板 10边角处的组装方式。 首先， 可以先将磁体 40契合于固定构件 20的容纳腔 24中， 底板 23—外露边缘设置止挡部 25， 能防止磁体 40契合后滑出。 然后 让固定构件 20的顶部对准电路板 10的边角处布铜区 （图中未示出）， 侧墙 21 的凸出部 27与电路板 10的边角缘边紧贴， 保持侧墙 21与电路板 10所在平面 垂直。 采用 SMT法将顶板 22与电路板 10焊接， 如前所述， 顶板 22上的多个 槽穴 26可利于焊料装配和及提高元件的平整程度。其他位置的固定构件 20可 参照组装。
当固定构件 20与电路板 10的连接完成后， 使固定构件 20扣于磁吸性背 板 30上， 由于固定构件 20上设有磁体 40，磁体 40通过磁力将背板 30吸附于 固定构件 20的底板 23下。 固定构件 20是采用导电的不锈钢制备， 因此依靠 固定构件 20与背板 30形成良好接触进行接地。 由于电路板 10通过固定构件 20磁力吸附在背板 30上，不需要在背板 30上设计多种的凸包，而可以保证背 板 30面具有良好的平整度。
某些液晶模组的电路板上还需要安装磁吸性屏蔽罩， 只需要让屏蔽罩的大 小和根部构型能分别与电路板图形、 固定构件 20结构吻合。 当屏蔽罩套于电 路板上， 其根部与固定构件 20的侧墙外侧贴合， 利用固定构件 20中的磁体对 屏蔽罩产生磁力吸附， 而将屏蔽罩固定。
实施例 2
为了满足某些薄型液晶模组的组装要求， 电路板 10和背板 30的距离需要 縮小（H<4mm)， 需要增加一绝缘隔板将电路板 10和背板 30隔离。 此时， 为 了固定隔板， 本实施例对固定构件 20作出改进。
本实施例的固定构件 20结构与实施例 1所不同的是， 如图 6、 图 7所示， 在固定构件 20的底板 23上设有一限位槽 28， 用于对设置在底板 23上的绝缘 隔板 50进行限位。 组装时， 绝缘隔板 50放置于磁吸性背板 30上， 再在隔板 50上安放连接有固定构件 20的电路板 10， 利用多个固定构件 20的限位槽 28 将隔板 50压合在背板 30上。 其余结构或组装方式请参阅实施例 1所示。
实施例 3
为了更好地稳定屏蔽罩的安设， 本实施对固定构件 20作出进一歩改进。 本实施例的固定构件 20在实施例 2的基础上改进， 如图 8、 图 9所示， 所 述固定构件 20的侧墙 21外侧延伸一凸台 29， 用于对设置在电路板 10上方的 屏蔽罩 60进行限位。 凸台 29的高度优选不高于磁体 40的最大安装高度。 这 种设计使得安放在凸台 29面上的屏蔽罩 60根部能获得指向固定构件 20内部 的磁吸力， 以及指向背板 30的向下的磁吸力， 能更加稳定地固定屏蔽罩 60。 其余结构或组装方式请参阅实施例 1或实施 2所示。 实施例 4
本实施例的固定构件 20构型进行简化， 如图 10所示， 这种液晶模组， 包 括磁吸性背板 30， 还包括底部设有多个布铜区 （参考图 5所示） 的电路板 10， 以及对应于所述布铜区固定连接一磁吸性的连接片 90， 所述连接片 90与所述 背板 30之间设有一磁体 40，用于通过磁吸力将所述电路板 10固定于所述背板 30上； 所述电路板 10及所述背板 30之间还通过导电柱 70相连。 本实施例的固定构件简化为一磁吸性连接片 90， 首先让连接片 90焊接到 电路板 10的布铜区 11上， 让磁体 40—端直接吸附到具有可磁吸的连接片上， 另一端吸附在磁吸性的背板 30上， 从而在固定磁体 40的同时， 同时实现电路 板 10与背板 30的连接， 组装结构更进一歩简化。 本实施例连接片 90的材质 为可磁吸的不锈钢， 也可以采用其他可磁吸的材质。 而对连接片 90的形状大 小要求较为宽松， 使得操作更为方便简单。
由于磁体 40本身不导电， 而为了满足电路板 10的接地要求， 还需要在电 路板 10和背板 30之间连接导电柱 70。 导电柱 70—般采用导电材料制作， 本 实施例导电柱 70的材质为导电泡棉。 本发明的固定构件以及利用该固定构件组装的液晶模组， 实现了电路板的 固定不依赖于背板上的凸包或铆柱， 不同形状或图形的电路板均可以通过磁吸 力装配在简化后的相对更平整的背板上， 也不需要另外装设双面胶或螺钉固 定， 提升了背板对不同电路板的兼容性。

Claims

权利要求书
1、 一种固定构件， 其特征在于， 包括侧墙以及固定于所述侧墙上的顶板 和底板， 所述顶板和底板与所述侧墙相互配合形成一磁体容纳腔； 所述底板边 缘设有止档部， 用于将磁体固定于容纳腔中。
2、 根据权利要求 1所述固定构件， 其特征在于， 所述侧墙突伸于所述顶 板上方形成凸出部， 用于增大所述固定构件与电路板连接的稳定性。
3、 根据权利要求 2所述固定构件， 其特征在于， 所述侧墙外侧延伸一凸 台， 用于对设置在电路板上方的屏蔽罩进行限位。
4、 根据权利要求 1所述固定构件， 其特征在于， 所述底板上设有一限位 槽， 用于对设置在所述底板上的绝缘隔板进行限位。
5、 根据权利要求 1所述固定构件， 其特征在于， 所述顶板上设有多个槽 穴， 用于顶板与电路板固定连接。
6、 根据权利要求 1所述固定构件， 其特征在于， 所述侧墙、 顶板和底板 是一体成型的。
7、 根据权利要求 6所述固定构件， 其特征在于， 所述侧墙、 顶板和底板 的材质均为导电材料。
8、 一种液晶模组， 包括磁吸性背板， 其特征在于， 还包括 底部设有多个布铜区的电路板；
多个固定构件， 其包括侧墙以及固定于所述侧墙上的顶板和底板， 所述顶 板和底板与所述侧墙相互配合形成一磁体容纳腔； 所述底板边缘设有止档部， 用于将磁体固定于容纳腔中；
以及装设在所述固定构件容纳腔内的磁体；
所述固定构件的顶板对应于所述布铜区与所述电路板连接， 用于使所述电 路板通过磁力固定在所述磁吸性背板上。
9、 根据权利要求 8所述液晶模组， 其特征在于， 所述磁吸性背板及所述 电路板之间还包括一绝缘隔板， 所述绝缘隔板通过设置在所述固定构件底板上 的限位槽而装设在所述背板上。
10、 根据权利要求 8所述液晶模组， 其特征在于， 所述电路板与所述固 定构件焊接。
11、 根据权利要求 8所述液晶模组， 其特征在于， 还包括设置于所述电 路板上方的屏蔽罩， 所述屏蔽罩通过在所述固定构件侧墙外侧延伸出的凸台而 装设在所述固定构件外侧。
12、 一种液晶模组， 包括磁吸性背板， 其特征在于， 还包括底部设有多 个布铜区的电路板， 以及对应于所述布铜区固定连接一磁吸性的连接片， 所述 连接片与所述背板之间设有一磁体， 用于通过磁吸力将所述电路板固定于所述 背板上； 所述电路板及所述背板之间还通过导电柱相连。
13、 根据权利要求 12所述的液晶模组， 其特征在于， 所述连接片的材质 为不锈钢； 所述导电柱的材质为导电泡棉。
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