WO2014132425A1 - Electronic module and production method for same - Google Patents

Electronic module and production method for same Download PDF

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Publication number
WO2014132425A1
WO2014132425A1 PCT/JP2013/055578 JP2013055578W WO2014132425A1 WO 2014132425 A1 WO2014132425 A1 WO 2014132425A1 JP 2013055578 W JP2013055578 W JP 2013055578W WO 2014132425 A1 WO2014132425 A1 WO 2014132425A1
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WO
WIPO (PCT)
Prior art keywords
substrate
functional unit
electronic module
heat sink
base plate
Prior art date
Application number
PCT/JP2013/055578
Other languages
French (fr)
Japanese (ja)
Inventor
康亮 池田
清水　正章
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to PCT/JP2013/055578 priority Critical patent/WO2014132425A1/en
Priority to JP2014501364A priority patent/JP5788584B2/en
Publication of WO2014132425A1 publication Critical patent/WO2014132425A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

Definitions

  • the present invention relates to an electronic module and a manufacturing method thereof, and more particularly to an electronic module including a heat sink and a manufacturing method thereof.
  • the conventional regulator 100 includes a power unit 110, a control unit 120, and a heat sink 130.
  • the power unit 110 performs power conversion by an electronic component 112 such as a semiconductor switch mounted on the substrate 111.
  • the control unit 120 controls the power unit 110 by an electronic component 122 such as a control element mounted on the substrate 121.
  • the power unit 110 and the control unit 120 are electrically connected by a connection terminal 113.
  • the heat sink 130 includes a base plate 131 and a plurality of fins 132 erected on the lower surface of the base plate 131.
  • the regulator 100 is connected to an external device via the external connection terminal 123.
  • both the power unit 110 and the control unit 120 are provided on the base plate 131 of the heat sink 130.
  • Patent Document 1 discloses a semiconductor device in which a semiconductor element is sandwiched between two heat sinks.
  • the size increases. That is, conventionally, there has been a problem that it is difficult to downsize an electronic module including a heat sink such as a regulator.
  • an object of the present invention is to provide an electronic module that can be miniaturized and can improve heat dissipation. Another object of the present invention is to provide an electronic module manufacturing method capable of improving the manufacturability of the electronic module.
  • An electronic module includes: A first substrate; a first electronic component mounted on the first substrate; and a second electronic component disposed to face the first substrate and thermally connected to the first electronic component
  • the heat sink has a base plate provided with a storage portion therein, The first functional unit is stored in the storage unit such that the first and second substrates are in contact with an inner wall surface of the storage unit of the base plate,
  • the second functional unit is fixed on the base plate so that the third substrate is in contact with the main surface of the base plate. It is characterized by that.
  • the first functional unit and the base plate may be fitted to each other.
  • a recess may be provided in at least one of the first substrate and the second substrate, and the heat conducting member may be disposed in the recess so as to contact the inner wall surface of the storage unit.
  • the first functional part accommodated in the accommodating part includes a first through hole reaching the accommodating part from the main surface of the base plate, and a second penetrating through the first functional part in the thickness direction. You may make it fix in the said heat sink with the screw inserted in the through-hole and screwing in the screw hole formed in the inner wall of the said accommodating part.
  • the second functional unit may be fixed on the base plate by inserting the screw into a through hole penetrating the third substrate in the thickness direction.
  • the first function unit may generate a larger amount of heat than the second function unit.
  • the first functional unit is a power unit that converts input power input to the first functional unit into desired output power
  • the second functional unit is a control unit that controls the power unit. There may be.
  • a plurality of connection terminals that electrically connect the first functional unit and the second functional unit are provided in stripes on the side surfaces of the base plate connected to the main surface so as to be insulated from each other. You may make it accommodate in each groove part.
  • the heat sink is A heat sink body with a recess formed on the surface; A lid having a first main surface and a second main surface opposite to the first main surface; The lid is attached to the heat sink body so that the first main surface is in contact with the surface of the heat sink body and covers the recess, and constitutes the storage portion together with the recess, and the second function
  • the part may be fixed to the second main surface of the lid.
  • the first functional unit may be fixed to the first main surface of the lid.
  • connection terminals that electrically connect the first functional unit and the second functional unit are inserted into through holes that penetrate the lid in the thickness direction so as to be insulated from each other. You may do it.
  • the storage part may be sealed by the recess of the heat sink body and the lid, and the first functional part may be stored in a sealed state in the heat sink.
  • An electronic module manufacturing method includes: A first function having a first substrate on which a first electronic component is mounted, and a second substrate disposed so as to face the first substrate and thermally connected to the first electronic component Of an electronic module comprising: a second functional part having a third substrate on which a second electronic component is mounted; and a heat sink having a base plate and cooling the first and second functional parts
  • a method Disposing a heat conductive member having a thickness equal to the depth of the recess in a recess provided in at least one of the first substrate and the second substrate; Storing the first functional unit in the storage unit such that the heat conducting member is in contact with an inner wall surface of a storage unit provided in the base plate; Fixing the second functional unit on the base plate such that the third substrate is in contact with the main surface of the base plate; It is characterized by providing.
  • An electronic module manufacturing method includes: A first function having a first substrate on which a first electronic component is mounted, and a second substrate disposed so as to face the first substrate and thermally connected to the first electronic component
  • a second functional unit having a second substrate on which a second electronic component is mounted, a heat sink body provided with a recess having a depth equal to the thickness of the first functional unit, and a lid body
  • a method of manufacturing an electronic module comprising a heat sink having: Fixing the first functional unit to the lid so that the first substrate is in contact with one main surface of the lid; Attaching the lid to the heat sink body such that the first functional part is housed in the recess of the heat sink body and the second substrate is in contact with the bottom surface of the recess; Fixing the second functional unit to the lid so that the second substrate is in contact with the other main surface of the lid; It is characterized by providing.
  • the heat sink has a base plate provided with a storage portion therein, and the first functional unit is such that the first and second substrates are in contact with the inner wall surface of the storage portion of the base plate.
  • the second functional unit is housed in the housing unit, and is fixed on the base plate so that the second substrate is in contact with the main surface of the base plate.
  • a heat conductive member having a thickness equal to the depth of the recess is provided in the recess provided in at least one of the first substrate and the second substrate.
  • the first functional unit is stored in the storage unit such that the heat conducting member is in contact with the inner wall surface of the storage unit provided inside the base plate.
  • the first functional unit when the first functional unit is stored in the heat sink storage unit, the first functional unit is connected to one of the lids of the heat sink.
  • the lid is fixed to the heat sink body so that the first functional part is accommodated in the recess of the heat sink body and the second substrate is in contact with the bottom surface of the recess.
  • FIG. 1 is a perspective view of an electronic module 1 according to a first embodiment. It is sectional drawing of the electronic module 1 which concerns on 1st Embodiment.
  • A) is sectional drawing of the board
  • (b) is sectional drawing of the board
  • A) is a perspective view of the heat sink main body of the heat sink of the electronic module 2 which concerns on 2nd Embodiment
  • FIGS. 1 and 2 show a perspective view and a cross-sectional view of the electronic module 1 according to the first embodiment, respectively. More specifically, FIG. 2 is a cross-sectional view of the electronic module 1 along a plane passing through the center line of the two screws 40 and 40.
  • FIG. 3A is a cross-sectional view of the substrate 13 of the electronic module 1
  • FIG. 3B is a cross-sectional view of the substrate 11 of the electronic module 1.
  • the electronic module 1 includes a first functional unit 10, a second functional unit 20, and a heat sink 30.
  • the first functional unit 10 is stored in the storage unit 31a1 so that the substrate 11 and the substrate 13 are in contact with the inner wall surface of the storage unit 31a1 of the base plate 31.
  • substrate 13 may be in contact with the inner wall face of the accommodating part 31a1, and may be in contact with an inner wall face via a heat conductive member (a thermal radiation sheet, thermal radiation grease, etc.).
  • the first functional unit 10 is a power unit that converts input power input to the first functional unit 10 into desired output power, for example. As shown in FIG. 2, the first functional unit 10 faces the substrate 11 (first substrate), the electronic component 12 (first electronic component) mounted on the substrate 11, and the substrate 11. And a substrate 13 (second substrate) disposed and thermally connected to the electronic component 12.
  • the electronic component 12 is, for example, a semiconductor switch, and is thermally connected to the substrate 13 via a heat conductive connection member 17.
  • the heat conductive connecting member 17 is a columnar conductor made of a metal such as copper or aluminum.
  • substrate 13 may be directly connected not via the heat conductive connection member 17.
  • the space between the substrate 11 and the substrate 13 is sealed with a sealing resin 14.
  • the sealing resin 14 embeds the electronic component 12 and the heat conductive connection member 17.
  • the substrate 11 includes an insulating base material 11a made of an insulating material such as ceramic, and conductor layers 11b and 11c provided on the insulating base material 11a.
  • the conductor layers 11b and 11c are made of copper foil or the like.
  • the conductor layer 11b is processed into a predetermined pattern, and the electronic component 12 is joined to the conductor layer 11b.
  • the conductor layer 11c contacts the inner wall surface of the storage portion 31a1.
  • substrate 11 does not need to be provided with the conductor layer 11c.
  • the substrate 13 includes an insulating base 13a made of an insulating material such as ceramic, and conductor layers 13b and 13c provided on the insulating base 13a.
  • the conductor layers 13b and 13c are made of copper foil or the like.
  • the thermally conductive connecting member 17 (or the electronic component 12) is joined to the conductor layer 13b via a joining material (such as solder or adhesive).
  • the conductor layer 13c is in contact with the inner wall surface of the storage portion 31a1.
  • substrate 13 does not need to be provided with the conductor layer 13b and / or the conductor layer 13c.
  • the second functional unit 20 is arranged on the main surface 31 b of the base plate 31.
  • the second function unit 20 is, for example, a control unit that controls the semiconductor switch of the power unit.
  • the second functional unit 20 includes a substrate 21 and an electronic component 22 (second electronic component) mounted on the substrate 21.
  • the substrate 21 includes an insulating base material made of an insulating material such as ceramic, and a conductor layer such as a copper foil provided on the insulating base material and processed into a predetermined pattern.
  • the electronic component 22 is joined to this conductor layer.
  • the heat sink 30 is for cooling the first functional unit 10 and the second functional unit 20, and includes a base plate 31 in which a storage unit 31a1 is provided, and a base plate And a plurality of fins 32 erected on 31.
  • the base plate 31 has a substantially rectangular parallelepiped shape, and has a main surface (upper surface) 31b, a side surface 31c connected to the main surface 31b, and a side surface 31d opposite to the side surface 31c.
  • the storage portion 31 a 1 provided in the base plate 31 is a space for storing the first functional unit 10.
  • the storage portion 31a1 includes a through-hole penetrating from the side surface 31c to the side surface 31d.
  • the accommodating part 31a1 consist of a recessed part formed in the side surface 31c.
  • the side surface 31d of the base plate 31 does not open.
  • the storage portion 31a1 only needs to be configured to be able to store the first functional unit 10 in the base plate 31, and is not limited to a through hole or a recess.
  • a plurality of groove portions 33 provided in a stripe shape are provided on the side surface 31 c of the base plate 31. As will be described later, the connection terminal 15 is accommodated in the groove 33.
  • a valley-shaped fitting portion 18 is provided on the main surface of the substrate 11 and the substrate 13 facing the inner wall surface of the storage portion 31a1.
  • the first functional unit 10 and the base plate 31 are fitted to each other.
  • the 1st function part 10 can be arranged with sufficient accuracy in storage part 31a1.
  • the contact area between the first functional unit 10 and the base plate 31 increases, the heat dissipation of the electronic module can be further enhanced.
  • the fitting portion 18 may be provided only on one of the substrate 11 and the substrate 13. Further, the shape of the fitting portion 18 is not limited to the mountain shape or the valley shape, and may be any shape that allows the substrate 11 or the substrate 13 and the inner wall surface of the storage portion 31a1 to be fitted.
  • the second functional unit 20 is fixed on the base plate 31 so that the substrate 21 contacts the main surface 31b of the base plate 31, as shown in FIGS.
  • the second function unit 20 is electrically connected to the first function unit 10 through a plurality of connection terminals 15 as shown in FIG.
  • connection terminals 15 are respectively accommodated in a plurality of groove portions 33 provided on the side surface 31c of the base plate 31 so as to be insulated from each other. Thereby, since the connection terminal 15 does not jump out of the heat sink 30, the electronic module 1 can be further reduced in size.
  • the first functional unit 10 stored in the storage unit 31 a 1 is fixed in the heat sink 30 by screws 40.
  • the screw 40 is inserted into the through hole 34 that reaches the housing part 31a1 from the main surface 31b of the base plate 31 and the through hole 16 that penetrates the first functional part 10 in the thickness direction, and is formed on the inner wall of the housing part 31a1.
  • the screw hole 35 is screwed.
  • the second functional unit 20 is fixed on the base plate 31 by inserting a screw 40 through a through hole 24 that penetrates the substrate 21 in the thickness direction.
  • the 1st and 2nd function parts 10 and 20 can be fixed to the heat sink 30 with a small number of screws.
  • the first functional unit 10 and the second functional unit 20 may be fixed to the heat sink 30 with separate screws, respectively.
  • heat conducting members 11e, 13e such as a heat radiating sheet or heat radiating grease are placed in the recesses 11d, 13d provided in the conductor layers 11c, 13c. Be placed. More specifically, the heat conducting members 11e and 13e are disposed in the recesses 11d and 13d so as to be in contact with the inner wall surface of the storage portion 31a1.
  • the heat conducting members 11e and 13e have a thickness substantially equal to the depth of the recesses 11d and 13d.
  • the concave portion is provided on the main surface of the substrate 11 and / or the substrate 13 facing the inner wall surface of the storage portion, and the heat conducting member is arranged in the concave portion so as to contact the inner wall surface of the storage portion.
  • the distance between the insulating base material 11a and the heat sink 30 is less than that of the recess 11d as compared with the case where the heat conducting member 11e is disposed between the substrate 11 where the recess 11d is not provided and the inner wall surface of the storage portion 31a1. It becomes shorter by the depth (the same applies to the substrate 13). As a result, the heat dissipation of the electronic module 1 can be further improved.
  • the electronic module 1 since the first functional unit 10 is stored in the storage unit 31a1, there is an area where the first functional unit 10 is installed on the base plate 31. It becomes unnecessary and the electronic module can be greatly reduced in size.
  • the heat generated from the first functional unit 10 is radiated from the two surfaces of the substrate 11 and the substrate 13 to the heat sink 30, the heat dissipation of the electronic module can be improved.
  • the 1st function part 10 increases, when the heat dissipation efficiency of the whole electronic module is considered, it is preferable that the 1st function part 10 has a larger calorific value than the 2nd function part 20. .
  • the first functional unit 10 is manufactured by the following procedure. Cream solder is applied to a predetermined position of the substrate 11, and the electronic component 12 is placed thereon. Next, the heat conductive connection member 17 is placed on the electronic component 12 via a bonding material (solder, thermosetting adhesive, or the like). Next, the substrate 13 is placed on the heat conductive connecting member 17 via a bonding material (solder or thermosetting adhesive or the like). Next, the assembly thus obtained is subjected to a heat treatment (reflow) to fix the joint portion. Next, a resin is injected between the substrate 11 and the substrate 13 by transfer molding or the like to form the sealing resin 14 in which the electronic component 12 and the heat conductive connection member 17 are embedded.
  • Cream solder is applied to a predetermined position of the substrate 11, and the electronic component 12 is placed thereon.
  • the heat conductive connection member 17 is placed on the electronic component 12 via a bonding material (solder, thermosetting adhesive, or the like).
  • the substrate 13 is placed on the heat conductive connecting member 17 via a bonding
  • the heat conducting members 11e and 13e are disposed in the recesses 11d and 13d provided in the substrate 11 and the substrate 13, respectively.
  • the heat conducting members 11e and 13e are heat radiating sheets
  • a heat radiating sheet having a thickness substantially equal to the depth of the concave portions 11d and 13d is stuck in the concave portions 11e and 13e.
  • the heat conducting members 11e and 13e are heat radiation grease
  • the heat radiation grease is filled in the recesses 11e and 13e so that the surface of the heat radiation grease is flush with the surfaces of the substrates 11 and 13.
  • the first functional unit 10 is stored in the storage unit 31a1 so that the heat conducting members 11e and 13e are in contact with the inner wall surface of the storage unit 31a1 provided in the base plate 31.
  • the second functional unit 20 is fixed on the base plate 31 so that the substrate 21 of the second functional unit 20 contacts the main surface 31 b of the base plate 31.
  • the heat conducting members 11e and 13e do not protrude from the main surfaces of the substrate 11 and the substrate 13, and thus the heat dissipation sheet is stored. It can be prevented from being broken or rounded by being caught in the opening of the part, and heat radiation grease from adhering to the opening end of the storage part. As a result, the manufacturability of the electronic module 1 can be improved.
  • FIG. 4A is a perspective view of the heat sink body 36 of the heat sink 30 of the electronic module 2 according to this embodiment.
  • FIG. 4B is a perspective view of the lid 37 of the heat sink 30.
  • FIG. 5 is a cross-sectional view of the electronic module 2 according to the second embodiment. More specifically, FIG. 5 is a cross-sectional view of the electronic module 2 along a plane including the connection terminals 15.
  • One of the differences between the second embodiment and the first embodiment is the configuration of the heat sink 30.
  • the second embodiment will be described focusing on this difference.
  • the heat sink 30 includes a heat sink body 36 and a lid body 37.
  • a lid 37 is attached to the heat sink body 36 to constitute the heat sink 30.
  • the heat sink body 36 has a recess 36a formed on a surface (upper surface) 36b.
  • the depth of the recess 36 a is substantially equal to the thickness of the first functional unit 10.
  • the recess 36a is open to the side surface 36c and the side surface 36d of the heat sink body 36.
  • the side surface 36c is a front side surface
  • the side surface 36d is a back side surface.
  • the lid body 37 has a main surface 37a and a main surface 37b opposite to the main surface 37a.
  • the lid 37 is attached to the heat sink body 36 so that the main surface 37a is in contact with the surface 36b of the heat sink body 36 and covers the recess 36a.
  • the main surface 37 b of the lid body 37 becomes the main surface 31 b of the base plate 31.
  • the lid body 37 constitutes a storage portion 31 a 2 that stores the first functional portion 10 together with the recess 36 a of the heat sink body 36.
  • the first functional unit 10 is fixed to the main surface 37 a of the lid 37 by, for example, screwing.
  • the first functional unit 10 may be fixed to the bottom surface of the recess 36a.
  • the second functional unit 20 is fixed to the main surface 37 b of the lid 37 by, for example, screwing.
  • the lid body 37 is provided with a through hole 38 that penetrates the lid body 37 in the thickness direction.
  • a plurality of connection terminals 15 that electrically connect the first functional unit 10 and the second functional unit 20 are inserted into the respective through holes 38 so as to be insulated from each other. Yes. Thereby, since the connection terminal 15 does not jump out of the heat sink 30, the electronic module 2 can be further reduced in size.
  • the first functional unit 10 is housed in the housing unit 31a1.
  • region which installs the 1st function part 10 on the baseplate 31 becomes unnecessary, and an electronic module can be reduced in size significantly.
  • the heat generated from the first functional unit 10 is radiated from the two surfaces of the substrate 11 and the substrate 13 to the heat sink 30, the heat dissipation of the electronic module can be improved.
  • the recess 36 a of the heat sink body 36 may be provided so as not to open on the side surfaces 36 c and 36 d of the heat sink body 36.
  • the storage portion 31 a 2 is sealed by the recess 36 a of the heat sink body 36 and the lid body 37, and the first functional unit 10 is stored in the heat sink 30 in a sealed state. Accordingly, it is possible to reduce the electromagnetic wave emitted to the outside along with the operation of the electronic module and to suppress the influence on the operation of the electronic module due to the electromagnetic wave from the outside.
  • the first functional unit 10 manufactured by the procedure described in the first embodiment is fixed to the lid 37 so that the substrate 11 is in contact with the main surface 37 a of the lid 37. At this time, the first functional unit 10 is fixed to the lid 37 so that the connection terminal 15 is inserted through the through hole 38 of the lid 37.
  • the lid 37 is attached to the heat sink body 36 so that the first functional unit 10 is accommodated in the recess 36a of the heat sink body 36 and the substrate 13 is in contact with the bottom surface of the recess 36a.
  • the second functional unit 20 is fixed to the lid body 37 so that the second substrate 21 is in contact with the main surface 37 b of the lid body 37.
  • the second functional unit 20 is fixed to the lid 37 so that the connection terminal 15 is inserted through the through hole of the second substrate 21. Thereafter, the connection terminal 15 is soldered to the second substrate 21.
  • the first functional unit 10 and the second functional unit 20 are fixed to the lid body 37 with screws or an adhesive.
  • the manufacturability of the electronic module can be improved.

Abstract

[Problem] To provide an electronic module that can be miniaturized and in which radiation properties can be improved, and a production method for the same. [Solution] An electronic module (1) provided with: a first functional part (10) including a substrate (11), an electronic part (12) attached to the substrate (11), and a substrate (13) that is arranged to face the substrate (11) and is thermally connected to the electronic part (12) attached to the substrate (11); a second functional part (20) including a substrate (21) and an electronic part (22), and being connected electrically to the first functional part (10); and a heat sink (30) that cools the first functional part (10) and the second functional part (20). The heat sink (30) includes a base plate (31) to which a storage part (31a) is internally provided. The first functional part (10) is housed within a storage part (31a1) such that the substrate (11) and the substrate (13) are contacted to an inner wall of the storage part (31a1) of the base plate (31). The second functional part (20) is fixed upon the base plate (31) such that the substrate (21) is contacted to a main surface (31b) of the base plate (31).

Description

電子モジュールおよびその製造方法Electronic module and manufacturing method thereof
　本発明は、電子モジュールおよびその製造方法、より詳しくは、ヒートシンクを備えた電子モジュールおよびその製造方法に関する。 The present invention relates to an electronic module and a manufacturing method thereof, and more particularly to an electronic module including a heat sink and a manufacturing method thereof.
　従来、電子モジュールの一つとして、入力電力から所望の出力電力を得るためのレギュレータが知られている。図７に示すように、従来のレギュレータ１００は、パワー部１１０、制御部１２０およびヒートシンク１３０を備えている。パワー部１１０は、基板１１１上に実装された半導体スイッチ等の電子部品１１２により電力変換を行う。制御部１２０は、基板１２１上に実装された制御素子等の電子部品１２２によりパワー部１１０を制御する。パワー部１１０と制御部１２０は、接続端子１１３により電気的に接続されている。ヒートシンク１３０は、ベースプレート１３１と、このベースプレート１３１の下面に立設された複数のフィン１３２とを有する。また、レギュレータ１００は、外部接続端子１２３を介して外部の機器と接続される。 Conventionally, a regulator for obtaining desired output power from input power is known as one of electronic modules. As shown in FIG. 7, the conventional regulator 100 includes a power unit 110, a control unit 120, and a heat sink 130. The power unit 110 performs power conversion by an electronic component 112 such as a semiconductor switch mounted on the substrate 111. The control unit 120 controls the power unit 110 by an electronic component 122 such as a control element mounted on the substrate 121. The power unit 110 and the control unit 120 are electrically connected by a connection terminal 113. The heat sink 130 includes a base plate 131 and a plurality of fins 132 erected on the lower surface of the base plate 131. The regulator 100 is connected to an external device via the external connection terminal 123.
　図７に示すように、従来のレギュレータ１００においては、パワー部１１０および制御部１２０のいずれも、ヒートシンク１３０のベースプレート１３１上に設けられている。 As shown in FIG. 7, in the conventional regulator 100, both the power unit 110 and the control unit 120 are provided on the base plate 131 of the heat sink 130.
　なお、特許文献１には、半導体素子を２つのヒートシンクで挟んだ半導体装置が開示されている。 Note that Patent Document 1 discloses a semiconductor device in which a semiconductor element is sandwiched between two heat sinks.
特開２０１２－２２７５３２号公報JP 2012-227532 A
　上記のように、従来の電子モジュールでは、パワー部１１０と制御部１２０が同一平面上に並べて設けられるため、サイズが大きくなってしまう。即ち、従来は、レギュレータ等のヒートシンクを備える電子モジュールを小型化することが困難であるという課題があった。 As described above, in the conventional electronic module, since the power unit 110 and the control unit 120 are provided side by side on the same plane, the size increases. That is, conventionally, there has been a problem that it is difficult to downsize an electronic module including a heat sink such as a regulator.
　さらに、従来の電子モジュールでは、放熱面が一方向のみであるため、大きさの割に放熱性が悪いという課題もあった。 Furthermore, in the conventional electronic module, since the heat radiation surface is only in one direction, there is a problem that the heat radiation performance is poor for the size.
　そこで、本発明は、小型化が可能であり、かつ放熱性を向上させることが可能な電子モジュールを提供することを目的とする。また、本発明は、該電子モジュールの製造性を向上させることが可能な電子モジュールの製造方法を提供することを目的とする。 Therefore, an object of the present invention is to provide an electronic module that can be miniaturized and can improve heat dissipation. Another object of the present invention is to provide an electronic module manufacturing method capable of improving the manufacturability of the electronic module.
　本発明の一態様に係る電子モジュールは、
　第１の基板と、前記第１の基板に実装された第１の電子部品と、前記第１の基板に対向するように配置され且つ前記第１の電子部品に熱的に接続された第２の基板とを有する第１の機能部と、
　第３の基板と、前記第３の基板に実装された第２の電子部品とを有し、前記第１の機能部に電気的に接続された第２の機能部と、
　前記第１および第２の機能部を冷却するヒートシンクと、を備え、
　前記ヒートシンクは、内部に収納部が設けられたベースプレートを有し、
　前記第１の機能部は、前記第１および第２の基板が前記ベースプレートの前記収納部の内壁面に接するように前記収納部内に収納され、
　前記第２の機能部は、前記第３の基板が前記ベースプレートの主面に接するように前記ベースプレート上に固定されている、
　ことを特徴とする。 An electronic module according to an aspect of the present invention includes:
A first substrate; a first electronic component mounted on the first substrate; and a second electronic component disposed to face the first substrate and thermally connected to the first electronic component A first functional unit having a substrate;
A second functional unit having a third substrate and a second electronic component mounted on the third substrate and electrically connected to the first functional unit;
A heat sink for cooling the first and second functional units,
The heat sink has a base plate provided with a storage portion therein,
The first functional unit is stored in the storage unit such that the first and second substrates are in contact with an inner wall surface of the storage unit of the base plate,
The second functional unit is fixed on the base plate so that the third substrate is in contact with the main surface of the base plate.
It is characterized by that.
　また、前記電子モジュールにおいて、
　前記第１の機能部と前記ベースプレートとが互いに嵌合しているようにしてもよい。 In the electronic module,
The first functional unit and the base plate may be fitted to each other.
　また、前記電子モジュールにおいて、
　前記第１の基板および前記第２の基板の少なくともいずれか一方に凹部が設けられ、熱伝導部材が前記収納部の内壁面に接するように前記凹部に配置されているようにしてもよい。 In the electronic module,
A recess may be provided in at least one of the first substrate and the second substrate, and the heat conducting member may be disposed in the recess so as to contact the inner wall surface of the storage unit.
　また、前記電子モジュールにおいて、
　前記収納部内に収納された前記第１の機能部は、前記ベースプレートの前記主面から前記収納部に達する第１の貫通孔と、前記第１の機能部を厚さ方向に貫通する第２の貫通孔とに挿通され、かつ前記収納部の内壁に形成されたネジ穴に螺合するネジにより、前記ヒートシンク内に固定されているようにしてもよい。 In the electronic module,
The first functional part accommodated in the accommodating part includes a first through hole reaching the accommodating part from the main surface of the base plate, and a second penetrating through the first functional part in the thickness direction. You may make it fix in the said heat sink with the screw inserted in the through-hole and screwing in the screw hole formed in the inner wall of the said accommodating part.
　また、前記電子モジュールにおいて、
　前記ネジが前記第３の基板を厚さ方向に貫通する貫通孔に挿通されることにより、前記第２の機能部は前記ベースプレート上に固定されているようにしてもよい。 In the electronic module,
The second functional unit may be fixed on the base plate by inserting the screw into a through hole penetrating the third substrate in the thickness direction.
　また、前記電子モジュールにおいて、
　前記第１の機能部は、前記第２の機能部よりも発熱量が大きいようにしてもよい。 In the electronic module,
The first function unit may generate a larger amount of heat than the second function unit.
　また、前記電子モジュールにおいて、
　前記第１の機能部は、前記第１の機能部に入力された入力電力を所望の出力電力に変換するパワー部であり、前記第２の機能部は、前記パワー部を制御する制御部であるようにしてもよい。 In the electronic module,
The first functional unit is a power unit that converts input power input to the first functional unit into desired output power, and the second functional unit is a control unit that controls the power unit. There may be.
　また、前記電子モジュールにおいて、
　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子が、互いに絶縁されるように、前記ベースプレートの前記主面につながる側面にストライプ状に設けられた複数の溝部にそれぞれ収納されているようにしてもよい。 In the electronic module,
A plurality of connection terminals that electrically connect the first functional unit and the second functional unit are provided in stripes on the side surfaces of the base plate connected to the main surface so as to be insulated from each other. You may make it accommodate in each groove part.
　また、前記電子モジュールにおいて、
　前記ヒートシンクは、
　表面に凹部が形成されたヒートシンク本体と、
　第１の主面と、前記第１の主面と反対側の第２の主面とを有する蓋体と、を有し、
　前記蓋体は、前記第１の主面が前記ヒートシンク本体の前記表面に接し且つ前記凹部を覆うように、前記ヒートシンク本体に取付けられ、前記凹部とともに前記収納部を構成し、前記第２の機能部は、前記蓋体の前記第２の主面に固定されているようにしてもよい。 In the electronic module,
The heat sink is
A heat sink body with a recess formed on the surface;
A lid having a first main surface and a second main surface opposite to the first main surface;
The lid is attached to the heat sink body so that the first main surface is in contact with the surface of the heat sink body and covers the recess, and constitutes the storage portion together with the recess, and the second function The part may be fixed to the second main surface of the lid.
　また、前記電子モジュールにおいて、
　前記第１の機能部は、前記蓋体の前記第１の主面に固定されているようにしてもよい。 In the electronic module,
The first functional unit may be fixed to the first main surface of the lid.
　また、前記電子モジュールにおいて、
　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子は、互いに絶縁されるように、前記蓋体を厚さ方向に貫通する貫通孔に挿通されているようにしてもよい。 In the electronic module,
The plurality of connection terminals that electrically connect the first functional unit and the second functional unit are inserted into through holes that penetrate the lid in the thickness direction so as to be insulated from each other. You may do it.
　また、前記電子モジュールにおいて、
　前記収納部は前記ヒートシンク本体の前記凹部と前記蓋体とにより密閉され、前記第１の機能部は、前記ヒートシンク内に密閉状態に収納されているようにしてもよい。 In the electronic module,
The storage part may be sealed by the recess of the heat sink body and the lid, and the first functional part may be stored in a sealed state in the heat sink.
　本発明の一態様に係る電子モジュールの製造方法は、
　第１の電子部品が実装された第１の基板および前記第１の基板に対向するように配置され且つ前記第１の電子部品に熱的に接続された第２の基板を有する第１の機能部と、第２の電子部品が実装された第３の基板を有する第２の機能部と、ベースプレートを有し、前記第１および第２の機能部を冷却するヒートシンクとを備える電子モジュールの製造方法であって、
　前記第１の基板および前記第２の基板の少なくともいずれか一方に設けられた凹部に、前記凹部の深さに等しい厚みを有する熱伝導部材を配置する工程と、
　前記熱伝導部材が前記ベースプレートの内部に設けられた収納部の内壁面に接するように、前記第１の機能部を前記収納部内に収納する工程と、
　前記第３の基板が前記ベースプレートの主面に接するように前記第２の機能部を前記ベースプレート上に固定する工程と、
　を備えることを特徴とする。 An electronic module manufacturing method according to an aspect of the present invention includes:
A first function having a first substrate on which a first electronic component is mounted, and a second substrate disposed so as to face the first substrate and thermally connected to the first electronic component Of an electronic module comprising: a second functional part having a third substrate on which a second electronic component is mounted; and a heat sink having a base plate and cooling the first and second functional parts A method,
Disposing a heat conductive member having a thickness equal to the depth of the recess in a recess provided in at least one of the first substrate and the second substrate;
Storing the first functional unit in the storage unit such that the heat conducting member is in contact with an inner wall surface of a storage unit provided in the base plate;
Fixing the second functional unit on the base plate such that the third substrate is in contact with the main surface of the base plate;
It is characterized by providing.
　本発明の一態様に係る電子モジュールの製造方法は、
　第１の電子部品が実装された第１の基板および前記第１の基板に対向するように配置され且つ前記第１の電子部品に熱的に接続された第２の基板を有する第１の機能部と、第２の電子部品が実装された第２の基板を有する第２の機能部と、前記第１の機能部の厚さに等しい深さの凹部が設けられたヒートシンク本体と蓋体とを有するヒートシンクとを備える電子モジュールの製造方法であって、
　前記第１の機能部を、前記第１の基板が前記蓋体の一方の主面に接するように前記蓋体に固定する工程と、
　前記第１の機能部が前記ヒートシンク本体の前記凹部に収納され且つ前記第２の基板が前記凹部の底面に接するように、前記蓋体を前記ヒートシンク本体に取付ける工程と、
　前記第２の機能部を、前記第２の基板が前記蓋体の他方の主面に接するように前記蓋体に固定する工程と、
　を備えることを特徴とする。 An electronic module manufacturing method according to an aspect of the present invention includes:
A first function having a first substrate on which a first electronic component is mounted, and a second substrate disposed so as to face the first substrate and thermally connected to the first electronic component A second functional unit having a second substrate on which a second electronic component is mounted, a heat sink body provided with a recess having a depth equal to the thickness of the first functional unit, and a lid body A method of manufacturing an electronic module comprising a heat sink having:
Fixing the first functional unit to the lid so that the first substrate is in contact with one main surface of the lid;
Attaching the lid to the heat sink body such that the first functional part is housed in the recess of the heat sink body and the second substrate is in contact with the bottom surface of the recess;
Fixing the second functional unit to the lid so that the second substrate is in contact with the other main surface of the lid;
It is characterized by providing.
　本発明に係る電子モジュールでは、ヒートシンクは、内部に収納部が設けられたベースプレートを有し、第１の機能部は、第１および第２の基板がベースプレートの収納部の内壁面に接するように収納部内に収納され、第２の機能部は、第２の基板がベースプレートの主面に接するようにベースプレート上に固定されている。これにより、本発明によれば、ベースプレート上に第１の機能部を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。さらに、第１の機能部から発せられる熱は第１および第２の基板の二面からヒートシンクに放熱されることになるため、電子モジュールの放熱性を向上させることができる。 In the electronic module according to the present invention, the heat sink has a base plate provided with a storage portion therein, and the first functional unit is such that the first and second substrates are in contact with the inner wall surface of the storage portion of the base plate. The second functional unit is housed in the housing unit, and is fixed on the base plate so that the second substrate is in contact with the main surface of the base plate. Thereby, according to this invention, the area | region which installs a 1st function part on a baseplate becomes unnecessary, and an electronic module can be reduced in size significantly. Furthermore, since the heat generated from the first functional unit is radiated from the two surfaces of the first and second substrates to the heat sink, the heat dissipation of the electronic module can be improved.
　また、本発明の一態様に係る電子モジュールの製造方法では、第１の基板および第２の基板の少なくともいずれか一方に設けられた凹部に、凹部の深さに等しい厚みを有する熱伝導部材を配置し、その後、熱伝導部材がベースプレートの内部に設けられた収納部の内壁面に接するように、第１の機能部を前記収納部内に収納する。これにより、第１の機能部をヒートシンクの収納部に収納する際、熱伝導部材が収納部の開口に引っかかって破れたり丸まったりすることや、収納部の開口端に付着することを防止できる。その結果、本発明によれば、小型化が可能であり、かつ放熱性を向上させることが可能な電子モジュールの製造性を向上させることができる。 In the method for manufacturing an electronic module according to one aspect of the present invention, a heat conductive member having a thickness equal to the depth of the recess is provided in the recess provided in at least one of the first substrate and the second substrate. After that, the first functional unit is stored in the storage unit such that the heat conducting member is in contact with the inner wall surface of the storage unit provided inside the base plate. Thus, when the first functional unit is stored in the storage unit of the heat sink, it is possible to prevent the heat conducting member from being caught by the opening of the storage unit and being torn or curled or adhering to the opening end of the storage unit. As a result, according to the present invention, it is possible to improve the manufacturability of an electronic module that can be miniaturized and can improve heat dissipation.
　また、本発明の一態様に係る電子モジュールの製造方法では、第１の機能部をヒートシンクの収納部に収納する際、第１の機能部を、第１の基板がヒートシンクの蓋体の一方の主面に接するように蓋体に固定し、その後、第１の機能部がヒートシンク本体の凹部に収納され且つ第２の基板が凹部の底面に接するように、蓋体をヒートシンク本体に取付ける。これにより、本発明によれば、第１の機能部をヒートシンクの収納部に対して高精度に位置合せする必要がなくなり、第１の機能部を容易に収納部内に収納でき、その結果、小型化が可能であり、かつ放熱性を向上させることが可能な電子モジュールの製造性を向上させることができる。 In the method for manufacturing an electronic module according to one aspect of the present invention, when the first functional unit is stored in the heat sink storage unit, the first functional unit is connected to one of the lids of the heat sink. The lid is fixed to the heat sink body so that the first functional part is accommodated in the recess of the heat sink body and the second substrate is in contact with the bottom surface of the recess. Thereby, according to this invention, it becomes unnecessary to align a 1st functional part with the storage part of a heat sink with high precision, and a 1st functional part can be easily accommodated in a storage part, As a result, small size Therefore, it is possible to improve the manufacturability of an electronic module that can improve the heat dissipation.
第１の実施形態に係る電子モジュール１の斜視図である。1 is a perspective view of an electronic module 1 according to a first embodiment. 第１の実施形態に係る電子モジュール１の断面図である。It is sectional drawing of the electronic module 1 which concerns on 1st Embodiment. （ａ）は第１の実施形態に係る電子モジュール１の基板１３の断面図であり、（ｂ）は該電子モジュールの基板１１の断面図である。(A) is sectional drawing of the board | substrate 13 of the electronic module 1 which concerns on 1st Embodiment, (b) is sectional drawing of the board | substrate 11 of this electronic module. （ａ）は、第２の実施形態に係る電子モジュール２のヒートシンクのヒートシンク本体の斜視図であり、（ｂ）は、該ヒートシンクの蓋体の斜視図である。(A) is a perspective view of the heat sink main body of the heat sink of the electronic module 2 which concerns on 2nd Embodiment, (b) is a perspective view of the cover body of this heat sink. 第２の実施形態に係る電子モジュール２の断面図である。It is sectional drawing of the electronic module 2 which concerns on 2nd Embodiment. 第２の実施形態の変形例に係るヒートシンク本体の斜視図である。It is a perspective view of the heat sink main body which concerns on the modification of 2nd Embodiment. 従来の電子モジュール（レギュレータ）１００の斜視図である。1 is a perspective view of a conventional electronic module (regulator) 100. FIG.
　以下、図面を参照しつつ本発明の実施形態について説明する。なお、各図において同等の機能を有する構成要素には同一の符号を付し、同一符号の構成要素の詳しい説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated.
（第１の実施形態）
　本発明の第１の実施形態に係る電子モジュール１について、図１～図３を参照しつつ説明する。図１および図２はそれぞれ、第１の実施形態に係る電子モジュール１の斜視図および断面図を示している。より詳しくは、図２は、電子モジュール１の、２本のネジ４０，４０の中心線を通る平面に沿う断面図である。また、図３（ａ）は電子モジュール１の基板１３の断面図であり、図３（ｂ）は電子モジュール１の基板１１の断面図である。 (First embodiment)
An electronic module 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2 show a perspective view and a cross-sectional view of the electronic module 1 according to the first embodiment, respectively. More specifically, FIG. 2 is a cross-sectional view of the electronic module 1 along a plane passing through the center line of the two screws 40 and 40. FIG. 3A is a cross-sectional view of the substrate 13 of the electronic module 1, and FIG. 3B is a cross-sectional view of the substrate 11 of the electronic module 1.
　電子モジュール１は、図１に示すように、第１の機能部１０と、第２の機能部２０と、ヒートシンク３０とを備えている。 As shown in FIG. 1, the electronic module 1 includes a first functional unit 10, a second functional unit 20, and a heat sink 30.
　図１および図２に示すように、第１の機能部１０は、基板１１および基板１３がベースプレート３１の収納部３１ａ１の内壁面に接するように、収納部３１ａ１内に収納されている。なお、基板１１および基板１３は、収納部３１ａ１の内壁面に直接接してもよいし、熱伝導部材（放熱シート、放熱グリスなど）を介して内壁面に接してもよい。 As shown in FIGS. 1 and 2, the first functional unit 10 is stored in the storage unit 31a1 so that the substrate 11 and the substrate 13 are in contact with the inner wall surface of the storage unit 31a1 of the base plate 31. In addition, the board | substrate 11 and the board | substrate 13 may be in contact with the inner wall face of the accommodating part 31a1, and may be in contact with an inner wall face via a heat conductive member (a thermal radiation sheet, thermal radiation grease, etc.).
　第１の機能部１０は、例えば、第１の機能部１０に入力された入力電力を所望の出力電力に変換するパワー部である。図２に示すように、第１の機能部１０は、基板１１（第１の基板）と、基板１１に実装された電子部品１２（第１の電子部品）と、基板１１に対向するように配置され且つ電子部品１２に熱的に接続された基板１３（第２の基板）とを有する。 The first functional unit 10 is a power unit that converts input power input to the first functional unit 10 into desired output power, for example. As shown in FIG. 2, the first functional unit 10 faces the substrate 11 (first substrate), the electronic component 12 (first electronic component) mounted on the substrate 11, and the substrate 11. And a substrate 13 (second substrate) disposed and thermally connected to the electronic component 12.
　電子部品１２は、例えば半導体スイッチであり、熱伝導性接続部材１７を介して基板１３に熱的に接続されている。この熱伝導性接続部材１７は、例えば、銅やアルミニウム等の金属からなる柱状の導体である。なお、熱伝導性接続部材１７を介さずに、電子部品１２と基板１３とが直接接続されてもよい。 The electronic component 12 is, for example, a semiconductor switch, and is thermally connected to the substrate 13 via a heat conductive connection member 17. The heat conductive connecting member 17 is a columnar conductor made of a metal such as copper or aluminum. In addition, the electronic component 12 and the board | substrate 13 may be directly connected not via the heat conductive connection member 17. FIG.
　また、好ましくは、図１および図２に示すように、基板１１と基板１３との間は、封止樹脂１４により封止されている。封止樹脂１４は、電子部品１２および熱伝導性接続部材１７を埋設している。 Further, preferably, as shown in FIGS. 1 and 2, the space between the substrate 11 and the substrate 13 is sealed with a sealing resin 14. The sealing resin 14 embeds the electronic component 12 and the heat conductive connection member 17.
　次に、基板１１および基板１３の構成について説明する。基板１１は、図３（ｂ）に示すように、セラミックなどの絶縁材料からなる絶縁基材１１ａと、絶縁基材１１ａ上に設けられた導体層１１ｂ，１１ｃとを有する。導体層１１ｂ，１１ｃは銅箔などからなる。導体層１１ｂは所定のパターンに加工されており、導体層１１ｂに電子部品１２が接合される。導体層１１ｃは、収納部３１ａ１の内壁面に接する。なお、基板１１は、導体層１１ｃを備えなくてもよい。 Next, the configuration of the substrate 11 and the substrate 13 will be described. As shown in FIG. 3B, the substrate 11 includes an insulating base material 11a made of an insulating material such as ceramic, and conductor layers 11b and 11c provided on the insulating base material 11a. The conductor layers 11b and 11c are made of copper foil or the like. The conductor layer 11b is processed into a predetermined pattern, and the electronic component 12 is joined to the conductor layer 11b. The conductor layer 11c contacts the inner wall surface of the storage portion 31a1. In addition, the board | substrate 11 does not need to be provided with the conductor layer 11c.
　基板１３は、図３（ａ）に示すように、セラミックなどの絶縁材料からなる絶縁基材１３ａと、絶縁基材１３ａ上に設けられた導体層１３ｂ，１３ｃとを有する。導体層１３ｂ，１３ｃは銅箔などからなる。熱伝導性接続部材１７（または電子部品１２）は、接合材（はんだ又は接着剤等）を介して導体層１３ｂに接合される。導体層１３ｃは、収納部３１ａ１の内壁面に接する。なお、基板１３は、導体層１３ｂおよび／または導体層１３ｃを備えなくてもよい。 As shown in FIG. 3A, the substrate 13 includes an insulating base 13a made of an insulating material such as ceramic, and conductor layers 13b and 13c provided on the insulating base 13a. The conductor layers 13b and 13c are made of copper foil or the like. The thermally conductive connecting member 17 (or the electronic component 12) is joined to the conductor layer 13b via a joining material (such as solder or adhesive). The conductor layer 13c is in contact with the inner wall surface of the storage portion 31a1. In addition, the board | substrate 13 does not need to be provided with the conductor layer 13b and / or the conductor layer 13c.
　図１および図２に示すように、ベースプレート３１の主面３１ｂには、第２の機能部２０が配置されている。第２の機能部２０は、例えば、パワー部の半導体スイッチを制御する制御部である。この第２の機能部２０は、基板２１と、基板２１に実装された電子部品２２（第２の電子部品）とを有する。基板２１は、基板１１と同様、セラミックなどの絶縁材料からなる絶縁基材と、該絶縁基材上に設けられ、所定のパターンに加工された銅箔などの導体層とを有する。そして、該導体層に電子部品２２が接合されている。 As shown in FIGS. 1 and 2, the second functional unit 20 is arranged on the main surface 31 b of the base plate 31. The second function unit 20 is, for example, a control unit that controls the semiconductor switch of the power unit. The second functional unit 20 includes a substrate 21 and an electronic component 22 (second electronic component) mounted on the substrate 21. Similarly to the substrate 11, the substrate 21 includes an insulating base material made of an insulating material such as ceramic, and a conductor layer such as a copper foil provided on the insulating base material and processed into a predetermined pattern. And the electronic component 22 is joined to this conductor layer.
　ヒートシンク３０は、図１および図２に示すように、第１の機能部１０および第２の機能部２０を冷却するためのものであり、内部に収納部３１ａ１が設けられたベースプレート３１と、ベースプレート３１に立設された複数のフィン３２とを有する。 As shown in FIGS. 1 and 2, the heat sink 30 is for cooling the first functional unit 10 and the second functional unit 20, and includes a base plate 31 in which a storage unit 31a1 is provided, and a base plate And a plurality of fins 32 erected on 31.
　ベースプレート３１は、略直方体状であり、主面（上面）３１ｂと、主面３１ｂにつながる側面３１ｃと、側面３１ｃと反対側の側面３１ｄとを有する。 The base plate 31 has a substantially rectangular parallelepiped shape, and has a main surface (upper surface) 31b, a side surface 31c connected to the main surface 31b, and a side surface 31d opposite to the side surface 31c.
　ベースプレート３１内に設けられた収納部３１ａ１は、第１の機能部１０を収納するスペースである。この収納部３１ａ１は、例えば、側面３１ｃから側面３１ｄまで貫通する貫通孔からなる。なお、収納部３１ａ１は、側面３１ｃに形成された凹部からなるようにしてもよい。この場合、ベースプレート３１の側面３１ｄは開口しない。収納部３１ａ１は、ベースプレート３１内に第１の機能部１０を収納可能に構成されていればよく、貫通孔や凹部に限定されない。 The storage portion 31 a 1 provided in the base plate 31 is a space for storing the first functional unit 10. For example, the storage portion 31a1 includes a through-hole penetrating from the side surface 31c to the side surface 31d. In addition, you may make it the accommodating part 31a1 consist of a recessed part formed in the side surface 31c. In this case, the side surface 31d of the base plate 31 does not open. The storage portion 31a1 only needs to be configured to be able to store the first functional unit 10 in the base plate 31, and is not limited to a through hole or a recess.
　ベースプレート３１の側面３１ｃには、図１に示すように、ストライプ状に設けられた複数の溝部３３が設けられている。後述するように、溝部３３内に接続端子１５が収納されている。 As shown in FIG. 1, a plurality of groove portions 33 provided in a stripe shape are provided on the side surface 31 c of the base plate 31. As will be described later, the connection terminal 15 is accommodated in the groove 33.
　図３に示すように、基板１１および基板１３の、収納部３１ａ１の内壁面と対向する主面には、谷形の嵌合部１８が設けられている。そして、図１および図２に示すように、第１の機能部１０とベースプレート３１とは、互いに嵌合している。これにより、収納部３１ａ１内に第１の機能部１０を精度良く配置することができる。加えて、第１の機能部１０とベースプレート３１との接触面積が増大するため、電子モジュールの放熱性をさらに高めることができる。 As shown in FIG. 3, a valley-shaped fitting portion 18 is provided on the main surface of the substrate 11 and the substrate 13 facing the inner wall surface of the storage portion 31a1. As shown in FIGS. 1 and 2, the first functional unit 10 and the base plate 31 are fitted to each other. Thereby, the 1st function part 10 can be arranged with sufficient accuracy in storage part 31a1. In addition, since the contact area between the first functional unit 10 and the base plate 31 increases, the heat dissipation of the electronic module can be further enhanced.
　嵌合部１８は、基板１１および基板１３のいずれか一方にのみ設けてもよい。また、嵌合部１８の形状は、山形・谷形に限らず、基板１１または基板１３と、収納部３１ａ１の内壁面とが嵌合する形状であればよい。 The fitting portion 18 may be provided only on one of the substrate 11 and the substrate 13. Further, the shape of the fitting portion 18 is not limited to the mountain shape or the valley shape, and may be any shape that allows the substrate 11 or the substrate 13 and the inner wall surface of the storage portion 31a1 to be fitted.
　第２の機能部２０は、図１および図２に示すように、基板２１がベースプレート３１の主面３１ｂに接するように、ベースプレート３１上に固定されている。 The second functional unit 20 is fixed on the base plate 31 so that the substrate 21 contacts the main surface 31b of the base plate 31, as shown in FIGS.
　また、第２の機能部２０は、図１に示すように、複数の接続端子１５により、第１の機能部１０に電気的に接続されている。これらの接続端子１５は、互いに絶縁されるように、ベースプレート３１の側面３１ｃに設けられた複数の溝部３３にそれぞれ収納されている。これにより、接続端子１５がヒートシンク３０の外に飛び出さないため、電子モジュール１をより小型化することができる。 The second function unit 20 is electrically connected to the first function unit 10 through a plurality of connection terminals 15 as shown in FIG. These connection terminals 15 are respectively accommodated in a plurality of groove portions 33 provided on the side surface 31c of the base plate 31 so as to be insulated from each other. Thereby, since the connection terminal 15 does not jump out of the heat sink 30, the electronic module 1 can be further reduced in size.
　ここで、第１の機能部１０および第２の機能部２０の固定方法について、図２を参照して説明する。収納部３１ａ１内に収納された第１の機能部１０は、ネジ４０によりヒートシンク３０内に固定されている。ネジ４０は、ベースプレート３１の主面３１ｂから収納部３１ａ１に達する貫通孔３４と、第１の機能部１０を厚さ方向に貫通する貫通孔１６とに挿通され、かつ収納部３１ａ１の内壁に形成されたネジ穴３５に螺合している。 Here, a method of fixing the first functional unit 10 and the second functional unit 20 will be described with reference to FIG. The first functional unit 10 stored in the storage unit 31 a 1 is fixed in the heat sink 30 by screws 40. The screw 40 is inserted into the through hole 34 that reaches the housing part 31a1 from the main surface 31b of the base plate 31 and the through hole 16 that penetrates the first functional part 10 in the thickness direction, and is formed on the inner wall of the housing part 31a1. The screw hole 35 is screwed.
　第２の機能部２０は、図２に示すように、ネジ４０が基板２１を厚さ方向に貫通する貫通孔２４に挿通されることにより、ベースプレート３１上に固定されている。これにより、第１および第２の機能部１０，２０を少ない数のネジでヒートシンク３０に固定することができる。なお、第１の機能部１０と第２の機能部２０は、別個のネジによりヒートシンク３０にそれぞれ固定されてもよい。 As shown in FIG. 2, the second functional unit 20 is fixed on the base plate 31 by inserting a screw 40 through a through hole 24 that penetrates the substrate 21 in the thickness direction. Thereby, the 1st and 2nd function parts 10 and 20 can be fixed to the heat sink 30 with a small number of screws. The first functional unit 10 and the second functional unit 20 may be fixed to the heat sink 30 with separate screws, respectively.
　図２および図３（ａ），（ｂ）に示すように、好ましくは、放熱シートまたは放熱グリスなどの熱伝導部材１１ｅ，１３ｅが、導体層１１ｃ，１３ｃに設けられた凹部１１ｄ，１３ｄ内に配置される。より詳しくは、熱伝導部材１１ｅ，１３ｅは、収納部３１ａ１の内壁面に接するように凹部１１ｄ，１３ｄ内に配置される。また、熱伝導部材１１ｅ，１３ｅは、凹部１１ｄ，１３ｄの深さにほぼ等しい厚みを有する。 As shown in FIGS. 2 and 3 (a), 3 (b), preferably, heat conducting members 11e, 13e such as a heat radiating sheet or heat radiating grease are placed in the recesses 11d, 13d provided in the conductor layers 11c, 13c. Be placed. More specifically, the heat conducting members 11e and 13e are disposed in the recesses 11d and 13d so as to be in contact with the inner wall surface of the storage portion 31a1. The heat conducting members 11e and 13e have a thickness substantially equal to the depth of the recesses 11d and 13d.
　なお、基板１１が導体層１１ｃを備えない場合は、熱伝導部材を収納する凹部を絶縁基材１１ａに設けてもよい。同様に、基板１３が導体層１３ｃを備えない場合は、熱伝導部材を収納する凹部を絶縁基材１３ａに設けてもよい。また、基板１１および基板１３のいずれか一方にのみ熱伝導部材を収納する凹部を設けてもよい。 In addition, when the board | substrate 11 is not provided with the conductor layer 11c, you may provide the recessed part which accommodates a heat conductive member in the insulating base material 11a. Similarly, when the substrate 13 does not include the conductor layer 13c, a concave portion for accommodating the heat conducting member may be provided in the insulating base material 13a. Moreover, you may provide the recessed part which accommodates a heat conductive member only in either the board | substrate 11 and the board | substrate 13. FIG.
　このように、収納部の内壁面に対向する基板１１および／または基板１３の主面に凹部が設けられ、熱伝導部材が収納部の内壁面に接するように該凹部に配置されるようにすることで、凹部１１ｄの設けられていない基板１１と収納部３１ａ１の内壁面との間に熱伝導部材１１ｅを配置する場合に比して、絶縁基材１１ａとヒートシンク３０間の距離が凹部１１ｄの深さ分だけ短くなる（基板１３についても同様）。その結果、電子モジュール１の放熱性をさらに向上させることができる。 As described above, the concave portion is provided on the main surface of the substrate 11 and / or the substrate 13 facing the inner wall surface of the storage portion, and the heat conducting member is arranged in the concave portion so as to contact the inner wall surface of the storage portion. Thus, the distance between the insulating base material 11a and the heat sink 30 is less than that of the recess 11d as compared with the case where the heat conducting member 11e is disposed between the substrate 11 where the recess 11d is not provided and the inner wall surface of the storage portion 31a1. It becomes shorter by the depth (the same applies to the substrate 13). As a result, the heat dissipation of the electronic module 1 can be further improved.
　以上説明したように、第１の実施形態に係る電子モジュール１では、第１の機能部１０は収納部３１ａ１内に収納されるため、ベースプレート３１上に第１の機能部１０を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。 As described above, in the electronic module 1 according to the first embodiment, since the first functional unit 10 is stored in the storage unit 31a1, there is an area where the first functional unit 10 is installed on the base plate 31. It becomes unnecessary and the electronic module can be greatly reduced in size.
　さらに、第１の機能部１０から発せられる熱は、基板１１および基板１３の二面からヒートシンク３０に放熱されることになるため、電子モジュールの放熱性を向上させることができる。このように、第１の機能部１０の放熱性が高まることから、電子モジュール全体の放熱効率を考慮すると、第１の機能部１０は第２の機能部２０よりも発熱量が大きいことが好ましい。 Furthermore, since the heat generated from the first functional unit 10 is radiated from the two surfaces of the substrate 11 and the substrate 13 to the heat sink 30, the heat dissipation of the electronic module can be improved. Thus, since the heat dissipation of the 1st function part 10 increases, when the heat dissipation efficiency of the whole electronic module is considered, it is preferable that the 1st function part 10 has a larger calorific value than the 2nd function part 20. .
　次に、第１の実施形態に係る電子モジュール１の製造方法について説明する。 Next, a method for manufacturing the electronic module 1 according to the first embodiment will be described.
　まず、第１の機能部１０を以下の手順で作製する。基板１１の所定の位置にクリームはんだを塗布し、その上に電子部品１２を載置する。次に、熱伝導性接続部材１７を、接合材（はんだ又は熱硬化性接着剤等）を介して電子部品１２の上に載置する。次に、基板１３を、接合材（はんだ又は熱硬化性接着剤等）を介して熱伝導性接続部材１７の上に載置する。次に、このようにして得られた組立体に加熱処理（リフロー）を施して、接合部分を固定する。次に、トランスファーモールド等により、基板１１と基板１３との間に樹脂を注入し、電子部品１２および熱伝導性接続部材１７を埋設する封止樹脂１４を形成する。 First, the first functional unit 10 is manufactured by the following procedure. Cream solder is applied to a predetermined position of the substrate 11, and the electronic component 12 is placed thereon. Next, the heat conductive connection member 17 is placed on the electronic component 12 via a bonding material (solder, thermosetting adhesive, or the like). Next, the substrate 13 is placed on the heat conductive connecting member 17 via a bonding material (solder or thermosetting adhesive or the like). Next, the assembly thus obtained is subjected to a heat treatment (reflow) to fix the joint portion. Next, a resin is injected between the substrate 11 and the substrate 13 by transfer molding or the like to form the sealing resin 14 in which the electronic component 12 and the heat conductive connection member 17 are embedded.
　次に、基板１１および基板１３に設けられた凹部１１ｄ，１３ｄに熱伝導部材１１ｅ，１３ｅを配置する。熱伝導部材１１ｅ，１３ｅが放熱シートの場合は、凹部１１ｄ，１３ｄの深さにほぼ等しい厚みを有する放熱シートを凹部１１ｅ，１３ｅ内に貼り付ける。また、熱伝導部材１１ｅ，１３ｅが放熱グリスの場合は、放熱グリスの表面が基板１１，１３の表面と面一になるように、凹部１１ｅ，１３ｅ内に放熱グリスを充填する。なお、上記の組立体を作製する前に予め、凹部１１ｄ，１３ｄに熱伝導部材１１ｅ，１３ｅを配置しておいてもよい。 Next, the heat conducting members 11e and 13e are disposed in the recesses 11d and 13d provided in the substrate 11 and the substrate 13, respectively. When the heat conducting members 11e and 13e are heat radiating sheets, a heat radiating sheet having a thickness substantially equal to the depth of the concave portions 11d and 13d is stuck in the concave portions 11e and 13e. Further, when the heat conducting members 11e and 13e are heat radiation grease, the heat radiation grease is filled in the recesses 11e and 13e so that the surface of the heat radiation grease is flush with the surfaces of the substrates 11 and 13. In addition, before producing said assembly, you may arrange | position the heat conductive members 11e and 13e in the recessed parts 11d and 13d previously.
　上記工程を経て、図２に示す第１の機能部１０が作製される。 Through the above steps, the first functional unit 10 shown in FIG. 2 is produced.
　次に、熱伝導部材１１ｅ，１３ｅがベースプレート３１の内部に設けられた収納部３１ａ１の内壁面に接するように、第１の機能部１０を収納部３１ａ１内に収納する。 Next, the first functional unit 10 is stored in the storage unit 31a1 so that the heat conducting members 11e and 13e are in contact with the inner wall surface of the storage unit 31a1 provided in the base plate 31.
　次に、第２の機能部２０の基板２１がベースプレート３１の主面３１ｂに接するように、第２の機能部２０をベースプレート３１上に固定する。 Next, the second functional unit 20 is fixed on the base plate 31 so that the substrate 21 of the second functional unit 20 contacts the main surface 31 b of the base plate 31.
　上記の電子モジュールの製造方法によれば、第１の機能部１０を収納部３１ａ１に収納する際、熱伝導部材１１ｅ，１３ｅが基板１１，基板１３の主面から出っ張らないため、放熱シートが収納部の開口に引っかかって破れたり丸まったりすることや、放熱グリスが収納部の開口端に付着することを防止できる。その結果、電子モジュール１の製造性を向上させることができる。 According to the above electronic module manufacturing method, when the first functional unit 10 is stored in the storage unit 31a1, the heat conducting members 11e and 13e do not protrude from the main surfaces of the substrate 11 and the substrate 13, and thus the heat dissipation sheet is stored. It can be prevented from being broken or rounded by being caught in the opening of the part, and heat radiation grease from adhering to the opening end of the storage part. As a result, the manufacturability of the electronic module 1 can be improved.
（第２の実施形態）
　次に、本発明の第２の実施形態について、図４および図５を参照して説明する。図４（ａ）は、本実施形態に係る電子モジュール２のヒートシンク３０のヒートシンク本体３６の斜視図である。図４（ｂ）は、ヒートシンク３０の蓋体３７の斜視図である。図５は、第２の実施形態に係る電子モジュール２の断面図である。より詳しくは、図５は、電子モジュール２の、接続端子１５を含む平面に沿う断面図である。 (Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. 4 and FIG. FIG. 4A is a perspective view of the heat sink body 36 of the heat sink 30 of the electronic module 2 according to this embodiment. FIG. 4B is a perspective view of the lid 37 of the heat sink 30. FIG. 5 is a cross-sectional view of the electronic module 2 according to the second embodiment. More specifically, FIG. 5 is a cross-sectional view of the electronic module 2 along a plane including the connection terminals 15.
　第２の実施形態と第１の実施形態との相違点の一つは、ヒートシンク３０の構成である。以下、この相違点を中心に第２の実施形態について説明する。 One of the differences between the second embodiment and the first embodiment is the configuration of the heat sink 30. Hereinafter, the second embodiment will be described focusing on this difference.
　第２の実施形態では、ヒートシンク３０は、ヒートシンク本体３６と、蓋体３７とを有する。蓋体３７がヒートシンク本体３６に取付けられて、ヒートシンク３０が構成される。 In the second embodiment, the heat sink 30 includes a heat sink body 36 and a lid body 37. A lid 37 is attached to the heat sink body 36 to constitute the heat sink 30.
　ヒートシンク本体３６は、図４（ａ）に示すように、表面（上面）３６ｂに凹部３６ａが形成されている。凹部３６ａの深さは、第１の機能部１０の厚さにほぼ等しい。また、凹部３６ａは、ヒートシンク本体３６の側面３６ｃおよび側面３６ｄに開口している。図４（ａ）において、側面３６ｃは正面側の側面であり、側面３６ｄは背面側の側面である。 As shown in FIG. 4A, the heat sink body 36 has a recess 36a formed on a surface (upper surface) 36b. The depth of the recess 36 a is substantially equal to the thickness of the first functional unit 10. Further, the recess 36a is open to the side surface 36c and the side surface 36d of the heat sink body 36. In FIG. 4A, the side surface 36c is a front side surface, and the side surface 36d is a back side surface.
　蓋体３７は、図４（ｂ）に示すように、主面３７ａと、主面３７ａと反対側の主面３７ｂとを有する。蓋体３７は、主面３７ａがヒートシンク本体３６の表面３６ｂに接し且つ凹部３６ａを覆うように、ヒートシンク本体３６に取付けられる。蓋体３７の主面３７ｂは、ベースプレート３１の主面３１ｂとなる。そして、図５に示すように、蓋体３７は、ヒートシンク本体３６の凹部３６ａとともに、第１の機能部１０を収納する収納部３１ａ２を構成する。 As shown in FIG. 4B, the lid body 37 has a main surface 37a and a main surface 37b opposite to the main surface 37a. The lid 37 is attached to the heat sink body 36 so that the main surface 37a is in contact with the surface 36b of the heat sink body 36 and covers the recess 36a. The main surface 37 b of the lid body 37 becomes the main surface 31 b of the base plate 31. As shown in FIG. 5, the lid body 37 constitutes a storage portion 31 a 2 that stores the first functional portion 10 together with the recess 36 a of the heat sink body 36.
　第１の機能部１０は、図５に示すように、例えばネジ止めにより、蓋体３７の主面３７ａに固定されている。なお、第１の機能部１０は、凹部３６ａの底面に固定されてもよい。第２の機能部２０は、図５に示すように、例えばネジ止めにより、蓋体３７の主面３７ｂに固定されている。 As shown in FIG. 5, the first functional unit 10 is fixed to the main surface 37 a of the lid 37 by, for example, screwing. The first functional unit 10 may be fixed to the bottom surface of the recess 36a. As shown in FIG. 5, the second functional unit 20 is fixed to the main surface 37 b of the lid 37 by, for example, screwing.
　また、図４（ｂ）に示すように、蓋体３７には、蓋体３７を厚さ方向に貫通する貫通孔３８が設けられている。図５に示すように、第１の機能部１０と第２の機能部２０とを電気的に接続する複数の接続端子１５が、互いに絶縁されるように、各々の貫通孔３８に挿通されている。これにより、接続端子１５がヒートシンク３０の外に飛び出さないため、電子モジュール２をより小型化することができる。 Further, as shown in FIG. 4B, the lid body 37 is provided with a through hole 38 that penetrates the lid body 37 in the thickness direction. As shown in FIG. 5, a plurality of connection terminals 15 that electrically connect the first functional unit 10 and the second functional unit 20 are inserted into the respective through holes 38 so as to be insulated from each other. Yes. Thereby, since the connection terminal 15 does not jump out of the heat sink 30, the electronic module 2 can be further reduced in size.
　第２の実施形態に係る電子モジュール２では、第１の実施形態と同様、第１の機能部１０は収納部３１ａ１内に収納される。このため、ベースプレート３１上に第１の機能部１０を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。 In the electronic module 2 according to the second embodiment, as in the first embodiment, the first functional unit 10 is housed in the housing unit 31a1. For this reason, the area | region which installs the 1st function part 10 on the baseplate 31 becomes unnecessary, and an electronic module can be reduced in size significantly.
　さらに、第１の機能部１０から発せられる熱は、基板１１および基板１３の二面からヒートシンク３０に放熱されることになるため、電子モジュールの放熱性を向上させることができる。 Furthermore, since the heat generated from the first functional unit 10 is radiated from the two surfaces of the substrate 11 and the substrate 13 to the heat sink 30, the heat dissipation of the electronic module can be improved.
　なお、図６に示すように、ヒートシンク本体３６の凹部３６ａは、ヒートシンク本体３６の側面３６ｃおよび３６ｄに開口しないように設けてもよい。この場合、収納部３１ａ２はヒートシンク本体３６の凹部３６ａと蓋体３７とにより密閉され、第１の機能部１０は、ヒートシンク３０内に密閉状態に収納される。これにより、電子モジュールの動作に伴って外部に放出される電磁波を低減するとともに、外部からの電磁波による電子モジュールの動作への影響を抑制することができる。 As shown in FIG. 6, the recess 36 a of the heat sink body 36 may be provided so as not to open on the side surfaces 36 c and 36 d of the heat sink body 36. In this case, the storage portion 31 a 2 is sealed by the recess 36 a of the heat sink body 36 and the lid body 37, and the first functional unit 10 is stored in the heat sink 30 in a sealed state. Accordingly, it is possible to reduce the electromagnetic wave emitted to the outside along with the operation of the electronic module and to suppress the influence on the operation of the electronic module due to the electromagnetic wave from the outside.
　次に、第２の実施形態に係る電子モジュール２の製造方法について説明する。 Next, a method for manufacturing the electronic module 2 according to the second embodiment will be described.
　まず、第１の実施形態で説明した手順により作製された第１の機能部１０を、基板１１が蓋体３７の主面３７ａに接するように蓋体３７に固定する。このとき、接続端子１５が蓋体３７の貫通孔３８に挿通されるように、第１の機能部１０を蓋体３７に固定する。 First, the first functional unit 10 manufactured by the procedure described in the first embodiment is fixed to the lid 37 so that the substrate 11 is in contact with the main surface 37 a of the lid 37. At this time, the first functional unit 10 is fixed to the lid 37 so that the connection terminal 15 is inserted through the through hole 38 of the lid 37.
　次に、第１の機能部１０がヒートシンク本体３６の凹部３６ａに収納され且つ基板１３が凹部３６ａの底面に接するように、蓋体３７をヒートシンク本体３６に取付ける。 Next, the lid 37 is attached to the heat sink body 36 so that the first functional unit 10 is accommodated in the recess 36a of the heat sink body 36 and the substrate 13 is in contact with the bottom surface of the recess 36a.
　次に、第２の機能部２０を、第２の基板２１が蓋体３７の主面３７ｂに接するように蓋体３７に固定する。このとき、接続端子１５が第２の基板２１の貫通孔に挿通されるように、第２の機能部２０を蓋体３７に固定する。その後、接続端子１５を第２の基板２１にはんだ付けする。 Next, the second functional unit 20 is fixed to the lid body 37 so that the second substrate 21 is in contact with the main surface 37 b of the lid body 37. At this time, the second functional unit 20 is fixed to the lid 37 so that the connection terminal 15 is inserted through the through hole of the second substrate 21. Thereafter, the connection terminal 15 is soldered to the second substrate 21.
　なお、第１の機能部１０および第２の機能部２０の蓋体３７への固定は、ネジまたは接着剤等により行う。 The first functional unit 10 and the second functional unit 20 are fixed to the lid body 37 with screws or an adhesive.
　上記の製造方法では、第１の機能部を収納部に対して高精度に位置決めして挿入する必要がなくなる。よって、第２の実施形態によれば、電子モジュールの製造性を向上させることができる。 In the above manufacturing method, it is not necessary to position and insert the first functional unit with high accuracy with respect to the storage unit. Therefore, according to the second embodiment, the manufacturability of the electronic module can be improved.
　上記の記載に基づいて、当業者であれば、本発明の追加の効果や種々の変形を想到できるかもしれないが、本発明の態様は、上述した個々の実施形態に限定されるものではない。異なる実施形態にわたる構成要素を適宜組み合わせてもよい。特許請求の範囲に規定された内容及びその均等物から導き出される本発明の概念的な思想と趣旨を逸脱しない範囲で種々の追加、変更及び部分的削除が可能である。 Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.
１，２　電子モジュール
１０　第１の機能部
１１　基板
１１ａ　絶縁基材
１１ｂ，１１ｃ　導体層
１１ｄ　凹部
１１ｅ　熱伝導部材
１２　電子部品
１３　基板
１３ａ　絶縁基板
１３ｂ，１３ｃ　導体層
１３ｄ　凹部
１３ｅ　熱伝導部材
１４　封止樹脂
１５　接続端子
１６　貫通孔
１７　熱伝導性接続部材
１８　嵌合部
２０　第２の機能部
２１　基板
２２　電子部品
２３　外部接続端子
２４　貫通孔
３０　ヒートシンク
３１　ベースプレート
３１ａ　収納部
３１ｂ　主面
３１ｃ，３１ｄ，３１ｅ　側面
３２　フィン
３３　溝部
３４　貫通孔
３５　ネジ穴
３６　ヒートシンク本体
３６ａ　凹部
３６ｂ　上面
３６ｃ，３６ｄ　側面
３７　蓋体
３７ａ,３７ｂ　主面
３８　貫通孔
４０　ネジ
１００　レギュレータ
１１０　パワー部
１１１　基板
１１２　電子部品
１１３　接続端子
１２０　制御部
１２１　基板
１２２　電子部品
１２３　外部接続端子
１３０　ヒートシンク
１３１　ベースプレート
１３２　フィン DESCRIPTION OF SYMBOLS 1, 2 Electronic module 10 1st function part 11 Board | substrate 11a Insulation base material 11b, 11c Conductive layer 11d Recessed part 11e Thermal conduction member 12 Electronic component 13 Substrate 13a Insulated board 13b, 13c Conductive layer 13d Recessed part 13e Thermal conduction member 14 Resin 15 Connection terminal 16 Through hole 17 Thermally conductive connection member 18 Fitting part 20 Second functional part 21 Substrate 22 Electronic component 23 External connection terminal 24 Through hole 30 Heat sink 31 Base plate 31a Storage part 31b Main surfaces 31c, 31d, 31e Side surface 32 Fin 33 Groove portion 34 Through hole 35 Screw hole 36 Heat sink body 36a Recess 36b Upper surface 36c, 36d Side surface 37 Cover body 37a, 37b Main surface 38 Through hole 40 Screw 100 Regulator 110 Power unit 111 Substrate 112 Electronic component 113 Connection terminal 120 Control Part 121 substrate 122 electronic part 123 External connection terminal 130 Heat sink 131 Base plate 132 Fin

Claims (14)

  1. 　第１の基板と、前記第１の基板に実装された第１の電子部品と、前記第１の基板に対向するように配置され且つ前記第１の電子部品に熱的に接続された第２の基板とを有する第１の機能部と、
    　第３の基板と、前記第３の基板に実装された第２の電子部品とを有し、前記第１の機能部に電気的に接続された第２の機能部と、
    　前記第１および第２の機能部を冷却するヒートシンクと、を備え、
    　前記ヒートシンクは、内部に収納部が設けられたベースプレートを有し、
    　前記第１の機能部は、前記第１および第２の基板が前記ベースプレートの前記収納部の内壁面に接するように前記収納部内に収納され、
    　前記第２の機能部は、前記第３の基板が前記ベースプレートの主面に接するように前記ベースプレート上に固定されている、
    　ことを特徴とする電子モジュール。     A first substrate; a first electronic component mounted on the first substrate; and a second electronic component disposed to face the first substrate and thermally connected to the first electronic component A first functional unit having a substrate;
    A second functional unit having a third substrate and a second electronic component mounted on the third substrate and electrically connected to the first functional unit;
    A heat sink for cooling the first and second functional units,
    The heat sink has a base plate provided with a storage portion therein,
    The first functional unit is stored in the storage unit such that the first and second substrates are in contact with an inner wall surface of the storage unit of the base plate,
    The second functional unit is fixed on the base plate so that the third substrate is in contact with the main surface of the base plate.
    An electronic module characterized by that.
  2. 　前記第１の機能部と前記ベースプレートとが互いに嵌合していることを特徴とする請求項１に記載の電子モジュール。 The electronic module according to claim 1, wherein the first functional part and the base plate are fitted to each other.
  3. 　前記第１の基板および前記第２の基板の少なくともいずれか一方に凹部が設けられ、熱伝導部材が前記収納部の内壁面に接するように前記凹部に配置されていることを特徴とする請求項１に記載の電子モジュール。 The concave portion is provided in at least one of the first substrate and the second substrate, and a heat conducting member is disposed in the concave portion so as to contact an inner wall surface of the storage portion. The electronic module according to 1.
  4. 　前記収納部内に収納された前記第１の機能部は、前記ベースプレートの前記主面から前記収納部に達する第１の貫通孔と、前記第１の機能部を厚さ方向に貫通する第２の貫通孔とに挿通され、かつ前記収納部の内壁に形成されたネジ穴に螺合するネジにより、前記ヒートシンク内に固定されていることを特徴とする請求項１に記載の電子モジュール。 The first functional part accommodated in the accommodating part includes a first through hole reaching the accommodating part from the main surface of the base plate, and a second penetrating through the first functional part in the thickness direction. The electronic module according to claim 1, wherein the electronic module is fixed in the heat sink by a screw inserted into a through hole and screwed into a screw hole formed in an inner wall of the storage portion.
  5. 　前記ネジが前記第３の基板を厚さ方向に貫通する貫通孔に挿通されることにより、前記第２の機能部は前記ベースプレート上に固定されていることを特徴とする請求項４に記載の電子モジュール。 The said 2nd function part is being fixed on the said baseplate by the said screw being penetrated by the through-hole which penetrates the said 3rd board | substrate in the thickness direction, The said 2nd function part is fixed on the said base plate. Electronic module.
  6. 　前記第１の機能部は、前記第２の機能部よりも発熱量が大きいことを特徴とする請求項１に記載の電子モジュール。 2. The electronic module according to claim 1, wherein the first functional unit generates a larger amount of heat than the second functional unit.
  7. 　前記第１の機能部は、前記第１の機能部に入力された入力電力を所望の出力電力に変換するパワー部であり、前記第２の機能部は、前記パワー部を制御する制御部であることを特徴とする請求項６に記載の電子モジュール。 The first functional unit is a power unit that converts input power input to the first functional unit into desired output power, and the second functional unit is a control unit that controls the power unit. The electronic module according to claim 6, wherein the electronic module is provided.
  8. 　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子が、互いに絶縁されるように、前記ベースプレートの前記主面につながる側面にストライプ状に設けられた複数の溝部にそれぞれ収納されていることを特徴とする請求項１に記載の電子モジュール。 A plurality of connection terminals that electrically connect the first functional unit and the second functional unit are provided in stripes on the side surfaces of the base plate connected to the main surface so as to be insulated from each other. The electronic module according to claim 1, wherein the electronic module is housed in each of the grooves.
  9. 　前記ヒートシンクは、
    　表面に凹部が形成されたヒートシンク本体と、
    　第１の主面と、前記第１の主面と反対側の第２の主面とを有する蓋体と、を有し、
    　前記蓋体は、前記第１の主面が前記ヒートシンク本体の前記表面に接し且つ前記凹部を覆うように、前記ヒートシンク本体に取付けられ、前記凹部とともに前記収納部を構成し、前記第２の機能部は、前記蓋体の前記第２の主面に固定されていることを特徴とする請求項１に記載の電子モジュール。     The heat sink is
    A heat sink body with a recess formed on the surface;
    A lid having a first main surface and a second main surface opposite to the first main surface;
    The lid is attached to the heat sink body so that the first main surface is in contact with the surface of the heat sink body and covers the recess, and constitutes the storage portion together with the recess, and the second function The electronic module according to claim 1, wherein the portion is fixed to the second main surface of the lid.
  10. 　前記第１の機能部は、前記蓋体の前記第１の主面に固定されていることを特徴とする請求項９に記載の電子モジュール。 10. The electronic module according to claim 9, wherein the first functional unit is fixed to the first main surface of the lid.
  11. 　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子は、互いに絶縁されるように、前記蓋体を厚さ方向に貫通する貫通孔に挿通されていることを特徴とする請求項９に記載の電子モジュール。 The plurality of connection terminals that electrically connect the first functional unit and the second functional unit are inserted into through holes that penetrate the lid in the thickness direction so as to be insulated from each other. The electronic module according to claim 9.
  12. 　前記収納部は前記ヒートシンク本体の前記凹部と前記蓋体とにより密閉され、前記第１の機能部は、前記ヒートシンク内に密閉状態に収納されていることを特徴とする請求項９に記載の電子モジュール。 10. The electronic device according to claim 9, wherein the storage unit is sealed by the recess of the heat sink body and the lid, and the first functional unit is stored in a sealed state in the heat sink. module.
  13. 　第１の電子部品が実装された第１の基板および前記第１の基板に対向するように配置され且つ前記第１の電子部品に熱的に接続された第２の基板を有する第１の機能部と、第２の電子部品が実装された第３の基板を有する第２の機能部と、ベースプレートを有し、前記第１および第２の機能部を冷却するヒートシンクとを備える電子モジュールの製造方法であって、
    　前記第１の基板および前記第２の基板の少なくともいずれか一方に設けられた凹部に、前記凹部の深さに等しい厚みを有する熱伝導部材を配置する工程と、
    　前記熱伝導部材が前記ベースプレートの内部に設けられた収納部の内壁面に接するように、前記第１の機能部を前記収納部内に収納する工程と、
    　前記第３の基板が前記ベースプレートの主面に接するように前記第２の機能部を前記ベースプレート上に固定する工程と、
    　を備えることを特徴とする電子モジュールの製造方法。     A first function having a first substrate on which a first electronic component is mounted, and a second substrate disposed so as to face the first substrate and thermally connected to the first electronic component Of an electronic module comprising: a second functional part having a third substrate on which a second electronic component is mounted; and a heat sink having a base plate and cooling the first and second functional parts A method,
    Disposing a heat conductive member having a thickness equal to the depth of the recess in a recess provided in at least one of the first substrate and the second substrate;
    Storing the first functional unit in the storage unit such that the heat conducting member is in contact with an inner wall surface of a storage unit provided in the base plate;
    Fixing the second functional unit on the base plate such that the third substrate is in contact with the main surface of the base plate;
    An electronic module manufacturing method comprising:
  14. 　第１の電子部品が実装された第１の基板および前記第１の基板に対向するように配置され且つ前記第１の電子部品に熱的に接続された第２の基板を有する第１の機能部と、第２の電子部品が実装された第２の基板を有する第２の機能部と、前記第１の機能部の厚さに等しい深さの凹部が設けられたヒートシンク本体と蓋体とを有するヒートシンクとを備える電子モジュールの製造方法であって、
    　前記第１の機能部を、前記第１の基板が前記蓋体の一方の主面に接するように前記蓋体に固定する工程と、
    　前記第１の機能部が前記ヒートシンク本体の前記凹部に収納され且つ前記第２の基板が前記凹部の底面に接するように、前記蓋体を前記ヒートシンク本体に取付ける工程と、
    　前記第２の機能部を、前記第２の基板が前記蓋体の他方の主面に接するように前記蓋体に固定する工程と、
    　を備えることを特徴とする電子モジュールの製造方法。     A first function having a first substrate on which a first electronic component is mounted, and a second substrate disposed so as to face the first substrate and thermally connected to the first electronic component A second functional unit having a second substrate on which a second electronic component is mounted, a heat sink body provided with a recess having a depth equal to the thickness of the first functional unit, and a lid body A method of manufacturing an electronic module comprising a heat sink having:
    Fixing the first functional unit to the lid so that the first substrate is in contact with one main surface of the lid;
    Attaching the lid to the heat sink body such that the first functional part is housed in the recess of the heat sink body and the second substrate is in contact with the bottom surface of the recess;
    Fixing the second functional unit to the lid so that the second substrate is in contact with the other main surface of the lid;
    An electronic module manufacturing method comprising:
PCT/JP2013/055578 2013-02-28 2013-02-28 Electronic module and production method for same WO2014132425A1 (en)

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