WO2014132085A1 - Module pour refroidir un ou plusieurs composants thermogènes - Google Patents

Module pour refroidir un ou plusieurs composants thermogènes Download PDF

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Publication number
WO2014132085A1
WO2014132085A1 PCT/GB2014/050615 GB2014050615W WO2014132085A1 WO 2014132085 A1 WO2014132085 A1 WO 2014132085A1 GB 2014050615 W GB2014050615 W GB 2014050615W WO 2014132085 A1 WO2014132085 A1 WO 2014132085A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat generating
coolant
container
generating component
cooling system
Prior art date
Application number
PCT/GB2014/050615
Other languages
English (en)
Inventor
Jason Bent
Keith Deakin
Peter Hopton
Original Assignee
Iceotope Limited
Kahn, Simon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Limited, Kahn, Simon filed Critical Iceotope Limited
Publication of WO2014132085A1 publication Critical patent/WO2014132085A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a module for cooling heat generating components, a method of manufacture for a module for cooling heat generating components, and a method of operation for a module for cooling heat generating components.
  • this invention is applicable for the cooling of electrical computer components, for example motherboards, processors or memory modules.
  • electrical component generate heat during operation.
  • electrical computer components such as motherboards, central processing units (CPUs) and memory modules may dissipate substantial amounts of heat when in use.
  • CPUs central processing units
  • memory modules may dissipate substantial amounts of heat when in use.
  • a common solution uses fans to force a continuous supply of cooled air over the components.
  • fan cooling may be noisy, cumbersome and require high volumes of circulating air in order to effectively cool the components to acceptable operating temperatures.
  • More advanced cooling assemblies use liquid cooling.
  • Liquid cooling systems may be advantageous over air cooled systems as they allow removal of heat using both conduction and convention.
  • convection currents demonstrate more efficient heat transfer than via conduction alone.
  • phase change cooling systems represent one of two types: (a) non-phase change cooling systems, in which the coolant does not change phase and remains liquid at all times; and (b) phase change cooling systems, in which the coolant undergoes a phase change to become a gas, thereby removing energy from the system and reducing temperature.
  • non-phase change cooling systems heat is removed from the coolant via conduction to a heat exchanger or similar cooling arrangement.
  • phase change cooling allows better handling of high heat densities, without higher temperature gradients.
  • a non-phase change cooling system is described in WO- 2010/130993 having common inventorship with this present invention.
  • convection currents in a first coolant convey heat away from heat generating components.
  • conduction plate is arranged adjacent the heat generating components such that the first coolant is in direct contact with a first surface of the conduction plate.
  • the conducting plate acts as a heat exchanger to a second coolant, which is circulated thus extracting heat from the system.
  • a condensing coil (or evaporation coil) in the upper section of the air-tight container causes the cooling gas to return to a liquid, and by so doing removes heat from the system.
  • the condensing coil operates via a separate, secondary circulation system with a secondary coolant.
  • a phase change cooling system is also considered in US 4,912,548 which describes a package for a semiconductor device, the package having an integrated heat pipe.
  • the semiconductor device is immersed in cooling fluid and located directly below the heat pipe.
  • the heat pipe is substantially vertical, with a cavity at its centre and a wicking material around its inner surface.
  • An upper portion of the heat pipe is provided with cooling fins and is maintained at a cold temperature. Operation of the semiconductor device causes the coolant to boil.
  • the coolant vapour rises through the centre of the heat pipe, transferring heat away from the device, until it contacts the cold portion of the heat pipe.
  • the vapour condenses and the coolant is carried back down the heat pipe via the wicking material.
  • the liquid droplets are returned to the pool of coolant in which the semiconductor device is immersed.
  • the device is not immersed in coolant, and the coolant is instead retained in wadding material at the base of the heat pipe.
  • the capacity of a cooling system to remove heat may be quantified by its cooling power. This describes the rate of energy transfer out of the system to the exterior.
  • the increasing heat load of modern electrical computer components may require a cooling power of 3-5kW to maintain a desirable operating temperature.
  • existing cooling systems, as described above, are more appropriate for systems requiring a lower cooling power.
  • the efficient transfer of heat from the heat generating components to the heat exchanger can be disrupted by the positioning and configuration of multiple heat generating components or electrical devices within the assembly.
  • the condenser is positioned above the coolant and heat generating component, in the same region of the module as the vapour gap. In this
  • the present invention relates to a module for cooling heat generating components, for example, for cooling electronic computer components such as a circuit board comprising a central processing unit and memory modules.
  • the cooling system is typically a phase-change cooling system in which one or more heat generating components are affixed within a sealable or air-tight container or more specifically, within a (sealable or air-tight) volume of the container.
  • the heat generating components are positioned in close proximity to a wadding material having a capillary action.
  • the wadding material is disposed adjacent to or in contact with a surface of the heat generating component.
  • a coolant is retained within the container or volume and is principally absorbed within the wadding material such that the wadding material remains dampened or moist. Operation of the heat generating component causes the coolant retained in nearby portion portions of the wadding material to evaporate and form a gas.
  • the gaseous coolant transfers heat away from the heat generating components and towards an adjacent cooling system or heat exchanger via convection currents.
  • the cooling system causes the gaseous coolant to condense, thus removing heat from the system.
  • Efficiency of cooling is significantly improved by the incorporation of the wadding material with a capillary or hygroscopic action, adjacent to the heat generating component.
  • the wadding material assists the effective circulation of coolant between the heat generating component and cooling system.
  • the capillary action of the wadding material acts to route or deliver coolant that has been re- condensed at the cooling system (and having a lower
  • the wadding material may aid uniform distribution of the coolant around the system and so negate "hot-spots" resulting from disruption or turbulence of the flow of convection currents around heat generating components in the assembly.
  • the wadding material further allows self-regulation of the rate of circulation of the coolant within the cooling module: the rate at which coolant is delivered to the heat generating component depends directly upon the rate of boiling of the liquid and the maximum flow rate of the capillaries. As such, for heat generating components operating at lower powers (and so generating less heat) the rate of circulation of coolant is less. Conversely, for higher power devices the rate of circulation will be greater and the cooling power increased. This mechanism helps to maintain a stable pressure within the cooling module, ideally at close to atmospheric pressure .
  • a module for cooling a heat generating component comprises a container suitable for containing a coolant, the container having a cooling system or heat
  • the heat exchanger which is substantially planar, and a heat generating component which is substantially planar, each mounted therein.
  • the heat generating component is located within the container spaced apart from the cooling system. Furthermore, the heat generating component and cooling system are arranged so that the plane of the cooling system and the plane of the heat generating component are substantially parallel.
  • the container defines a volume for containing the coolant. Then, the heat generating component may be housed or mounted within the volume. The wadding material is then typically disposed adjacent the heat generating component within the volume.
  • Such arrangements allow the cooling system to remove heat from the heat generating component via the coolant. Housing the coolant and heat generating component in the same volume, advantageously with no separation between the two that
  • the invention further comprises a wadding material having a capillary or wicking action.
  • the wadding material is disposed adjacent the heat generating component and is arranged such that its capillary action routes or delivers coolant towards one or more surfaces of the heat generating component.
  • the wadding is arranged to be in close proximity to, or in contact with, one or more surfaces of the heat generating component.
  • the wadding material having a capillary action assists circulation of the coolant via passive (rather than mechanical) means.
  • the module does not require circulation of the coolant by a pump (which may then need to be disposed within the volume as well) .
  • the cooling system and heat generating component are substantially planar. In other words, the cooling system and heat generating component each have a depth that is much less than its length and width.
  • the surfaces defined by the axis of length and width comprise the planar face of the cooling system or heat generating component.
  • the heat generating component may be arranged within the container (and particularly within the volume) such that a planar face of the cooling system and a planar face of the heat generating component are facing each other.
  • a planar face of the cooling system is both opposite and substantially parallel to the planar face of the heat generating component.
  • the component and the cooling system may both be planar and rectangular in shape, arranged so that the longest sides of each rectangle are parallel. This configuration may provide a large surface area of opposing planar surfaces of the heat generating component and the cooling system, thus enabling effective cooling.
  • the cooling system may not be rectangular, and may instead be a square or another
  • the heat generating component may be of any substantially planar shape.
  • the wadding material is disposed between the cooling system and the heat generating component (especially within the volume, which may mean that there is no separation between the cooling system and the heat generating component preventing the passage of coolant) .
  • the wadding material may be interposed between the parallel and opposing planar faces of the heat generating component and cooling system, and may substantially fill the space therebetween. There may be a uniform density of wadding material in the region between the cooling system and heat generating
  • a greater density of wadding material may be positioned adjacent particular portions of the heat generating component.
  • the wadding material may be in contact with, or in close proximity to, the surface of the cooling system.
  • the wadding material is arranged such that its capillary action routes or channels coolant from the vicinity of the cooling system toward the surface of the heat generating component (particularly within the volume) .
  • the arrangement of the wadding material thereby influences the flow or
  • the wadding material can be used to constrain or adapt the normal flow of coolant that would occur due to convection currents, in order to ensure more efficient heat transfer.
  • the wadding material may be arranged so that the capillary action moves the lowest temperature coolant horizontally in the system, between the parallel and opposing planar faces of the cooling system and heat generating component, rather than allowing it to flow downwards to the base of the container or volume (as would be the case, by the action of gravity, without the wadding material) .
  • the wadding may further be arranged so that the capillary action routes coolant toward particular regions of the heat
  • the capillary action may be configured to move low temperature coolant to a "hot spot" on the heat generating component.
  • the wadding material will be uniformly distributed in the vicinity of the heat generating component.
  • the wadding may be arranged to provide wadding adjacent to or in contact with the whole surface of the heat generating component.
  • the heat generating component may be affixed within the container (or more specifically, the volume) such that, in use, the plane of the heat generating component is
  • the heat generating component may be mounted so that, in use, its planar face (or axis of elongation) is upright (or perpendicular to the base of the container) .
  • the cooling system may be configured or positioned within the container (or volume) such that, in use, the plane of the cooling system is substantially vertical.
  • the cooling system may be mounted so that, in use, its planar face (or axis of elongation) is upright (or perpendicular with respect to the base of the container) .
  • the cooling system and heat generating component may be arranged vertically and parallel.
  • the heat generating component and cooling system may each be substantially planar and mounted vertically and facing each other within the container or volume, with wadding interposed between. This increases performance of the cooling system, whilst also allowing more compact design.
  • a vapour space may be defined in an upper region of the container (or volume) above the heat generating component and wadding.
  • the lid or top surface of the container may be spaced apart from the uppermost surface of the heat generating component.
  • the space therebetween may define a vapour space in which air vapour (including water vapour) can accumulate.
  • the cooling system is located within the container (optionally, at least part of the cooling system may be located within the volume), particularly such that the operational portion of the cooling system is below the vapour space.
  • the operational portion may be the portion of the surface of the cooling system which is adjacent the wadding material.
  • a module for cooling a plurality of heat generating components comprising a container suitable for containing a coolant, the container having a cooling system and a plurality of heat generating components spaced apart within the
  • the module further comprises a wadding material interposed between the plurality of heat generating components, the wadding material having a capillary action so as to route coolant towards the surfaces of the plurality of heat generating components.
  • the container defines a volume for containing the coolant.
  • the heat generating components may be housed or mounted within the volume.
  • the wadding material is then typically interposed between the plurality of heat generating components within the volume.
  • the wadding material assists in efficient cooling of multiple heat generating components (in other words, two or more separate heat generating components), as it increases the cooling capacity of the module.
  • the plurality of heat generating components may each be separate electronic devices.
  • the plurality of heat generating components may be processors, memory modules or controllers or any combination of these.
  • the plurality of heat generating components may each be substantially planar. In other words, they may each have a length and width which is much greater than their depth. The axis of length and width may define a planar face of the heat generating component.
  • the plurality of heat generating components may each comprise one or more electronic devices mounted on the surface of a planar board.
  • component may be a circuit board or mother board with one or more devices such as a memory module, processor or controller (or combination of these) mounted on its surface.
  • plurality of heat generating components will potentially comprise a plurality of such circuit boards.
  • the plurality of heat generating components may be fixed within the container (and preferably within the volume) such that the plane of each heat generating component is substantially vertical.
  • the plane of each heat generating component may be substantially upright and perpendicular to the base of the container or volume.
  • Each heat generating component may be arranged upright and be parallel with respect to another so that the plane of each heat generating component is parallel to the plane of the next heat generating component.
  • a wadding material may be
  • the wadding material is adjacent the surface of the heat generating components (advantageously within the volume) .
  • the plurality of heat generating components are affixed within the container (or volume) such that the plane of each heat generating component is perpendicular to an axis of elongation of the cooling system.
  • the cooling system may be affixed within the container such that, in use, the cooling system is arranged substantially horizontally in the container (or volume) .
  • the plurality of heat generating components may be positioned within the container (or volume) such that, in use, the cooling system is positioned above the plurality heat generating components and wadding material. As such, in use, the uppermost portion of the wadding material and the
  • heat generating component may apply to either a single heat generating component, one of a plurality of heat generating components or a plurality of heat
  • a heat generating component may be any electronic device. More particularly, the heat generating component may comprise an electronic computer component such as a circuit board, processor or memory module, and especially any combination of these.
  • the heat generating component may be formed of a planar board with one or more electronic devices mounted on its surface. The heat generating component or mounted
  • electronic devices may be comprise a heat spreader or coating to assist the exchange of heat with the coolant.
  • the heat generating component In operation, the heat generating component generates heat which may be understood to stimulate convection currents within the coolant. In particular, operation of the heat generating component may cause a portion of the coolant in the vicinity of the heat generating component to evaporate (or boil) and change phase from liquid to gas. Accordingly, a heat generating component may be any component which produces heat as a by-product of its operation.
  • the cooling system includes a condenser or evaporator coil.
  • the condenser offers an efficient means of extracting heat from the system by causing gaseous coolant to condense and return to the liquid phase. As a result, said portion of the coolant will have reduced in temperature.
  • the condenser may be a coil or may consist of a surface having embedded fluid channels.
  • the wadding material is insulating
  • the wadding material may comprise of one or more of:
  • the material may be a hygroscopic substance.
  • a coolant is contained within the container (particularly, the volume) and more specifically is retained or absorbed by the wadding material.
  • the coolant provides a medium for effective transfer of heat away from the heat generating component, in particular via convection currents.
  • the coolant is able to exploit the capillary action of the wadding material.
  • the volume of coolant contained within the container (especially the volume) is sufficient to uniformly moisten or dampen the wadding material.
  • the coolant absorbed and retained by the wadding material may be a mixture of coolant in the liquid and gaseous phases.
  • the amount of liquid retained by the wadding will be sufficient to promote effective and consistent circulation of coolant in the proximity of every region of the surface of the heat
  • the wadding material results in a lower volume of coolant necessary for effective cooling than compared with cooling systems in which the heat generating component is fully submerged by a cooling liquid.
  • the wadding need only be dampened with coolant, rather than the heat generating components within the container (or volume) being immersed.
  • the coolant may be a dielectric (or insulating) liquid and/or may be inert.
  • this reduces damage to electrostatic-sensitive heat generating components caused by an electric current being applied between components via the coolant .
  • the coolant may be a fluorinated compound.
  • Fluorinated compounds are especially suited for use in combination with the wadding material having a capillary action.
  • Examples of preferred fluorinated compounds include perflouroketones (PFK) or hydrofluroethylene (HFE) .
  • PFK perflouroketones
  • HFE hydrofluroethylene
  • the compound may be chosen to have a boiling point at close to the operating temperature of the heat generating component and a freezing point below 0°C.
  • the module for cooling a heat generating component may further comprise an electrical inlet to the container (or volume), through which electrical connections to the heat generating electrical component or other electrical components can be received.
  • the electrical inlet further comprises a seal to prevent coolant escaping the container (or volume) and to prevent air or moisture entering the container from the exterior .
  • the electrical inlet may be located on a wall of the container at a height that is greater than the heat generating component within the container (or volume) .
  • the electrical inlet is located on a wall of the container (or volume within the container) at a height greater than the height of the cooling system within the container or volume.
  • the electrical inlet may be arranged such that it is located in the vapour space, and in particular in the lid or upper surface of the container.
  • the interior of the container may be maintained at atmospheric pressure and so leakage of air into the container or volume through the seal of the electrical inlet is reduced.
  • the module may be fully sealed, so that the container or volume is air-tight and has no inlet or outlet other than the electrical inlet.
  • the module for cooling a heat generating component may further comprise a filling inlet to the container, through which the coolant can be received into the container or volume.
  • the inlet may comprise a seal.
  • inclusion of the filling inlet allows
  • the seal to the filling inlet may include a one-way valve, or other type of valve.
  • the seal may be designed to allow filling of the container with coolant without excessive spillage or mess.
  • the filling inlet may be positioned in the upper wall (or lid) at the top of the container or volume, or in the wall of the container at a height greater than the height of the heat generating component.
  • the filling inlet may be in the vapour gap above the wadding and heat generating component.
  • the filling inlet may be located on the wall of the container at a height that is no higher than the height of the heat generating component within the
  • the filling inlet may be positioned so that the distance between the filling inlet and the base of the container is less than the distance between the uppermost portion of the heat
  • the module for cooling a heat generating component further comprises a feedback outlet from the
  • the feedback outlet may further comprise a valve.
  • the valve may be a pressure release valve and/or be controlled externally by the user to adjust the rate of flow of gaseous coolant through the valve. Provision of the valve enables adjustment of the volume of coolant passing out of the
  • the container or volume may also act as a safety feature to avoid the build up of excess pressure within the container or volume.
  • the pressure within the container or volume may be maintained at close to atmospheric pressure, which reduces the likelihood of leakage at the filling inlet, electrical inlet or any other seal of the container.
  • the module for cooling a heat generating component according to any preceding claim may further
  • a valve may be placed at the feedback inlet to regulate the flow of coolant into the container or volume.
  • the valve may be any type of valve, and may be manually controlled or controlled by a controller.
  • a secondary circulatory system is connected between the feedback outlet of the container and the feedback inlet of the container, for circulation of coolant.
  • the secondary circulatory system may act to provide a
  • the secondary circulatory system receives coolant from the feedback outlet of the container or volume and returns the coolant to the container through the feedback inlet.
  • the secondary circulatory system may
  • circulatory system may give redundancy for storing any
  • the secondary circulatory system may provide an alternative and/or additional method of cooling gaseous coolant, thereby increasing the system cooling power or cooling capacity.
  • the secondary circulatory system may be connected to more than one module containing heat generating components.
  • the secondary circulatory system may be central to a network of modules.
  • the secondary circulatory system may comprise a pump or other mechanical means for transfer of coolant.
  • the secondary circulatory system may further comprise a storage tank
  • the pump and storage tank may be placed in series between the feedback outlet and feedback inlet, interconnected by pipes.
  • the secondary circulatory system incorporating a pump or other mechanical means may advantageously allow coolant to be redistributed around the container or volume. For example, coolant may be pumped from the feedback outlet in a lower region of the container to the feedback inlet in the upper region of the container, against the action of gravity. This may be
  • the secondary circulatory system may comprise a secondary cooling system arranged to receive gaseous coolant released through the feedback outlet.
  • the secondary cooling system can increase redundancy and the overall cooling capacity of the system.
  • the secondary cooling system may provide an additional or auxiliary method for cooling excess gaseous coolant, in order to avoid excessive pressures or excessive load on the cooling system situated within the container or volume.
  • the secondary cooling system may further comprise a secondary condenser or heat exchanger arranged to condense gaseous coolant released through the feedback outlet of the container or volume and may further comprise a storage tank suitable for containing the condensed coolant.
  • the secondary condenser or heat exchanger may remove heat from the system and return the coolant to the liquid phase. Storage of re- condensed coolant within the storage tank provides utility for regulating the flow of coolant out of the secondary cooling system, allowing flow to be adjusted according to need.
  • the secondary cooling system may form part of the secondary circulatory system as follows: the gaseous coolant exits the container through the feedback outlet (and/or valve) of the container and enters the secondary cooling system.
  • the gaseous coolant may be cooled by the secondary condenser, and re-condensed to the liquid phase.
  • the re-condensed coolant may be retained in the storage tank until required for return to the container.
  • the coolant may be resupplied to the container through a feedback inlet (and/or valve) located in a wall of the container.
  • a feedback inlet and/or valve located in a wall of the container.
  • there may be a closed circulation system for the coolant allowing the user to adjust the coolant level within the container in order to maintain an optimum liquid level.
  • the feedback inlet may further comprise a spray nozzle within the container or volume, arranged such that coolant entering the container or volume through the feedback inlet passes through the spray nozzle.
  • the spray nozzle generates a mist or series of droplets of coolant for entry to the
  • This may provide a consistent and uniform
  • a mist or spray of droplets of coolant may be less likely to disrupt convection currents and so the intended transfer of heat within the system.
  • the secondary cooling system may comprise a controller to control the flow of coolant into and out of the container or volume at the feedback outlet and/or inlet.
  • the controller may control a valve at the feedback outlet of the container or volume or a valve at the feedback inlet, or any combination of valves within the module.
  • the valves may determine flow of the coolant into or out of the container or volume or may shut-off the flow of coolant entirely.
  • the controller may be a computer or a manually operated switch or other controlling means.
  • the module comprises one or more sensors for measuring one or more parameters consisting of: liquid level; moisture level or dampness within the wadding; and, pressure with the container or volume.
  • the one or more sensors may be located in the wall of the container. More than one sensor may be distributed in the walls of the container to measure a parameter within particular locality. For example, sensors may be arranged at a number of heights within the container or volume.
  • the sensors may be electrically connected to the exterior of the module to allow measurement of each variable without disturbance of the module (for example, the sensors may be electrically connected through the electrical inlet to allow measurement, without the requirement to access the interior of the container) .
  • the controller may be arranged to adjust the flow of the coolant through the feedback inlet based on the measured parameter from the one or more sensors.
  • the controller may adjust a valve at the outlet of the container or volume according to a value from the one or more sensors. This is particularly advantageous when forming part of a secondary circulatory system and may ensure that the optimum amount of coolant is present in the wadding material, or that the optimum pressure is maintained within the container or volume .
  • the one or more sensors may be capacitive sensors.
  • a sensor may be a capacitive sensor for measuring liquid level.
  • a sensor may measure the
  • the one or more sensors may include a liquid level meter incorporating a float.
  • a method of manufacturing a module for cooling a heat generating component which comprises a first step of providing a container suitable for containing a coolant. The method further comprises a second step of housing a
  • a third step comprises mounting a substantially planar heat generating component within the container, located so that the cooling system is spaced apart from the heat generating component and so that the plane of the cooling system and the plane of the heat generating component is substantially parallel. This may allow the cooling system to remove heat from the heat generating component via the coolant.
  • the method includes providing a wadding material adjacent the heat generating component, the wadding material having a capillary action routing coolant towards a surface of the heat generating component.
  • the container defines a volume for containing the coolant.
  • the heat generating component may be housed or mounted within the volume. The wadding material is then typically provided adjacent the heat generating component within the volume.
  • the method may further comprise providing a coolant within the container or volume in order to dampen the wadding.
  • Housing the substantially planar cooling system may comprise housing the cooling system so that, in use, the cooling system is substantially vertical within the container or volume. In other words, in use, the cooling system is upright within the container, and the plane of the cooling system is perpendicular to the base of the container.
  • mounting the substantially planar heat generating component comprises mounting the heat generating component substantially vertically within the container or volume.
  • the heat generating component may be upright within the container or volume, with the plane of the heat generating component being perpendicular to the base of the container or volume. The planes of heat
  • generating component and cooling system may be substantially parallel in order that the planar surfaces of the heat
  • generating component and cooling system are opposite and facing each other.
  • a method of operating a module for cooling a substantially planar heat generating component mounted within a container and adjacent a wadding material having a capillary action.
  • the wadding material retains a coolant, so that the step of operating the heat generating component causes a portion of the coolant to evaporate.
  • the method further comprising condensing the evaporated gaseous coolant using a substantially planar cooling system, the cooling system being spaced apart from the heat generating component with the plane of the heat generating component and the plane of the cooling system being substantially parallel.
  • the cooling system being spaced apart from the heat generating component with the plane of the heat generating component and the plane of the cooling system being substantially parallel.
  • the container defines a volume for containing the coolant. Then, the heat generating component may be housed or mounted within the volume. The wadding material is then typically provided adjacent the heat generating component within the volume.
  • a further step comprises a first step of providing a container suitable for containing a coolant, and a second step of housing a cooling system within the container.
  • a further step comprises
  • a final step comprises providing a wadding
  • the container defines a volume for containing the coolant.
  • the heat generating components may be housed or mounted within the volume.
  • the wadding material is then typically provided adjacent the plurality of heat generating components within the volume.
  • the method further comprised an additional step of providing coolant within the container or volume in order to dampen the wadding material.
  • mounting a plurality of heat generating components within the container comprises mounting the
  • FIGURE 1 is a simplified cross-sectional side view of a module for cooling a heat generating component
  • FIGURE 2 is a simplified cross-sectional side view of an alternative embodiment of a module for cooling a heat
  • FIGURE 3 is a simplified cross-sectional side view of a further alternative embodiment of a module for cooling a heat generating component. It should be noted that the figures are not necessarily drawn to scale.
  • FIG. 1 there is shown a simplified cross-sectional side view of a module 10 for cooling a heat generating component.
  • the module 10 comprises a container 12 suitable for containing a coolant.
  • a cooling system 14 Within the container 12 is a cooling system 14, together with a heat generating component 20 affixed to a mounting 16, and positioned spaced apart from the cooling system 14.
  • a wadding material 18 Disposed between the cooling system 14 and the heat generating component 20 is a wadding material 18 having a capillary action.
  • the embodiment of the invention illustrated in Figure 1 further comprises: a condenser 22, included within the cooling system and consisting of fluid carrying channels embedded into a cooling surface; a feedback outlet 30 of the container; a secondary circulatory system comprising a secondary cooling system 32; a valve 34, at the feedback outlet; a secondary condenser 36 and storage tank 38 as part of the secondary cooling system 32; a feedback inlet 40 to the container; a controller 42; and, a spray nozzle at the feedback inlet.
  • the embodiment also incorporates a coolant retained or absorbed within the wadding material.
  • the embodiment comprises a filling inlet to the container and a seal at the filling inlet, as well as a number of measurement sensors.
  • FIG. 1 illustrates the module 10 comprising the heat generating component 20 affixed to the mounting 16, where the heat generating component 20 is a circuit board including a number of surface mount components such as a central
  • processing unit and one or more memory modules.
  • the mounting 16 is located within the container 12 so that, when affixed, the heat generating component 20 is spaced apart from the cooling system 14.
  • the distance between the heat generating component 20 and the cooling system 14 is selected to support optimum cooling in the system.
  • the positioning of each feature is selected to ensure favourable flow of convection currents created within the system when in operation.
  • the wadding material 18 with a capillary or wicking action is interposed between the cooling system 14 and heat generating component 20.
  • the wadding material 18 is arranged so that it is close to, or in contact with, both the outer surfaces of the heat generating component 20 and a surface of the cooling system 14.
  • the wadding material 18 is arranged to be in close proximity to a maximum surface area of the heat generating component.
  • the wadding material 18 is configured so that its capillary action operates to move or route liquid from the surface of the cooling system 14 towards the surface of the heat generating component 20.
  • the cooling system 14 includes a condenser 22 (or
  • the condenser 22 forms part of an overall cooling system, parts of which may be external to the module.
  • the cooling system 14 may include further apparatus such as a primary coolant fluid (for example, air conditioning fluid) which circulates through the condenser via an inlet 48 and outlet 50, pumps, and storage tanks. Some of these apparatus are not shown in
  • Both the cooling system 14 and the heat generating component 20 are substantially planar (that is, having a width and length much larger than their depth) .
  • the cooling system 14 and the heat generating component 20 are arranged
  • the cooling system 14 is configured such that its axis of elongation (the longest dimension of the plane) is aligned with the axis of elongation of the heat generating component 20.
  • the planar face of the cooling system 14 is arranged to face or be opposite to the planar face of a heat generating component (in this case, a circuit board) so that their longest sides align. In this configuration the surface area of the faces of the cooling system 14 and heat generating component 20 which oppose each other are maximised.
  • a vapour gap resides above the heat generating component and wadding in the uppermost portion of the container, and above the majority of the operational portion of the cooling system. Due to stratification, any excess air and moisture will accumulate in the vapour gap. Consequently, the
  • Figure 1 shows the arrangement of the module when it is suitable for operation.
  • the container 12 contains a coolant.
  • the volume of the coolant is sufficient for all portions of the wadding 18 to be dampened.
  • the wadding is of sufficient dampness to enable effective cooling.
  • the vapour gap is retained in the uppermost portion of the container 12, between the surface of the coolant 24 and the upper wall or lid of the container 12.
  • the module includes a secondary cooling system 32.
  • the secondary cooling system forms part of a feedback or secondary circulatory system.
  • the secondary cooling system 32 receives excess coolant from the container 12, removes heat from the liquid, and then returns the lower temperature coolant to the container 12.
  • the secondary cooling system 32 is connected to a
  • the feedback outlet 30 of the container positioned within the vapour gap.
  • the feedback outlet 30 includes a valve 34, for example a pressure release valve. When the valve 34 is open, gaseous coolant will pass through the outlet and be received by the secondary cooling system 32.
  • the secondary cooling system 32 comprises a secondary condenser 36 and a storage tank 38.
  • the secondary cooling system 32 is arranged so that, in use, the gaseous coolant received by the secondary cooling system 32 will be re- condensed at the secondary condenser 36. Re-condensed coolant is caught, retained and stored within the storage tank 38 before further circulation.
  • the secondary cooling system 32 may include external apparatus necessary for operation, for example pumps and a secondary coolant fluid.
  • the secondary cooling system may be shared with other cooling modules. For example, the secondary cooling system may be connected to more than one feedback outlet from more than one module for cooling a heat generating component .
  • An outlet of the secondary cooling system (specifically, an outlet from the storage tank) is connected to a feedback inlet 40 of the container 12.
  • the feedback inlet 40 is located in the uppermost portion of the container 12, within the vapour gap.
  • Connected to the feedback inlet 40 is a valve 44 and a spray nozzle.
  • the secondary cooling system 32, feedback inlet 40, valve 44 and spray nozzle are arranged such that coolant from the secondary cooling system 32 may pass through the feedback inlet 40 and spray nozzle into the container 12. For example, re-condensed coolant within the storage tank 38 may be returned to the container 12.
  • the spray nozzle at the feedback inlet 40 causes liquid to be released in a fine mist or series of droplets.
  • input of coolant in this form causes less disruption to the flow of the coolant already retained within the container.
  • the secondary cooling system 32 of Figure 1 further includes a controller 42.
  • the controller 42 regulates various parameters within the module.
  • the controller 42 controls one or more valves. For example, in the
  • controller 42 is used to adjust the flow of coolant into the secondary cooling system via the valve 34 at the feedback outlet 30. Furthermore, the controller 42 is used to adjust the flow of coolant into the secondary cooling system via the valve 34 at the feedback outlet 30. Furthermore, the controller 42 is used to adjust the flow of coolant into the secondary cooling system via the valve 34 at the feedback outlet 30. Furthermore, the controller 42 is used to adjust the flow of coolant into the secondary cooling system via the valve 34 at the feedback outlet 30. Furthermore, the controller 42 is used to adjust the flow of coolant into the secondary cooling system via the valve 34 at the feedback outlet 30. Furthermore, the controller 42 is used to adjust the flow of coolant into the secondary cooling system via the valve 34 at the feedback outlet 30. Furthermore, the
  • controller 42 regulates flow of coolant out of the secondary cooling system 32 and into the container 12 via the valve 44 at the feedback inlet 40.
  • the controller 42 regulates the flow according to
  • the measured parameters may comprise one or more of coolant level, dampness of the wadding material or pressure within the container. Based on readings from the one or more sensors, the controller 42 determines whether the module is operating at the optimum conditions for efficient cooling. In particular, the
  • controller 42 is configured to maintain the dampness of the wadding material at its optimum level. Thus, when the wadding is too dry, the controller 42 allows extra coolant from the reserved coolant contained in the storage tank 38 of the secondary cooling system 32 to enter the container 12 through the feedback inlet 40. If the vapour gap is too large (or the system is above a desired pressure) the controller 32 may increase the flow of gaseous coolant through the outlet 30 and into the secondary cooling system 32.
  • the module further comprises an electrical inlet 60 which is positioned in the uppermost portion of the container 12, at a height greater than the heat generating component 20.
  • Electrical connections 58 to the heat generating component may be fed through the electrical inlet 60.
  • the electrical inlet 60 comprises a seal to avoid leakage of coolant or entry of air or moisture into the container.
  • a filling inlet is located in the wall of the container 12.
  • the filling inlet allows filling and refilling of the coolant without fully opening the container 12.
  • the filling inlet is located in the top wall or lid of the container 12.
  • the filling inlet 26 is positioned so that the interior portion of the filling inlet is within the vapour gap in the uppermost portion of the container 12, above the surface of the coolant.
  • the filling inlet further includes a seal. This is a cap or bung which acts to close the filling inlet.
  • component 10 in Figure 1 includes coolant within the
  • the wadding material retains or absorbs the coolant so that the wadding material remains damp.
  • the container 12 is secured and sealed so that it is air-tight. Operation of the heat generating component 20 causes heat to be transferred to the coolant. A portion of the coolant surrounding the heat generating component 20 increases in temperature, preferably causing a phase change from liquid to gas. As such, said portion of the coolant forms gaseous coolant or coolant vapour. Consequently, the wadding material contains a mixture of coolant in the liquid phase and in the gas phase.
  • Gaseous coolant in the vicinity of the condenser 22 of Figure 1 will be re-condensed and returned to the liquid phase. By so doing, the cooling system 14 extracts heat from the module.
  • Re-condensed coolant has a lower temperature and higher density than gaseous coolant.
  • convection currents cause the re-condensed coolant to circulate towards lower portions of the system, by the action of gravity.
  • the flow of the convection currents is influenced by the capillary action of the wadding material 18 interposed between the heat generating component 20 and the cooling system 14.
  • the capillary action of the wadding material 18 routes the lower temperature coolant directly towards the surface of the heat generating component 20.
  • the capillary action directs the lower temperature coolant crossways from the cooling system 14 to the heat generating component 20.
  • the capillary action of the wadding material 18 allows low temperature coolant to be distributed more evenly across the complete surfaces of the heat generating component 20, rather than relying on the flow of liquid due to convection currents alone.
  • the module according to the present invention takes advantage of convective cooling (in particular phase-change cooling techniques) whilst providing a means of manipulating the fluid flow of the coolant for more effective cooling.
  • the wadding material may be arranged to ensure homogenous cooling across a complete assembly of heat
  • inclusion of wadding material with a capillary action may reduce accumulation of lower temperature coolant in the lower regions of the container. This may be observed in the prior art where fluid flow is solely a consequence of convection currents and can result in a temperature gradient between upper and lower regions of the heat generating component. Instead, in the present invention, the capillary action ensures that
  • the configuration of the present invention may be particularly advantageous when the heat generating component is arranged substantially vertically, for example the
  • the module is suitable for cooling heat generating components, and especially electrical computer components.
  • the heat generating component may be a circuit board or mother board, memory modules, central processing units (CPU) or an assembly of electronic computer components.
  • the container may be any type of container or box that can retain liquid and be made substantially air-tight (that is, does not exhibit significant leakage even when the
  • the container may have a lid with a seal which can be opened and closed by the user.
  • the container may be permanently or semi-permanent ly sealed after the module is assembled .
  • the cooling system may be any type of heat exchanger that is arranged to extract heat from the interior of the system.
  • the cooling system preferably includes a condensing system as part of a phase-change cooling system.
  • the cooling system may exploit non-phase change cooling.
  • the cooling system in Figure 1 is described as planar and having a rectangular surface facing the heat generating component, the skilled person will appreciate that a planar cooling system having an alternative configuration could be used.
  • the mounting for the heat generating component can be any feature which allows the heat generating component to be affixed within the container.
  • the mounting may be any fixing, feature, slot or indentation within the
  • the wadding material may be any material having a capillary or wicking action, or may be hygroscopic.
  • the wadding material may be any material which causes liquid to flow without the application of external force or pressure.
  • the capillary action may cause the direction of fluid flow to be in opposition to gravity or another external force. Capillary action results from surface tension and the cohesion of a fluid to the conduit material (in this case, the wadding material) .
  • Wadding materials such as cotton wool, paper, cellulose, silica, a metal or a metal oxide (or any combination of said material) may be particularly suitable within the module described herein. However, the skilled person will recognise that various other materials may be used as a wadding
  • the wadding material is electrically insulating .
  • the coolant level may alternatively be of a height to result in the heat generating component being part immersed or fully submerged .
  • a number of types of fluid may be apparent to the skilled person for use as a coolant.
  • Particularly suitable are fluorinated compounds.
  • particularly advantageous may be a perfluroketone or hydrofluroethylene solution.
  • the coolant will be inert and a dielectric or insulator. In order to achieve lower operational
  • a coolant may be selected with a freezing point below water. Furthermore, the coolant will ideally have a boiling point at a temperature close to the operational temperature of the heat generating component (before cooling) . This will ensure the evaporation of the coolant whilst the component is in use and so permit phase-change cooling.
  • the feedback outlet of the container is connected to a secondary cooling system
  • the feedback outlet may instead be connected directly to the exterior or to an alternative system.
  • the valve at the outlet may be a pressure release valve, a manually or electronically
  • the container has a filling inlet and valve for refilling the coolant.
  • the coolant may be provided within the container during manufacture and permanently sealed.
  • the module is then an entirely enclosed system, and the coolant will not be renewed or refilled by the user.
  • the module may not comprise a secondary cooling system, or any type of secondary circulation system, and be provided without any outlets or inlets other than the electrical inlet.
  • FIG. 1 shows an arrangement of the module in which the heat generating component is substantially planar and arranged substantially vertically.
  • the present invention is not limited to this configuration.
  • the heat generating component may be arranged horizontally or at an angle to the base of the container.
  • FIG. 2 there is shown a cross-sectional side view of module 210 for cooling a heat generating component.
  • the module 210 includes a
  • the container 212 for containing a coolant.
  • the container 212 has a substantially planar cooling system 214 and a substantially planar heat generating component 220.
  • the heat generating component is located spaced apart from the cooling system 214, such that the cooling system can remove heat from the heat generating component 220 via a coolant.
  • a wadding material 218 is disposed within the container 212 so that it is
  • the wadding material has a capillary action which routes the coolant towards the surface of the heat generating component.
  • the heat generating component and cooling system are arranged such that the planar faces of each element are parallel.
  • Figure 2 further illustrates a mounting for the heat generating component 216; a condenser 222 as part of the cooling system and having an inlet 248 and an outlet 250; an outlet 230 to the container, having a valve 234; an inlet 240 to the container, having a valve 244 and sprinkler nozzle;
  • the heat generating component 220 is shown affixed to a mounting 216.
  • the heat generating component 220 comprises a planar circuit board, with a number of components attached to the circuit board (for example, memory modules or processors) .
  • Electrical connection is made to the heat generating component via wires 258 inserted through a sealed electrical connection inlet 260.
  • the electrical connection inlet 260 is placed in the upper surface or lid of the sealable connector.
  • the cooling system 214 forms the inner surface of one wall of the container 212.
  • the cooling system 214 comprises a condenser 222 (or evaporation coil) for condensing gaseous coolant.
  • the cooling system 214 includes an input 248 and output 250, each further comprising quick disconnect valves .
  • a coolant is contained within the container 212.
  • the amount of coolant in the container 212 is sufficient to ensure the wadding 218 is damp and may be saturated, but is not enough to cause components in the container 212 to be fully submerged.
  • smaller volumes of coolant are required compared to systems in which the heat generating component is submerged.
  • the module 210 further comprises a circulatory system.
  • the circulatory system aids the
  • Coolant may exit from the lower portion of the container at a feedback outlet 230.
  • a mechanical pump 252 external to the container 212, pumps the coolant to a feedback inlet 240 in the upper portion of the container 212 via pipes 254, 256.
  • a control valve 234 is located at the feedback outlet 230 of the container 212.
  • a second control valve 244 is positioned at the feedback inlet 240.
  • the feedback inlet 240 comprises a sprinkler head or nozzle which causes coolant to enter the container 212 as a stream of droplets or spray.
  • the circulation system provides a secondary mechanism for transfer of coolant, and assists in ensuring the wadding 218 in every portion of the container 212 is kept sufficiently damp to provide efficient cooling of the heat generating component 220.
  • the module may further comprise one or more sensors (not shown in Figure 2) .
  • the sensors may be situated on the wall of the container 212, and may be situated at intervals to each other (for example, as differing depths) .
  • the sensors may measure the dampness of the wadding material 218, the coolant level or the internal pressure of the container 212.
  • This embodiment of the module may comprise a controller (not shown in Figure 2) .
  • the controller may control a number of valves within the module.
  • the controller may control valves 234, 244 at the feedback outlet 230 and
  • the controller may adjust the valves 234, 244 according to measurements of the wadding dampness or the pressure within the container by the one or more sensors described above. In this way, the
  • controller may initiate circulation of coolant from the lower portion of the container to the upper portion of the container 212.
  • the controller may open valves 234, 244 at the feedback outlet 230 and feedback inlet 240, in response to sensors in the upper portion of the container 212 indicating the wadding is insufficiently damp.
  • heat generated by the heat generating components 220 is transferred to the nearby coolant retained or absorbed by the adjacent wadding material 218, so causing the nearby coolant to evaporate.
  • Vaporous coolant is then carried via convention currents to the surface of the cooling system.
  • the cooling system 214 and condenser 222 cause the vaporous coolant to re-condense. Subsequently, the lower temperature, re-condensed coolant is routed back to the surface of the heat generating component 220 through the capillary action of the wadding material 218.
  • the secondary circulation system may be employed to increase circulation of the coolant. This may especially be useful in the event that coolant accumulates in the lower portion of the container causing the wadding in the upper portion of the container to be too dry.
  • the valve at the feedback outlet 234 may be opened to allow coolant to be pumped (via mechanical pump 252) to the feedback inlet 240 in the uppermost surface (or lid) of the container 212.
  • coolant will then re-enter the container 212 through the sprinkler nozzle.
  • a spray or jet of droplets of coolant will be released to re-dampen the wadding material 218.
  • the secondary circulatory system may be controlled by a
  • controller and operate in response to the measured values for dampness of the wadding material 218 or pressure within the container 212.
  • the module 310 comprises a container 312 having a cooling system 314 and enclosing a number of heat generating components 320a, 320b, 320c, 320d.
  • heat generating components 320a, 320b, 320c, 320d are affixed to mountings 316a, 316b, 316c, 316d spaced apart within the container 312.
  • the skilled person will appreciate that although four heat generating components are illustrated in Figure 3, any number of heat generating components could be mounted in this way.
  • the heat generating components 320a, 320b, 320c, 320d are planar, and are mounted substantially vertically within the container 312.
  • the cooling system 314 is located substantially horizontally in the upper portion of the container 312, above the heat generating components 320a, 320b, 320c, 320d. In other words, the axis of elongation of the cooling system 314 is positioned perpendicular to the plane of the heat
  • the cooling system 314 comprises a condenser 322 (or evaporator coil) .
  • a wadding material 318 is disposed adjacent the heat generating components 320a, 320b, 320c, 320d.
  • the wadding material 318 is interposed between the heat generating
  • the wadding material 318 has a capillary action, which causes coolant within the module to be routed towards the surface of the heat generating components 320a, 320b, 320c, 320d.
  • FIG. 3 illustrates the module having a secondary circulatory system.
  • This system includes a secondary cooling system 332 including a secondary condenser 336 and a storage tank 338.
  • the secondary cooling system 332 is connected to a feedback outlet 330 of the container 312. Flow through the feedback outlet 330 is controlled by a valve 334.
  • secondary cooling system 332 is further connected to a feedback inlet 340 of the container 312 and the feedback inlet 340 comprises a controllable valve 344.
  • a controller regulates the flow through controllable valves 334, 344.
  • the controller may regulate the flow
  • the heat generating components In operation, the heat generating components generate heat causing the coolant at the surface or close to the surface of the heat generating components 320a, 320b, 320c, 320d, to evaporate. Evaporation of the coolant transfers heat away from the surface of the heat generating components 320a, , 320c, 320d.
  • the gaseous coolant is transported upwards through the wadding material 318 via convection currents.
  • the gaseous coolant vapour will accumulate at the surface of the cooling system 314 (and condenser 322) and subsequently re- condense .
  • Re-condensed coolant having a greater density than surrounding gaseous coolant, will move downwards onto the wadding 318 and heat generating components 320a, 320b, 320c, 320d beneath. Via this mechanism, the wadding material 318 is constantly re-dampened. The capillary action of the wadding material 318 routes the cooler, re-condensed coolant to the surface of the heat generating components 320a, 320b, 320c, 320d and ensures a more uniform distribution of coolant. This in turn results in a more homogenous temperature across the surface of the heat generating components 320a, 320b, 320c, 320d.
  • the secondary circulatory system allows excess gaseous coolant to be removed from the container 312.
  • the interior of the container 312 is maintained at a pressure which provides efficient recondensat ion of vaporous coolant.
  • Gaseous coolant may enter the secondary cooling system 332 of the secondary circulatory system through the feedback outlet 330 of the container 312. Vapour within the secondary cooling system 332 may be re-condensed at the secondary condenser 336, and then stored in the storage tank 338 until required. The coolant may subsequently be returned to the container 312 through the feedback inlet 340.
  • a controller 342 may regulate the rate of flow through the secondary cooling system 332 via valves 334, 344 at the feedback outlet 330 and inlet 340.
  • the secondary circulatory system provides redundancy in the system, and offers increased capacity for re-condensing the gaseous coolant.

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Abstract

Un module servant à assurer le refroidissement d'un composant thermogène comprend un récipient définissant un volume pour contenir un liquide de refroidissement. Ledit récipient comprend : un système de refroidissement sensiblement plan; un ou plusieurs composants thermogènes sensiblement plans montés à l'intérieur du volume, de sorte que le système de refroidissement se trouve à distance du ou des composants thermogènes et de sorte que le plan du système de refroidissement et le plan du ou des composants thermogènes sont sensiblement parallèles, ce qui permet au système de refroidissement de dissiper la chaleur provenant du ou des composants thermogènes par l'intermédiaire de l'agent de refroidissement; ainsi qu'un matériau de rembourrage qui est disposé de manière adjacente au composant thermogène ou est intercalé entre les composants thermogènes à l'intérieur du volume et présente une action capillaire de manière à acheminer le liquide de refroidissement vers une surface du ou des composants thermogènes.
PCT/GB2014/050615 2013-03-01 2014-03-03 Module pour refroidir un ou plusieurs composants thermogènes WO2014132085A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1303655.3 2013-03-01
GB1303655.3A GB2511354A (en) 2013-03-01 2013-03-01 A module for cooling one or more heat generating components

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WO2014132085A1 true WO2014132085A1 (fr) 2014-09-04

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CN109997421A (zh) * 2016-11-25 2019-07-09 爱思欧托普有限公司 用于浸入冷却式电子器件的i/o电路板

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