WO2014129005A1 - Circuit d'attaque et module de modulation optique - Google Patents

Circuit d'attaque et module de modulation optique Download PDF

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Publication number
WO2014129005A1
WO2014129005A1 PCT/JP2013/076919 JP2013076919W WO2014129005A1 WO 2014129005 A1 WO2014129005 A1 WO 2014129005A1 JP 2013076919 W JP2013076919 W JP 2013076919W WO 2014129005 A1 WO2014129005 A1 WO 2014129005A1
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WO
WIPO (PCT)
Prior art keywords
driver
terminal
driver circuit
termination resistor
optical modulator
Prior art date
Application number
PCT/JP2013/076919
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English (en)
Japanese (ja)
Inventor
佐藤　健二
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日本電気株式会社
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Publication date
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Priority to JP2015501248A priority Critical patent/JPWO2014129005A1/ja
Publication of WO2014129005A1 publication Critical patent/WO2014129005A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/21—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  by interference
    • G02F1/225—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  by interference in an optical waveguide structure
    • G02F1/2255—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  by interference in an optical waveguide structure controlled by a high-frequency electromagnetic component in an electric waveguide structure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/0121—Operation of devices; Circuit arrangements, not otherwise provided for in this subclass

Definitions

  • the present invention relates to a driver and an optical modulation module.
  • optical multilevel modulation system is a system that increases the amount of information without increasing the frequency use band by multileveling the amplitude and phase of light.
  • optical OFDM scheme is a scheme in which an OFDM signal is generated by an electrical signal, optically modulated, and multiplexed between optical subcarriers in an orthogonal state.
  • a Mach-Zehnder interferometer (MZI: MZI) is used for an optical transmission apparatus that uses the above-described method to perform multi-level or multiplexing and convert an electrical digital signal, which is data, into an optical analog signal waveform.
  • An optical modulator (hereinafter referred to as a Mach-Zehnder type modulator) constituting a Mach-Zehnder-Interferometer is used.
  • a Mach-Zehnder type modulator is constituted by an optical modulator (hereinafter referred to as an LN modulator) made of a lithium niobate (LiNbO 3 ) material, and an optical waveguide of the LN modulator is used.
  • An optical waveguide device is disclosed in which a voltage is applied to a part of the optical waveguide to change the refractive index of the optical waveguide, and optical modulation is performed using light interference.
  • Patent Document 2 discloses a Mach-Zehnder composed of a semiconductor material of indium phosphide (InP) and arsenic arsenide phosphide (InGaAsP), or gallium arsenide (GaAs) and aluminum gallium arsenide (AlGaAs).
  • a type modulator is disclosed. Since the change in the refractive index with respect to the voltage of the semiconductor material has a coefficient that is several tens of times larger than that of lithium niobate, the use of the semiconductor material reduces the operating voltage to a fraction of that of the LN modulator. The size can be reduced to a few tenths or less.
  • an absorption change can be made larger than a refractive index change, and there is one called an electroabsorption optical modulator. In that case, the size can be reduced to one tenth or less than that of the Mach-Zehnder type semiconductor optical modulator.
  • Electroabsorption optical modulators are often integrated with other elements.
  • Patent Document 3 discloses a device called an electroabsorption optical modulator integrated laser integrated with a semiconductor laser.
  • the optical modulator as described above realizes optical modulation by changing the amplitude, intensity, and phase of light passing through it by applying a voltage.
  • an amplifier circuit that amplifies an electric signal is usually used, which is generally called a driver.
  • the driver circuit gallium arsenide (GaAs), indium phosphide (InP), silicon germanium (SiGe), or a CMOS circuit (silicon) is used depending on the required output voltage amplitude.
  • Patent Document 4 discloses a driving circuit for an optical modulator that outputs a modulated signal light in response to carrier light from a light source, a terminal resistor connected between the electrodes of the optical modulator to generate a driving voltage, and driving.
  • both the driver for driving the optical modulator and the driven optical modulator must have a wide band up to a high frequency range.
  • the response characteristic with respect to the frequency cannot be kept flat up to a wide band, and the frequency response characteristic becomes undulating, the frequency band becomes narrow.
  • the termination resistor can be arranged on a substrate 200b different from the driver 200a.
  • the driver 200a includes a driver circuit 300 and a terminal 400a.
  • the optical modulator 100 includes terminals 600 and 700 and an optical modulation unit 800 having an optical waveguide.
  • the substrate 200b has a termination resistor 500 and a terminal 400b.
  • the terminal 400a and the terminal 700 are connected by a wire 140a, and the terminal 400b and the terminal 600 are connected by a wire 140b.
  • the driver 200a and the substrate 200b on which the termination resistor 500 is arranged are provided separately, which causes problems such as being bulky and preventing miniaturization when connected to each other. Can do.
  • the driver 200 includes a driver circuit 300, a terminal 400, and a termination resistor 500.
  • the optical modulator 100 includes terminals 600 and 700, an optical modulation unit 800, and a capacitor (capacitor 120) formed between the optical modulation unit 800 and the ground. Terminal 400 and terminal 700 are connected by wire 140.
  • the object of the present invention is to reduce the influence of the termination resistor on the driver circuit by increasing the distance between the termination resistor and the driver circuit without unnecessarily routing the wiring in the driver in which the termination resistor and the driver circuit are arranged. It is an issue to provide.
  • a driver circuit, a first terminal electrically connected to the driver circuit, a termination resistor, and a second terminal electrically connected to the termination resistor are disposed on the same substrate.
  • the driver circuit and the termination resistor are electrically connected to each other via the ground only on the substrate, and when the driver is connected to the optical modulator, they are electrically connected to each other via the optical modulator.
  • Drivers are provided.
  • an optical modulation module including the driver and an optical modulator connected to the driver.
  • a technique for increasing the distance between the termination resistor and the driver circuit without unnecessarily routing the wiring and reducing the influence of heat generated by the termination resistor on the driver circuit Is realized.
  • FIG. 2 is an equivalent circuit diagram of the light modulation module of FIG. 1. It is a figure for demonstrating the effect of this embodiment. It is a figure for demonstrating the effect of this embodiment. It is a figure for demonstrating the effect of this embodiment. It is a figure for demonstrating the effect of this embodiment. It is a figure which shows an example of a structure of the light modulation module of this embodiment. It is a figure which shows an example of a structure of the light modulation module of this embodiment.
  • FIG. 8 is an equivalent circuit diagram of the light modulation module of FIG. 7. It is a figure which shows the structure of the light modulation module of a reference example. It is a figure which shows the structure of the light modulation module of a reference example.
  • the driver of the present embodiment is electrically connected to the optical modulator, and applies a voltage (modulation signal) for modulating light passing through the optical modulator to the optical modulator.
  • the configuration of the optical modulator can be any configuration according to the prior art.
  • the driver of this embodiment includes a driver circuit, a first terminal electrically connected to the driver circuit, a termination resistor, and a second terminal electrically connected to the termination resistor.
  • the driver circuit, the first terminal, the termination resistor, and the second terminal are disposed on the same substrate.
  • the configuration of the driver circuit, the first terminal, the termination resistor, and the second terminal can be any configuration in accordance with the prior art.
  • the driver circuit and the termination resistor of the present embodiment are electrically connected to each other only on the substrate via the ground.
  • the drivers are electrically connected to the optical modulator, they are electrically connected to each other via the optical modulator.
  • the driver of the present embodiment when electrically connected to the optical modulator, is electrically connected to each other via the optical modulator, the first terminal, the termination resistor, and the second A plurality of sets including terminals can be provided.
  • the driver circuit and the first terminal pair and the terminal resistor and the second terminal pair can be installed on the substrate at a sufficient distance. That is, the distance between the driver circuit and the termination resistor on the substrate can be increased. As a result, it is possible to reduce the inconvenience that the influence of heat generated by the terminating resistor affects the driver circuit.
  • these pairs are electrically connected only by the ground on the board and not electrically connected by wiring, so even if the distance between these pairs is increased, wiring is unnecessary on the board. Will not be routed.
  • the light modulation module 10 includes a light modulator 1 and a driver 2 arranged in parallel with each other.
  • the optical modulator 1 includes a plurality of sets each including an optical modulation unit 4 having an optical waveguide and terminals 6 and 7 electrically connected to the optical modulation unit 4. Three sets are shown in the figure. In any of the groups, a capacitor (capacitor 12) is formed between the light modulation unit 4 and the ground. The plurality of sets are electrically insulated from each other. The light passes through these sets in order (eg, from the left to the right in the figure), and the light is individually modulated by each of the plurality of sets.
  • the optical modulator 1 can be made of lithium niobate or a semiconductor such as indium phosphide (InP).
  • the optical modulator 1 can employ any optical modulator such as an electroabsorption optical modulator, an optical phase modulator, and a Mach-Zehnder modulator.
  • the drivers 2 there is a set having a driver circuit 3, a first terminal 40 a electrically connected to the driver circuit 3, a termination resistor 5, and a second terminal 40 b electrically connected to the termination resistor 5.
  • a driver circuit 3 a first terminal 40 a electrically connected to the driver circuit 3, a termination resistor 5, and a second terminal 40 b electrically connected to the termination resistor 5.
  • the set is provided so that the number, position, and the like correspond to the set including the optical modulation unit 4 and the terminals 6 and 7 included in the optical modulator 1.
  • the pair of the driver circuit 3 and the first terminal 40a and the pair of the termination resistor 5 and the second terminal 40b are electrically connected to each other on the driver 2 substrate only through the ground.
  • the first terminal 40a of the driver 2 is electrically connected to the terminal 7 of the optical modulator 1 through the wire 14a.
  • the second terminal 40b of the driver 2 is electrically connected to the terminal 7 of the optical modulator 1 through the wire 14b.
  • the first terminal 40 a and the second terminal 40 b included in the same set are electrically connected to the same terminal 7. That is, the driver circuit 3 and the termination resistor 5 included in the same set are electrically connected to each other via the wire 14a, the wire 14b, and the optical modulator 1 (terminal 7).
  • the configuration of the driver circuit 3 is not particularly limited, and any conventional technique can be applied.
  • an amplifier circuit that amplifies the electric signal is used to apply a voltage corresponding to the input electric signal to the optical modulator 1. be able to.
  • gallium arsenide (GaAs), indium phosphide (InP), silicon germanium (SiGe), or a CMOS circuit (silicon) is used depending on the required output voltage amplitude.
  • the lengths of the wires 14a and 14b are adjusted, and the design is performed in consideration of the presence of an inductor having a predetermined value realized by the wires 14a and 14b. can do.
  • both wires 14a and 14b are inductors.
  • the characteristic impedance of the electrical line is approximately represented by the square root of L / C when the inductance L of the wires 14a and 14b and the capacitance C of the capacitor 12 are considered.
  • L the sum of the wire 14a and the wire 14b
  • the capacitance C of the capacitor 12 is designed to be 100 femtofarads
  • the characteristic impedance is just 50 ohms. Actually, it is difficult to set it to just 50 ohms, but it can be set to a value close to 50 ohms to some extent.
  • the characteristic impedance can be close to 50 ohms to some extent, and if a 50 ohm transmission line for high frequencies is terminated with a termination resistor 50 of 50 ohms, electrical reflection from the termination hardly occurs. As a result, the frequency response characteristic tends to be flat (see FIG. 5).
  • a heat shield structure can be provided between the driver circuit 3 on the substrate of the driver 2 and the termination resistor 5.
  • a groove filled with a dielectric (eg, air, silicon dioxide, etc.) having a lower thermal conductivity than the substrate (eg: silicon substrate) of the driver 2 can be considered.
  • the material of the substrate of the driver 2 is a design matter, and any conventional technique can be applied. Since the driver circuit 3 and the termination resistor 5 are connected only at the ground, there is no problem in terms of circuit even if a groove is formed between them.
  • the width of the groove can be about several microns.
  • the cross-sectional shape of the groove is not particularly limited.
  • the optical modulator 1 includes a plurality of sets each including an optical modulation unit 4 and terminals 6, 7 a, 7 b electrically connected to the optical modulation unit 4. May be.
  • the terminals 7a and 7b are directly electrically connected without passing through the light modulator 4.
  • the first terminal 40a of the driver 2 is electrically connected to the terminal 7a of the optical modulator 1 through the wire 14a.
  • the second terminal 40b of the driver 2 is electrically connected to the terminal 7b of the optical modulator 1 through the wire 14b.
  • An equivalent circuit diagram of this configuration is also shown in FIG. 2, and the same operational effects as the configuration shown in FIG. 1 can be realized.
  • a termination resistor is arranged between the first terminal 40a and the driver circuit 3 so as to be in parallel with the driver circuit 3, and is electrically connected to the termination resistor and the second terminal 40b.
  • a resistance having a predetermined value may be realized by using both of the termination resistances 5.
  • the resistance value of the termination resistor disposed between the first terminal 40a and the driver circuit 3 is appropriately adjusted so that the heat generated by the termination resistor does not affect the driver circuit 3. Is preferred.
  • the terminating resistor 5 and the driver circuit 3 are electrically connected only via the ground, and are not connected via wiring. For this reason, the arrangement position of the termination resistor 5 is not affected by the arrangement position of the driver circuit 3 and can be arranged sufficiently apart. As a result, the influence of the heat generated by the termination resistor 5 on the driver circuit 3 can be reduced.
  • the resistance value of the termination resistor 5 is also 50 ohms. However, there is no particular problem if it is in the vicinity of 50 ohms. Further, depending on the characteristic impedance of the circuit, an appropriate resistance value may be selected accordingly.
  • the termination resistor 5 included in one set is composed of a plurality of resistance elements. In this way, the heat generated by the termination resistor 5 can be distributed to a plurality of resistance elements. As a result, inconvenience that a large amount of heat can be accumulated locally can be reduced, and heat radiation can be promoted.
  • a plurality of resistance elements included in one set may be connected in series with each other and have different resistance values.
  • the resistance element having a higher resistance value is disposed at a position farther from the driver circuit 3 than the resistance element having a lower resistance value.
  • a calorific value distribution is formed in the plurality of resistance elements.
  • the resistor element having a large heat generation amount can be arranged farther from the driver circuit 3 than the resistor element having a small heat generation amount. As a result, it is possible to further reduce the influence of the heat generated by the termination resistor 5 on the driver circuit 3.
  • a plurality of resistance elements included in one set may be connected in parallel to each other and have different resistance values.
  • the resistance element having a low resistance value is arranged at a position farther from the driver circuit 3 than the resistance element having a high resistance value. In such a case as well, the influence of the heat generated by the termination resistor 5 on the driver circuit 3 can be further reduced.
  • FIG. 7 shows the configuration of the second embodiment devised to release heat from the termination resistor 5.
  • the termination resistor 5 of this embodiment is different in that it is composed of a plurality of resistance elements 5a to 5c. Other configurations are the same.
  • FIG. 8 illustrates this with an electrical equivalent circuit diagram.
  • the plurality of resistance elements 5a to 5c are configured such that a plurality of resistance elements gather in a distributed manner and behave as one termination resistor 5 as a whole.
  • the plurality of resistance elements are connected to each other in series and / or in parallel.
  • the number of resistance elements is a matter of design. Note that the resistance values of the plurality of resistance elements may all be the same, or different ones may be mixed. It is only necessary that the resistance value of the termination resistor 5 configured by a plurality of resistance elements be a predetermined value (eg, 50 ohms).
  • the resistance element 5a can be 300 ohms
  • the resistance element 5b can be 150 ohms
  • the resistance element 5c can be 100 ohms.
  • the heat generation amount of each of the resistance elements 5a to 5c generated at that time is determined by V ⁇ I, the heat generation amount increases as the resistance elements 5a to 5c having higher current values, that is, the resistance elements 5a to 5c having lower resistance values.
  • the heating value of the resistance element 5c 100 ohms
  • the heating value of the resistance element 5b 150 ohms
  • the heating value of the resistance element 5a 300 ohms
  • the resistance values of the plurality of resistance elements 5a to 5c are distributed, and the resistance elements 5a to 5c having higher heat generation (resistance elements 5a to 5c having lower resistance values) are arranged away from the driver circuit 3, The influence of the heat generated by the termination resistor 5 on the driver circuit 3 can be further reduced.
  • the plurality of resistance elements 5a to 5c are distributed too far apart, the influence of the inductance between the resistance elements 5a to 5c cannot be ignored, and the reflection of the electric signal may increase and affect the frequency response. Therefore, they cannot be separated indefinitely, and it is desirable that the number of resistance elements 5a to 5c be about 2 to 10 and separated so as not to affect the frequency response.
  • a driver connected to the light modulator and applying a voltage to the light modulator for modulating light passing through the light modulator;
  • a driver circuit, a first terminal electrically connected to the driver circuit, a termination resistor, and a second terminal electrically connected to the termination resistor are disposed on the same substrate.
  • the driver circuit and the termination resistor are electrically connected to each other via the ground only on the substrate, and when the driver is connected to the optical modulator, they are electrically connected to each other via the optical modulator.
  • Driver 2.
  • the termination resistor included in one set is a driver configured by a plurality of resistance elements. 4).
  • the plurality of resistance elements included in one set are connected in series with each other, and have different resistance values.
  • the driver in which the resistance element having a higher resistance value is arranged at a position farther from the driver circuit than the resistance element having a lower resistance value. 5.
  • the plurality of resistance elements included in one set are connected in parallel to each other, and include elements having different resistance values,
  • the driver in which the resistance element having a lower resistance value is arranged at a position farther from the driver circuit than the resistance element having a higher resistance value. 6).
  • a driver in which a heat shielding structure is provided between the driver circuit and the termination resistor. 7).
  • the thermal barrier structure is a driver that is a groove filled with a dielectric having a lower thermal conductivity than the substrate. 8).
  • the light modulation module according to 8 An optical modulation module in which at least one of the first terminal and the second terminal of the driver is connected to a terminal on the optical modulator via an inductor. 10. In the light modulation module according to 8 or 9, The optical modulation module in which the first terminal and the second terminal of the driver are connected to the same terminal on the optical modulator.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

La présente invention traite les problèmes d'accroître la distance entre une résistance de terminaison et un circuit d'attaque sans tirer un câblage non nécessaire, et de réduction des effets de chaleur évoluée dans une résistance de terminaison sur circuit d'attaque dans un circuit d'attaque dans lequel une résistance de terminaison et un circuit d'attaque sont disposés. En tant que moyen pour résoudre ces problèmes, un circuit d'attaque (2) est proposé dans lequel un circuit d'attaque (3), une première borne (40a) électriquement connectée au circuit d'attaque (3), une résistance (5) de terminaison, et une seconde borne (40b) électriquement connectée à la résistance (5) de terminaison sont disposés sur le même substrat, le circuit d'attaque (3) et la résistance (5) de terminaison étant électriquement connectés l'un à l'autre sur le substrat uniquement par l'intermédiaire d'une masse, et le circuit d'attaque (2) et le modulateur (1) optique étant électriquement connectés l'un à l'autre par l'intermédiaire du modulateur (1) optique lorsque le circuit d'attaque (2) et le modulateur (1) optique sont connectés.
PCT/JP2013/076919 2013-02-20 2013-10-03 Circuit d'attaque et module de modulation optique WO2014129005A1 (fr)

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JP2015501248A JPWO2014129005A1 (ja) 2013-02-20 2013-10-03 ドライバ及び光変調モジュール

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JP2013031397 2013-02-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173409B1 (ja) * 2021-12-27 2022-11-16 三菱電機株式会社 半導体光素子

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JP2000507718A (ja) * 1996-03-29 2000-06-20 クリスタル テクノロジー インコーポレイテッド セグメント化電極を備えた線形式光変調器
JP2002118384A (ja) * 2000-08-01 2002-04-19 Mitsubishi Electric Corp 電子機器
JP2004226769A (ja) * 2003-01-24 2004-08-12 Hitachi Ltd 光送信装置
JP2005128440A (ja) * 2003-10-27 2005-05-19 Fujitsu Ltd 電気回路を内蔵する光導波路モジュール及びその製造方法
JP2005326802A (ja) * 2004-04-14 2005-11-24 Optical Comb Institute Inc 光共振器
JP2006352563A (ja) * 2005-06-16 2006-12-28 Shinko Electric Ind Co Ltd 終端抵抗内蔵基板
JP2009536447A (ja) * 2006-04-20 2009-10-08 エヌエックスピー ビー ヴィ Ｌｅｄ照明用途に用いられるサブマウント内の電子デバイスの断熱
JP2011003770A (ja) * 2009-06-19 2011-01-06 Mitsubishi Electric Corp 抵抗終端器
JP2011166464A (ja) * 2010-02-10 2011-08-25 Nec Corp 多チャンネル光送信モジュールとその構成方法、及び、多チャンネル光受信モジュールとその構成方法
WO2013018263A1 (fr) * 2011-08-02 2013-02-07 日本電気株式会社 Module de modulateur optique, circuit intégré pour commande de modulateur optique et procédé de modulation de signal optique

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000507718A (ja) * 1996-03-29 2000-06-20 クリスタル テクノロジー インコーポレイテッド セグメント化電極を備えた線形式光変調器
JP2002118384A (ja) * 2000-08-01 2002-04-19 Mitsubishi Electric Corp 電子機器
JP2004226769A (ja) * 2003-01-24 2004-08-12 Hitachi Ltd 光送信装置
JP2005128440A (ja) * 2003-10-27 2005-05-19 Fujitsu Ltd 電気回路を内蔵する光導波路モジュール及びその製造方法
JP2005326802A (ja) * 2004-04-14 2005-11-24 Optical Comb Institute Inc 光共振器
JP2006352563A (ja) * 2005-06-16 2006-12-28 Shinko Electric Ind Co Ltd 終端抵抗内蔵基板
JP2009536447A (ja) * 2006-04-20 2009-10-08 エヌエックスピー ビー ヴィ Ｌｅｄ照明用途に用いられるサブマウント内の電子デバイスの断熱
JP2011003770A (ja) * 2009-06-19 2011-01-06 Mitsubishi Electric Corp 抵抗終端器
JP2011166464A (ja) * 2010-02-10 2011-08-25 Nec Corp 多チャンネル光送信モジュールとその構成方法、及び、多チャンネル光受信モジュールとその構成方法
WO2013018263A1 (fr) * 2011-08-02 2013-02-07 日本電気株式会社 Module de modulateur optique, circuit intégré pour commande de modulateur optique et procédé de modulation de signal optique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173409B1 (ja) * 2021-12-27 2022-11-16 三菱電機株式会社 半導体光素子

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