WO2014120256A1 - Composants d'émetteur de lumière de dispositif à montage en surface (smd) à base d'embase et procédés - Google Patents

Composants d'émetteur de lumière de dispositif à montage en surface (smd) à base d'embase et procédés Download PDF

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Publication number
WO2014120256A1
WO2014120256A1 PCT/US2013/035411 US2013035411W WO2014120256A1 WO 2014120256 A1 WO2014120256 A1 WO 2014120256A1 US 2013035411 W US2013035411 W US 2013035411W WO 2014120256 A1 WO2014120256 A1 WO 2014120256A1
Authority
WO
WIPO (PCT)
Prior art keywords
submount
component
approximately
light emitter
panel
Prior art date
Application number
PCT/US2013/035411
Other languages
English (en)
Inventor
Christopher P. Hussell
Erin R.F. WELCH
Jesse Colin Reiherzer
Peter Scott Andrews
Original Assignee
Cree, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/755,993 external-priority patent/US9780268B2/en
Application filed by Cree, Inc. filed Critical Cree, Inc.
Priority to CN201380071952.6A priority Critical patent/CN104969368B/zh
Publication of WO2014120256A1 publication Critical patent/WO2014120256A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention porte sur des composants d'émetteur de lumière de conception à montage en surface (SMD) à base d'embase et sur des procédés associés. Selon certains aspects, des composants d'émetteur de lumière peuvent comprendre une embase avec un premier côté ayant une première zone de surface, des premier et second contacts électriques disposés sur le premier côté de l'embase, et au moins une puce d'émetteur de lumière sur le premier côté. Selon certains aspects, la zone de contact électrique peut être inférieure à la moitié de la première zone de surface du premier côté de l'embase. Des composants décrits ici peuvent comprendre des parties de profil bas ou des dômes où un rapport entre une hauteur de dôme et une largeur de dôme est inférieur à 0,5. Un procédé pour fournir des composants peut comprendre la fourniture d'un panneau de matériau et de puces de DEL, la distribution d'un matériau d'agent d'encapsulation liquide sur le panneau, et la singularisation du panneau en composants à base d'embase individuels après que le matériau d'agent d'encapsulation a durci.
PCT/US2013/035411 2013-01-31 2013-04-05 Composants d'émetteur de lumière de dispositif à montage en surface (smd) à base d'embase et procédés WO2014120256A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380071952.6A CN104969368B (zh) 2013-01-31 2013-04-05 基于基板的表面贴装器件(smd)发光组件以及方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/755,993 US9780268B2 (en) 2006-04-04 2013-01-31 Submount based surface mount device (SMD) light emitter components and methods
US13/755,993 2013-01-31

Publications (1)

Publication Number Publication Date
WO2014120256A1 true WO2014120256A1 (fr) 2014-08-07

Family

ID=51262811

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/035411 WO2014120256A1 (fr) 2013-01-31 2013-04-05 Composants d'émetteur de lumière de dispositif à montage en surface (smd) à base d'embase et procédés

Country Status (2)

Country Link
CN (1) CN104969368B (fr)
WO (1) WO2014120256A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738832S1 (en) 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
WO2020099324A1 (fr) * 2018-11-14 2020-05-22 Osram Opto Semiconductors Gmbh Procédé de fabrication d'une pluralité de composants électroluminescents, composant électroluminescent, procédé de fabrication d'un support de connexion et support de connexion

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109459827B (zh) * 2018-10-29 2021-02-02 西安微电子技术研究所 一种光电模块气密性组装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009146935A (ja) * 2007-12-11 2009-07-02 Citizen Electronics Co Ltd 発光ダイオード
KR100933920B1 (ko) * 2009-06-05 2009-12-28 주식회사 케이아이자이맥스 발광유니트 및 그 제조방법
KR20100008509A (ko) * 2008-07-16 2010-01-26 주식회사 이츠웰 표면 실장형 엘이디 패키지와 이를 이용한 백 라이트 유닛
US20110079801A1 (en) * 2009-10-01 2011-04-07 Zhang Xianzhu Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
KR20110111941A (ko) * 2010-04-06 2011-10-12 엘지이노텍 주식회사 발광 소자 및 그 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1947266A (zh) * 2004-03-31 2007-04-11 克里公司 包括发光变换元件的半导体发光器件和用于封装该器件的方法
TW200637033A (en) * 2004-11-22 2006-10-16 Matsushita Electric Ind Co Ltd Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device
JP2006156668A (ja) * 2004-11-29 2006-06-15 Nichia Chem Ind Ltd 発光装置及びその製造方法
CN100459193C (zh) * 2006-02-23 2009-02-04 亿光电子工业股份有限公司 白光发光二极管封装结构
JP5427174B2 (ja) * 2008-06-23 2014-02-26 パナソニック株式会社 発光装置、面発光装置及び表示装置
JP5345363B2 (ja) * 2008-06-24 2013-11-20 シャープ株式会社 発光装置
WO2010141235A1 (fr) * 2009-06-01 2010-12-09 Nitto Denko Corporation Dispositif électroluminescent comprenant un luminophore en céramique en forme de dôme
TWI409975B (zh) * 2009-12-01 2013-09-21 Au Optronics Corp 具大發光角度之光源裝置及其製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009146935A (ja) * 2007-12-11 2009-07-02 Citizen Electronics Co Ltd 発光ダイオード
KR20100008509A (ko) * 2008-07-16 2010-01-26 주식회사 이츠웰 표면 실장형 엘이디 패키지와 이를 이용한 백 라이트 유닛
KR100933920B1 (ko) * 2009-06-05 2009-12-28 주식회사 케이아이자이맥스 발광유니트 및 그 제조방법
US20110079801A1 (en) * 2009-10-01 2011-04-07 Zhang Xianzhu Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
KR20110111941A (ko) * 2010-04-06 2011-10-12 엘지이노텍 주식회사 발광 소자 및 그 제조방법

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738832S1 (en) 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
WO2020099324A1 (fr) * 2018-11-14 2020-05-22 Osram Opto Semiconductors Gmbh Procédé de fabrication d'une pluralité de composants électroluminescents, composant électroluminescent, procédé de fabrication d'un support de connexion et support de connexion

Also Published As

Publication number Publication date
CN104969368A (zh) 2015-10-07
CN104969368B (zh) 2017-08-25

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