WO2014117482A1 - 新型低通滤波通路及采用它的通信腔体器件 - Google Patents

新型低通滤波通路及采用它的通信腔体器件 Download PDF

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Publication number
WO2014117482A1
WO2014117482A1 PCT/CN2013/079284 CN2013079284W WO2014117482A1 WO 2014117482 A1 WO2014117482 A1 WO 2014117482A1 CN 2013079284 W CN2013079284 W CN 2013079284W WO 2014117482 A1 WO2014117482 A1 WO 2014117482A1
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novel low
pass filter
sub
cavities
hole
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PCT/CN2013/079284
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English (en)
French (fr)
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丁海
黄友胜
丁培培
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京信通信系统（中国）有限公司
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Priority to BR112015011114A priority Critical patent/BR112015011114A8/pt
Publication of WO2014117482A1 publication Critical patent/WO2014117482A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other

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  • the invention relates to a communication cavity device for low-pass filtering a communication signal, in particular to a novel low-pass filter path that can be externally tuned and a communication cavity device using the path structure, such as a filter, a combiner and Diplexer.
  • Combiners, duplexers and filters are widely used in the field of communications as passive communication devices, especially in the field of radio frequency communications.
  • a high-performance low-pass filter is needed.
  • the traditional implementation is generally Chebyshev type, such as the common sugar gourd-shaped low-pass filter, which has the advantages of simple structure and easy implementation, but the disadvantage is that the out-of-band drop is slow and the out-of-band suppression is The consistency of the low filter characteristics depends on the accuracy of the machining and assembly.
  • Such low-pass filters are often used to suppress out-of-band bands, and in general, they do not meet the high isolation requirements between actual systems.
  • Another object of the present invention is to provide a filter including the novel low pass filter path.
  • the novel low-pass filter path of the present invention comprises a metal cavity and a cover plate fixedly mounted with the metal cavity; the metal cavity is provided with a plurality of sub-cavities connected in series, and adjacent two sub-cavities are arranged a connecting window, a conductor bar is disposed in the metal cavity sequentially through the sub-cavities communicating with the respective phases, and the conductor bar is connected to two ports provided at both ends of the cavity, and the conductor bar corresponds to the connection a hole is disposed in the window, and a resonant rod having one end facing the cover is disposed in the hole; the cover plate is provided with a threaded hole corresponding to the position of the resonant rod, and each threaded hole is provided with a tuning screw
  • the metal cavity is bored through the threaded hole and is capacitively coupled to the corresponding resonant rod.
  • the tuning screw is provided with a mounting hole toward one end of the metal cavity, and a sleeve is sleeved in
  • the filter of the present invention comprises the aforementioned novel low pass filter path structure
  • the combiner of the present invention comprises the novel low pass filter path structure described above.
  • the duplexer of the present invention comprises the novel low pass filter path structure described above.
  • the present invention has the following advantages:
  • the novel low-pass filter path of the present invention and the communication cavity device using the same are based on the traditional sugar-gourd-shaped low-pass filter, and the low-impedance part is replaced by a harmonic oscillator of an equivalent inductance-capacitor series.
  • the main path, the equivalent inductance of the resonator is realized by the high impedance formed between the resonant rod and the cavity wall, and the equivalent capacitance is realized by the gap coupling between the tuning screw and the inner wall of the resonant rod.
  • the communication cavity device thus formed has a faster out-of-band degradation and can generate strong suppression in a wide frequency range outside the band, thereby satisfying the requirement of high isolation between communication systems; and at the same time, having small insertion loss, Small VSWR, low passive intermodulation, and large power capacity.
  • the tuning screw is fixed on the outer surface of the cover plate, which makes the debugging of the low-pass filter very convenient, eliminating the steps of repeatedly unpacking and debugging, improving the production efficiency of the low-pass filter and ensuring its excellent intermodulation. performance.
  • FIG. 1 is a schematic view showing the assembly structure of a novel low-pass filter path of the present invention.
  • FIG. 2 is a view showing the mounting structure of a conductor bar and a resonant rod of the novel low-pass filter path of the present invention.
  • FIG. 3 is an equivalent circuit diagram of a novel low pass filter path of the present invention.
  • an embodiment of a novel low-pass filter path of the present invention is a low-pass filter path designed in the metal cavity 1 and includes a metal cavity 1 and a metal cavity 1
  • the cover 2 is fixedly mounted.
  • a plurality of sub-cavities are formed in the metal cavity 1, and a connection window 16 is formed between the adjacent two sub-cavities 11-15, thereby sequentially connecting the sub-cavities 11-15, and a conductor bar 3 in the metal cavity traverses the metal cavity 1
  • Each of the sub-cavities 11-15 and the connecting window 16 in the longitudinal direction are fixedly connected to the ports 17, 18 provided at both ends of the metal cavity 1.
  • Resonant rods 31-34 passing through the conductor bars 3 and facing the cover plate are provided at corresponding positions of the conductor bars 3 corresponding to the respective connection windows 16.
  • the cover plate 2 is provided with a threaded hole 23 corresponding to the position where the above-mentioned resonant rods 31-34 are located, and a tuning screw 21 penetratingly coupled to the metal cavity 1 and the corresponding resonant rods 31-34 through the threaded holes 24.
  • FIG. 2 and FIG. 3 Please further combine FIG. 2 and FIG. 3 to facilitate a clearer understanding of the specific structure and electrical principle of the embodiment.
  • the plurality of sub-cavities 11-15 are arranged substantially in the same direction, that is, along a straight path, and the spatial volume of the sub-cavities 11-15 is realized according to the design of the electrical performance index.
  • the first and the last two in the direction The spatial volume of the sub-chambers 11 and 15 is relatively small, and the remaining sub-cavities 12-14 in the intermediate section are substantially identical or approximately spatial volumes, which may be considered as equal.
  • the two ends of the conductor bar 3 are respectively connected to the inner conductors (not shown) of the two ports 17, 18, and the two ports 17 and 18 are fixed on the metal cavity 1, so that the conductor bars 3 are fixed in the metal cavity.
  • the longitudinal axis of the body 1 passes through the respective sub-chambers 11-15 and the connection window 16 between adjacent sub-chambers.
  • a hole 36 is provided at a position of the conductor bar 3 corresponding to each of the connection windows 16 such that the resonance rod passes through the hole 36 and is provided with one end extending toward the cover plate 2, and the other end thereof is disposed in a stepped manner to be retained in the conductor bar 3.
  • the stepped design leaves a gap 35 between the resonant rod and the hole 36 that is welded to the conductor bar 3, thereby facilitating soldering of the resonant rod to the conductor rod 3 with solder, and the solder does not easily overflow the hole 36.
  • the heights of the resonant rods protruding from the conductor bars 3 are different, and the different resonant rods are adapted to different frequency bands and have different lengths, thereby forming a plurality of resonant rods 31-34 arranged along the same straight line.
  • the threaded hole 23 in the cover plate 2 and the tuning screw 21 passing through the threaded hole 23 are arranged in a straight line in accordance with the position of the conductor bar 3 and the resonant rods 31-34, and the external thread of the tuning screw 21 and the internal thread of the threaded hole 23 are provided. It is matched so that the depth of the tuning screw 21 deep into the metal cavity 1 can be adjusted.
  • the tuning screw 21 protrudes into the cavity and has a mounting hole at one end thereof, and the mounting hole is a through hole or a blind hole whose inner diameter is gradually reduced, and the mounting hole is used for the inner sleeve, which is made of polytetrafluoroethylene or other insulating material.
  • a media sleeve 22 is formed.
  • the end face of the tuning screw 21 exposed on the cover plate 2 has a slot or a cross slot for facilitating the rotation of the tuning screw 21, and the shaft of the end of the tuning screw 21 has a hexagonal bolt structure.
  • the mounting hole of the tuning screw 21 is stepped, that is, the hole diameter at the inlet of the mounting hole is large, and the inner diameter is smaller.
  • the media sleeve 22 is assembled with the tuning screw 21, and the dielectric sleeve 22 exposes the mounting hole of the tuning screw 21 and forms a boss.
  • the dielectric sleeve 22 is assembled with the tuning screw 21, the dielectric sleeve 22 is assembled.
  • the upper end face of the boss is raised above the end face of the tuning screw 21, which facilitates assembly, and the dielectric sleeve 22 is less likely to fall off and effectively prevents the tuning screw 21 from being short-circuited with the conductor bar 3.
  • the dielectric sleeve 22 in the tuning screw 21 can be internally sleeved with the resonant rods 31-34, thereby realizing the resonant screw 21 and the corresponding resonant rod 31-
  • the sleeve 22 and the tuning screw 21 together form an equivalent capacitive inductance in the equivalent inductor-capacitor series resonator, which can generate capacitive coupling and inductance effects, forming a series resonant circuit whose equivalent capacitive inductance is composed of the tuning screw 21 and the conductor bar 3.
  • the relative positions of the resonant rods 31-34 and the resonant rods 31-34 and the tuning screw 21 are determined.
  • the series resonant circuit forms a transmission zero point in the suppressed pass band of the low pass filtering path.
  • the series connection of the corresponding equivalent inductance and equivalent capacitance constitutes an equivalent series resonator.
  • Multiple equivalent series resonators are combined to enable the low-pass filter path to produce higher rejection (above 70%) over a wide band of out-of-band (relative bandwidth up to 45%).
  • the arrangement of the plurality of sub-cavities 11-15 may not be in the same direction, that is, arranged along a bending path, for example, the arrangement directions of the plurality of sub-cavities 11-15 form a right angle.
  • the conductor bars 3 also need to be designed to be bent.
  • the threaded holes 23 on the respective cover plates and the tuning screw 21 are arranged in an adaptive manner. It can be seen that appropriately changing the structure of the individual components of the present invention does not affect the achievement of the technical effects of the present invention.
  • the structure of the novel low-pass filter path of the present invention is applied to communication cavity devices, such as filters, combiners, and duplexers, wherein the combiner is also referred to as a splitter depending on the port usage. Better performance with its high bandwidth rejection.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

本发明公开了一种新型低通滤波通路及采用它的通信腔体器件，新型低通滤波通路包括金属腔体和盖合金属腔体的盖板，所述金属腔体内设多个顺次相连通的子腔，相邻两个子腔间设有连接窗口，金属腔体内设一根导体棒顺次贯穿相连通的子腔，在各连接窗口对应的导体棒上设有穿过导体棒而朝向盖板露出杆身的谐振杆,盖板上设有与上述谐振杆对应的螺纹孔，一组内设安装孔的调谐螺杆穿过螺纹孔而深入腔体与相应谐振杆容性耦合，且安装孔内套有介质套筒。本发明的新型低通滤波通路及采用它的通信腔体器件，电气指标优良，可外部调谐而便于加工和批量生产，采用该通路的通信腔体器件，可在带外较宽频段范围内产生较强的抑制，满足通信系统间的高隔离度要求。

Description

新型低通滤波通路及采用它的通信腔体器件 技术领域
本发明涉及一种用于对通信信号进行低通滤波的通信腔体器件，具体涉及可外部调谐的新型低通滤波通路及采用该通路结构的通信腔体器件，如滤波器、合路器和双工器。
背景技术
随着三网融合的发展以及LTE频段的启用，相对传统频段，新的频段正向着更低和更高两个方向发展。随着新的制式或系统的引入，市场对无源器件的要求越来越高。
合路器、双工器及滤波器作为无源通信装置广泛应用于通信领域，尤其是射频通信领域。而随着电视系统、视频点播系统加入到通信系统通道，需要一种高性能的低通滤波器，在实现有线电视信号正常传输的基础上，同时需要对移动通信系统有较高的抑制度。
对于低通滤波器，传统的实现方式一般是切比雪夫型的，例如常见的糖葫芦形低通滤波器，它的优点是结构简单、易于实现，但缺点是带外下降缓慢、带外抑制度低、滤波特性的一致性依赖于加工和装配的精度。这样的低通滤波器常用于抑制远端带外，一般情况下，它无法满足实际系统间的高隔离度的要求。
 技术问题
本发明的目的在于克服上述不足，提供一种带外下降较快的、带外抑制度较高的、便于外部调谐校正的低通滤波通路。
本发明的另一目的在于提供一种包含所述新型低通滤波通路的滤波器。
本发明的再一目的在于提供一种包含所述新型低通滤波通路的合路器。
本发明的再一目的在于提供一种包含所述新型低通滤波通路的双工器。
 技术解决方案
为达到上述发明的目的，本发明通过以下技术方案实现：
本发明的新型低通滤波通路，包括金属腔体和与金属腔体相固定安装的盖板；所述金属腔体内设有多个顺次相连通的子腔，相邻两个子腔之间设有连接窗口，所述金属腔体内设有一根导体棒顺次贯穿所述各相连通的子腔，并且该导体棒与腔体两端设有的两端口相连接，导体棒对应于所述连接窗口位置处设有孔洞，所述孔洞中置有一端朝向盖板的谐振杆；所述盖板上设有与上述谐振杆所处位置相对应的螺纹孔，每个螺纹孔设置一调谐螺杆用于穿过该螺纹孔深入金属腔体与相应谐振杆容性耦合，该调谐螺杆朝向金属腔体的一端设有安装孔，并且该安装孔内套接有介质套筒。
本发明的滤波器,其包含前述的新型低通滤波器通路结构
本发明的合路器,其包含前述的新型低通滤波器通路结构。
本发明的双工器,其包含前述的新型低通滤波器通路结构。
 有益效果
与现有技术相比，本发明具有如下优点：
本发明的新型低通滤波通路及采用它的通信腔体器件，是在传统的糖葫芦形低通滤波器的基础上，将其低阻抗部分代之以一个等效电感电容串联的谐振子并入主通路，该谐振子的等效电感由谐振杆与腔壁之间形成的高阻抗实现，等效电容由调谐螺杆与谐振杆内壁之间的缝隙耦合实现。这样形成的通信腔体器件，带外下降较快，并可在带外很宽的频段范围内产生较强的抑制，从而满足通信系统间的高隔离度的要求；同时，具有插入损耗小、驻波比小、无源互调低、功率容量大等优点。另一方面，调谐螺杆固定在盖板的外表面，使得低通滤波器的调试非常方便，省去以往反复拆盖调试的步骤，提高低通滤波器生产效率的同时保证了其优良的互调性能。
 附图说明
图1为本发明的新型低通滤波通路的组装结构示意图。
图2为本发明的新型低通滤波通路的导体棒与谐振杆的安装结构图。
图3为本发明的新型低通滤波通路的等效电路图。
 本发明的最佳实施方式
本发明的实施方式
下面结合附图和实施例对本发明作进一步的说明：
请参阅图1，本发明的新型低通滤波通路的实施例，该新型低通滤波通路是在金属腔体1中设计形成的低通滤波通路，包括有金属腔体1和与金属腔体1相固定安装的盖板2。金属腔体1内形成多个子腔，且在相邻两子腔11-15之间为连接窗口16，从而依次联通各子腔11-15，金属腔体内一根导体棒3横贯金属腔体1纵长方向的各子腔11-15和连接窗口16，并与金属腔体1两端设置的端口17，18固定连接。与各个连接窗口16相对应的导体棒3的相应位置上设有穿过导体棒3并朝向盖板的谐振杆31-34。盖板2上设有与上述谐振杆31-34所处位置相对应的螺纹孔23和穿过该螺纹孔24深入金属腔体1与相应谐振杆31-34容性耦合的调谐螺杆21。
请进一步结合图2和图3，便于更清楚理解本实施例的具体结构和电性原理。
所述多个子腔11-15基本沿同一方向即沿一直线路径顺次排布，子腔11-15的空间体积大小依赖于电性能指标的设计实现，较佳的，除该方向上首尾两个子腔11与15的空间体积相对较小外，其余处于中间段的子腔12-14基本上相同或相近似的空间体积，可视为等大。
所述的导体棒3两端分别与两个端口17，18的内导体（未图示）相连接，两个端口17和18固定在金属腔体1上，从而导体棒3被固定在金属腔体1的纵轴线上，从而穿过各个子腔11-15和相邻子腔间的连接窗口16。在各连接窗口16对应的导体棒3位置处具有孔洞36，使得谐振杆穿过该孔洞36而呈一端伸向盖板2设置，而其另一端设置为阶梯状被留置在导体棒3的该孔洞36之内，阶梯状的设计使得谐振杆与孔洞36之间留有与导体棒3焊接的间隙35，从而利于用焊锡将谐振杆与导体棒3相焊接，且焊锡不易溢出该孔洞36。各谐振杆伸出导体棒3而呈现的高度高低不一，不同谐振杆适应不同的频段而具有不同的长度,由此形成多个沿同一直线排布的谐振杆31-34。
盖板2上的螺纹孔23以及穿过该螺纹孔23的调谐螺杆21适应导体棒3及谐振杆31-34的位置而呈直线排布，调谐螺杆21的外螺纹与螺纹孔23的内螺纹配套，从而可调节调谐螺杆21深入金属腔体1内的深度。调谐螺杆21伸入腔体的一端具有安装孔，且该安装孔为向内孔径逐渐减小的通孔或是盲孔，该安装孔用于内套一由聚四氟乙烯或其它绝缘材料制成的介质套筒22。调谐螺杆21露在盖板2上的一端端面为便于转动调谐螺杆21而具有一字槽或十字槽，并且调谐螺杆21该端的杆身为六角螺栓结构。
调谐螺杆21的安装孔呈阶梯状，即在安装孔接入口处的孔径大，越往内孔径越小。所述介质套筒22与调谐螺杆21过盈装配,且介质套筒22露出调谐螺杆21的安装孔并形成一凸台，当介质套筒22与调谐螺杆21过盈装配后，介质套筒22上局部的凸台端面高出调谐螺杆21的端面，这样有利于装配，且介质套筒22不易脱落且有效防止调谐螺杆21与导体棒3短路。
将盖板2安装到金属腔体1上时，随着调谐螺杆21的深入，调谐螺杆21内的介质套筒22可内套谐振杆31-34，从而实现谐振螺杆21与相应谐振杆31-34之间的容性耦合，从而将调谐螺杆21、介质套筒22与导体棒3上的谐振杆31-34配合安装，如图3所示，这些谐振杆31-34、连接窗口16、介质套筒22以及调谐螺杆21一起形成了等效电感电容串联谐振子中的等效电容电感，可以产生电容耦合及电感效应，形成一个串联谐振电路，其等效电容电感由调谐螺杆21、导体棒3、谐振杆31-34及谐振杆31-34与调谐螺杆21的相对位置来决定，该串联谐振电路在低通滤波通路的抑制通带形成传输零点。
这样，相对应的等效电感和等效电容的串联构成了等效串联谐振子。多个等效串联谐振子进而相配合使低通滤波通路可以在带外很宽的频段范围内（相对带宽可达45%）产生较高的抑制度（70dB以上）。
在本发明未图示的另一实施例中，所述多个子腔11-15的排列可以不在同一方向上,即沿弯折路径排布，例如，多个子腔11-15的排列方向形成直角。作为适应性的改变，所述导体棒3也需设计成弯折状。相应的盖板上的螺纹孔23及调谐螺杆21做适应性的排布。可见，适当地改变本发明的个别部件的结构，依然不影响本发明的技术效果的实现。
将本发明的新型低通滤波通路的结构应用于通信腔体器件，如滤波器、合路器以及双工器中，其中的合路器根据端口使用情况的不同也被称为分路器，可更好地发挥其高带宽抑制度的性能。
上述实施例仅用以说明本发明而并非限制本发明所描述的技术方案；因此，尽管本说明书参照上述的各个实施例对本发明已进行了详细的说明，但是，本领域的普通技术人员应当理解，仍然可以对本发明进行修改或者等同替换；而一切不脱离本发明的精神和范围的技术方案及其改进，其均应涵盖在本发明的权利要求范围当中。
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Claims (11)

  1. 新型低通滤波通路，包括金属腔体和与金属腔体相固定安装的盖板；所述金属腔体内设有多个顺次相连通的子腔，相邻两个子腔之间设有连接窗口，所述金属腔体内设有一根导体棒顺次贯穿所述各相连通的子腔，并且该导体棒与腔体两端设有的两端口相连接，导体棒对应于所述连接窗口位置处设有孔洞，所述孔洞中置有一端朝向盖板的谐振杆；所述盖板上设有与上述谐振杆所处位置相对应的螺纹孔，每个螺纹孔设置一调谐螺杆用于穿过该螺纹孔深入金属腔体与相应谐振杆容性耦合，该调谐螺杆朝向金属腔体的一端设有安装孔，并且该安装孔内套接有介质套筒。
  2. 根据权利要求1所述的新型低通滤波通路，其特征在于：所述多个子腔沿同一方向排布，所述导体棒相应呈直线状。
  3. 根据权利要求1所述的新型低通滤波通路，其特征在于：所述多个子腔不在同一方向上排布，所述导体棒相应呈弯折状。
  4. 根据权利要求1至3中任意一项所述的新型低通滤波通路，其特征在于：所述谐振杆留置在导体棒的孔洞内的一端设置为阶梯状，与导体棒在孔洞处相焊接，该导体棒上的每个谐振杆高出相应孔洞的高度一致或不一致。
  5. 根据权利要求1至3中任意一项所述的新型低通滤波通路，其特征在于：所述调谐螺杆的安装孔为通孔或盲孔。
  6. 根据权利要求5所述的新型低通滤波通路，其特征在于：所述调谐螺杆的安装孔呈阶梯状，其在安装孔接入口处的孔径大于安装孔内部的孔径。
  7. 根据权利要求6所述的新型低通滤波通路，其特征在于：所述介质套筒与调谐螺杆过盈装配，且介质套筒露出调谐螺杆的安装孔并形成一凸台。
  8. 根据权利要求1至3中任意一项所述的新型低通滤波通路，其特征在于：所述多个子腔中，位于首尾两个子腔之间的其余子腔均等大。
  9. 一种滤波器，其特征在于，包含如权利要求1至8中任意一项所述的新型低通滤波通路的整体结构。
  10. 一种合路器，其特征在于，包含如权利要求1至8中任意一项所述的新型低通滤波通路的整体结构。
  11. 一种双工器，其特征在于，包含如权利要求1至8中任意一项所述的新型低通滤波通路的整体结构。
PCT/CN2013/079284 2013-01-29 2013-07-12 新型低通滤波通路及采用它的通信腔体器件 WO2014117482A1 (zh)

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