WO2014101866A1 - 一种光固化快速成型装置及其方法 - Google Patents

一种光固化快速成型装置及其方法 Download PDF

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Publication number
WO2014101866A1
WO2014101866A1 PCT/CN2013/090863 CN2013090863W WO2014101866A1 WO 2014101866 A1 WO2014101866 A1 WO 2014101866A1 CN 2013090863 W CN2013090863 W CN 2013090863W WO 2014101866 A1 WO2014101866 A1 WO 2014101866A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive resin
fluid state
imaging component
light source
carrier
Prior art date
Application number
PCT/CN2013/090863
Other languages
English (en)
French (fr)
Inventor
刘彦君
蒋程宇
张振宇
Original Assignee
Liu Yanjun
Jiang Chengyu
Zhang Zhenyu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liu Yanjun, Jiang Chengyu, Zhang Zhenyu filed Critical Liu Yanjun
Priority to US14/653,860 priority Critical patent/US20150328833A1/en
Publication of WO2014101866A1 publication Critical patent/WO2014101866A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058—Liquid or visquous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing

Definitions

  • TECHNICAL FIELD This application relates to the field of rapid prototyping technology in the manufacturing industry, and more particularly to a photocuring rapid prototyping apparatus and a corresponding method thereof.
  • Rapid Prototyping (RP) technology is an advanced manufacturing technology developed on the basis of modern CAD/CAM technology, laser technology, computer numerical control technology, precision servo drive technology and new materials.
  • CAD/CAM technology CAD/CAM technology
  • laser technology CAD/CAM technology
  • computer numerical control technology CAD/CAM technology
  • precision servo drive technology new materials.
  • this technology has a positive role in promoting enterprise product innovation, shortening new product development cycle, and improving product competitiveness.
  • Rapid prototyping technology can be divided into various categories depending on materials used, molding methods, etc., among which light curing rapid prototyping is more common.
  • the principle of photocuring is: using a photosensitive state of a fluid state (UV) to form a polymerization reaction under illumination, the light source is irradiated according to the cross-sectional shape of the object to be molded, and the photosensitive resin in a fluid state is solidified and molded.
  • the photocuring rapid prototyping device for solidifying and forming a workpiece by using a photosensitive resin in a fluid state mainly includes two types, namely, a selective laser curing device (SLA, also known as a stereoscopic solid-solid device) and a DLP mask. Mold curing device.
  • SLA selective laser curing device
  • DLP mask a selective laser curing device
  • the former uses a laser galvanometer to scan a two-dimensional pattern on a fluid-type photosensitive resin, so that the resin of the irradiated portion is solidified and adhered layer by layer to form a workpiece; the latter uses a DLP projector to project a two-dimensional image on a fluid-form photosensitive resin. The cured portion of the resin in the irradiated portion is layered and added to form a workpiece.
  • these two types of photo-curing rapid prototyping devices use either a laser galvanometer or a DLP projector, and the optical paths of the two components are complicated, and there is a long delay, which affects the effect of photocuring rapid prototyping, and reduces The efficiency of light curing rapid prototyping.
  • a photocuring rapid prototyping apparatus provided by an embodiment of the present application includes: a carrier for carrying a photosensitive resin in a fluid state, an imaging member for displaying a two-dimensional figure, and a region of the two-dimensional graphic displayed by the imaging member The transparent state of the other regions within the range of the imaging member other than the dimensional pattern is reversed, and a light source for polymerizing the photosensitive resin in a fluid state, the light source and the carrier being located on the opposite side of the imaging member.
  • the apparatus further includes a first moving member and a first conveying member, the first moving member is configured to move the cured photosensitive resin away after curing of the photosensitive resin in a fluid state in the carrier
  • the direction of the light source moves a first gap
  • the first conveying member is configured to transport a photosensitive resin in a new fluid state to the carrier body to fill the first gap, wherein the first gap is smaller than the photosensitive state of the fluid state The depth of cure of the resin.
  • the apparatus further includes a second moving part and a second conveying part
  • the second moving part is configured to move the imaging part away from the photosensitive resin after curing in a fluid state in the carrier Moving the second gap in a direction of the carrier
  • the second conveying member is configured to convey a new fluid state photosensitive resin into the carrier body to fill the second gap, and the second gap is smaller than the fluid state photosensitive resin The depth of cure.
  • the carrier for carrying the photosensitive resin in a fluid state is a U-shaped container
  • the image forming member for exhibiting a two-dimensional pattern is a liquid crystal panel for polymerizing a photosensitive resin in a fluid state
  • the light source is a light source having a wavelength in the range of 350 to 400 nanometers.
  • the apparatus includes: a carrier for carrying a photosensitive resin in a fluid state, an imaging member for exhibiting a two-dimensional figure, the region in which the two-dimensional graphic is displayed by the imaging member, and other components within the range of the imaging member other than the two-dimensional graphic a transparent state of the region, and a light source for polymerizing the photosensitive resin in a fluid state, the light source and the carrier being on the same side of the image forming member, the device further comprising a reflecting member, wherein the reflecting member is In the light reflecting the light source, the emitted light may be irradiated to the photosensitive resin in a fluid state through the image forming member.
  • the embodiment of the present application provides a photocuring rapid prototyping method.
  • the method includes:
  • the method further includes:
  • the cured photosensitive resin is moved to a first gap away from the light source, the first gap being smaller than a curing depth of the photosensitive resin in a fluid state;
  • the method further includes:
  • the image forming member is moved to a second gap in a direction away from the carrier, the second gap being smaller than a curing depth of the photosensitive resin in a fluid state;
  • the photocuring rapid prototyping apparatus includes a carrier carrying a photosensitive resin in a fluid state, an imaging member exhibiting a two-dimensional image, and a light source for illuminating the photosensitive resin, and the light source and the carrier are located on the opposite side or the same side of the imaging member.
  • the same side also includes the transmitting part.
  • the device of the embodiment of the present application has a simple structure and a small number of components, which reduces the volume of the photo-curing rapid prototyping device, and the imaging component used is low in manufacturing cost compared with the technical laser galvanometer or DLP projector. Less material.
  • FIG. 1 is a schematic structural diagram of an embodiment of a photocuring rapid prototyping apparatus of the present application
  • FIG. 2 is a schematic structural diagram of another embodiment of a photocuring rapid prototyping apparatus of the present application
  • FIG. 3 is based on FIG. 1 of the present application.
  • Figure 2 is a flow chart of the method of the device embodiment of Figure 2.
  • Figure 4 is a flow chart of a method based on another embodiment of a photocuring rapid prototyping apparatus of the present application.
  • DETAILED DESCRIPTION OF THE EMBODIMENTS In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present application. The described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the scope
  • composition of an embodiment of a photocuring rapid prototyping apparatus of the present application includes: a carrier 101, an imaging member 102, and a light source 103, the carrier 101 and the light source 103 being located on opposite sides of the imaging member 102, wherein:
  • the carrier 101 is used to carry the photosensitive resin 100 in a fluid state.
  • the carrier may be a container having a containment shape, such as a U-shaped container, which is generally suitable for thick depth and regular edge portions.
  • the molded object can also be embodied as a carrier of a flat structure, which is generally suitable for a molded object requiring a deep depth, a large area, and a regular body portion;
  • An imaging member 102 for displaying a two-dimensional figure of a cross section of an object to be molded, and a two-dimensional image displayed on the imaging member can be generally divided into two connected regions, that is, a region included in the two-dimensional graphic itself and a two-dimensional image.
  • the area within the surface of the imaging member, the transparent state of the two parts is opposite, that is, two cases are included: one case is that the two-dimensional graphic portion is dark (not transmitting light), and the other portion is transparent (transmissive) Light) In another case, the two-dimensional graphics portion is in a transparent state, and the other portions are in a dark state.
  • the photosensitive resin covered by the dark region will not undergo polymerization reaction, and will not be solidified, and other portions can be cured quickly.
  • This case is suitable for making inclusive two-dimensional graphics (hollowing) Mold, similar to the engraving method of Chinese character carving; the latter is because the dark part is the area other than the two-dimensional figure, and there is no illumination in this part of the area. It should not be cured, and other parts will solidify under illumination.
  • This situation is suitable for the workpieces that make the shape of the two-dimensional figure itself, similar to the embossing method of Chinese characters.
  • the imaging member of the present embodiment may be embodied as any physical device capable of imaging, and the meaning of "imaging” herein may be mechanical, for example, by manually attaching a cross-sectional pattern of a target molded body to be molded to the imaging member.
  • imaging On the surface, this is usually suitable for small-scale rapid prototyping scenarios; it can also be electronic, such as generating control signals through automated equipment, and imaging two-dimensional images on the surface of imaging components, such as liquid crystal screens, which can pass through circuits. Controlling the shape of the two-dimensional graphics on the LCD screen is more suitable for large-scale rapid prototyping environments.
  • the use of a liquid crystal panel as an imaging member has a higher resolution than a laser galvanometer or DLP in the prior art.
  • the light source 103 is a light source 103 for polymerizing a photosensitive resin in a fluid state, and the light source 103 and the carrier 101 are located on the opposite side of the image forming member 102.
  • the action segment of the light source can be appropriately selected. For example, it has been experimentally proved that the wavelength of the light source can be preferred in this embodiment. Light source in the 350 to 400 nm range.
  • the working principle of the photo-curing device of the present embodiment is: after the light source 103 emits light, the light that is irradiated onto the imaging member 102 is irradiated due to the different brightness and dark states of the two-dimensional graphics and the two-dimensional graphics exhibited by the imaging member 102.
  • One part can be irradiated onto the photosensitive resin in a fluid state through the transparent portion in the image forming member, and the other portion of the light which cannot pass through the image forming member will not be irradiated onto the photosensitive resin in a fluid state, thereby causing two different kinds of photosensitive resin in a fluid state.
  • the photosensitive resin in the fluid state irradiated by the light will be rapidly solidified by polymerization, and the photosensitive resin which is not in the fluid state irradiated by the light will not be polymerized and will remain in the original state. If the two-dimensional image is in a dark state, after the above process, a cured photosensitive resin molded body containing a two-dimensional image will be presented; if the two-dimensional image is in a transparent state, after the above process, the solidified photosensitive image of the two-dimensional graphic will be directly imaged. Resin molded body.
  • the photocuring rapid prototyping apparatus of the present embodiment includes a carrier that carries a photosensitive resin in a fluid state, an imaging member that exhibits a two-dimensional image, and a light source that illuminates the photosensitive resin, and the light source and the carrier are located on the opposite side of the imaging member.
  • the present embodiment can at least achieve the following three technical effects: (1) Since the optical path portion in the photocuring rapid prototyping process is composed of only the imaging member and the light source, the positional relationship is simple and reduced. The optical path complexity of the photocuring process reduces the optical path delay.
  • the apparatus of the present embodiment includes three component parts, which have a simple structure and a small number of parts, and reduce the total volume of the photocuring rapid prototyping apparatus.
  • the imaging member employed in the apparatus of the present embodiment has a low manufacturing cost and a small amount of materials for use with respect to a technical laser galvanometer or DLP projector.
  • the carrier 101 and the imaging member 102 of the above embodiment may be combined into a "one" to be a component, that is, the imaging member is simultaneously used as a photosensitive resin carrying a fluid state.
  • the carrier or the carrier of the photosensitive resin carrying the fluid state simultaneously has a function of exhibiting a two-dimensional figure.
  • the light source 103 and the imaging member 102 of the above embodiment may be combined into a "one" to form a component, that is, the two-dimensional graphic displayed by the imaging member has a function of emitting light (for example, using plasma electrons). Screen), or an image in which the light source exhibits a two-dimensional image (for example, controlling the light-emitting states of the plurality of light source units such that the whole of the light source units exhibit a two-dimensional pattern).
  • the solution of the above embodiment can achieve the object of the present invention, in the actual application process, it is not only required to produce a cured molded body of a sheet structure in the form of "two-dimensional graphics", but more demand is to produce a three-dimensional shape.
  • the solidified body of the "three-dimensional structure” can be regarded as being cumulatively bonded by a plurality of two-dimensional pattern sections, so that the above-described forming process can be continuously cycled to achieve the object.
  • the present application also preferably includes a moving member for injecting a new gap, injecting a new fluid state photosensitive resin into the gap, and then performing the above-described illumination process to re-appear the cured molded body.
  • This cured molded body is adhered to the last cured molded body, and the above-described operation is performed a plurality of times to obtain a cured molded body having a desired three-dimensional structure.
  • the moving parts and the conveying parts can be implemented in various specific ways. Two methods are described below:
  • the first moving part 204 and the first conveying part 205 are further included in the foundation of the above device embodiment (thus constituting another embodiment of the photocuring rapid prototyping apparatus of the present application, and the foregoing embodiment
  • the same components are respectively labeled as a carrier 201, an imaging member 202, a light source 203, a photosensitive resin 200 in a fluid state
  • the first moving member 104 is used to cure the molded resin in a fluid state after being solidified in the carrier.
  • the photosensitive resin moves the first gap away from the light source, and the first conveying member 105 is configured to convey a photosensitive resin of a new fluid state to the carrier, Filling the first gap.
  • the moving part in the present mode can be represented as a mechanical support, and the conveying member can also be embodied as a mechanical transmission.
  • the "first gap” generally selects a curing depth of the photosensitive resin smaller than the fluid state, so that the injected fluid state is photosensitive.
  • the resin can be sufficiently cured.
  • the gap can be as small as possible, so that each "layer” of light curing is as thin as possible, thereby improving the resolution and precision of the molding on the one hand, and between "layer” and “layer” on the other hand.
  • the adhesion is more stable and the stability of the three-dimensional structure is enhanced; if the focus is on the speed of curing, under the condition that the curing depth is less than the photosensitive resin, the gap can be as large as possible, so that each layer of light curing "As thick as possible, the number of times of photocuring of a molded body of a three-dimensional structure having the same height is reduced, and the overall speed of photocuring is increased.
  • the second method further comprising a second moving part and a second conveying part on the base of the device embodiment, wherein the second moving part is used for curing the photosensitive resin in the fluid state in the bearing body, and then forming the imaging part Moving a second gap away from the carrier, the second conveying member is configured to convey a new fluid state photosensitive resin into the carrier to fill the second gap, the second gap being smaller than the fluid state The depth of cure of the resin.
  • This method is opposite to the moving direction of the first mode, which is considered to be more difficult in moving the carrier carrying the liquid state photosensitive resin in practical use than moving the imaging member, and therefore, it is easier to adopt a method of moving the image forming member.
  • the above-described embodiment improved on the basis of the first embodiment can produce a molded body of a three-dimensional structure without any limitation on the shape of the molding.
  • a molded body for example, a cylindrical molded body
  • a molded body having a different cross section for example, a gourd molded body
  • the pattern i.e., the cross-sectional pattern of the target molded body
  • Step S301 injecting a photosensitive state of a fluid state into a carrier of a photosensitive resin carrying a fluid state a resin exhibiting a two-dimensional graphic on an imaging member exhibiting a two-dimensional graphic, the image forming component exhibiting a two-dimensional graphic in a region opposite to a transparent state of other regions in the imaging component range other than the two-dimensional graphic;
  • Sub-steps a step of injecting a photosensitive resin and exhibiting a two-dimensional pattern, both of which are necessary steps for completing photo-curing rapid prototyping, but since they are both two preparatory steps of photo-curing, the application is not limited The order of their execution may be the first step of injecting the photosensitive resin, or the step of displaying the two-dimensional pattern, or two simultaneously, depending on the factors considered in the actual application process and the environment in which it is faced.
  • Step S302 illuminating the imaging member with a light source located on the opposite side of the imaging member from the carrier so as to be within a range of an imaging component other than the region where the two-dimensional image is displayed or the two-dimensional image is displayed through the imaging member Other areas cure the photosensitive resin in a fluid state;
  • the "single layer" photocured molded body is completed, and if the purpose of photocuring is to obtain such a "single layer” molded body, the subsequent steps can be stopped. If it is desired to produce a three-dimensionally shaped molded body, it is necessary to carry out the injection operation of the photosensitive resin in a liquid state a plurality of times and to move out a new void for filling the photosensitive resin, that is, the following steps are performed.
  • Step S303 after the fluid state photosensitive resin in the carrier body is solidified and molded, the cured photosensitive resin is moved in a direction away from the light source, the first gap d, the photosensitive resin in a fluid state Curing depth
  • the curing depth is the depth at which the photosensitive resin in the fluid state can undergo polymerization under a certain illumination condition. If it is larger than this depth, the photosensitive resin away from the light source side may not be polymerized well or the polymerization reaction may be incomplete.
  • the molded body cannot achieve the degree of curing (hardening) of the target.
  • Step S304 filling the first gap into the carrier by injecting a new fluid state photosensitive resin
  • Step S305 illuminating the imaging member with a light source located on the opposite side of the imaging member from the carrier so as to pass through the region of the two-dimensional image or the imaging component outside the two-dimensional image displayed by the imaging member Other areas cure the newly injected fluid state photosensitive resin;
  • Step S306 determining whether the curing molding of the photosensitive resin reaches a preset height, and if so, the knot The bundle flow; if not, returns to step S303.
  • the above apparatus or method embodiment describes the case where the light source and the carrier of the photosensitive resin carrying the fluid state are located on the opposite side of the imaging member.
  • the composition of the composition can be appropriately deformed to obtain light of other constituent structures.
  • Curing the rapid prototyping device is a composition showing an embodiment of another photocuring rapid prototyping apparatus, which is different from the above apparatus embodiment in that the light source and the carrier are located on the same side of the image forming member, in this case, light curing
  • the rapid device further includes a reflecting member for reflecting the light of the light source so that the reflected light can be irradiated to the photosensitive resin in a fluid state through the image forming member, so that the object of the present invention can also be achieved.
  • Fig. 4 shows the flow of the method, namely:
  • Step S401 injecting a photosensitive resin in a fluid state into a carrier of a photosensitive resin carrying a fluid state, and exhibiting a two-dimensional graphic on an imaging member exhibiting a two-dimensional figure, the region of the two-dimensional graphic and the two-dimensional graphic exhibited by the imaging component
  • the transparent state of the other regions within the range of the outer imaging member is reversed;
  • step S402 illuminating the imaging member with the light source on the same side of the imaging member as the carrier member through the reflective member so that the light reflected by the reflective member transmits The region in which the two-dimensional image exhibited by the imaging member or other region within the range of the imaging member other than the two-dimensional image solidifies the photosensitive resin in a fluid state.
  • a new gap can be injected between the cured layer and the image forming member by adding a moving step, thereby injecting a new fluid state into the gap.
  • the photosensitive resin, a new thin layer is formed, and a plurality of thin layers are automatically adhered together to form a solid three-dimensional structure.
  • the object of the present invention can be achieved by curing the resin.
  • each embodiment of the present specification focuses on differences from other embodiments, and the same similar parts between the respective embodiments can be referred to each other.
  • the description is relatively simple, and the relevant parts can be referred to the description of the method embodiment.
  • the components of the device embodiments described above may or may not be physically separated, and may be made into a complete whole in the production, or may be separately fabricated, and then installed as needed to achieve the present.
  • the device scheme of the embodiment of the present application actually constitutes a 3D printer, and by controlling the two-dimensional cross-sectional view input to the 3D printer, the photosensitive resin in the fluid state can be used to print various desired targets. Molded body.

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Abstract

本申请实施例公开了一种光固化快速成型装置。该装置包括：用于承载流体状态的光敏树脂的承载体，用于展现二维图形的成像部件，所述成像部件展现的二维图形所在区域与二维图形之外的成像部件范围内的其他区域的透明状态相反，以及用于使流体状态的光敏树脂发生聚合反应的光源，所述光源与所述承载体位于所述成像部件异侧。本申请还公开了一种光固化快速成型方法，以及另一种光固化快速成型装置以及对应方法。本申请的实施例减小了光路复杂度，能够提高光固化快速成型的效果。

Description

一种光固化快速成型装置及其方法 本申请要求于 2012年 12 月 31 日提交中国国家知识产权局、 申请号为 201210592723.6、 发明名称为 "一种光固化快速成型装置及其方法" 的中国专 利申请的优先权， 该在先申请的全部内容通过引用结合在本申请中。
技术领域 本申请涉及制造业中快速成型技术领域，特别是涉及一种光固化快速成型 装置及其相应的方法。
背景技术
快速成型 （ Rapid Prototyping, RP )技术是在现代 CAD/CAM技术、 激光 技术、计算机数控技术、精密伺服驱动技术及新材料等技术基 之上发展起来 的一项先进制造技术。 该技术作为制造业企业新产品开发的一项关键共性技 术， 对促进企业产品创新、 缩短新产品开发周期、提高产品竟争力有积极推动 作用。
快速成型技术根据使用材料、成型方式等的不同可划分为多种类别， 其中 较为常见的是光固化快速成型。 光固化成型的原理是： 利用流体状态的光敏树 月旨 （UV )在光照下发生聚合反应的特点， 将光源按照待成型物体的截面形状 进行照射， 使流体状态的光敏树脂固化成型。 目前， 利用流体状态的光敏树脂 固化成型制作工件的光固化快速成型装置主要包括两种，即选择性激光固化装 置 ( Stereo lithography Appearance, SLA, 又称为立体光固 4匕成型装置)和 DLP掩模光固化装置。 前者采用激光振镜在流体形态的光敏树脂上扫描二维 图形， 使受照射部分的树脂固化粘附逐层累加形成工件； 后者采用 DLP投影 仪在流体形态的光敏树脂上投射二维图形，使受照射部分的树脂固化粘附逐层 累加形成工件。 然而， 这两种光固化快速成型装置由于或者采用激光振镜， 或 者采用 DLP投影仪， 而这种两种部件的光路复杂， 存在较长延时， 影响到光 固化快速成型的效果， 降低了光固化快速成型的效率。
发明内容
为解决上述技术问题，本申请实施例提供了一种光固化快速成型装置及其 对应的方法， 以简化光固化快速成型的光路， 提高光固化快速成型的效果。 本申请实施例提供的一种光固化快速成型装置包括：用于承载流体状态的 光敏树脂的承载体， 用于展现二维图形的成像部件， 所述成像部件展现的二维 图形所在区域与二维图形之外的成像部件范围内的其他区域的透明状态相反， 以及用于使流体状态的光敏树脂发生聚合反应的光源，所述光源与所述承载体 位于所述成像部件异侧。
优选地， 所述装置还包括第一移动部件和第一输送部件， 所述第一移动部 件用于在所述承载体内的流体状态的光敏树脂固化成型后，将已固化成型的光 敏树脂向远离所述光源的方向移动第一间隙，所述第一输送部件用于向所述承 载体内输送新的流体状态的光敏树脂， 以填充所述第一间隙， 所述第一间隙小 于流体状态的光敏树脂的固化深度。
优选地， 所述装置还包括第二移动部件和第二输送部件， 所述第二移动部 件用于在所述承载体内的流体状态的光敏树脂固化成型后，将所述成像部件向 远离所述承载体的方向移动第二间隙，所述第二输送部件用于向所述承载体内 输送新的流体状态的光敏树脂， 以填充所述第二间隙， 所述第二间隙小于流体 状态的光敏树脂的固化深度。
进一步优选地， 所述用于承载流体状态的光敏树脂的承载体为 U型容器， 所述用于展现二维图形的成像部件为液晶屏，所述用于使流体状态的光敏树脂 发生聚合反应的光源为波长在 350至 400纳米范围内的光源。
本申请实施例还提供了另一种光固化快速成型装置。该装置包括： 用于承 载流体状态的光敏树脂的承载体， 用于展现二维图形的成像部件， 所述成像部 件展现的二维图形所在区域与二维图形之外的成像部件范围内的其他区域的 透明状态相反， 以及用于使流体状态的光敏树脂发生聚合反应的光源， 所述光 源与所述承载体位于所述成像部件同侧， 所述装置还包括反射部件， 所述反射 部件用于反射所述光源的光， 射的光可经过所述成像部件照射到流体状态 的光敏树脂。
本申请实施例提供了一种光固化快速成型方法。 该方法包括：
向承载流体状态的光敏树脂的承载体内注入流体状态的光敏树脂，在展现 二维图形的成像部件上展现二维图形，所述成像部件展现的二维图形所在区域 与二维图形之外的成像部件范围内的其他区域的透明状态相反； 使用与所述承载体位于所述成像部件异侧的光源照射所述成像部件，以便 透过所述成像部件展现的二维图像所在区域或二维图像之外的成像部件范围 内的其他区域使流体状态的光敏树脂固化成型。
优选地， 所述方法还包括：
在所述承载体内的流体状态光敏树脂固化成型后，将已固化成型的光敏树 脂向远离所述光源的方向移动第一间隙，所述第一间隙小于流体状态的光敏树 脂的固化深度；
向所述承载体内注入新的流体状态的光敏树脂填充所述第一间隙； 使用与所述承载体位于所述成像部件异侧的光源照射所述成像部件，以便 透过所述成像部件展现的二维图像所在区域或二维图像之外的成像部件范围 内的其他区域使新注入的流体状态的光敏树脂固化成型。
优选地， 所述方法还包括：
在所述承载体内的流体状态光敏树脂固化成型后，将所述成像部件向远离 所述承载体的方向移动第二间隙，所述第二间隙小于流体状态的光敏树脂的固 化深度；
向所述承载体内注入新的流体状态的光敏树脂填充所述第二间隙； 使用与所述承载体位于所述成像部件异侧的光源照射所述成像部件，以便 透过所述成像部件展现的二维图像所在区域或二维图像之外的成像部件范围 内的其他区域使新注入的流体状态的光敏树脂固化成型。
本申请实施例提供的光固化快速成型装置包括承载流体状态的光敏树脂 的承载体、展现二维图像的成像部件以及用于照射光敏树脂的光源， 光源与承 载体位于成像部件异侧或同侧， 同侧时还包括发射部件。 与现有技术相比， 由 于本申请实施例的光路部分仅由成像部件和光源组成，位置关系简单， 降低了 光固化过程的光路复杂度，减少了光路延迟，从而提高了光固化快速成型效果。 此外， 本申请实施例的装置结构简洁、 部件数量少， 降低了光固化快速成型装 置的体积， 而且， 采用的成像部件相对于技术的激光振镜或 DLP投影仪而言， 制作成本低、 使用材料少。
附图说明 实施例或现有技术描述中所需要使用的附图作简单地介绍。 显而易见地， 以下描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人 员而言， 还可以根据这些附图所示实施例得到其它的实施例及其附图。
图 1为本申请的一种光固化快速成型装置实施例的组成结构示意图； 图 2为本申请的另一种光固化快速成型装置实施例的组成结构示意图； 图 3为本申请的基于图 1、 图 2所述装置实施例的方法的流程图； 图 4为本申请的基于再一种光固化快速成型装置实施例的方法的流程图。 具体实施方式 为了使本技术领域的人员更好地理解本申请中的技术方案，下面将结合本 申请实施例中的附图， 对本申请实施例中的技术方案进行清楚、 完整地描述， 显然， 所描述的实施例仅仅是本申请一部分实施例， 而不是全部的实施例。 基 于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获 得的所有其他实施例， 都应当属于本申请保护的范围。
参见图 1 , 该图示出了本申请的光固化快速成型装置实施例的组成结构。 该实施例包括： 承载体 101、成像部件 102和光源 103 ,承载体 101与光源 103 位于成像部件 102的异侧， 其中：
承载体 101 , 该承载体用于承载流体状态的光敏树脂 100, 实际应用过程 中， 该承载体可以是具有包容形状的容器， 比如 U型容器， 这通常适用于要 求深度厚、 边缘部分规整的成型对象， 也可以体现为平板结构的载体， 这通常 适用于要求深度薄、 面积大、 主体部分规整的成型对象；
成像部件 102, 该部件用于展现待成型对象截面的二维图形， 展现在成像 部件上的二维图像通常可区分为两个连通区域，即二维图形本身包含的区域和 二维图像之外成像部件表面范围之内的区域， 这两部分区域的透明状态相反， 即包括两种情形： 一种情形是二维图形部分为暗色状态 （不能透过光线）、 其 他部分为透明状态（可以透射光线）， 另一种情形是二维图形部分为透明状态、 其他部分为暗色状态。前者由于暗色部分不能透过光线，被该暗色区域遮住的 光敏树脂将不发生聚合反应， 不会固化成型， 而其他部分则可以迅速固化， 这 种情形适用于制作包容二维图形的 （镂空）模具， 类似于汉字雕刻的阴刻法； 后者由于暗色部分为二维图形之外的区域，这部分区域没有光照不发生聚合反 应， 不被固化， 其他部分在光照下发生固化， 这种情形适用于制作二维图形本 身形状的工件， 类似于汉字雕刻的阳刻法。本实施例的成像部件具体实现时可 以是任何能够成像的物理设备， 这里 "成像" 的含义可以是机械性的， 比如， 通过人工将待成型的目标成型体的截面图形粘附在成像部件的表面上，这通常 适用于小规模的快速成型的场景； 也可以是电子性的， 比如通过自动化设备产 生控制信号， 在成像部件的表面成像出二维图像， 常见的如液晶屏， 可以通过 电路控制液晶屏上的二维图形的形状，这较多地适用于大规模的快速成型的环 境。 此外， 采用液晶屏作为成像部件在现有工艺下比激光振镜或 DLP具有更 高的分辨率。
光源 103 ,用于使流体状态的光敏树脂发生聚合反应的光源 103 ,光源 103 与承载体 101位于成像部件 102的异侧。在实际应用过程中， 考虑到流体状态 的光敏树脂的发生聚合反应的速度、深度等因素， 可以对光源的作用语段进行 适当选择， 比如， 经实验证明， 本实施例可以优选光源的波长在 350 至 400 纳米范围的光源。
本实施例的光固化成型装置的工作原理是： 光源 103发出光后， 由于成像 部件 102展现的二维图形与二维图形之外的区域存在不同的明暗状态，照射到 成像部件 102 上的光线一部分能够透过成像部件中的透明部分照射到流体状 态的光敏树脂上，另一部分不能透过成像部件的光将无法照射到流体状态的光 敏树脂上，从而使得流体状态的光敏树脂出现两种不同的变化方向： 被光线照 射到的流体状态的光敏树脂将发生聚合反应迅速固化，没有被光线照射到的流 体状态的光敏树脂不发生聚合反应，仍然保持原有状态。如果二维图形为暗色 状态， 经过上述过程后， 将呈现出包容二维图形的固化光敏树脂成型体； 如果 二维图像为透明状态， 经过上述过程后，将直接成像出二维图形的固化光敏树 脂成型体。
本实施例的光固化快速成型装置包括承载流体状态的光敏树脂的承载体、 展现二维图像的成像部件以及用于照射光敏树脂的光源，光源与承载体位于成 像部件异侧。与现有技术相比，本实施例至少可以取得如下三方面的技术效果： ( 1 ) 由于本实施例实现光固化快速成型过程中的光路部分仅由成像部件和光 源组成， 位置关系简单， 降低了光固化过程的光路复杂度， 减少了光路延迟， 而且减少了插入光路元件（比如透镜、反射镜）带来的像差、畸变等光学误差， 从而提高了光固化快速成型效果。 （2 )本实施例的装置包括三个组成部件， 其 结构简洁、 部件数量少， 降低了光固化快速成型装置的总体积。 （3 )本实施例 的装置采用的成像部件相对于技术的激光振镜或 DLP投影仪而言， 制作成本 低、 使用材料少。
需要说明的是，在实际应用过程中， 上述实施例的承载体 101和成像部件 102 可以合 "二" 为 "一"， 作成一个部件， 即： 使成像部件同时作为承载流 体状态的光敏树脂的承载体，或者使承载流体状态的光敏树脂的承载体同时具 有展现二维图形的功能。 同样地，还可以将上述实施例的光源 103和成像部件 102合 "二" 为 "一"， 作成一个部件， 即： 使成像部件展现的二维图形同时 具有发光的功能（比如， 采用等离子电子屏）， 或者， 使光源呈现出二维图形 的图像（比如， 对多个光源单元的发光状态进行控制， 使这些光源单元的整体 呈现出二维图形）。
上述实施例的方案尽管能够实现本申请的发明目的，但是，在实际应用过 程中， 不仅需要制作出 "二维图形"形式的薄片结构的固化成型体， 而且更多 的需求是制作立体形状的 "三维结构" 的固化成型体。 "三维结构" 的固化成 型体可以看作是由多个二维图形截面累积贴和而成，这样可以将上述成型的过 程连续循环进行即可实现该目的。 为此， 本申请还优选包括移动部件和输送部 件，移动部件用于在产生新的空隙，在该空隙内注入新的流体状态的光敏树脂， 然后进行上述的光照过程，再次出现固化成型体，该固化成型体粘附在上次的 固化成型体上，多次进行这样的操作，即可得到需要的三维结构的固化成型体。 这里的移动部件和输送部件可以采用多种具体实现方式，下面列举两种方式予 以说明：
方式之一： 参见图 2, 在上述装置实施例的基石出上进一步包括第一移动部 件 204和第一输送部件 205 (从而构成本申请的又一个光固化快速成型装置实 施例， 与前述实施例相同的部件分别标号为承载体 201、 成像部件 202、 光源 203、 流体状态的光敏树脂 200 ), 第一移动部件 104用于在承载体内的流体状 态的光敏树脂固化成型后，将已固化成型的光敏树脂向远离光源的方向移动第 一间隙， 第一输送部件 105用于向承载体内输送新的流体状态的光敏树脂， 以 填充所述第一间隙。 本方式中的移动部件可以表现为一个机械支架，输送部件 也可以表现为机械传动装置， 这里的 "第一间隙"通常选择小于流体状态的光 敏树脂的固化深度， 以使注入的流体状态的光敏树脂能够得到充分的固化。在 实际应用过程中， 除这种对 "间隙" 的约束条件外， 根据进一步实现的目的不 同还可能强化对该间隙的限制： 如果重点考虑的是固化成型的效果，在满足小 于光敏树脂的固化深度的条件下，该间隙可以尽可能小，使光固化的每个 "层" 尽可能的薄，从而一方面可以提高成型的分辨率和精度，一方面使"层"与"层" 之间粘附更稳固，增强三维立体结构的稳定性； 如果重点考虑的是固化成型的 速度， 在满足小于光敏树脂的固化深度的条件下， 该间隙可以尽可能大， 使光 固化的每个 "层"尽可能厚， 从而使成型相同高度的三维立体结构的成型体的 光固化的次数变少， 提高光固化的整体速度。
方式之二：在上述装置实施例的基 上进一步包括第二移动部件和第二输 送部件，第二移动动部件用于在所述承载体内的流体状态的光敏树脂固化成型 后，将成像部件向远离所述承载体的方向移动第二间隙， 第二输送部件用于向 所述承载体内输送新的流体状态的光敏树脂， 以填充所述第二间隙， 所述第二 间隙小于流体状态的光敏树脂的固化深度。这种方式和第一种方式的移动方向 相反，这是考虑到在实际应用中可能移动承载液体状态光敏树脂的承载体比移 动成像部件更难， 因此， 采取移动成像部件的方式更容易实现。
上述在第一个实施例基础上改进的实施例能够制作出三维立体结构的成 型体， 而并没有对成型的形状进行任何限制， 实际上， 在工业制造成形体时， 不仅需要制作每个截面均相同的成型体（比如， 柱体型成型体）， 还需要制作 每个截面均不同的成型体（比如， 葫芦型成型体）， 在后者情况下， 还需要改 变成像部件中呈现的二维图形 （即目标成型体的截面图形）， 这时可以通过一 般的控制电路向成型部件输出不同的二维图形，从而得到具有不同截面的目标 成型体。
上述内容详细叙述了本申请的光固化快速成型装置实施例的组成结构，与 此对应地， 本申请还提供了基于上述光固化快速成型方法实施例。 参见图 3 , 该图示出了本申请的光固化快速成型方法的流程。 该流程包括：
步骤 S301 : 向承载流体状态的光敏树脂的承载体内注入流体状态的光敏 树脂，在展现二维图形的成像部件上展现二维图形， 所述成像部件展现的二维 图形所在区域与二维图形之外的成像部件范围内的其他区域的透明状态相反； 本步骤包括两个子步骤： 注入光敏树脂和展现二维图形的步骤， 这两个步 骤均是完成光固化快速成型的必要步骤，但是， 由于他们均属于光固化成型的 两个准备性步骤， 本申请并不限定他们的执行顺序， 可以先进行注入光敏树脂 的步骤， 也可以先进行展现二维图形的步骤， 或者两个同时进行， 这取决于实 际应用过程中考虑的因素和面临的环境。
步骤 S302: 使用与所述承载体位于所述成像部件异侧的光源照射所述成 像部件，以便透过所述成像部件展现的二维图像所在区域或二维图像之外的成 像部件范围内的其他区域使流体状态的光敏树脂固化成型；
经过本步骤后 "单层" 的光固化成型体即已制作完成， 如果进行光固化的 目的仅在于得到这样 "单层" 的成型体， 则可停止进行后续步骤。 如果需要制 作立体的三维结构的成型体，则需要连续多次进行液体状态的光敏树脂的注入 操作和移动出新的用于填充光敏树脂的空隙， 即执行如下的步骤。
步骤 S303 : 在所述承载体内的流体状态光敏树脂固化成型后， 将已固化 成型的光敏树脂向远离所述光源的方向移动第一间隙，所述第一间隙 d、于流体 状态的光敏树脂的固化深度；
将已固化成型的光敏树脂远离光源后， 由于成像部件保持位置不变，在成 像部件与固化成型的成型体之间空出新的间隙，该间隙需要小于流体状态的光 敏树脂的固化深度， "固化深度" 是在一定光照情形下， 流体状态的光敏树脂 能够发生聚合反应的深度，如果大于该深度，将导致远离光源侧的光敏树脂不 能很好地发生聚合反应或者聚合反应进行不完全，使成型体不能达到目标的固 化 (硬化 )程度。
步骤 S304: 向所述承载体内注入新的流体状态的光敏树脂填充所述第一 间隙；
步骤 S305: 使用与所述承载体位于所述成像部件异侧的光源照射所述成 像部件，以便透过所述成像部件展现的二维图像所在区域或二维图像之外的成 像部件范围内的其他区域使新注入的流体状态的光敏树脂固化成型；
步骤 S306: 判断光敏树脂的固化成型是否达到预设高度， 如果是， 则结 束流程； 如果否， 则返回步骤 S303。
通过多次执行上述 S303〜S305 的步骤， 多个单层的二维成形体将粘附累 积成一个立体三维结构的目标成型体。
上述装置或方法实施例叙述了光源和承载流体状态的光敏树脂的承载体 位于成像部件异侧的情形， 实际上， 基于现实需要， 可以对这种组成架构进行 适当变形， 获得其他组成结构的光固化快速成型装置。 比如， 该是示出了再一 种光固化快速成型装置实施例的组成结构，该实施例与上述装置实施例不同的 是光源与承载体位于成像部件的同侧， 这种情况下， 光固化快速装置还包括反 射部件， 用于反射所述光源的光，使反射的光可经过所述成像部件照射到流体 状态的光敏树脂， 这样同样能够实现本申请的发明目的。 同样地， 基于这种类 型的光固化成型装置， 可以存在对应的光固化快速成型方法， 参见图 4, 该图 示出了该方法的流程， 即：
步骤 S401 : 向承载流体状态的光敏树脂的承载体内注入流体状态的光敏 树脂，在展现二维图形的成像部件上展现二维图形， 所述成像部件展现的二维 图形所在区域与二维图形之外的成像部件范围内的其他区域的透明状态相反； 步骤 S402: 使用与所述承载体位于所述成像部件同侧的光源经过反射部 件照射所述成像部件，以便经反射部件反射的光透过所述成像部件展现的二维 图像所在区域或二维图像之外的成像部件范围内的其他区域使流体状态的光 敏树脂固化成型。
同样地，在需要成型的目标成型体为立体三维结构时，也可以通过增加移 动步骤使已固化成型的薄层与成像部件之间的产生新的间隙，从而在该间隙内 注入新的流体状态的光敏树脂， 制作新的薄层， 多个薄层自动粘附在一起形成 立体三维结构的成型体。
实际上，基于上述改进光固化快速成型装置的思路， 本领域技术人员还可 以得到上述涉及装置的更多变形形式，只要提供的光源能够透过明暗状态不同 的二维图形照射到流体状态的光敏树脂使其固化成型，即可实现本申请的发明 目的。
需要说明的是： 为了叙述的简便， 本说明书的每个实施例重点说明的都是 与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。尤 其，对于承载体与光源位于成像部件同侧的装置实施例而言， 由于其基本相似 于其之前的实施例， 所以描述得比较简单，相关之处参见方法实施例的部分说 明即可。以上所描述的装置实施例的各组成部件可以是或者也可以不是物理上 分开的， 既可以在制作上做成一个完整的整体， 也可以分别制作各组成部分， 然后根据需要安装成能实现本申请发明目的的装置。 当制作为完成整体时， 本 申请实施例的装置方案实际上构成一种 3D打印机， 通过控制向该 3D打印机 中输入的二维截面图，可以利用流体状态的光敏树脂打印出各种需要的目标成 型体。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通 技术人员来说， 在不脱离本申请原理的前提下， 还可以做出若干改进和润饰， 这些改进和'; 饰也应视为本申请的保护范围。

Claims

权 利 要 求
1、 一种光固化快速成型装置， 其特征在于， 所述装置包括： 用于承载流 体状态的光敏树脂的承载体， 用于展现二维图形的成像部件， 所述成像部件展 现的二维图形所在区域与二维图形之外的成像部件范围内的其他区域的透明 状态相反， 以及用于使流体状态的光敏树脂发生聚合反应的光源， 所述光源与 所述承载体位于所述成像部件异侧。
2、 根据权利要求 1所述装置， 其特征在于， 所述装置还包括第一移动部 件和第一输送部件，所述第一移动部件用于在所述承载体内的流体状态的光敏 树脂固化成型后，将已固化成型的光敏树脂向远离所述光源的方向移动第一间 隙， 所述第一输送部件用于向所述承载体内输送新的流体状态的光敏树脂， 以 填充所述第一间隙， 所述第一间隙小于流体状态的光敏树脂的固化深度。
3、 根据权利要求 1所述的装置， 其特征在于， 所述装置还包括第二移动 部件和第二输送部件，所述第二移动部件用于在所述承载体内的流体状态的光 敏树脂固化成型后， 将所述成像部件向远离所述承载体的方向移动第二间隙， 所述第二输送部件用于向所述承载体内输送新的流体状态的光敏树脂，以填充 所述第二间隙， 所述第二间隙小于流体状态的光敏树脂的固化深度。
4、 根据权利要求 1至 3中任何一项所述的装置， 其特征在于， 所述用于 承载流体状态的光敏树脂的承载体为 U型容器， 所述用于展现二维图形的成 像部件为液晶屏，所述用于使流体状态的光敏树脂发生聚合反应的光源为波长 在 350至 400纳米范围内的光源。
5、 一种光固化快速成型装置， 其特征在于， 所述装置包括： 用于承载流 体状态的光敏树脂的承载体， 用于展现二维图形的成像部件， 所述成像部件展 现的二维图形所在区域与二维图形之外的成像部件范围内的其他区域的透明 状态相反， 以及用于使流体状态的光敏树脂发生聚合反应的光源， 所述光源与 所述承载体位于所述成像部件同侧， 所述装置还包括反射部件， 所述反射部件 用于反射所述光源的光， ^^射的光可经过所述成像部件照射到流体状态的光 敏树脂。
6、 一种光固化快速成型方法， 其特征在于， 所述方法包括：
向承载流体状态的光敏树脂的承载体内注入流体状态的光敏树脂，在展现 二维图形的成像部件上展现二维图形，所述成像部件展现的二维图形所在区域 与二维图形之外的成像部件范围内的其他区域的透明状态相反；
使用与所述承载体位于所述成像部件异侧的光源照射所述成像部件，以便 透过所述成像部件展现的二维图像所在区域或二维图像之外的成像部件范围 内的其他区域使流体状态的光敏树脂固化成型。
7、 根据权利要求 6所述的方法， 其特征在于， 所述方法还包括： 在所述承载体内的流体状态的光敏树脂固化成型后，将已固化成型的光敏 树脂向远离所述光源的方向移动第一间隙，所述第一间隙 d、于流体状态的光敏 树脂的固化深度；
向所述承载体内注入新的流体状态的光敏树脂填充所述第一间隙； 使用与所述承载体位于所述成像部件异侧的光源照射所述成像部件，以便 透过所述成像部件展现的二维图像所在区域或二维图像之外的成像部件范围 内的其他区域使新注入的流体状态的光敏树脂固化成型。
8、 根据权利要求 6所述的方法， 其特征在于， 所述方法还包括： 在所述承载体内的流体状态的光敏树脂固化成型后，将所述成像部件向远 离所述承载体的方向移动第二间隙，所述第二间隙小于流体状态的光敏树脂的 固化深度；
向所述承载体内注入新的流体状态的光敏树脂填充所述第二间隙； 使用与所述承载体位于所述成像部件异侧的光源照射所述成像部件，以便 透过所述成像部件展现的二维图像所在区域或二维图像之外的成像部件范围 内的其他区域使新注入的流体状态的光敏树脂固化成型。
9、 一种光固化快速成型方法， 其特征在于， 所述方法包括：
向承载流体状态的光敏树脂的承载体内注入流体状态的光敏树脂，在展现 二维图形的成像部件上展现二维图形，所述成像部件展现的二维图形所在区域 与二维图形之外的成像部件范围内的其他区域的透明状态相反；
使用与所述承载体位于所述成像部件同侧的光源经过反射部件照射所述 成像部件，以便经反射部件反射的光透过所述成像部件展现的二维图像所在区 域或二维图像之外的成像部件范围内的其他区域使流体状态的光敏树脂固化 成型。
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