WO2014101552A1 - Light sensor and touch screen terminal - Google Patents

Light sensor and touch screen terminal Download PDF

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Publication number
WO2014101552A1
WO2014101552A1 PCT/CN2013/085733 CN2013085733W WO2014101552A1 WO 2014101552 A1 WO2014101552 A1 WO 2014101552A1 CN 2013085733 W CN2013085733 W CN 2013085733W WO 2014101552 A1 WO2014101552 A1 WO 2014101552A1
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WIPO (PCT)
Prior art keywords
touch screen
control chip
screen control
capacitive touch
phototransistor
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PCT/CN2013/085733
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French (fr)
Chinese (zh)
Inventor
冉锐
李晨辉
卓光明
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深圳市汇顶科技股份有限公司
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Publication of WO2014101552A1 publication Critical patent/WO2014101552A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04106—Multi-sensing digitiser, i.e. digitiser using at least two different sensing technologies simultaneously or alternatively, e.g. for detecting pen and finger, for saving power or for improving position detection

Definitions

  • the invention belongs to the technical field of light sensing, and in particular relates to a light sensing sensor and a touch screen terminal.
  • the light sensing technology adopts three kinds of methods.
  • the first one is shown in FIG. 1 , a photosensitive induction diode or a triode, a peripheral amplifying circuit and an analog-to-digital conversion circuit to realize digital quantization of light sensing;
  • the photosensitive device itself integrates an amplifier, outputs an analog signal, and cooperates with a peripheral analog-to-digital conversion circuit to realize light-sensing digital quantization;
  • the third is shown in FIG. 3, the photosensitive device itself integrates an amplifier and an analog-to-digital conversion circuit, and directly outputs a digital quantized signal. .
  • This kind of light sensing technology is applied more and more widely, not only in the field of lighting, but also more and more applied to terminal products to achieve different functions as the functions of electronic products are diversified.
  • a mobile communication terminal it can be used to detect changes in ambient light to automatically adjust the backlight brightness of the mobile communication terminal to provide a better user experience.
  • the technical problem to be solved by the present invention is to provide a light sensing sensor and a touch screen terminal thereof.
  • a light sensing sensor comprising a photosensitive device, further comprising a capacitive touch screen control chip; the photosensitive device is connected to the capacitive touch screen control chip, and the capacitive touch screen control chip is used for the photosensitive
  • the device performs frequency modulation, so that the first analog signal outputted by the photosensitive device to characterize the ambient light brightness is superimposed on a carrier, and the capacitive touch screen control chip separates the first analog signal from the carrier and Converted to the first digital signal.
  • the present invention also provides a touch screen terminal comprising the light sensing sensor as described above.
  • the photosensitive touch device is modulated by the capacitive touch screen control chip, so that the frequency of the analog light sensing signal output by the photosensitive device is adapted to the demodulation frequency of the capacitive touch screen control chip, and the amplification and modulus of the chip itself are controlled by the capacitive touch screen.
  • the conversion function is used to realize light sensing, and the combination of the photosensitive device and the advanced capacitive touch technology can greatly improve the accuracy and response speed of the photosensitive detection.
  • Figure 4 is a schematic structural view of a structure provided by the present invention.
  • FIG. 5 is a structural schematic diagram of another light sensing sensor provided by the present invention.
  • FIG. 6A, FIG. 6B, FIG. 6C, and FIG. 6D are four circuit diagrams of the light sensing sensor when the photosensor of the present invention adopts a phototransistor and a capacitive touch screen control chip adopts a mutual capacitance touch screen control chip;
  • FIG. 7A, FIG. 7B, FIG. 7C, and FIG. 7D are four circuit diagrams of the light sensing sensor when the photosensor of the present invention uses a photodiode and a capacitive touch screen control chip using a mutual capacitance touch screen control chip;
  • FIG. 8A, FIG. 8B, FIG. 8C are three circuit diagrams of the light sensing sensor when the photosensitive device of the present invention adopts a phototransistor and a capacitive touch screen control chip adopts a self-capacitive touch screen control chip;
  • FIG. 9A, FIG. 9B, and FIG. 9C are three circuit diagrams of a light sensing sensor when the photosensor of the present invention uses a photodiode and a capacitive touch screen control chip using a self-capacitance touch screen control chip;
  • FIG. 10 and FIG. 11 are respectively an optimized structural diagram of the mutual capacitance touch screen control chip and the self-capacitance touch screen control chip provided by the present invention.
  • FIG. 12 and FIG. 13 are block diagrams showing the principle of proximity sensing using a mutual capacitance touch screen control chip and a self-capacitance touch screen control chip provided by the present invention.
  • the invention combines the photosensitive device and the capacitive touch chip to realize light sensing and quantize output by multiplexing the components of the capacitive touch screen control chip.
  • the light sensing sensor provided by the present invention comprises a photosensitive device 1 and a capacitive touch screen control chip 2.
  • the capacitive touch screen control chip 2 can be used on a capacitive touch screen terminal, and is mainly used for sensing a touch operation on a touch screen and correspondingly Control instruction.
  • the photosensitive device 1 is connected to the capacitive touch screen control chip 2, the photosensitive device 1 is used for sensing ambient light brightness, generates a first analog signal according to ambient light brightness and outputs, and the capacitive touch screen control chip 2 is used for the first simulation The signal is amplified and converted to a first digital signal.
  • the capacitive touch screen control chip 2 cannot directly detect the first analog signal, and the capacitive touch screen control chip 2 of the present invention is also used for the photosensitive
  • the device 1 performs frequency modulation, so that the photosensitive device 1 outputs a first analog signal representing the brightness of the ambient light, and the first analog signal is superimposed on a carrier for transmission, so that the frequency of the first analog signal and the demodulation frequency of the capacitive touch screen control chip 2 It is also suitable to provide anti-interference ability.
  • the capacitive touch screen control chip 2 first needs to separate the first analog signal from the carrier before amplifying the first analog signal.
  • the light sensing sensor can realize proximity sensing and the like if combined with a light emitting device such as an infrared emitting diode to form an ambient light sensing and proximity sensing sensor.
  • the light sensing sensor further includes an infrared light emitting device 3 connected to the capacitive touch screen control chip 2 to emit light under the modulation of the capacitive touch screen control chip 2.
  • the sensor with two sensing functions has two working modes. In the first mode, the ambient light detection is performed according to the analog signal generated by the photosensitive device, and in the second mode, the analog signal generated by the reflected light is generated according to the photosensitive device. Distance detection.
  • the infrared light emitting device 3 is turned off, and the capacitive touch screen control chip 2 modulates the photosensitive device 1 to superimpose the first analog signal representing the ambient light brightness outputted by the photosensitive device 1 on a carrier, and the capacitive touch screen control chip 2 The first analog signal is then separated from the carrier and converted into a first digital signal.
  • the second mode when the infrared illuminating device 3 is turned on, infrared light is emitted under the modulation of the capacitive touch screen control chip 2, so that the infrared light emitted by the infrared illuminating device 3 is superimposed on a carrier; at this time, the photosensitive device 1 is not modulated. Inductively reflecting the infrared light reflected back through the obstacle and generating a second analog signal matched to the size, the capacitive touch screen control chip 2 separates the second analog signal from the carrier and converts it into a second digital signal.
  • light sensing is implemented by using one receiving channel RX and one transmitting channel TX or general-purpose IO port GPIO, using TX or GPIO
  • the signal of the photodiode or transistor is modulated, the receive channel RX is used to detect the input, the transmit channel TX and the general purpose IO port GPIO are used to modulate the output of the signal.
  • a separate transmitting channel TX or GPIO is used to drive the infrared light-emitting diode, and the light sensing can realize the proximity sensing function.
  • FIG. 6C is a phototransistor Q1, and there are four connection modes with the mutual capacitance touch screen control chip 2, and one mode (FIG. 6A): the collector of the phototransistor Q1 is connected to the mutual capacitance touch screen control chip through a capacitor C. A receiving channel RX, the collector of the phototransistor Q1 is also connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R1, and the emitter is grounded.
  • FIG. 6A the collector of the phototransistor Q1 is connected to the mutual capacitance touch screen control chip through a capacitor C.
  • a receiving channel RX the collector of the phototransistor Q1 is also connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R1, and the emitter is grounded.
  • the second mode Fig.
  • the collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitance touch screen control chip, the emitter of the phototransistor is grounded through a resistor, and the emitter is also connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor.
  • Mode 3 (Fig. 6C): The collector of the phototransistor is connected to a power supply terminal VDD, and the emitter of the phototransistor is connected to a transmission channel of the mutual capacitance touch screen control chip through a resistor, and the emitter is also connected to the mutual capacitance touch screen control chip through a capacitor.
  • the collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitive touch screen control chip, and the emitter of the phototransistor is sequentially connected through a resistor and a capacitor to connect the mutual capacitive touch screen control chip. aisle.
  • the photosensitive device in FIG. 7A to FIG. 7D is a photodiode D1, and the connection relationship with the mutual-capacitive touch screen control chip 2 is also in four ways.
  • the cathode of the photodiode D1 is connected through a capacitor C and a mutual capacitive touch screen.
  • a receiving channel RX of the chip is connected to the amplifier via the receiving channel, and the cathode of the photodiode D1 is also connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R3, and the anode of the photodiode D1 is grounded.
  • the cathode of the photodiode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R3.
  • the anode of the photodiode is grounded through a resistor, and the anode is also connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor.
  • Mode 3 (Fig.
  • the infrared light emitting device is implemented by using an infrared light emitting diode D2.
  • the anode of the infrared light emitting diode D2 is connected to a transmitting channel TX or a general IO port of the mutual capacitive touch screen control chip through a resistor R2, and the cathode is grounded.
  • the receiving channel RX and the transmitting channel TX in FIG. 6 and FIG. 7 are the pins of the mutual capacitance touch screen control chip, respectively, for receiving the transmission of the touch operation signal and the control command, and the GPIO is the general IO of the mutual capacitance touch screen control chip. port.
  • the self-capacitance channel CHX is used to connect the photodiode or the triode to realize the ambient light brightness detection.
  • a self-capacitance channel CHX or GPIO is used to drive the infrared light-emitting diode, and the light sensing can realize the proximity sensing physical layer function.
  • the photosensitive device 1 is a phototransistor Q1
  • the connection relationship with the mutual capacitance touch screen control chip 2 is three ways. In the first mode (Fig.
  • the collector of the phototransistor Q2 is connected to the self-capacitive touch screen through a resistor R4. A self-capacitance channel of the chip, the emitter of the phototransistor Q2 is grounded.
  • the collector of the phototransistor Q2 is connected to the power supply terminal VDD through a resistor R4, and the emitter of the phototransistor Q2 is connected to a self-capacitance channel of the self-capacitance touch screen control chip.
  • the third mode Fig.
  • the collector of the phototransistor Q2 is connected to the power supply terminal VDD, and the emitter of the phototransistor Q2 is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor R4.
  • the photosensitive device 1 in FIG. 9A to FIG. 9C is a photodiode D3, and the connection relationship with the self-capacitive touch screen control chip 2 is three ways.
  • the cathode is connected to the self-capacitive touch screen control chip through a resistor R5. Capacitor channel, the anode of photodiode D3 is grounded.
  • Mode 2 (Fig.
  • FIG. 9B The cathode of the photodiode is connected to the power supply terminal VDD through a resistor R5, and the anode of the photodiode D3 is connected to a self-capacitance channel of the self-capacitive touch screen control chip.
  • Mode 3 (Fig. 9C): The cathode of the photodiode D3 is connected to the power supply terminal VDD, and the anode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor R5.
  • the infrared light-emitting device of FIG. 8 and FIG. 9 is realized by using an infrared light-emitting diode D4.
  • the anode of the infrared light-emitting diode D4 is connected to a self-capacitance channel or a general-purpose IO port of the self-capacitive touch screen control chip through a resistor R6, and the cathode is grounded.
  • Capacitive touch screen control chip 2 whether it is a mutual capacitance technology or a self-capacitance technology, has a high driving or excitation signal frequency (usually in the range of several tens of KHz to 1 MHz), and is not in the same signal band as the electrical signal output from the photodiode or the triode.
  • a high driving or excitation signal frequency usually in the range of several tens of KHz to 1 MHz
  • FIG. 10 and FIG. 11 The principle of light sensing of mutual capacitance and self capacitance is shown in FIG. 10 and FIG. 11 respectively, wherein the mutual capacitance touch screen control chip and the self capacitance touch screen control chip at least comprise an amplifier and a demodulation unit connected thereto, and may further comprise a microprocessor unit.
  • the self-capacitance modulation signal is output from the amplifier to the photosensor 1
  • the mutual capacitance modulation signal is output from the transmission channel.
  • the amplifier is configured to amplify the first analog signal
  • the demodulation unit is configured to separate the first analog signal from the carrier and convert to the first digital signal
  • the microprocessor unit is configured to linearize the first digital signal or Perform a format conversion.
  • the principle of infrared proximity sensing is as follows: the infrared light-emitting device 3 emits infrared light, and when the object approaches, the infrared light is reflected back, the photosensitive device 1 The light reflected by the object is received, and the distance is detected according to the size of the signal.
  • the infrared light emitting diode emits a signal, which is usually a lower frequency signal or a direct current signal.
  • the frequency of the driving or excitation signal of the capacitive touch screen control chip is relatively high (usually in the range of several tens of kHz to 1 MHz), so TX (mutual capacitance) is adopted.

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Abstract

A light sensor and a touch screen terminal belong to the technical field of light sensing. The light sensor comprises a photosensitive device (1) and a capacitance touch screen control chip (2). The photosensitive device is connected to the capacitance touch screen control chip. The capacitance touch screen control chip is used for performing frequency modulation for the photosensitive device, so as to enable a first analog signal output by the photosensitive device and representing environmental brightness to be superposed on a carrier for transmission; and then, the capacitance touch screen control chip separates the first analog signal from the carrier and converts it into a first digital signal. The capacitance touch screen control chip is used for modulating the photosensitive device, so that a frequency of an analog photosensitive signal output by the photosensitive device adapts to a demodulation frequency of the capacitance touch screen control chip; light sensing is implemented through amplification and analog-to-digital conversion functions of the capacitance touch screen control chip; and the precision and the response speed of photosensitive detection can be greatly improved by combining the photosensitive device and an advanced capacitance touch technology.

Description

光线感应传感器及触摸屏终端  Light sensor and touch screen terminal 技术领域Technical field
本发明属于光线传感技术领域，尤其涉及一种光线感应传感器及触摸屏终端。 The invention belongs to the technical field of light sensing, and in particular relates to a light sensing sensor and a touch screen terminal.
背景技术Background technique
目前的光线感应技术多采用3种方式，第一种如图1所示，光敏感应二极管或三极管，外围加放大电路和模数转换电路，实现光线感应数字量化；第二种如图2所示，光敏器件本身集成放大器，输出模拟信号，再配合外围的模数转换电路实现光线感应数字量化；第三种如图3所示，光敏器件本身集成放大器和模数转换电路，直接输出数字量化信号。At present, the light sensing technology adopts three kinds of methods. The first one is shown in FIG. 1 , a photosensitive induction diode or a triode, a peripheral amplifying circuit and an analog-to-digital conversion circuit to realize digital quantization of light sensing; The photosensitive device itself integrates an amplifier, outputs an analog signal, and cooperates with a peripheral analog-to-digital conversion circuit to realize light-sensing digital quantization; the third is shown in FIG. 3, the photosensitive device itself integrates an amplifier and an analog-to-digital conversion circuit, and directly outputs a digital quantized signal. .
这种光线感应技术的应用范围越来越广泛，不仅可应用于照明领域，而且随着电子产品功能的多样化，也越来越多地应用于终端产品上以实现不同的功能。例如在移动通信终端上，可用于检测环境光的变化实现自动调整移动通信终端的背光亮度，为用户提供更好的使用感受。This kind of light sensing technology is applied more and more widely, not only in the field of lighting, but also more and more applied to terminal products to achieve different functions as the functions of electronic products are diversified. For example, on a mobile communication terminal, it can be used to detect changes in ambient light to automatically adjust the backlight brightness of the mobile communication terminal to provide a better user experience.
技术问题technical problem
本发明所要解决的技术问题在于提供一种光线感应传感器及其触摸屏终端。 The technical problem to be solved by the present invention is to provide a light sensing sensor and a touch screen terminal thereof.
技术解决方案Technical solution
本发明是这样实现的，一种光线感应传感器,包括光敏器件,还包括一电容触摸屏控制芯片;所述光敏器件与所述电容触摸屏控制芯片连接，所述电容触摸屏控制芯片用于对所述光敏器件进行频率调制,使所述光敏器件输出的表征环境光亮度的第一模拟信号叠加于一载波上传输，所述电容触摸屏控制芯片再将所述第一模拟信号从所述载波上分离出并转换为第一数字信号。The present invention is implemented as follows, a light sensing sensor comprising a photosensitive device, further comprising a capacitive touch screen control chip; the photosensitive device is connected to the capacitive touch screen control chip, and the capacitive touch screen control chip is used for the photosensitive The device performs frequency modulation, so that the first analog signal outputted by the photosensitive device to characterize the ambient light brightness is superimposed on a carrier, and the capacitive touch screen control chip separates the first analog signal from the carrier and Converted to the first digital signal.
本发明还提供一种触摸屏终端，其包括如上所述的光线感应传感器。The present invention also provides a touch screen terminal comprising the light sensing sensor as described above.
有益效果Beneficial effect
本发明中，使用电容触摸屏控制芯片对光敏器件进行调制，以使光敏器件输出的模拟感光信号的频率与电容触摸屏控制芯片的解调频率相适应，通过电容触摸屏控制芯片本身具有的放大、模数转换功能来实现光线感应，光敏器件与先进的电容触控技术相结合可大大提升光敏检测的精度和响应速度。 In the invention, the photosensitive touch device is modulated by the capacitive touch screen control chip, so that the frequency of the analog light sensing signal output by the photosensitive device is adapted to the demodulation frequency of the capacitive touch screen control chip, and the amplification and modulus of the chip itself are controlled by the capacitive touch screen. The conversion function is used to realize light sensing, and the combination of the photosensitive device and the advanced capacitive touch technology can greatly improve the accuracy and response speed of the photosensitive detection.
附图说明DRAWINGS
图1、图2、图3是现有技术提供的三种光线感应技术的原理图；1, 2, and 3 are schematic diagrams of three light sensing technologies provided by the prior art;
图4是本发明提供的一种的结构原理图；Figure 4 is a schematic structural view of a structure provided by the present invention;
图5是本发明提供的另一种光线感应传感器的结构原理图；FIG. 5 is a structural schematic diagram of another light sensing sensor provided by the present invention; FIG.
图6A、图6B、图6C、图6D是本发明提供的光敏器件采用光电三极管、电容触摸屏控制芯片采用互电容触摸屏控制芯片时的光线感应传感器的四种电路图；6A, FIG. 6B, FIG. 6C, and FIG. 6D are four circuit diagrams of the light sensing sensor when the photosensor of the present invention adopts a phototransistor and a capacitive touch screen control chip adopts a mutual capacitance touch screen control chip;
图7A、图7B、图7C、图7D是本发明提供的光敏器件采用光电二极管、电容触摸屏控制芯片采用互电容触摸屏控制芯片时的光线感应传感器的四种电路图；7A, FIG. 7B, FIG. 7C, and FIG. 7D are four circuit diagrams of the light sensing sensor when the photosensor of the present invention uses a photodiode and a capacitive touch screen control chip using a mutual capacitance touch screen control chip;
图8A、图8B、图8C是本发明提供的光敏器件采用光电三极管、电容触摸屏控制芯片采用自电容触摸屏控制芯片时的光线感应传感器的三种电路图；8A, FIG. 8B, FIG. 8C are three circuit diagrams of the light sensing sensor when the photosensitive device of the present invention adopts a phototransistor and a capacitive touch screen control chip adopts a self-capacitive touch screen control chip;
图9A、图9B、图9C是本发明提供的光敏器件采用光电二极管、电容触摸屏控制芯片采用自电容触摸屏控制芯片时的光线感应传感器的三种电路图；9A, FIG. 9B, and FIG. 9C are three circuit diagrams of a light sensing sensor when the photosensor of the present invention uses a photodiode and a capacitive touch screen control chip using a self-capacitance touch screen control chip;
图10、图11分别是本发明提供的采用互电容触摸屏控制芯片和自电容触摸屏控制芯片时的一种优化结构图；10 and FIG. 11 are respectively an optimized structural diagram of the mutual capacitance touch screen control chip and the self-capacitance touch screen control chip provided by the present invention;
图12、图13分别是本发明提供的采用互电容触摸屏控制芯片和自电容触摸屏控制芯片实现接近感应的原理框图。12 and FIG. 13 are block diagrams showing the principle of proximity sensing using a mutual capacitance touch screen control chip and a self-capacitance touch screen control chip provided by the present invention.
本发明的实施方式Embodiments of the invention
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
本发明通过复用电容触摸屏控制芯片的元器件，把光敏器件与电容触控芯片相结合实现光线感应并量化输出。The invention combines the photosensitive device and the capacitive touch chip to realize light sensing and quantize output by multiplexing the components of the capacitive touch screen control chip.
参照图4，本发明提供的光线感应传感器包括光敏器件1和电容触摸屏控制芯片2，此电容触摸屏控制芯片2可用于电容触摸屏终端上，主要用于对触摸屏上的触摸操作进行感应并作出相应的控制指令。本发明中，光敏器件1连接电容触摸屏控制芯片2，光敏器件1用于感测环境光亮度，根据环境光亮度产生第一模拟信号并输出，而电容触摸屏控制芯片2用于将该第一模拟信号放大并转换为第一数字信号。考虑到环境光敏信号的频率比较低，而电容触摸屏控制芯片2的解调频率较高，电容触摸屏控制芯片2无法直接检测到第一模拟信号，本发明中电容触摸屏控制芯片2还用于对光敏器件1进行频率调制，使光敏器件1输出表征环境光亮度的第一模拟信号，该第一模拟信号叠加于一载波上传输，使第一模拟信号的频率与电容触摸屏控制芯片2的解调频率相适应，同时也有利于提供抗干扰能力，电容触摸屏控制芯片2对第一模拟信号放大处理之前首先需要将第一模拟信号从载波上分离出来。Referring to FIG. 4, the light sensing sensor provided by the present invention comprises a photosensitive device 1 and a capacitive touch screen control chip 2. The capacitive touch screen control chip 2 can be used on a capacitive touch screen terminal, and is mainly used for sensing a touch operation on a touch screen and correspondingly Control instruction. In the present invention, the photosensitive device 1 is connected to the capacitive touch screen control chip 2, the photosensitive device 1 is used for sensing ambient light brightness, generates a first analog signal according to ambient light brightness and outputs, and the capacitive touch screen control chip 2 is used for the first simulation The signal is amplified and converted to a first digital signal. Considering that the frequency of the ambient photosensitive signal is relatively low, and the demodulation frequency of the capacitive touch screen control chip 2 is high, the capacitive touch screen control chip 2 cannot directly detect the first analog signal, and the capacitive touch screen control chip 2 of the present invention is also used for the photosensitive The device 1 performs frequency modulation, so that the photosensitive device 1 outputs a first analog signal representing the brightness of the ambient light, and the first analog signal is superimposed on a carrier for transmission, so that the frequency of the first analog signal and the demodulation frequency of the capacitive touch screen control chip 2 It is also suitable to provide anti-interference ability. The capacitive touch screen control chip 2 first needs to separate the first analog signal from the carrier before amplifying the first analog signal.
作为本发明的又一个实施例，上述光线感应传感器若与红外发射二极管等发光器件结合还可实现接近感应等功能，形成一个环境光感应与接近感应传感器。如图5所示，该光线感应传感器还包括红外发光器件3，与电容触摸屏控制芯片2连接，可在电容触摸屏控制芯片2的调制下发光。此具备两种感应功能的传感器有两种工作模式，在第一种模式下，根据光敏器件产生的模拟信号进行环境光检测，在第二种模式下根据光敏器件由反射光产生的模拟信号进行距离检测。具体如下：第一种模式，红外发光器件3关闭，电容触摸屏控制芯片2调制光敏器件1，使光敏器件1输出的表征环境光亮度的第一模拟信号叠加于一载波上传输，电容触摸屏控制芯片2再将第一模拟信号从载波上分离出并转换为第一数字信号。第二种模式，红外发光器件3开启时在电容触摸屏控制芯片2的调制下发出红外光，使红外发光器件3发出的红外光叠加于一载波上传输；此时光敏器件1不被调制而用于感应经障碍物反射回的红外光，并产生与之大小相匹配的第二模拟信号，电容触摸屏控制芯片2把第二模拟信号从载波上分离出并转换为第二数字信号。As still another embodiment of the present invention, the light sensing sensor can realize proximity sensing and the like if combined with a light emitting device such as an infrared emitting diode to form an ambient light sensing and proximity sensing sensor. As shown in FIG. 5, the light sensing sensor further includes an infrared light emitting device 3 connected to the capacitive touch screen control chip 2 to emit light under the modulation of the capacitive touch screen control chip 2. The sensor with two sensing functions has two working modes. In the first mode, the ambient light detection is performed according to the analog signal generated by the photosensitive device, and in the second mode, the analog signal generated by the reflected light is generated according to the photosensitive device. Distance detection. The specifics are as follows: In the first mode, the infrared light emitting device 3 is turned off, and the capacitive touch screen control chip 2 modulates the photosensitive device 1 to superimpose the first analog signal representing the ambient light brightness outputted by the photosensitive device 1 on a carrier, and the capacitive touch screen control chip 2 The first analog signal is then separated from the carrier and converted into a first digital signal. In the second mode, when the infrared illuminating device 3 is turned on, infrared light is emitted under the modulation of the capacitive touch screen control chip 2, so that the infrared light emitted by the infrared illuminating device 3 is superimposed on a carrier; at this time, the photosensitive device 1 is not modulated. Inductively reflecting the infrared light reflected back through the obstacle and generating a second analog signal matched to the size, the capacitive touch screen control chip 2 separates the second analog signal from the carrier and converts it into a second digital signal.
对于互电容（投射式）触摸屏控制芯片，如图6A-图6D、7A-图7D所示，采用1个接收通道RX和1个发射通道TX或通用IO端口GPIO实现光线感应，利用TX或GPIO调制光敏二极管或三极管的信号，接收通道RX用于检测输入，发射通道TX和通用IO端口GPIO用于调制信号的输出。另外再采用1个单独的发射通道TX或GPIO驱动红外发光二极管，配合光线感应可实现接近感应功能。图6A至图6C中光敏器件为光电三极管Q1，与互电容触摸屏控制芯片2的连接方式有四种，方式一（图6A）：光电三极管Q1的集电极通过一电容C连接互电容触摸屏控制芯片的一接收通道RX，光电三极管Q1的集电极还通过一电阻R1连接互电容触摸屏控制芯片的一发射通道，发射极接地。方式二（图6B），光电三极管的集电极直接连接互电容触摸屏控制芯片的一发射通道，光电三极管的发射极通过一电阻接地，发射极还通过一电容连接互电容触摸屏控制芯片的一接收通道。方式三（图6C）：光电三极管的集电极连接一电源端VDD，光电三极管的发射极通过一电阻连接互电容触摸屏控制芯片的一发射通道，发射极还通过一电容连接互电容触摸屏控制芯片的一接收通道；方式四（图6D），光电三极管的集电极直接连接互电容触摸屏控制芯片的一发射通道，光电三极管的发射极依次通过一电阻、一电容后连接互电容触摸屏控制芯片的一接收通道。图7A至图7D中光敏器件为光电二极管D1，与互电容触摸屏控制芯片2的连接关系同样有四种方式，方式1（图7A），光电二极管D1的阴极通过一电容C连接互电容触摸屏控制芯片的一接收通道RX，经接收通道与放大器连接，光电二极管D1的阴极还通过一电阻R3连接互电容触摸屏控制芯片的一发射通道，光电二极管D1的阳极接地。方式二（图7B），光电二极管的阴极通过一电阻R3连接互电容触摸屏控制芯片的一发射通道，光电二极管的阳极通过一电阻接地，阳极还通过一电容连接互电容触摸屏控制芯片的一接收通道。方式三（图7C）：光电二极管的阴极连接电源端VDD，阳极通过一电阻R3连接互电容触摸屏控制芯片的一发射通道，阳极还通过一电容连接互电容触摸屏控制芯片的一接收通道。方式四（图7D）：光电二极管的阴极连接电源端VDD，阴极还通过一电容连接互电容触摸屏控制芯片的一接收通道，阳极通过一电阻R3连接互电容触摸屏控制芯片的一发射通道。图6、图7中红外发光器件选用红外发光二极管D2实现，红外发光二极管D2的阳极通过一电阻R2连接互电容触摸屏控制芯片的一发射通道TX或一通用IO端口，阴极接地。For the mutual capacitance (projection) touch screen control chip, as shown in FIG. 6A - FIG. 6D, 7A - FIG. 7D, light sensing is implemented by using one receiving channel RX and one transmitting channel TX or general-purpose IO port GPIO, using TX or GPIO The signal of the photodiode or transistor is modulated, the receive channel RX is used to detect the input, the transmit channel TX and the general purpose IO port GPIO are used to modulate the output of the signal. In addition, a separate transmitting channel TX or GPIO is used to drive the infrared light-emitting diode, and the light sensing can realize the proximity sensing function. The photosensitive device in FIG. 6A to FIG. 6C is a phototransistor Q1, and there are four connection modes with the mutual capacitance touch screen control chip 2, and one mode (FIG. 6A): the collector of the phototransistor Q1 is connected to the mutual capacitance touch screen control chip through a capacitor C. A receiving channel RX, the collector of the phototransistor Q1 is also connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R1, and the emitter is grounded. In the second mode (Fig. 6B), the collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitance touch screen control chip, the emitter of the phototransistor is grounded through a resistor, and the emitter is also connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor. . Mode 3 (Fig. 6C): The collector of the phototransistor is connected to a power supply terminal VDD, and the emitter of the phototransistor is connected to a transmission channel of the mutual capacitance touch screen control chip through a resistor, and the emitter is also connected to the mutual capacitance touch screen control chip through a capacitor. a receiving channel; mode four (Fig. 6D), the collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitive touch screen control chip, and the emitter of the phototransistor is sequentially connected through a resistor and a capacitor to connect the mutual capacitive touch screen control chip. aisle. The photosensitive device in FIG. 7A to FIG. 7D is a photodiode D1, and the connection relationship with the mutual-capacitive touch screen control chip 2 is also in four ways. In the first embodiment (FIG. 7A), the cathode of the photodiode D1 is connected through a capacitor C and a mutual capacitive touch screen. A receiving channel RX of the chip is connected to the amplifier via the receiving channel, and the cathode of the photodiode D1 is also connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R3, and the anode of the photodiode D1 is grounded. In the second mode (Fig. 7B), the cathode of the photodiode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R3. The anode of the photodiode is grounded through a resistor, and the anode is also connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor. . Mode 3 (Fig. 7C): The cathode of the photodiode is connected to the power supply terminal VDD, and the anode is connected to a transmission channel of the mutual capacitance touch screen control chip through a resistor R3. The anode also controls a receiving channel of the chip through a capacitive connection mutual capacitance touch screen. Mode 4 (Fig. 7D): The cathode of the photodiode is connected to the power supply terminal VDD, and the cathode is also connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor, and the anode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor R3. In FIG. 6 and FIG. 7 , the infrared light emitting device is implemented by using an infrared light emitting diode D2. The anode of the infrared light emitting diode D2 is connected to a transmitting channel TX or a general IO port of the mutual capacitive touch screen control chip through a resistor R2, and the cathode is grounded.
图6、图7中的接收通道RX、发射通道TX均是互电容触摸屏控制芯片的引脚，分别用于接收触摸操作信号和控制指令的发送，而GPIO则表示互电容触摸屏控制芯片的通用IO端口。The receiving channel RX and the transmitting channel TX in FIG. 6 and FIG. 7 are the pins of the mutual capacitance touch screen control chip, respectively, for receiving the transmission of the touch operation signal and the control command, and the GPIO is the general IO of the mutual capacitance touch screen control chip. port.
对于自电容触摸屏控制芯片，如图8A-图8C、图9A-图9C所示，采用自电容通道CHX接入光敏二极管或三极管，实现环境光亮度检测。另外采用1个自电容通道CHX或GPIO驱动红外发光二极管，配合光线感应可实现接近感应物理层功能。图8A至图8C中光敏器件1为光电三极管Q1，与互电容触摸屏控制芯片2的连接关系有三种方式，方式一（图8A），光电三极管Q2的集电极通过一电阻R4连接自电容触摸屏控制芯片的一自电容通道，光电三极管Q2的发射极接地。方式二（图8B），光电三极管Q2的集电极通过一电阻R4连接电源端VDD，光电三极管Q2的发射极连接自电容触摸屏控制芯片的一自电容通道。方式三（图8C），光电三极管Q2的集电极连接电源端VDD，光电三极管Q2的发射极通过一电阻R4连接自电容触摸屏控制芯片的一自电容通道。图9A至图9C中光敏器件1为光电二极管D3，与自电容触摸屏控制芯片2的连接关系有三种方式，方式一（图9A），其阴极通过一电阻R5连接自电容触摸屏控制芯片的一自电容通道，光电二极管D3的阳极接地。方式二（图9B）：光电二极管的阴极通过一电阻R5连接电源端VDD，光电二极管D3的阳极连接自电容触摸屏控制芯片的一自电容通道。方式三（图9C）：光电二极管D3的阴极连接电源端VDD，光电二极管的阳极通过一电阻R5连接自电容触摸屏控制芯片的一自电容通道。图8、图9中红外发光器件选用红外发光二极管D4实现，红外发光二极管D4的阳极通过一电阻R6连接自电容触摸屏控制芯片的一自电容通道或一通用IO端口，阴极接地。For the self-capacitance touch screen control chip, as shown in FIG. 8A to FIG. 8C and FIG. 9A to FIG. 9C, the self-capacitance channel CHX is used to connect the photodiode or the triode to realize the ambient light brightness detection. In addition, a self-capacitance channel CHX or GPIO is used to drive the infrared light-emitting diode, and the light sensing can realize the proximity sensing physical layer function. 8A to 8C, the photosensitive device 1 is a phototransistor Q1, and the connection relationship with the mutual capacitance touch screen control chip 2 is three ways. In the first mode (Fig. 8A), the collector of the phototransistor Q2 is connected to the self-capacitive touch screen through a resistor R4. A self-capacitance channel of the chip, the emitter of the phototransistor Q2 is grounded. In the second mode (Fig. 8B), the collector of the phototransistor Q2 is connected to the power supply terminal VDD through a resistor R4, and the emitter of the phototransistor Q2 is connected to a self-capacitance channel of the self-capacitance touch screen control chip. In the third mode (Fig. 8C), the collector of the phototransistor Q2 is connected to the power supply terminal VDD, and the emitter of the phototransistor Q2 is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor R4. The photosensitive device 1 in FIG. 9A to FIG. 9C is a photodiode D3, and the connection relationship with the self-capacitive touch screen control chip 2 is three ways. In the first method (FIG. 9A), the cathode is connected to the self-capacitive touch screen control chip through a resistor R5. Capacitor channel, the anode of photodiode D3 is grounded. Mode 2 (Fig. 9B): The cathode of the photodiode is connected to the power supply terminal VDD through a resistor R5, and the anode of the photodiode D3 is connected to a self-capacitance channel of the self-capacitive touch screen control chip. Mode 3 (Fig. 9C): The cathode of the photodiode D3 is connected to the power supply terminal VDD, and the anode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor R5. The infrared light-emitting device of FIG. 8 and FIG. 9 is realized by using an infrared light-emitting diode D4. The anode of the infrared light-emitting diode D4 is connected to a self-capacitance channel or a general-purpose IO port of the self-capacitive touch screen control chip through a resistor R6, and the cathode is grounded.
图6至图9的基础原理为：在直流供电电压下，光电二极管D1或光电三极管Q1输出电流随着感应光强的变化而变化，由于光线的变化相对较为缓慢，转换为电信号通常是较低频率的信号（小于数百Hz，甚至近似于直流信号）。The basic principle of Figure 6 to Figure 9 is: under the DC supply voltage, the output current of the photodiode D1 or the phototransistor Q1 changes with the change of the induced light intensity. Since the change of the light is relatively slow, the conversion to the electrical signal is usually Low frequency signals (less than a few hundred Hz, even similar to a DC signal).
电容触摸屏控制芯片2无论是互电容技术还是自电容技术，驱动或激励信号频率均较高（通常在几十KHz至1MHz区间），与光敏二极管或三极管输出的电信号不在同一信号频带内。为了把光敏二极管或三极管输出的信号调制到电容触摸屏芯片可检测的芯片频带范围内，就需要采用上述技术方案中通过互电容或自电容触摸屏控制芯片对光电二极管或光电三极管进行调制。Capacitive touch screen control chip 2, whether it is a mutual capacitance technology or a self-capacitance technology, has a high driving or excitation signal frequency (usually in the range of several tens of KHz to 1 MHz), and is not in the same signal band as the electrical signal output from the photodiode or the triode. In order to modulate the signal outputted by the photodiode or the triode into the chip band range detectable by the capacitive touch screen chip, it is necessary to modulate the photodiode or the phototransistor through the mutual capacitance or self-capacitance touch screen control chip in the above technical solution.
互电容和自电容的光线感应原理分别如图10、图11所示，其中互电容触摸屏控制芯片与自电容触摸屏控制芯片至少包括相连接的放大器和解调单元，还可包括微处理器单元，不同的是自电容的调制信号由放大器输出至光敏器件1，而互电容的调制信号由发射通道输出。其中放大器用于放大第一模拟信号，解调单元用于将第一模拟信号从载波上分离出并转换为第一数字信号，而微处理器单元用于对第一数字信号进行线性化处理或进行格式转换。The principle of light sensing of mutual capacitance and self capacitance is shown in FIG. 10 and FIG. 11 respectively, wherein the mutual capacitance touch screen control chip and the self capacitance touch screen control chip at least comprise an amplifier and a demodulation unit connected thereto, and may further comprise a microprocessor unit. The difference is that the self-capacitance modulation signal is output from the amplifier to the photosensor 1, and the mutual capacitance modulation signal is output from the transmission channel. Wherein the amplifier is configured to amplify the first analog signal, the demodulation unit is configured to separate the first analog signal from the carrier and convert to the first digital signal, and the microprocessor unit is configured to linearize the first digital signal or Perform a format conversion.
图12、图13进一步展示出了互电容和自电容的近场感应原理，红外接近感应的实现原理如下：红外发光器件3发射红外光线，当物体靠近时，红外光线被反射回来，光敏器件1接收到物体反射的光线，根据信号的大小实现对距离的检测。12 and 13 further illustrate the principle of near-field sensing of mutual capacitance and self-capacitance. The principle of infrared proximity sensing is as follows: the infrared light-emitting device 3 emits infrared light, and when the object approaches, the infrared light is reflected back, the photosensitive device 1 The light reflected by the object is received, and the distance is detected according to the size of the signal.
同样地，红外发光二极管发射信号通常是较低频率信号或直流信号，电容触摸屏控制芯片的驱动或激励信号频率均较高（通常在几十KHz至1MHz区间），所以采用TX(互电容)、CHX(自电容)或GPIO调制红外发光二极管。Similarly, the infrared light emitting diode emits a signal, which is usually a lower frequency signal or a direct current signal. The frequency of the driving or excitation signal of the capacitive touch screen control chip is relatively high (usually in the range of several tens of kHz to 1 MHz), so TX (mutual capacitance) is adopted. CHX (self-capacitance) or GPIO modulated infrared LED.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims (15)

  1. 一种光线感应传感器, 其特征在于,包括光敏器件和电容触摸屏控制芯片，所述光敏器件与所述电容触摸屏控制芯片连接，所述电容触摸屏控制芯片用于对所述光敏器件输出的表征环境光亮度的第一模拟信号进行频率调制,使所述光敏器件输出的表征环境光亮度的第一模拟信号叠加于一载波上传输，所述电容触摸屏控制芯片再将所述第一模拟信号从所述载波上分离出并转换为第一数字信号。  a light sensing sensor, The invention comprises a photosensitive device and a capacitive touch screen control chip, wherein the photosensitive device is connected to the capacitive touch screen control chip, and the capacitive touch screen control chip is used for outputting the first analog signal of the ambient light brightness to the photosensitive device. Performing frequency modulation, causing the first analog signal output by the photosensor to characterize ambient light to be superimposed on a carrier, the capacitive touch screen control chip separating and converting the first analog signal from the carrier Is the first digital signal.
  2. 如权利要求1所述的光线感应传感器，其特征在于,还包括：The light sensing sensor of claim 1 further comprising:
    红外发光器件，与所述电容触摸屏控制芯片连接，可在所述电容触摸屏控制芯片的调制下发光；An infrared light emitting device is connected to the capacitive touch screen control chip and can emit light under modulation of the capacitive touch screen control chip;
    当所述红外发光器件关闭时，所述电容触摸屏控制芯片调制所述光敏器件，使所述光敏器件输出的表征环境光亮度的第一模拟信号叠加于一载波上传输，所述电容触摸屏控制芯片再将所述第一模拟信号从所述载波上分离出并转换为第一数字信号；When the infrared light emitting device is turned off, the capacitive touch screen control chip modulates the photosensitive device, and the first analog signal outputted by the photosensitive device to represent ambient light brightness is superimposed on a carrier, and the capacitive touch screen control chip And separating the first analog signal from the carrier and converting into a first digital signal;
    当所述红外发光器件开启时在所述电容触摸屏控制芯片的调制下发出红外光，使所述红外发光器件发出的红外光叠加于一载波上传输；此时所述光敏器件不被调制而用于感应经障碍物反射回的所述红外光，并产生与之大小相匹配的第二模拟信号，所述电容触摸屏控制芯片用于将所述第二模拟信号从所述载波上分离出并转换为第二数字信号。When the infrared light emitting device is turned on, emitting infrared light under modulation of the capacitive touch screen control chip, so that infrared light emitted by the infrared light emitting device is superimposed on a carrier for transmission; at this time, the photosensitive device is not modulated and used Inducing the infrared light reflected back through the obstacle and generating a second analog signal that matches the size thereof, the capacitive touch screen control chip is configured to separate and convert the second analog signal from the carrier Is the second digital signal.
  3. 如权利要求1所述的光线感应传感器，其特征在于，所述电容触摸屏控制芯片为互电容触摸屏控制芯片，其包括相连接的放大器、解调单元；The light sensing sensor of claim 1 , wherein the capacitive touch screen control chip is a mutual capacitance touch screen control chip, comprising a connected amplifier and a demodulation unit;
    所述放大器用于放大和处理所述第一模拟信号，所述解调单元用于将所述第一模拟信号从所述载波上分离出并转换为第一数字信号。The amplifier is configured to amplify and process the first analog signal, and the demodulation unit is configured to separate the first analog signal from the carrier and convert it into a first digital signal.
  4. 如权利要求3所述的光线感应传感器，其特征在于，所述互电容触摸屏控制芯片还包括与所述解调单元连接的微处理器单元，用于对所述第一数字信号进行线性化处理或进行格式转换。The light sensing sensor according to claim 3, wherein said mutual capacitance touch screen control chip further comprises a microprocessor unit connected to said demodulating unit for linearizing said first digital signal Or format conversion.
  5. 如权利要求3或4所述的光线感应传感器，其特征在于，所述光敏器件为光电二极管或光电三极管；The light sensing sensor according to claim 3 or 4, wherein the photosensitive device is a photodiode or a phototransistor;
    所述光电二极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the photodiode and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电二极管的阴极通过一电容连接所述互电容触摸屏控制芯片的一接收通道，经所述接收通道与所述放大器连接，所述光电二极管的阴极还通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，所述光电二极管的阳极接地；或The cathode of the photodiode is connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor, and is connected to the amplifier via the receiving channel, and the cathode of the photodiode is further connected to the mutual capacitive touch screen through a resistor. a firing channel of the chip, the anode of the photodiode being grounded; or
    所述光电二极管的阴极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，所述光电二极管的阳极通过一电阻接地，阳极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The cathode of the photodiode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor, the anode of the photodiode is grounded through a resistor, and the anode is further connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor. ;or
    所述光电二极管的阴极连接电源端，阳极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，阳极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The cathode of the photodiode is connected to the power supply end, and the anode is connected to a transmission channel of the mutual capacitance touch screen control chip through a resistor, and the anode is further connected to a receiving channel of the mutual capacitance touch screen control chip through a capacitor; or
    所述光电二极管的阴极连接电源端，阴极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道，阳极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道；The cathode of the photodiode is connected to the power supply end, and the cathode is further connected to a receiving channel of the mutual capacitance touch screen control chip through a capacitor, and the anode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor;
    所述光电三极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the phototransistor and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电三极管的集电极通过一电容连接所述互电容触摸屏控制芯片的一接收通道，所述光电三极管的集电极还通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，所述光电三极管的发射极接地；或The collector of the phototransistor is connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor, and the collector of the phototransistor is further connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor, the photoelectric The emitter of the triode is grounded; or
    所述光电三极管的集电极直接连接所述互电容触摸屏控制芯片的一发射通道，所述光电三极管的发射极通过一电阻接地，发射极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitive touch screen control chip, the emitter of the phototransistor is grounded through a resistor, and the emitter is further connected to the receiving of the mutual capacitive touch screen control chip through a capacitor. Channel; or
    所述光电三极管的集电极连接一电源端，所述光电三极管的发射极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，发射极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The collector of the phototransistor is connected to a power supply end, and the emitter of the phototransistor is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor, and the emitter is further connected to the mutual capacitive touch screen control chip through a capacitor. a receiving channel; or
    所述光电三极管的集电极直接连接所述互电容触摸屏控制芯片的一发射通道，所述光电三极管的发射极依次通过一电阻、一电容后连接所述互电容触摸屏控制芯片的一接收通道。The collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitive touch screen control chip, and the emitter of the phototransistor is sequentially connected to a receiving channel of the mutual capacitive touch screen control chip through a resistor and a capacitor.
  6. 如权利要求1所述的光线感应传感器，其特征在于，所述电容触摸屏控制芯片为自电容触摸屏控制芯片，其包括相连接的放大器、解调单元；The light sensing sensor of claim 1 , wherein the capacitive touch screen control chip is a self-capacitive touch screen control chip, comprising a connected amplifier and a demodulation unit;
    所述放大器用于放大所述第一模拟信号，所述解调单元用于将所述第一模拟信号从所述载波上分离出并转换为第一数字信号。The amplifier is configured to amplify the first analog signal, and the demodulation unit is configured to separate the first analog signal from the carrier and convert it into a first digital signal.
  7. 如权利要求6所述的光线感应传感器，其特征在于，所述自电容触摸屏控制芯片还包括一与所述解调单元连接的微处理器单元，用于对所述第一数字信号进行线性化处理或进行格式转换。The light sensing sensor according to claim 6, wherein said self-capacitive touch screen control chip further comprises a microprocessor unit connected to said demodulating unit for linearizing said first digital signal Process or format conversion.
  8. 如权利要求6或7所述的光线感应传感器，其特征在于，所述光敏器件为光电二极管或光电三极管；The light sensing sensor according to claim 6 or 7, wherein the photosensitive device is a photodiode or a phototransistor;
    所述光电二极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the photodiode and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电二极管的阴极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道，所述光电二极管的阳极接地；或The cathode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor, and the anode of the photodiode is grounded; or
    所述光电二极管的阴极通过一电阻连接电源端，所述光电二极管的阳极连接所述自电容触摸屏控制芯片的一自电容通道；或The cathode of the photodiode is connected to the power supply end through a resistor, and the anode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip; or
    所述光电二极管的阴极连接电源端，所述光电二极管的阳极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道；The cathode of the photodiode is connected to the power supply end, and the anode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor;
    所述光电三极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the phototransistor and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电三极管的集电极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道，所述光电三极管的发射极接地；或The collector of the phototransistor is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor, and the emitter of the phototransistor is grounded; or
    所述光电三极管的集电极通过一电阻连接电源端，所述光电三极管的发射极连接所述自电容触摸屏控制芯片的一自电容通道；或The collector of the phototransistor is connected to the power supply end through a resistor, and the emitter of the phototransistor is connected to a self-capacitance channel of the self-capacitive touch screen control chip; or
    所述光电三极管的集电极连接电源端，所述光电三极管的发射极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道。The collector of the phototransistor is connected to the power supply end, and the emitter of the phototransistor is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor.
  9. 如权利要求2所述的光线感应传感器，其特征在于，所述电容触摸屏控制芯片为互电容触摸屏控制芯片；其包括相连接的放大器、解调单元；The light sensing sensor according to claim 2, wherein the capacitive touch screen control chip is a mutual capacitance touch screen control chip; and comprises a connected amplifier and a demodulation unit;
    所述放大器用于放大所述第一模拟信号，所述解调单元用于将所述第一模拟信号从所述载波上分离出并转换为第一数字信号。The amplifier is configured to amplify the first analog signal, and the demodulation unit is configured to separate the first analog signal from the carrier and convert it into a first digital signal.
  10. 如权利要求9所述的光线感应传感器，其特征在于，所述互电容触摸屏控制芯片还包括一与所述解调单元连接的微处理器单元，用于对所述第一数字信号进行线性化处理或进行格式转换。The light sensing sensor according to claim 9, wherein said mutual capacitance touch screen control chip further comprises a microprocessor unit coupled to said demodulation unit for linearizing said first digital signal Process or format conversion.
  11. 如权利要求9或10所述的光线感应传感器，其特征在于，所述光敏器件为光电二极管或光电三极管；The light sensing sensor according to claim 9 or 10, wherein the photosensitive device is a photodiode or a phototransistor;
    所述光电二极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the photodiode and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电二极管的阴极通过一电容连接所述互电容触摸屏控制芯片的一接收通道，经所述接收通道与所述放大器连接，所述光电二极管的阴极还通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，所述光电二极管的阳极接地；或The cathode of the photodiode is connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor, and is connected to the amplifier via the receiving channel, and the cathode of the photodiode is further connected to the mutual capacitive touch screen through a resistor. a firing channel of the chip, the anode of the photodiode being grounded; or
    所述光电二极管的阴极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，所述光电二极管的阳极通过一电阻接地，阳极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The cathode of the photodiode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor, the anode of the photodiode is grounded through a resistor, and the anode is further connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor. ;or
    所述光电二极管的阴极连接电源端，阳极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，阳极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The cathode of the photodiode is connected to the power supply end, and the anode is connected to a transmission channel of the mutual capacitance touch screen control chip through a resistor, and the anode is further connected to a receiving channel of the mutual capacitance touch screen control chip through a capacitor; or
    所述光电二极管的阴极连接电源端，阴极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道，阳极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道；The cathode of the photodiode is connected to the power supply end, and the cathode is further connected to a receiving channel of the mutual capacitance touch screen control chip through a capacitor, and the anode is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor;
    所述光电三极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the phototransistor and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电三极管的集电极通过一电容连接所述互电容触摸屏控制芯片的一接收通道，所述光电三极管的集电极还通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，所述光电三极管的发射极接地；或The collector of the phototransistor is connected to a receiving channel of the mutual capacitive touch screen control chip through a capacitor, and the collector of the phototransistor is further connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor, the photoelectric The emitter of the triode is grounded; or
    所述光电三极管的集电极直接连接所述互电容触摸屏控制芯片的一发射通道，所述光电三极管的发射极通过一电阻接地，发射极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitive touch screen control chip, the emitter of the phototransistor is grounded through a resistor, and the emitter is further connected to the receiving of the mutual capacitive touch screen control chip through a capacitor. Channel; or
    所述光电三极管的集电极连接一电源端，所述光电三极管的发射极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道，发射极还通过一电容连接所述互电容触摸屏控制芯片的一接收通道；或The collector of the phototransistor is connected to a power supply end, and the emitter of the phototransistor is connected to a transmitting channel of the mutual capacitive touch screen control chip through a resistor, and the emitter is further connected to the mutual capacitive touch screen control chip through a capacitor. a receiving channel; or
    所述光电三极管的集电极直接连接所述互电容触摸屏控制芯片的一发射通道，所述光电三极管的发射极依次通过一电阻、一电容后连接所述互电容触摸屏控制芯片的一接收通道；The collector of the phototransistor is directly connected to a transmitting channel of the mutual capacitive touch screen control chip, and the emitter of the phototransistor is sequentially connected to a receiving channel of the mutual capacitive touch screen control chip through a resistor and a capacitor;
    所述红外发光二极管的阳极通过一电阻连接所述互电容触摸屏控制芯片的一发射通道或一通用IO端口，阴极接地。The anode of the infrared light emitting diode is connected to a transmitting channel of the mutual capacitive touch screen control chip or a universal IO port through a resistor, and the cathode is grounded.
  12. 如权利要求2所述的光线感应传感器，其特征在于，所述电容触摸屏控制芯片为自电容触摸屏控制芯片，其包括相连接的放大器、解调单元；The light sensing sensor according to claim 2, wherein the capacitive touch screen control chip is a self-capacitive touch screen control chip, comprising a connected amplifier and a demodulation unit;
    所述放大器用于放大所述第一模拟信号，所述解调单元用于将所述第一模拟信号从所述载波上分离出并转换为第一数字信号。The amplifier is configured to amplify the first analog signal, and the demodulation unit is configured to separate the first analog signal from the carrier and convert it into a first digital signal.
  13. 如权利要求12所述的光线感应传感器，其特征在于，所述自电容触摸屏控制芯片还包括一与所述解调单元连接的微处理器单元，用于对所述第一数字信号进行线性化处理或进行格式转换。The light sensing sensor according to claim 12, wherein said self-capacitive touch screen control chip further comprises a microprocessor unit coupled to said demodulating unit for linearizing said first digital signal Process or format conversion.
  14. 如权利要求12或13所述的光线感应传感器，其特征在于，所述光敏器件为光电二极管或光电三极管；The light sensing sensor according to claim 12 or 13, wherein the photosensitive device is a photodiode or a phototransistor;
    所述光电二极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the photodiode and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电二极管的阴极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道，所述光电二极管的阳极接地；或The cathode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor, and the anode of the photodiode is grounded; or
    所述光电二极管的阴极通过一电阻连接电源端，所述光电二极管的阳极连接所述自电容触摸屏控制芯片的一自电容通道；或The cathode of the photodiode is connected to the power supply end through a resistor, and the anode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip; or
    所述光电二极管的阴极连接电源端，所述光电二极管的阳极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道；The cathode of the photodiode is connected to the power supply end, and the anode of the photodiode is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor;
    所述光电三极管与所述互电容触摸屏控制芯片的连接关系为下述几种连接方式的任一种：The connection relationship between the phototransistor and the mutual capacitance touch screen control chip is any one of the following connection methods:
    所述光电三极管的集电极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道，所述光电三极管的发射极接地；或The collector of the phototransistor is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor, and the emitter of the phototransistor is grounded; or
    所述光电三极管的集电极通过一电阻连接电源端，所述光电三极管的发射极连接所述自电容触摸屏控制芯片的一自电容通道；或The collector of the phototransistor is connected to the power supply end through a resistor, and the emitter of the phototransistor is connected to a self-capacitance channel of the self-capacitive touch screen control chip; or
    所述光电三极管的集电极连接电源端，所述光电三极管的发射极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道；The collector of the phototransistor is connected to the power supply end, and the emitter of the phototransistor is connected to a self-capacitance channel of the self-capacitive touch screen control chip through a resistor;
    所述红外发光二极管的阳极通过一电阻连接所述自电容触摸屏控制芯片的一自电容通道或一通用IO端口，阴极接地。The anode of the infrared light emitting diode is connected to a self-capacitance channel or a general-purpose IO port of the self-capacitive touch screen control chip through a resistor, and the cathode is grounded.
  15. 一种触摸屏终端，其特征在于，其包括如权利要求1至14任一项所述的光线感应传感器。A touch screen terminal characterized by comprising the light sensing sensor according to any one of claims 1 to 14.
PCT/CN2013/085733 2012-12-27 2013-10-22 Light sensor and touch screen terminal WO2014101552A1 (en)

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