WO2014101080A1 - 柔性电子器件的制作方法和制作柔性电子器件的基板 - Google Patents

柔性电子器件的制作方法和制作柔性电子器件的基板 Download PDF

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Publication number
WO2014101080A1
WO2014101080A1 PCT/CN2012/087786 CN2012087786W WO2014101080A1 WO 2014101080 A1 WO2014101080 A1 WO 2014101080A1 CN 2012087786 W CN2012087786 W CN 2012087786W WO 2014101080 A1 WO2014101080 A1 WO 2014101080A1
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WIPO (PCT)
Prior art keywords
electronic device
substrate
flexible
rigid substrate
channel
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Ceased
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PCT/CN2012/087786
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English (en)
French (fr)
Inventor
刘自鸿
余晓军
魏鹏
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to US14/758,161 priority Critical patent/US20150382474A1/en
Priority to CN201280001914.9A priority patent/CN104081552B/zh
Priority to PCT/CN2012/087786 priority patent/WO2014101080A1/zh
Publication of WO2014101080A1 publication Critical patent/WO2014101080A1/zh
Anticipated expiration legal-status Critical
Priority to US16/283,503 priority patent/US11272621B2/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention belongs to the field of electronic device manufacturing, and in particular relates to a method for fabricating a flexible electronic device and a substrate for manufacturing a flexible electronic device.
  • Flexible electronic devices are made of organic/inorganic materials in flexible / Emerging electronic technology on ductile plastic or thin metal substrates with its unique flexibility / Extensibility and efficient, low-cost manufacturing processes have broad application prospects in the fields of information, energy, medical, and defense, such as flexible electronic displays, organic light-emitting diodes (OLEDs), and printed RFID. , thin film solar panels, electronic surface paste (Skin Patches) and so on.
  • An object of the present invention is to provide a method for fabricating a flexible electronic device and a substrate for manufacturing a flexible electronic device, which are intended to solve the problem that the adhesive present in the process of peeling off the flexible substrate and the rigid substrate in the prior art cannot be completely peeled off and The problem of damage to the flexible substrate.
  • a method for fabricating a flexible electronic device includes the following steps:
  • the binder is a binder polymer or a film.
  • the step of fabricating an electronic device on the flexible substrate comprises: providing at least one of the electronic device and a wiring electrically connected to the electronic device on a surface of the flexible substrate.
  • the chemical substance is a chemical solvent or a gas.
  • the channel is a micro channel, a pattern, a grain or a groove disposed on the first surface of the rigid substrate.
  • the channel has at least one injection port located on a side of the rigid substrate or a second surface opposite the first surface.
  • the channels are in communication with each other.
  • the step of injecting the chemical into the channel includes: injecting the chemical into an injection port of the rigid substrate; and flowing the chemical into the channel and the adhesive along the injection port Contact and react.
  • the channel is a via hole penetrating through the first surface of the rigid substrate and the second surface opposite to the first surface.
  • the step of injecting the chemical into the channel comprises: immersing the flexible substrate and the rigid substrate in a reaction container containing the chemical; and flowing the chemical along the via The rigid substrate is in contact with and reacts with the binder.
  • the present invention also provides a substrate for fabricating a flexible electronic device, comprising a flexible electronic device formed by the above-described manufacturing method of the flexible electronic device, A rigid substrate provided with a channel and a bonding agent coated on the rigid substrate and attached to the channel, the bonding agent bonding the flexible electronic device to the rigid substrate.
  • the channel is a microchannel, a pattern, a pattern or a groove disposed on a first surface of the rigid substrate and communicating with each other, the channel having at least one injection port on a side of the rigid substrate; Or the channel is a via hole penetrating the rigid substrate.
  • the chemical substance is brought into contact with the bonding agent and reacted, so that the rigid substrate is completely automatically peeled off, and the adopted
  • the reaction conditions of the chemical with the binder do not cause damage to the flexible substrate or the electronic device.
  • FIG. 1 is a flow chart of a method of fabricating a flexible electronic device according to an embodiment of the present invention.
  • Fig. 2 is a schematic plan view showing the channel distribution of the rigid substrate in the first embodiment of the present invention.
  • Fig. 3 is a perspective view showing the channel distribution of the rigid substrate in the first embodiment of the present invention.
  • Figure 4 is a schematic plan view showing the channel distribution of a rigid substrate in a second embodiment of the present invention.
  • Figure 5 is a cross-sectional view showing a substrate on which a flexible electronic device is fabricated in a first embodiment of the present invention.
  • Figure 6 is a cross-sectional view showing a substrate in which a flexible electronic device is fabricated in a second embodiment of the present invention.
  • Figure 7 is a cross-sectional view showing a substrate on which a flexible electronic device is fabricated in a second embodiment of the present invention.
  • a method for fabricating a flexible electronic device includes the following steps:
  • the flexible substrate 40 is attached to the rigid substrate 20 by using a bonding agent 60;
  • the chemical substance 200 reacts with the binder 60 to remove the flexible substrate 40 from the rigid substrate 20 Stripped on.
  • the above manufacturing method provides a channel 24 for injecting the chemical substance 200 on the rigid substrate 20 such that the chemical substance 200 is adhered to the rigid substrate 20 along the channel 24.
  • the bonding agent 60 between the flexible substrate 40 and the flexible substrate 40 chemically dissolves the bonding agent 60 to peel the rigid substrate 20 and the flexible substrate 40.
  • the chemical substance 200 and the binder 60 A chemical reaction occurs to completely remove the binder 60 to completely peel off the flexible substrate 20 without damaging the flexible substrate 40, facilitating the fabrication of high quality flexible electronic devices.
  • the rigid substrate 20 is a quartz substrate or a glass substrate, but is not limited thereto.
  • the rigid substrate 20 Mainly to provide support for the subsequent fabrication process of the electronic device 80 to avoid breakage, wrinkles and deformation of the flexible substrate 20.
  • the rigid substrate 20 includes a first surface 21 and the first surface 21 An opposite second surface 22 and a side 23 between the first surface 21 and the second surface 22.
  • the first surface 21 faces the flexible substrate 40.
  • the channel 24 is disposed on the first surface 21 of the rigid substrate 20.
  • the microchannels, patterns, lines or grooves on the top are shown in Figures 2 and 3.
  • the channel 24 can be of any shape, i.e., unrestricted by shape.
  • the channel 24 It is formed by etching or laser drilling.
  • the passage 24 has at least one injection port 26 located on a side 23 of the rigid substrate 20, for example, an injection port 26 corresponds to a channel 24 such that chemical 200 flows into channel 24 along different injection ports 26 to react with binder 60.
  • the injection port 26 It can be square, circular or other shape, and is also formed by etching or laser drilling.
  • the channels 24 are connected to each other.
  • the number of the injection ports 26 may be one, that is, the chemical substance 200.
  • the inlet port 26 flows into the passage 24, or the number of the injection ports 26 is two or the same as the number of the passages 24, so that the chemical substance 200 can be along any one of the injection ports. It flows into the passage 24, thereby accelerating the reaction speed of the chemical substance 200 with the binder 60.
  • the injection port 26 is disposed on the second surface 22 and communicates with the passage 24.
  • the injection port 26 for the chemical substance 200 to enter and contact the bonding agent 60.
  • the passage 24 is a through hole 25 penetrating the first surface 21 and the second surface 22
  • the via hole 25 is formed by etching or laser drilling.
  • the via hole 25 There are a plurality of, and the number of the through holes 25 can be determined according to the size of the rigid substrate 20.
  • a bonding agent 60 is applied to the first surface 21 of the rigid substrate 20, and the bonding agent 60 is applied to the channel 24.
  • the binder 60 may be a bonded polymer or film, and the adhesive polymer may be silica gel, rubber, epoxy resin or phenolic resin or the like. Applying adhesive 60 In the case of dip coating, roll coating, die coating, spray coating, curtain coating, spin coating or dispensing. The dip coating method is performed by immersing the first surface 21 of the rigid substrate 20 in a binder 60. In the tank, after a short period of time, the rigid substrate 20 is removed from the tank and the excess binder 60 is recirculated back into the tank.
  • the adhesive 60 should be uniformly applied to the first surface 21 at the time.
  • the adhesive 60 can be on the first surface 21 A plurality of bonding patterns are formed thereon, and the bonding patterns should be uniformly distributed on the first surface 21.
  • the flexible substrate 40 is bonded to the rigid substrate 20 by a bonding agent 60. Specifically, the flexible substrate 40 is covered with a binder The flexible substrate 40 is bonded to the rigid substrate 20 by curing the binder 60. In the present embodiment, the flexible substrate 40 is attached to the rigid substrate 20
  • the upper bonding method may be a normal pressing method or a rolling method, but is not limited thereto.
  • the flexible substrate 40 may be a glass film substrate, a stainless steel film substrate, or a plastic substrate, but is not limited thereto.
  • the flexible substrate 40 The thickness ranges from 5.5 to 550 microns.
  • the bonding agent 60 may also be applied to the flexible substrate 40 first and by curing the bonding agent 60.
  • the flexible substrate 40 is attached to the rigid substrate 20.
  • an electronic device 80 is fabricated on a flexible substrate 40. Due to the rigid substrate 20 The support function of the electronic device 80 on the flexible substrate 40 bonded to the rigid substrate 20 can effectively avoid the flexible substrate 40 in the electronic device 80 Broken, wrinkled and deformed during the production process. Fabricating electronic device 80 on said flexible substrate 20 includes at least one of said electronic device 80 and said electronic device 80 The electrically connected wiring is disposed on the surface of the flexible substrate 20.
  • the electronic device 80 may be a display element, a thin film transistor, a capacitor or a resistor, or the like, but is not limited thereto.
  • Making electronics 80 During the process, the length of the electronic device 80 should avoid the bending direction of the flexible substrate 40 to prevent damage to the electronic device 80 when the flexible substrate 40 is bent.
  • the method of packaging the light emitting diode includes a metal encapsulation method, a glass encapsulation method, a plastic encapsulation method, or a thin film encapsulation method, but is not limited thereto.
  • the chemical substance 200 is capable of dissolving the binder 60
  • the substance can be a chemical solvent or a gas.
  • the chemical solvent is acetone, isopropanol or other solvent.
  • the gas may be a corrosive gas such as a fluorinated gas.
  • the step of injecting the chemical 20 into the channel 24 includes: introducing the chemical 20
  • the injection port 26 of the rigid substrate 20 is injected, and the chemical substance 200 flows into the channel 24 along the injection port 26 to form the bonding agent 60.
  • a chemical solvent such as acetone or isopropyl alcohol is injected into the injection port 26 of the rigid substrate 20, and the chemical flows into the channel 24 along the injection port 26 to form the bonding agent 60.
  • a rubber, epoxy or phenolic resin is contacted and chemically reacted to dissolve the binder 60 to peel the flexible substrate 40 from the rigid substrate 20 to form a flexible substrate 40.
  • flexible electronics for electronics 80 is provided.
  • the step of injecting the chemical 20 into the channel 24 includes: the flexible substrate 40 and the rigid substrate 20 immersed in a reaction vessel 300 containing a chemical substance 200, and the chemical substance 200 along the via hole 25 and the binder 60 Contact and react. Specifically, in a reaction vessel 300 containing a chemical solvent such as acetone or isopropyl alcohol, acetone or isopropyl alcohol is passed along the via 25 and the binder 60. For example, a rubber, epoxy or phenolic resin is contacted and reacted to dissolve the bonding agent 60 to peel the flexible substrate 40 from the rigid substrate 20 to form a flexible substrate 40 and an electronic device 80.
  • Flexible electronics as shown in Figure 7.
  • reaction vessel 300 It is filled with a fluorinated gas such as cesium fluoride, chlorine trifluoride, bromine trifluoride or fluorine gas to dissolve the silica gel binder 60 .
  • a fluorinated gas such as cesium fluoride, chlorine trifluoride, bromine trifluoride or fluorine gas to dissolve the silica gel binder 60 .
  • the silica gel binder 60 A homogenous chemical reaction occurs with a fluorinated gas such as cesium fluoride to generate helium gas and silicon tetrafluoride gas.
  • the silica gel binder 60 When using chlorine trifluoride, bromine trifluoride or fluorine gas as the fluorinated gas, the silica gel binder 60
  • the reaction product with the fluorinated gas is still a escapable gas such as chlorine gas and silicon tetrafluoride gas due to the silica gel binder 60 It reacts well with the fluorinated gas, and no foreign impurities are added during the reaction, and no residual silicone adhesive 60 remains.
  • a chemical solvent or gas is used to react with the bonding agent 60 through the injection port 26 or the via hole 25, and the rigid substrate is made.
  • 20 Automatic stripping is achieved, and the peeling is not cleaned effectively.
  • the dissolution of the binder 60 by acetone or isopropanol and the reaction conditions of the fluorinated gas with the silica gel binder 60 hardly affect the flexible substrate 40.
  • the electronic device 80 causes damage, thereby effectively avoiding the influence on the performance of the flexible substrate 40 and the electronic device 80 when the rigid substrate 20 is peeled off, and, when the rigid substrate 20 is peeled off, the electronic device 80 and its circuitry are unaffected, making it easy to produce high quality flexible electronics.
  • a plurality of via holes 25 are designed to enable a chemical solvent or gas to be bonded to the binder over a large area. The contact and reaction occur to peel off the rigid substrate 20, which accelerates the peeling speed and also achieves an effective peeling effect.
  • the size of the injection port 26 can be increased or the passage 24 can be made. Exposure to the side of the rigid substrate 20 exposes the adhesive 60, which increases the contact area of the chemical 200 with the binder 60 and accelerates the reaction.
  • the fabrication of the flexible electronic device is completed by the above-mentioned production steps, and the substrate of the flexible electronic device is fabricated by referring to FIG. 5 and FIG. 6 at the same time.
  • 100 includes a flexible electronic device formed by the above method, a rigid substrate 20 provided with a channel 24, and a bonding agent 60 coated on the rigid substrate 20 and filled in the channel, the bonding agent 60
  • the flexible electronic device is attached to the rigid substrate 20.
  • the flexible electronic device includes a flexible substrate 20 and is disposed on the flexible substrate 40 and located away from the rigid substrate 20 of the flexible substrate 40. One side of the electronics 80.
  • the channel 24 is disposed on the first surface of the rigid substrate 20 And interconnecting microchannels, patterns, lines or grooves and having at least one injection port 26 on the side 23 of the rigid substrate 20.
  • the rigid substrate 20 A plurality of via holes 25 penetrating the rigid substrate 20 are provided, and specifically, the via holes 25 penetrate the first surface 21 and the second surface 22 of the rigid substrate 20. Peeled rigid substrate 20
  • the latter flexible electronic device can be applied to an electronic device to improve the application range of the flexible electronic device, for example, it can be applied to a flexible display, a mobile phone, a disk drive, a CD player, and the like.
  • the present invention provides a chemical substance by providing a passage 24 having an injection port 26 or a through hole 25 on the rigid substrate 20. 200 is in contact with and reacts with the binder 60, so that the rigid substrate 20 is completely automatically peeled off, and the reaction conditions of the chemical 200 and the binder 60 are not applied to the flexible substrate 40. Or the electronic device 80 causes damage.
  • This method can be used to ensure that the flexible substrate 40 is in the fabrication of electronic components 80 The deformation or warping phenomenon does not occur during the process to form a high-quality flexible electronic device, and the rate of peeling of the flexible substrate 40 from the rigid substrate 20 is effectively improved, which is advantageous for its production application.
  • the manufacturing method of the flexible electronic device of the present invention is suitable for integrating a plurality of flexible substrates 40 for large-area fabrication, and completing the electronic device 80.
  • the flexible substrate 40 is fabricated and the cutting step is performed before the rigid substrate 20 is peeled off, not only the plurality of flexible substrates 40 can be separated, but also the bonding agent 60 It is exposed so that the chemical substance 200 can quickly react with the binder 60, thereby accelerating the peeling speed of the rigid substrate 20.

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Abstract

一种柔性电子器件的制作方法和制作柔性电子器件的基板。制作方法包括：在刚性基材（20）上设置通道（24）；利用黏结剂（60）将柔性基材（40）贴合于刚性基材（20）上；在柔性基材（40）上制作电子器件（80）；将化学物质注入通道（24）中；以及化学物质与黏结剂（60）反应，将柔性基材（40）从刚性基材（20）上剥离。通过在刚性基材（20）上设置通道（24），增强了化学物质与黏结剂（60）反应的效率和速度。

Description

柔性电子器件的制作方法和制作柔性电子器件的基板 技术领域
本发明属于电子器件制作领域，尤其涉及一种柔性电子器件的制作方法和制作柔性电子器件的基板。
背景技术
柔性电子器件是将有机 / 无机材料电子器件制作在柔性 / 可延性塑料或薄金属基材上的新兴电子技术，以其独特的柔性 / 延展性以及高效、低成本制造工艺，在信息、能源、医疗、国防等领域具有广泛应用前景，例如柔性电子显示器、有机发光二极管 OLED 、印刷 RFID 、薄膜太阳能电池板、电子用表面粘贴 (Skin Patches) 等。
由于柔性基板存在易碎、易起褶皱和变形等问题，在实际制作过程中尤为突出。常见的柔性电子器件的制作方法是利用特定的黏结剂将柔性基材与刚性基材贴附在一起，然后将电子器件制作在柔性基材之背离刚性基材的侧面上，最后通过加热或者激光熔切的方法去除黏结剂，从而将柔性基材从刚性基材上剥离以柔性电子器件，该柔性电子器件为设有电子器件的柔性基材。虽然这两种剥离方法通过不断的改进工艺条件从一定程度上改善了柔性基材与刚性基材的剥离效果, 但是黏结剂无法完全剥离干净与柔性基材存在损伤的问题仍然存在，且剥离工艺条件难以控制, 不利于制作高质量的柔性电子器件。
 技术问题
本发明的目的在于提供一种柔性电子器件的制作方法及制作柔性电子器件的基板，旨在解决现有技术中将柔性基材和刚性基材剥离的过程中存在的黏结剂无法完全剥离干净以及造成柔性基材损伤的问题。
技术解决方案
本发明实施例是这样实现的，一种柔性电子器件的制作方法，包括以下步骤：
在刚性基材上设置通道；
利用黏结剂将柔性基材贴合于所述刚性基材上；
在所述柔性基材上制作电子器件；
将化学物质注入所述通道中；
以及所述化学物质与所述黏结剂反应，将所述柔性基材从所述刚性基材上剥离。
进一步地，所述黏结剂为黏合聚合物或者薄膜。
进一步地，在所述柔性基材上制作电子器件的步骤包括：将至少一个所述电子器件和与所述电子器件电性连接的布线设在所述柔性基材的表面。
进一步地，所述化学物质为化学溶剂或者气体。
进一步地，所述通道为设置于所述刚性基材之第一表面的微型沟道、图案、纹路或者凹槽。
进一步地， 所述通道具有至少一个注入口，所述注入口位于所述刚性基材的侧面或者与所述第一表面相对的第二表面。
进一步地，所述通道相互连通。
进一步地，将所述化学物质注入所述通道的步骤包括：将所述化学物质注入所述刚性基材之注入口；以及所述化学物质沿所述注入口流入所述通道与所述黏结剂接触并发生反应。
进一步地，所述通道为贯通所述刚性基材之第一表面和与所述第一表面相对的第二表面的导通孔。
进一步地，将所述化学物质注入所述通道的步骤包括：将所述柔性基材及刚性基材浸入盛有所述化学物质的反应容器中；以及所述化学物质沿所述导通孔流入所述刚性基材内并与所述黏结剂接触和发生反应。
本发明还提供了一种制作柔性电子器件的基板，包括采用上述柔性电子器件的制作方法形成的柔性电子器件、 设有通道的刚性基材以及涂布于所述刚性基材上并添塞于所述通道的黏结剂，所述黏结剂将所述柔性电子器件贴合于所述刚性基材上 。
进一步地，所述通道为设置于所述刚性基材之第一表面且相互连通的微型沟道、图案、纹路或者凹槽，所述通道具有至少一个位于所述刚性基材侧面的注入口；或者所述通道为贯通所述刚性基材的导通孔。
 有益效果
本发明通过在所述刚性基材上设置具有注入口的通道或者贯通孔，使所述化学物质与所述黏结剂接触并发生反应，从而使所述刚性基材完全自动剥离，而且所采用的所述化学物质与所述黏结剂的反应条件不会对所述柔性基材或者所述电子器件造成损伤。利用该方法可以保证所述柔性基材在制作所述电子器件的过程中不发生变形或者翘曲现象。
附图说明
图 1 是本发明实施例 提供的柔性电子器件的制作方法的流程图。
图 2 是本发明 提供的第一种 实施方式中 刚性基材的通道分布的平面示意图。
图 3 是本发明 提供的第一种 实施方式中 刚性基材的通道分布的立体示意图。
图 4 是本发明 提供的第二种 实施方式中 刚性基材的通道分布的平面示意图。
图 5 是本发明 提供的第一种实施方式中制作柔性电子器件的基板的剖面示意图。
图 6 是本发明 提供的第二种实施方式中制作柔性电子器件的基板的剖面示意图。
图 7 是本发明实施例 提供的第二种实施方式中制作柔性电子器件的基板的剖面示意图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参照图 1 ，本发明提供的柔性电子器件的制作方法，包括以下步骤：
在刚性基材 20 上设置通道 24 ；
利用黏结剂 60 将柔性基材 40 贴合于刚性基材 20 上；
在所述柔性基材 40 上制作电子器件 80 ；
将化学物质 200 注入通道 24 中；以及
所述化学物质 200 与所述黏结剂 60 反应，将所述柔性基材 40 从所述刚性基材 20 上剥离。上述制作方法通过在刚性基材 20 上设置用于注入化学物质 200 的通道 24 ，以使所述化学物质 200 沿该通道 24 与粘结于刚性基材 20 和柔性基材 40 之间的黏结剂 60 发生化学反应，从而溶解所述黏结剂 60 使刚性基材 20 和柔性基材 40 剥离。而且，化学物质 200 与黏结剂 60 发生化学反应，可以完全清除黏结剂 60 以使柔性基材 20 完全剥离干净，同时，不会损伤柔性基材 40 ，便于制作高质量的柔性电子器件。
在本实施方式中，刚性基材 20 为石英基材或者玻璃基材，但不限于此。该刚性基材 20 主要是为后续的电子器件 80 的制作过程提供支撑作用，以避免柔性基材 20 出现破碎、褶皱和变形等现象。
请同时参照图 2 至图 4 ，刚性基材 20 包括第一表面 21 、与所述第一表面 21 相对的第二表面 22 以及位于所述第一表面 21 和所述第二表面 22 之间的侧面 23 。所述第一表面 21 朝向所述柔性基材 40 。
在本发明的第一种实施方式中，所述通道 24 为设置于刚性基材 20 的第一表面 21 上的微型沟道、图案、纹路或者凹槽，如图 2 和图 3 所示。所述通道 24 可以是任意形状，即不受形状的限制。所述通道 24 是通过蚀刻或者激光钻刻的方式形成的。所述通道 24 具有至少一个注入口 26 ，所述注入口 26 位于所述刚性基材 20 的侧面 23 ，例如，一个注入口 26 对应一个通道 24 ，以使化学物质 200 沿不同注入口 26 流入通道 24 内与黏结剂 60 反应。所述注入口 26 可以为方形、圆形或者其他形状，也是通过蚀刻或者激光钻刻的方式形成的。
进一步地，所述通道 24 相互连通，具体而言，所述注入口 26 的数量可以是一个，即化学物质 200 沿该注入口 26 流入所述通道 24 内，或者注入口 26 的数量为两个或者与所述通道 24 的数量相同，以使化学物质 200 可以沿任意一个注入口 26 流入所述通道 24 内，从而加快化学物质 200 与黏结剂 60 的反应速度。
在其他实施方式中，所述注入口 26 设置于第二表面 22 上并与所述通道 24 相互贯通。所述注入口 26 用于供化学物质 200 进入并与所述黏结剂 60 接触。
在本发明的第二种实施方式中，所述通道 24 为贯通第一表面 21 和第二表面 22 的导通孔 25 ，所述导通孔 25 是通过蚀刻或者激光钻刻的方式形成的。为有效地使化学物质 200 与黏结剂 60 接触并发生反应，所述导通孔 25 设有多个，可以根据刚性基材 20 的尺寸大小来确定导通孔 25 的个数。
在刚性基材 20 的第一表面 21 涂布黏结剂 60 ，黏结剂 60 添塞于通道 24 中。所述黏结剂 60 可以为黏合聚合物或者薄膜，所述黏合聚合物可以是硅胶、橡胶、环氧树脂或者酚醛树脂等。在涂布黏结剂 60 时，可以采用浸涂法、滚涂法、模涂法、喷涂法、帘涂法、旋涂法或者点胶法等。浸涂法是通过将刚性基材 20 之第一表面 21 浸没在盛有黏结剂 60 的槽中，经过很短的时间，将刚性基材 20 从槽中取出，并将多余的黏结剂 60 重新流回槽内。采用滚涂法、模涂法、喷涂法、帘涂法或者旋涂法涂布黏结剂 60 时，黏结剂 60 应均匀涂覆在第一表面 21 上。采用点胶法涂布黏结剂 60 时，黏结剂 60 可以在第一表面 21 上形成多个粘结图案，所述黏结图案应均匀分布在第一表面 21 上。
利用黏结剂 60 将柔性基材 40 贴合于刚性基材 20 上。具体地，将柔性基材 40 覆盖在黏结剂 60 上，并通过固化所述黏结剂 60 以使所述柔性基材 40 与所述刚性基材 20 贴合在一起。在本实施方式中，将所述柔性基材 40 贴合于所述刚性基材 20 上贴合方式可以是普通压合方式或者碾压方式，但并不限于此。柔性基材 40 可以是玻璃薄膜基材、不锈钢薄膜基材或者塑料基材，但不限于此。所述柔性基材 40 的厚度范围为 5.5~550 微米。
在其他实施方式中，也可以将黏结剂 60 先涂布于柔性基材 40 上，并通过固化所述黏结剂 60 将所述柔性基材 40 与所述刚性基材 20 贴合在一起。
请参照图 5 和图 6 ，在柔性基材 40 上制作电子器件 80 。由于刚性基材 20 的支撑作用，在与刚性基材 20 贴合在一起的柔性基材 40 上制作电子器件 80 ，可以有效地避免柔性基材 40 在电子器件 80 的制作过程中出现破碎、褶皱和变形现象。在所述柔性基材 20 上制作电子器件 80 包括将至少一个所述电子器件 80 和与所述电子器件 80 电性连接的布线设置在柔性基材 20 的表面。所述电子器件 80 可以是显示元件、薄膜晶体管、电容器或者电阻器等，但不限于此。在制作电子器件 80 的过程中，电子器件 80 的长度方向应避开柔性基材 40 的弯曲方向，以防止柔性基材 40 发生弯曲时损坏电子器件 80 。以所述电子器件 80 为显示元件为例，在柔性基材 40 上制作有机发光二极管以及封装所述有机发光二极管。封装所述发光二极管的方法包括金属封装法、玻璃封装法、塑料封装法或者薄膜封装法，但不限于此。
所述化学物质 200 是可以溶解所述黏结剂 60 的物质，可以是化学溶剂或者气体。所述化学溶剂为丙酮、异丙醇或者其他溶解剂。所述气体可以是腐蚀性气体，例如氟化气体。
在本发明的一种实施方式中，将化学物质 20 注入通道 24 的步骤包括：将所述化学物质 20 注入刚性基材 20 之注入口 26 ，以及化学物质 200 沿注入口 26 流入通道 24 以与黏结剂 60 接触并发生反应。具体而言，将化学溶剂例如丙酮或者异丙醇注入刚性基材 20 之注入口 26 中，该化学物质沿注入口 26 流入通道 24 中以与黏结剂 60 例如橡胶、环氧树脂或者酚醛树脂接触并发生化学反应，从而将黏结剂 60 溶解，以使柔性基材 40 从刚性基材 20 上剥离，从而形成包括柔性基材 40 和电子器件 80 的柔性电子器件。
在本发明的另一种实施方式中，将化学物质 20 注入通道 24 的步骤包括：将柔性基材 40 及刚性基材 20 浸入盛有化学物质 200 的反应容器 300 中，以及所述化学物质 200 沿导通孔 25 与黏结剂 60 接触并发生反应。具体而言，在盛有化学溶剂例如丙酮或者异丙醇的反应容器 300 中，丙酮或者异丙醇沿导通孔 25 与黏结剂 60 例如橡胶、环氧树脂或者酚醛树脂接触并发生反应，以将黏结剂 60 溶解，从而使柔性基材 40 从刚性基材 20 上剥离以形成包括柔性基材 40 和电子器件 80 的柔性电子器件，如图 7 所示。
在本实施方式中，请参照图 7 ，在反应容器 300 中充满氟化气体，例如氟化氙、三氟化氯、三氟化溴或者氟气，溶解硅胶黏结剂 60 。氟化氙反应容器 300 中，硅胶黏结剂 60 与氟化气体例如氟化氙发生各项同性化学反应，生成氙气体和四氟化硅气体逸出。当选用三氟化氯、三氟化溴或者氟气作为氟化气体时，硅胶黏结剂 60 与氟化气体的反应产物仍然为可逸出的气体例如氯气体与四氟化硅气体，由于硅胶黏结剂 60 与氟化气体的充分反应，且在反应过程中不会新增外来的杂质，也不会有硅胶黏结剂 60 的残余。
综上所述，利用化学溶剂或者气体通过注入口 26 或者导通孔 25 与黏结剂 60 反应，并使刚性基材 20 实现自动剥离干净，并有效避免剥离不干净现象。而且，丙酮或者异丙醇对黏结剂 60 溶解以及氟化气体与硅胶黏结剂 60 的反应条件几乎不会对柔性基材 40 以及电子器件 80 造成损伤，从而有效地避免剥离刚性基材 20 时对柔性基层 40 和电子器件 80 性能的影响，而且，在剥离刚性基材 20 时，电子器件 80 及其电路不会受到影响，从而有利于制作高质量的柔性电子器件。
本发明一种实施方式中通过设计多个导通孔 25 ，使化学溶剂或者气体能够在较大面积范围内与黏结剂 60 接触并发生反应，使刚性基材 20 剥离，这可以加速剥离速度，也可以达到有效剥离之效果。
为了加速化学物质 200 与黏结剂 60 的反应，可以加大注入口 26 的尺寸或者使通道 24 暴露于刚性基材 20 的侧边，从而使黏结剂 60 暴露出来，这样可以加大化学物质 200 与黏结剂 60 的接触面积，加速反应。
综合上述制作步骤即完成了柔性电子器件的制作，请同时参照图 5 和图 6 ，制作柔性电子器件的基板 100 包括采用上述方法形成的柔性电子器件、设有通道 24 的刚性基材 20 以及涂布于刚性基材 20 上并添塞于通道内的黏结剂 60 ，黏结剂 60 将柔性电子器件贴合于刚性基材 20 上。柔性电子器件包括柔性基材 20 以及设置于柔性基材 40 上并位于柔性基材 40 之背离刚性基材 20 的一侧的电子器件 80 。在第一种实施方式中，通道 24 为设置于刚性基材 20 之第一表面 21 且相互连通的微型沟道、图案、纹路或者凹槽，并具有至少一个位于所述刚性基材 20 之侧面 23 的注入口 26 。在第二种实施方式中，所述刚性基材 20 设有多个贯通所述刚性基材 20 的导通孔 25 ，具体地，导通孔 25 贯通刚性基材 20 的第一表面 21 和第二表面 22 。经剥离刚性基材 20 后的柔性电子器件可以应用于电子装置中，提高柔性电子器件的应用范围，例如，可以应用于柔性显示器、移动电话、磁碟机、 CD 随身听等。
本发明通过在刚性基材 20 上设置具有注入口 26 的通道 24 或者贯通孔 25 ，使化学物质 200 与黏结剂 60 接触并发生反应，从而使刚性基材 20 完全自动剥离，而且所采用的化学物质 200 与黏结剂 60 的反应条件不会对柔性基材 40 或者电子器件 80 造成损伤。利用该方法可以保证柔性基材 40 在制作电子器件 80 的过程中不发生变形或者翘曲现象以形成高质量的柔性电子器件，并有效的提高了柔性基材 40 从刚性基材 20 上剥离的速率，有利于其在生产上的应用。
本发明的柔性电子器件的制作方法适用于多个柔性基板 40 整合在一起进行大面积制作，在完成将电子器件 80 制作在柔性基板 40 之后以及在剥离刚性基材 20 之前进行切割步骤，不仅可以使得多个柔性基板 40 分离，而且还使黏结剂 60 暴露出来，从而使得化学物质 200 可以快速与黏结剂 60 发生反应，进而加快刚性基材 20 的剥离速度。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种柔性电子器件的制作方法，其特征在于，包括以下步骤：
    在刚性基材上设置通道；
    利用黏结剂将柔性基材贴合于所述刚性基材上；
    在所述柔性基材上制作电子器件；
    将化学物质注入所述通道中；以及
    使所述化学物质与所述黏结剂反应，将所述柔性基材从所述刚性基材上剥离。
  2. 如权利要求 1 所述的柔性电子器件的制作方法，其特征在于，在所述柔性基材上制作电子器件的步骤包括：
    将至少一个所述电子器件和与所述电子器件电性连接的布线设在所述柔性基材的表面。
  3. 如权利要求 1 或者 2 所述的柔性电子器件的制作方法，其特征在于，所述通道为设置于所述刚性基材之第一表面的微型沟道、图案、纹路或者凹槽。
  4. 如权利要求 3 所述的柔性电子器件的制作方法，其特征在于，所述通道具有至少一个注入口，所述注入口位于所述刚性基材的侧面或者与所述第一表面相对的第二表面。
  5. 如权利要求 4 所述的柔性电子器件的制作方法，其特征在于，所述通道相互连通。
  6. 如权利要求 5 所述的柔性电子器件的制作方法，其特征在于，将所述化学物质注入所述通道的步骤包括：
    将所述化学物质注入所述刚性基材之注入口；以及
    所述化学物质沿所述注入口流入所述通道以与所述黏结剂接触并发生反应。
  7. 如权利要求 1 或者 2 所述的柔性电子器件的制作方法，其特征在于，所述通道为贯通所述刚性基材之第一表面和与所述第一表面相对的第二表面的导通孔。
  8. 如权利要求 7 所述的柔性电子器件的制作方法，其特征在于，将所述化学物质注入所述通道的步骤包括：
    将所述柔性基材及刚性基材浸入盛有所述化学物质的反应容器中；以及
    所述化学物质沿所述导通孔流入所述刚性基材内并与所述黏结剂接触和发生反应。
  9. 一种制作柔性电子器件的基板，其特征在于，包括采用权利要求 1 或者 2 所述的柔性电子器件的制作方法形成的柔性电子器件、设有通道的刚性基材以及涂布于所述刚性基材上并添塞于所述通道内的黏结剂，所述黏结剂将所述柔性电子器件贴合于所述刚性基材上。
  10. 如权利要求 9 所述的制作柔性电子器件的基板，其特征在于，所述通道为设置于所述刚性基材之第一表面且相互连通的微型沟道、图案、纹路或者凹槽，并具有至少一个位于所述刚性基材侧面的注入口；或者所述通道为贯通所述刚性基材的导通孔。
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