WO2014097897A1 - Tantalum sputtering target and method for producing same - Google Patents

Tantalum sputtering target and method for producing same Download PDF

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Publication number
WO2014097897A1
WO2014097897A1 PCT/JP2013/082764 JP2013082764W WO2014097897A1 WO 2014097897 A1 WO2014097897 A1 WO 2014097897A1 JP 2013082764 W JP2013082764 W JP 2013082764W WO 2014097897 A1 WO2014097897 A1 WO 2014097897A1
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Prior art keywords
tantalum
rolling
sputtering target
target
plane
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PCT/JP2013/082764
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French (fr)
Japanese (ja)
Inventor
真一郎 仙田
光太郎 永津
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Jx日鉱日石金属株式会社
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Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Priority to EP13866236.6A priority Critical patent/EP2878699B1/en
Priority to CN201380053775.9A priority patent/CN105431565B/en
Priority to SG11201501175TA priority patent/SG11201501175TA/en
Priority to US14/433,948 priority patent/US10490393B2/en
Priority to KR1020157007541A priority patent/KR101950549B1/en
Priority to KR1020177007784A priority patent/KR20170036120A/en
Priority to JP2014524215A priority patent/JP5847309B2/en
Publication of WO2014097897A1 publication Critical patent/WO2014097897A1/en
Priority to IL237919A priority patent/IL237919B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/0615—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with transition metals other than titanium, zirconium or hafnium
    • C01B21/0617—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with transition metals other than titanium, zirconium or hafnium with vanadium, niobium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/02—Alloys based on vanadium, niobium, or tantalum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/2855—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by physical means, e.g. sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a tantalum sputtering target and a manufacturing method thereof.
  • the present invention relates to a tantalum sputtering target used for forming a Ta film or a TaN film as a diffusion barrier layer for copper wiring in an LSI and a method for manufacturing the same.
  • a Ta film or a TaN film is formed by sputtering a tantalum target.
  • various impurities, gas components, crystal plane orientation, crystal grain size, etc. contained in the target are related to the effect on sputtering performance, film formation speed, film thickness uniformity, particle generation, etc. Is known to affect.
  • Patent Document 1 describes that the uniformity of the film is improved by forming a crystal structure in which (222) orientation is preferential from the position of 30% of the target thickness toward the center plane of the target.
  • Patent Document 2 describes that by making the crystal orientation of the tantalum target random (not aligning with a specific crystal orientation), the film formation rate is increased and the uniformity of the film is improved.
  • Patent Document 3 discloses that the film orientation is improved by selectively increasing the plane orientation of (110), (200), (211) having a high atomic density on the sputtering surface, and variation in plane orientation is also observed. The improvement of uniformity is described by suppressing.
  • Patent Document 8 describes that a tantalum ingot is forged, subjected to heat treatment twice or more in this forging process, further subjected to cold rolling, and subjected to recrystallization heat treatment.
  • the idea of controlling the crystal orientation on the sputtering surface of the target to lower the discharge voltage of the tantalum target, facilitate the generation of plasma, and improve the stability of the plasma is Absent.
  • JP 2004-107758 A International Publication No. 2005/045090 Japanese Patent Laid-Open No. 11-80942 Japanese Patent Laid-Open No. 2002-36336 Special table 2008-532765 gazette Japanese Patent No. 4754617 International Publication No. 2011-061897 Japanese Patent No. 4714123
  • a tantalum sputtering target characterized in that, on the sputtering surface of a tantalum sputtering target, the orientation ratio of the (200) plane exceeds 70% and the orientation ratio of the (222) plane is 30% or less.
  • the present invention also provides: 5) Forging and recrystallization annealing of the cast tantalum ingot, followed by rolling and heat treatment, the (200) plane orientation ratio exceeds 70%, and the (222) plane orientation ratio on the sputtering surface of the target.
  • the tantalum sputtering target of the present invention is excellent in that the crystal orientation on the sputtering surface of the target can be controlled to lower the discharge voltage of the tantalum target, facilitate the generation of plasma, and improve the stability of the plasma. It has the effect. In particular, it has an excellent effect in forming a diffusion barrier layer made of Ta film or TaN film that can effectively prevent contamination around the wiring due to active Cu diffusion.
  • the tantalum sputtering target has a (200) plane orientation ratio of over 70% and a (222) plane orientation ratio of less than 30%.
  • the orientation rate of the (200) plane is 80% or more and the orientation rate of the (222) plane is 20% or less.
  • the sputtering rate (deposition rate) is reduced under normal conditions.
  • the discharge voltage of the tantalum target can be lowered, so that there is an advantage that plasma is easily generated and the plasma can be stabilized.
  • the voltage and current are adjusted so that the discharge can be maintained at a set input power.
  • the current may decrease due to some influence, and the voltage may increase in an attempt to maintain the power at a constant value.
  • a discharge abnormality In the tantalum sputtering target, the discharge voltage of the tantalum target can be lowered and the plasma can be stabilized by controlling the crystal orientation on the sputtering surface of the target. Occurrence can be suppressed.
  • the discharge abnormality occurrence rate can be reduced.
  • the orientation rate is a standardized measurement intensity of each diffraction peak obtained by X-ray diffraction (110), (200), (211), (310), (222), (321), This means the intensity ratio of a specific plane orientation when the sum of the plane orientation intensities is 100.
  • JCPDS Joint Committee for Powder Diffraction Standard
  • the orientation ratio (%) of the (200) plane is [[(measured intensity of (200) / JCPDS intensity of (200)] / ⁇ (measured intensity of each face / JCPDS intensity of each face)] ⁇ 10 0.
  • the tantalum sputtering target of the present invention can be used for forming a diffusion barrier layer such as a Ta film or a TaN film in a copper wiring. Even when nitrogen is introduced into the atmosphere during sputtering to form a TaN film, the sputtering target of the present invention is By controlling the crystal orientation on the sputter surface of the target, the discharge voltage of the tantalum target can be lowered, the plasma can be easily generated, and the plasma stability can be improved. In the formation of a copper wiring provided with a diffusion barrier layer such as a film or a TaN film, and further in the manufacture of a semiconductor device provided with the copper wiring, the product yield can be improved.
  • a tantalum target is manufactured by the above manufacturing process.
  • the (200) plane orientation ratio is increased, and the (222) plane orientation ratio is high. Is to lower.
  • a tantalum raw material having a purity of 99.995% was melted by electron beam and cast into an ingot having a diameter of 195 mm ⁇ .
  • this ingot was clamped and forged at room temperature to a diameter of 150 mm ⁇ , and this was recrystallized and annealed at a temperature of 1100 to 1400 ° C.
  • Example 1 In Example 1, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 400 mm at a rolling speed of 10 m / min and a rolling rate of 86% to obtain a thickness of 14 mm and a diameter of 520 mm ⁇ . Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 84.3% and the orientation ratio of the (222) plane was 9.9% could be obtained. When sputtering was performed using this sputtering target, the discharge voltage was 613.5 V, the discharge voltage variation was 7.1 V, and the discharge abnormality occurrence rate was good at 3.5%. The results are shown in Table 1.
  • Example 2 In Example 2, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 400 mm at a rolling speed of 15 m / min and a rolling rate of 88% to a thickness of 14 mm and a diameter of 520 mm ⁇ . Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 77.7% and the orientation ratio of the (222) plane was 16.2% could be obtained. When sputtering was performed using this sputtering target, the discharge voltage was 614.7 V, the discharge voltage variation was 12.3 V, and the discharge abnormality occurrence rate was good at 5.8%. The results are shown in Table 1.
  • Example 5 (Example 5)
  • the obtained target material was cold-rolled with a rolling roll having a rolling roll diameter of 500 mm at a rolling speed of 20 m / min and a rolling rate of 84% to a thickness of 14 mm and a diameter of 520 mm ⁇ .
  • Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target.
  • a tantalum sputtering target having a crystal structure in which the (200) plane orientation ratio was 70.8% and the (222) plane orientation ratio was 19.7% could be obtained.
  • the discharge voltage was 61.2 V
  • the discharge voltage variation was 12.2 V
  • the discharge abnormality occurrence rate was good at 8.1%.
  • Table 1 The results are shown in Table 1.
  • Comparative Example 1 In Comparative Example 1, the obtained target material was cold-rolled at a rolling speed of 15 m / min and a rolling rate of 80% using a rolling roll having a rolling roll diameter of 650 mm to a thickness of 14 mm and a diameter of 520 mm ⁇ . Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 43.6% and the orientation ratio of the (222) plane was 39.1% could be obtained. When sputtering was performed using this sputtering target, the discharge voltage was 622.5 V, the discharge voltage variation was 17.0 V, and the discharge abnormality occurrence rate was poor at 16.6%. The results are shown in Table 1.
  • Comparative Example 2 In Comparative Example 2, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 500 mm at a rolling speed of 10 m / min and a rolling rate of 78% to obtain a thickness of 14 mm and a diameter of 520 mm ⁇ . Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure with a (200) plane orientation ratio of 60.1% and a (222) plane orientation ratio of 24.0% could be obtained. When sputtering was performed using this sputtering target, the discharge voltage was 627.0 V, the discharge voltage variation was 18.0 V, and the discharge abnormality occurrence rate was poor at 20.5%. The results are shown in Table 1.

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Abstract

This tantalum sputtering target is characterized in that in the sputtering surface thereof, the orientation rate in the (200) plane exceeds 70% and the orientation rate in the (222) plane is no greater than 30%. By means of controlling the crystal orientation of the target, the discharge voltage of the tantalum target is reduced, causing plasma to be easily generated, and there is the effect of increasing the stability of plasma.

Description

タンタルスパッタリングターゲット及びその製造方法Tantalum sputtering target and manufacturing method thereof
　本発明は、タンタルスパッタリングターゲット及びその製造方法に関する。特には、ＬＳＩにおける銅配線の拡散バリア層としてのＴａ膜又はＴａＮ膜の形成に用いられるタンタルスパッタリングターゲット及びその製造方法に関する。 The present invention relates to a tantalum sputtering target and a manufacturing method thereof. In particular, the present invention relates to a tantalum sputtering target used for forming a Ta film or a TaN film as a diffusion barrier layer for copper wiring in an LSI and a method for manufacturing the same.
従来、半導体素子の配線材料としてアルミニウムが使用されていたが、素子の微細化、高集積化に伴い、配線遅延の問題が表面化し、アルミに替わって電気抵抗の小さい銅が使用されるようになった。銅は、配線材料として非常に有効であるが、銅自体が活発な金属であるため、層間絶縁膜に拡散して汚染するという問題があり、銅配線と層間絶縁膜との間に、Ｔａ膜やＴａＮ膜などの拡散バリア層を形成する必要がある。 Conventionally, aluminum has been used as a wiring material for semiconductor elements, but with the miniaturization and high integration of elements, the problem of wiring delay has surfaced so that copper with low electrical resistance can be used instead of aluminum. became. Copper is very effective as a wiring material, but because copper itself is an active metal, there is a problem that it diffuses into the interlayer insulating film and becomes contaminated. Between the copper wiring and the interlayer insulating film, the Ta film And a diffusion barrier layer such as a TaN film must be formed.
　一般に、Ｔａ膜やＴａＮ膜は、タンタルターゲットをスパッタリングすることにより成膜する。これまでタンタルターゲットについて、スパッタリング時のパフォーマンスに及ぼす影響に関して、ターゲットに含有される各種不純物、ガス成分、結晶の面方位や結晶粒径等が、成膜速度、膜厚の均一性、パーティクル発生等に影響を与えることが知られている。 Generally, a Ta film or a TaN film is formed by sputtering a tantalum target. For tantalum targets, various impurities, gas components, crystal plane orientation, crystal grain size, etc. contained in the target are related to the effect on sputtering performance, film formation speed, film thickness uniformity, particle generation, etc. Is known to affect.
　例えば、特許文献１には、ターゲット厚さの３０％の位置からターゲットの中心面に向かって（２２２）配向が優先的である結晶組織にすることにより、膜の均一性を向上させることが記載されている。
また、特許文献２は、タンタルターゲットの結晶配向をランダムにする（特定の結晶方位にそろえない）ことにより、成膜速度が大きく、膜の均一性を向上させることが記載されている。
また、特許文献３には、原子密度の高い（１１０）、（２００）、（２１１）の面方位をスパッタ面に選択的に多くすることにより成膜速度が向上し、かつ面方位のばらつきを抑えることでユニフォーミティの向上が記載されている。 For example, Patent Document 1 describes that the uniformity of the film is improved by forming a crystal structure in which (222) orientation is preferential from the position of 30% of the target thickness toward the center plane of the target. Has been.
Patent Document 2 describes that by making the crystal orientation of the tantalum target random (not aligning with a specific crystal orientation), the film formation rate is increased and the uniformity of the film is improved.
Patent Document 3 discloses that the film orientation is improved by selectively increasing the plane orientation of (110), (200), (211) having a high atomic density on the sputtering surface, and variation in plane orientation is also observed. The improvement of uniformity is described by suppressing.
　さらに、特許文献４には、Ｘ線回折により求められる（１１０）面の強度比の、スパッタ表面部分の場所によるばらつきを２０％以内にすることにより、膜厚均一性を向上させることが記載されている。
また、特許文献５には、スエージング、押し出し、回転鍛造、無潤滑の据え込み鍛造をクロック圧延と組み合わせて用い、非常に強い（１１１）、（１００）などの結晶学集合組織を持つ円形の金属ターゲットを作製できると述べられている。 Further, Patent Document 4 describes that the uniformity of the film thickness is improved by making the variation of the intensity ratio of the (110) plane obtained by X-ray diffraction within 20% depending on the location of the sputter surface portion. ing.
Further, Patent Document 5 uses swaging, extrusion, rotary forging, and non-lubricated upset forging in combination with clock rolling, and has a very strong crystallographic texture such as (111) or (100). It is stated that a metal target can be made.
　この他、下記特許文献６には、タンタルインゴットを、鍛造、焼鈍、圧延加工を施し、最終組成加工後、さらに１１７３Ｋ以下の温度で焼鈍を行い、未再結晶組織を２０％以下、９０％以下とするタンタルスパッタリングターゲットの製造方法が記載されている。 In addition, in Patent Document 6 below, a tantalum ingot is subjected to forging, annealing, and rolling, and after final composition processing, it is further annealed at a temperature of 1173 K or lower, and an unrecrystallized structure is 20% or less, 90% or less. A method for producing a tantalum sputtering target is described.
また、特許文献７には、鍛造、冷間圧延等の加工と熱処理により、ターゲットのスパッタ面のピークの相対強度を（１１０）＞（２１１）＞（２００）とし、スパッタ特性を安定化させる技術が開示されている。 Patent Document 7 discloses a technique for stabilizing the sputtering characteristics by setting the relative intensity of the peak of the sputtering surface of the target to (110)> (211)> (200) by processing such as forging and cold rolling and heat treatment. Is disclosed.
　さらに、特許文献８には、タンタルインゴットを鍛造し、この鍛造工程で２回以上の熱処理を行い、さらに冷間圧延を施し、再結晶化熱処理を行うことが記載されている。
しかしながら、上記特許文献のいずれにも、ターゲットのスパッタ面における結晶配向を制御することによって、タンタルターゲットの放電電圧を低くし、プラズマを発生し易くすると共に、プラズマの安定性を向上させるという発想はない。 Further, Patent Document 8 describes that a tantalum ingot is forged, subjected to heat treatment twice or more in this forging process, further subjected to cold rolling, and subjected to recrystallization heat treatment.
However, in any of the above patent documents, the idea of controlling the crystal orientation on the sputtering surface of the target to lower the discharge voltage of the tantalum target, facilitate the generation of plasma, and improve the stability of the plasma is Absent.
特開２００４－１０７７５８号公報JP 2004-107758 A 国際公開２００５／０４５０９０号International Publication No. 2005/045090 特開平１１－８０９４２号公報Japanese Patent Laid-Open No. 11-80942 特開２００２－３６３７３６号公報Japanese Patent Laid-Open No. 2002-36336 特表２００８－５３２７６５号公報Special table 2008-532765 gazette 特許第４７５４６１７号Japanese Patent No. 4754617 国際公開２０１１／０６１８９７号International Publication No. 2011-061897 特許第４７１４１２３号Japanese Patent No. 4714123
本発明は、タンタルスパッタリングターゲットにおいて、ターゲットのスパッタ面における結晶配向を制御することによって、タンタルターゲットの放電電圧を低くし、プラズマを発生し易くすると共に、プラズマの安定性を向上させることを課題とする。
特に、活発なＣｕの拡散による配線周囲の汚染を効果的に防止することができるＴａ膜又はＴａＮ膜などからなる拡散バリア層の形成に有用なタンタルスパッタリングターゲットを提供することを課題とする。 It is an object of the present invention to lower the discharge voltage of a tantalum target by controlling the crystal orientation on the sputtering surface of the tantalum sputtering target, to easily generate plasma, and to improve the stability of the plasma. To do.
In particular, it is an object of the present invention to provide a tantalum sputtering target useful for forming a diffusion barrier layer made of a Ta film or a TaN film that can effectively prevent contamination around wiring due to active Cu diffusion.
　上記の課題を解決するために、本発明は、以下の発明を提供するものである。
１）タンタルスパッタリングターゲットのスパッタ面において、（２００）面の配向率が７０％を超え、かつ、（２２２）面の配向率が３０％以下であることを特徴とするタンタルスパッタリングターゲット
２）タンタルスパッタリングターゲットのスパッタ面において、（２００）面の配向率が８０％以上、かつ、（２２２）面の配向率が２０％以下であることを特徴とする上記１）記載のタンタルスパッタリングターゲット
３）上記１）～２）のいずれかに記載のスパッタリングターゲットを用いて形成した拡散バリア層用薄膜
４）上記３）記載の拡散バリア層用薄膜を用いられた半導体デバイス In order to solve the above-described problems, the present invention provides the following inventions.
1) A tantalum sputtering target characterized in that, on the sputtering surface of a tantalum sputtering target, the orientation ratio of the (200) plane exceeds 70% and the orientation ratio of the (222) plane is 30% or less. 1) The tantalum sputtering target according to 1) above, wherein the (200) plane orientation ratio is 80% or more and the (222) plane orientation ratio is 20% or less on the sputtering surface of the target. ) Diffusion barrier layer thin film formed using the sputtering target according to any one of 2) to 2) 4) Semiconductor device using the diffusion barrier layer thin film according to 3) above
また、本発明は、
５）溶解鋳造したタンタルインゴットを鍛造及び再結晶焼鈍した後、圧延及び熱処理し、ターゲットのスパッタ面において、（２００）面の配向率が７０％を超え、かつ、（２２２）面の配向率が３０％以下である結晶組織を形成することを特徴とするタンタルスパッタリングターゲットの製造方法
６）溶解鋳造したタンタルインゴットを鍛造及び再結晶焼鈍した後、圧延及び熱処理し、ターゲットのスパッタ面において、（２００）面の配向率が８０％以上、かつ、（２２２）面の配向率が２０％以下である結晶組織を形成することを特徴とする上記５）記載のタンタルスパッタリングターゲットの製造方法。
７）圧延ロール径５００ｍｍ以下の圧延ロールを用いて、圧延速度１０ｍ／分以上、圧延率８０％超で冷間圧延することを特徴とする上記５）～６）のいずれかに記載のタンタルスパッタリングターゲットの製造方法。
８）温度９００℃～１４００℃で熱処理することを特徴とする上記５）～７）のいずれかに記載のタンタルスパッタリングターゲットの製造方法。
９）圧延及び熱処理後、切削、研磨により表面仕上げを行うことを特徴とする上記５）～８）のいずれかに記載のタンタルスパッタリングターゲットの製造方法、を提供する。 The present invention also provides:
5) Forging and recrystallization annealing of the cast tantalum ingot, followed by rolling and heat treatment, the (200) plane orientation ratio exceeds 70%, and the (222) plane orientation ratio on the sputtering surface of the target. A tantalum sputtering target manufacturing method characterized by forming a crystal structure of 30% or less 6) Forging and recrystallization annealing of a cast tantalum ingot, followed by rolling and heat treatment, (200 5) The method for producing a tantalum sputtering target according to 5) above, wherein a crystal structure having a plane orientation ratio of 80% or more and a (222) plane orientation ratio of 20% or less is formed.
7) Tantalum sputtering according to any one of 5) to 6) above, wherein cold rolling is performed at a rolling speed of 10 m / min or more and a rolling rate of more than 80% using a rolling roll having a rolling roll diameter of 500 mm or less. Target manufacturing method.
8) The method for producing a tantalum sputtering target according to any one of 5) to 7) above, wherein the heat treatment is performed at a temperature of 900 ° C. to 1400 ° C.
9) The method for producing a tantalum sputtering target according to any one of 5) to 8) above, wherein surface finishing is performed by cutting and polishing after rolling and heat treatment.
本発明のタンタルスパッタリングターゲットは、ターゲットのスパッタ面における結晶配向を制御することによって、タンタルターゲットの放電電圧を低くし、プラズマを発生し易くすると共に、プラズマの安定性を向上させることができるという優れた効果を有する。特に、活発なＣｕの拡散による配線周囲の汚染を効果的に防止することができるＴａ膜又はＴａＮ膜などからなる拡散バリア層の形成に優れた効果を有する。 The tantalum sputtering target of the present invention is excellent in that the crystal orientation on the sputtering surface of the target can be controlled to lower the discharge voltage of the tantalum target, facilitate the generation of plasma, and improve the stability of the plasma. It has the effect. In particular, it has an excellent effect in forming a diffusion barrier layer made of Ta film or TaN film that can effectively prevent contamination around the wiring due to active Cu diffusion.
　本発明のタンタルスパッタリングターゲットは、そのスパッタ面における（２００）面の配向率を高くすること、かつ（２２２）面の配向率を低くすることが特徴である。
タンタルの結晶構造は体心立方格子構造（略称、ＢＣＣ）であるため、（２２２）面の方が（２００）面よりも隣接する原子間距離が短く、（２２２）面の方が（２００）面よりも原子が密に詰まっている状態にある。このため、スパッタリングの際、（２２２）面の方が（２００）面よりもタンタル原子をより多く放出して、スパッタレート（成膜速度）が早くなると考えられる。 The tantalum sputtering target of the present invention is characterized by increasing the orientation ratio of the (200) plane on the sputtering surface and decreasing the orientation ratio of the (222) plane.
Since the crystal structure of tantalum is a body-centered cubic lattice structure (abbreviation, BCC), the (222) plane has a shorter interatomic distance than the (200) plane, and the (222) plane has the (200) plane. Atoms are more densely packed than the surface. For this reason, it is considered that during sputtering, the (222) plane releases more tantalum atoms than the (200) plane, and the sputtering rate (film formation rate) is increased.
　本発明において、タンタルスパッタリングターゲットは、そのスパッタ面における（２００）面の配向率は７０％超え、かつ、（２２２）面の配向率は３０％未満とするものである。好ましくは、（２００）面の配向率は８０％以上、かつ、（２２２）面の配向率は２０％以下とする。
　このようにスパッタ面における（２００）面の配向率を高く、（２２２）面の配向率を低くすることにより、通常の条件ではスパッタレート（成膜速度）が遅くなることが考えられる。しかし、成膜速度を過度に上げる必要が無い場合には、タンタルターゲットの放電電圧を低くすることができるので、プラズマが発生し易くなり、プラズマを安定させることができるというメリットがある。 In the present invention, the tantalum sputtering target has a (200) plane orientation ratio of over 70% and a (222) plane orientation ratio of less than 30%. Preferably, the orientation rate of the (200) plane is 80% or more and the orientation rate of the (222) plane is 20% or less.
Thus, by increasing the orientation ratio of the (200) plane and lowering the orientation ratio of the (222) plane on the sputtering surface, it is conceivable that the sputtering rate (deposition rate) is reduced under normal conditions. However, when it is not necessary to increase the film formation rate excessively, the discharge voltage of the tantalum target can be lowered, so that there is an advantage that plasma is easily generated and the plasma can be stabilized.
通常、スパッタリングによりタンタル膜を成膜するときに、設定した投入電力にて放電を維持できるように電圧および電流が調整される。しかし、何らかの影響により電流が低下し、電力を一定値に維持しようとして電圧が上昇することがあり、一般に、このような状態を放電異常と呼ぶ。
本発明は、タンタルスパッタリングターゲットにおいて、ターゲットのスパッタ面における結晶配向を制御することにより、タンタルターゲットの放電電圧を低くし、プラズマを安定させることができるので、上記のようなスパッタリング時の放電異常の発生を抑制することが可能となる。特に、放電電圧を６２０Ｖ以下且つ、放電電圧バラつきを２０Ｖ以下とすることで、放電異常発生率を低減することが可能となる。 Usually, when a tantalum film is formed by sputtering, the voltage and current are adjusted so that the discharge can be maintained at a set input power. However, the current may decrease due to some influence, and the voltage may increase in an attempt to maintain the power at a constant value. Generally, such a state is called a discharge abnormality.
In the tantalum sputtering target, the discharge voltage of the tantalum target can be lowered and the plasma can be stabilized by controlling the crystal orientation on the sputtering surface of the target. Occurrence can be suppressed. In particular, by setting the discharge voltage to 620 V or less and the discharge voltage variation to 20 V or less, the discharge abnormality occurrence rate can be reduced.
本発明において配向率とは、Ｘ線回折法によって得られる（１１０）、（２００）、（２１１）、（３１０）、（２２２）、（３２１）それぞれの回折ピークの測定強度を標準化し、それぞれの面方位の強度の総和を１００とした時の、特定の面方位の強度比を意味する。なお、標準化にはＪＣＰＤＳ（Ｊｏｉｎｔ　Ｃｏｍｍｉｔｔｅｅ　ｆｏｒ　Ｐｏｗｄｅｒ　Ｄｉｆｆｒａｃｔｉｏｎ　Ｓｔａｎｄａｒｄ）を用いた。
例えば、（２００）面の配向率（％）は、[［(２００)の測定強度／(２００)のＪＣＰＤＳ強度］／Σ（各面の測定強度／各面のＪＣＰＤＳ強度）]×１０
０となる。 In the present invention, the orientation rate is a standardized measurement intensity of each diffraction peak obtained by X-ray diffraction (110), (200), (211), (310), (222), (321), This means the intensity ratio of a specific plane orientation when the sum of the plane orientation intensities is 100. For standardization, JCPDS (Joint Committee for Powder Diffraction Standard) was used.
For example, the orientation ratio (%) of the (200) plane is [[(measured intensity of (200) / JCPDS intensity of (200)] / Σ (measured intensity of each face / JCPDS intensity of each face)] × 10
0.
本発明のタンタルスパッタリングターゲットは、銅配線におけるＴａ膜又はＴａＮ膜などの拡散バリア層を形成するために用いることができる。スパッタ時の雰囲気に窒素を導入してＴａＮ膜を成膜する場合においても、本発明のスパッタリングターゲットは、
ターゲットのスパッタ面における結晶配向を制御することによって、タンタルターゲットの放電電圧を低くし、プラズマを発生し易くすると共に、プラズマの安定性を向上させることができるという優れた効果を有するので、当該Ｔａ膜又はＴａＮ膜などの拡散バリア層を備えた銅配線形成、さらに、その銅配線を備えた半導体デバイス製造において、製品歩留まりを向上することができる。 The tantalum sputtering target of the present invention can be used for forming a diffusion barrier layer such as a Ta film or a TaN film in a copper wiring. Even when nitrogen is introduced into the atmosphere during sputtering to form a TaN film, the sputtering target of the present invention is
By controlling the crystal orientation on the sputter surface of the target, the discharge voltage of the tantalum target can be lowered, the plasma can be easily generated, and the plasma stability can be improved. In the formation of a copper wiring provided with a diffusion barrier layer such as a film or a TaN film, and further in the manufacture of a semiconductor device provided with the copper wiring, the product yield can be improved.
本発明のタンタルスパッタリングターゲットは、次のような工程によって製造する。その例を示すと、まず、タンタル原料として、通常４Ｎ（９９．９９％）以上の高純度タンタルを使用する。これを電子ビーム溶解等により溶解し、これを鋳造してインゴット又はビレットを作製する。次に、このインゴット又はビレットを、鍛造、再結晶焼鈍、を行う。具体的には、例えば、インゴット又はビレット－締め鍛造－１１００～１４００℃の温度での焼鈍－冷間鍛造（一次鍛造）－再結晶温度～１４００℃の温度での焼鈍－冷間鍛造（二次鍛造）－再結晶温度～１４００℃の温度での焼鈍を行う。 The tantalum sputtering target of the present invention is manufactured by the following process. For example, first, high purity tantalum of 4N (99.99%) or more is usually used as a tantalum raw material. This is melted by electron beam melting or the like and cast to produce an ingot or billet. Next, this ingot or billet is forged and recrystallized. Specifically, for example, ingot or billet-clamp forging-1 annealing at a temperature of 100 to 1400 ° C-cold forging (primary forging) -annealing at a recrystallization temperature of 1400 ° C to cold forging (secondary Forging) —Annealing is performed at a recrystallization temperature of 1400 ° C.
次に、冷間圧延を行う。この冷間圧延の条件を調整することで、本発明のタンタルスパッタリングターゲットの配向率を制御することができる。具体的には、圧延ロールはロール径が小さいものがよく、５００ｍｍφ以下のものが好ましい。また、圧延速度はできるだけ速い方がよく、１０ｍ／ｍｉｎ以上が好ましい。さらに、圧延を１回のみ実施する場合は、圧延率は高く８０％超であることが好ましく、圧延を２回以上繰り返す場合は、圧延率は６０％以上とし、ターゲットの最終厚みを圧延１回の場合と同じにする必要がある。圧延率は総計で８０％超とするのが望ましい。 Next, cold rolling is performed. By adjusting the conditions for this cold rolling, the orientation rate of the tantalum sputtering target of the present invention can be controlled. Specifically, the rolling roll preferably has a small roll diameter, and preferably has a diameter of 500 mmφ or less. The rolling speed is preferably as fast as possible, and preferably 10 m / min or more. Furthermore, when the rolling is performed only once, the rolling rate is preferably high and more than 80%. When the rolling is repeated twice or more, the rolling rate is set to 60% or more and the final thickness of the target is set to one rolling. Must be the same as The rolling rate is desirably more than 80% in total.
次に、熱処理を行う。冷間圧延の条件と併せて、冷間圧延後に行う熱処理条件を調整することで、本発明のタンタルスパッタリングターゲットの配向率を制御することができる。具体的には熱処理温度は高い方が良く、好ましくは９００～１４００℃とする。圧延で導入される歪みの量にもよるが、再結晶組織を得るためには９００℃以上の温度で熱処理する必要がある。一方、１４００℃超で熱処理することは、経済的に好ましくない。この後、ターゲットの表面を機械加工、研磨加工等の仕上げ加工によって、最終的な製品に仕上げる。 Next, heat treatment is performed. The orientation rate of the tantalum sputtering target of the present invention can be controlled by adjusting the heat treatment conditions performed after the cold rolling together with the cold rolling conditions. Specifically, the heat treatment temperature should be higher, preferably 900 to 1400 ° C. Although depending on the amount of strain introduced by rolling, it is necessary to perform heat treatment at a temperature of 900 ° C. or higher in order to obtain a recrystallized structure. On the other hand, it is economically unpreferable to heat-process at over 1400 degreeC. Thereafter, the surface of the target is finished into a final product by finishing such as machining and polishing.
上記の製造工程によってタンタルターゲットを製造するが、本発明において特に重要なことは、ターゲットのスパッタ面の結晶配向において、（２００）面の配向率を高くし、かつ、（２２２）面の配向率を低くすることである。
配向の制御に大きくかかわるのは、主として圧延工程である。圧延工程においては、圧延ロールの径、圧延速度、圧延率等のパラメータを制御することにより、圧延時に導入される歪みの量や分布を変えることが可能となり、（２００）面の配向率及び（２２２）面の配向率の制御が可能となる。
面配向率の調整を効果的に行うには、ある程度の繰り返しの条件設定が必要であるが、一旦（２００）面の配向率及び（２２２）面の配向率の調整ができると、その製造条件を設定することにより、恒常的特性の（一定レベルの特性を持つ）ターゲットの製造が可能となる。 A tantalum target is manufactured by the above manufacturing process. Particularly important in the present invention, in the crystal orientation of the sputtering surface of the target, the (200) plane orientation ratio is increased, and the (222) plane orientation ratio is high. Is to lower.
It is mainly the rolling process that is greatly involved in controlling the orientation. In the rolling process, it is possible to change the amount and distribution of strain introduced during rolling by controlling parameters such as the diameter of the rolling roll, the rolling speed, the rolling rate, and the (200) plane orientation rate and ( 222) The orientation ratio of the plane can be controlled.
In order to effectively adjust the plane orientation ratio, it is necessary to set conditions to some extent, but once the (200) plane orientation ratio and (222) plane orientation ratio can be adjusted, the manufacturing conditions By setting this, it becomes possible to manufacture a target having a constant characteristic (having a certain level of characteristic).
通常、ターゲットを製造する場合には、圧延ロール径５００ｍｍ以下の圧延ロールを使用し、圧延速度を１０ｍ／ｍｉｎ以上、１パスの圧延率を８～１２％とすることが有効である。しかし、本発明の結晶配向が達成できる製造工程であれば、必ずしも、この製造工程のみに限定する必要はない。一連の加工において、鍛造・圧延で鋳造組織を破壊するとともに、再結晶化を十分に行うという条件設定が有効である。
さらに、溶解鋳造したタンタルインゴット又はビレットに鍛造し、圧延等の加工を加えた後は、再結晶焼鈍し、組織を微細かつ均一化するのが望ましい。 Usually, when manufacturing a target, it is effective to use a rolling roll having a rolling roll diameter of 500 mm or less, a rolling speed of 10 m / min or more, and a one-pass rolling rate of 8 to 12%. However, as long as the manufacturing process can achieve the crystal orientation of the present invention, it is not necessarily limited to this manufacturing process. In a series of processing, it is effective to set conditions for destroying the cast structure by forging and rolling and sufficiently performing recrystallization.
Furthermore, after forging a melt-cast tantalum ingot or billet and applying a process such as rolling, it is desirable to recrystallize and to make the structure fine and uniform.
　次に、実施例に基づいて本発明を説明する。以下に示す実施例は、理解を容易にするためのものであり、これらの実施例によって本発明を制限するものではない。すなわち、本発明の技術思想に基づく変形及び他の実施例は、当然本発明に含まれる。
　純度９９．９９５％のタンタル原料を電子ビーム溶解し、これを鋳造して直径１９５ｍｍφのインゴットとした。次に、このインゴットを室温で締め鍛造して直径１５０ｍｍφとし、これを１１００～１４００℃の温度で再結晶焼鈍した。再度、これを室温で鍛造して厚さ１００ｍｍ、直径１５０ｍｍφとし（一次鍛造）、これを再結晶温度～１４００℃の温度で再結晶焼鈍した。さらに、これを室温で鍛造して厚さ７０～１００ｍｍ、直径１５０～１８５ｍｍφとし（二次鍛造）、これを再結晶温度～１４００℃の温度で再結晶焼鈍して、ターゲット素材を得た。 Next, the present invention will be described based on examples. The following examples are for ease of understanding, and the present invention is not limited by these examples. That is, modifications and other embodiments based on the technical idea of the present invention are naturally included in the present invention.
A tantalum raw material having a purity of 99.995% was melted by electron beam and cast into an ingot having a diameter of 195 mmφ. Next, this ingot was clamped and forged at room temperature to a diameter of 150 mmφ, and this was recrystallized and annealed at a temperature of 1100 to 1400 ° C. Again, this was forged at room temperature to a thickness of 100 mm and a diameter of 150 mmφ (primary forging), and this was recrystallized and annealed at a recrystallization temperature of ˜1400 ° C. Further, this was forged at room temperature to a thickness of 70 to 100 mm and a diameter of 150 to 185 mmφ (secondary forging), and this was recrystallized and annealed at a recrystallization temperature of 1400 ° C. to obtain a target material.
（実施例１）
　実施例１では、得られたターゲット素材を、圧延ロール径４００ｍｍの圧延ロールを用いて、圧延速度１０ｍ／ｍｉｎ、圧延率８６％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを１０００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。
以上の工程により、（２００）面の配向率が８４．３％、（２２２）面の配向率が９．９％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６１３．５Ｖ、放電電圧バラツキは７．１Ｖであり、放電異常発生率は３．５％と良好であった。この結果を、表１に示す。 (Example 1)
In Example 1, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 400 mm at a rolling speed of 10 m / min and a rolling rate of 86% to obtain a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target.
Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 84.3% and the orientation ratio of the (222) plane was 9.9% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 613.5 V, the discharge voltage variation was 7.1 V, and the discharge abnormality occurrence rate was good at 3.5%. The results are shown in Table 1.
通常、放電異常発生率を計算する場合は、電圧が電源の上限値である１０００Ｖまで達した回数を全放電回数で割り返すことで行うが、本実施例においても、同条件で行った。タンタル膜の成膜は、下記の条件で行った（以下の実施例、比較例も同様とした）。
＜成膜条件＞
　電源：直流方式
　電力：１５ｋＷ
　到達真空度：５×１０-8Ｔｏｒｒ
　雰囲気ガス組成：Ａｒ
　スパッタガス圧：５×１０-3Ｔｏｒｒ
　スパッタ時間：１５秒 Normally, the discharge abnormality occurrence rate is calculated by dividing the number of times that the voltage has reached 1000 V, which is the upper limit value of the power supply, by the total number of discharges. The tantalum film was formed under the following conditions (the same applies to the following examples and comparative examples).
<Film formation conditions>
Power supply: DC method Power: 15kW
Ultimate vacuum: 5 × 10 −8 Torr
Atmospheric gas composition: Ar
Sputtering gas pressure: 5 × 10 −3 Torr
Sputtering time: 15 seconds
（実施例２）
　実施例２では、得られたターゲット素材を、圧延ロール径４００ｍｍの圧延ロールを用いて、圧延速度１５ｍ／ｍｉｎ、圧延率８８％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを９００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。
以上の工程により、（２００）面の配向率が７７．７％、（２２２）面の配向率が１６．２％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６１４．７Ｖ、放電電圧バラツキは１２．３Ｖであり、放電異常発生率は５．８％と良好であった。この結果を、表１に示す。 (Example 2)
In Example 2, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 400 mm at a rolling speed of 15 m / min and a rolling rate of 88% to a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target.
Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 77.7% and the orientation ratio of the (222) plane was 16.2% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 614.7 V, the discharge voltage variation was 12.3 V, and the discharge abnormality occurrence rate was good at 5.8%. The results are shown in Table 1.
（実施例３）
　実施例３では、得られたターゲット素材を、圧延ロール径４００ｍｍの圧延ロールを用いて、圧延速度２０ｍ／ｍｉｎ、圧延率８２％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを１１００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が７４．３％、（２２２）面の配向率が１４．８％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６０３．２Ｖ、放電電圧バラツキは１８．２Ｖであり、放電異常発生率は６．０％と良好であった。この結果を、表１に示す。 (Example 3)
In Example 3, the obtained target material was cold-rolled at a rolling speed of 20 m / min and a rolling rate of 82% using a rolling roll having a rolling roll diameter of 400 mm to a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure with a (200) plane orientation ratio of 74.3% and a (222) plane orientation ratio of 14.8% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 603.2 V, the discharge voltage variation was 18.2 V, and the discharge abnormality occurrence rate was good at 6.0%. The results are shown in Table 1.
（実施例４）
　実施例４では、得られたターゲット素材を、圧延ロール径５００ｍｍの圧延ロールを用いて、圧延速度１５ｍ／ｍｉｎ、圧延率９０％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを８００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が７１．４％、（２２２）面の配向率が２０．７％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６１４．１Ｖ、放電電圧バラツキは１５．３Ｖであり、放電異常発生率は７．０％と良好であった。この結果を、表１に示す。 Example 4
In Example 4, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 500 mm at a rolling speed of 15 m / min and a rolling rate of 90% to a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the (200) plane orientation ratio was 71.4% and the (222) plane orientation ratio was 20.7% could be obtained.
When sputtering was carried out using this sputtering target, the discharge voltage was 614.1 V, the discharge voltage variation was 15.3 V, and the discharge abnormality occurrence rate was good at 7.0%. The results are shown in Table 1.
（実施例５）
　実施例５では、得られたターゲット素材を、圧延ロール径５００ｍｍの圧延ロールを用いて、圧延速度２０ｍ／ｍｉｎ、圧延率８４％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを１４００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が７０．８％、（２２２）面の配向率が１９．７％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６１１．２Ｖ、放電電圧バラツキは１２．２Ｖであり、放電異常発生率は８．１％と良好であった。この結果を、表１に示す。 (Example 5)
In Example 5, the obtained target material was cold-rolled with a rolling roll having a rolling roll diameter of 500 mm at a rolling speed of 20 m / min and a rolling rate of 84% to a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the (200) plane orientation ratio was 70.8% and the (222) plane orientation ratio was 19.7% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 61.2 V, the discharge voltage variation was 12.2 V, and the discharge abnormality occurrence rate was good at 8.1%. The results are shown in Table 1.
（比較例１）
　比較例１では、得られたターゲット素材を、圧延ロール径６５０ｍｍの圧延ロールを用いて、圧延速度１５ｍ／ｍｉｎ、圧延率８０％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを８００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が４３．６％、（２２２）面の配向率が３９．１％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６２２．５Ｖ、放電電圧バラツキは１７．０Ｖであり、放電異常発生率は１６．６％と悪かった。この結果を、表１に示す。 (Comparative Example 1)
In Comparative Example 1, the obtained target material was cold-rolled at a rolling speed of 15 m / min and a rolling rate of 80% using a rolling roll having a rolling roll diameter of 650 mm to a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 43.6% and the orientation ratio of the (222) plane was 39.1% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 622.5 V, the discharge voltage variation was 17.0 V, and the discharge abnormality occurrence rate was poor at 16.6%. The results are shown in Table 1.
（比較例２）
　比較例２では、得られたターゲット素材を、圧延ロール径５００ｍｍの圧延ロールを用いて、圧延速度１０ｍ／ｍｉｎ、圧延率７８％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを８００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が６０．１％、（２２２）面の配向率が２４．０％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６２７．０Ｖ、放電電圧バラツキは１８．０Ｖであり、放電異常発生率は２０．５％と悪かった。この結果を、表１に示す。 (Comparative Example 2)
In Comparative Example 2, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 500 mm at a rolling speed of 10 m / min and a rolling rate of 78% to obtain a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure with a (200) plane orientation ratio of 60.1% and a (222) plane orientation ratio of 24.0% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 627.0 V, the discharge voltage variation was 18.0 V, and the discharge abnormality occurrence rate was poor at 20.5%. The results are shown in Table 1.
（比較例３）
　比較例３では、得られたターゲット素材を、圧延ロール径５００ｍｍの圧延ロールを用いて、圧延速度１５ｍ／ｍｉｎ、圧延率８５％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを８００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が５１．４％、（２２２）面の配向率が３７．３％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６２４．０Ｖ、放電電圧バラツキは２５．１Ｖであり、放電異常発生率は２６．２％と悪かった。この結果を、表１に示す。 (Comparative Example 3)
In Comparative Example 3, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 500 mm at a rolling speed of 15 m / min and a rolling rate of 85% to obtain a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 51.4% and the orientation ratio of the (222) plane was 37.3% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 624.0 V, the discharge voltage variation was 25.1 V, and the discharge abnormality occurrence rate was 26.2%. The results are shown in Table 1.
（比較例４）
　比較例４では、得られたターゲット素材を、圧延ロール径６５０ｍｍの圧延ロールを用いて、圧延速度２０ｍ／ｍｉｎ、圧延率８６％で冷間圧延して厚さ１４ｍｍ、直径５２０ｍｍφとし、これを１０００℃の温度で熱処理した。その後、表面を切削、研磨してターゲットとした。以上の工程により、（２００）面の配向率が６６．２％、（２２２）面の配向率が３１．０％の結晶組織を有するタンタルスパッタリングターゲットを得ることができた。
このスパッタリングターゲットを使用して、スパッタリングを実施したところ、放電電圧は６０３．４Ｖ、放電電圧バラツキは２８．４Ｖであり、放電異常発生率は１８．３％と悪かった。この結果を、表１に示す。 (Comparative Example 4)
In Comparative Example 4, the obtained target material was cold-rolled using a rolling roll having a rolling roll diameter of 650 mm at a rolling speed of 20 m / min and a rolling rate of 86% to obtain a thickness of 14 mm and a diameter of 520 mmφ. Heat treatment was performed at a temperature of ° C. Thereafter, the surface was cut and polished to obtain a target. Through the above steps, a tantalum sputtering target having a crystal structure in which the orientation ratio of the (200) plane was 66.2% and the orientation ratio of the (222) plane was 31.0% could be obtained.
When sputtering was performed using this sputtering target, the discharge voltage was 603.4 V, the discharge voltage variation was 28.4 V, and the discharge abnormality occurrence rate was as bad as 18.3%. The results are shown in Table 1.
以上の実施例及び比較例が示すように、本願発明の条件の範囲にあるものはタンタルターゲットの放電電圧を低くしてプラズマを発生し易くすると共に、プラズマの安定性を向上させる効果を有する。すなわち、比較例に比べて、放電電圧を下げることができ、放電電圧のバラツキを低く抑えることができ、さらに放電異常発生率を低減できるという優れた効果を有する。 As shown in the above Examples and Comparative Examples, those within the range of the conditions of the present invention have the effect of lowering the discharge voltage of the tantalum target to facilitate the generation of plasma and improving the stability of the plasma. That is, compared with the comparative example, the discharge voltage can be lowered, the variation in the discharge voltage can be suppressed, and the discharge abnormality occurrence rate can be further reduced.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
本発明は、タンタルスパッタリングターゲットを提供するものであり、ターゲットのスパッタ面における結晶配向を制御することによって、タンタルターゲットの放電電圧を低くしてプラズマを発生し易くすると共に、プラズマの安定性を向上させる効果を有する。本発明のタンタルスパッタリングターゲットは特に、活発なＣｕの拡散による配線周囲の汚染を効果的に防止することができるＴａ膜又はＴａＮ膜などからなる拡散バリア層の形成に有用である。 The present invention provides a tantalum sputtering target. By controlling the crystal orientation on the sputtering surface of the target, the discharge voltage of the tantalum target is lowered to facilitate the generation of plasma, and the stability of the plasma is improved. Has the effect of The tantalum sputtering target of the present invention is particularly useful for forming a diffusion barrier layer made of a Ta film or a TaN film that can effectively prevent contamination around the wiring due to active Cu diffusion.

Claims (9)

  1. 　タンタルスパッタリングターゲットのスパッタ面において、（２００）面の配向率が７０％を超え、かつ、（２２２）面の配向率が３０％以下であることを特徴とするタンタルスパッタリングターゲット。 A tantalum sputtering target having a (200) plane orientation ratio of more than 70% and a (222) plane orientation ratio of 30% or less on the sputtering surface of the tantalum sputtering target.
  2. タンタルスパッタリングターゲットのスパッタ面において、（２００）面の配向率が８０％以上、かつ、（２２２）面の配向率が２０％以下であることを特徴とする請求項１記載のタンタルスパッタリングターゲット。 2. The tantalum sputtering target according to claim 1, wherein the (200) plane orientation ratio is 80% or more and the (222) plane orientation ratio is 20% or less on the sputtering surface of the tantalum sputtering target.
  3. 　請求項１～２のいずれかに記載のスパッタリングターゲットを用いて形成した拡散バリア層用薄膜。 A thin film for a diffusion barrier layer formed using the sputtering target according to claim 1.
  4. 請求項３記載の拡散バリア層用薄膜を用いられた半導体デバイス。 A semiconductor device using the thin film for a diffusion barrier layer according to claim 3.
  5. 溶解鋳造したタンタルインゴットを鍛造及び再結晶焼鈍した後、圧延及び熱処理し、ターゲットのスパッタ面において、（２００）面の配向率が７０％を超え、かつ、（２２２）面の配向率が３０％以下である結晶組織を形成することを特徴とするタンタルスパッタリングターゲットの製造方法。 The forged and recrystallized annealing of the tantalum ingot that has been melt cast, followed by rolling and heat treatment, the (200) plane orientation ratio exceeds 70% and the (222) plane orientation ratio is 30% on the sputtering surface of the target. The manufacturing method of the tantalum sputtering target characterized by forming the following crystal structures.
  6. 溶解鋳造したタンタルインゴットを鍛造及び再結晶焼鈍した後、圧延及び熱処理し、ターゲットのスパッタ面において、（２００）面の配向率が８０％以上、かつ、（２２２）面の配向率が２０％以下である結晶組織を形成することを特徴とする請求項５記載のタンタルスパッタリングターゲットの製造方法。 After forging and recrystallization annealing of the cast tantalum ingot, rolling and heat treatment are performed, and on the sputtering surface of the target, the orientation ratio of (200) plane is 80% or more and the orientation ratio of (222) plane is 20% or less. The method for producing a tantalum sputtering target according to claim 5, wherein a crystal structure is formed.
  7. 圧延ロール径５００ｍｍ以下の圧延ロールを用いて、圧延速度１０ｍ／分以上、圧延率８０％超で冷間圧延することを特徴とする請求項５～６のいずれかに記載のタンタルスパッタリングターゲットの製造方法。 The production of a tantalum sputtering target according to any one of claims 5 to 6, wherein cold rolling is performed at a rolling speed of 10 m / min or more and a rolling rate of over 80% using a rolling roll having a rolling roll diameter of 500 mm or less. Method.
  8. 温度９００℃～１４００℃で熱処理することを特徴とする請求項５～７のいずれかに記載のタンタルスパッタリングターゲットの製造方法。 The method for producing a tantalum sputtering target according to any one of claims 5 to 7, wherein the heat treatment is performed at a temperature of 900 ° C to 1400 ° C.
  9. 圧延及び熱処理後、切削、研磨により表面仕上げを行うことを特徴とする請求項５～８のいずれかに記載のタンタルスパッタリングターゲットの製造方法。 The method for producing a tantalum sputtering target according to any one of claims 5 to 8, wherein the surface finish is performed by cutting and polishing after rolling and heat treatment.
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