WO2014094640A1 - Rfid电子标签天线、电子标签及其加工方法 - Google Patents

Rfid电子标签天线、电子标签及其加工方法 Download PDF

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Publication number
WO2014094640A1
WO2014094640A1 PCT/CN2013/090012 CN2013090012W WO2014094640A1 WO 2014094640 A1 WO2014094640 A1 WO 2014094640A1 CN 2013090012 W CN2013090012 W CN 2013090012W WO 2014094640 A1 WO2014094640 A1 WO 2014094640A1
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WO
WIPO (PCT)
Prior art keywords
electronic tag
rfid electronic
substrate
spring coils
extends
Prior art date
Application number
PCT/CN2013/090012
Other languages
English (en)
French (fr)
Inventor
袁仲雪
董兰飞
陈海军
佟强
滕学志
李玉峰
邬立春
姚永
任丽艳
Original Assignee
Yuan Zhongxue
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201210556953.7A external-priority patent/CN103887594A/zh
Priority claimed from CN201210557100.5A external-priority patent/CN103886357B/zh
Application filed by Yuan Zhongxue filed Critical Yuan Zhongxue
Priority to AU2013362439A priority Critical patent/AU2013362439A1/en
Priority to KR1020157019450A priority patent/KR20150096771A/ko
Priority to RU2015129649/28U priority patent/RU166712U1/ru
Priority to US14/654,160 priority patent/US9679238B2/en
Publication of WO2014094640A1 publication Critical patent/WO2014094640A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas

Definitions

  • the invention relates to an RFID electronic tag which can be implanted inside or attached to an information carrier and a processing method thereof, and belongs to the field of information electronics and rubber mechanical processing.
  • the RFID electronic tag has a unique identification code that is implanted inside the information carrier (such as a rubber tire) or attached to the surface of the information carrier (such as a cargo container) and integrated into it without affecting the quality of the carrier. Driven by external reading and writing devices, the data can be sent/read and written at any time, and the carrier can be monitored in real time for production, sales, use, claims or information monitoring.
  • the RFID electronic tag mainly realizes the transmission/reception of data through the connection of the antenna and the radio frequency module. Since the information carrier forms a certain degree of deflection and deformation during manufacture or use, especially when applied to a rubber tire, the antenna is directly caused. Separation from electronic devices due to cracking, damage, or aging, thereby improving the robustness of the connection between the antenna and the electronic tag can effectively improve the robustness of the electronic tag.
  • the prior application of the following scheme is disclosed, the application number is ZL200920252556. 4, the name is an RFID tire electronic label, and the application adopts an electronic label of a spring-type antenna structure, and the welded end of the spring antenna is compressed and then soldered to the RF module. Together, the other portions of the spring antenna still spiral in the same direction to the lateral distal ends of the substrate.
  • the antenna when subjected to external force stretching or a high working environment temperature, the antenna may break free from the solder and be separated from the RF module.
  • the reason is that the compressed welding end and the spring ring extending to the lateral distal end form a direct force transmission, without any slowing or damping effect, and it is difficult to effectively resist external force or high temperature factor for the solder and welding end. The destruction of the connection structure.
  • the RFID electronic tag and the processing method thereof according to the present invention are aimed at solving the above problems and assembling
  • the antenna on the substrate is designed as two parts extending in two directions.
  • the external force transmitted from the side of the substrate to the distal end or other force that damages the welded structure is weakened and attenuated at the soldering end of the antenna, thereby improving the soldering end of the antenna.
  • the stress stability and anti-interference performance of the solder structure between the substrates improves the robustness of the RFID electronic tag throughout its life cycle.
  • the RFID electronic tag antenna has a first portion extending in a first direction, and the first portion has a plurality of coils arranged in a spiral shape and continuously arranged.
  • the antenna further includes a second portion continuous with the first portion and spirally extending in the second direction, the second portion having at least one complete coil.
  • the first portion and the second portion of the antenna respectively extend in the first direction and the second direction, that is, the spring coils constituting the two portions are elastically reset, and the direction of being stretched or compressed by the external force is not the same.
  • the soldering end is fixed on the substrate by the soldering process, a fixing structure similar to the rivet structure is formed at the second portion, and the solder paste (usually formed into a solder paste by a soldering process) is filled and filled with the spring of the second portion.
  • Inner ring When the external force is transmitted to the second portion through the first portion, it is only equivalent to the spring ring acting laterally on the second portion, because the central axis of the second partial coil (the same direction as the elastic reset direction) and the extension direction of the first portion Unlike the external force or other destructive force, the antenna welding end is weakened and attenuated, so that the welding reliability of the antenna and the substrate is greatly enhanced.
  • the coils of the second portion are compressed to reduce the pitch between them.
  • the reduction of the pitch can more fully improve the tightness of the connection between the solder paste and the coil.
  • the difference in the pitch between the first part and the second part can also cause the difference between the vibration frequency and the amplitude of the spring, thereby further aggravating the attenuation of the external force at the welding end of the antenna.
  • the pitch between the first partial coils can be made equal, that is, the equidistant coil arrangement is adopted.
  • the pitch between the second partial coils can be made equal.
  • a more preferred embodiment is that the first portion extends in a first direction and the second portion extends in a second direction Vertical to the phase.
  • the present invention also implements the mounting method of the RFID tag antenna described below based on the above-mentioned object of the invention.
  • the second portion has at least one complete coil that is poured into the inner ring of the second portion during soldering. Further refining is that the second portion has at least two complete coils, and the maximum pitch between the second portions of the coils is less than the minimum pitch between the first portions of the coils.
  • the first direction in which the first portion extends may be disposed to be perpendicular to the second direction in which the second portion extends.
  • the antenna has a first portion extending in a first direction, and the first portion has a plurality of coils arranged in a spiral shape and continuously arranged;
  • the assembly of the antenna on the side of the electronic chip is achieved by soldering the second portion to the substrate, the first portion being in an elastic, unrestricted state in a plurality of directions relative to the second portion.
  • the first portion and the second portion of the antenna respectively extend in the first direction and the second direction, that is, the spring coils constituting the two portions are elastically reset, and the direction of being stretched or compressed by the external force is not the same.
  • the first portion After the second portion is fixed to the substrate by the soldering process, the first portion is in a free state in a plurality of directions with respect to the second portion, that is, elastically bent, stretched, and twisted. Therefore, when external forces When passing through the first portion to the second portion, it only corresponds to the spring ring acting laterally on the second portion, since the central axis of the second partial coil (the same direction as the elastic reset direction) is different from the extending direction of the first portion, The external force or other destructive force is weakened and attenuated at the welding end of the antenna, so that the welding reliability of the antenna and the substrate is greatly enhanced.
  • a through hole may be formed on the substrate and the second portion of the solder, and the solder paste of the second portion is soldered through the through hole to form a first rivet structure.
  • the cured solder paste sufficiently connects the second portion to both side surfaces of the substrate, so that the antenna and the substrate as a whole form a stable connection structure.
  • a more optimized supplemental improvement is that, during soldering, solder paste is poured into the inner ring of the second portion to form a second rivet structure. That is, on the side surface of the substrate, the solder paste (usually formed into a solder paste by a solder process) is filled and filled and filled with the second portion, thereby enhancing the soldering and stability of the second portion to the substrate.
  • the coils of the second portion are compressed to reduce the pitch between them.
  • the reduction of the pitch can more fully improve the tightness of the connection between the solder paste and the coil.
  • the difference in the pitch between the first part and the second part can also cause the difference between the vibration frequency and the amplitude of the spring, thereby further aggravating the attenuation of the external force at the welding end of the antenna.
  • the pitches between the first partial coils are equal, and the pitches between the second partial coils are equal, that is, an equidistant coil arrangement is adopted.
  • the equal pitch is designed to improve the clarity of the transmitted and received data signals of the antenna and to simplify the complexity of the machining process.
  • the first direction in which the first portion extends is perpendicular to the second direction in which the second portion extends.
  • a set of antennas are mounted on both sides of the electronic chip, which is different from the prior art in that
  • the first portion that is continuous with the second portion and extends in the first direction is in an elastic, unrestricted state in a plurality of directions with respect to the second portion.
  • a further improvement and refinement is that, when the second portion is welded, the solder paste is poured into the inner ring of the second portion to form a second rivet structure;
  • the second rivet structure is packed in the entirety of the second portion, and the second portion forms a stable connection with one side surface of the substrate.
  • An improved method for improving the stable connection between the second portion and the substrate after soldering is: when soldering the second portion, the solder paste penetrates through the through hole provided on the substrate to form a first rivet structure;
  • the second portion After soldering, the second portion forms a stable connection with both sides of the substrate.
  • the maximum pitch between the second portion of the coils is less than the minimum pitch between the first portions of the coils.
  • the pitches between the first partial coils are equal, and the pitches between the second partial coils are equal.
  • the first direction in which the first portion extends is perpendicular to the second direction in which the second portion extends.
  • the antenna has two parts extending in different directions, so the antenna soldering end connected to the substrate has high stress stability and anti-interference performance, and the robustness of the entire RFID electronic tag is significantly improved.
  • the RFID tag with improved antenna has a relatively stable data communication performance.
  • RFID electronic tags can withstand high stresses and flexural deformation during processing and use.
  • Figure 1 is a front elevational view of an RFID electronic tag
  • Figure 2 is a front elevational view of the antenna
  • Figure 3 is a top plan view of the antenna
  • Figure 4 is a schematic side view of one side of the substrate
  • Figure 5 is a schematic view of the other side surface of the substrate
  • Figure 6 is a bottom view of Figure 1;
  • the RFID electronic tag mainly includes a substrate 4, an electronic chip 7 disposed on the substrate 4, and a set of antennas 10 on both sides of the electronic chip 7. among them,
  • the antenna 10 has a first portion 1 extending in a first direction, and the first portion 1 has a plurality of coils arranged in a spiral shape and continuously arranged, and the pitches of the first portion 1 are similar between the coils;
  • a second portion 2 continuous with the first portion 1 and extending helically in the second direction, the second portion 2 having at least 2 complete coils, the pitch of the second portion 2 being equal between the coils; the second portion 2 spring The pitch between the turns is smaller than the pitch between the coils of the first portion 1 .
  • the first direction in which the first portion 1 extends is perpendicular to the second direction in which the second portion 2 extends.
  • the assembly of the antenna 10 on the side portion of the electronic chip by soldering the second portion 2 to the substrate 4 enables the first portion 1 to be in an elastic, unrestricted state with respect to the second portion 2 in a plurality of directions.
  • solder paste is poured into the inner ring of the second portion 2 to form a second rivet structure 3.
  • a through hole 5 is formed on the substrate 4 at the second portion 2 of the solder, and the solder paste for soldering the second portion 2 penetrates the through hole 5 to form the first rivet structure 6.
  • the second part 2 The maximum pitch between the coils is smaller than the minimum pitch between the first part 1 coils; the first part 1 has the same pitch between the coils, and the second part 2 has the same pitch between the coils.
  • the first direction in which the first portion 1 extends is perpendicular to the second direction in which the second portion 2 extends.
  • the solder paste is poured into the inner ring of the second portion 2 to form a second rivet structure 3; after soldering, the second rivet structure 3 is packed in the second portion 2 as a whole, the second portion 2 and the substrate 4 One side surface formation Stable connection.
  • the solder paste penetrates through the via hole 5 provided on the substrate 4 to form the first rivet structure 6; after soldering, the second portion 2 forms a stable connection with both side surfaces of the substrate 4.
  • the breaking force during the production and use of the tire is mainly distributed along the direction of the force 8 in Fig. 6, that is, along the distal end of the substrate 3 toward both sides.
  • the improved structure of the above antenna and the soldering and mounting method of the antenna and the substrate 3 overcome the direct transmission of the horizontal stress of the antenna, thereby improving the stress level and the flexural deformation resistance of the whole antenna through the second portion 2.

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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

本发明所述的 RFID 电子标签天线、电子标签及其加工方法，将装配于基板上的天线设计成沿2个方向延伸的2个部分，从基板侧向远端传递来的外力或其他破坏焊接结构的力在天线的焊接端得以削弱与衰减，从而提高天线焊接端与基板之间焊接结构的应力稳定与抗干扰性能，进而提高 RFID 电子标签在整个生命周期中的鲁棒性。RFID电子标签包括有基板，电子芯片，一组天线。天线具有沿第一方向延伸的第一部分，第一部分具有数个呈螺旋状、连续排列的弹簧圈；与第一部分连续的、沿第二方向螺旋状延伸的第二部分，通过将第二部分焊接于基板而实现天线在电子芯片侧部的装配，第一部分相对于第二部分处于多个方向上的弹性、无限定状态。

Description

说 明 书
RFID电子标签天线、 电子标签及其加工方法 技术领域
本发明涉及一种可以植入信息载体内部或附于其表面的 RFID电子标签及其加工 方法， 属于信息电子与橡胶机械加工领域。
背景技术
目前将 RFID电子标签作为数据信息载体、反馈终端而应用于物流运输、调配或 在网络环境下的产品全生命周期信息化管理， 已不再仅是一种技术概念。
RFID 电子标签具有唯一的标识码， 将其植入信息载体 （如橡胶轮胎） 内部或附 于其 （如货物集装箱）表面之后， 在不影响载体质量的基础上与其结合成一个整体。 在外界读写设备的驱动下， 随时发送 /读写数据， 能够实时的监控载体在生产、销售、 使用、 理赔或信息化监控全程的管理。
RFID电子标签主要是通过天线和射频模块连接实现数据的发送 /接收，由于信息 载体在制造或使用过程中会形成一定程度的挠曲与形变， 特别当应用于橡胶轮胎时， 会直接地导致天线与电子装置因破裂、 损坏或老化而分离， 因此提高天线和电子标 签连接的牢固程度可有效的提高电子标签的鲁棒性。
如公开以下方案的在先申请， 申请号为 ZL200920252556. 4， 名称为 RFID轮胎电 子标签， 该申请采用了弹簧式天线结构的电子标签， 将弹簧天线的焊接端压缩后再 与射频模块焊接固定到一起， 而弹簧天线的其他部分仍沿相同方向、 螺旋状延伸至 基板的侧向远端。
上述方案的天线结构， 当受到外力拉伸或较高的工作环境温度等因素作用时， 天线可能会挣脱焊锡的束缚而与射频模块分离。 究其原因是被压缩的焊接端与延伸 至侧向远端的弹簧圈之间形成直接的受力传递， 未形成任何的减缓或衰减效应， 难 以有效地对抗外力或高温因素对于焊锡与焊接端之间连接结构的破坏。
有鉴于此， 特提出本专利申请。
发明内容
本发明所述的 RFID电子标签及其加工方法， 其目的在于解决上述问题而将装配 于基板上的天线设计成沿 2个方向延伸的 2个部分， 从基板侧向远端传递来的外力 或其他破坏焊接结构的力在天线的焊接端得以削弱与衰减， 从而提高天线焊接端与 基板之间焊接结构的应力稳定与抗干扰性能， 进而提高 RFID电子标签在整个生命周 期中的鲁棒性。
为实现上述发明目的，所述的 RFID电子标签天线， 具有沿第一方向延伸的第一 部分， 第一部分具有数个呈螺旋状、 连续排列的弹簧圈。
与现有技术的区别之处在于， 天线还包括有与第一部分连续的、 沿第二方向螺 旋状延伸的第二部分， 第二部分具有至少一个完整的弹簧圈。
如上述基本方案， 天线所具有第一部分、 第二部分分别各自地沿第一方向、 第 二方向延伸， 即构成 2个部分的弹簧圈弹性复位、 以及受外力作用而拉伸或压缩的 方向是不相同的。
在焊接端通过焊接工艺而固定于基板上之后， 在第二部分处会形成类似铆钉结 构的固定结构， 焊膏 （通常可采用焊锡工艺而形成为锡膏） 会灌注并充满第二部分 的弹簧内圈。 而当外力通过第一部分传递至第二部分时， 仅相当于从侧向作用于第 二部分的弹簧圈， 由于第二部分弹簧圈的中心轴线 （与弹性复位方向相同） 与第一 部分的延展方向不相同， 外力或其他破坏力在天线焊接端得以削弱和衰减， 从而天 线与基板的焊接可靠性得以大大加强。
为进一步地提高焊接端在焊接时所形成连接结构的稳定性， 可采取的改进方案 是， 所述第二部分具有至少两个完整的弹簧圈， 第二部分弹簧圈之间的最大螺距小 于第一部分弹簧圈之间的最小螺距。
即在焊接前， 第二部分的弹簧圈被压缩而减小其相互间的螺距。 螺距的缩小， 能够更充分地提高在焊膏与弹簧圈之间连接的紧密性。
而且因外力作用时， 第一部分与第二部分之间螺距的不同， 也可导致弹簧振动 频率与振幅的差异， 从而更为加剧外力在天线焊接端的衰减。
为改善天线的数据通讯功能， 可将第一部分弹簧圈之间的螺距设为相等， 即采 取等距的弹簧圈排列结构。
同理， 可将第二部分弹簧圈之间的螺距设为相等。
较为优选的实施方式是， 第一部分延伸的第一方向， 与第二部分延伸的第二方 向相垂直。 应用上述 RFID电子标签天线的改进方案，基于以上提及的发明目的，本发明还 实现了下述 RFID电子标签天线的安装方法。
将 RFID电子标签天线的第二部分焊接固定在基板上，与第二部分连续的第一部 分沿基板侧向呈螺旋状延伸；
第二部分具有至少一个完整的弹簧圈， 焊接时焊膏灌注于第二部分的内圈。 进一步地细化方式是， 所述的第二部分具有至少两个完整的弹簧圈， 第二部分 弹簧圈之间的最大螺距小于第一部分弹簧圈之间的最小螺距。
另外， 在基板表面， 可将第一部分延伸的第一方向， 设置成与第二部分延伸的 第二方向相垂直。 应用上述电子标签天线及其安装方法，本方法还实现了下述 RFID电子标签， 主 要包括有：
基板，
设置于基板上的电子芯片，
以及， 装配于电子芯片两侧的一组天线。
与现有技术的区别之处在于， 所述的天线具有沿第一方向延伸的第一部分， 第 一部分具有数个呈螺旋状、 连续排列的弹簧圈；
与第一部分连续的、 沿第二方向螺旋状延伸的第二部分， 第二部分具有至少一 个完整的弹簧圈；
通过将第二部分焊接于基板而实现天线在电子芯片侧部的装配， 第一部分相对 于第二部分处于多个方向上的弹性、 无限定状态。
如上述基本方案， 天线所具有第一部分、 第二部分分别各自地沿第一方向、 第 二方向延伸， 即构成 2个部分的弹簧圈弹性复位、 以及受外力作用而拉伸或压缩的 方向是不相同的。
在第二部分处通过焊接工艺而将在天线固定于基板上之后， 第一部分相对于第 二部分处于多个方向上的自由状态， 即可弹性地弯曲、 伸缩与扭转。 因此， 当外力 通过第一部分传递至第二部分时， 仅相当于从侧向作用于第二部分的弹簧圈， 由于 第二部分弹簧圈的中心轴线 （与弹性复位方向相同）与第一部分的延展方向不相同， 外力或其他破坏力在天线焊接端得以削弱和衰减， 从而天线与基板的焊接可靠性得 以大大加强。
为进一步地提高第二部分在焊接时所形成连接结构的稳定性， 可在基板上、 焊 接第二部分处设置有通孔， 焊接第二部分的焊膏贯穿通孔而形成第一铆钉结构。
焊接后， 固化后的焊膏将第二部分充分地连接于与基板的两侧表面， 从而天线 与基板整体上形成稳定的连接结构。
更为优化的补充改进措施是， 焊接时， 焊膏灌注于第二部分的内圈而形成第二 铆钉结构。 即在基板一侧表面， 焊膏 （通常可采用焊锡工艺而形成为锡膏） 灌注并 充满、 填塞第二部分， 从而增强第二部分与基板的焊接紧密与稳固程度。
为提高灌注时焊膏与第二部分弹簧圈的连接稳定性， 可采取的改进方案是， 第 二部分弹簧圈之间的最大螺距小于第一部分弹簧圈之间的最小螺距。
即在焊接前， 第二部分的弹簧圈被压缩而减小其相互间的螺距。 螺距的缩小， 能够更充分地提高在焊膏与弹簧圈之间连接的紧密性。
而且因外力作用时， 第一部分与第二部分之间螺距的不同， 也可导致弹簧振动 频率与振幅的差异， 从而更为加剧外力在天线焊接端的衰减。
另外， 所述第一部分弹簧圈之间的螺距相等， 第二部分弹簧圈之间的螺距相等， 即采取等距的弹簧圈排列结构。 相等螺距的设计是为了提高天线发送与接收数据信 号的清晰度、 以及简化加工工艺复杂程度。
较为优选的实施方式是， 所述第一部分延伸的第一方向， 与第二部分延伸的第 二方向相垂直。 应用上述 RFID电子标签的改进方案，基于以上提及的发明目的，本发明还实现 了下述 RFID电子标签的加工方法。
在基板上安装电子芯片，
在电子芯片两侧装配一组天线， 与现有技术的区别之处在于，
将沿第二方向螺旋状延伸的、 具有至少一个完整弹簧圈的第二部分焊接于电子 芯片侧部；
与第二部分连续的、 沿第一方向延伸的第一部分， 相对于第二部分处于多个方 向上的弹性、 无限定状态。
进一步的改进与细化方案是， 焊接第二部分时， 焊膏被向第二部分的内圈灌注 而形成第二铆钉结构；
焊接后， 第二铆钉结构填塞于第二部分整体， 第二部分与基板一侧表面形成稳 定连接。
更能提高焊接后第二部分与基板之间稳固连接的改进方法是， 焊接第二部分时， 焊膏贯穿设置于基板上的通孔而形成第一铆钉结构；
焊接后， 第二部分与基板的两侧表面均形成稳定连接。
另外， 第二部分弹簧圈之间的最大螺距小于第一部分弹簧圈之间的最小螺距。 并且， 第一部分弹簧圈之间的螺距相等， 第二部分弹簧圈之间的螺距相等。 所述第一部分延伸的第一方向， 与第二部分延伸的第二方向相垂直。 综上所述， 本发明 RFID电子标签天线、 电子标签及其加工方法具有以下优点：
1、 天线具有沿不同方向延伸的 2个部分， 因此与基板连接的天线焊接端具有较高的 应力稳定与抗干扰性能， 整个 RFID电子标签的鲁棒性得以显著地提高。
2、 应用改进后天线的 RFID电子标签具较为稳定的数据通讯性能。
3、 RFID电子标签能够承受较高的加工、 使用过程中的应力及曲挠形变。
附图说明
现结合以下附图对本发明做进一步的说明。
图 1是 RFID电子标签的主视示意图；
图 2是所述天线的主视示意图；
图 3是所述天线的俯视示意图；
图 4是所述基板的一侧表面示意图；
图 5是所述基板的另一侧表面示意图；
图 6是图 1的仰视示意图；
如图 1至图 6所示， 第一部分 1， 第二部分 2， 第二铆钉结构 3， 基板 4， 通孔 5， 第一铆钉结构 6， 电子芯片 7， 受力方向 8， 天线 10。
具体实施方式
实施例 1， 如图 1至图 6所示， 所述的 RFID电子标签主要包括有， 基板 4、 设 置于基板 4上的电子芯片 7、 以及电子芯片 7两侧的一组天线 10。 其中，
天线 10， 具有沿第一方向延伸的第一部分 1， 第一部分 1具有数个呈螺旋状、 连续排列的弹簧圈， 第一部分 1弹簧圈之间的螺距相等；
与第一部分 1连续的、沿第二方向螺旋状延伸的第二部分 2，第二部分 2具有至 少 2个完整的弹簧圈， 第二部分 2弹簧圈之间的螺距相等； 第二部分 2弹簧圈之间 的螺距小于第一部分 1弹簧圈之间的螺距。
所述第一部分 1延伸的第一方向， 与第二部分 2延伸的第二方向相垂直。 通过将第二部分 2焊接于基板 4而实现天线 10在电子芯片 Ί侧部的装配， 第一 部分 1相对于第二部分 2处于多个方向上的弹性、 无限定状态。
焊接时， 焊膏灌注于第二部分 2的内圈而形成第二铆钉结构 3。
在基板 4上、焊接第二部分 2处设置有通孔 5，焊接第二部分 2的焊膏贯穿通孔 5而形成第一铆钉结构 6。 基于上述 RFID电子标签的结构改进， 同时可实现下述 RFID电子标签的加工方 法：
在基板 4上安装电子芯片 7， 在电子芯片 Ί两侧装配一组天线 10;
将沿第二方向螺旋状延伸的、 具有至少一个完整弹簧圈的第二部分 2焊接于电 子芯片 7侧部；
与第二部分 2连续的、沿第一方向延伸的第一部分 1，相对于第二部分 2处于多 个方向上的弹性、 无限定状态；
第二部分 2弹簧圈之间的最大螺距小于第一部分 1弹簧圈之间的最小螺距； 第 一部分 1弹簧圈之间的螺距相等， 第二部分 2弹簧圈之间的螺距相等。
所述第一部分 1延伸的第一方向， 与第二部分 2延伸的第二方向相垂直。 焊接第二部分 2时， 焊膏被向第二部分 2的内圈灌注而形成第二铆钉结构 3; 焊 接后， 第二铆钉结构 3填塞于第二部分 2整体， 第二部分 2与基板 4一侧表面形成 稳定连接。
焊接第二部分 2时， 焊膏贯穿设置于基板 4上的通孔 5而形成第一铆钉结构 6; 焊接后， 第二部分 2与基板 4的两侧表面均形成稳定连接。
将上述 RFID电子标签植入橡胶轮胎内部以后， 在轮胎生产及使用过程中的破坏 拉力主要沿图 6中的受力方向 8分布， 即沿基板 3向两侧的远端扩展。 而采用上述 天线改进结构、 以及天线与基板 3 的焊接安装方法， 克服了天线水平应力的直接传 递， 从而通过第二部分 2提高了天线整体的应力水平及抗曲挠形变性能。

Claims

权 利 要 求 书
1、 一种 RFID电子标签天线， 具有沿第一方向延伸的第一部分 （1 )， 第一部分
( 1 ) 具有数个呈螺旋状、 连续排列的弹簧圈， 其特征在于：
所述的 RFID电子标签天线， 还包括有与第一部分 （1 ) 连续的、 沿第二方向螺 旋状延伸的第二部分 （2)， 第二部分 （2) 具有至少一个完整的弹簧圈。
2、 根据权利要求 1所述的 RFID电子标签天线， 其特征在于： 所述的第二部分
(2) 具有至少两个完整的弹簧圈， 第二部分 （2) 弹簧圈之间的最大螺距小于第一 部分 （1 ) 弹簧圈之间的最小螺距。
3、根据权利要求 2所述的 RFID电子标签天线，其特征在于：所述第一部分（1 ) 弹簧圈之间的螺距相等。
4、根据权利要求 2所述的 RFID电子标签天线，其特征在于：所述第二部分（2) 弹簧圈之间的螺距相等。
5、 根据权利要求 1、 2、 3或 4所述的 RFID电子标签天线， 其特征在于： 所述 第一部分 （1 ) 延伸的第一方向， 与第二部分 （2) 延伸的第二方向相垂直。
6、 一种 RFID电子标签， 包括有基板（4)、 设置于基板（4)上的电子芯片（7)、 以及电子芯片 （7) 两侧的一组天线 （10)， 其特征在于：
所述的天线 （10) 具有， 沿第一方向延伸的第一部分 （1 )， 第一部分 （1 ) 具有 数个呈螺旋状、 连续排列的弹簧圈；
与第一部分（1 )连续的、沿第二方向螺旋状延伸的第二部分（2)， 第二部分（2) 具有至少一个完整的弹簧圈；
通过将第二部分 （2) 焊接于基板 （4) 而实现天线 （10) 在电子芯片 （7) 侧部 的装配， 第一部分 （1 ) 相对于第二部分 （2) 处于多个方向上的弹性、 无限定状态。
7、 根据权利要求 6所述的 RFID电子标签， 其特征在于： 在基板（4)上、 焊接 第二部分 （2) 处设置有通孔 （5)， 焊接第二部分 （2) 的焊膏贯穿通孔 （5) 而形成 第一铆钉结构 （6)。
8、 根据权利要求 6或 7所述的 RFID电子标签， 其特征在于： 焊接时， 焊膏灌 注于第二部分 （2) 的内圈而形成第二铆钉结构 （3)。
9、 根据权利要求 8所述的 RFID电子标签， 其特征在于： 第二部分（2)弹簧圈 之间的最大螺距小于第一部分 （1 ) 弹簧圈之间的最小螺距。
10、 根据权利要求 9所述的 RFID电子标签， 其特征在于： 所述第一部分 （1 ) 弹簧圈之间的螺距相等， 第二部分 （2) 弹簧圈之间的螺距相等。
11、 根据权利要求 10所述的 RFID电子标签， 其特征在于： 所述第一部分 （1 ) 延伸的第一方向， 与第二部分 （2) 延伸的第二方向相垂直。
12、 如权利要求 6至 11任一权项所述 RFID电子标签的加工方法， 在基板 （4) 上安装电子芯片 （7)， 在电子芯片 （7) 两侧装配一组天线 （10)， 其特征在于： 将沿第二方向螺旋状延伸的、 具有至少一个完整弹簧圈的第二部分 （2)焊接于 电子芯片 （7) 侧部；
与第二部分（2)连续的、沿第一方向延伸的第一部分（1 )， 相对于第二部分（2) 处于多个方向上的弹性、 无限定状态。
13、 根据权利要求 12所述的 RFID电子标签加工方法， 其特征在于： 焊接第二 部分 （2) 时， 焊膏被向第二部分 （2) 的内圈灌注而形成第二铆钉结构 （3);
焊接后， 第二铆钉结构 （3) 填塞于第二部分 （2) 整体， 第二部分 （2) 与基板 (4) 一侧表面形成稳定连接。
14、根据权利要求 12或 13所述的 RFID电子标签加工方法， 其特征在于： 焊接 第二部分（2)时，焊膏贯穿设置于基板（4)上的通孔（5)而形成第一铆钉结构（6); 焊接后， 第二部分 （2) 与基板 （4) 的两侧表面均形成稳定连接。
15、 根据权利要求 14所述的 RFID电子标签加工方法， 其特征在于： 第二部分 (2) 弹簧圈之间的最大螺距小于第一部分 （1 ) 弹簧圈之间的最小螺距；
第一部分 （1 ) 弹簧圈之间的螺距相等， 第二部分 （2) 弹簧圈之间的螺距相等。
16、 根据权利要求 15所述的 RFID电子标签加工方法， 其特征在于： 所述第一 部分 （1 ) 延伸的第一方向， 与第二部分 （2) 延伸的第二方向相垂直。
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CN201532644U (zh) * 2009-11-09 2010-07-21 青岛高校软控股份有限公司 Rfid轮胎电子标签
CN102054194A (zh) * 2009-11-09 2011-05-11 软控股份有限公司 Rfid轮胎电子标签及其制造方法
CN203025753U (zh) * 2012-12-20 2013-06-26 软控股份有限公司 Rfid电子标签
CN203166068U (zh) * 2012-12-20 2013-08-28 软控股份有限公司 Rfid电子标签天线

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RU166712U1 (ru) 2016-12-10
AU2013101730A4 (en) 2015-08-27
AU2013101730B4 (en) 2016-05-19
KR20150096771A (ko) 2015-08-25
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