WO2014094347A1 - 一种led灯泡 - Google Patents

一种led灯泡 Download PDF

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Publication number
WO2014094347A1
WO2014094347A1 PCT/CN2013/001202 CN2013001202W WO2014094347A1 WO 2014094347 A1 WO2014094347 A1 WO 2014094347A1 CN 2013001202 W CN2013001202 W CN 2013001202W WO 2014094347 A1 WO2014094347 A1 WO 2014094347A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
ceramic substrate
led light
light bulb
connecting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2013/001202
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English (en)
French (fr)
Inventor
王耀海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Opple Lighting Co Ltd
Original Assignee
Opple Lighting Co Ltd
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Filing date
Publication date
Application filed by Opple Lighting Co Ltd filed Critical Opple Lighting Co Ltd
Publication of WO2014094347A1 publication Critical patent/WO2014094347A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting device, and more particularly to an LED lighting device. Background technique
  • LED bulbs are increasingly being applied to lighting devices such as lamps.
  • Conventional LED bulbs use an aluminum substrate as a substrate to mount an LED light source, and as technology advances, ceramic substrates are increasingly used as substrates for LED light sources due to their excellent thermal conductivity and reliable electrical insulation.
  • an alumina ceramic LED bulb is disclosed in Chinese Patent Application Publication No. CN10277776A.
  • the alumina ceramic LED bulb includes an alumina ceramic substrate, a heat sink, and a lamp cover.
  • Some heat sinks are made of metal, so that the shortest distance between the two conductor parts (the portion of the conductive portion of the surface of the ceramic substrate to the portion where the heat sink is connected to the surface of the ceramic substrate) measured along the insulating surface of the ceramic substrate (ie, the creepage distance) ) Sufficient, so as not to cause the insulation material to exhibit electrification and leakage.
  • the alumina ceramic substrate is in close contact with the heat sink and is in thermal contact with the heat sink, so that the creepage distance between the alumina layer and the heat sink is too short to reach the required standard. If a sufficient creepage distance is required, it is necessary to increase the thickness of the ceramic substrate to cause an increase in cost and an increase in the weight of the bulb.
  • An LED bulb includes a heat sink, a ceramic substrate in contact with the heat sink, and an LED light source fixed on the ceramic substrate, the heat sink having a stud, a stud and a ceramic substrate
  • the connection forms a connection surface
  • the ceramic substrate has a connection surface connected to the protrusion, and the connection surface area of the protrusion is smaller than the connection surface area of the ceramic substrate.
  • Figure 1 is an exploded perspective view of a first preferred embodiment of an LED bulb of the present invention.
  • Figure 2 is an exploded perspective view of another angle from Figure 1.
  • Fig. 3 is a perspective view showing a ceramic substrate and an LED light source of a first preferred embodiment of the LED bulb of the present invention.
  • FIG. 4 is a schematic view of a second preferred embodiment of the LED light bulb of the present invention. detailed description
  • the LED bulb 100 includes a heat sink 104, a ceramic substrate 103 in contact with the heat sink 104, and a ceramic substrate 103.
  • LED light source 105 LED light source
  • the heat sink 104 has a stud 1041, and the stud 1041 is connected to the ceramic substrate 103 to form a first connecting surface 10410.
  • the ceramic substrate 103 has a second connecting surface 1030 connected to the stud 1041.
  • the first connecting surface 10410 of the stud 1041 has an area smaller than the second connecting surface 1030 of the ceramic substrate 103.
  • the heat sink 104 further includes a body portion 1042 coupled to the stud 1041.
  • the body portion 1042 of the heat sink 104 and the stud 1041 form a stepped heat sink 104 internal structure.
  • the ceramic substrate 103 includes a flat plate portion 1031 and an extending portion 1032 extending from the edge of the flat plate portion 1031.
  • the extension portion 1032 forms an angle with the flat plate portion 1031 and is located outside the boss 1041 of the heat sink 104 without being in contact with the stud 1041.
  • the extending portion 1032 is perpendicular to the flat plate portion 1031 of the ceramic substrate 103.
  • the extension 1032 can also be disposed obliquely relative to the flat portion 1031.
  • the first connecting surface 10410 has a recess 10411.
  • the second connecting surface 1030 has a boss 1031 extending toward the first connecting surface 10410.
  • the boss 10311 corresponds to the recess 10411.
  • the boss 10311 Located in the recess 1041 1.
  • the arrangement of the boss 10311 and the recess 10411 can function to increase the creepage distance and achieve a certain positioning.
  • the heat sink 104 is made of a metal material, and a conductor (not shown) is attached to the ceramic substrate 103.
  • the shortest path between the conductor on the ceramic substrate 103 and the heat sink 104 is L-shaped.
  • the area of the first connection surface 10410 connecting the heat sink 104 and the ceramic substrate 103 is made small, so that the creepage distance between the conductor on the ceramic substrate 103 and the heat sink 104 is increased, thereby achieving the LED with a minimum space. A sufficient creepage distance required for the bulb.
  • the ceramic substrate 103 is fixed to the heat sink 104 by screws 101, and the spacers 102 are provided between the screws 101 and the heat sink 104. In other embodiments, the ceramic substrate 103 may be otherwise fixed.
  • the LED bulb 200 includes a heat sink 204, a ceramic substrate 203 in contact with the heat sink 204, and an LED light source 205 mounted on the ceramic substrate 203.
  • the ceramic substrate 203 in this embodiment has a flat plate shape without including an extending portion.
  • the shortest path between the conductor (not shown) of the ceramic substrate 203 and the heat sink 204 is U-shaped.
  • the shape of the heat sink 204 is the same as that of the first embodiment, so that the connection surface 20410 of the heat sink 204 and the ceramic substrate 203 is made small, so that the conductor on the ceramic substrate 203 and the heat sink 204 are The creepage distance is increased to achieve a sufficient creepage distance required for the LED bulb 200 with a minimum of space.
  • the bulb 200 also includes a lamp cover 206 that is assembled with the heat sink 204 such that the outer surface 2061 of the lamp cover 206 and the outer wall 2042 of the heat sink 204 form the outer surface of the bulb 200.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

公开了一种LED灯泡（100），包括散热器（104）、与散热器（104）接触的陶瓷基板（103）、以及固定于陶瓷基板（103）上的LED光源（105），散热器（104）具有凸柱（1041），凸柱（1041）具有与陶瓷基板（103）连接形成的第一连接面（10410），陶瓷基板（103）具有与凸柱（1041）连接形成的第二连接面（1030），第一连接面（10410）面积小于第二连接面（1030）面积。

Description

一种 LED灯泡
技术领域
本发明是涉及一种照明装置， 尤其指一种 LED照明装置。 背景技术
随着 LED技术的发展， LED灯泡越来越多的应用到灯具等照明装置中。 传统的 LED灯泡用铝基板作为基材来安装 LED光源， 而随着技术的进步， 陶瓷基板由于其优良的热传导性和可靠的电绝缘性被越来越多的应用于作 为 LED光源的基板。现有技术中， 中国专利申请公开第 CN10277776A号揭 示了一种氧化铝陶瓷 LED灯泡。 该氧化铝陶瓷 LED灯泡包括氧化铝陶瓷基 板、 散热器以及灯罩。 有些散热器为金属材质， 这样沿陶瓷基板的绝缘表面 测得的两个导体零件（陶瓷基板表面的导电部分边沿到散热器与陶瓷基板表 面连接的部分）之间的最短距离 （即爬电距离）足够， 这样才不至于导致绝 缘材料呈现带电现象而发生漏电。然而其氧化铝陶瓷基板紧贴散热器而与散 热器热接触， 使得氧化铝层与散热器之间的爬电距离太短而达不到需要的标 准。如果需要足够的爬电距离，则需要增加陶瓷基板的厚度而造成成本升高、 且球泡灯重量增加。
因此， 为了克服上述缺陷， 有必要提供一种改进的 LED灯泡。 发明内容
本发明的目的在于提供一种具有足够爬电距离的 LED灯泡。
为了实现上述目的， 本发明采用如下技术方案： 一种 LED灯泡， 包括 散热器、 与散热器接触的陶瓷基板、 以及固定于陶瓷基板上的 LED光源， 散热器具有凸柱， 凸柱与陶瓷基板连接形成一连接面， 陶瓷基板具有一连接 面与凸柱连接， 凸柱的连接面面积小于陶瓷基板的连接面面积。 相较于现有技术， 本发明 LED灯泡具有以下优点： 利用有限的空间提 供灯泡足够的爬电距离。 附图说明
图 1为本发明 LED灯泡的第一较佳实施例的立体分解图。
图 2为与图 1另一角度的立体分解图。
图 3为本发明 LED灯泡的第一较佳实施例的陶瓷基板和 LED光源的立 体图。
图 4为本发明 LED灯泡的第二较佳实施例的示意图。 具体实施方式
参照图 1至图 3所示，图示为本发明第一较佳实施例，本实施例中， LED 灯泡 100包括散热器 104、 与散热器 104接触的陶瓷基板 103、 安装于陶瓷 基板 103的 LED光源 105。
散热器 104具有凸柱 1041， 凸柱 1041与陶瓷基板 103连接形成第一连 接面 10410。陶瓷基板 103具有第二连接面 1030与凸柱 1041连接，凸柱 1041 的第一连接面 10410面积小于陶瓷基板 103的第二连接面 1030面积。 散热 器 104还包括与凸柱 1041连接的主体部 1042， 散热器 104的主体部 1042 与凸柱 1041形成阶梯形的散热器 104内部结构。
陶瓷基板 103包括平板部 1031 以及自平板部 1031 边缘延伸的延伸部 1032。延伸部 1032与平板部 1031形成一定的角度且位于散热器 104的凸柱 1041的外部而不与凸柱 1041接触。本实施例中延伸部 1032垂直于陶瓷基板 103的平板部 1031。 其他实施例中， 延伸部 1032也可以相对平板部 1031倾 斜设置。
第一连接面 10410具有凹口 10411，所述第二连接面 1030具有向第一连 接面 10410方向延伸的凸台 1031，凸台 10311与凹口 10411对应，凸台 10311 位于凹口 1041 1内。 凸台 10311与凹口 10411的设置可起到增加爬电距离及 起到一定的定位的作用。
散热器 104为金属材料制成， 陶瓷基板 103上附有导体 （未图示）， 陶 瓷基板 103上的导体与散热器 104之间的最短路径为 L形。
该实施例中将散热器 104与陶瓷基板 103连接的第一连接面 10410面积 做小， 使得陶瓷基板 103上的导体与散热器 104之间的爬电距离增大， 从而 利用最小的空间达到 LED灯泡所需的足够的爬电距离。
本实施例中，陶瓷基板 103通过螺钉 101固定于散热器 104上，螺钉 101 与散热器 104之间具有垫片 102。 其他实施例中， 陶瓷基板 103也可以通过 其他方式固定。
参照图 4所示， 图示为本发明第二较佳实施例， 本实施例中， LED灯泡 200包括散热器 204、 与散热器 204接触的陶瓷基板 203、 安装于陶瓷基板 203的 LED光源 205。 与第一实施例不同的是， 本实施例中陶瓷基板 203为 平板形而不包括延伸部。 本实施例中， 陶瓷基板 203的导体 （未图示） 与散 热器 204之间的最短路径为 U形。该实施例中将散热器 204的形状与第一实 施例的相同， 因此该散热器 204与陶瓷基板 203连接的连接面 20410面积做 小， 使得陶瓷基板 203上的导体与散热器 204之间的爬电距离增大， 从而利 用最小的空间达到 LED灯泡 200所需的足够的爬电距离。
灯泡 200还包括灯罩 206，灯罩 206与散热器 204相组装，使得灯罩 206 外表面 2061和散热器 204的外壁 2042形成灯泡 200的外表面。

Claims

权利要求
1. 一种 LED灯泡， 包括散热器、 与散热器接触的陶瓷基板、 以及固 定于陶瓷基板上的 LED光源， 其特征在于： 所述散热器具有凸柱， 所述凸 柱具有与陶瓷基板连接形成的第一连接面， 所述陶瓷基板具有与所述凸柱 连接形成的第二连接面， 所述第一连接面面积小于所述第二连接面面积。
2. 如权利要求 1所述的 LED灯泡， 其特征在于: 所述散热器还包括 与所述凸柱连接的主体部， 所述散热器的主体部与凸柱形成阶梯形的散热 器内部结构。
3. 如权利要求 1所述的 LED灯泡， 其特征在于： 所述陶瓷基板包括 平板部以及自所述平板部边缘延伸的延伸部， 所述延伸部与所述平板部形 成一定的角度且位于所述散热器的凸柱的外部。
4. 如权利要求 3所述的 LED灯泡， 其特征在于： 所述延伸部垂直于 所述陶瓷基板的平板部。
5. 如权利要求 4所述的 LED灯泡， 其特征在于： 所述散热器为金属 材料制成， 所述陶瓷基板上附有导体， 所述陶瓷基板上的导体与散热器之 间的最短路径为 L形。
6. 如权利要求 1所述的 LED灯泡， 其特征在于： 所述散热器为金属 材料制成， 所述陶瓷基板上附有导体， 所述陶瓷基板上的导体与散热器之 间的最短路径为 U形。
7. 如权利要求 1所述的 LED灯泡， 其特征在于： 所述第一连接面具 有凹口， 所述第二连接面具有向所述第一连接面方向延伸的凸台， 所述凸 台与所述凹口对应， 所述凸台位于所述凹口内。
PCT/CN2013/001202 2012-12-17 2013-10-08 一种led灯泡 Ceased WO2014094347A1 (zh)

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CN201210547159.6A CN103867934A (zh) 2012-12-17 2012-12-17 一种led灯泡
CN201210547159.6 2012-12-17

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CN110566830A (zh) * 2019-10-14 2019-12-13 江苏优为视界科技有限公司 一种满足安全爬电间距的灯具

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CN202302865U (zh) * 2011-10-19 2012-07-04 苏州益而益光电有限公司 Led球泡灯
CN202302875U (zh) * 2011-10-21 2012-07-04 李冬 一种led灯管
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CN103075666A (zh) * 2013-01-10 2013-05-01 海德信（漳州）电光源有限公司 大角度发光led灯
CN202972686U (zh) * 2012-12-17 2013-06-05 欧普照明股份有限公司 一种led灯泡

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CN102109116B (zh) * 2010-12-27 2016-06-22 秦彪 Led光模组和led芯片
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Publication number Priority date Publication date Assignee Title
CN202302865U (zh) * 2011-10-19 2012-07-04 苏州益而益光电有限公司 Led球泡灯
CN202302875U (zh) * 2011-10-21 2012-07-04 李冬 一种led灯管
CN202580726U (zh) * 2012-03-23 2012-12-05 苏州东魁照明有限公司 一种具安全可靠性的一体管
CN202972686U (zh) * 2012-12-17 2013-06-05 欧普照明股份有限公司 一种led灯泡
CN103075666A (zh) * 2013-01-10 2013-05-01 海德信（漳州）电光源有限公司 大角度发光led灯

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