KR100959910B1 - Led 기판 모듈 - Google Patents
Led 기판 모듈 Download PDFInfo
- Publication number
- KR100959910B1 KR100959910B1 KR1020090108349A KR20090108349A KR100959910B1 KR 100959910 B1 KR100959910 B1 KR 100959910B1 KR 1020090108349 A KR1020090108349 A KR 1020090108349A KR 20090108349 A KR20090108349 A KR 20090108349A KR 100959910 B1 KR100959910 B1 KR 100959910B1
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- South Korea
- Prior art keywords
- substrate
- led
- diffusion lens
- circuit wiring
- coupling
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 238000009792 diffusion process Methods 0.000 claims abstract description 41
- 238000003780 insertion Methods 0.000 claims abstract description 9
- 230000037431 insertion Effects 0.000 claims abstract description 9
- 238000010168 coupling process Methods 0.000 claims description 34
- 230000008878 coupling Effects 0.000 claims description 33
- 238000005859 coupling reaction Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 3
- 238000005286 illumination Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract 3
- 239000010408 film Substances 0.000 description 11
- 238000009826 distribution Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
- 삭제
- 삭제
- 삭제
- 삭제
- 금속 소재의 방열판, 상기 방열판의 상면에 도포된 제1절연막, 상기 제1절연막의 상면에 패터닝된 회로배선을 포함하는 기판;상기 회로배선에 각각 전기적으로 연결되도록 상기 기판에 실장된 적어도 하나의 LED 소자; 및상기 LED 소자 각각에서 방출되는 광을 외부로 확산시키기 위하여 상기 기판에 결합된 적어도 하나의 확산렌즈를 포함하되,상기 확산렌즈의 바닥면은 기판에 대향하는 둥근 장방형 평면이고, 상기 바닥면의 중앙에는 LED 소자 각각의 발광부가 삽입되는 반원 형상의 삽입홈이 단측 길이방향으로 형성되며,상기 바닥면의 장측 양단에는 각각 바닥면의 수직방향으로 연장된 레그부와, 상기 레그부의 단부에서 바닥면의 외측 방향으로 상기 기판에 대향되도록 절곡되어 연장된 평면부가 더 형성되고,상기 바닥면의 중앙에는 상기 LED 소자의 본체 프레임 양측 테두리가 끼움 결합되는 가이드부가 상기 삽입홈의 양측에서 바닥면의 수직방향으로 연장되어 형성되되,상기 가이드부의 연장길이는 레그부의 연장길이보다 짧고,상기 평면부 각각에 형성된 결합돌기;와상기 LED 소자의 양측 테두리가 가이드부에 끼움 결합될 경우 상기 결합돌기에 대응되도록 상기 기판에 형성된 결합홈을 더 구비하되,상기 확산렌즈는 상기 결합돌기와 결합홈의 결합에 의하여 상기 기판에 결합되는 것을 특징으로 하는 LED 기판 모듈.
- 제5항에 있어서,상기 기판은 회로배선의 상면에 형성된 제2절연막을 더 구비하되,상기 제2절연막은 상기 LED 소자와 회로배선의 접합부를 제외한 부분에 대해서 형성된 것을 특징으로 하는 LED 기판 모듈.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090108349A KR100959910B1 (ko) | 2009-11-11 | 2009-11-11 | Led 기판 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090108349A KR100959910B1 (ko) | 2009-11-11 | 2009-11-11 | Led 기판 모듈 |
Publications (1)
Publication Number | Publication Date |
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KR100959910B1 true KR100959910B1 (ko) | 2010-06-01 |
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KR1020090108349A KR100959910B1 (ko) | 2009-11-11 | 2009-11-11 | Led 기판 모듈 |
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KR (1) | KR100959910B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101126556B1 (ko) | 2010-07-30 | 2012-03-22 | 주식회사 탑엔지니어링 | 탈모관리기 |
KR101349841B1 (ko) * | 2010-06-24 | 2014-01-09 | 엘지전자 주식회사 | Led 조명기구 |
KR20210115808A (ko) * | 2020-03-16 | 2021-09-27 | (주) 헥사이노힐 | 저출력 레이저 치료 요법(lllt)을 위한 일체형 칩온보드 타입의 의료용 발광 소자 제조 방법 및 이를 이용한 의료용 발광 소자 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100729825B1 (ko) * | 2005-12-27 | 2007-06-18 | 럭스피아(주) | 발광 유니트 |
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2009
- 2009-11-11 KR KR1020090108349A patent/KR100959910B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100729825B1 (ko) * | 2005-12-27 | 2007-06-18 | 럭스피아(주) | 발광 유니트 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101349841B1 (ko) * | 2010-06-24 | 2014-01-09 | 엘지전자 주식회사 | Led 조명기구 |
KR101126556B1 (ko) | 2010-07-30 | 2012-03-22 | 주식회사 탑엔지니어링 | 탈모관리기 |
KR20210115808A (ko) * | 2020-03-16 | 2021-09-27 | (주) 헥사이노힐 | 저출력 레이저 치료 요법(lllt)을 위한 일체형 칩온보드 타입의 의료용 발광 소자 제조 방법 및 이를 이용한 의료용 발광 소자 |
KR102341319B1 (ko) * | 2020-03-16 | 2021-12-21 | (주) 헥사이노힐 | 저출력 레이저 치료 요법(lllt)을 위한 일체형 칩온보드 타입의 의료용 발광 소자 제조 방법 및 이를 이용한 의료용 발광 소자 |
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