WO2014075402A1 - Capteur micromécanique de champ magnétique et application de ce capteur - Google Patents

Capteur micromécanique de champ magnétique et application de ce capteur Download PDF

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Publication number
WO2014075402A1
WO2014075402A1 PCT/CN2013/071256 CN2013071256W WO2014075402A1 WO 2014075402 A1 WO2014075402 A1 WO 2014075402A1 CN 2013071256 W CN2013071256 W CN 2013071256W WO 2014075402 A1 WO2014075402 A1 WO 2014075402A1
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WIPO (PCT)
Prior art keywords
magnetic field
field sensor
resonant
resonant oscillator
anchor point
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PCT/CN2013/071256
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English (en)
Chinese (zh)
Inventor
熊斌
吴国强
徐德辉
王跃林
Original Assignee
中国科学院上海微系统与信息技术研究所
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Publication of WO2014075402A1 publication Critical patent/WO2014075402A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/028—Electrodynamic magnetometers
    • G01R33/0286—Electrodynamic magnetometers comprising microelectromechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/028—Electrodynamic magnetometers

Definitions

  • the invention belongs to the technical field of design and detection of micro-mechanical magnetic field sensors, and relates to a magnetic field sensor, in particular to a micro-mechanical magnetic field sensor and its circuit structure working in an expanded mode. Background technique
  • the magnetic field sensor can be divided into: superconducting quantum interference magnetic field sensor, Hall magnetic field sensor, fluxgate magnetometer, giant magnetoresistive magnetic field sensor and induction coil magnetic field sensor.
  • the superconducting quantum interference magnetic field sensor has the highest sensitivity among all magnetic field sensors, but its structure is complex, bulky, expensive, and needs to work in a low temperature environment.
  • the Hall magnetic field sensor has low power consumption and small size, and can measure static or dynamic magnetic fields. However, its sensitivity is low, noise level and static offset are large; fluxgate magnetometer is used to measure static or slowly changing magnetic field, high resolution, low power consumption, but large volume and low frequency response; giant magnetoresistance Magnetic field sensors are highly sensitive, but cannot measure large magnetic fields.
  • Inductive coil magnetic field sensors are based on Faraday's law of electromagnetic induction to detect changing magnetic fields. They have low power consumption and simple structure (AL Herrera- May, LA Aguilera-Corts, PJ Garca- Ramrez and E. Manjarrez, "Resonant magnetic field sensors based on MEMS technology", Sensors, vol. 9, no. 10, pp. 7875-7813, 2009. ).
  • MEMS Micro Electro Mechanical System
  • CMOS IC Complementary Metal Oxide Semiconductor Integrated Circuit
  • MEMS magnetic field sensors have the advantages of small size, light weight, low power consumption, low cost, high reliability, excellent performance and powerful functions that are unmatched by traditional sensors.
  • the development of MEMS technology has enabled micro-structure processing on the chip, while reducing the cost of MEMS, and can also accomplish tasks that many large-scale electromechanical systems cannot perform, thus promoting the development of magnetic field sensors.
  • the main working principle of the magnetic field sensor of the MEMS structure is: After the Lorentz force of the induction coil of the current is subjected to the magnetic field, the structure of the support coil is bent or twisted, and the method of capacitance detection or piezoresistive detection, optical detection, etc.
  • the magnitude of the magnetic field signal can be detected by measuring the amount of torsional deformation or the amount of bending deformation of the supporting coil structure.
  • These devices typically have inductive coils fabricated on cantilever beams, U-beams, or plates that can be bent or twisted. Device When working, place the device in a magnetic field and apply current to the induction coil.
  • the induction coil is subjected to Lorentz forces, which cause bending or torsion of the cantilever beam, U-beam or plate.
  • Lorentz forces By measuring the amount of bending or the amount of twist of the cantilever beam, U-beam or plate, the magnitude of the magnetic field can be detected.
  • these devices all need to pass current to the induction coil, their power consumption is relatively large; in addition, these devices generally operate in a bending mode or a torsional mode, and thus they operate at a lower resonance frequency.
  • the MEMS-structured magnetic field sensor can also be implemented by loading a metal coil on a resonant oscillator structure operating in an expanded mode (in the case of a bulk mode).
  • the resonant resonator may be a square plate, a circular plate or a circular plate structure.
  • Figures la to lc are modal diagrams of several resonant oscillator structures operating in a bulk mode, where the dashed line indicates the deformation trend of the outer contour of the resonant oscillator structure during operation (resonant state), and Figure la is for operation at the Square Extensional ( SE) modal square plate resonant oscillator structure, Figure lb is a circular plate resonant oscillator structure operating in the Radial Extensional (RE) mode, and Figure lc is a circular plate resonant oscillator structure operating in the Radial Extensional (RE) mode .
  • the micromechanical magnetic field sensor in the magnetic field sensor is an electrostatically driven device.
  • the measured output signal contains a capacitive coupling signal caused by capacitive coupling.
  • the effect of capacitive coupling is generally reduced by reducing the parasitic capacitance between the input signal and the output port.
  • this method can only reduce the capacitive coupling signal and cannot completely eliminate it. In other words, there is still a capacitive coupling signal in the output signal, and a simple magnetic field output signal cannot be obtained. Summary of the invention
  • the present invention provides a micro-mechanical magnetic field sensor, the micro-mechanical magnetic field sensor comprising: a pair of resonant oscillators and an insulating layer and a metal coil sequentially formed on a surface thereof;
  • the resonant oscillator pair includes:
  • each of the resonant axes of the resonant oscillator structure includes at least a first axis of symmetry and a second axis of symmetry, and the first axis of symmetry is perpendicular to the second axis of symmetry;
  • a main support beam on the first axis of symmetry, and two resonant oscillator structures are coupled to each other through respective main support beams;
  • Driving electrodes are respectively disposed on opposite sides of each of the resonant oscillator structures, and a driving gap is formed between each of the resonant oscillator structures, the driving electrode is connected to a DC power source through a resistor, and the driving electrode is connected to the AC through a capacitor a power source, wherein the driving electrodes of each of the resonant oscillator structures are respectively connected to an alternating current power source having opposite phase amplitudes;
  • the insulating layer is formed on the resonant oscillator structure of the pair of resonant oscillators and the upper surface of the main supporting beam, and an insulating layer is formed between the first anchor point and the pad formed thereon;
  • the metal coils are respectively formed on the insulating layer on each of the resonant oscillator structures, and the metal coils are metal coils whose inner ends are surrounded by the center of the insulating layer, wherein the two resonant resonator structures are The metal coils are in the same direction; the beginning ends of the metal coils are connected to the pads on the corresponding first anchor points through the first connecting bridge, and the ends of the metal coils are connected to each other through the second connecting bridge.
  • each metal coil On the first insulating layer on the main support beam, or the end of each metal coil is connected to the pad on the corresponding first anchor point through the second connecting bridge, and the beginning end of each metal coil passes through the first connecting bridge Connected to the first insulating layer on the main supporting beam of the coupled connection; an insulating layer is formed between each of the first connecting bridge and each of the metal coils located under the connecting bridge.
  • the resonant oscillator pair further includes a first coupling beam connected at one end to the main supporting beam coupled to each other, and a second anchor point connected to the other end of the first coupling beam, where The second anchor point is grounded through a pad formed thereon, and an insulating layer is formed between the upper surface of the first coupling beam and the pad formed on the second anchor point and the pad formed thereon.
  • each of the metal coils is connected to the pad on the second anchor point through a second connecting bridge via a main support beam coupled to each other and a first insulating layer on the first coupling beam; or
  • the beginning of the metal coil is connected to the pad on the second anchor point through the first connecting bridge via the main support beam coupled to each other and the first insulating layer on the first coupling beam.
  • the resonant oscillator structure is a rectangular plate, a circular plate or a circular annular plate.
  • the first coupling beam is a straight beam or a curved folding beam.
  • the resonant oscillator pair further includes a second coupling beam, and the second coupling beam is also connected to the main supporting beam on the first symmetry axis and connected to each other, and the second coupling beam is connected There is a third anchor point; wherein the second coupling beam and the first coupling beam are respectively distributed on two sides of the first symmetry axis.
  • the second coupling beam is a straight beam or a curved folding beam.
  • the first axis of symmetry is parallel to a long side or a wide side of the rectangular plate.
  • the first symmetry axis and the second symmetry axis are respectively extension lines of two diagonal lines of the square plate.
  • the resonant oscillator pair further includes a side support beam on the second symmetry axis and one end connected to the resonant oscillator structure, and a fourth anchor point connected to the other end of the side support beam.
  • the metal coil is a plurality of layers, and the metal coils of each layer are connected in series, and the metal coils of each layer have the same winding direction, and an insulating layer is formed between the metal coils of each layer.
  • the metal coils are connected in series by a continuous even-numbered layer and an odd-numbered layer, the ends of the metal coils are connected, and the continuous odd-numbered layer and the even-numbered layer are connected to the beginning of the metal coil, and each of the The metal coils connected in series have an insulating layer in addition to the joint.
  • a metal support post supporting the metal coil to hang over the insulating layer is formed between the metal coil and the insulating layer under the metal coil.
  • the metal coil is a circle, and the metal coil is circular or rectangular.
  • the metal coil is a plurality of turns, and the metal coil is a circular spiral or a rectangular spiral.
  • the present invention also provides a circuit structure of a micro-mechanical magnetic field sensor, the circuit structure including at least: a phase-locked loop circuit, a differential operational amplifier, the micro-mechanical magnetic field sensor, a voltage amplifier, and a voltage follower, wherein the lock
  • the phase loop circuit includes a voltage controlled oscillator, a phase detector, and a low pass filter;
  • An output of the micromechanical magnetic field sensor for generating an induced voltage is coupled to an input of the voltage amplifier; and an output of the voltage amplifier for amplifying the induced voltage is coupled to the phase detector An input terminal, wherein the amplified induced voltage signal output by the voltage amplifier is used as a measurement signal;
  • An output of the phase detector for identifying a phase difference between the measurement signal and the reference signal is coupled to an input of the low pass filter
  • An output of the low pass filter for filtering an alternating current portion of the phase detector output signal is connected to a control end of the voltage controlled oscillator and an input end of the voltage follower, wherein the low pass The DC signal outputted by the filter is used as a control voltage signal of the voltage controlled oscillator to ensure that the entire phase locked loop circuit is in a stable working state;
  • the output of the voltage follower is connected to an external measuring device, wherein the magnitude of the DC voltage signal output by the voltage follower characterizes the magnitude of the magnetic field to be measured of the micromechanical magnetic field sensor.
  • the voltage amplifier is a differential voltage amplifier having two inputs; when one first anchor of the two resonant oscillator structure is connected to the output and the other first anchor is grounded, the voltage amplifier is a conventional voltage amplifier having one input.
  • the micromechanical magnetic field sensor of the present invention has the following advantageous effects:
  • the present invention uses a coupling beam to couple two resonant oscillator structures to form a resonant oscillator pair, and uses differential capacitive excitation and electromagnetic induction to measure the magnitude of the magnetic field, wherein the two resonant oscillator structures operate in an anti-phase mode, each of the resonant oscillators
  • the metal coils in the structure are wound in the same direction, and the induced electromotive forces generated by the metal coils on the two resonant oscillator structures are connected in series; since the driving signals are differential signals, the two differential driving signals respectively form two opposite phases with the output signals.
  • the capacitively coupled signal and because the two capacitively coupled signals are equal in magnitude and opposite in sign, they cancel each other out at the voltage output of the measured induced electromotive force, thereby eliminating the capacitively coupled signal in the output signal.
  • the simple magnetic field output signal realizes the simple magnetic field output signal detection of the micro-mechanical magnetic field sensor;
  • the invention couples two resonant oscillator structures by using a coupling structure, and the two resonant resonator structures are integrally connected by the coupling structure, thereby ensuring that the entire micro-mechanical magnetic field sensor has a single resonant frequency;
  • the resonant oscillator of the micromechanical magnetic field sensor proposed by the invention operates in an expanding mode, so that each small metal cutting magnetic line on the metal coil generates an induced electromotive force which is superposed in series with each other to enhance the intensity of the output signal;
  • the metal coil of the present invention It can be one or more layers of spiral coils, which is beneficial to further increase the intensity of the output signal and improve the sensitivity of detection;
  • the present invention can also suspend the metal coil over the resonant oscillator through the metal support column, thereby reducing the problem of crosstalk between the resonant oscillator structure and the metal coil at high frequencies;
  • the invention has a simple structure, does not need to pass current on the metal coil, and reduces the power consumption of the device; at the same time, the magnitude of the magnetic field is measured by measuring the induced electromotive force at both ends of the metal coil, so that the temperature is less affected; and since the invention adopts The two resonant oscillator structures further enhance the strength of the output signal and also increase the sensitivity of the output signal.
  • Figures la to lc show schematic diagrams of modalities of several resonant oscillator structures operating in bulk mode in the prior art, wherein Figure la is a square plate resonant oscillator structure operating in the Square Extensional (SE) mode, Figure Lb is a circular plate resonant oscillator structure operating in the Radial Extensional (RE) mode, and Figure lc is a circular plate resonant oscillator structure operating in the Radial Extensional (RE) mode.
  • SE Square Extensional
  • Figure Lb is a circular plate resonant oscillator structure operating in the Radial Extensional (RE) mode
  • Figure lc is a circular plate resonant oscillator structure operating in the Radial Extensional (RE) mode.
  • FIG. 2a is a schematic view showing a test circuit of the micromechanical magnetic field sensor of the present invention in the first embodiment, wherein the resonant oscillator structure is a SE modal square plate.
  • FIG. 2b is a schematic diagram showing a test circuit of a micro-mechanical magnetic field sensor of the present invention, wherein the resonant vibration
  • the substructure is a SE modal square plate.
  • Fig. 2c is a schematic view showing a related structure of a resonator pair of a micromechanical magnetic field sensor of the present invention.
  • Fig. 2d is a schematic view showing the structure of a pair of resonant oscillators of the micromechanical magnetic field sensor of the present invention in the first embodiment.
  • 2e is a schematic view showing the circuit structure of the micro-mechanical magnetic field sensor of the present invention in the first embodiment.
  • Fig. 3a is a schematic view showing the test circuit of the micromechanical magnetic field sensor of the present invention in the second embodiment, wherein the resonant oscillator structure is a Width Extensional (WE) mode rectangular plate.
  • WE Width Extensional
  • Fig. 3b is a schematic view showing a test circuit of the micromechanical magnetic field sensor of the present invention, wherein the resonant oscillator structure is a WE mode rectangular plate.
  • Fig. 3c is a schematic view showing the structure of a pair of resonant oscillators of the micromechanical magnetic field sensor of the present invention in the second embodiment.
  • Fig. 3d is a schematic view showing the circuit structure of the micromechanical magnetic field sensor of the present invention in the second embodiment.
  • Fig. 4a is a schematic view showing the test circuit of the micromechanical magnetic field sensor of the present invention in the third embodiment, wherein the resonant oscillator structure is a RE mode circular plate.
  • Fig. 4b is a schematic view showing the structure of a pair of resonant oscillators of the micromechanical magnetic field sensor of the present invention in the third embodiment.
  • Component label description is a schematic view showing the structure of a pair of resonant oscillators of the micromechanical magnetic field sensor of the present invention in the third embodiment.
  • the present invention provides a micro-mechanical magnetic field sensor, the micro-mechanical magnetic field sensor comprising: at least: a pair of resonant oscillators and an insulating layer 6 and a metal coil 7 sequentially formed on a surface thereof, wherein
  • the resonant oscillator pair includes: a resonant oscillator structure 1, a main support beam 21, a first anchor point 41, and a drive electrode 5.
  • the resonant oscillator pair further includes a first coupling beam 31 and a second anchor point 42.
  • the resonant oscillator structure 1 is two and both axisymmetric structures, and the axis of symmetry of each of the resonant oscillator structures 1 includes at least a first axis of symmetry and a second axis of symmetry, and the first axis of symmetry is perpendicular to the second symmetry. axis.
  • the material of the resonant oscillator structure 1 is monocrystalline silicon, polycrystalline silicon, amorphous silicon or silicon carbide.
  • the resonant oscillator structure 1 is a rectangular plate, a circular plate or a circular annular plate.
  • the first axis of symmetry is parallel to a long side or a wide side of the rectangular plate.
  • the resonant oscillator structure 1 is a square plate; further, the resonant oscillator structure 1
  • the plate is a square plate, the first axis of symmetry and the second axis of symmetry may also be extension lines of two diagonal lines of the square plate, respectively.
  • the two resonant resonator structures 1 are single crystal silicon square plates, and the first symmetry axis and the second symmetry axis of the square plate resonant oscillator structure 1 are square respectively.
  • An extension of the two diagonal lines of the board, that is, the main support beam 21 is connected to the corner of the square plate resonant oscillator structure 1, and the broken line of each of the resonant oscillator structures 1 in Fig. 2d indicates that each of the resonant oscillator structures 1 is in operation (resonant state).
  • the deformation trend of the outer contour is described in the first embodiment, as shown in FIG. 2d.
  • the main support beam 21 is located on the first axis of symmetry, and the two resonant resonator structures 1 are coupled to each other by respective main support beams 21.
  • the main support beams 21 are two, and each of the single crystal silicon square resonator vibrator structures 1 is coupled to each other through a respective one of the main support beams 21.
  • the resonant oscillator pair further includes a first coupling beam 31 and a second anchor point 42, but is not limited thereto.
  • the resonant oscillator pair may The first coupling beam 31 and the second anchor point 42 are not included (see Figure 2c).
  • One end of the first coupling beam 31 is connected to the main supporting beam 21 connected to each other, wherein the first coupling beam 31 is a straight beam or a curved folding beam.
  • the first coupling beam 31 is a curved folded beam.
  • the second anchor point 42 is connected to the other end of the first coupling beam 31, wherein the second anchor point 42 is formed with a pad (as shown in FIG. 2a, the first anchor point is filled with a cross grid place) And the second anchor point 42 is grounded through the pad.
  • the first anchor point 41 is connected to the free end of the main support beam 21, wherein the first anchor point 41 is formed with a pad (as shown in FIG. 2a, the second anchor point is filled with a cross-grid space)
  • the first anchor point 41 of the two resonant resonator structure 1 is respectively connected to the voltage output terminal V through pads formed thereon.
  • Ut or a first anchor point is connected to the voltage output terminal V.
  • Ut and the other first anchor point is grounded, thereby measuring the induced electromotive force V.
  • Ut to measure the size of the magnetic field to be measured.
  • the first anchor point 41 of the two-resonant oscillator structure 1 is respectively connected to the voltage output terminal ⁇ through the pads formed thereon.
  • the first anchor point 41 of the one resonant resonator structure 1 is connected to the voltage output terminal V.
  • Ut and the first anchor point 41 of the other resonant oscillator structure 1 is grounded as shown in Fig. 2b.
  • the driving electrodes 5 are respectively distributed on opposite sides of each of the resonant oscillator structures 1 and between each of the resonant oscillator nodes 1 A driving gap is formed, the driving electrode 5 is connected to the DC power source V p through the resistor R, and the driving electrode 5 is connected to the AC power source V in through the capacitor C, wherein the AC power source connected to the resonant resonator structure 1 is +V in , the AC power source connected to the other resonant oscillator structure is -V in , wherein + ⁇ and -1 ⁇ 4 11 are opposite in phase, that is, the drive electrodes 5 of the resonant resonator structure 1 are respectively connected to opposite phases
  • the two resonant oscillator structures operate in reverse phase mode.
  • the driving signal is a differential signal
  • two differential driving signals respectively form two opposite phase capacitive coupling signals with the output signal
  • the two capacitive coupling signals are equal in size and opposite in sign, they are The voltage output terminals of the measured induced electromotive force cancel each other out, thereby eliminating the capacitive coupling signal in the output signal, and obtaining a simple magnetic field output signal, thereby realizing the simple magnetic field output signal detection of the micromechanical magnetic field sensor.
  • the driving electrodes 5 are located on opposite sides of each of the square plate resonant oscillator structures 1, and between the driving electrodes 5 and the resonant oscillator structure 1.
  • a driving gap is formed.
  • the driving electrodes 5 are two pairs, and each pair is symmetrically distributed on opposite sides of each of the square plate resonant oscillator structures 1, that is, each pair of the driving electrodes 5 is symmetrically distributed.
  • the driving electrodes may be only a pair and distributed in the opposite direction of each of the square plate resonant oscillator structures 1. side.
  • the resonant oscillator pair further includes a second coupling beam 32, and the second coupling beam 32 is also connected to the first symmetry axis. And connected to the main support beam 21, and the second coupling beam 32 is connected with a third anchor point 43, preferably, as shown in FIG. 2d, the second coupling beam 32 and the first coupling beam 31 Symmetrically distributed on both sides of the first axis of symmetry.
  • the resonant oscillator pair further includes a side support beam 22 and a fourth anchor point 44, wherein the side support beam 22 is located in the a second axis of symmetry, one end of which is connected to the resonant oscillator structure 1 and the other end of which is connected to the fourth anchor point 44 (the fourth anchor point 44 in FIG. 2a is grounded, but is not limited thereto, the ground four anchor points
  • the side support beam 22 may be connected to the corner of the square plate resonant oscillator structure 1, but is not limited thereto.
  • the resonant oscillator pair may also be free of the side. Support beam and fourth anchor point.
  • the four anchor points 44 are grounded through the pads located thereon, but are not limited thereto, and the pads on the fourth anchor point may also be Not grounded.
  • the insulating layer 6 is formed on the upper surface of the resonant oscillator structure 1 and the main support beam 21 of the pair of resonant resonators, and an insulating layer 6 is formed between the first anchor point 41 and the pad formed thereon.
  • the upper surface of the first coupling beam 31 is also formed with an insulating layer 6, and the insulating layer 6 is formed between the second anchor point 42 and the pad formed thereon.
  • the resonant oscillator structure 1, the main support beam 21, the first coupling beam 31, and the first anchor point 41 and the second anchor point 42 are formed in the same plane, and the insulating layer is formed on the upper surface of the plane.
  • the resonant oscillator pair further includes a second coupling beam 32, a third anchor point 43, a side support beam 22, and a fourth anchor point 44, as shown in FIG. 2a, the second coupling There is no insulating layer 6 on the beam 32, the third anchor point 43, and the side support beam 22.
  • the insulating layer 6 is formed between the fourth anchor point 44 and the pad formed thereon, but is not limited thereto.
  • the second coupling beam 32, the third anchor point 43, and the side support beam 22 may also have an insulating layer 6. When the fourth anchor point 44 has no pad, there may be no insulation. Layer 6.
  • the metal coils 7 are respectively formed on the insulating layer 6 on each of the resonant oscillator structures 1 , wherein the metal coils are metal coils whose inner ends are surrounded by the center of the insulating layer 6 .
  • the metal coils 7 on the two resonant resonator structures 1 are in the same direction. Since the metal coils on the resonant resonator structure 1 have the same circumferential direction; and since the two resonant oscillator structures 1 are excited by the differential capacitors and operate in the reverse phase mode, the induction of the metal coils 7 on the two resonant oscillator structures 1 The electromotive forces are connected in series.
  • each of the metal coils 7 is surrounded by a clockwise direction, and the ends of the metal coils 7 are connected to the corresponding first anchor points 41 through the second connecting bridge 82.
  • a main support beam 21 coupled to each other via the first connecting bridge 81 and an insulating layer 6 on the first coupling beam 31 are connected to the pads on the second anchor point 42 through the first connecting bridge 81,
  • the second connecting bridge 82 is located on the insulating layer 6 on the main supporting beam 21 connected to the first anchor point 41; at the same time, each of the first connecting bridge 81 and each of the metal coils located under the same An insulating layer 6 is formed therebetween, wherein the first connecting bridge 81-end is connected to the beginning of the metal coil ⁇ through an insulating layer 6 located therebelow, and the other end of the first connecting bridge 81 is connected to a pad on the second anchor point 42.
  • the first connecting bridge 81 is located on the metal coil 7, the main supporting beam 21 coupled to each other and the insulating layer 6 on the first coupling beam 31; the metal coil 7.
  • the materials of the first connecting bridge 81 and the second connecting bridge 82 are Gold, but not limited to this, the materials of the three can be the same or different, but the three materials are selected from gold, copper or aluminum to ensure a good electrical connection.
  • the manner in which the metal coil is connected to the pads on the first anchor point and the second anchor point is not limited thereto.
  • the beginning of each of the metal coils is connected to the pads on its corresponding first anchor point through the first connecting bridge, and the ends of the metal coils pass through the second connecting bridge.
  • the main support beam and the insulating layer on the first coupling beam are connected to the pad on the second anchor point; at the same time, each of the first connecting bridge and each of the metal coils located under the same is formed An insulating layer, wherein one end of the first connecting bridge is connected to a beginning end of the metal coil through an insulating layer located under the first connecting bridge, and the other end of the first connecting bridge is connected to a pad on the first anchor point.
  • the metal coil may be a layer or a plurality of layers; when the metal coil is a plurality of layers, the metal coils of each layer are connected in series, and the metal coils of each layer have the same winding direction.
  • An insulating layer is further formed between the metal coils of each layer, wherein the metal coils are connected in series by a continuous even-numbered layer and an odd-numbered layer The ends are connected, and the continuous odd-numbered layer and the even-numbered layer are connected to the beginning of the metal coil to ensure that the layers are in the same winding direction, and each of the metal coils connected in series has an insulating layer except for the joint.
  • the first layer of metal coils is clockwise surrounded from the inside to the outside with the center as the beginning, and the second layer of metal coils is connected to the ends of the first layer of metal coils, and the The two-layer metal coil is surrounded by the end from the outside to the clockwise direction.
  • the first layer of the metal coil and the second layer of the metal coil are wound in the same direction, and then the third layer of the metal coil is connected to the center of the second layer of the metal coil.
  • the third layer of metal coils is clockwisely surrounded from the inside to the outside with the center as the starting end.
  • the winding directions of the metal coils of the first layer, the second layer and the third layer are the same.
  • the metal coil may be directly formed on the insulating layer, or a metal coil may be suspended between the metal coil and the insulating layer underneath.
  • the metal support column wherein the support column and the coil are of the same material, and are all selected from the group consisting of gold, copper or aluminum.
  • the number of turns of the metal coil is one turn (unclosed), the metal coil is circular or rectangular; the metal coil may also be multiple turns, and the metal coil is circular spiral or The rectangle is spiral, but it is necessary to ensure that the shape of each of the resonant oscillator structures 1 is consistent with the shape of the metal coil located thereon.
  • the metal coil is a layer of a square spiral metal coil 7 formed directly on the insulating layer 6.
  • the micromechanical magnetic field sensor proposed by the present invention is realized by loading a metal coil on two resonant oscillator structures forming a pair of resonant oscillators.
  • the invention utilizes differential capacitance excitation to drive two resonant oscillator structures into a resonant state.
  • the resonant oscillator vibration will drive the metal coil to move, the metal coil cuts the magnetic induction line, and generates an induced electromotive force at both ends of the metal coil.
  • the magnitude of the measured magnetic field is measured by measuring the induced electromotive force across the metal coil.
  • the present invention also provides a circuit structure of a micro-mechanical magnetic field sensor.
  • the circuit structure includes at least: a phase-locked loop circuit, a differential operational amplifier 92, and a micro-mechanical magnetic field sensor 93.
  • the voltage amplifier 94 and the voltage follower 97, wherein the phase locked loop circuit comprises a voltage controlled oscillator 91, a phase detector 95 and a low pass filter 96.
  • An output of the voltage controlled oscillator 91 for generating an alternating current signal having the same resonant frequency as the micromechanical magnetic field sensor 93 is coupled to an input of the differential operational amplifier 92 and an input of the phase detector 95, respectively.
  • the AC signal outputted by the voltage controlled oscillator 91 is used as a reference signal of the phase detector 95.
  • the DC power input end of the micro-mechanical magnetic field sensor 93 is further connected with a DC voltage V p
  • An output of the micromechanical magnetic field sensor 93 for generating an induced voltage is coupled to an input of the voltage amplifier 94 for connecting an output of the voltage amplifier 94 that amplifies the induced voltage to the phase detector 95.
  • An output of the phase detector 95 for discriminating the phase difference between the measurement signal and the reference signal is coupled to the input of the low pass filter 96.
  • An output of the low-pass filter 96 for filtering an alternating current portion of the output signal of the phase detector 95 is connected to a control end of the voltage controlled oscillator 91 and an input end of the voltage follower 97, wherein The DC signal output by the low pass filter 96 serves as a control voltage signal of the voltage controlled oscillator 91 for ensuring that the entire phase locked loop circuit is in a stable operating state.
  • the output of the voltage follower 97 is connected to an external measuring device (not shown), wherein the magnitude of the DC voltage signal output by the voltage follower 97 characterizes the magnitude of the magnetic field to be measured of the micro-mechanical magnetic field sensor 93.
  • a voltage-controlled oscillator (VCO) 91 in the phase-locked loop circuit generates an AC signal having the same resonant frequency as the micro-mechanical magnetic field sensor 93;
  • Single to Differential) 92 converts the AC signal output from the voltage controlled oscillator 91 into a differential voltage signal, and superimposes the DC voltage V p to excite the micromechanical magnetic field sensor 93 to operate;
  • the induced voltage of the micromachined magnetic field sensor 93 passes the voltage
  • the amplifier (Amplifier) 94 performs amplification; the frequency signal output from the voltage controlled oscillator 91 is used as a reference frequency, and the output of the voltage amplifier 94 is used as a measurement signal, and the phase difference between the measurement signal and the reference signal is discriminated by the phase detector 95;
  • the output signal of the phaser 95 is connected to a low-pass filter 96, and the AC portion of the signal is filtered to obtain a DC signal related to the amplitude of the
  • the signal acts as a control voltage signal of the voltage controlled oscillator 91, thereby ensuring that the entire phase-locked loop circuit is in a stable working state; the DC signal output by the low-pass filter 96 reflecting the amplitude of the magnetic field signal to be tested passes through a voltage follower (Buffer Amplifier). Connected to an external measuring device, the final output DC voltage signal V.
  • the size of ut characterizes the magnitude of the magnetic field to be measured by the micromechanical magnetic field sensor 93.
  • the micro-mechanical magnetic field sensor of the present invention has the following beneficial effects:
  • the present invention uses a coupling beam to couple two resonant oscillator structures to form a resonant oscillator pair, and uses differential capacitive excitation and electromagnetic induction to measure the magnitude of the magnetic field, wherein the two resonant oscillator structures operate in an anti-phase mode, each of the resonant oscillators
  • the metal coils in the structure are wound in the same direction, and the induced electromotive forces generated by the metal coils on the two resonant oscillator structures are connected in series; since the driving signals are differential signals, the two differential driving signals respectively form two opposite phases with the output signals.
  • the capacitively coupled signal and because the two capacitively coupled signals are equal in magnitude and opposite in sign, they cancel each other out at the voltage output of the measured induced electromotive force, thereby eliminating the capacitively coupled signal in the output signal.
  • the simple magnetic field output signal realizes the simple magnetic field output signal detection of the micro-mechanical magnetic field sensor;
  • the invention couples two resonant oscillator structures by using a coupling structure, and the two resonant resonator structures are integrally connected by the coupling structure, thereby ensuring that the entire micro-mechanical magnetic field sensor has a single resonant frequency;
  • the resonant oscillator of the micromechanical magnetic field sensor proposed by the invention operates in an expanding mode, so that each small metal cutting magnetic line on the metal coil generates an induced electromotive force which is superposed in series with each other to enhance the intensity of the output signal;
  • the metal coil of the present invention It can be one or more layers of spiral coils, which is beneficial to further increase the intensity of the output signal and improve the sensitivity of detection;
  • the present invention can also suspend the metal coil over the resonant oscillator through the metal support column, thereby reducing the problem of crosstalk between the resonant oscillator structure and the metal coil at high frequencies;
  • the invention has a simple structure, does not need to pass current on the metal coil, and reduces the power consumption of the device; at the same time, the magnitude of the magnetic field is measured by measuring the induced electromotive force at both ends of the metal coil, so that the temperature is less affected; and since the invention adopts The two resonant oscillator structures further enhance the strength of the output signal and also increase the sensitivity of the output signal.
  • Embodiment 2
  • the second embodiment is basically the same as the technical solution of the first embodiment, and the difference mainly lies in: the resonant vibration described in the first embodiment
  • the substructure is a square plate, and the resonant oscillator pair includes a first coupling beam, a second anchor point, a second coupling beam, and a third anchor point.
  • the resonant oscillator structure is a rectangular plate, and The resonant oscillator pair does not include the first coupling beam, the second anchor point, the second coupling beam and the third anchor point, and the rest of the resonance oscillator pairing (structure, manufacturing method and working principle) is the same as the embodiment. A related description of one will not be repeated here.
  • the second embodiment provides a micro-mechanical magnetic field sensor
  • the micro-mechanical magnetic field sensor includes at least: a pair of resonant oscillators and an insulating layer 6 and a metal coil 7 sequentially formed on a surface thereof, wherein
  • the resonant oscillator pair includes: a rectangular plate resonant oscillator structure 1, a main support beam 21, a first anchor point 41, and a driving electrode 5, but is not limited thereto.
  • each of the resonant oscillator pairs is also The first coupling beam connected to the interconnected main support beam and the second anchor point connected to the other end of the first coupling beam may be further included, and each of the resonant oscillator pairs may further include a connection The second coupling beam on the main support beam on the first axis of symmetry and connected to each other and the third anchor point connecting the second coupling beam.
  • the rectangular plate resonant oscillator structure 1 is silicon carbide, and its first axis of symmetry is parallel to the long side or wide side of the rectangular plate.
  • the first axis of symmetry is parallel to the long side of the rectangular plate, i.e., the main support beam 21 is connected to the wide side of the rectangular plate resonator structure 1.
  • the first anchor point 41 is connected to the free end of the main support beam 21, wherein the first anchor point 41 is formed with a pad (as shown in FIGS. 3a and 3b, the second anchor point is filled with a cross grid
  • the first anchor point 41 of the two-resonant oscillator structure 1 is connected to the voltage output terminal V through pads formed thereon, respectively.
  • Ut (as shown in Figure 3a) or a first anchor connected to the voltage output V.
  • Ut and another first anchor point is grounded (as shown in Figure 3b) to thereby measure the induced electromotive force V.
  • Ut to measure the size of the magnetic field to be measured.
  • a first anchor point 41 of the two-resonant oscillator structure 1 is connected to the voltage output terminal V.
  • Ut and another first anchor point 41 is grounded.
  • the driving electrodes 5 are respectively disposed on opposite sides of each of the rectangular plate resonator structure 1 and the driving motor 5 and the resonant oscillator structure 1 are formed with a driving gap.
  • the driving electrodes 5 are two and symmetrically distributed on both sides of the first symmetry axis of each of the rectangular plate resonant oscillator structures 1, that is, the driving electrodes 5 are symmetrically distributed on the long sides of the rectangular plate resonant oscillator structures 1 side.
  • the rectangular plate resonant oscillator structure may also preferably be a square plate.
  • the insulating layer 6 is formed on the upper surface of the resonant oscillator structure 1 and the main support beam 21 of the pair of resonant resonators, and an insulating layer 6 is formed between the first anchor point 41 and the pad formed thereon.
  • the resonant oscillator structure 1, the main support beam 21 and the first anchor point 41 are formed in the same plane, and the insulating layer is formed on the upper surface of the plane.
  • the second coupling beam 32 and the third anchor point 43 may be formed on the second coupling beam 32 and the third anchor point 43.
  • the insulating layer 6 may also have no insulating layer 6.
  • the metal coil 7 please refer to the first embodiment, except that the metal coil 7 has a rectangular spiral shape, and each of the metal coils 7 is counterclockwise, as shown in FIG. 3a.
  • the circuit structure of the micro-mechanical magnetic field sensor of the second embodiment is basically the same as that of the first embodiment, except that the voltage amplifier 94 in the first embodiment is a differential voltage amplifier having two input terminals; and the voltage amplifier 94 of the second embodiment.
  • a conventional voltage amplifier having an input terminal (refer to FIG. 3d); in addition, the structure of the micro-mechanical magnetic field sensor of the second embodiment is different from that of the first embodiment.
  • the micro-mechanical magnetic field sensor of the present invention has the following beneficial effects:
  • the present invention uses a coupling beam to couple two resonant oscillator structures to form a resonant oscillator pair, and uses differential capacitive excitation and electromagnetic induction to measure the magnitude of the magnetic field, wherein the two resonant oscillator structures operate in an anti-phase mode, each of the resonant oscillators
  • the metal coils in the structure are wound in the same direction, and the induced electromotive forces generated by the metal coils on the two resonant oscillator structures are connected in series; since the driving signals are differential signals, the two differential driving signals respectively form two opposite phases with the output signals.
  • the capacitively coupled signal and because the two capacitively coupled signals are equal in magnitude and opposite in sign, they cancel each other out at the voltage output of the measured induced electromotive force, thereby eliminating the capacitively coupled signal in the output signal.
  • the simple magnetic field output signal realizes the simple magnetic field output signal detection of the micro-mechanical magnetic field sensor;
  • the invention couples two resonant oscillator structures by using a coupling structure, and the two resonant resonator structures are integrally connected by the coupling structure, thereby ensuring that the entire micro-mechanical magnetic field sensor has a single resonant frequency;
  • the resonant oscillator of the micromechanical magnetic field sensor proposed by the invention operates in an expanding mode, so that each small metal cutting magnetic line on the metal coil generates an induced electromotive force which is superposed in series with each other to enhance the intensity of the output signal;
  • the metal coil of the present invention It can be one or more layers of spiral coils, which is beneficial to further increase the intensity of the output signal and improve the sensitivity of detection;
  • the present invention can also suspend the metal coil over the resonant oscillator through the metal support column, thereby reducing the problem of crosstalk between the resonant oscillator structure and the metal coil at high frequencies;
  • the invention has a simple structure, does not need to pass current on the metal coil, and reduces the power consumption of the device; at the same time, the magnitude of the magnetic field is measured by measuring the induced electromotive force at both ends of the metal coil, so that the temperature is less affected; and since the invention adopts The two resonant oscillator structures further enhance the strength of the output signal and also increase the sensitivity of the output signal.
  • Embodiment 3
  • the third embodiment is basically the same as the technical solution of the first embodiment, and the difference is mainly as follows:
  • the resonant oscillator structure in the first embodiment is a square plate; in the third embodiment, the resonant oscillator structure is a circular plate, and the resonant oscillator
  • the third embodiment provides a micro-mechanical magnetic field sensor.
  • the micro-mechanical magnetic field sensor includes at least: a pair of resonant oscillators and an insulating layer 6 and a metal coil 7 sequentially formed on a surface thereof, wherein
  • the resonant oscillator pair includes: a circular plate resonant oscillator structure 1, a main support beam 21, a first coupling beam 31, a first anchor point 41, a second anchor point 42, and a driving electrode 5, wherein the first axis of symmetry An extension of the diameter of the circular plate.
  • the resonant oscillator structure 1 is not limited to a circular plate, and the resonant oscillator structure 1 may also be a circular plate or a circular ring plate, wherein the first symmetry axis is a circular plate or a circle. An extension of the major or minor axis of the circle in the ring plate.
  • the annular plate is a preferred embodiment of the annular plate, and the first axis of symmetry is an extension of the diameter of the annular plate.
  • the resonant oscillator pair further includes a second coupling beam 32 connected to the main support beam 21 and a third anchor point 43 connected to the second coupling beam 32, wherein
  • the main support beam 21 is a main support beam that is located on the first axis of symmetry and is connected to each other, but is not limited thereto.
  • the pair of resonant beams may not have the second coupling beam and A third anchor point connected to the second coupling beam.
  • the driving electrodes 5 are respectively disposed on opposite sides of each of the square plate resonant oscillator structures 1, and the driving motor 5 and the resonant oscillator structure 1 are formed with a driving gap.
  • the driving electrodes are two arc-shaped driving electrodes matched with the circular plate, and are symmetrically distributed on opposite sides of each of the circular plate resonant oscillator structures 1.
  • the insulating layer 6 is formed on the resonant oscillator structure 1 of the resonant oscillator pair, the main support beam 21, and the upper surface of the first coupling beam 31, and between the first anchor point 41 and the pad formed thereon An insulating layer 6 is formed, and an insulating layer 6 is formed between the second anchor 42 and a pad formed thereon.
  • the resonant oscillator structure 1, the main support beam 21, the first coupling beam 31, the first anchor point 41 and the second anchor point 42 are formed in the same plane, and the insulating layer is formed on the upper surface of the plane. on.
  • the resonant oscillator pair further includes a second coupling beam 32 connected to the main support beam 21 and a third anchor point 43 connected to the second coupling beam 32, as shown in FIG. 4a.
  • the second coupling beam 32 and the third anchor point 43 are not provided with the insulating layer 6, but are not limited thereto.
  • the second coupling beam 32 and the third anchor point 43 are also There may be an insulating layer 6.
  • the metal coil 7 has a circular spiral shape, and each of the metal coils 7 is counterclockwise, as shown in Fig. 4a.
  • the circuit structure (not shown) of the micro-mechanical magnetic field sensor of the third embodiment is described in the first embodiment, except that the structure of the micro-mechanical magnetic field sensor of the third embodiment is different from that of the first embodiment. .
  • micro-mechanical magnetic field sensor of the present invention has the following beneficial effects as compared with the conventional micro-mechanical magnetic field sensor:
  • the present invention uses a coupling beam to couple two resonant oscillator structures to form a resonant oscillator pair, and uses differential capacitive excitation and electromagnetic induction to measure the magnitude of the magnetic field, wherein the two resonant oscillator structures operate in an anti-phase mode, each of the resonant oscillators
  • the metal coils in the structure are wound in the same direction, and the induced electromotive forces generated by the metal coils on the two resonant oscillator structures are connected in series; since the driving signals are differential signals, the two differential driving signals respectively form two opposite phases with the output signals.
  • the capacitively coupled signal and because the two capacitively coupled signals are equal in magnitude and opposite in sign, they cancel each other out at the voltage output of the measured induced electromotive force, thereby eliminating the capacitively coupled signal in the output signal.
  • the simple magnetic field output signal realizes the simple magnetic field output signal detection of the micro-mechanical magnetic field sensor;
  • the invention couples two resonant oscillator structures by using a coupling structure, and the two resonant resonator structures are integrally connected by the coupling structure, thereby ensuring that the entire micro-mechanical magnetic field sensor has a single resonant frequency;
  • the resonant oscillator of the micromechanical magnetic field sensor proposed by the invention operates in an expanding mode, so that each small metal cutting magnetic line on the metal coil generates an induced electromotive force which is superposed in series with each other to enhance the intensity of the output signal;
  • the metal coil of the present invention It can be one or more layers of spiral coils, which is beneficial to further increase the intensity of the output signal and improve the sensitivity of detection;
  • the present invention can also suspend the metal coil over the resonant oscillator through the metal support column, thereby reducing the problem of crosstalk between the resonant oscillator structure and the metal coil at high frequencies;
  • the invention has a simple structure, does not need to pass current on the metal coil, and reduces the power consumption of the device; at the same time, the magnitude of the magnetic field is measured by measuring the induced electromotive force at both ends of the metal coil, so that the temperature is less affected; and since the invention adopts The two resonant oscillator structures further enhance the strength of the output signal and also increase the sensitivity of the output signal.
  • the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Magnetic Variables (AREA)

Abstract

La présente invention concerne un capteur micromécanique de champ magnétique (93) et une application de ce capteur. Le capteur micromécanique de champ magnétique (93) comprend au moins une paire d'oscillateurs résonnants, et des couches isolantes (6) et des bobines de fil métallique (7) formées séquentiellement sur les surfaces de la paire d'oscillateurs résonnants. L'excitation différentielle de condensateurs et l'induction électromagnétique sont utilisées pour mesurer la taille d'un champ magnétique, deux structures (1) d'oscillateur résonnant formant la paire d'oscillateurs résonnants fonctionnent dans des modes antiphase, les bobines métalliques d'induction (7) se trouvant sur les structures (1) d'oscillateur résonnant sont enroulées dans la même direction, et les forces électromotrices induites générées par les bobines métalliques d'induction (7) se trouvant sur les deux structures (1) d'oscillateur résonnant sont connectées les unes aux autres en série. Comme le signal d'excitation est un signal différentiel, un signal de couplage capacitif est éliminé d'un signal de sortie, ce qui permet d'acquérir un signal de sortie de champ magnétique unidirectionnel. Dans le même temps, les deux structures (1) d'oscillateur résonnant sont couplées par l'intermédiaire d'une structure de couplage, de sorte que les deux structures (1) d'oscillateur résonnant fonctionnent d'une manière intégralement connectée. En outre, le capteur micromécanique de champ magnétique (93) présente comme avantages d'avoir une structure simple, d'être peu influencé par la température, de produire un signal de sortie important, d'être très sensible, de permettre une détection très précise et d'être adapté à une fréquence de travail élevée.
PCT/CN2013/071256 2012-11-19 2013-02-01 Capteur micromécanique de champ magnétique et application de ce capteur WO2014075402A1 (fr)

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TWI610879B (zh) * 2015-10-16 2018-01-11 碩英股份有限公司 具有防止訊號衰減功能之微機電裝置及其製造方法與防止訊號衰減的方法

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CN105988090B (zh) * 2015-01-30 2018-09-25 中国科学院上海微系统与信息技术研究所 微机械磁场传感器及其应用
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