WO2014069866A1 - Composition de pâte de cuivre pour composants électroniques imprimés - Google Patents

Composition de pâte de cuivre pour composants électroniques imprimés Download PDF

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Publication number
WO2014069866A1
WO2014069866A1 PCT/KR2013/009664 KR2013009664W WO2014069866A1 WO 2014069866 A1 WO2014069866 A1 WO 2014069866A1 KR 2013009664 W KR2013009664 W KR 2013009664W WO 2014069866 A1 WO2014069866 A1 WO 2014069866A1
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WO
WIPO (PCT)
Prior art keywords
copper
paste composition
printed electronics
nanoparticles
weight
Prior art date
Application number
PCT/KR2013/009664
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English (en)
Korean (ko)
Inventor
김성배
이승혁
임준환
한주경
유현석
김영모
Original Assignee
주식회사 동진쎄미켐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 동진쎄미켐 filed Critical 주식회사 동진쎄미켐
Priority to CN201380056055.8A priority Critical patent/CN106170835B/zh
Priority to JP2015539508A priority patent/JP6487846B2/ja
Priority claimed from KR1020130128938A external-priority patent/KR102109427B1/ko
Publication of WO2014069866A1 publication Critical patent/WO2014069866A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Definitions

  • the present invention relates to a copper paste composition for printed electronics, and more particularly, to a copper paste composition for printed electronics including copper nanoparticles whose oxidation is suppressed and excellent in electrical conductivity, adhesion to a substrate, and printability.
  • Printed electronics technology is a technology that manufactures a variety of electronic devices, components or modules using a direct printing process of various functional ink materials capable of solution processing.
  • RFID tags, lighting, displays, solar cells It can be applied to almost all areas where semiconductors, devices, circuits, and the like are used.
  • conductive ink materials are mainly used for electrodes and wiring of various electronic devices, and the most important physical property necessary for the conductive lines formed at this time is conductivity, and the next important requirements are low process temperature, Low production cost, ink stability, and the like.
  • the conductive ink materials which are mainly used or actively studied at present include conductive polymer solutions, solutions in which metal nanoparticles are dispersed, carbon nanotube (CNT) dispersion solutions, and composite materials thereof.
  • Metal nanoparticles which are currently being actively studied, have high conductivity, but require a relatively high firing temperature (> 150 ° C.) in order to remove the dispersant used to disperse them.
  • a composition composed mainly of spherical micro ( ⁇ m) -sized silver (Ag) has been used as a paste, and the paste made of silver has been widely applied because it is easy to manufacture and has excellent stability and stable after printing. Due to the high price and high price, it has a negative effect on the cost of the produced product, and the spherical micro silver particles are difficult to realize high electrical conductivity at low temperature.
  • an object of the present invention is to provide a copper paste composition for printed electronics that can suppress the oxidation of copper to exhibit excellent electrical conductivity, adhesion and printability.
  • Another object of the present invention is to provide a printed electronic method capable of exhibiting excellent electrical conductivity, adhesive strength and printability using the copper paste composition for printed electronics, and a printed electronic article manufactured by the method.
  • the present invention to achieve the above object
  • the present invention provides a printed electronic method comprising the step of performing drying and firing after printing the copper paste composition for printed electronics on a substrate.
  • the present invention provides a printed electronic article manufactured by the printed electronic method.
  • the copper paste composition for printed electronics according to the present invention can exhibit excellent conductivity and printability even at atmospheric pressure by using copper nanoparticles, copper-dissimilar metal nanoparticles or a mixture thereof, which are synthesized by wet synthesis and thinly coated with organic material on the surface.
  • copper- dissimilar metal nanoparticles since the adhesion is excellent, it can be applied to various printed electronics instead of expensive silver particles.
  • FIG. 1 is a photograph showing copper nanoparticles synthesized in Synthesis Example 1.
  • Figure 2 is a graph showing the EDAX surface analysis of the copper nanoparticles synthesized in Synthesis Example 1.
  • Figure 3 is a graph showing the thermal analysis and organic content measurement results of the copper nanoparticles synthesized in Synthesis Example 1.
  • Example 4 is a photograph showing the result of printing and baking the composition of Example 1 on a polyimide film.
  • FIG. 5 is a photograph showing the results of evaluation of printability of the composition of Example 1.
  • Copper particles of 1 ⁇ m or more that are generally sold on the market are difficult to achieve low resistance due to fusion between particles at low temperatures, and have a disadvantage of completely losing conductivity while oxidation occurs first when fused for a long time.
  • commercially available copper particles do not have organic coatings on their surfaces and are easily oxidized.
  • Copper nanoparticles coated with an organic material on the surface usable in the present invention may be a pure copper nanoparticles coated with an organic material, or copper- dissimilar metal nanoparticles may be coated with an organic material or a mixture thereof.
  • the different metal in the above may be used without limitation as long as the metal is faster oxidation than copper commonly used in the art, preferably zinc or aluminum.
  • pure copper nanoparticles do not show excellent results even if the polymer component is added to the adhesion between the polyimide and the polymer substrate.
  • the pure copper nanoparticles differ in shrinkage from the substrate because the interface between particles increases and the shrinkage rate increases accordingly.
  • the adhesion strength is not good, but the metal oxide is faster than the copper, in particular, in the case of forming copper-heterometallic nanoparticles in the form of solid solution of zinc or aluminum in the form of a solid solution, The adhesive strength is improved by reducing the difference in shrinkage.
  • the content ratio of the copper and the dissimilar metal in the copper-dissimilar metal nanoparticles is preferably mixed with dissimilar metals in an amount of 1 to 30 parts by weight based on 100 parts by weight of copper.
  • the nanoparticles are spherical, the average particle size is 50 to 1,000 nm, preferably 100 to 500 nm, the organic material is coated on the surface is characterized in that the oxidation is inhibited.
  • the copper nanoparticles according to the present invention are inhibited from being oxidized by the organic film coated on the surface even when heat is applied at atmospheric pressure in which oxygen or more is present.
  • the organic material may be an amine, fatty acid, aliphatic amine or mercapto, and the content of the surface organic material is preferably 0.1 to 10% by weight. In the case, it is possible to satisfy the desired electrical conductivity at the same time while preventing the oxidation of copper.
  • the copper nanoparticles can be prepared using conventional methods, such as wet synthesis.
  • the copper nanoparticles may be included in an amount of 40 to 90% by weight, and when added in an amount of less than 40% by weight, the binder content may be increased to achieve a desired conductivity.
  • the viscoelastic properties for the sharp deterioration has a problem that the print performance is significantly reduced.
  • the copper nanoparticles may be a mixture of 30 to 70 parts by weight of pure copper nanoparticles and 70 to 30 parts by weight of copper- dissimilar metal nanoparticles.
  • a binder resin is included in order to give the paste composition an adhesive property and a rheological property for printing.
  • Binder resins usable in the present invention include, but are not limited to, cellulose-based, for example methylcellulose, ethylcellulose, hydroxypropylcellulose, hydroxypropylmethylcellulose, cellulose acetate boot Rate, carboxymethyl cellulose, hydroxyethyl cellulose, epoxy resins, polyester resins and copolymers prepared by mixing at least one of them are preferred.
  • the binder resin may be included in an amount of 1 to 30% by weight, and when added in an amount of less than 1% by weight, the viscosity of the paste may be increased, resulting in poor printability, and when the content exceeds 30% by weight, the viscosity of the paste may be increased.
  • monomers or oligomers are used to increase the Viscosity property of the composition.
  • one or more selected from the group consisting of acryl, urethane and epoxy may be used, for example urethane acrylate, polyfunctional acrylate, polyester acrylate urethane, etc., molecular weight of 10,000 It is preferable that it is the following.
  • the monomer or oligomer may be included in an amount of 1 to 20% by weight, the elastic property may be excessively increased by the binder when added in less than 1% by weight, the fluidity may be excessively increased when it exceeds 20% by weight have.
  • the curing agent may be added by adding a curing agent that can be cured by thermal baking.
  • dimethylaminopropyl methacrylamide, isocyanate, phthalic anhydride and the like can be used as the curing agent usable in the present invention.
  • the curing agent may be included in 0.1 to 3% by weight, it is difficult to secure the adhesive strength when it is added to less than 0.1% by weight, it is difficult to secure the adhesive strength, if more than 3% by weight rather than the adhesive strength due to the unreacted curing agent Can be dropped.
  • a solvent is used to control the viscosity of the paste and to enhance the dispersion of the nanoparticles.
  • Solvents usable in the present invention include diethylene glycol, triethylene glycol, tetraethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, Diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, methyl pyrrolidone, terpinol, and the like can be used. It may be included as.
  • the copper paste composition for printed electronics of the present invention may further include additives commonly used in the art, for example, antioxidants, pH adjusting agents, and the like, in addition to the above components.
  • the present invention also provides a printed electronic method comprising the step of performing drying and firing after printing the copper paste composition for printed electronics on a substrate and a printed electronic article prepared according to the method.
  • the printing may include screen printing, gravure off-set printing, and gravure direct.
  • the substrate to be printed may be applied to a variety of known substrates, for example, may be printed on a flexible circuit board, a glass substrate.
  • the substrate is a flexible circuit board, in particular, a polyimide (PI) film.
  • the paste composition of the present invention is optimized to be suitable for each printing process, and when the screen printing method is applied to a polyimide (PI) film, the paste composition of the present invention has a viscosity range of 10,000 to 50,000 centipoise (cps). It is preferable to have.
  • PI polyimide
  • the copper paste composition of the present invention may be calcined according to the calcining method commonly used in the art after performing the printing process as described above, preferably nitrogen, oxygen or argon hot air alone, MIR (Middle infra red) Lamps, or hot air and MIR lamps can be used at the same time to dry and fire.
  • nitrogen, oxygen or argon hot air alone, MIR (Middle infra red) Lamps, or hot air and MIR lamps can be used at the same time to dry and fire.
  • composition according to the present invention is preferably dried or fired while supplying hot nitrogen or oxygen at 220 ° C. or lower, preferably 150 to 200 ° C., or dried and fired with a MIR lamp at 150 to 200 ° C.
  • the composition according to the present invention can suppress oxidation at atmospheric pressure as much as possible by using copper nanoparticles coated with an organic material on the surface, as well as excellent electrical conductivity, adhesion and Because of its excellent printability, it can be applied to various printed electronic fields (for example, RFID tags, lighting, displays, solar cells, batteries, semiconductors, electronic devices, circuits, etc.) instead of expensive silver particles.
  • the present invention can be preferably applied in the manufacture of flexible printed circuit boards.
  • the dark red powder was recovered by centrifugation and precipitation, and washed and recovered several times with methanol, and then stored at atmospheric pressure.
  • Copper-zinc nanoparticles were synthesized in the same manner as in Synthesis Example 1, except that 27 g of copper precursor CuCl 2 and 3 g of zinc precursor were used instead of 30 g of copper precursor CuCl 2 as the metal precursor.
  • Copper-aluminum nanoparticles were synthesized in the same manner as in Synthesis Example 1, except that 27 g of copper precursor CuCl 2 and 3 g of aluminum precursor were used instead of 30 g of copper precursor CuCl 2 as the metal precursor.
  • a paste composition was prepared in the same manner as in Example 1, except that 30 g of the copper-zinc nanoparticles prepared in Synthesis Example 2 was used instead of 30 g of the copper nanoparticles prepared in Synthesis Example 1.
  • Example 1 except that 15 g of copper nanoparticles prepared in Synthesis Example 1 and 15 g of copper-zinc nanoparticles prepared in Synthesis Example 2 were used instead of 30 g of the copper nanoparticles prepared in Synthesis Example 1. In the same manner as in the paste composition was prepared.
  • a paste composition was prepared in the same manner as in Example 1, except that a polyfunctional urethane acrylate oligomolecule having a molecular weight of 2,000 or more was used instead of an acrylic monomer.
  • a paste composition was prepared in the same manner as in Example 1, except that a bisphenol-based epoxy oligomo having a molecular weight of 500 or more was used instead of the acrylic monomer.
  • a paste composition was prepared in the same manner as in Example 1, except that 8 g of ethyl cellulose polymer and 2 g of epoxy resin were used instead of 10 g of ethyl cellulose polymer.
  • a paste composition was prepared in the same manner as in Example 1, except that 8 g of ethyl cellulose polymer and 2 g of epoxy resin were used instead of 10 g of ethyl cellulose polymer, and a urethane based monomer was used instead of an acrylic monomer.
  • a paste composition was prepared in the same manner as in Example 1, except that 8 g of ethyl cellulose polymer and 2 g of epoxy resin were used instead of 10 g of ethyl cellulose polymer, and an epoxy monomer was used instead of an acrylic monomer.
  • a paste composition was prepared in the same manner as in Example 1, except that 30 g of copper particles purchased from Aldrich Inc. was used instead of 30 g of copper nanoparticles prepared in Synthesis Example 1.
  • each composition was printed on a polyimide film through a 290 mesh screen net having a pattern formed thereon, and the formed coating film was dried at 50 ° C. After calcining with hot air at 200 ° C. for 3 minutes (FIG. 4), the conductivity was measured by directly measuring the printed pattern with a multi tester, and the printed pattern was evaluated for adhesive strength by the method of ASTM D3359. Table 1 shows.
  • Example 1 Conductivity (line resistance 100 ⁇ m / 1 cm) Adhesion (PI Substrate ASTM D3359) Printability (with / without 50 ⁇ m single wire)
  • Example 1 2.5 50 o
  • Example 2 7.8 95 o
  • Example 3 3.4 90 o
  • Example 4 30.2 95 o
  • Example 5 3.9 50 o
  • Example 6 10.5 95 o
  • Example 7 3.1 50 o
  • Example 8 3.9 90 o
  • Example 9 11.8 50 o
  • Example 10 4.8 30 o
  • Example 11 20.4 95 o
  • Example 12 3.8 50 o
  • Example 13 4.9 90 o
  • Example 14 20.8 90 o Comparative Example 1 x 5 x
  • the copper paste composition for printed electronics according to the present invention may exhibit excellent conductivity and printability even at atmospheric pressure by using copper nanoparticles, copper-dissimilar metal nanoparticles, or a mixture thereof, which are synthesized by wet synthesis and thinly coated with organic material on the surface.
  • copper- dissimilar metal nanoparticles since the adhesion is excellent, it can be applied to various printed electronics instead of expensive silver particles.

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne une composition de pâte de cuivre pour composants électroniques imprimés et, plus particulièrement, une composition de pâte de cuivre pour composants électroniques imprimés ayant une excellente conductivité électrique, résistance d'adhérence avec un substrat, et aptitude à l'impression en raison de l'inclusion de nanoparticules de cuivre dont l'oxydation est empêchée. Plus précisément, la composition de pâte de cuivre pour composants électroniques imprimés selon la présente invention peut montrer une excellente conductivité et aptitude à l'impression même à pression atmosphérique dans la mesure où des nanoparticules de cuivre ou des nanoparticules de métal autre que le cuivre sur la surface desquelles un matériau organique est apposé en couche mince sont utilisées. Plus particulièrement, l'adhérence est excellente lorsque des nanoparticules de métal dissemblable sont utilisées, et ainsi les nanoparticules de métal dissemblable, plutôt que des particules d'argent onéreuses, peuvent être appliquées sur différents champs électroniques imprimés.
PCT/KR2013/009664 2012-10-31 2013-10-29 Composition de pâte de cuivre pour composants électroniques imprimés WO2014069866A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380056055.8A CN106170835B (zh) 2012-10-31 2013-10-29 印刷电子用铜糊剂组合物
JP2015539508A JP6487846B2 (ja) 2012-10-31 2013-10-29 プリンテッドエレクトロニクス用銅ペースト組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2012-0121743 2012-10-31
KR20120121743 2012-10-31
KR10-2013-0128938 2013-10-29
KR1020130128938A KR102109427B1 (ko) 2012-10-31 2013-10-29 인쇄전자용 구리 페이스트 조성물

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170107382A1 (en) * 2015-10-20 2017-04-20 Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.O.C. Antioxidant conductive copper paste and method for preparing the same
CN112961538A (zh) * 2021-02-18 2021-06-15 长沙蓝思新材料有限公司 一种移印镜面银油墨及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060210705A1 (en) * 2003-05-16 2006-09-21 Daisuke Itoh Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method
KR20100004376A (ko) * 2008-07-03 2010-01-13 주식회사 동진쎄미켐 금속 나노 입자의 제조방법
US20100113647A1 (en) * 2006-07-28 2010-05-06 Takuya Harada Fine particle dispersion and method for producing fine particle dispersion
KR20100109791A (ko) * 2009-04-01 2010-10-11 주식회사 동진쎄미켐 저온소성 가능한 전극 또는 배선 형성용 페이스트 조성물
KR20120097778A (ko) * 2011-02-25 2012-09-05 삼성전기주식회사 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060210705A1 (en) * 2003-05-16 2006-09-21 Daisuke Itoh Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method
US20100113647A1 (en) * 2006-07-28 2010-05-06 Takuya Harada Fine particle dispersion and method for producing fine particle dispersion
KR20100004376A (ko) * 2008-07-03 2010-01-13 주식회사 동진쎄미켐 금속 나노 입자의 제조방법
KR20100109791A (ko) * 2009-04-01 2010-10-11 주식회사 동진쎄미켐 저온소성 가능한 전극 또는 배선 형성용 페이스트 조성물
KR20120097778A (ko) * 2011-02-25 2012-09-05 삼성전기주식회사 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170107382A1 (en) * 2015-10-20 2017-04-20 Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.O.C. Antioxidant conductive copper paste and method for preparing the same
CN112961538A (zh) * 2021-02-18 2021-06-15 长沙蓝思新材料有限公司 一种移印镜面银油墨及其制备方法和应用

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