WO2014069290A1 - Structure de raccordement entre des lentilles, équipement optique, module de câblage composite photoélectrique, et dispositif de transmission - Google Patents

Structure de raccordement entre des lentilles, équipement optique, module de câblage composite photoélectrique, et dispositif de transmission Download PDF

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Publication number
WO2014069290A1
WO2014069290A1 PCT/JP2013/078639 JP2013078639W WO2014069290A1 WO 2014069290 A1 WO2014069290 A1 WO 2014069290A1 JP 2013078639 W JP2013078639 W JP 2013078639W WO 2014069290 A1 WO2014069290 A1 WO 2014069290A1
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WO
WIPO (PCT)
Prior art keywords
optical
lens
substrate
wiring
lenses
Prior art date
Application number
PCT/JP2013/078639
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English (en)
Japanese (ja)
Inventor
松嶋　直樹
中條　徳男
俊明 高井
里佳 野村
進 石田
徹 矢崎
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Publication of WO2014069290A1 publication Critical patent/WO2014069290A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425—Optical features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding

Definitions

  • the present invention relates to a connection structure between two lenses, and more particularly to a photoelectric composite wiring module that collectively processes a large-capacity optical signal and a transmission device using the same.
  • optical fiber networks have been developed over long distances of several kilometers or more such as backbone, metro, and access systems.
  • it will be effective to use optical signals to process large-capacity data without delay even at short distances between transmission devices (several meters to several hundreds of meters) and within devices (several centimeters to several tens of centimeters).
  • Opticalization of LSI-to-LSI transmission between LSIs and backplanes in information devices such as routers and servers is being promoted.
  • Patent Document 1 an optical package lead frame and a substrate with a built-in optical device are electrically joined with solder or the like to be formed in the optical device and the substrate.
  • the optical waveguide and the optical waveguide are optically coupled, and electrical connection and optical coupling can be performed simultaneously by conventional electronic component mounting.
  • the optical coupling between the optical element and the optical waveguide uses a collimating optical system using two lenses.
  • This optical system has a large positional displacement tolerance between the two lenses in the direction perpendicular to the optical axis and in the optical axis direction. Therefore, a two-lens structure is also used in this prior art so that a high optical coupling can be obtained even if a positional deviation occurs to some extent by soldering.
  • this optical system is characterized by a small tolerance for angular deviation between lenses.
  • this structure there are many dangers that an angle deviation occurs between the lens optical axis on the optical package side and the lens optical axis on the substrate side due to lead frame distortion, solder thickness variation, electrode height variation, and the like.
  • Even if the optical axes are parallel during mounting there is still a possibility that an angle deviation such as deformation of the lead frame due to external force occurs during use.
  • the conventional structure has a problem that the optical coupling efficiency is significantly lowered due to the angle shift during mounting and use as described above, and the optical signal cannot be transmitted.
  • connection structure that eliminates the angular deviation between two lenses, and a structure that can easily perform electrical connection and optical coupling at the same time and that can ensure high optical coupling efficiency. It is to provide a photoelectric composite module and to provide a transmission device using the same.
  • the present invention is characterized by having an elastic body on both sides of the back surface of at least one of the two lenses.
  • the photoelectric composite wiring module having a structure for performing electrical connection and optical coupling simultaneously, An optical element, an IC for driving the optical element, a first substrate having a first lens for optical connection between the optical element and the optical wiring, an electrical wiring, an optical wiring, and the optical wiring
  • An optical element an IC for driving the optical element
  • a first substrate having a first lens for optical connection between the optical element and the optical wiring
  • an electrical wiring an optical wiring
  • an optical wiring and the optical wiring
  • the photoelectric composite wiring module having a second substrate provided with a second lens for optical connection between the optical element and the optical element, provided behind either or both of the first lens and the second lens It has a structure in which lenses are pressed and fixed by an elastic body.
  • FIG. 1 and FIG. 2 show a first embodiment of the present invention.
  • FIG. 1 is a cross-sectional view of a photoelectric composite wiring module according to the present invention.
  • FIG. 1A shows an assembly process
  • FIG. 1B shows a state where mounting is completed.
  • 2 (a) and 2 (b) are top views.
  • the present photoelectric composite wiring module is composed of a first substrate 1 and a second substrate 2.
  • an optical element 11 such as a semiconductor laser or a photodiode and an optical transmission / reception circuit 12 for the optical element 11 are mounted.
  • the mounting method is flip-chip mounting using the solder bumps 13.
  • the optical element 11 and the optical transmission / reception circuit 12 are electrically connected to each other by a solder bump and an electric wiring 14 formed on the first substrate 1.
  • the optical element 11 is a semiconductor laser
  • an electrical signal is transmitted from the optical transmission circuit 12 to the semiconductor laser via the electrical wiring 14, and converted from electricity to an optical signal by the semiconductor laser.
  • both the optical element 11 and the optical transmission / reception circuit 12 may be a combination of die bonding and wire bonding other than flip-chip mounting.
  • the optical signal emitted from the light emitting element / incident on the light receiving element is propagated below the first substrate. That is, the portion immediately below where the optical element 11 is mounted on the first substrate 1 is transparent to the propagating light. In this embodiment, transparency is ensured by using the first substrate as a glass material.
  • a first lens 15 is disposed immediately below the optical element 11. This lens is shaped so that the light emitted from the light emitting element is converted into parallel light, or the parallel light incident on the light receiving element can be efficiently condensed on the aperture of the light receiving element. As a result, the light emitted from the light emitting element emits parallel light downward in the first substrate. Alternatively, parallel light incident from below the first substrate 1 enters the light receiving element.
  • electrical wiring 16 is formed on the first substrate 1. The structure is electrically connected to the opposite side of the surface on which the optical element 11 and the optical transmission / reception circuit 12 on the first substrate 1 are mounted by a through hole or the like.
  • FIGS. 2 (a) and 2 (b) are top views of the first substrate.
  • a light emitting element array 111, a light receiving element array 112, an optical transmission circuit 121, and an optical reception circuit 122 are mounted on the first substrate 1.
  • the optical element and the optical transmission / reception circuit are electrically connected to appropriate portions by wiring 14 on the substrate.
  • the light-emitting element array and the light-receiving element array are in the form of an optical transceiver mounted on the same substrate.
  • only the light-emitting element or only the light-receiving element may be used.
  • two array elements are provided, but one or three or more array elements may be provided.
  • one optical transmission / reception circuit is configured for one optical element array, but other configurations, for example, a combination of two or more optical element arrays in one optical cleaning reception circuit may be used. I do not care.
  • An optical fiber 22 having a second lens 21 at the tip is disposed on the second substrate 2.
  • the optical fiber 22 is disposed in the back surface direction of the second substrate through the through hole 23 provided in the second substrate.
  • the optical fiber 22 and the second substrate 2 are connected by an elastic body 24 represented by a spring.
  • An electric socket 25 is also installed on the second substrate 2.
  • a spring, rubber, sponge or the like can be used as the elastic body.
  • the electrode 17 on the lower surface of the first substrate 1 and the terminal 26 of the electric socket 25 installed on the second substrate 2 have the same electrode arrangement, and the first substrate 1 is placed on the electric socket. It has a structure that can be connected electrically by installing.
  • the first lens 15 provided on the first substrate 1 and the second lens 21 provided on the second substrate 2 are in contact with each other when mounted on the electrical socket 25. It has a structure to do.
  • the surface 19 of the first lens and the surface 29 of the second lens are formed substantially perpendicular (85 to 95 degrees) with respect to the optical axis of the lens. These two surfaces come into contact when the first substrate is attached to the electrical socket.
  • the elastic body exists behind the second lens, the two lenses in contact with the two surfaces are pressed by the restoring force of the elastic body 24.
  • Alignment with the electrical socket 25 of the second board of the first board is performed by a fitting pin 27 or the like.
  • the alignment accuracy is about 30 ⁇ m.
  • the first lens and the second lens have a structure in which an optical signal emitted from the optical element is converted into parallel light by the first lens and condensed on the core of the optical fiber by the second lens.
  • the optical signal emitted from the optical fiber is converted into parallel light by the second lens and is condensed on the light receiving element by the first lens. That is, the optical coupling system in this structure is a two-lens system.
  • FIG. 3A, FIG. 4A, and FIG. 5A are schematic diagrams showing the occurrence of positional deviation between the lenses in the two-lens system, and the fluctuation of the optical coupling efficiency at that time in FIG. b), FIG. 4B, and FIG.
  • 201 is a light source
  • 202 is a first lens
  • 400 is light
  • 301 is an optical fiber
  • 302 is a second lens
  • 500 is a second member. is there.
  • FIG. 3A shows a case where the optical axis is shifted in parallel
  • FIG. 4A shows a case where the optical axis is shifted vertically
  • FIG. 5C shows a case where an angular deviation occurs.
  • the optical coupling efficiency hardly fluctuates as shown in FIG.
  • the amount of positional deviation that decreases by 1 dB with respect to the vertical deviation is approximately ⁇ 30 ⁇ m, which is relatively large.
  • the alignment pins of the two lenses are used as described above.
  • the fitting pin structure high-precision alignment cannot be performed, but high optical coupling efficiency can be ensured by the optical characteristics of the two-lens system.
  • the surface of each lens is abutted, and the structure is less likely to cause a positional shift.
  • an array-like ribbon fiber is used in the present embodiment, but it may be bundled or separated one by one. Furthermore, a film in which an optical waveguide is formed may be used.
  • the cap 31 may be attached as necessary to avoid moisture and dust.
  • a method such as molding other than the cap as in the present embodiment may be used.
  • an opto-electric composite wiring module capable of simultaneously performing high-efficiency optical coupling at the time of mounting by simple mounting equivalent to an electronic device having only electrical connection. Further, it is possible to provide an optical device and a transmission device using the same.
  • FIG. 6A shows a structure in which a plate spring structure is used for the elastic body 24 instead of the coil-type spring as shown in FIG. Even in such a structure, when the lenses are pressed against each other, a restoring force is exerted, and the positional variation between the lenses is less likely to occur. Further, it is possible to obtain the same effect by disposing a resin having a small elastic modulus represented by rubber, for example, as the elastic body.
  • FIG. 6B shows a structure in which the optical fiber 22 is routed to the upper surface instead of the lower surface of the second substrate 2.
  • the second substrate is provided with a groove 231 on the upper surface instead of the through hole 23, and the optical fiber 22 is drawn from the groove 231.
  • This groove may be provided on the lower surface of the electrical socket 25 instead of the second substrate 2.
  • An appropriate structure may be selected according to the space on the upper and lower surfaces of the second substrate, the placement of other mounted components, and the like.
  • FIG. 6C shows a structural example in the case where the lens 15 provided on the first substrate is made of a member different from the first substrate.
  • a through hole 151 is provided immediately below the optical element 11 mounting portion of the first substrate 1 so that light can pass therethrough.
  • the lens 15 is provided immediately below the hole.
  • an IC 101 such as a switch LSI is mounted on the second substrate 2.
  • the IC 101 is electrically connected to the optical transmission / reception circuit 12 via the electric wiring 28 on the second substrate, the electrode 26 of the electric socket, the wiring 16 of the first substrate 1 and the like. That is, an electrical signal from the IC 101 is transmitted to the optical transmission circuit 12, and further, an electrical signal is transmitted from the optical transmission circuit 12 to the light emitting element 11, and after being converted into an optical signal, the optical signal is transmitted through the optical fiber 22. Is done. Alternatively, the optical signal propagated through the optical fiber 22 is converted into an electric signal by the light receiving element 11 and reaches the IC 101 through the optical receiving circuit 12.
  • An optical connector 102 is provided at the end of the optical fiber, and by connecting another optical fiber or the like to this end, optical transmission between boards or racks becomes possible.
  • Example 1 shown in FIG. 1 is applied as a photoelectric composite wiring module, it is applicable also to the form of Example 2 other than that.
  • the present invention relates to a connection structure between two lenses, and particularly has an industrial applicability to a photoelectric composite wiring module that collectively processes a large-capacity optical signal and a transmission device using the same.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)

Abstract

Afin de résoudre un problème selon lequel une déviation angulaire entre deux lentilles diminue de manière significative l'efficacité de couplage optique et perturbe la transmission de signaux optiques, la structure de raccordement entre des lentilles selon l'invention est caractérisée en ce qu'elle comprend une première lentille, une seconde lentille, et des corps élastiques agencés sur les deux côtés sur une face arrière de la première lentille et/ou de la seconde lentille.
PCT/JP2013/078639 2012-10-30 2013-10-23 Structure de raccordement entre des lentilles, équipement optique, module de câblage composite photoélectrique, et dispositif de transmission WO2014069290A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012238481A JP2016027351A (ja) 2012-10-30 2012-10-30 レンズ間の接続構造、および光電気複合配線モジュール
JP2012-238481 2012-10-30

Publications (1)

Publication Number Publication Date
WO2014069290A1 true WO2014069290A1 (fr) 2014-05-08

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PCT/JP2013/078639 WO2014069290A1 (fr) 2012-10-30 2013-10-23 Structure de raccordement entre des lentilles, équipement optique, module de câblage composite photoélectrique, et dispositif de transmission

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WO (1) WO2014069290A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286987A (ja) * 2001-03-23 2002-10-03 Kanto Tatsumi Denshi Kk 鏡筒内に二つ以上のレンズを位置決め固定する方法及び該方法を適用した光学機器
JP2006258835A (ja) * 2005-03-15 2006-09-28 Sony Corp 光導波モジュール、並びに、光電変換装置及び光導波部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286987A (ja) * 2001-03-23 2002-10-03 Kanto Tatsumi Denshi Kk 鏡筒内に二つ以上のレンズを位置決め固定する方法及び該方法を適用した光学機器
JP2006258835A (ja) * 2005-03-15 2006-09-28 Sony Corp 光導波モジュール、並びに、光電変換装置及び光導波部材

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