WO2014068938A1

WO2014068938A1 - Header for photoelectric conversion device and photoelectric conversion device equipped with same

Info

Publication number: WO2014068938A1
Application number: PCT/JP2013/006343
Authority: WO
Inventors: 天谷　英俊; 朝日　信行; 松本　卓也; 飯田　満; 大倉　健治
Original assignee: パナソニック株式会社
Priority date: 2012-11-01
Filing date: 2013-10-25
Publication date: 2014-05-08
Also published as: JP5963086B2; JP2014093140A; TW201432337A

Abstract

This photoelectric conversion device is equipped with a header (1). The header (1) is equipped with a header body (1s) and a metal wiring section (9). The header body (1s) has a recessed housing section (1c) where an optical component (4) and a photoelectric conversion IC (5) are housed and mounted and header-side connection sections (8) that protrude in the vicinity of corner sections of the header body (1s) and are isolated from the recessed housing section (1c). The metal wiring section (9) is electrically connected to the optical component (4) and the photoelectric conversion IC (5). The metal wiring section (9) has metal wiring terminal parts (9a, 9b) that are attached to the header-side connection sections (8). When the header-side connection sections (8) of the header (1) are fitted to socket-side connection sections (15) of a counterpart socket (2), the metal wiring terminal parts (9a, 9b) attached to the header-side connection sections (8) are elastically fitted to metal terminals (16) of the socket-side connection sections (15) so as to achieve electrical connections therebetween.

Description

Header for photoelectric conversion device and photoelectric conversion device including the same

The present invention relates to a photoelectric conversion device header and a photoelectric conversion device including the header.

Conventionally, a photoelectric conversion apparatus as described in Patent Document 1 is known. In this photoelectric conversion device, an optical element and an photoelectric conversion IC are mounted in two opposing devices, and the optical elements of each device are light guide components (for example, optical fiber, optical waveguide, etc.) Is optically connected. Then, the electrical signal is converted into an optical signal by the photoelectric conversion IC of one device, and the optical signal is emitted from the optical element. The optical signal is transmitted by the light guide component and incident on the optical element of the other device, and the optical signal is converted into an electrical signal by the photoelectric conversion IC.

Patent Document 1 discloses a connector structure of such a photoelectric conversion device. This connector structure includes, for example, a socket (receptacle connector) 51 and a header (plug connector) 52, as shown in FIGS. 9 (a) and 9 (b).

The socket 51 is formed with a recess 53 into which the header 52 is fitted from the inner surface side, and a socket-side connection portion 54 extending over substantially the entire length of both side walls constituting the recess 53. A large number of metal terminals 55 are attached to the socket side connection portion 54.

Inside the header 52, an optical element (not shown) and a photoelectric conversion IC (not shown) are mounted. The optical fiber 56 for optical transmission is drawn from the outside of the header 52 to the inside. On both sides of the header 52, header-side connection portions 57 that are opposed to the socket-side connection portions 54 are formed over substantially the entire length. The header side connecting portion 57 is attached with a number of metal terminals 58 formed from a metal plate electrically connected to the photoelectric conversion IC and the optical element and extending from the wiring portion.

When the header 52 is fitted in the recess 53 of the socket 51, the metal terminal 58 of the header side connection portion 57 is sandwiched from both sides of the header 52 by the metal terminal 55 of the socket side connection portion 54, and the metal terminal 55 Is electrically connected.

However, in the connector structure described in Patent Document 1, the metal terminal 58 of the header side connection portion 57 that extends over substantially the entire length of the side portion of the header 52 is connected to the socket side connection portion 54 of the socket 51 from both sides thereof. The metal terminal 55 is fitted between the metal terminals 55. The socket side connection portion 54 extends over substantially the entire length of the side portion of the socket 51. Therefore, if the contact pressure of the metal terminal 55 is increased in order to increase the fitting accuracy, an excessive stress may act on the optical element, the photoelectric conversion IC, and the metal plate wiring portion inside the header 52. is there. This may affect long-term reliability.

JP 2010-135109 A

SUMMARY OF THE INVENTION An object of the present invention is to provide a header for a photoelectric conversion device that prevents an excessive stress accompanying the fitting from acting on an optical element or the like in the header even when the header side connection is fitted to the socket side connection. It is providing the photoelectric conversion apparatus provided with.

The present invention includes a header body having a housing recess and a header side connection for housing an optical element and a photoelectric conversion IC, and a metal wiring terminal portion attached to the header side connection, the optical element and A metal wiring part electrically connected to the photoelectric conversion IC, wherein the header side connection part is formed in the vicinity of a corner of the header body isolated from the housing recess, and the header side The metal wiring terminal portion has a shape fitted to the socket side connection portion of the socket facing the connection portion, and the socket side connection portion is fitted to the socket side connection portion when the header side connection portion is fitted to the socket side connection portion. The present invention provides a header for a photoelectric conversion device characterized by having a shape that is elastically fitted to a metal terminal of a connection portion and is electrically connected to the metal terminal.

Moreover, this invention provides the photoelectric conversion apparatus provided with said header and the socket which has the said socket side connection part which has a shape which can be fitted to the said header side connection part of the said header. is there.

It is a perspective view showing the whole photoelectric conversion device provided with the header of the embodiment concerning the present invention, and is a perspective view in the state after the header was inserted in the socket. FIG. 2 is a perspective view of a state before a header is fitted into the socket of FIG. 1. FIG. 3 is a perspective view of the inner surface side of the header of FIG. 1 with the optical element and the photoelectric conversion IC mounted on the header body. FIG. 2 is a perspective view of the header of FIG. 1, with the optical element and the photoelectric conversion IC sealed with a sealing resin. FIG. 2 is a perspective view of the inner surface side of the header of FIG. 1 in a state where the optical element and the photoelectric conversion IC are shielded by a shield cover. 6A is a cross-sectional view taken along the line II-II of FIG. 5, FIG. 6B is a cross-sectional view taken along the line II of FIG. 2, and FIG. 6C is a cross-sectional view of a modified example of FIG. FIG. 7A is a schematic side view of Modification Example 1 of the header, and FIG. 7B is a schematic side view of Modification Example 2 of the header. 8A is a unidirectional communication system diagram, and FIG. 8B is a bidirectional communication system diagram. 9 (a) and 9 (b) are diagrams showing the background art, FIG. 9 (a) is a perspective view after the header is fitted into the socket, and FIG. 9 (b) is a diagram before the header is fitted into the socket. It is a perspective view of the state.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing the photoelectric conversion device in a state after the header 1 is fitted in the socket 2. FIG. 2 is a perspective view of the photoelectric conversion device in a state before the header 1 is fitted into the socket 2.

FIG. 3 is a perspective view of the inner surface of the header 1 with the optical element 4 and the photoelectric conversion IC 5 mounted thereon. FIG. 4 is a perspective view of the inner surface of the header 1 in a state where the optical element 4 and the photoelectric conversion IC 5 are sealed with the sealing resin 11. FIG. 5 is a perspective view of the inner surface of the header 1 in a state where the optical element 4 and the photoelectric conversion IC 5 are shielded by the shield cover 14.

1 and 2, the photoelectric conversion device includes a header 1 and a socket 2. That is, the photoelectric conversion device is configured by fitting the header 1 into the socket 2. The main body portion of the header 1 and the socket 2, that is, the header main body 1 s and the socket main body 2 s are formed by a molded product formed into a substantially rectangular flat plate shape using polyamide (PA), liquid crystal polymer (LCP), ceramic, or the like. It is configured.

Hereinafter, a specific configuration of the header 1 will be described.

The header 1 includes a header body 1s and a metal wiring portion 9 (see FIG. 3) disposed on the surface of the header body 1s.

The header body 1 s is set to be slightly smaller than the socket 2. On the other hand, a recess 2c is formed in the inner surface 2a of the socket 2, and a header body 1s is fitted into the recess 2c. Thereby, the outer surface 1b of the header body 1s is arranged on the substantially same plane on the inner surface 2a of the socket 2, and as a result, it is possible to reduce the height of the photoelectric conversion device.

Specifically, as shown in FIG. 3, a rectangular storage recess 1c that is recessed from the inner surface 1a and elongated in the length direction is formed at a substantially central position of the inner surface 1a of the header body 1s. In the housing recess 1c, an optical element (light receiving / light emitting element) 4 and a photoelectric conversion IC 5 are housed and mounted. In addition, an optical fiber (light guide component) 6 that transmits light to the optical element 4 is connected to the one end 1d in the length direction of the header body 1s from the outside so as to continue to the protruding portion 1e that protrudes outward. A groove 1f for drawing is formed. An optical waveguide (light guide component) may be used instead of the optical fiber 6, and a round hole may be used instead of the groove 1f.

Then, the optical elements 4 of the opposing photoelectric conversion devices are optically connected by an optical fiber 6. The electrical signal is converted into an optical signal by the photoelectric conversion IC 5 of one photoelectric conversion device, and the optical signal is emitted from the optical element (light emitting element) 4. The emitted optical signal is transmitted through the optical fiber 6 and is incident on the optical element (light receiving element) 4 of the other photoelectric conversion device. The optical signal is converted into an electrical signal by the photoelectric conversion IC 5 of the photoelectric conversion device.

The header-side connecting portions 8 that protrude in the length direction are formed near the four corners of the header body 1s at both side positions in the length direction of the header body 1s. In the present embodiment, a total of four header side connection portions 8 are formed, two on each side in the width direction of the header body 1s. In the present invention, the number of header side connection portions 8 is not limited to four. For example, one header side connection portion 8 may be arranged on the diagonal lines on both sides in the width direction of the header body 1s. Or the one header side connection part 8 may be arrange | positioned at the other edge part 1g of the header main body 1s. In addition, three or five or more header side connection portions 8 may be arranged.

As shown in FIG. 3, the header side connection portion 8 is located at substantially equal positions in the vicinity of the four corners of the header body 1 s, which is separated from the storage recess 1 c by the vertical wall 1 h surrounding the storage recess 1 c in the header body 1 s. It is preferable that they are arranged in a dispersed manner. That is, the housing recess 1c and the recess 1p are formed on the inner surface 1a of the header body 1s so that the vertical wall 1h remains. The vertical wall 1h has a part α along the edge of the header body 1s and a part β protruding from the part α in the central direction. The inner storage recess 1c and the outer recess 1p are partitioned by the portion β. The header side connection portion 8 is formed at a position adjacent to the recess 1p at the edge of the header body 1s. These header side connection portions 8 are isolated from the storage recess 1c by a vertical wall 1h surrounding the storage recess 1c.

The header side connection part 8 has a shape fitted to the socket side connection part 15 of the socket 2 facing the header side connection part 8. For example, as shown in FIG. 5 and FIG. 6B, the header side connection portion 8 extends in the length direction of the header body 1s and protrudes from the outer surface 1b of the header body 1 toward the inner surface 1a (that is, 6 (b) protrudes in the direction a facing the socket-side connecting portion 15 of the socket 2 shown in FIG. 6 (b)), and has a shape of a protrusion with a rounded tip.

A metal wiring portion 9 is formed in the housing recess 1c on the inner surface 1a side of the header body 1s as shown by cross hatching in FIG. The metal wiring portion 9 is electrically connected to the optical element 4 and the photoelectric conversion IC 5.

The metal wiring part 9 has metal

wiring terminal parts

9a and 9b attached to the surface of the header side connection part 8 of the header body 1s. Two metal

wiring terminal portions

9a and 9b are formed on the surface of each header side connection portion 8, respectively.

The metal

wiring terminal portions

9a and 9b are elastically fitted to the metal terminal 16 of the socket side connection portion 15 and the metal terminal 16 in a state where the header side connection portion 8 is fitted to the socket side connection portion 15. And has a shape electrically connected to. For example, as shown in FIGS. 5 and 6B, the metal

wiring terminal portions

9 a and 9 b are three-dimensionally aligned with the surface shape of the header side connection portion 8 having the shape of a ridge with a rounded tip. Further, the inner surface of the header side connection portion 8 (that is, the surface where the pair of header side connection portions 8 arranged in the width direction W of the header body 1 s face each other) is located on the outer surface (that is, on the opposite side of the opposite surface). , A surface facing the outside of the header main body 1s).

The metal wiring portion 9 is preferably formed with a wiring pattern produced by metal plating. However, the metal wiring part 9 can also be formed by a wiring pattern produced by processing a metal plate.

Metal plating includes, for example, a method of forming a copper film on the surface of a molded product (for example, header main body 1s), patterning with a laser or the like, and then electroplating copper or gold. In addition, for the patterning, a photolithography technique or a printing method can be used. For electroplating, electroless, vapor deposition, or sputtering methods can be used. In particular, hard pure gold plating can be used as the gold plating. The hard pure gold plating is a plating that uses a pure gold with a purity of 99.9% to obtain a wiring pattern having a hardness higher than that of normal plating. A wiring pattern obtained by hard pure gold plating has, for example, a Vickers hardness of about twice that of a normal product, for example, a Vickers hardness of 100 HV or more.

In the housing recess 1c of the header body 1s, an injection space S (see FIG. 4) for the sealing resin 11 (see FIG. 4) for sealing the optical element 4 and the photoelectric conversion IC 5 by the vertical wall 1h surrounding the housing recess 1c. 3) is formed. Further, in the vicinity of the header side connection portion 8, a convex wall portion 1j that prevents the sealing resin 11 and the adhesive 12 (see FIG. 4) from flowing into the header side connection portion 8 is formed.

As shown in FIG. 4, the sealing resin 11 is injected into the injection space S of the housing recess 1 c of the header body 1 s, and the optical element 4 and the photoelectric conversion IC 5 are formed by the sealing resin 11. It is sealed. The adhesive 12 is injected into the groove 1f for drawing the optical fiber 6 of the header body 1s from the outside. The optical fiber 6 is fixed to the groove 1 f by the adhesive 12.

The convex wall portion 1j is formed to prevent the sealing resin 11 and the adhesive 12 from flowing into the header side connection portion 8 and adhering to the metal

wiring terminal portions

9a and 9b.

As shown in FIG. 5, a metal shield cover 14 mainly covering the upper portion of the storage recess 1 c is dropped into the inner side of the storage recess 1 c on the inner surface 1 a of the header body 1 s by the thickness of the shield cover 14. Has been placed. An end portion 14a on the other end portion 1g side of the header main body 1s in the shield cover 14 is bent into a substantially U shape and fitted into the inner surface 1a and the outer surface 1b of the end portion 1g. Further, the end portion 14b on the one end portion 1d side of the header body 1s is fixed by caulking while being bent in a substantially U shape in the width direction of the protruding portion 1e in a state of covering the opening portion of the groove 1f of the protruding portion 1e. ing.

The shield cover 14 protects the optical element 4, the photoelectric conversion IC 5 and the like from external forces, and can improve the rigidity of the header body 1s which is a thin molded product. Thus, by improving the rigidity of the header body 1s, the header body 1s can be made thinner and smaller.

Further, on both sides of the shield cover 14 in the vicinity of the storage recess 1c, bent portions 14c that are bent in the direction facing the outer surface 1b are formed. The bent portion 14c is inserted and press-fitted into an insertion groove 1k formed on the inner surface 1a of the header body 1s. As shown in FIG. 6A, a GND (earth) metal wiring portion 9c is formed in the insertion groove 1k. When the bent portion 14c comes into contact with the GND metal wiring portion 9c, the shield cover 14 is GND-connected (grounded).

As described above, since the GND connection of the shield cover 14 is performed in the vicinity of the housing recess 1c, that is, in the vicinity of the optical element 4 and the photoelectric conversion IC 5, effective noise countermeasures are possible.

In order to prevent the shield cover 14 from falling (approaching) to the metal wiring portion 9 side and short-circuiting, four convex wall portions 1j are provided at positions adjacent to the storage concave portion 1c. Two or more steps are provided on the upper surface of each wall 1j. A metal wiring portion 9 is disposed in the lower portion of the wall portion 1j. The higher part of the wall 1j holds the shield cover 14. A protrusion 1n (see FIG. 3) is provided between the walls 1j to prevent the shield cover 14 from falling.

Further, as shown in FIG. 2, a shield pattern 9d made of metal plating is formed on the outer surface 1b of the header body 1s so as to correspond to the housing recess 1c and the header side connection portion 8 on the other end 1g side. Is formed. The shield pattern 9d can be formed simultaneously with the metal wiring portion 9 which is a wiring pattern made by metal plating. The shield pattern 9d is electrically connected to a GND (earth) metal wiring portion 9c on the inner surface of the header body 1s through a lead portion 9e on the side of the header body 1s.

Next, a specific configuration of the socket 2 will be described.

As shown in FIG. 2, the socket 2 includes a socket body 2 s and metal terminals 16. A recess 2c is formed in the inner surface 2a of the socket body 2s. A socket side connection portion 15 is formed in the recess 2c. The socket-side connection portion 15 has a shape that is respectively fitted to each header-side connection portion 8 so as to face each header-side connection portion 8 of the header 1 fitted into the recess 2c.

As shown in FIG. 6B, metal terminals 16 having a substantially U-shaped cross section are attached to each socket side connection portion 15, respectively. And the header side connection part 8 of the header main body 1s is fitted to the socket side connection part 15 of the socket 2 which opposes from the arrow a direction. As a result, the metal

wiring terminal portions

9a and 9b attached to the header side connection portion 8 are elastically sandwiched between the metal terminals 16 and electrically connected to the socket side connection portion 15.

Each metal terminal 16 is disposed on the outer surface 2b side of the socket 2 and has an end portion 16a for electrically connecting to a wiring pattern or the like of the board.

In this embodiment, the header side connection part 8 of the header body 1s has a convex shape, and the metal terminal 16 of the socket side connection part 15 of the socket 2 has a concave shape. These header side connection parts 8 The metal terminal 16 constitutes a so-called uneven fitting structure. On the other hand, as shown in FIG. 6C, the header side connection portion 8 of the header body 1s has a concave shape, and the metal terminal 16 of the socket side connection portion 15 of the socket 2 has a convex shape. By having, the concave-convex fitting structure may be configured.

The extraction slits 2d are formed on both sides of the socket 2 at substantially the middle position in the length direction. Square pillar portions 1m are formed on both side portions of the header body 1s so as to be located on both sides in the length direction of the extraction slit 2d. The end of the square column 1m overlaps the end of the extraction slit 2d. After the header 1 is fitted into the socket 2, it may be necessary to remove the header 1 from the socket 2 for some reason. By pushing up the square column 1m of the header body 1s, the header 1 can be easily and easily removed from the socket 2.

If the photoelectric conversion device is configured as in the above-described embodiment, the header-side connection portions 8 near the four corners of the header body 1s isolated from the housing recess 1c in the header body 1s of the header 1 are connected to the socket side of the socket 2. The connecting portion 15 is fitted. As a result, the metal

wiring terminal portions

9 a and 9 b of the metal wiring portion 9 attached to the header side connection portion 8 are elastically fitted to and electrically connected to the metal terminals 16 of the socket side connection portion 15.

The header side connection portion 8 is isolated from the housing recess 1c in which the optical element 4 and the photoelectric conversion IC 5 are mounted. Therefore, even if the header side connection portion 8 is fitted to the socket side connection portion 15, excessive stress associated with the fitting does not act on the housing recess 1 c in the header body 1 s. Therefore, long-term reliability of the optical element 4, the photoelectric conversion IC 5, and the metal wiring part 9 is improved.

In particular, the header side connection portion 8 is formed only in the vicinity of the corner of the header body 1s, and is not formed in any place other than the vicinity of the corner (including the vicinity of the storage recess 1c). Therefore, even if the header-side connection portion 8 is fitted to the socket-side connection portion 15, the housing recess 1c in the header body 1s is hardly subjected to excessive stress associated with the fitting. Therefore, long-term reliability of the optical element 4, the photoelectric conversion IC 5, and the metal wiring part 9 is reliably improved.

Further, since the metal

wiring terminal portions

9a and 9b attached to the header side connection portion 8 are elastically fitted to the metal terminals 16 of the socket side connection portion 15, the metal

wiring terminal portions

9a and 9b are connected to the metal terminal 16. Can be inserted / removed with respect to each other, and a highly reliable fitting force can be maintained.

Furthermore, since the metal wiring portion 9 is formed with a wiring pattern made by metal plating, the header body 1s has an inner portion compared to a metal plate wiring pattern or a metal terminal as described in Patent Document 1. It is possible to increase the density and flexibility of the wiring and to facilitate the high-frequency design. That is, since the wiring in the header described in Patent Document 1 is a wiring pattern made of a metal plate, a metal terminal extending from the wiring pattern has a three-dimensional structure and is several μm to several tens μm. It is not easy to perform fine processing and design with high accuracy. Therefore, it is difficult to further increase the density of the wiring pattern, the degree of freedom of wiring is reduced, and high-frequency design is also difficult.

作製 By making the wiring pattern with hard pure gold plating, the wiring pattern is less likely to be corroded and the durability can be improved. Furthermore, if the wiring pattern is made of hard pure gold plating, it is possible to increase the wear resistance of the wiring pattern, and it is difficult to wear even if the number of times of inserting / removing the metal

wiring terminal portions

9a, 9b with respect to the metal terminal 16 increases. . That is, in high-speed transmission including the photoelectric conversion device, transmission signal delay becomes a problem. That is, if the number of insertions / extractions increases and the metal plating wears, transmission signal delays due to variations in contact resistance, making it difficult to achieve good transmission. Furthermore, if the wiring pattern is produced by pure gold plating, high reliability can be obtained for the joining of the photoelectric conversion IC 5.

Further, the header body 1s is fitted and held in a generally uniform manner in relation to the socket 2 by disposing the header side connection portions 8 at substantially equal positions near the four corners of the header body 1s. Can have power. For this reason, the header 1 is unlikely to be inadvertently detached from the socket 2.

Furthermore, since the optical element 4 and the photoelectric conversion IC 5 are mounted in the housing recess 1c that is recessed from the inner surface 1a of the header body 1s, it is possible to reduce the height of the photoelectric conversion device.

Further, when the sealing resin 11 for sealing the optical element 4 and the photoelectric conversion IC 5 is injected into the injection space S of the housing recess 1c of the header body 1s, the sealing is performed by the convex wall 1j. It is possible to prevent the resin 11 from flowing into the header side connection portion 8. Therefore, the optical element 4 and the photoelectric conversion IC 5 in the housing recess 1c can be easily sealed with the sealing resin 11, and the sealing workability is improved. Further, since the sealing resin 11 does not adhere to the metal

wiring terminal portions

9a and 9b of the header side connection portion 8, the connection reliability of the header side connection portion 8 is improved. Furthermore, a material suitable for the application can be widely selected as the sealing resin without worrying about the viscosity (fluidity) of the sealing resin 11.

Similarly, since the adhesive wall 12 of the optical fiber 6 can be prevented from flowing into the header side connection portion 8 by the convex wall portion 1j, it is bonded to the metal

wiring terminal portions

9a and 9b of the header side connection portion 8. The agent 12 does not adhere. Therefore, the connection reliability of the header side connection unit 8 is improved.

Further, the header body 1s is formed with a groove 1f or a hole for drawing the optical fiber 6 for optical transmission to the optical element 4 from the outside. Therefore, the optical fiber 6 can be fitted and positioned in the groove 1f or the hole of the header body 1s and fixed with the adhesive 12 or the like. Therefore, the fixing operation of the optical fiber 6 is facilitated, and the tensile strength of the optical fiber 6 can be improved. Further, by fitting the optical fiber 6 into the groove 1f or the hole, the photoelectric conversion device can be reduced in height.

FIG. 7A is a schematic side view of Modification 1 of the header 1. 7A, in place of the shield pattern 9d made of metal plating on the outer surface 1b of the header body 1s, the metal shield plate 20 is connected to the header body 1s on the outer surface 1b of the header body 1s. It is integrally molded (outsert mold).

With this configuration, the metal shield plate 20 is integrally formed with the header body 1s on the outer surface 1b of the header body 1s, so that the thickness of the header body 1s can be reduced while securing strength. The conversion device can be reduced in height. Further, the shielding effect is improved by connecting the metal shield plate 20 to GND (ground).

FIG. 7B is a schematic side view of Modification 2 of the header 1. In the modified example shown in FIG. 7B, a metal shield plate 21 is integrally formed (insert molded) inside the header body 1s instead of the shield pattern 9d made of metal plating on the outer surface 1b of the header body 1s. ing.

With this configuration, the metal shield plate 21 formed integrally with the header body 1s partitions the inner surface 1a side and the outer surface 1b side of the header body 1s, and the metal shield plate 21 is connected to GND (ground). . Thus, one surface (inner surface 1a) of the header body 1s is used as the photoelectric conversion high-frequency circuit 23 in which the optical element 4 and the photoelectric conversion IC 5 are arranged, and the other surface (outer surface 1b) of the header body 1s is used as the power circuit. 24 mag. This also prevents the photoelectric conversion high-frequency circuit 23 from being affected by noise from the power supply circuit 24 and the like. Further, impedance design for a high-speed transmission circuit in the metal wiring portions 9 on both sides of the header body 1s is facilitated. Furthermore, since each component can be mounted on both

surfaces

1a and 1b of the header body 1s, high-density mounting is possible.

The embodiment has been described as a unidirectional communication system as shown in FIG. That is, the optical element (light emitting element, for example, laser) 4 (A) of the photoelectric conversion device 25 (A) and the optical element (light receiving element, for example, photodiode) 4 (B) of the photoelectric conversion device 25 (B) that face each other. Are optically connected by the optical fiber 6. The electrical signal is converted into an optical signal by the photoelectric conversion IC (for example, laser driver) 5 (A) of one device 25 (A) and emitted from the optical element (light emitting element, for example, laser) 4 (A). Is done. The emitted light is transmitted through the optical fiber 6 (A) and is incident on the optical element (light receiving element, for example, photodiode) 4 (B) of the other device 25 (B), and the photoelectric conversion IC (for example, TIA). ANP) 5 (B) converts the optical signal into an electrical signal.

On the other hand, as a modification of the present invention, as shown in FIG. 8B, a bidirectional communication system can be configured by the photoelectric conversion devices 25 (A) and 25 (B). That is, in addition to the unidirectional communication system shown in FIG. 8A, the optical element (light emitting element, for example, laser) 4 (B ′) and the photoelectric conversion apparatus 25 (A) of the photoelectric conversion apparatus 25 (B). Optical elements (light receiving elements such as photodiodes) 4 (A ′) are optically connected by an optical fiber 6 (B). The electrical signal is converted into an optical signal by the photoelectric conversion IC (for example, laser driver) 5 (B ′) of one device 25 (B), and the optical element (light emitting element, for example, laser) 4 (B ′). It is emitted from. The emitted light is transmitted through the optical fiber 6 (B) and is incident on the optical element (light receiving element, eg, photodiode) 4 (A ′) of the other device 25 (A), and the photoelectric conversion IC (eg, TIA). LIA) 5 (A ′) converts the optical signal into an electrical signal.

DESCRIPTION OF SYMBOLS 1 Header

1a Inner surface

1b Outer surface 1c Storage recessed part 1f Groove

1j Convex wall

1s Header body 2 Socket

2a Inner surface

2b Outer surface

2s Socket body 4 Optical element 5 Optical fiber (light guide component)
8 Header side connection part 9

Metal wiring part

9a, 9b Metal wiring terminal part 11 Sealing resin 12 Adhesive 14 Shield cover 15 Socket side connection part 16

Metal terminal

20, 21 Metal shield plate S Injection space

Claims

A header body having a housing recess and a header side connection for housing the optical element and the photoelectric conversion IC;
A metal wiring terminal portion attached to the header side connection portion, and a metal wiring portion electrically connected to the optical element and the photoelectric conversion IC,
The header side connection part is formed in the vicinity of a corner isolated from the storage recess in the header body, and has a shape fitted to a socket side connection part of a socket facing the header side connection part,
The metal wiring terminal portion is elastically fitted to the metal terminal of the socket side connection portion and electrically connected to the metal terminal in a state where the header side connection portion is fitted to the socket side connection portion. Have the shape to be
Header for photoelectric conversion device.
The header for a photoelectric conversion device according to claim 1, wherein the header side connection portion is formed only in the vicinity of the corner and is not formed in a portion other than the vicinity of the corner.
3. The header for the photoelectric conversion device according to claim 1, wherein the header side connection portions are distributed and arranged at substantially equal positions near the corners of the header body.
The photoelectric conversion device header according to any one of claims 1 to 3, wherein the metal wiring portion has a wiring pattern made by metal plating.
5. The photoelectric conversion device header according to claim 4, wherein the metal plating is hard pure gold plating.
The storage recess is formed with a sealing resin injection space for sealing the optical element and the photoelectric conversion IC,
The photoelectric wall according to any one of claims 1 to 5, wherein a convex wall portion for preventing the sealing resin from flowing into the header side connection portion is formed in the vicinity of the header side connection portion. Header for conversion device.
The photoelectric conversion device header according to any one of claims 1 to 6, wherein the header body is formed with a groove or a hole for drawing a light guide component that transmits light to the optical element from the outside.
The photoelectric conversion device header according to any one of claims 1 to 7, wherein a metal shield plate is integrally formed with the header body on an outer surface of the header body.
The photoelectric conversion device header according to any one of claims 1 to 7, wherein a metal shield plate is integrally formed with the header body inside the header body.
The photoelectric conversion device header according to any one of claims 1 to 9,
A socket having the socket side connection portion having a shape that can be fitted to the header side connection portion of the header;
A photoelectric conversion device comprising: