WO2014067784A1 - Procédé de fabrication d'un module à del à corps de refroidissement - Google Patents

Procédé de fabrication d'un module à del à corps de refroidissement Download PDF

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Publication number
WO2014067784A1
WO2014067784A1 PCT/EP2013/071669 EP2013071669W WO2014067784A1 WO 2014067784 A1 WO2014067784 A1 WO 2014067784A1 EP 2013071669 W EP2013071669 W EP 2013071669W WO 2014067784 A1 WO2014067784 A1 WO 2014067784A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
heat sink
led
laser beam
directed
Prior art date
Application number
PCT/EP2013/071669
Other languages
German (de)
English (en)
Inventor
Georg Rosenbauer
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Priority to CN201380055616.2A priority Critical patent/CN104781940A/zh
Publication of WO2014067784A1 publication Critical patent/WO2014067784A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/323—Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Definitions

  • the present invention relates to a method for manufacturing an LED module with a heat sink.
  • LEDs light emitting diodes
  • the actual semiconductor device, the sogenann ⁇ th chip is equipped as standard with a "Package" (for example, ceramic, plastic or Metalllustma- material including solder pads, possibly phosphor layers for converting UV-radiation into light and possibly transparent lenses or optics from polycarbonate or Sili ⁇ kon).
  • the semiconductor device including package is referred to as a LED diode and associated material including a printed circuit board as Su-.
  • the board may for example consist of FR4, an epoxy resin-impregnated glass fiber mat material, or the circuit board may also include a metal ⁇ core board in.
  • a common circuit board can also be used for more than one LED diode.
  • known in the prior art also is the use of heat sinks for dissipating heat from the LED diode and the circuit board.
  • LEDs relatively good efficiencies Errei ⁇ chen, they produce waste heat anyway.
  • heatsinks can be complex three-dimensional structures have to dissipate the heat particularly well and radiate.
  • the boards are fastened with screws, attached, double-sided adhesive sheets or adhesives on the heat sink.
  • LED module The assembly of at least one LED diode, the board (or more than one board) and the heat sink, which is hereinafter referred to as LED module, can then be installed in un ⁇ ferent different devices, for example, in light sources such as So-called retro fitlampen, so LED bulbs, which correspond with their approximate design and its socket classic bulbs such as incandescent.
  • the LED modules can also be installed in complete luminaires.
  • the present invention is based on the problem of specifying an improved manufacturing method for a LED module with a heat sink.
  • the problem is solved by a method for producing an LED module in which a mechanical connection for producing or improving a heat coupling between a heat sink and a PCB carrying at least one LED is produced by laser welding, and by a correspondingly manufactured LED module itself.
  • the inventor has come to the conclusion that the Qualcomm ⁇ known connection methods are another costly in terms of the assembly of the heat sink and board and is not particularly suitable for machine automation ⁇ tion. He also stated that by local concentrated energy coupling with a laser and corresponding melting of material areas a very good mechanical connection between the heat sink and board can be produced. Laser welding can be relatively easily au ⁇ automate, because no separate components such as rivets, screws, double-sided adhesive films or adhesives must be handled, which can also be used that can be easily guided by laser movable mirrors or other optical elements and laser thus the spot weld can be easily and quickly localized.
  • the energy input can also be so short that the heat input for the LED module and in particular the LED diode itself is not a problem.
  • the heat sink and the board are directly connected during laser welding, the ie means without the interposition of an intermediate part.
  • material parts of the heat sink and material parts of the board merge with each other during laser welding.
  • This does not necessarily exclude a solder, as long as material parts of the heat sink and the board are melted with and mixed with each other.
  • an immediate welding oh ⁇ ne additional solder is provided.
  • fusible materials can be welded by laser welding, ie, for example, also thermoplastics, or materials with a fusible fraction, that is, for example, reinforced plastics with thermoplastic binder or thermoplastic matrix.
  • a metal core board could be welded with plastic coating with a plastic ⁇ heat sink, which owes its thermal conductivity, for example ⁇ thermally conductive fillers such as glass fibers or carbon additives.
  • metal ⁇ metallic material parts are fused together. That, metallic coatings, as well as "massive" component parts ⁇ or metal cores.
  • metal core boards are preferred.
  • the metal core can also be used for welding, for example, by having a non-metallic coating sufficiently thin, absent or removed at the appropriate location.
  • the metal core ensures a good thermal conductivity of the board, which indeed has a heat transport function between the LED diode and the heat sink.
  • Preferred materials of the metal core are aluminum including aluminum alloys and copper including copper alloys.
  • the heat sink preferably has a three-dimensional shape aligned with its function, so it is not simply a flat plate.
  • it may have ribs or otherwise be structured in three dimensions in favor of improved heat transport and / or heat radiation.
  • the board in turn is, as already mentioned, in direct ⁇ ter heat and power to the LED diode.
  • the board and the LED diode materials are provided only for the attachment and / or the heat transfer, for example, solder, adhesive or michleitmassen.
  • the LED diode and the board can also abut each other directly.
  • the laser beam is directed from the side to the board on which the LED is mounted on the board.
  • the laser beam is directed into an LED-free area, so for example with two mounted LED diodes between them. He then hits the board itself and the LED diodes are not or negligibly affected.
  • the laser beam From this side the board completely melts the board with respect to the depth (of course not in relation to the area, that is to say extending transversely to the thickness direction) and then also melts a part of the heat sink under the board in order to establish the welded connection.
  • a position of the board can be selected which is diluted or even specially diluted for this purpose (about 20% to 80%)
  • an edge of the board can be used, for example, an outer edge on which the heat sink is flush or laterally projecting something, or even the edge of a provided in the board for this purpose or other reasons hole , At this edge then the board can be melted and (by the laser beam itself or by the molten board material) a part of theharikör ⁇ pers.
  • the laser beam is directed from the opposite side to the heat sink.
  • the heat sink can in principle be completely penetrated, with heat sinks in many cases being so thick that it is particularly appropriate here to choose or produce a thinned spot.
  • the laser can also be directed from this side onto an edge of the heat sink at which the circuit board is flush or protrudes. For illustration, reference is made to the exemplary embodiments.
  • the laser welding according to the invention can also be combined with other measures with regard to the coupling between the board and the heat sink.
  • a contact material which conforms to the shape can be provided, which is thin (compared to its areal extent) and lies in-between.
  • This may be an adhesive or a thermally conductive material ("thermal interface material").
  • thermally conductive material improves the heat transfer in addition to the direct mechanical coupling (which in practice is associated with unavoidable air gaps).
  • pin fasteners may be provided.
  • this generic term refers to screws or rivets which act as fastening elements between the printed circuit board and the heat sink itself are previously known. It has been found that advantages can be achieved despite the laser welding with rivets or rivets according to the invention, for example because the number of laser welding points or lines can be reduced and a screw or rivet (perhaps only individually or in small numbers) for other reasons anyway makes sense, for example, to attach the entire LED module to a housing or to attach optical elements to the LED module. The same applies mutatis mutandis to other pin fasteners, such as locking pins or clamp mounting pins, the dowel-like terminals or can work with spreading elastic elements. These can in particular also consist of plastic.
  • Figures 1 to 11 each show a schematic sectional view in side perspective view of an invented LED module to illustrate the erfindungsge ⁇ MAESSEN manufacturing process, corresponding to a first to eighth embodiments.
  • Preferred Embodiment of the Invention Figure 1 shows the first embodiment.
  • the reference numeral 1 is a metal heat sink whose three-dimensional structure has cooling fins and is considerably more complex than drawn.
  • this structure is known as such and is also familiar to the person skilled in the art.
  • a board 2 is planar manner ⁇ sets, namely, a metal core board having an aluminum core ⁇ (a copper core would also be preferred) and an insulating coating, are printed on the electrical conductor tracks.
  • two LED diodes 3 are soldered, in a conventional manner.
  • the LED diodes 3 essentially consist of the soldered epitaxial substrate of a preceding epitaxy process, in which the actual active semiconductor layers of the LED are formed, and a package.
  • the heat sink in this case is an aluminum die cast alloy, but could also be rolled steel, aluminum, copper or other metal sheets that have been formed into a heat sink.
  • Typical wall thicknesses for diecast cooling bodies are 1 mm to 6 mm, for sheet metal cooling bodies 0.5 mm to 3 mm.
  • coatings come with an insulator on at least one side into consideration, ⁇ that the heat sink can be mounted isolated. Thermoforming processes are for reshaping particularly in Be ⁇ costume.
  • Die-cast alloy cooling bodies can also be injection-molded with plastic, in particular on the surface which does not touch the printed circuit board (pointing downward in FIG. 1).
  • a plastic coating of the board may provide an insulator on an aluminum base, typically 1.6 mm thick, onto which, for example, 35 ⁇ m thick copper layers for the tracks, a solder mask, and a solder resist (for reflow solder mounting of the LEDs) are deposited , Typical thicknesses of the metal core boards ⁇ between 0.4 mm and 3 mm.
  • the arrow in the center symbolizes a vertically downward laser beam 4 of an infrared laser, for example a pulsed Nd: YAG laser (wavelength 1.06 ym).
  • it may have a pulse energy of between 10 J and 100 J, in the present case about 40 J, with pulse widths of the order of 10 ms to 100 ms, for example 20 ms.
  • Typical pulse powers are between 1 kW and 9 kW, for example 2 kW.
  • the laser beam melts the metal core of the board 2, and the fusion penetrates through the board 2 to the metal or metal core of the heat sink 1.
  • the plastic coating of the board 2 is possibly damaged locally, but this is unproblematic in consideration of the ladder ⁇ web structure and of course the LEDs 3, because a suitable range can be selected.
  • metallic material constituents of the plate 2 and of the heat sink 1 mix and form a solid local mechanical bond after solidification.
  • the laser also includes other IR lasers, such as C02 lasers (10.6 ym) diode lasers, fiber lasers, disk lasers, or other solid-state lasers into consideration.
  • C02 lasers (10.6 ym) diode lasers such as fused lasers, fused lasers, or other fused lasers into consideration.
  • CW lasers non-pulsed (CW) lasers have proven their worth.
  • An advantage of this embodiment is that the laser beam impinges in the usual mounting direction, so the LED module does not have to be turned over or processed from below. As far as a certain particle contamination arises when the laser beam strikes, gravity does not direct it to the optics of the laser.
  • the welding points can in a simple manner on the circuit board 2 and the LEDs 3 adjusted (i.e. positio ⁇ defined) are.
  • scanner optics, mechanical shutter and / or movable workpiece holders also areal grid or distributions may be generated become.
  • the method is particularly suitable for thin circuit boards, although relatively high laser energies on the order of, for example, 40 J or more per pulse may be required. Associated with this, in comparison to other embodiments, larger quantities of smoke or scratches can occur on the LED lenses (not shown), for which reason appropriate precautions, for example a good suction, may be necessary. It is favorable if, in the area of the future laser welding connection 5, no solder resist is present in advance appropriate pollution of the atmosphere by the smoke to avoid. Due to the board thickness relatively large welding lenses occur, so that the number of welding spots can remain small. The achievable strength can certainly be comparable to previously known methods.
  • the process can also be improved by an inert gas purge to protect from a heat input betrof ⁇ fene areas from oxidation.
  • the LEDs 3 are themselves not jeopardized by the Kurzzeittechnik and Loka ⁇ le limit of the heat input, as long as they are not taken or will not work in its immediate neighborhood.
  • a depression 6 is provided in advance in the blank 2 in order to facilitate the welding connection at the point of impact of the laser beam 4.
  • the remaining thickness of the board 2 is significantly lower, for example by about 50%.
  • the third exemplary embodiment in FIG. 3 corresponds in part to the second embodiment; However, here is not only a recess in the board 2 vorgese ⁇ hen, but a hole. This hole can also be generated by a mechanical step in the Platinenferti ⁇ supply, for example by simply piercing, which is compared to the milling step even less problematic, because it does not have to pay attention to the depth.
  • the laser beam 4 is angled irradiated from above in order to meet an edge of thedekör ⁇ pers 1 can be melted together in the material regions of the board 2 and material regions. This is indicated in Fig. 3 by the welded joint 5.3. Due to the clear previous distinction of the hole against the ⁇ over the remaining board area in this embodiment, the risk of accidental separation of conductor tracks is particularly low. Through the di- rect welding on the interface between the board 2 and the heat sink 1 are created even compared to the second embodiment, particularly little Schmauch and we ⁇ nig spatters and is only a low laser energy necessary. Here, too, more spot welds are typically compared to the ⁇ ers th embodiment advisable. For example, as in the second embodiment, it may be between 3 and 10 spot welds, whereas in the first embodiment, typically 2 to 6 are preferred.
  • the outer edge of the board is the target of the laser beam 4.
  • the welded connection is to be kept particularly well out of the strip conductor area and it does not have to extend to the hole 7 ⁇ be targeted.
  • a little more welding points should be set than in the first embodiment, as ⁇ preferably between 3 and 10.
  • the LED module for example, rotated about a vertical axis be so that without changing the laser beam, the two drawn in Fig. 4 welding areas 5.4 can be made.
  • this embodiment is particularly suitable for the combination with an additional central attachment, for example, with the third embodiment or in kon ⁇ conventional form with a screw, rivet or a locking or clamping attachment pin.
  • a ⁇ adhesive material between board 2 and the heat sink 1 can be advisable (or a good heat-conducting material with good Haftei- characteristics) to avoid problems due to a bulge between board 2 and heat sink 1.
  • the fifth embodiment shown in FIG. 5 differs as well as the sixth, seventh and eighth embodiment of the first four exporting explained thereafter ⁇ approximately embodiments in that the laser beam 4 here from "below", ie from the board 2 side remote from the heat sink 1 is directed to the latter.
  • this variant is suitable for rather small material thickness of the heat sink 1, for example, in one embodiment from deep-drawn sheet metal.
  • a recess 8 was provided in the heat sink 1 from below, for example, by a milling process or by a corresponding shaping during die casting.
  • the seventh embodiment in Fig. 7 corresponds in an analogous manner to the third of Fig. 3, the heat sink 1 is thus pierced or more generally provided with egg ⁇ nem hole 9, which can be prepared, for example, by taking into account in die casting.
  • the corresponding welded connection 5.7 is very similar to the welded connection 5.3 from FIG. 3, although the remarks relating to the laser alignment "from below" apply to the fifth and sixth exemplary embodiments.
  • the last eighth exemplary embodiment in FIG. 8 corresponds to the fourth from FIG. 4, wherein, unlike FIG. 4, the printed circuit board 2 must protrude somewhat beyond the heat sink 1 (and not vice versa as in FIG. 4). At the edge in between a weld 5.8 is provided.
  • the comments on the fourth exemplary embodiment apply, taking into account the special features of working from below. In particular, this also applies to the risk ei ⁇ ner buckling and the particular suitability for combination with a mechanical connection "in the area" between board 2 and heat sink 1.
  • Adhesives In combination with the invention, however, their curing or drying times do not necessarily have to be a significant disadvantage for the production, because the mechanical connection between board 2 and Heatsink 1 can already be made by one or a few laser welding points.
  • the provided between board 2 and heat sink 1 adhesive can then harden during storage or at the latest during operation of the LED module and the elevated temperatures then occur, provide additional support and prevent buckling.
  • the adhesive may also bridge an air gap, thereby improving thermal contact. This is particularly true in view of occasionally unavoidable rather unevenness in the surfaces, especially in those of the heat sink 1.
  • thermal interface materials can be used, which either improve only the heat transfer or additionally adhesion-improving properties (such as adhesive with additional heat conduction additives).
  • a combination with mechanical fasteners such as screws or rivets is possible, which can be used advantageously for other connection ⁇ purposes, for example, for attachment of optical parts, Abdecklinsen or housing parts.
  • mechanical fasteners such as screws or rivets
  • rivets and specially shaped plastic fasteners that clamp in dowel-like ⁇ form or form-fitting (by spreading the elements) connect All these fasteners are basically previously known and therefore not shown in detail. An example is shown in FIG.
  • FIGS. 10 and 11 Two further examples are shown in FIGS. 10 and 11 with an adhesive connection 11 between the heat sink 1 and the circuit board 2, on the one hand in FIG. 10 in combination with welded connections 5. 4 as in FIG. 4 and in FIG. 11 in connection with a welded connection 5. 8 according to FIG. 8.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un module de DEL, selon lequel un assemblage par soudure au laser (5.1) est obtenu entre un corps de refroidissement (1) et une platine (2) portant au moins une DEL (3).
PCT/EP2013/071669 2012-10-30 2013-10-16 Procédé de fabrication d'un module à del à corps de refroidissement WO2014067784A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380055616.2A CN104781940A (zh) 2012-10-30 2013-10-16 用于制造具有冷却体的led模块的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012219879.2 2012-10-30
DE102012219879.2A DE102012219879A1 (de) 2012-10-30 2012-10-30 Verfahren zum Herstellen eines LED-Moduls mit Kühlkörper

Publications (1)

Publication Number Publication Date
WO2014067784A1 true WO2014067784A1 (fr) 2014-05-08

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Application Number Title Priority Date Filing Date
PCT/EP2013/071669 WO2014067784A1 (fr) 2012-10-30 2013-10-16 Procédé de fabrication d'un module à del à corps de refroidissement

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DE (1) DE102012219879A1 (fr)
WO (1) WO2014067784A1 (fr)

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