WO2014067250A1

WO2014067250A1 - Element clamping device and control method therefor

Info

Publication number: WO2014067250A1
Application number: PCT/CN2013/072941
Authority: WO
Inventors: 苏建华; 乔红; 董继武; 张宇仁
Original assignee: 中国科学院自动化研究所
Priority date: 2012-10-31
Filing date: 2013-03-20
Publication date: 2014-05-08
Also published as: CN102879881A; CN102879881B

Abstract

An element clamping device, comprising: a clamping frame (1), a pressure acquisition unit (2) and a control unit (4).The clamping frame (1) is used for applying a clamping force to a clamped element (6) so as to fix same, and comprises: a support frame (11);n clamping element drivers (141, 142, 143, 144, 145, 146, 147, 148) respectively fixed to the outside of the support frame (11);and n elastic clamping elements (131, 132, 133, 134, 135, 136, 137, 138) respectively installed on the corresponding clamping element driver (141, 142, 143, 144, 145, 146, 147, 148), with each front end thereof passing through a corresponding hole in the support frame (11) and abutting against the clamped element (6).The pressure acquisition unit (2) is used for acquiring the value of the clamping force applied to the clamped element (6) by the elastic clamping elements (131, 132, 133, 134, 135, 136, 137, 138) in the clamping frame (1), and inputting same into the control unit (4).The control unit (4) is used for controlling the n clamping element drivers (141, 142, 143, 144, 145, 146, 147, 148).By means of the element clamping device and the control method therefor, the location of a clamping point and the applied clamping force can be adjusted according to the expected amount of deformation of the element (6), thereby reducing the deformation of the optical element (6).

Description

Component clamping device and control method thereof

The present invention relates to the field of automatic control, and in particular to a component clamping device and a control method thereof. Background technique

In high-power solid-state laser systems, the optical components are mounted in a supporting metal frame with a fixed support around them, and the supporting metal frame is mounted to the system's mounting bracket. With the continuous development of high-power solid-state laser technology, higher requirements have been placed on the power and beam quality of solid-state lasers, and the size of optical components used to amplify the energy of laser light paths has also increased.

The increase in the size of the optical component places higher demands on the clamping method during use: On the one hand, the clamping force needs to be able to balance the gravity of the optical component itself and the disturbing power during installation, avoiding the optical component from supporting On the other hand, during the operation of the high-power laser, the optical component is thermally deformed due to the influence of the laser irradiation, and the clamping force needs to ensure the effective support of the optical component in the case of thermal deformation. Among them, the thermal deformation includes three parts such as deformation caused by thermal expansion of the material in the axial direction by thermal expansion, thermal stress caused by temperature change, and deformation due to the free expansion restriction of the supporting metal frame to the optical element.

Research on optical component clamping methods and devices has attracted the attention of many technicians. Reference 1 (Chinese invention patent: application number 01273469.1) A frame for a mirror in a laser cavity mirror and a light guiding system is proposed. The laser mirror is located in the frame and is fixed by a pressing screw to press the screw head It is a conical head with a small taper shape. Three holes are made on the side of the laser mirror. The hole is ground with the same taper as the conical head of the compression screw. The compression screws are fixed from the corresponding fixing holes of the laser mirror on the frame. Laser mirror. Reference 2 (U.S. Patent No. 4,763,991) discloses an optical element holding mechanism. The optical component clamping mechanism adopts a three-point support mode, and each support point clamps the optical component by a locking mechanism, and the three locking mechanisms can adjust the position and posture of the optical component by linkage.

However, in the process of implementing the present invention, the Applicant has found that the existing component clamping method has the following drawbacks: (1) in the process of mounting the optical component to the supporting metal frame or when carrying the supporting metal frame on which the optical component is mounted Due to the installation and handling of vibrations, the fixed position of the plastic nails and the fixed point load are difficult to balance or cancel the disturbance power: The large clamping force will generate residual micro stress inside the optical component; Small, the optical component may deviate from the original position. (2) The existing clamping method cannot change the position of the nip point and the clamping force applied to the optical element according to the change of the working environment temperature and humidity of the optical component, and also causes the optical component to Deformation. Summary of the invention

(1) Technical problems to be solved

In view of the above problems, the present invention provides an element holding device and a control method thereof for automatically adjusting the position of the nip point and the applied clamping force.

(ii) Technical solutions

According to an aspect of the invention, an optical component holding device is provided, comprising: a clamping frame, a pressure collecting unit, and a control unit. a clamping frame for applying a clamping force to the clamped component to fix the clamped component, comprising: a support frame; “a clamp drive driver, respectively fixed on the outside of the support frame; “one elastic clamp, respectively Mounted on the corresponding clamp drive, the front end of which passes through the corresponding hole in the support frame and presses against the clamped component. The pressure collecting unit is configured to collect a clamping force value applied by the elastic clamping member in the clamping frame to the clamped component, and input the clamping force value to the control unit. a control unit, configured to control n clamping member drivers, comprising: a clamping calculation module, configured to select, from the one elastic clamping member, t elastic clips that need to apply a clamping force according to a preset deformation amount of the component Holding member and clamping force value respectively required to be applied, wherein tn; output driving module for respectively controlling the corresponding clamping member drivers of the t elastic clamping members that need to apply the clamping force with corresponding clamping force values The clamping element exerts a clamping force.

According to another aspect of the present invention, a method for controlling a component holding device for controlling the component clamping device described above is performed by the clamping calculation module, including: obtaining an operating environment by offline experiment Training data set of temperature and humidity, clamping position and its force, component deformation amount; using the support vector machine regression algorithm, using the training data set, obtaining the deformation amount of the clamped component and the clamping force value of each elastic clamping member Regression function model; and according to the deformation amount of a given clamped component, using the regression function model, select t elastic clips that need to apply clamping force from each elastic gripper and respectively need to be applied The clamping force value.

(3) Beneficial effects

As can be seen from the above technical solution, the component holding device of the present invention and the control method thereof have the following beneficial effects:

(1) adjusting the position of the nip point and the applied clamping force according to the desired amount of deformation of the component, Thereby reducing the deformation of the optical element;

(2) Adjust the position of the nip point and the clamping force according to the expected deformation amount of the component and the temperature/humidity of the working environment, thereby avoiding damage to the optical component and maintaining the clamping under different working environment temperatures and working environment humidity conditions. The reliability of the device. DRAWINGS

1 is a schematic structural view of a component holding device according to an embodiment of the present invention;

2 is a schematic structural view of a clamping frame in the component clamping device shown in FIG. 1;

3 is a working principle diagram of a pressure collecting unit in the component holding device shown in FIG. 1. FIG. 4 is a working principle diagram of a temperature and humidity collecting unit in the component holding device shown in FIG. 1. FIG. Schematic diagram of the structure of the control unit 4 in the holding device;

6 is a flow chart of a method for controlling a component clamping device according to an embodiment of the present invention;

Fig. 7 is a detailed flow chart of step C in the method of controlling the component holding device shown in Fig. 6. detailed description

The present invention will be described in detail below with reference to the specific embodiments of the invention and the accompanying drawings.

It should be noted that in the drawings or the description of the specification, the same reference numerals are used for similar or identical parts. Implementations not shown or described in the figures are in the form known to those of ordinary skill in the art. In addition, although an example of a parameter containing a particular value may be provided herein, it should be understood that the parameter need not be exactly equal to the corresponding value, but may approximate the corresponding value within an acceptable error tolerance or design constraint. In addition, the directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only referring to the directions of the drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

The component holding device and the control method thereof according to the present invention can automatically adjust the position of the nip point and the applied clamping force according to the desired deformation rate of the component, the temperature/humidity of the working environment, and the deformation amount of the component is not larger than the desired deformation amount. For ease of understanding, the components involved in the component holding device of the present invention are first listed as follows:

1- clamping frame; 2-pressure collecting unit;

3-temperature humidity acquisition unit; 4-control unit;

5-drive unit; 6-optical component;

11 - support frame; 22 - pressure information processing board; 221-pressure board MCU; 222-pressure signal conditioning circuit; 223-communication circuit; 31-temperature and humidity sensor; 32-temperature board MCU; 33-temperature board communication circuit; 41-control computer; 42-communication circuit; Drive module; 411-clamping calculation module;

131, 132, 133, 134, 135, 136, 137,

141, 142, 143, 144, 145, 146, 147,

211, 212, 213, 214, 215, 216, 217,

In an exemplary embodiment of the invention, an element holding device for holding an optical element is provided. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a component holding device according to an embodiment of the present invention. As shown in Fig. 1, the component holding device of this embodiment comprises: a clamping frame 1, a pressure collecting unit 2, a temperature and humidity collecting unit 3, a control unit 4, and a driving unit 5. The clamping frame 1 is used to fix the clamped optical component 6. The pressure collecting unit 2 collects the value of the clamping force applied to the optical element 6 by the holding frame, and inputs the value of the clamping force into the control unit 4. The temperature and humidity collecting unit 5 is configured to collect the temperature value and the humidity value near the clamping frame 1, and input the temperature value and the humidity value to the control unit 4. The control unit 4 is configured to calculate the clamping force that should be applied to the clamping frame 1 according to the predetermined deformation amount, the temperature value and the humidity value of the preset optical component, and then control the driving unit 5 to act to drive the clamping frame 1 to be applied. Holding force.

The respective components of the component holding device of this embodiment will be described in detail below. Figure 2 is a schematic view showing the structure of a holding frame in the component holding device shown in Figure 1. Referring to FIG. 2 , the clamping frame 1 includes: a support frame 11 , plastic nails 131 , 132 , 133 , 134 , 135 , 136 , 137 , 138 , plastic nail drivers 141 , 142 , 143 , 144 , 145 , 146 , 147 , 148. The length of the 8 nails is the same as the outer diameter. On the support frame 11, there is a circular hole corresponding to the position of each plastic nail, and the inner diameter of the circular hole is slightly larger than the outer diameter of the plastic nail. Eight plastic staple drivers 14 are fixed to the outside of the support frame. Eight plastic nails are respectively mounted on the eight nail drive drivers, for example, the nails 131 are mounted on the staple drive 141. Driven by the glue driver, the glue nail can apply a clamping force to the optical element by telescopic movement.

In this embodiment, the glue driver 141 or the like can select a servo cylinder, and by adjusting the telescopic length of the servo cylinder rod, the telescopic movement of the rubber nail is driven to apply a clamping force to the optical element. In other embodiments of the present invention, the glue nails may be replaced by spring leaf holding members, and the nail driver may also be a servo motor or the like. The number of glue and staple drivers can be adjusted as needed. It is not limited to eight in this embodiment.

Fig. 3 is a schematic view showing the operation of the pressure collecting unit in the component holding device shown in Fig. 1. Referring to Fig. 3, the pressure collecting unit 2 includes: 8 strain gauge pressure sensors 211, 212, 213, 214, 215, 216, 217, 218 and a pressure information processing board 22. 8 strain gauge pressure sensors are respectively mounted on 8 plastic nails 131, 132, 133, 134, 135, 136, 137, 138 and 8 staple drive 141, 142, 143, 144, 145, 146, 147, 148 Connection. The signal output terminals of the eight strain gauge pressure sensors are connected to the input of the pressure information processing board 22. The pressure information processing board 22 includes a pressure plate microcomputer 221, a pressure signal conditioning circuit 222, and a communication circuit 223. The pressure signal conditioning circuit 222 can adopt a resistor-capacitor filter circuit. The main purpose is to perform noise conditioning, amplification and filtering on the input pressure sensor signal to obtain a conditioned pressure signal. The conditioned pressure signal is input to the pressure plate microcontroller 221 . The pressure plate MCU 221 uses the digital filtering method to process the conditioned pressure signal to obtain the pressure values collected by the eight strain gauge pressure sensors. The communication circuit can transmit 8 pressure values obtained by the pressure plate MCU 221 to the control unit 4 by RS485 serial communication.

Referring to FIG. 4, FIG. 4 is a working principle diagram of the temperature and humidity collecting unit 3 in the component clamping device shown in FIG. The temperature/humidity collecting unit 3 includes a temperature/humidity sensor 31, a temperature/humidity board unit 32, and a temperature/humidity board communication circuit 33. The temperature/humidity sensor 31 detects the working environment temperature and the ambient humidity parameter in real time, and converts the analog quantity and the digital quantity converter in the sensor chip into corresponding binary values and stores them in the RAM of the chip, and the temperature/humidity board single chip 32 transmits and reads by reading. Take the temperature and humidity sensor temperature and humidity command code, the temperature and humidity sensor will return the corresponding temperature value or humidity value. The temperature/humidity board communication circuit 33 uses RS485 serial communication to transmit the working environment temperature value and humidity value obtained by the temperature single chip 32 to the control unit 4.

Please refer to FIG. 5. FIG. 5 is a schematic structural view of the control unit 4 in the component clamping device shown in FIG. The control unit 4 includes: a control computer 41, a communication circuit 42, and an output drive module 43. The control computer 41 can select an industrial control computer, the communication circuit can select a RS485 serial circuit, and the output drive module 43 can select a proportional flow valve or a hydraulic valve. A grip calculation module 411 is stored in the control computer 41. The clamping calculation module 411 receives the pressure value input by the pressure collecting unit 2 through the RS485 communication circuit 42, and the temperature value and the humidity value input by the temperature and humidity collecting unit 3, according to the preset deformation amount of the optical component, from the elastic clip Selecting t elastic clamping members that need to apply a clamping force and clamping force values respectively required to be applied, wherein tn; The proportional flow valve of the output drive module 43 respectively controls the servo cylinders corresponding to the t glues that need to apply the clamping force to apply a clamping force to the clamped optical elements with corresponding clamping force values.

So far, the component holding device of this embodiment has been introduced.

Based on the component clamping device of the above embodiment, the present invention also provides a control method, which is executed by a clamping calculation module in the control computer 41. As shown in FIG. 6, the control method includes: Step A, offline Experiment, obtaining a training data set, each training data in the training data set includes information such as working environment temperature and humidity, clamping position and clamping force thereof, deformation amount of the clamped optical element, and the like;

In the step A, the experimental data obtained by the offline experiment, the working environment temperature and humidity, the clamping position and the clamping force, the amount of deformation of the clamped optical element, etc., S ₂ , S ₃ , S ₄ , the training data acquisition step is :

Sub-step A1: Under the condition that the working environment temperature is Ί\ and the working environment humidity is Mi, the driving glue pins 131, 133, 135 and 137 are extended, and the position of the glue nail is P _{1 ()} , P ₃₀ , P ₅ o, P ₇ o indicates that the applied clamping forces are F _1Q , F _3Q , F _5Q , F _{7Q , respectively} . Measuring the amount of deformation of the clamped optical element is Yi o Recording the first set of data for S corpse (Xj, Y _x , Tj , Mj ), where X corpse (Ρ ₁₍₎ , Ρ ₃₀ ,

?50 ' ?70 ' Fl0 , F ₃ 0 ' F50 ' F ₇ o ) ;

Sub-step A2: Under the condition that the working environment temperature is T ₂ and the working environment humidity is Μ ₂ , the driving glue pins 132, 134, 136 and 138 are extended, and the positions of the glue nails are respectively Ρ _{2 ()} , Ρ ₄₀ , Ρ ₆ ο, Pso indicates that the applied clamping force is F _2Q , F _4Q , F _6Q , F ₈₀ o , respectively, and the amount of deformation of the clamped optical element is Y ₂ . Record the second set of data as S ₂ = (Χ ₂ , Υ ₂ , Τ ₂ , Μ ₂ ), where Χ ₂ = (Ρ ₂₀ ,

?40 ' ? 60 ' ? 80 ' F ₂ o, F ₄ o, F60, Fgo ;

Sub-step A3: Under the condition that the working environment temperature is T ₃ and the working environment humidity is M ₃ , the driving glue nails 131, 133, 135 and 137 are extended, and the positions of the rubber nails are respectively Ρ _{1 ()} , Ρ ₃₀ , Ρ ₅ ο, Ρ ₇ ο indicates; the applied clamping force is F„, F ₃₁ , F ₅₁ , F _{71. The} amount of deformation of the clamped optical element is measured as Y ₃ . The third set of data is recorded as S ₃ = ( , Y ₃ , Τ ₃ , Μ ₃ ), where Χ ₃ = (Ρ ₁₀ , Ρ ₃₀ ,

?50 ' ?70 ' Fll , F-71 ) ;

Sub-step 4: Under the condition that the working environment temperature is Τ ₄ and the working environment humidity is Μ4, the driving glue pins 132, 134, 136 and 138 are extended, and the positions of the glue nails are respectively P _2Q , P _4Q , P ₆₀ , P ₈ o indicates; the applied clamping force is F ₂₁ , F ₄₁ , F ₆₁ , F ₈₁ . The amount of deformation of the held optical element is measured as Y ₄ . Record the second set of data as S ₄ = (Χ ₄ , Υ ₄ , Τ ₄ , Μ ₄ ), where Χ ₄ = (Ρ ₂₀ , ?40'?60'?80', F41, F611 Fsi).

The above S ₂ , S ₃ , and S _{4 are} the _four training data of the obtained training data set. Of course, the training data in the training data set can also be more groups, and the manner of obtaining is the same, and will not be repeated.

Step B: Using a support vector machine (SVM) regression algorithm, using the training data set, obtaining a regression function model between the deformation amount of the clamped optical component and the working environment temperature value, the humidity value, and the clamping force value;

Wherein, in step B, according to the support vector machine (SVM) regression algorithm, the deformation amount of the clamped optical element is obtained by training data Si, S ₂ , S ₃ , S ₄ ; position and clamping of the clamping point The force variable x, the regression function model x), is calculated as:

: =1, 2, 3, 4, take 0.5, etc. less than 1

1

b = --(ω\(Χ _Γ + A) , where iy*,( _r + 3⁄4> represents the inner product of and ( _r + X _s )

And .* can be found by:

j 4 4 4 4

α, ^α 2 _{/ = 1} = li = lj = l where, in the equation, s takes 0.5.

Χ^ΠΧ denotes any two support vectors in X, (i=l, 2, 3, 4), that is, the correspondence and "satisfaction: _r , a > 0 Fig. 7 is a flow chart showing a step C in the method of controlling the component holding device shown in Fig. 6. As shown in FIG. 7, the embodiment C includes:

Sub-step C1: receiving the working environment temperature T and the working environment humidity M obtained by the temperature and humidity collecting unit 3, according to the regression function model x), calculating the out-of-line (<8) position as Ρ^. When the nail is applied and the clamping force F^., ^, the deformation amount of the optical element is less than the desired deformation amount I, that is, r < i, the position of the output glue pin P^.A and its clamping force F^^ F^ Otherwise, step C2 is performed;

Sub-step C2: The initial value of j is taken as 1, the j- ^studded nail (<8) in the retracted position, the plastic stud with the extended position of ^Pra ₊₁ (^ ^{+1 ≤ 8} ), and the clamping force is applied. F _ra+1 , according to the regression function / (x), offline calculation when the working environment temperature is T, the humidity is M, the optical deformation amount Γ, if Γ <, the output glue nail position Ρ _1; ..., P, P ₊ i, P _ra , P _ra+ i and clamping force F _1; ... , F _y-1 , F _y+1 , F _ra , F _ra+1 ; If Υ'> Υ > Υ _τ , execute 歩Step C3; otherwise, add 1 and repeat step C2;

Sub-step C3: The j-th glue in which the retracted position is, that is, only m-1 positions are applied as Ρ^., Ρ, Ρ^, Ρ^^ and the clamping force is applied F^.A^F^ F ^ then the regression function D, calculated off when the operating temperature is T, the working environment humidity Μ, the optical deformation amount ', _if' <Υ τ, the output of plastic nail position Ρ ^, Ρ ^,? _∞ and The clamping force F , ..., F _J+1 , _Fra; if '>; Γ >; Γ _γ , force 卩 1, w minus 1, repeat step C3.

Of course, in this embodiment, it is also possible that the clamping force applied by a certain elastic clamping member is zero, that is, the elastic clamping member does not apply a clamping force, which is also within the protection scope of the present invention.

Heretofore, the component holding device of the present embodiment has been described in detail with reference to the accompanying drawings. From the description of the above embodiments, those skilled in the art should have a clear understanding of the component holding device of the present invention.

It should be noted that the above definitions of the various components are not limited to the specific structures or shapes mentioned in the embodiments, and those skilled in the art can simply and well replace them, for example: Other elastic elements, such as in the form of spring leaf holders; other precision elements, as well as other precision elements, can also employ the apparatus and method of the present invention.

In summary, the component clamping device of the present invention is suitable for optical devices such as solid-state lasers, optical telescopes, or other devices, and can automatically adjust the position of the nip point and the applied clip according to the desired deformation rate of the component, the temperature/humidity of the working environment. With force, the deformation of the component is not greater than the desired deformation, which ensures the reliability and accuracy of the working state of the clamped component. The specific embodiments of the present invention have been described in detail with reference to the preferred embodiments of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

Rights request

A component clamping device, comprising:

a clamping frame for applying a clamping force to the clamped component to fix the clamped component, comprising: a support frame;

«A clamp drive, fixed to the outside of the support frame;

«A plurality of elastic clamping members are respectively mounted on the corresponding clamping member drivers, and the front end thereof passes through a corresponding hole in the supporting frame and is pressed against the clamped member;

a pressure collecting unit, configured to collect a clamping force value applied by the elastic clamping member in the clamping frame to the clamped component, and input the clamping force value to the control unit;

a control unit, configured to control the “clamp drive”, comprising:

a clamping calculation module, configured to select, according to a preset desired deformation amount of the component, t elastic clamping members that need to apply a clamping force from the “elastic clamping members” and clamping force values respectively required to be applied, wherein Tn;

An output driving module for respectively controlling t elastic clamping members that need to apply a clamping force. A corresponding clamping member driver applies a clamping force to the clamped component with a corresponding clamping force value.

2. The component holding device according to claim 1, wherein:

The component clamping device further includes: a temperature/humidity collecting unit configured to collect temperature values and humidity values of the working environment of the clamping frame, and input the temperature value and the humidity value to the control unit;

The clamping calculation module is configured to select t to apply a clamping force from the “elastic clamping members” according to a preset component desired deformation amount, a temperature value collected by the temperature and humidity collecting unit, and a humidity value. The elastic clamping members and the clamping force values that need to be applied respectively.

The component holding device according to claim 1 or 2, wherein the gripper driver is a servo cylinder or a servo motor.

The component holding device according to claim 1 or 2, wherein the elastic holding member is a plastic nail or a spring piece holding member.

The component holding device according to claim 1 or 2, wherein the output drive module is a proportional flow valve or a hydraulic valve.

The component holding device according to claim 1 or 2, wherein the pressure collecting unit comprises:

«A pressure sensor, wherein the zth pressure sensor is mounted on the zth elastic clamp The connection point of the first ι gripper driver;

a pressure information processing board, connected to the signal output ends of the n pressure sensors, for converting n pressure sensing signals acquired by the n pressure sensors into corresponding clamping force values, and transmitting to the control unit.

The component holding device according to claim 1 or 2, wherein the member to be clamped is an optical component.

8. A method of controlling a component holding device for controlling the component holding device according to claim 1 or 2, comprising:

Step A, through the offline experiment, obtain a training data set including the working environment temperature and humidity, the clamping position and its force, and the deformation amount of the component;

Step B, using a support vector machine regression algorithm, using the training data set to obtain a regression function model between the deformation amount of the clamped component and the clamping force value of each elastic clamp;

Step C, according to a given amount of deformation of the clamped component, using the regression function model, selecting t elastic clips that need to apply a clamping force from the "elastic clips" and respectively need to be applied The clamping force value.

The control method according to claim 8, wherein the training data set includes a working environment temperature and a humidity value;

The step B includes: using a support vector machine regression algorithm, using a training data set to obtain a regression function model between the deformation amount of the clamped component, the working environment temperature and the humidity value, and the clamping force value;

The step C includes: selecting, according to a given component desired deformation amount, a working environment temperature, and a humidity value, from the “elastic clamping members, t elastic forces that need to apply a clamping force. The clamping members and the clamping force values that need to be applied respectively.

The control method according to claim 9, wherein in the step A, the first group of training data is obtained in the following manner:

Under the condition that the working environment temperature is T and the working environment humidity is the same, select the q positions which are respectively P;, ..., P. The elastic clamping members are extended, and the clamping force applied is respectively? ₁ ...^ _; The value Y of the measured component deformation amount, then, the group training data is S, = (X,, Y,, Τ, ·, Μ, ·), where X corpse (Ρ^, . , . , Ρ,, Fi, ... ^) , 2 ≤ q ≤ n.

The control method according to claim 10, wherein the step B package Includes:

Using the support vector machine regression algorithm to train the training data in the training data set, obtain the variable _y of the component deformation amount and the extended elastic clamping member and its clamping force variable 工作, working environment temperature variable and humidity The regression function between variables M), where the kernel function used by the support vector machine is defined as:

Where ζ=1,2,3,4, is a small positive real number, Ί represents the working environment temperature value, Μ _; · represents the working environment humidity value, X, represents the training data.

The control method according to claim 11, wherein the step C includes:

Sub-step C1: receiving the working environment temperature Τ and the working environment humidity 获得 obtained by the temperature and humidity collecting unit, according to the regression function model f, x), calculating the protruding nails of m positions Ρ^. Apply a clamping force? _{When 1} ... ^, if the expected deformation amount of the component is less than the desired deformation amount I, the position of the glue pin Pi, ...^ and its clamping force Fi, ..., ^ otherwise, the execution step C2 is performed. Where m<n;

Sub-step C2: The initial value is taken as 1, the retracted position is the 'studded nail, where <8, the protruding position is P _ra+1 , where ^+1≤8, and the clamping force F is applied. _Ra+1 , according to the regression function D, offline calculation when the working environment temperature is T, the humidity is Μ, the optical deformation amount Γ, if, the output glue nail position Ρ^, Ρ^, P _ra , P _ra+1 and clip Holding

F!,...^!^!^^! If >;r>i, execute step C3; no ij, _y plus 1, repeat step C2;

Sub-step C3: Retracting the position of the first nail, applying -1 position? ^,, , +^ P _ra glue nail and apply the clamping force F^.A^ ^F^, according to the regression function / ( ), offline calculation when the working environment temperature is T, the working environment humidity is M, the component is deformed Quantity ', if '< Υ _τ , the position of the output glue Ρ ^., Ρ , Ρ ^, ? _∞ and clamping force F ^.AF ^ F ^ If '> Υ > , plus 1, minus 1, repeat Execute step C3.