WO2014063350A1

WO2014063350A1 - Signal transmission device and electronic device

Info

Publication number: WO2014063350A1
Application number: PCT/CN2012/083580
Authority: WO
Inventors: 刘金水; 邓治高
Original assignee: 华为技术有限公司
Priority date: 2012-10-26
Filing date: 2012-10-26
Publication date: 2014-05-01
Also published as: CN103098317A; CN103098317B

Abstract

Provided are a signal transmission device and an electronic device. The signal transmission device comprises: a back panel and at least two connector combination groups. Each connector combination group comprises: at least one first connector on a first surface of the back panel and at least one second connector at a second surface of the back panel. The direction of each of the connector combination groups is: an overlapping area of a second connector in each connector combination group faces the direction of a non-overlapping area of the second connector, and the at least one first connector forms an array structure on the first surface of the back panel; if a first connector combination group and a second connector combination group in the at least two connector combination groups are adjacent connector combinations, the direction of the first connector combination group is opposite to the direction of the second connector combination group. The signal transmission device solves problems in a signal transmission device with a half-orthogonal architecture in the prior art.

Description

The present invention relates to the field of information technologies, and in particular, to a signal transmission device and an electronic device. Background technique

In the prior art, the Middle Plane (MP) in the signal transmission device of the orthogonal architecture can implement N Line Processing Units (LPUs) and M Switch Fabric Units (referred to as Switch Fabric Units, for short). The vertical interconnection of SFU), the signal transmission device of this orthogonal architecture can basically meet the electronic equipment that requires a small number of circuit boards (less than 12).

Specifically, the interconnection relationship between the vertically interconnected LPU and the SFU is implemented by orthogonal connectors on both sides of the backplane. In this case, the number of slots corresponding to the SFU on the backplane is not more than 12, to implement SFU. The number of slots is greater than 12, and the vertical interconnection between the LPU and the SFU needs to be maintained. The industry has begun to implement a signal transmission device using a semi-orthogonal architecture.

In the signal transmission device of the semi-orthogonal architecture, the MP has the following features: 1) having multiple LPU slots (the LPU slot includes at least one LPU connector), and the slots of all the LPUs are compatible, and the intermixing is supported. ; 2) There are multiple SFU slots (SFU slots include at least one

SFU connector), and all SFU slots are compatible and support mixed insertion; 3) Each LPU slot is spatially perpendicular to each SFU slot, and each LPU slot is only perpendicular to some SFU slots. Orthogonal.

However, the signal transmission apparatus of the above-described semi-orthogonal architecture has the following problems: The signal interconnection relationship between the LPU slot and the non-orthogonal SFU slot is confusing, which makes system resources waste. Summary of the invention

In view of this, the embodiments of the present invention provide a signal transmission device and an electronic device, which are used to solve the problem of waste of system resources caused by confusion of signal interconnection relationships in the prior art.

In a first aspect, an embodiment of the present invention provides a signal transmission apparatus, including: a backboard and at least two sets of connectors are combined;

Each of the at least two sets of connector combinations includes: at least one first connector on a first side of the backplane, and at least one second connector on a second side of the backplane The direction of each set of connector combinations is: a direction in which the coincident area of one of the second set of connector sets is toward a non-coincidence area of the second connector;

The at least one first connector forms a queue structure on the first side of the backplane, if the first set of connector combinations of the at least two sets of connector combinations and the second set of connectors are combined into adjacent connections In combination, the direction of the first set of connector combinations is opposite to the direction of the second set of connector combinations.

With reference to the first aspect, in a possible implementation, each set of connector combinations includes at least one sub-connector combination;

Each of the at least one sub-connector combination includes: a first connector on a first side of the backplane, and a second connector on a second side of the backplane, The pin of the coincident region of the first connector and the pin of the coincident region of the second connector are directly connected through the backplane.

In conjunction with the first possible implementation of the first aspect, in the second possible implementation, the number of the first connectors located on the first side of the backplane in each set of connector combinations The same number of second connectors as the second side of the backplane, and

In each of the sub-connector combinations, a pin of a coincident region of the second connector corresponds to a pin of a coincident region of the first connector;

In each of the sub-connector combinations, the number of pins of the non-coincident area of the second connector is the same as the number of pins of the non-coincident area of the first connector.

In combination with the first and second possible implementations of the first aspect, in a third possible implementation, in each of the sub-connector combinations, the structure of the first connector and the The second connector has the same structure.

In combination with the first aspect and the foregoing possible implementation manner, in a fourth possible implementation manner, the at least one second connector located on the second side of the backplane is distributed on different printed circuit board PCBs of the backplane In the layer.

In combination with the first, second, third, and fourth possible implementations of the first aspect, in a fifth possible implementation, in each of the sub-connector combinations, the One connection The device is a rectangular parallelepiped structure or a rectangular parallelepiped structure, and the second connector is a rectangular parallelepiped structure or a rectangular parallelepiped structure.

With reference to the first aspect and the foregoing possible implementation manner, in a sixth possible implementation manner, a pin of a non-coincident region of the first connector in the first group of connector combinations is connected to the second group The pins of the non-coincident area of the second connector in the combination are connected by the signal lines of the backplane, and all the signal lines are parallel.

In a second aspect, an embodiment of the present invention provides an electronic device, including: an LPU and an SFU, and the signal transmission device of any one of the foregoing, wherein the LPU is connected to at least one of a connector combination of the signal transmission device. Connector;

The SFU is coupled to at least one second connector of the connector combination of the signal transmission device to enable a signal on the LPU to communicate with a signal on the SFU through the signal transmission device.

In a first possible implementation of the second aspect, the LPU and the SFU are perpendicular or parallel.

In a second possible implementation manner of the second aspect, the number of the SFUs is greater than 12, or the number of the LPUs is greater than 12.

According to the above technical solution, in the signal transmission device and the electronic device of the embodiment of the present invention, the first connector in each set of connector combinations forms a queue structure on the first side of the backplane, and the first group of connectors are combined with When the second group of connectors is combined into an adjacent connector combination, the direction of the combination of the first group of connectors is opposite to the direction of the combination of the second group of connectors, so that the signal interconnection relationship can be simplified and simplified. There is a problem of wasted system resources caused by confusion of signal interconnection relationships in signal transmission devices of the semi-orthogonal architecture in the technology. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the technical solution of the present invention, a brief description of the drawings to be used in the embodiments will be briefly described below. It is obvious that the following drawings are only drawings of some embodiments of the present invention, Those skilled in the art can obtain other drawings which can also implement the technical solutions of the present invention according to the drawings without any creative labor.

1A to 1C are front views of a connector assembly in an embodiment of the present invention;

2A is a front elevational view of a sub-connector assembly in accordance with an embodiment of the present invention; 2B is a front elevational view of a first connector in accordance with an embodiment of the present invention;

2C is a front elevational view of a second connector in accordance with an embodiment of the present invention;

2D is a side elevational view showing a part of a structure of a signal transmission device according to an embodiment of the present invention; and FIG. 3A to FIG. 3D are front views of a signal transmission device according to an embodiment of the present invention;

Figure 4A is a side view of the signal transmission device shown in Figure 3A;

Fig. 4B is a side view of the signal transmission device shown in Fig. 3B. The technical solutions of the present invention will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the various embodiments described below are merely exemplary embodiments of the invention. Based on the following various embodiments of the present invention, those skilled in the art can obtain other technical features that can solve the technical problems of the present invention and achieve the technical effects of the present invention by equivalently transforming some or even all of the technical features without creative work. The various embodiments of the invention are apparent from the scope of the invention as disclosed.

1A to 1C are front elevational views showing a connector assembly in an embodiment of the present invention, wherein FIGS. 1A to 1C show connector combinations of different configurations, as shown in FIGS. 1A to 1C. The connector assembly in this embodiment includes at least one first connector 10 on the first side of the backplane 100 and at least one second connector 20 on the second side of the backplane 100.

It should be noted that the structure of the back sheet 100 is not shown in either of Figs. 1A and 1C, and the position of the back sheet 100 in the connector assembly is as shown in the side view shown in Fig. 2D.

As shown in FIG. 1A to FIG. 1C, at least one sub-connector combination (as shown in FIG. 2A) is included in any of the connector combinations, and each sub-connector combination includes: a first one located on the first side of the backplane 100. a connector, and a second connector on the second side of the backplane 100. The difference between the connector combinations shown in FIG. 1A to FIG. 1C is that the number of sub-connector combinations is different, and the connector combination shown in FIG. 1A includes four sub-connector combinations, and the connection shown in FIG. The combination of two sub-connectors is included in the combination, and the sub-connector combination is included in the connector combination shown in FIG. 1C.

In particular, in the connector assembly shown in FIGS. 1A-1C, the number of first connectors 10 on the first side of the backplane 100 and the number of second connectors 20 on the second side of the backplane 100 The amounts are the same, and each of the first connectors 10 includes a coincident region and a non-coincident region, and each of the second connectors 20 includes a coincident region and a non-coincident region.

The overlap region in this embodiment means: a region where the pin 1 1 ' of the first connector 10 and the pin 21' of the second connector 20 overlap. 2A, the area where the pin 1 1 ' of the first connector 10 is located (B area) is the overlapping area of the first connector 10, and the area where the pin 1 1 of the first connector 10 is located (area A) ) is a non-coincident area of the first connector 10;

The area where the pin 21' of the second connector 20 is located (C area) is the overlapping area of the second connector 20, and the area where the pin 21 of the second connector 20 is located (D area) is the second connector 20 Non-coincident area;

Wherein, the pin 11' of the B region of the first connector 10 coincides with the pin 21' of the C region of the second connector 20, that is, the pin 11' and the pin 21' pass through the backplane 100. The direct connection can be directly connected through holes (not shown) on the backplane 100, so that no signal line connection through the backplane is required. Of course, in practical applications, the pins 1 1 ' and the pins 21 ' can also be connected through signal lines on the backplane 100.

In this embodiment, the direction of the connector combination is defined, that is, the direction of the overlapping area of one of the second connectors 20 in the connector assembly is oriented toward the non-coincident area of the second connector 20, that is, each group of connectors. The direction of the combination. The orientation of the directional arrows in Figures 1A through 1C.

In addition, FIG. 2A shows a schematic structural view of a sub-connector assembly. As shown in FIG. 2A, the sub-connector assembly includes: a first connector 10 on a first side of the backplane 100 (shown in FIG. 2D). And a second connector 20 located on the second side of the backplane 100, the pin 11' of the overlapping area of the first connector 10 and the pin of the overlapping area of the second connector 20 are directly connected through the backplane 100 . The direction of any of the sub-connector combinations is the same as the direction in which the sub-connector combination is combined, that is, the coincident area of one of the sub-connector combinations is toward the non-coincident area of the second connector direction. In the sub-connector combination, the first connector 10 is connected to a Line Processing Unit (LPU), such as an electrical connection or an optical connection, and the second connector 20 and a Switch Fabric Unit (SFU) are referred to as a SFU. Connections, such as electrical connections or optical connections, are of course not limited to this.

Wherein, the direction of each sub-connector combination is: the direction of the coincident region C in the second connector 20 toward the non-coincident region D in the second connector 20. In most signal transmission devices, the connector combination includes two or more sub-connector combinations.

Specifically, a front view of the first connector 10 and the second connector 20 is shown in FIGS. 2B and 2C, respectively, and as shown in FIG. 2B, the first connector 10 includes: a plurality of pins arranged side by side, For example, pin 1 of zone A and pin 1 of zone B. The structure of the first connector 10 in this embodiment may be a rectangular parallelepiped structure or a rectangular parallelepiped structure. In addition, the plurality of first connectors 10 may constitute an LPU slot for carrying the LPU.

As shown in Fig. 2C, the second connector 20 includes a plurality of pins arranged side by side, such as pin 21' of the C zone and pin 21 of the D zone. The structure of the second connector 20 in this embodiment may be a square structure or a rectangular parallelepiped structure. In addition, the plurality of second connectors 20 may constitute an SFU slot for carrying the SFU.

The structures of the first connector 10 and the second connector 20 described above are similar to those of the existing first connector and second connector, and Figs. 2A and 2B are merely illustrative.

As shown in Fig. 2D, Fig. 2D shows a side view of the signal transmission device. As can be seen from the figure, the pin 11' of the first connector 10 and the pin 21' of the second connector 20 are vertical and positive. The signal of the LPU, and then the LPU, is directly transmitted through the backplane of the first connector to the pin 21' of the second connector via the backplane, without the need to pass the printed circuit board on the backplane (Printed Circuit Board, Referred to as PCB).

In a practical application, the B zone of the first connector 10 and the C zone of the second connector 20 may be directly communicated through the backplane, and in different connector combinations, the A zone and the second connection of the first connector 10 The D area of the device 20 requires PCB traces to achieve connectivity.

In the prior art, the LPU installed in the LPU slot needs to communicate with all other SFUs. Accordingly, the SFU installed in the SFU slot needs to communicate with all other LPU signals. Since the signal line traces on the backplane are confusing, the signal mapping relationship between the LPU and the SFU (ie, the signal interworking relationship) is also confusing, as shown in the following Table 1.

To this end, in order to avoid the problems in the prior art, the signal transmission device in this embodiment includes: a backboard and at least two sets of connector combinations;

The signal mapping relationship of the signal transmission device in this embodiment is simple and clear (as shown in Table 2 below), and the number of PCB layers of the backplane can be reduced, and the non-coincident area of the first connector and the non-coincidence area of the second connector are simultaneously made. The signal lines are not repeated, do not cross, and thus ensure the integrity of the signal (Single Integrality, referred to as SI).

In a preferred embodiment, each set of connector combinations includes at least one sub-connector combination; each of the at least one sub-connector combination includes: located on the backplane a first connector on one side, and a second connector on a second side of the backplane, a pin of a coincident area of the first connector and a pin of a coincident area of the second connector Directly connected through the back plate.

In another preferred embodiment, in each of the set of connector combinations, located on the back

Replacement page (Article 26) The number of first connectors on the first side of the board is the same as the number of second connectors on the second side of the back board, and

In each sub-connector combination, a pin of a coincident region of the second connector corresponds to a pin of a coincident region of the first connector;

In each sub-connector combination, the number of pins of the non-coincident area of the second connector is the same as the number of pins of the non-coincidence area of the first connector.

In a possible implementation manner, in each of the sub-connector combinations, the number of pins of the overlapping area in the second connector may be the same as the pin of the overlapping area of the first connector The number is not the same;

In each of the sub-connector combinations, the number of pins of the non-coincident area in the second connector may also be different from the number of pins of the non-coincident area of the first connector, which may be based on actual Need to set up.

Generally, in each of the sets of connector combinations, the structure of the first connector and the structure of the second connector may be the same, such as a rectangular parallelepiped structure or a rectangular parallelepiped structure. Of course, the structure of the first connector and the structure of the second connector may also be different, which are set according to actual needs.

According to the above embodiment, the first connector in each set of connector combinations forms a queue structure on the first surface of the backplane (refer to the drawings), and further When a set of connector combinations and a second set of connectors are combined into adjacent connector combinations, the direction of the first set of connector combinations and the direction of the second set of connector combinations are arranged oppositely, so that the signal mapping relationship is simple and clear. Therefore, the problem of the signal interconnection relationship between the LPU slot and the non-orthogonal SFU slot in the prior art is solved, and at the same time, the back signal transmission device in the semi-orthogonal architecture in the prior art can be solved. The board has many PCB layers and high cost, which makes SI unable to meet the problem.

As shown in FIG. 3A, FIG. 3B, FIG. 3C, and FIG. 3D, the signal transmission device includes: a backboard and a combination of two or more connectors;

Each set of connector combinations includes: at least one first connector 10 on a first side of the backplane 100, and at least one second connector 20 on a second side of the backplane 100; each set of connectors combined The direction is: a direction of the coincident region C of one of the second connector 20 of the connector assembly facing the non-coincident region D of the second connector 20;

At least one first connector 10 included in each set of connector combinations is on the backplane 100 One side forms a queue structure; if the first set of connector combinations 102 and the second set of connector combinations 103 are adjacent connector combinations, the direction of the first set of connector combinations 102 is opposite to the direction of the second set of connector combinations 103 .

In practical applications, the structure of the first connector and the structure of the second connector of each set of connector combinations may be the same. In addition, the first connector 10 of all the connector combinations shown in Figs. 3A to 3D forms a queue structure on the first side of the back plate 100.

Specifically, for each sub-connector combination, as shown in FIGS. 3A to 3D, the number of pins of the coincident area B area in the first connector 10 is the same as the number of pins of the non-overlapping area A area; the second connector The number of pins in the C-zone of the 20-coincidence zone is the same as the number of pins in the zone D of the non-coincident zone.

It can be understood that all the second connectors 20 on the second side of the backplane are distributed in different PCB layers of the backplane in practical applications.

That is, the second connector 20 corresponding to the different connector combinations can be located in different PCB layers on the backplane. For example, the second connector 20 of the first set of connector combinations may be located in the third layer PCB of the backplane, and the second connector 20 of the second set of connector combinations may be located in the second layer PCB of the backplane, The second connector 20 of the third set of connector combinations can be located in the first layer PCB of the backplane.

Of course, the above does not limit the position of the second connector, and all of the first connectors 10 in all connector combinations may be located in the same PCB layer or in different PCB layers, which are set according to actual needs.

In this embodiment, the non-coincident area of the non-coincident area A of the first connector 10 of the first set of connector assemblies 102 and the non-coincidence area of the second connector 20 of the second set of connector combinations 103 The pins 21 of the D zone are connected by the signal line 101 of the backplane 100, and all the signal lines are parallel.

In other embodiments, if one or more connector combinations, the structure of the first connector is different from the structure of the second connector, or the structure of all the first connectors may be different, and all the second connections may be different. The structure of the device may also be different. At this time, the pin 1 1 of the non-coincident area A of the first connector 10 of the first set of connector assemblies 102 and the second connector 20 of the second set of connector combinations 103 The pin 21 of the non-coincident area D is connected by the signal line 101 of the backplane 100, and all the signal lines do not intersect, and the signal lines may or may not be parallel, but All signal lines are not crossed.

In this embodiment, the directions of the adjacent connector combinations are reversed, so that the signal interconnection relationship can be simplified and simplified, thereby solving the problem of the signal interconnection relationship in the signal transmission device of the semi-orthogonal architecture in the prior art. It is ensured that the PCB traces of the pins in the A and D regions in different connector combinations do not cross and reduce the number of PCB layers in the backplane. Specifically, the above PCB traces are shown in both FIG. 3A and FIG. 3B. As can be seen from the figure, the above PCB traces are no longer crossed. The signal mapping relationship in this embodiment is as shown in Table 2 below.

It should be noted that, in this embodiment, the connector combination has a direction. As shown in FIG. 1A, the direction of the connector in this embodiment is that the coincident area of one of the second connectors in the connector combination faces non-coincidence. The direction of the area. That is, in the second connector, the direction of the C zone toward the D zone, or the direction of the B zone toward the A zone in the first connector.

Table II

The signal transmission device in this embodiment can reduce the number of PCB layers of the backplane, and at the same time, more first connectors and second connectors can be disposed on the backplane, that is, the signals in this embodiment. The transmission device can achieve the target of more than 12 LPU slots, and can achieve the targets of more than 12 SFU slots.

Figure 3A shows a front view of two LPU slots and two SFU slots distributed on the backplane. Figure 3B shows that two SFU slots and four LPU slots are distributed on the backplane. Figure 3C shows a front view of four SFU slots and four LPU slots distributed on the backplane; Figure 3D shows four SFU slots and six LPU slots. A front view distributed over the backplane.

10 Replacement page (Article 26) Accordingly, Fig. 4A shows a side view of the above Fig. 3A, and Fig. 4B shows a side view of Fig. 3B.

The signal transmission device in the foregoing embodiment can overcome the problem that the signal mapping relationship of the circuit board LPU to the SFU in the signal transmission device of the semi-orthogonal architecture in the prior art is disordered, and at the same time reduce the number of PCB layers in the backplane, and optimize the present There are PCB traces in the technology to reduce the number of PCB layers in the MP and reduce the MP cost. Thereby, it is possible to improve the SL of the signal transmitted in the signal transmission device

According to another aspect of the present invention, the present invention further provides an electronic device, comprising: an LPU and an SFU, and a signal transmission device according to any of the embodiments of the present invention, wherein the LPU is connected to a connector combination of the signal transmission device At least one first connector;

In the present embodiment, the LPU and the SFU are vertical or parallel, as shown in Figures 3A to 3D above.

In particular, the number of SFUs in this embodiment may be greater than or equal to 12, or the number of the LPUs may be greater than or equal to 12.

The above electronic device can satisfy the SI characteristic of a high speed signal and can reduce the cost of the electronic device.

It should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

claims

1. A signal transmission device, characterized in that it includes:

Backplane and at least two sets of connector combinations;

Each of the at least two sets of connector combinations includes: at least one first connector located on the first side of the backplane, and at least one second connector located on the second side of the backplane. , the direction of each set of connector combinations is: the direction in which the overlapping area of a second connector in each set of connector combinations faces the non-overlapping area of the second connector;

The at least one first connector forms a queue structure on the first side of the backplane, if the first group of connector combinations and the second group of connector combinations in the at least two groups of connector combinations are adjacent connections. connector combination, then the direction of the first set of connector combinations is opposite to the direction of the second set of connector combinations.

2. The device according to claim 1, characterized in that each set of connector combinations includes at least one sub-connector combination;

Each sub-connector combination in the at least one sub-connector combination includes: a first connector located on the first side of the backplane, and a second connector located on the second side of the backplane, so The pins in the overlapping area of the first connector and the pins in the overlapping area of the second connector are directly connected through the backplane.

3. The device according to claim 2, wherein in each set of connector combinations, the number of first connectors located on the first side of the backplane is equal to the number of first connectors located on the second side of the backplane. the same number of second connectors, and

In each of the sub-connector combinations, the pins in the overlapping area of the second connector correspond to the pins in the overlapping area of the first connector;

In each of the sub-connector combinations, the number of pins in the non-overlapping area of the second connector is the same as the number of pins in the non-overlapping area of the first connector.

4. The device according to any one of claims 2 to 3, characterized in that, in each of the sub-connector combinations, the structure of the first connector and the structure of the second connector are the same.

5. The device according to any one of claims 1 to 4, characterized in that at least one second connector located on the second side of the backplane is distributed in different printed circuit board (PCB) layers of the backplane.

6. The device according to any one of claims 2 to 5, characterized in that, in each of the In the sub-connector combination, the first connector has a cuboid structure or a cube structure, and the second connector has a cuboid structure or a cube structure.

7. The device according to any one of claims 1 to 6, characterized in that, the pins in the non-overlapping area of the first connector in the first set of connector combinations are the same as those in the second set of connector combinations. The pins of the non-overlapping areas of the second connector are connected through the signal lines of the backplane, and all the signal lines are parallel.

8. An electronic device, including: a line processing unit LPU and a switching scheduling unit SFU, characterized in that it further includes: the signal transmission device according to any one of claims 1 to 7, the LPU connected to the signal transmission device at least one first connector in the connector combination;

The SFU is connected to at least one second connector in the connector combination of the signal transmission device; the signal on the LPU and the signal on the SFU communicate through the signal transmission device.

9. The electronic device according to claim 8, wherein the LPU and the SFU are perpendicular or parallel.

10. The electronic device according to claim 8 or 9, wherein the number of SFUs is greater than 12, or the number of LPUs is greater than 12.