WO2022242190A1 - Electronic assembly, switch, and computer system - Google Patents

Electronic assembly, switch, and computer system Download PDF

Info

Publication number
WO2022242190A1
WO2022242190A1 PCT/CN2021/143783 CN2021143783W WO2022242190A1 WO 2022242190 A1 WO2022242190 A1 WO 2022242190A1 CN 2021143783 W CN2021143783 W CN 2021143783W WO 2022242190 A1 WO2022242190 A1 WO 2022242190A1
Authority
WO
WIPO (PCT)
Prior art keywords
port
signal
chip
ports
electronic component
Prior art date
Application number
PCT/CN2021/143783
Other languages
French (fr)
Chinese (zh)
Inventor
高俊恩
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2022242190A1 publication Critical patent/WO2022242190A1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6467Means for preventing cross-talk by cross-over of signal conductors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L49/00Packet switching elements
    • H04L49/10Packet switching elements characterised by the switching fabric construction
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L49/00Packet switching elements
    • H04L49/10Packet switching elements characterised by the switching fabric construction
    • H04L49/111Switch interfaces, e.g. port details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L49/00Packet switching elements
    • H04L49/30Peripheral units, e.g. input or output ports
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/10Exchange station construction
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure

Definitions

  • the present application relates to the technical field of computer equipment, in particular to an electronic component, a switch and a computer system.
  • Servers and switches are IT equipment commonly used in the field of Internet Technology (IT). Among them, the server is mainly used for data calculation and storage.
  • the switch is used to realize the transmission and exchange of data between different devices. According to different network locations, switches can be classified into access switches and aggregation switches. in.
  • the aggregation switch can be understood as the upper-level switch of the access switch.
  • the access switch includes an uplink port and a downlink port.
  • the uplink port is used to connect to an upper-level switch, such as the aggregation switch mentioned above; the downlink port is used to connect to a network interface of a server to transmit data of the server.
  • a switching board of a switch includes a circuit board, a chip and a signal port.
  • the topology of the switch board is fixed and cannot be configured flexibly.
  • the application scenarios of the switch board are severely limited.
  • the present application provides an electronic component, a switch, and a computer system, so as to realize flexible networking and enrich application scenarios of the electronic component.
  • the present application provides an electronic component for flexible networking, and the electronic component includes a chip, a signal cable and a plurality of signal ports.
  • the above-mentioned chip includes a plurality of chip ports, and the chip ports are connected with pins of the chip.
  • the above signal cable includes a first end and a second end. The first end of the signal cable is plugged into at least one chip port of the multiple chip ports, and the second end of the signal cable is plugged into at least one signal port of the multiple signal ports. That is to say, the signal cable is connected with the chip port and the signal port, so as to realize signal transmission.
  • the above-mentioned signal cable is plugged into the signal port and the chip port, so it can be plugged and pulled out at any time to replace the connected signal port and chip port, and to replace the signal transmission path.
  • the networking of electronic components can be changed, and the networking flexibility is high.
  • this solution can avoid the problem of cross traces on the circuit board, reduce the number of layers of the circuit board, and reduce costs.
  • the above-mentioned plurality of signal ports may include a first signal port and a second signal port
  • the chip port may include a first chip port and a second chip port.
  • the first end of the signal cable is plugged into the port of the first chip without any change, and only the signal port to which the second end is plugged is changed to form different signal transmission paths.
  • the first end of the signal cable can also be plugged into the second chip port, and the second end of the signal cable can be plugged into the first signal port, then when the electronic component is working, a third signal transmission can be formed. path.
  • a fourth signal transmission path can be formed when the electronic component is working.
  • the first signal transmission path, the second signal transmission path, the third signal transmission path and the fourth signal transmission path are different. Different signal transmission paths form different networking. Therefore, this solution can flexibly configure the networking of electronic components.
  • the first end portion of the above-mentioned signal cable includes one or at least two ports, and the above-mentioned second end portion includes one or at least two ports. That is to say, the signal cable can be connected to multiple signal ports and/or to multiple chip ports at the same time.
  • the number of signal ports connected to both ends of the signal cable may be the same as or different from the number of chip ports, which is not limited in this application.
  • the cable may have multiple ports, thereby reducing the number of cables and reducing the space occupied by the cables.
  • a plurality of signal ports may be separately arranged on the first side and the second side of the chip, and the first side and the second side are adjacent to or away from each other.
  • the signal ports are more scattered.
  • the area occupied by the signal ports is relatively large.
  • the signal ports can be arranged on both sides, and the occupied areas can be overlapped, thereby facilitating the miniaturization of electronic components.
  • using the signal cable to configure the signal transmission path can make the signal port and the opposite device to be connected on the same side when the signal port is connected to the opposite device, which facilitates the connection with the opposite device.
  • the above-mentioned signal port includes an uplink port and a downlink port
  • the downlink port can be arranged on the first side of the above-mentioned chip
  • the uplink port can be arranged on the second two sides of the above-mentioned chip. In this way, it is convenient for the electronic components to connect with different peer devices by using the uplink port and the downlink port respectively.
  • the chip can be arranged on a circuit board, the chip port is also arranged on the circuit board, and the chip port is connected to the pins of the chip through the circuit board.
  • the above-mentioned chip port can also be arranged on the body of the chip, so as to facilitate the modularization of the chip and the preparation of the electronic components in the technical solution of the present application.
  • the electronic assembly may further include a first circuit board and a second circuit board, the chip is arranged on the first circuit board, and the signal port is arranged on the second circuit board.
  • the above-mentioned first circuit board and the second circuit board can be connected by a fixing member, or fixed to the casing respectively, so as to realize mutual fixing.
  • the position of the second circuit board can be set according to the connection requirements of the signal port, so as to facilitate the connection between the signal port and the connection port of the peer device.
  • the above-mentioned signal ports may also be disposed on the fixing plate, which is not limited in this application.
  • the number of chips included in the electronic component is not limited, and may include one chip, or may include at least two chips, and each of the above chips has a chip port. That is to say, the electronic component has one chip or multiple chips, which is not limited in the present application.
  • the present application further provides a switch, which includes a housing and the electronic component in any of the above technical solutions, and the electronic component is arranged in the housing.
  • networking can be flexibly configured according to requirements.
  • it is also beneficial to improve the miniaturization degree of the switch.
  • the present application further provides a computer system, the computer system including a cabinet and the electronic component in the above first aspect, and the electronic component is arranged in the cabinet.
  • the electronic components of the computer system in this solution can be flexibly configured and networked according to requirements. When the network configuration of the computer system needs to be changed, the signal transmission path of the electronic components can be changed through cables, and the network configuration can be changed without replacing the electronic components, which has high efficiency and low cost.
  • the above computer system further includes a peer device, which is also arranged in the cabinet, and the peer device includes a connection port, and the connection port is connected to a signal port for signal transmission.
  • the above computer system further includes a backplane.
  • the connection port is located at the end of the peer device facing the back of the cabinet; the signal port and the connection port at the end of the electronic component facing the back of the cabinet are connected through the backplane.
  • the above-mentioned electronic component is an access switching board
  • the peer device is a server.
  • the signal port connected to the switch board includes a first downlink port, and the first downlink port is connected to the connection port through the backplane.
  • the specific type of the server is not limited, for example, it may be a computing server, a storage server, a heterogeneous server, an interface server, and the like.
  • the above-mentioned electronic components are access switching boards
  • the peer device is a convergence switching board.
  • the signal port includes a first uplink port
  • the connection port of the aggregation switch board includes a second downlink port
  • the first uplink port and the second downlink port are connected through a backplane.
  • the above-mentioned backplane has a high-speed connector, and the signal port and the connection port are respectively connected to the high-speed connector.
  • the connection mode of the backplane, the signal port and the connection port is relatively simple and less prone to errors.
  • the backplane may be a cable backplane, a circuit board backplane, or an optical backplane.
  • the type and structure of the backplane can be designed according to the requirements of the computer system.
  • FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application
  • Fig. 2 is another schematic structural diagram of the electronic component in the embodiment of the present application.
  • FIG. 3 is another schematic structural view of an electronic component in an embodiment of the present application.
  • FIG. 4 is another schematic structural view of an electronic component in an embodiment of the present application.
  • Fig. 5 is another schematic structural diagram of the electronic component in the embodiment of the present application.
  • FIG. 6 is another schematic structural diagram of an electronic component in an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a switch in an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a computer system in an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a backplane in an embodiment of the present application.
  • a chip is an important component of IT equipment. During its working process, it usually needs to be connected to a signal port to realize signal transmission with other equipment.
  • the above-mentioned chip can be installed in an electronic component.
  • the connection relationship between the chip and the signal port is fixed, so the signal transmission path is fixed, that is, the topological networking of the electronic component is fixed, and it is impossible to flexibly network according to actual needs. If a different network needs to be replaced, the electronic components need to be replaced.
  • the present application provides an electronic component for flexible networking, as well as a switch and a computer system with the electronic component.
  • FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application.
  • the electronic component 1 includes a chip 11 , a signal cable 12 and a plurality of signal ports 13 .
  • the above-mentioned chip 11 includes a plurality of chip ports 111 , and the chip ports 111 are connected to the pins of the chip 11 .
  • the signal cable 12 is connected between the chip port 111 and the signal port 13 .
  • the signal port 13 is connected to the chip port 111 , and on the other hand, it is used to connect to the opposite device, so as to realize the connection between the electronic component 1 and the opposite device.
  • the signal cable 12 includes a first end and a second end, the first end is plugged into at least one chip port 111 of the plurality of chip ports 111, and the second end is connected to the plurality of signal ports 13 At least one of the signal ports 13 is plugged in.
  • the signal cable 12 is respectively plugged into the chip port 111 and the signal port 13, and the signal cable 12 can be connected to a certain chip port 111 and signal port 13 according to the requirement to form a certain signal transmission path, and then form a Certain networking configurations.
  • the signal cable 12 can be unplugged from the chip port 111; or the signal cable 12 can be unplugged from the signal port 13; or the signal cable 12 can be unplugged from the chip port 111, and the The signal cable 12 is disconnected from the signal cable 1 . Then, according to requirements, reconnect the signal port 13 and the chip port 111 to form other signal transmission paths, thereby forming different networking configurations. That is to say, the electronic component 1 in the technical solution of the present application uses the signal cable 12 to connect the chip port 111 and the signal port 13, so that the signal transmission path can be replaced according to actual needs to replace the networking configuration. Therefore, this solution can realize flexible networking, which is conducive to enriching the application scenarios of the electronic component 1 and reducing the cost of electronic equipment. In addition, this solution does not need to use a circuit board to realize the connection between the chip port 111 and the signal port 13, so there will be no problem of wire crossing, and the number of layers of the circuit board can be reduced.
  • the connection mode of the chip port and the signal port can be flexibly changed to form different networking and adapt to different working scenarios.
  • the above-mentioned plurality of signal ports 13 may include a first signal port and a second signal port, and the chip port 111 includes a first chip port and a second chip port.
  • the first signal can be formed. transfer path.
  • the second end of the signal cable 12 is plugged into the second signal port, then when the electronic component 1 is working, a second signal can be formed. transfer path.
  • the first end of the signal cable 12 is plugged into the first chip port, without any change, only the signal port 13 to which the second end is plugged is changed to form different signal transmission paths.
  • the first end of the signal cable 12 can also be plugged into the second chip port, and the second end of the signal cable 12 can be plugged into the first signal port, then when the electronic component 1 works, a second chip can be formed.
  • Three signal transmission paths When the first end of the signal cable 12 is plugged into the second chip port, and the second end of the signal cable 12 is plugged into the second signal port, then when the electronic component 1 is working, a fourth signal transmission can be formed. path.
  • the first signal transmission path, the second signal transmission path, the third signal transmission path and the fourth signal transmission path are different. Different signal transmission paths form different networking. Therefore, this solution can flexibly configure the networking of electronic components.
  • the electronic component 1 in the technical solution of the present application can be connected to different combinations of chip ports 111 and signal ports 13 through the plugging and unplugging of the signal cable 12 , so that the signal transmission path can be replaced. Therefore, this solution can flexibly form the network formed by the electronic components 1. When the network of electronic devices needs to be replaced, the signal transmission path can be changed by plugging and unplugging the cables, without replacing the electronic components 1, and the cost is low. In addition, this solution is beneficial to the preparation of standard parts of the electronic component 1 and reduces the production cost. There is no need to design the wiring of the electronic component 1 according to the actual requirement, and the user can use a cable to connect the chip port 111 and the signal port 13 of the electronic component 1 according to the requirement.
  • the above-mentioned electronic component 1 may include a chip 11 .
  • FIG. 2 is another schematic structural diagram of the electronic component in the embodiment of the present application. As shown in FIG. 2 , the above-mentioned electronic component 1 may also include two chips 11 or more chips 11 , and the application does not limit the number of chips 11 of the electronic component 1 .
  • FIG. 3 is another schematic structural diagram of an electronic component in an embodiment of the present application.
  • the number of ports included at both ends of the above-mentioned signal cable 12 is not limited, specifically, the first end of the above-mentioned signal cable 12 includes at least one port, for example, may include one port, two ports , four ports, or eight ports, etc., are not limited in this application.
  • the second end of the signal cable 12 includes at least one port, for example, may include one port, two ports, four ports, or eight ports, etc., which is not limited in this application.
  • the number of ports at both ends of the signal cable 12 may be the same or different, which is not limited in this application.
  • the first end of the signal cable 12 can have one port, and the second end has two ports; or the first end of the signal cable 12 has two ports, and the second end has one port; or The first end of the signal cable 12 has two ports, and the second end has four ports; or the first end of the signal cable 12 has four ports, and the second end has four ports. Not to list them all here.
  • one end of the signal transmission path can be connected to at least one chip port 111, which can be one or more, and the other end of the signal transmission path can be connected to at least one signal port 13, which can be One or more ports are not limited in this application, and the number of ports of the above-mentioned signal cable 12 can be designed according to actual needs.
  • a plurality of signal ports 13 can be separately arranged on both sides of the chip 11 .
  • the plurality of signal ports can be arranged on the first side and the second side of the chip, and the first side is adjacent to or away from the second side, that is to say, the above-mentioned plurality of signal ports are arranged on the adjacent side of the chip. Two of them, or separate the two sides away from the chip.
  • a part of the signal ports 13 in the plurality of signal ports 13 is arranged on the first side of the chip 11, and another part of the signal ports 13 is arranged on the second side of the chip 11.
  • the two sides are located on opposite sides of the chip 11 .
  • the connection port of the peer device to be connected is located on the same side as the signal port 13 of the electronic component 1 .
  • the signal line can be used Cable 12, so that the signal port 13 on the same side as the connection port of the peer device is connected to the set chip port 111, so as to facilitate the connection between the two.
  • the signal port 13 is located on both sides of the chip 11 , which is beneficial to reduce the space occupied by the signal port 13 on one side of the electronic component 1 .
  • the above-mentioned electronic component 1 may be a switch board, and the chip 11 is a switch chip.
  • the above-mentioned plurality of signal ports 13 can be uplink ports 131 and downlink ports 132 , and the above-mentioned uplink ports 131 and downlink ports 132 can be separately arranged on opposite sides of the chip 11 .
  • the uplink port 131 is disposed on the first side of the chip 11 of the electronic component 1
  • the downlink port 132 is disposed on the second side of the chip 11 of the electronic component 1 .
  • the above switch board may be an access switch board, the downlink port 132 of the access switch board may be used to connect to the server, and the uplink port 131 may be used to connect to the aggregation switch.
  • the downlink port 132 of the access switch board can be located on the same side as the connection port of the server, which facilitates the connection of the downlink port 132 of the access switch board with the connection port of the server.
  • the uplink port 131 of the access switch board can be connected to the connection port of the aggregation switch, so that the connection port of the aggregation switch and the above-mentioned uplink port 131 are on the same side, so that the uplink port 131 of the access switch board is connected to the connection port of the aggregation switch .
  • multiple signal ports of the electronic component can also be arranged on the same side of the chip and on the back side of the electronic component.
  • the above-mentioned back side may refer to the side where the connection port of the server is located, and the connection port of the above-mentioned aggregation switch is also located on the above-mentioned back side, so that the signal port of the electronic component is located on the same side as the connection port of the connected peer device, so that for signal connection.
  • the chip includes a plurality of chip ports, which means that the chip is connected with a plurality of chip ports, and signal transmission with the chip can be realized through the chip ports.
  • the chip port can also be arranged on the chip body.
  • the electronic component 1 may include a circuit board 14 , and the above-mentioned chip 11 is disposed on the circuit board 14 .
  • the chip port 111 may be arranged on the circuit board 14 and be connected to the chip 11 through the circuit board 14 for signal connection.
  • FIG. 5 is another schematic structural diagram of an electronic component in an embodiment of the present application.
  • the chip port 111 may also be provided on the chip 11 , that is, the chip 11 body is provided with the chip port 111 .
  • the chip port 111 is disposed on the body of the chip 11 , so the integration of the chip 11 is higher, which is beneficial to simplify the assembly of the electronic component 1 .
  • the present application does not limit the setting method of the chip port 111 .
  • FIG. 6 is another schematic structural diagram of the electronic component in the embodiment of the present application.
  • the electronic component 1 may further include a first circuit board 141 and a second circuit board 142 .
  • the aforementioned chip 11 and the chip port 111 are disposed on the first circuit board 141
  • the signal port 13 is disposed on the second circuit board 142 .
  • the above-mentioned first circuit board 141 and the second circuit board 142 may be fixed by a fixing member, or the first circuit board 141 and the second circuit board 142 are respectively fixed to structures such as a casing.
  • the signal port 13 is connected to the chip port 111 through a cable; on the other hand, the first circuit board 141 and the second circuit board 142 are not in an integral structure. Therefore, the position of the second circuit board 142 can be set according to the actual position requirements, so that the position of the signal port 13 can be reasonably set to facilitate the connection between the signal port 13 and the peer device.
  • the specific number of the second circuit board 142 is not limited. For example, as shown in FIG. 6 , each group of signal ports 13 corresponds to one second circuit board 142 .
  • the above-mentioned electronic assembly 1 may also include a first circuit board 141 and a fixing board, the above-mentioned chip 11 and the chip port 111 are arranged on the first circuit board 141, and the signal port 13 is arranged on the fixing board, and the fixing board can be used only in terms of structure
  • the fixed signal port 13 does not need to transmit electrical signals.
  • the above-mentioned first circuit board 141 and the fixing plate can be fixed by a fixing member, or the first circuit board 141 and the fixing plate are respectively fixed to structures such as a housing.
  • the signal port 13 is connected to the chip port 111 through a cable; on the other hand, the first circuit board 141 and the fixing board are not in an integral structure. Therefore, the position of the fixing plate can be set according to the actual position requirements, so that the position of the signal port 13 can be reasonably set to facilitate the connection between the signal port 13 and the opposite device.
  • the chip 11, the chip port 111 and the signal port 13 in the above-mentioned electronic component 1 can be arranged on the same circuit board, and the chip port 111 and the signal port 13 are electrically connected through the circuit board to improve the electronic component 1.
  • the density of the server with the electronic component 1 is increased.
  • FIG. 7 is a schematic structural diagram of a switch in an embodiment of the present application.
  • the switch 10 includes a casing 101 and the electronic component 1 in any of the above-mentioned technical solutions, and the electronic component 1 is arranged in the casing 101 .
  • the signal port 13 of the switch 10 can be connected to the chip port 111 of the chip 11 according to requirements, so as to configure the signals that can be transmitted in each signal port 13, and the flexibility is high.
  • the switch 10 includes a panel 1011, the panel 1011 can be located on the first side of the chip 11 of the electronic component 1, then the second side of the chip 11 is located on the side of the switch 10 away from the panel 1011, which can make the signal
  • the ports 13 are distributed on both sides of the switch 10 .
  • reducing the area occupied by the signal ports 13 on the panel 1011 is beneficial to improving the integration of the switch 10 .
  • the uplink port 131 of the switch 10 may be located on the side where the panel 1011 of the switch 10 is located, and is used for connecting with devices such as aggregation switches.
  • the downlink port 132 is located on the side of the switch 10 away from the panel 1011 , and is used for connecting with devices such as servers.
  • the connection port of the server is usually located on the back side, and the downlink port 132 of the switch 10 is located on the back side of the switch 10, and the distance between the downlink port 132 and the connection port is relatively close to facilitate connection.
  • FIG. 8 is a schematic structural diagram of a computer system in an embodiment of the present application.
  • the computer system 100 includes a cabinet 110 and the electronic component 1 in any of the above-mentioned embodiments, and the above-mentioned electronic component 1 is arranged in the cabinet 110 .
  • the electronic components 1 of the computer system 100 in this embodiment can configure signal transmission paths according to actual needs, and the networking flexibility is high. Therefore, the computer system 100 can also change the networking configuration more conveniently without replacing the electronic component 1 , which has high efficiency and low cost.
  • the above computer system 100 may further include a peer device 120 , and the peer device 120 may also be disposed in the cabinet 110 .
  • the aforementioned peer device 120 includes a connection port 121, which is connected to the signal port 13 for transmitting signals.
  • the specific type of the peer device 120 is not limited, and may be a server, such as a computing server, a storage server, a heterogeneous server, an interface server, and the like.
  • the peer device 120 may also be a device such as a switch, which is not limited in this application.
  • connection port 121 of the above-mentioned peer device 120 can be located at one end of the peer device 120 facing the back side 1101 of the cabinet 110, and the electronic component 1 has a signal port facing the end of the back side 1101 of the cabinet 110.
  • the port 13 , the above-mentioned signal port 13 and the connection port 121 can be connected through the backplane 130 .
  • the electronic component 1 and the peer device 120 are connected through the backplane 130 , which occupies less space, which is beneficial to reducing the space occupied by the computer system 100 and improving the integration of the computer system 100 .
  • This solution can also avoid connection errors caused by manual access.
  • there is no need to use structures such as cables to connect the signal port 13 and the connection port 121 which can reduce costs.
  • the backplane 130 can support signal transmission at different rates, without changing the type of cables according to the rate of transmission signals.
  • FIG. 9 is a schematic structural diagram of a backplane in an embodiment of the present application.
  • the above-mentioned backplane 130 may specifically be provided with a high-speed connector 1301.
  • the signal port 13 and the connection port 121 are respectively connected to the high-speed connector 1301 , so as to realize the connection between the signal port 13 and the connection port 121 .
  • Using the high-speed connector 1301 facilitates the connection between the signal port 13 and the connection port 121 , the operation is relatively simple, and the connection process is relatively reliable.
  • the above-mentioned electronic component 1 may be an access switch board, and the peer device 120 may be a server.
  • the above access switch board includes a first downlink port, the first downlink port is set on the side of the access switch board facing the back side 1101 of the cabinet 110, and the connection port 121 of the server is also set on the side facing the back side 1101 of the cabinet 110. side. Therefore, the access switch board and the server in the technical solution of the present application can use the backplane 130 to implement signal transmission.
  • the above-mentioned electronic component 1 is an access switch board
  • the peer device 120 is a convergence switch board.
  • the signal port 13 of the access switch board includes a first uplink port
  • the connection port 121 of the aggregation switch board includes a second downlink port.
  • the above-mentioned first uplink port is set on the side of the access switching board facing the back side 1101 of the cabinet 110
  • the second downlink port of the aggregation switching board is also set on the side facing the back side 1101 of the cabinet 110 . Therefore, the access switch board and aggregation switch in the technical solution of the present application can also use the backplane 130 to implement signal transmission.
  • the backplane 130 is a circuit board backplane, and the specific shape is a cross.
  • the shape of the circuit board backplane can be specifically set according to the distribution of the signal ports 13 and the connection ports 121 .
  • the specific shape of the backboard 130 is not limited.
  • the above-mentioned backplane 130 may also be a cable backplane or an optical backplane, which is not limited in this application.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Multi Processors (AREA)
  • Information Transfer Systems (AREA)

Abstract

The present application provides an electronic assembly, a switch, and a computer system. The electronic assembly comprises a chip, a signal cable, and a plurality of signal ports; the chip comprises a plurality of chip ports; the signal cable comprises a first end portion and a second end portion; and the first end portion of the signal cable is inserted into at least one of the plurality of chip ports, and the second end portion is inserted into at least one of the plurality of signal ports. The signal cable is connected to the chip ports and the signal ports, thereby achieving signal transmission. In addition, the signal cable is inserted into the signal ports and the chip ports, and therefore can inserted/retracted at any time so as to replace the signal port and the chip port that are connected to the signal cable, and change a signal transmission path, so that different networking configurations are realized, and the networking flexibility is high. In addition, compared with connecting the signal ports and the chip ports by means of circuit board wiring, the solution can reduce the complexity of the circuit board wiring, reduce the number of layers of the circuit board, and reduce the cost.

Description

电子组件、交换机及计算机系统Electronic components, switches and computer systems
相关申请的交叉引用Cross References to Related Applications
本申请要求在2021年05月17日提交中国专利局、申请号为202110536454.0、申请名称为“电子组件、交换机及计算机系统”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application with application number 202110536454.0 and application title "Electronic Components, Switches, and Computer Systems" filed with the China Patent Office on May 17, 2021, the entire contents of which are hereby incorporated by reference .
技术领域technical field
本申请涉及计算机设备技术领域,尤其涉及到一种电子组件、交换机及计算机系统。The present application relates to the technical field of computer equipment, in particular to an electronic component, a switch and a computer system.
背景技术Background technique
服务器和交换机是互联网技术(Internet Technology,IT)领域普遍使用的IT设备。其中,服务器主要用于数据计算以及存储等。交换机用于实现不同装置之间数据的传输交换。根据网络位置的不同,交换机可以分为接入交换机和汇聚交换机等类型。其中。汇聚交换机可以理解为接入交换机的上一级交换机。接入交换机包括上行端口和下行端口,上行端口用于与上一级交换机连接,例如上述汇聚交换机;下行端口用于与服务器的网络接口连接,以传输服务器的数据。Servers and switches are IT equipment commonly used in the field of Internet Technology (IT). Among them, the server is mainly used for data calculation and storage. The switch is used to realize the transmission and exchange of data between different devices. According to different network locations, switches can be classified into access switches and aggregation switches. in. The aggregation switch can be understood as the upper-level switch of the access switch. The access switch includes an uplink port and a downlink port. The uplink port is used to connect to an upper-level switch, such as the aggregation switch mentioned above; the downlink port is used to connect to a network interface of a server to transmit data of the server.
现有技术中,交换机的交换板包括电路板、芯片和信号端口。交换板的拓扑组网固定,不能进行灵活配置,交换板的应用场景受限较为严重。In the prior art, a switching board of a switch includes a circuit board, a chip and a signal port. The topology of the switch board is fixed and cannot be configured flexibly. The application scenarios of the switch board are severely limited.
发明内容Contents of the invention
本申请提供了一种电子组件、交换机及计算机系统,以实现灵活组网,丰富电子组件的应用场景。The present application provides an electronic component, a switch, and a computer system, so as to realize flexible networking and enrich application scenarios of the electronic component.
第一方面,本申请提供了一种灵活组网的电子组件,该电子组件包括芯片、信号线缆和多个信号端口。上述芯片包括多个芯片端口,芯片端口与芯片的引脚连接。上述信号线缆包括第一端部和第二端部。信号线缆的第一端部与多个芯片端口中的至少一个芯片端口插接,第二端部与多个信号端口中的至少一个信号端口插接。也就是说,信号线缆与芯片端口和信号端口连接,从而实现信号的传输。此外,上述信号线缆与信号端口和芯片端口插接,因此,可以随时进行插拔,以更换相连接的信号端口和芯片端口,以更换信号传输路径。通过更改芯片与信号端口之间的信号传输路经,可以更改电子组件的组网,组网灵活性较高。此外,与采用电路板走线连接信号端口和芯片端口对比,该方案可以避免电路板出现走线交叉的问题,可以减少电路板的层数,降低成本。In a first aspect, the present application provides an electronic component for flexible networking, and the electronic component includes a chip, a signal cable and a plurality of signal ports. The above-mentioned chip includes a plurality of chip ports, and the chip ports are connected with pins of the chip. The above signal cable includes a first end and a second end. The first end of the signal cable is plugged into at least one chip port of the multiple chip ports, and the second end of the signal cable is plugged into at least one signal port of the multiple signal ports. That is to say, the signal cable is connected with the chip port and the signal port, so as to realize signal transmission. In addition, the above-mentioned signal cable is plugged into the signal port and the chip port, so it can be plugged and pulled out at any time to replace the connected signal port and chip port, and to replace the signal transmission path. By changing the signal transmission path between the chip and the signal port, the networking of electronic components can be changed, and the networking flexibility is high. In addition, compared with connecting signal ports and chip ports with circuit board traces, this solution can avoid the problem of cross traces on the circuit board, reduce the number of layers of the circuit board, and reduce costs.
具体的,可以使得上述多个信号端口可以包括第一信号端口和第二信号端口,芯片端口包括第一芯片端口和第二芯片端口。当信号线缆的第一端部与上述第一芯片端口插接时,信号线缆的第二端部与第一信号端口插接,则当电子组件工作时,可以形成第一信号传输路径。当信号线缆的第一端部仍然与第一芯片端口插接时,信号线缆的第二端部与第二信号端口插接,则当电子组件工作时,可以形成第二信号传输路径。上述实施例以信号线缆的第一端部与第一芯片端口插接,不做改变,仅仅改变第二端部插接的信号端口,就可以 形成不同的信号传输路径。或者,还可以使得信号线缆的第一端部与第二芯片端口插接,信号线缆的第二端部与第一信号端口插接,则当电子组件工作时,可以形成第三信号传输路径。当信号线缆的第一端部与第二芯片端口插接时,信号线缆的第二端部与第二信号端口插接,则当电子组件工作时,可以形成第四信号传输路径。上述第一信号传输路径、第二信号传输路径、第三信号传输路径和第四信号传输路径不同。不同的信号传输路径,形成的组网也不同,因此,该方案可以灵活电子组件的组网配置。Specifically, the above-mentioned plurality of signal ports may include a first signal port and a second signal port, and the chip port may include a first chip port and a second chip port. When the first end of the signal cable is plugged into the first chip port, and the second end of the signal cable is plugged into the first signal port, the first signal transmission path can be formed when the electronic component is working. When the first end of the signal cable is still plugged into the first chip port, and the second end of the signal cable is plugged into the second signal port, a second signal transmission path can be formed when the electronic component is working. In the above embodiment, the first end of the signal cable is plugged into the port of the first chip without any change, and only the signal port to which the second end is plugged is changed to form different signal transmission paths. Alternatively, the first end of the signal cable can also be plugged into the second chip port, and the second end of the signal cable can be plugged into the first signal port, then when the electronic component is working, a third signal transmission can be formed. path. When the first end of the signal cable is plugged into the second chip port and the second end of the signal cable is plugged into the second signal port, a fourth signal transmission path can be formed when the electronic component is working. The first signal transmission path, the second signal transmission path, the third signal transmission path and the fourth signal transmission path are different. Different signal transmission paths form different networking. Therefore, this solution can flexibly configure the networking of electronic components.
具体设置上述信号线缆时,上述信号线缆的第一端部包括一个或者至少两个端口,上述第二端部包括一个或者至少两个端口。也就是说,信号线缆可以同时与多个信号端口连接,和/或与多个芯片端口连接。此外,上述信号线缆两端连接的信号端口的数量,和芯片端口的数量可以相同,也可以不同,本申请不做限制。该方案中,线缆可以具有多个端口,从而可以减少线缆的数量,减少线缆占用的空间。When the above-mentioned signal cable is specifically arranged, the first end portion of the above-mentioned signal cable includes one or at least two ports, and the above-mentioned second end portion includes one or at least two ports. That is to say, the signal cable can be connected to multiple signal ports and/or to multiple chip ports at the same time. In addition, the number of signal ports connected to both ends of the signal cable may be the same as or different from the number of chip ports, which is not limited in this application. In this solution, the cable may have multiple ports, thereby reducing the number of cables and reducing the space occupied by the cables.
具体设置上述电子组件的信号端口时,可以使得多个信号端口分设于芯片的第一侧和第二侧,该第一侧和第二侧相邻或者相背离。与现有技术中,所有的信号端口均设置于芯片的同一侧相比,信号端口设置的较为分散。当多有的信号端口均设置于芯片的同一侧时,上述信号端口占用的面积较多。本申请技术方案中,信号端口可以设置于两侧,占用的面积可以重叠,从而有利于实现电子组件的小型化。此外,利用信号线缆来配置信号传输路径,可以使得信号端口与对端设备连接时,信号端口与需要连接的对端设备设置于同一侧,便于与对端设备进行连接。When specifically setting up the signal ports of the above-mentioned electronic components, a plurality of signal ports may be separately arranged on the first side and the second side of the chip, and the first side and the second side are adjacent to or away from each other. Compared with the prior art, where all the signal ports are arranged on the same side of the chip, the signal ports are more scattered. When all the signal ports are arranged on the same side of the chip, the area occupied by the signal ports is relatively large. In the technical solution of the present application, the signal ports can be arranged on both sides, and the occupied areas can be overlapped, thereby facilitating the miniaturization of electronic components. In addition, using the signal cable to configure the signal transmission path can make the signal port and the opposite device to be connected on the same side when the signal port is connected to the opposite device, which facilitates the connection with the opposite device.
具体的,上述信号端口包括上行端口和下行端口,下行端口可以设置于上述芯片的第一侧,上行端口可以设置于上述芯片的第二两侧。从而便于电子组件利用上行端口和下行端口分别与不同的对端设备连接。Specifically, the above-mentioned signal port includes an uplink port and a downlink port, the downlink port can be arranged on the first side of the above-mentioned chip, and the uplink port can be arranged on the second two sides of the above-mentioned chip. In this way, it is convenient for the electronic components to connect with different peer devices by using the uplink port and the downlink port respectively.
具体设置上述芯片时,芯片可以设置于电路板,芯片端口也设置于电路板,芯片端口通过电路板与芯片的引脚连接。或者,还可以使得上述芯片端口设置于芯片的本体,从而便于实现芯片的模块化,便于制备本申请技术方案中的电子组件。When the above-mentioned chip is specifically arranged, the chip can be arranged on a circuit board, the chip port is also arranged on the circuit board, and the chip port is connected to the pins of the chip through the circuit board. Alternatively, the above-mentioned chip port can also be arranged on the body of the chip, so as to facilitate the modularization of the chip and the preparation of the electronic components in the technical solution of the present application.
电子组件还可以包括第一电路板和第二电路板,上述芯片设置于第一电路板,信号端口设置于第二电路板。上述第一电路板和第二电路板可以通过固定件连接,或者分别固定于壳体,以实现相互固定。该方案中,可以根据信号端口的连接需求,来设置第二电路板的位置,以便于信号端口与对端设备的连接端口连接。The electronic assembly may further include a first circuit board and a second circuit board, the chip is arranged on the first circuit board, and the signal port is arranged on the second circuit board. The above-mentioned first circuit board and the second circuit board can be connected by a fixing member, or fixed to the casing respectively, so as to realize mutual fixing. In this solution, the position of the second circuit board can be set according to the connection requirements of the signal port, so as to facilitate the connection between the signal port and the connection port of the peer device.
此外,上述信号端口还可以设置于固定板,本申请不做限制。In addition, the above-mentioned signal ports may also be disposed on the fixing plate, which is not limited in this application.
上述电子组件包括的芯片的数量不做限制,可以包括一个芯片,也可以包括至少两个芯片,每个上述芯片都具有芯片端口。也就是说,电子组件具有一个芯片或者多个芯片,本申请对此不做限制。The number of chips included in the electronic component is not limited, and may include one chip, or may include at least two chips, and each of the above chips has a chip port. That is to say, the electronic component has one chip or multiple chips, which is not limited in the present application.
第二方面,本申请还提供了一种交换机,该交换机包括壳体以及上述任一技术方案中的电子组件,上述电子组件设置于壳体。该方案中,可以根据需求灵活配置组网。此外,还有利于提升交换机的小型化程度。In a second aspect, the present application further provides a switch, which includes a housing and the electronic component in any of the above technical solutions, and the electronic component is arranged in the housing. In this solution, networking can be flexibly configured according to requirements. In addition, it is also beneficial to improve the miniaturization degree of the switch.
第三方面,本申请还提供了一种计算机系统,该计算机系统包括机柜和上述第一方面中的电子组件,上述电子组件设置于机柜。该方案中的计算机系统的电子组件可以根据需求灵活配置组网。当需要更改计算机系统的组网配置时,可以通过线缆更改电子组件的信号传输路径,则可以更改组网配置,而无需更换电子组件,效率较高,且成本较低。In a third aspect, the present application further provides a computer system, the computer system including a cabinet and the electronic component in the above first aspect, and the electronic component is arranged in the cabinet. The electronic components of the computer system in this solution can be flexibly configured and networked according to requirements. When the network configuration of the computer system needs to be changed, the signal transmission path of the electronic components can be changed through cables, and the network configuration can be changed without replacing the electronic components, which has high efficiency and low cost.
上述计算机系统还包括对端设备,该对端设备也设置于机柜,对端设备包括连接端口, 上述连接端口与信号端口连接,用于进行信号传输。The above computer system further includes a peer device, which is also arranged in the cabinet, and the peer device includes a connection port, and the connection port is connected to a signal port for signal transmission.
为了实现上述连接端口与信号端口的连接,上述计算机系统还包括背板。上述连接端口位于对端设备朝向机柜背侧的一端;电子组件朝向机柜背侧的一端的信号端口和连接端口通过背板连接。该方案中,无需利用线缆连接上述信号端口和连接端口,则占用的空间较小,有利于实现计算机系统的小型化,且成本较低。此外,不易出现由于人为操作导致的错误。In order to realize the connection between the connection port and the signal port, the above computer system further includes a backplane. The connection port is located at the end of the peer device facing the back of the cabinet; the signal port and the connection port at the end of the electronic component facing the back of the cabinet are connected through the backplane. In this solution, there is no need to use cables to connect the above-mentioned signal port and the connection port, so the occupied space is small, which is beneficial to realize the miniaturization of the computer system, and the cost is low. In addition, errors due to human operations are less likely to occur.
具体的技术方案中,上述电子组件为接入交换板,对端设备为服务器。接入交换板的信号端口包括第一下行端口,上述第一下行端口与连接端口通过背板连接。该服务器的具体类型不做限制,例如可以为计算服务器、存储服务器、异构服务器和接口服务器等。In a specific technical solution, the above-mentioned electronic component is an access switching board, and the peer device is a server. The signal port connected to the switch board includes a first downlink port, and the first downlink port is connected to the connection port through the backplane. The specific type of the server is not limited, for example, it may be a computing server, a storage server, a heterogeneous server, an interface server, and the like.
另一种具体的技术方案中,上述电子组件为接入交换板,对端设备为汇聚交换板。上述信号端口包括第一上行端口,汇聚交换板的连接端口包括第二下行端口,第一上行端口与第二下行端口通过背板连接。In another specific technical solution, the above-mentioned electronic components are access switching boards, and the peer device is a convergence switching board. The signal port includes a first uplink port, the connection port of the aggregation switch board includes a second downlink port, and the first uplink port and the second downlink port are connected through a backplane.
为了实现背板与信号端口和连接端口的连接,上述背板具有高速连接器,信号端口和连接端口分别与高速连接器连接。该方案中,背板与信号端口和连接端口的连接方式较为简单,且不易出错。In order to realize the connection between the backplane and the signal port and the connection port, the above-mentioned backplane has a high-speed connector, and the signal port and the connection port are respectively connected to the high-speed connector. In this solution, the connection mode of the backplane, the signal port and the connection port is relatively simple and less prone to errors.
上述背板的具体类型不做限制,例如,上述背板可以为线缆背板、电路板背板或者光背板。具体可以根据计算机系统的需求,设计背板的类型和结构。The specific type of the backplane is not limited. For example, the backplane may be a cable backplane, a circuit board backplane, or an optical backplane. Specifically, the type and structure of the backplane can be designed according to the requirements of the computer system.
附图说明Description of drawings
图1为本申请实施例中电子组件的一种结构示意图;FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application;
图2为本申请实施例中电子组件的另一种结构示意图;Fig. 2 is another schematic structural diagram of the electronic component in the embodiment of the present application;
图3为本申请实施例中电子组件的另一种结构示意图;FIG. 3 is another schematic structural view of an electronic component in an embodiment of the present application;
图4为本申请实施例中电子组件的另一种结构示意图;FIG. 4 is another schematic structural view of an electronic component in an embodiment of the present application;
图5为本申请实施例中电子组件的另一种结构示意图;Fig. 5 is another schematic structural diagram of the electronic component in the embodiment of the present application;
图6为本申请实施例中电子组件的另一种结构示意图;FIG. 6 is another schematic structural diagram of an electronic component in an embodiment of the present application;
图7为本申请实施例中交换机的一种结构示意图;FIG. 7 is a schematic structural diagram of a switch in an embodiment of the present application;
图8为本申请实施例中计算机系统的一种结构示意图;FIG. 8 is a schematic structural diagram of a computer system in an embodiment of the present application;
图9为本申请实施例中背板的一种结构示意图。FIG. 9 is a schematic structural diagram of a backplane in an embodiment of the present application.
附图标记:Reference signs:
1-电子组件;                   11-芯片;1-electronic components; 11-chips;
111-芯片端口;                 12-信号线缆;111-chip port; 12-signal cable;
13-信号端口;                  131-上行端口;13-signal port; 131-uplink port;
132-下行端口;                 14-电路板;132-downstream port; 14-circuit board;
141-第一电路板;               142-第二电路板;141-the first circuit board; 142-the second circuit board;
10-交换机;                    101-壳体;10-switch; 101-housing;
1011-面板;                    100-计算机系统;1011-panel; 100-computer system;
110-机柜;                     1101-背侧;110-cabinet; 1101-back side;
120-对端设备;                 121-连接端口;120-peer device; 121-connection port;
130-背板;                     1301-高速连接器。130-backplane; 1301-high-speed connector.
具体实施方式Detailed ways
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.
以下实施例中所使用的术语只是为了描述特定实施例的目的,而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样,单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式,除非其上下文中明确地有相反指示。The terms used in the following examples are for the purpose of describing particular examples only, and are not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also Expressions such as "one or more" are included unless the context clearly dictates otherwise.
在本说明书中描述的参考“一个实施例”或“具体的实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”,除非是以其他方式另外特别强调。Reference to "one embodiment" or "a particular embodiment" or the like described in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. The terms "including", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically stated otherwise.
为了方便理解本申请实施例提供的电子组件、交换机及计算机系统,下面首先介绍一下其应用场景。芯片为IT设备的重要器件,其工作过程中,通常需要连接信号端口,从而与其它设备实现信号传输。例如,上述芯片可以设置于电子组件,现有技术中,芯片与信号端口的连接关系为固定的,则信号传输路径固定,也就是电子组件的拓扑组网固定,无法根据实际需求灵活组网。若需要更换不同组网,则需要更换电子组件。为此,本申请提供了一种灵活组网的电子组件,以及具有该电子组件的交换机和计算机系统。下面结合附图来列举实施例说明本申请技术方案中的电子组件、交换机及计算机系统。In order to facilitate the understanding of the electronic component, the switch and the computer system provided by the embodiments of the present application, the application scenarios thereof are firstly introduced below. A chip is an important component of IT equipment. During its working process, it usually needs to be connected to a signal port to realize signal transmission with other equipment. For example, the above-mentioned chip can be installed in an electronic component. In the prior art, the connection relationship between the chip and the signal port is fixed, so the signal transmission path is fixed, that is, the topological networking of the electronic component is fixed, and it is impossible to flexibly network according to actual needs. If a different network needs to be replaced, the electronic components need to be replaced. To this end, the present application provides an electronic component for flexible networking, as well as a switch and a computer system with the electronic component. The electronic components, switches, and computer systems in the technical solution of the present application are described below with reference to the accompanying drawings.
图1为本申请实施例中电子组件的一种结构示意图。如图1所示,电子组件1包括芯片11、信号线缆12和多个信号端口13。上述芯片11包括多个芯片端口111,芯片端口111与芯片11的引脚连接。信号线缆12连接于芯片端口111与信号端口13之间。信号端口13一方面与芯片端口111连接,另一方面用于与对端设备连接,从而实现电子组件1与对端设备连接。具体的,上述信号线缆12包括第一端部和第二端部,上述第一端部与多个芯片端口111中的至少一个芯片端口111插接,第二端部与多个信号端口13中的至少一个信号端口13插接。该方案中,信号线缆12分别与芯片端口111和信号端口13插接,信号线缆12则可以根据需求连接一定的芯片端口111和信号端口13,用于形成一定的信号传输路径,进而形成一定的组网配置。需要更换组网时,可以将信号线缆12与芯片端口111拔开;或者可以将信号线缆12与信号端口13拔开;或者,可以将信号线缆12与芯片端口111拔开,且将信号线缆12与信号线缆1拔开。然后根据需求,重新连接信号端口13和芯片端口111,以形成其它的信号传输路径,进而形成不同的组网配置。也就是说,本申请技术方案中的电子组件1,利用信号线缆12插接的方式连接芯片端口111和信号端口13,则可以根据实际需求来更换信号传输路径,以更换组网配置。因此,该方案可以实现灵活组网,有利于丰富电子组件1的应用场景,降低电子设备的成本。此外,该方案无需利用电路板实现芯片端口111与信号端口13的连接,因此不会出现走线交叉的问题,可以减少电路板的层数。FIG. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application. As shown in FIG. 1 , the electronic component 1 includes a chip 11 , a signal cable 12 and a plurality of signal ports 13 . The above-mentioned chip 11 includes a plurality of chip ports 111 , and the chip ports 111 are connected to the pins of the chip 11 . The signal cable 12 is connected between the chip port 111 and the signal port 13 . On the one hand, the signal port 13 is connected to the chip port 111 , and on the other hand, it is used to connect to the opposite device, so as to realize the connection between the electronic component 1 and the opposite device. Specifically, the signal cable 12 includes a first end and a second end, the first end is plugged into at least one chip port 111 of the plurality of chip ports 111, and the second end is connected to the plurality of signal ports 13 At least one of the signal ports 13 is plugged in. In this solution, the signal cable 12 is respectively plugged into the chip port 111 and the signal port 13, and the signal cable 12 can be connected to a certain chip port 111 and signal port 13 according to the requirement to form a certain signal transmission path, and then form a Certain networking configurations. When the networking needs to be replaced, the signal cable 12 can be unplugged from the chip port 111; or the signal cable 12 can be unplugged from the signal port 13; or the signal cable 12 can be unplugged from the chip port 111, and the The signal cable 12 is disconnected from the signal cable 1 . Then, according to requirements, reconnect the signal port 13 and the chip port 111 to form other signal transmission paths, thereby forming different networking configurations. That is to say, the electronic component 1 in the technical solution of the present application uses the signal cable 12 to connect the chip port 111 and the signal port 13, so that the signal transmission path can be replaced according to actual needs to replace the networking configuration. Therefore, this solution can realize flexible networking, which is conducive to enriching the application scenarios of the electronic component 1 and reducing the cost of electronic equipment. In addition, this solution does not need to use a circuit board to realize the connection between the chip port 111 and the signal port 13, so there will be no problem of wire crossing, and the number of layers of the circuit board can be reduced.
具体的实施例中,当电子组件工作场景发生变化,业务的种类发生变化时,需要的组网也不同,从而信号传输路径也会发生变化。以上述电子组件为交换板为例,当交换板先与第一服务器连接,再更换成与第二服务器连接时,需要的端口数量以及组网类型等也会发生变化。因此,采用本申请技术方案则可以灵活的更换芯片端口和信号端口的连接方式,以形成不同的组网,适应不同的工作场景。In a specific embodiment, when the working scene of the electronic component changes and the type of service changes, the required networking is also different, so the signal transmission path will also change. Taking the above-mentioned electronic component as a switch board as an example, when the switch board is first connected to the first server and then replaced to connect to the second server, the number of required ports and the type of networking will also change. Therefore, by adopting the technical solution of the present application, the connection mode of the chip port and the signal port can be flexibly changed to form different networking and adapt to different working scenarios.
具体的,上述多个信号端口13可以包括第一信号端口和第二信号端口,芯片端口111 包括第一芯片端口和第二芯片端口。当信号线缆12的第一端部与上述第一芯片端口插接时,信号线缆12的第二端部与第一信号端口插接,则当电子组件1工作时,可以形成第一信号传输路径。当信号线缆12的第一端部仍然与第一芯片端口插接时,信号线缆12的第二端部与第二信号端口插接,则当电子组件1工作时,可以形成第二信号传输路径。上述实施例以信号线缆12的第一端部与第一芯片端口插接,不做改变,仅仅改变第二端部插接的信号端口13,就可以形成不同的信号传输路径。或者,还可以使得信号线缆12的第一端部与第二芯片端口插接,信号线缆12的第二端部与第一信号端口插接,则当电子组件1工作时,可以形成第三信号传输路径。当信号线缆12的第一端部与第二芯片端口插接时,信号线缆12的第二端部与第二信号端口插接,则当电子组件1工作时,可以形成第四信号传输路径。上述第一信号传输路径、第二信号传输路径、第三信号传输路径和第四信号传输路径不同。不同的信号传输路径,形成的组网也不同,因此,该方案可以灵活电子组件的组网配置。Specifically, the above-mentioned plurality of signal ports 13 may include a first signal port and a second signal port, and the chip port 111 includes a first chip port and a second chip port. When the first end of the signal cable 12 is plugged into the first chip port, and the second end of the signal cable 12 is plugged into the first signal port, then when the electronic component 1 is working, the first signal can be formed. transfer path. When the first end of the signal cable 12 is still plugged into the first chip port, the second end of the signal cable 12 is plugged into the second signal port, then when the electronic component 1 is working, a second signal can be formed. transfer path. In the above embodiment, the first end of the signal cable 12 is plugged into the first chip port, without any change, only the signal port 13 to which the second end is plugged is changed to form different signal transmission paths. Alternatively, the first end of the signal cable 12 can also be plugged into the second chip port, and the second end of the signal cable 12 can be plugged into the first signal port, then when the electronic component 1 works, a second chip can be formed. Three signal transmission paths. When the first end of the signal cable 12 is plugged into the second chip port, and the second end of the signal cable 12 is plugged into the second signal port, then when the electronic component 1 is working, a fourth signal transmission can be formed. path. The first signal transmission path, the second signal transmission path, the third signal transmission path and the fourth signal transmission path are different. Different signal transmission paths form different networking. Therefore, this solution can flexibly configure the networking of electronic components.
本申请技术方案中的电子组件1,通过信号线缆12插拔,连接不同的芯片端口111和信号端口13组合,则可以更换信号传输路径。因此,该方案可以灵活电子组件1形成的组网,当需要更换电子设备的组网时,可以通过线缆插拔来改变信号传输路径,无需更换电子组件1,成本较低。此外,该方案有利于制备电子组件1的标准件,降低制作成本。无需根据实际需求,来设计电子组件1的连线,用户可以根据需求利用电缆来连接电子组件1的芯片端口111与信号端口13。The electronic component 1 in the technical solution of the present application can be connected to different combinations of chip ports 111 and signal ports 13 through the plugging and unplugging of the signal cable 12 , so that the signal transmission path can be replaced. Therefore, this solution can flexibly form the network formed by the electronic components 1. When the network of electronic devices needs to be replaced, the signal transmission path can be changed by plugging and unplugging the cables, without replacing the electronic components 1, and the cost is low. In addition, this solution is beneficial to the preparation of standard parts of the electronic component 1 and reduces the production cost. There is no need to design the wiring of the electronic component 1 according to the actual requirement, and the user can use a cable to connect the chip port 111 and the signal port 13 of the electronic component 1 according to the requirement.
如图1所示,具体的实施例中,上述电子组件1可以包括一个芯片11。另外,图2为本申请实施例中电子组件的另一种结构示意图。如图2所示,上述电子组件1还可以包括两个芯片11或者更多的芯片11,本申请对于电子组件1的芯片11的数量不做限制。As shown in FIG. 1 , in a specific embodiment, the above-mentioned electronic component 1 may include a chip 11 . In addition, FIG. 2 is another schematic structural diagram of the electronic component in the embodiment of the present application. As shown in FIG. 2 , the above-mentioned electronic component 1 may also include two chips 11 or more chips 11 , and the application does not limit the number of chips 11 of the electronic component 1 .
图3为本申请实施例中电子组件的另一种结构示意图。如图3所示,上述信号线缆12的两端包括的端口数量不做限制,具体的,上述信号线缆12的第一端部包括至少一个端口,例如,可以包括一个端口、两个端口、四个端口或者八个端口等等,本申请不做限制。上述信号线缆12的第二端部包括至少一个端口,例如,可以包括一个端口、两个端口、四个端口或者八个端口等等,本申请不做限制。信号线缆12的两端的端口的数量可以相同,也可以不同,本申请不做限制。例如,可以使信号线缆12的第一端部具有一个端口,第二端部具有两个端口;或者信号线缆12的第一端部具有两个端口,第二端部具有一个端口;或者信号线缆12的第一端部具有两个端口,第二端部具有四个端口;或者信号线缆12的第一端部具有四个端口,第二端部具有四个端口。此处不进行一一列举。也就是说,利用信号线缆12形成的信号传输路径,信号传输路径的一端可以连接至少一个芯片端口111,可以为一个或者多个,信号传输路径的另一端可以连接至少一个信号端口13,可以为一个或者多个,本申请不做限制,根据实际需求设计上述信号线缆12的端口数量即可。FIG. 3 is another schematic structural diagram of an electronic component in an embodiment of the present application. As shown in Figure 3, the number of ports included at both ends of the above-mentioned signal cable 12 is not limited, specifically, the first end of the above-mentioned signal cable 12 includes at least one port, for example, may include one port, two ports , four ports, or eight ports, etc., are not limited in this application. The second end of the signal cable 12 includes at least one port, for example, may include one port, two ports, four ports, or eight ports, etc., which is not limited in this application. The number of ports at both ends of the signal cable 12 may be the same or different, which is not limited in this application. For example, the first end of the signal cable 12 can have one port, and the second end has two ports; or the first end of the signal cable 12 has two ports, and the second end has one port; or The first end of the signal cable 12 has two ports, and the second end has four ports; or the first end of the signal cable 12 has four ports, and the second end has four ports. Not to list them all here. That is to say, using the signal transmission path formed by the signal cable 12, one end of the signal transmission path can be connected to at least one chip port 111, which can be one or more, and the other end of the signal transmission path can be connected to at least one signal port 13, which can be One or more ports are not limited in this application, and the number of ports of the above-mentioned signal cable 12 can be designed according to actual needs.
请参考图2和图3,在具体设置电子组件1的信号端口13时,可以使多个信号端口13分设于芯片11的两侧。具体的,可以使的多个信号端口分设于芯片的第一侧和第二侧,上述第一侧与第二侧相邻或者相背离,也就是说,上述多个信号端口分设于芯片相邻的两个,或者分设与芯片相背离的两侧。例如图3所示的实施例中,多个信号端口13中的一部分信号端口13设置于芯片11的第一侧,另一部分信号端口13设置于芯片11的第二侧,上述第一侧与第二侧位于芯片11相背离的两侧。再例如图4所示的实施例中,从而便于电 子组件1与对端设备连接时,使得需要连接的对端设备的连接端口与电子组件1的信号端口13位于同一侧,具体可以利用信号线缆12,使得与对端设备的连接端口位于同一侧的信号端口13与设定的芯片端口111连接,便于实现两者的连接。此外,信号端口13位于芯片11的两侧,则有利于减少信号端口13在电子组件1的一侧占用的空间。Please refer to FIG. 2 and FIG. 3 , when specifically setting the signal ports 13 of the electronic component 1 , a plurality of signal ports 13 can be separately arranged on both sides of the chip 11 . Specifically, the plurality of signal ports can be arranged on the first side and the second side of the chip, and the first side is adjacent to or away from the second side, that is to say, the above-mentioned plurality of signal ports are arranged on the adjacent side of the chip. Two of them, or separate the two sides away from the chip. For example, in the embodiment shown in FIG. 3 , a part of the signal ports 13 in the plurality of signal ports 13 is arranged on the first side of the chip 11, and another part of the signal ports 13 is arranged on the second side of the chip 11. The two sides are located on opposite sides of the chip 11 . Another example is in the embodiment shown in FIG. 4 , so that when the electronic component 1 is connected to the peer device, the connection port of the peer device to be connected is located on the same side as the signal port 13 of the electronic component 1 . Specifically, the signal line can be used Cable 12, so that the signal port 13 on the same side as the connection port of the peer device is connected to the set chip port 111, so as to facilitate the connection between the two. In addition, the signal port 13 is located on both sides of the chip 11 , which is beneficial to reduce the space occupied by the signal port 13 on one side of the electronic component 1 .
请参考图3,具体的实施例中,上述电子组件1可以为交换板,芯片11为交换芯片。则上述多个信号端口13可以为上行端口131和下行端口132,则可以使得上述上行端口131和下行端口132分设于芯片11相背离的两侧。例如,上行端口131设置于电子组件1的芯片11的第一侧,下行端口132设置于上述电子组件1的芯片11的第二侧。上述交换板可以为接入交换板,接入交换板的下行端口132可以用于与服务器连接,上行端口131可以用于与汇聚交换机连接。可以使接入交换板的下行端口132与服务器的连接端口位于同一侧,则便于使接入交换板的下行端口132与服务器的连接端口连接。接入交换板的上行端口131可以与汇聚交换机的连接端口连接,使得汇聚交换机的连接端口与上述上行端口131位于同一侧,则便于使接入交换板的上行端口131与汇聚交换机的连接端口连接。Please refer to FIG. 3 , in a specific embodiment, the above-mentioned electronic component 1 may be a switch board, and the chip 11 is a switch chip. Then the above-mentioned plurality of signal ports 13 can be uplink ports 131 and downlink ports 132 , and the above-mentioned uplink ports 131 and downlink ports 132 can be separately arranged on opposite sides of the chip 11 . For example, the uplink port 131 is disposed on the first side of the chip 11 of the electronic component 1 , and the downlink port 132 is disposed on the second side of the chip 11 of the electronic component 1 . The above switch board may be an access switch board, the downlink port 132 of the access switch board may be used to connect to the server, and the uplink port 131 may be used to connect to the aggregation switch. The downlink port 132 of the access switch board can be located on the same side as the connection port of the server, which facilitates the connection of the downlink port 132 of the access switch board with the connection port of the server. The uplink port 131 of the access switch board can be connected to the connection port of the aggregation switch, so that the connection port of the aggregation switch and the above-mentioned uplink port 131 are on the same side, so that the uplink port 131 of the access switch board is connected to the connection port of the aggregation switch .
另一种实施例中,还可以使电子组件的多个信号端口设置于芯片的同一侧,且位于电子组件的背侧。上述背侧可以指的是服务器的连接端口所在的一侧,且上述汇聚交换机的连接端口也位于上述背侧,则使得电子组件的信号端口与连接的对端设备的连接端口位于同一侧,以便于实现信号连接。In another embodiment, multiple signal ports of the electronic component can also be arranged on the same side of the chip and on the back side of the electronic component. The above-mentioned back side may refer to the side where the connection port of the server is located, and the connection port of the above-mentioned aggregation switch is also located on the above-mentioned back side, so that the signal port of the electronic component is located on the same side as the connection port of the connected peer device, so that for signal connection.
具体的实施例中,芯片包括多个芯片端口,指的是芯片连接有多个芯片端口,通过芯片端口可以实现与芯片之间的信号传输。具体的,上述芯片端口设置的位置不做限制,例如可以设置于电路板,再与芯片连接。或者,还可以使芯片端口设置于芯片本体上。请继续参考图3,具体设置上述电子组件1时,可以使电子组件1包括电路板14,上述芯片11设置于电路板14。设置芯片端口111时,可以使得芯片端口111设置于电路板14,并通过电路板14与芯片11进行信号连接。In a specific embodiment, the chip includes a plurality of chip ports, which means that the chip is connected with a plurality of chip ports, and signal transmission with the chip can be realized through the chip ports. Specifically, there is no limitation on the position where the chip port is set, for example, it can be set on a circuit board and then connected to the chip. Alternatively, the chip port can also be arranged on the chip body. Please continue to refer to FIG. 3 , when the above-mentioned electronic component 1 is specifically arranged, the electronic component 1 may include a circuit board 14 , and the above-mentioned chip 11 is disposed on the circuit board 14 . When the chip port 111 is provided, the chip port 111 may be arranged on the circuit board 14 and be connected to the chip 11 through the circuit board 14 for signal connection.
图5为本申请实施例中电子组件的另一种结构示意图。如图4所示,另一种实施例中,还可以使芯片端口111设置于芯片11,也就是芯片11本体就设置有芯片端口111。芯片端口111设置于芯片11的本体,则芯片11的集成度较高,有利于简化电子组件1的组装。本申请对于芯片端口111的设置方式不做限制。FIG. 5 is another schematic structural diagram of an electronic component in an embodiment of the present application. As shown in FIG. 4 , in another embodiment, the chip port 111 may also be provided on the chip 11 , that is, the chip 11 body is provided with the chip port 111 . The chip port 111 is disposed on the body of the chip 11 , so the integration of the chip 11 is higher, which is beneficial to simplify the assembly of the electronic component 1 . The present application does not limit the setting method of the chip port 111 .
如图3所示的实施例中,上述芯片11、芯片端口111和信号端口13可以设置于同一块电路板14。或者,图6为本申请实施例中电子组件的另一种结构示意图。如图6所示,另一种实施例中,电子组件1还可以包括第一电路板141和第二电路板142。上述芯片11和芯片端口111设置于第一电路板141,信号端口13设置于第二电路板142。上述第一电路板141和第二电路板142可以通过固定件固定,或者第一电路板141和第二电路板142分别固定于壳体等结构。该方案中,一方面信号端口13与芯片端口111通过线缆连接,另一方面,第一电路板141和第二电路板142并非为一体结构。因此,第二电路板142的位置可以根据实际位置需求设置,从而合理设置信号端口13的位置,便于信号端口13与对端设备进行连接。具体设置上述第二电路板142时,第二电路板142的具体数量不做限制,例如,如图6所示,每组信号端口13对应一个第二电路板142。In the embodiment shown in FIG. 3 , the chip 11 , the chip port 111 and the signal port 13 can be arranged on the same circuit board 14 . Alternatively, FIG. 6 is another schematic structural diagram of the electronic component in the embodiment of the present application. As shown in FIG. 6 , in another embodiment, the electronic component 1 may further include a first circuit board 141 and a second circuit board 142 . The aforementioned chip 11 and the chip port 111 are disposed on the first circuit board 141 , and the signal port 13 is disposed on the second circuit board 142 . The above-mentioned first circuit board 141 and the second circuit board 142 may be fixed by a fixing member, or the first circuit board 141 and the second circuit board 142 are respectively fixed to structures such as a casing. In this solution, on the one hand, the signal port 13 is connected to the chip port 111 through a cable; on the other hand, the first circuit board 141 and the second circuit board 142 are not in an integral structure. Therefore, the position of the second circuit board 142 can be set according to the actual position requirements, so that the position of the signal port 13 can be reasonably set to facilitate the connection between the signal port 13 and the peer device. When the above-mentioned second circuit board 142 is specifically arranged, the specific number of the second circuit board 142 is not limited. For example, as shown in FIG. 6 , each group of signal ports 13 corresponds to one second circuit board 142 .
此外,上述电子组件1还可以包括第一电路板141和固定板,上述芯片11和芯片端口111设置于第一电路板141,信号端口13设置于固定板,固定板可以仅从结构方面用于固定信号端口13,无需传输电信号。上述第一电路板141和固定板可以通过固定件固定,或 者第一电路板141和固定板分别固定于壳体等结构。该方案中,一方面信号端口13与芯片端口111通过线缆连接,另一方面,第一电路板141和固定板并非为一体结构。因此,固定板的位置可以根据实际位置需求设置,从而合理设置信号端口13的位置,便于信号端口13与对端设备进行连接。In addition, the above-mentioned electronic assembly 1 may also include a first circuit board 141 and a fixing board, the above-mentioned chip 11 and the chip port 111 are arranged on the first circuit board 141, and the signal port 13 is arranged on the fixing board, and the fixing board can be used only in terms of structure The fixed signal port 13 does not need to transmit electrical signals. The above-mentioned first circuit board 141 and the fixing plate can be fixed by a fixing member, or the first circuit board 141 and the fixing plate are respectively fixed to structures such as a housing. In this solution, on the one hand, the signal port 13 is connected to the chip port 111 through a cable; on the other hand, the first circuit board 141 and the fixing board are not in an integral structure. Therefore, the position of the fixing plate can be set according to the actual position requirements, so that the position of the signal port 13 can be reasonably set to facilitate the connection between the signal port 13 and the opposite device.
当然,在其它实施例中上述电子组件1中的芯片11、芯片端口111和信号端口13可以设置于同一块电路板,芯片端口111与信号端口13通过电路板实现电连接,以提高电子组件1的密度,提升具有该电子组件1的服务器的密度。Of course, in other embodiments, the chip 11, the chip port 111 and the signal port 13 in the above-mentioned electronic component 1 can be arranged on the same circuit board, and the chip port 111 and the signal port 13 are electrically connected through the circuit board to improve the electronic component 1. The density of the server with the electronic component 1 is increased.
基于相同的发明构思,本申请还提供了一种交换机10。图7为本申请实施例中交换机的一种结构示意图。如图7所示,该交换机10包括壳体101和上述任一技术方案中的电子组件1,该电子组件1设置于壳体101内。该方案中,交换机10的信号端口13可以根据需求与芯片11的芯片端口111连接,从而配置各个信号端口13内能够传输的信号,灵活性较高。Based on the same inventive concept, the present application also provides a switch 10 . FIG. 7 is a schematic structural diagram of a switch in an embodiment of the present application. As shown in FIG. 7 , the switch 10 includes a casing 101 and the electronic component 1 in any of the above-mentioned technical solutions, and the electronic component 1 is arranged in the casing 101 . In this solution, the signal port 13 of the switch 10 can be connected to the chip port 111 of the chip 11 according to requirements, so as to configure the signals that can be transmitted in each signal port 13, and the flexibility is high.
请继续参考图7,该交换机10包括面板1011,该面板1011可以位于电子组件1的芯片11的第一侧,则芯片11的第二侧则位于交换机10背离面板1011的一侧,可以使得信号端口13分布于交换机10的两侧,一方面,减少信号端口13占用面板1011的面积,有利于提升交换机10的集成度。另一方面,有利于分散电子组件1与对端设备连接时的线缆分布。Please continue to refer to FIG. 7, the switch 10 includes a panel 1011, the panel 1011 can be located on the first side of the chip 11 of the electronic component 1, then the second side of the chip 11 is located on the side of the switch 10 away from the panel 1011, which can make the signal The ports 13 are distributed on both sides of the switch 10 . On the one hand, reducing the area occupied by the signal ports 13 on the panel 1011 is beneficial to improving the integration of the switch 10 . On the other hand, it is beneficial to disperse the cable distribution when the electronic component 1 is connected to the peer device.
此外,可以使得交换机10的上行端口131位于交换机10的面板1011所在的一侧,用于与汇聚交换机等设备连接。下行端口132位于交换机10背离面板1011的一侧,用于与服务器等设备连接。服务器的连接端口通常位于背侧,则交换机10的下行端口132位于交换机10的背侧,下行端口132与连接端口的距离较近,便于实现连接。In addition, the uplink port 131 of the switch 10 may be located on the side where the panel 1011 of the switch 10 is located, and is used for connecting with devices such as aggregation switches. The downlink port 132 is located on the side of the switch 10 away from the panel 1011 , and is used for connecting with devices such as servers. The connection port of the server is usually located on the back side, and the downlink port 132 of the switch 10 is located on the back side of the switch 10, and the distance between the downlink port 132 and the connection port is relatively close to facilitate connection.
本申请还提供了一种计算机系统。图8为本申请实施例中计算机系统的一种结构示意图。如图8所示,该计算机系统100包括机柜110和上述任一实施例中的电子组件1,上述电子组件1设置于机柜110内。The application also provides a computer system. FIG. 8 is a schematic structural diagram of a computer system in an embodiment of the present application. As shown in FIG. 8 , the computer system 100 includes a cabinet 110 and the electronic component 1 in any of the above-mentioned embodiments, and the above-mentioned electronic component 1 is arranged in the cabinet 110 .
该实施例中的计算机系统100的电子组件1可以根据实际需求配置信号传输路径,组网灵活性较高。因此计算机系统100也可以较为方便的更改组网配置,而无需更换电子组件1,效率较高,且成本较低。The electronic components 1 of the computer system 100 in this embodiment can configure signal transmission paths according to actual needs, and the networking flexibility is high. Therefore, the computer system 100 can also change the networking configuration more conveniently without replacing the electronic component 1 , which has high efficiency and low cost.
请结合图4和图8,上述计算机系统100还可以包括对端设备120,该对端设备120也可以设置于机柜110。上述对端设备120包括连接端口121,该连接端口121与信号端口13连接,用于传输信号。具体的,上述对端设备120的具体类型不做限制,可以为服务器,例如计算服务器、存储服务器、异构服务器和接口服务器等。或者,上述对端设备120还可以为交换机等设备,本申请不做限制。Please refer to FIG. 4 and FIG. 8 , the above computer system 100 may further include a peer device 120 , and the peer device 120 may also be disposed in the cabinet 110 . The aforementioned peer device 120 includes a connection port 121, which is connected to the signal port 13 for transmitting signals. Specifically, the specific type of the peer device 120 is not limited, and may be a server, such as a computing server, a storage server, a heterogeneous server, an interface server, and the like. Alternatively, the peer device 120 may also be a device such as a switch, which is not limited in this application.
具体设置上述计算机系统100时,可以使上述对端设备120的连接端口121位于对端设备120朝向机柜110的背侧1101的一端,且电子组件1具有朝向机柜110的背侧1101的一端的信号端口13,上述信号端口13和连接端口121可以通过背板130连接。该方案中,电子组件1和对端设备120通过背板130连接,占用的空间较少,有利于减小计算机系统100占用的空间,提升计算机系统100的集成度。该方案还可以避免人工接入导致的连接错误。此外,无需利用线缆等结构连接信号端口13与连接端口121,可以降低成本。此外,背板130可以支持不同速率的信号传输,无需根据传输信号的速率更换线缆的类型。When the above-mentioned computer system 100 is specifically set up, the connection port 121 of the above-mentioned peer device 120 can be located at one end of the peer device 120 facing the back side 1101 of the cabinet 110, and the electronic component 1 has a signal port facing the end of the back side 1101 of the cabinet 110. The port 13 , the above-mentioned signal port 13 and the connection port 121 can be connected through the backplane 130 . In this solution, the electronic component 1 and the peer device 120 are connected through the backplane 130 , which occupies less space, which is beneficial to reducing the space occupied by the computer system 100 and improving the integration of the computer system 100 . This solution can also avoid connection errors caused by manual access. In addition, there is no need to use structures such as cables to connect the signal port 13 and the connection port 121 , which can reduce costs. In addition, the backplane 130 can support signal transmission at different rates, without changing the type of cables according to the rate of transmission signals.
图9为本申请实施例中背板的一种结构示意图。请结合图8和图9,上述背板130具 体可以设置有高速连接器1301。信号端口13和连接端口121分别与高速连接器1301连接,从而实现信号端口13与连接端口121的连接。利用高速连接器1301则便于实现信号端口13与连接端口121的连接,操作较为简单,且连接过程较为可靠。FIG. 9 is a schematic structural diagram of a backplane in an embodiment of the present application. Please refer to FIG. 8 and FIG. 9 , the above-mentioned backplane 130 may specifically be provided with a high-speed connector 1301. The signal port 13 and the connection port 121 are respectively connected to the high-speed connector 1301 , so as to realize the connection between the signal port 13 and the connection port 121 . Using the high-speed connector 1301 facilitates the connection between the signal port 13 and the connection port 121 , the operation is relatively simple, and the connection process is relatively reliable.
具体实施例中,上述电子组件1可以为接入交换板,对端设备120可以为服务器。上述接入交换板包括第一下行端口,第一下行端口设置于接入交换板朝向机柜110的背侧1101的一侧,服务器的连接端口121也设置于朝向机柜110的背侧1101的一侧。因此,本申请技术方案中的接入交换板和服务器可以利用背板130实现信号传输。In a specific embodiment, the above-mentioned electronic component 1 may be an access switch board, and the peer device 120 may be a server. The above access switch board includes a first downlink port, the first downlink port is set on the side of the access switch board facing the back side 1101 of the cabinet 110, and the connection port 121 of the server is also set on the side facing the back side 1101 of the cabinet 110. side. Therefore, the access switch board and the server in the technical solution of the present application can use the backplane 130 to implement signal transmission.
另一种实施例中,上述电子组件1为接入交换板,对端设备120为汇聚交换板。上述接入交换板的信号端口13包括第一上行端口,汇聚交换板的连接端口121包括第二下行端口。上述第一上行端口设置于接入交换板朝向机柜110的背侧1101的一侧,汇聚交换板的第二下行端口也设置于朝向机柜110的背侧1101的一侧。因此,本申请技术方案中的接入交换板和汇聚交换机也可以利用背板130实现信号传输。In another embodiment, the above-mentioned electronic component 1 is an access switch board, and the peer device 120 is a convergence switch board. The signal port 13 of the access switch board includes a first uplink port, and the connection port 121 of the aggregation switch board includes a second downlink port. The above-mentioned first uplink port is set on the side of the access switching board facing the back side 1101 of the cabinet 110 , and the second downlink port of the aggregation switching board is also set on the side facing the back side 1101 of the cabinet 110 . Therefore, the access switch board and aggregation switch in the technical solution of the present application can also use the backplane 130 to implement signal transmission.
图8和图9所示的实施例中,背板130为电路板背板,具体形状为十字形。然而,在实际制备上述电路板背板时,电路板背板的形状可以根据信号端口13和连接端口121的分布具体设置。此外,具体设置上述背板130时,背板130的具体形态不做限制。例如,上述背板130除了为电路板背板以外,还可以为线缆背板或者光背板,本申请不做限制。In the embodiment shown in FIG. 8 and FIG. 9 , the backplane 130 is a circuit board backplane, and the specific shape is a cross. However, when actually preparing the above-mentioned circuit board backplane, the shape of the circuit board backplane can be specifically set according to the distribution of the signal ports 13 and the connection ports 121 . In addition, when the above-mentioned backboard 130 is specifically arranged, the specific shape of the backboard 130 is not limited. For example, in addition to being a circuit board backplane, the above-mentioned backplane 130 may also be a cable backplane or an optical backplane, which is not limited in this application.
以上,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以权利要求的保护范围为准。The above is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application, and should cover Within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (15)

  1. 一种电子组件,其特征在于,包括芯片、信号线缆和多个信号端口,所述芯片包括多个芯片端口,所述信号线缆包括第一端部和第二端部,所述第一端部与所述多个芯片端口中的至少一个芯片端口插接,所述第二端部与所述多个信号端口中的至少一个所述信号端口插接;An electronic component, characterized in that it includes a chip, a signal cable and a plurality of signal ports, the chip includes a plurality of chip ports, the signal cable includes a first end and a second end, the first The end portion is plugged into at least one chip port among the plurality of chip ports, and the second end portion is plugged into at least one signal port among the plurality of signal ports;
    所述多个信号端口包括第一信号端口和第二信号端口;当所述信号线缆的第一端部与所述芯片端口中的第一芯片端口插接时,所述信号线缆的第二端部与所述第一信号端口插接,用于形成第一信号传输路径;或,当所述信号线缆的第一端部与所述芯片端口中的所述第一芯片端口插接时,所述信号线缆的第二端部与所述第二信号端口插接,用于形成第二信号传输路径;所述第一信号传输路径与所述第二信号传输路径不同。The plurality of signal ports include a first signal port and a second signal port; when the first end of the signal cable is plugged into the first chip port of the chip ports, the second signal port of the signal cable The two ends are plugged into the first signal port to form a first signal transmission path; or, when the first end of the signal cable is plugged into the first chip port among the chip ports When, the second end of the signal cable is plugged into the second signal port to form a second signal transmission path; the first signal transmission path is different from the second signal transmission path.
  2. 如权利要求1所述的电子组件,其特征在于,所述信号线缆的所述第一端部包括至少一个端口,和/或,所述第二端部包括至少一个端口。The electronic assembly of claim 1, wherein the first end portion of the signal cable includes at least one port, and/or the second end portion includes at least one port.
  3. 如权利要求1或2所述的电子组件,其特征在于,所述多个信号端口分设于所述芯片的第一侧和第二侧,所述第一侧与所述第二侧相邻或者相背离。The electronic component according to claim 1 or 2, wherein the plurality of signal ports are respectively arranged on the first side and the second side of the chip, and the first side is adjacent to the second side or Deviate from.
  4. 如权利要求3所述的电子组件,其特征在于,所述多个信号端口包括上行端口和下行端口,所述下行端口设置于所述芯片的所述第一侧,所述上行端口设置于所述芯片的所述第二侧。The electronic component according to claim 3, wherein the plurality of signal ports include an uplink port and a downlink port, the downlink port is set on the first side of the chip, and the uplink port is set on the the second side of the chip.
  5. 如权利要求1~4任一项所述的电子组件,其特征在于,所述芯片端口设置于所述芯片或者设置于与所述芯片连接的电路板。The electronic component according to any one of claims 1 to 4, wherein the chip port is arranged on the chip or on a circuit board connected to the chip.
  6. 如权利要求1~5任一项所述的电子组件,其特征在于,还包括第一电路板和第二电路板,所述芯片设置于所述第一电路板,所述信号端口设置于所述第二电路板。The electronic component according to any one of claims 1-5, further comprising a first circuit board and a second circuit board, the chip is arranged on the first circuit board, and the signal port is arranged on the Describe the second circuit board.
  7. 如权利要求1~6任一项所述的电子组件,其特征在于,包括至少两个所述芯片,每个所述芯片包括多个芯片端口。The electronic component according to any one of claims 1-6, characterized in that it comprises at least two chips, and each chip includes a plurality of chip ports.
  8. 一种交换机,其特征在于,包括壳体以及至少一个如权利要求1~7任一项所述的电子组件,所述电子组件设置于所述壳体。A switch, characterized by comprising a casing and at least one electronic component according to any one of claims 1-7, the electronic component being arranged in the casing.
  9. 一种计算机系统,其特征在于,包括机柜和如权利要求1~7任一项所述的电子组件,所述电子组件设置于所述机柜。A computer system, characterized by comprising a cabinet and the electronic component according to any one of claims 1-7, the electronic component being arranged in the cabinet.
  10. 如权利要求9所述的计算机系统,其特征在于,还包括对端设备,所述对端设备设置于所述机柜,所述对端设备包括连接端口,所述连接端口与所述信号端口连接,用于进行信号传输。The computer system according to claim 9, further comprising a peer device, the peer device is arranged in the cabinet, the peer device includes a connection port, and the connection port is connected to the signal port , for signal transmission.
  11. 如权利要求10所述的计算机系统,其特征在于,还包括背板,所述连接端口位于所述对端设备朝向所述机柜背侧的一端;所述电子组件朝向所述机柜背侧的一端的所述信号端口和所述连接端口通过所述背板连接。The computer system according to claim 10, further comprising a backplane, the connection port is located at one end of the peer device facing the back side of the cabinet; the electronic component is at one end facing the back side of the cabinet The signal port and the connection port are connected through the backplane.
  12. 如权利要求11所述的计算机系统,其特征在于,所述电子组件为接入交换板,所述对端设备为服务器;所述信号端口包括第一下行端口,所述第一下行端口与所述连接端口通过所述背板连接。The computer system according to claim 11, wherein the electronic component is an access switch board, and the peer device is a server; the signal port includes a first downlink port, and the first downlink port It is connected with the connection port through the backplane.
  13. 如权利要求11或12所述的计算机系统,其特征在于,所述电子组件为接入交换板,所述对端设备为汇聚交换板;所述信号端口包括第一上行端口,所述汇聚交换板的所述连接端口包括第二下行端口,所述第一上行端口与所述第二下行端口通过所述背板连接。The computer system according to claim 11 or 12, wherein the electronic component is an access switch board, and the peer device is a convergence switch board; the signal port includes a first uplink port, and the convergence switch The connection ports of the board include a second downlink port, and the first uplink port and the second downlink port are connected through the backplane.
  14. 如权利要求11~13任一项所述的计算机系统,其特征在于,所述背板具有高速连接器,所述信号端口和所述连接端口分别与所述高速连接器连接。The computer system according to any one of claims 11 to 13, wherein the backplane has a high-speed connector, and the signal port and the connection port are respectively connected to the high-speed connector.
  15. 如权利要求11~14任一项所述的计算机系统,其特征在于,所述背板为线缆背板、电路板背板或者光背板。The computer system according to any one of claims 11 to 14, wherein the backplane is a cable backplane, a circuit board backplane or an optical backplane.
PCT/CN2021/143783 2021-05-17 2021-12-31 Electronic assembly, switch, and computer system WO2022242190A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110536454.0A CN115426541A (en) 2021-05-17 2021-05-17 Electronic component, switch and computer system
CN202110536454.0 2021-05-17

Publications (1)

Publication Number Publication Date
WO2022242190A1 true WO2022242190A1 (en) 2022-11-24

Family

ID=84140262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/143783 WO2022242190A1 (en) 2021-05-17 2021-12-31 Electronic assembly, switch, and computer system

Country Status (2)

Country Link
CN (1) CN115426541A (en)
WO (1) WO2022242190A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1659810A (en) * 2002-04-29 2005-08-24 西利康导管有限公司 Direct-connect signaling system
CN102546186A (en) * 2010-12-17 2012-07-04 无锡江南计算技术研究所 Switch and network computer room for placing the switch
CN107548480A (en) * 2015-05-04 2018-01-05 莫列斯有限公司 Using the computing device of bypass module
US20200037448A1 (en) * 2018-07-28 2020-01-30 Cray Inc. Direct connection of high speed signals on pcb chip

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1659810A (en) * 2002-04-29 2005-08-24 西利康导管有限公司 Direct-connect signaling system
CN102546186A (en) * 2010-12-17 2012-07-04 无锡江南计算技术研究所 Switch and network computer room for placing the switch
CN107548480A (en) * 2015-05-04 2018-01-05 莫列斯有限公司 Using the computing device of bypass module
US20200037448A1 (en) * 2018-07-28 2020-01-30 Cray Inc. Direct connection of high speed signals on pcb chip

Also Published As

Publication number Publication date
CN115426541A (en) 2022-12-02

Similar Documents

Publication Publication Date Title
US10084255B2 (en) Perpendicular and orthogonal interconnection system and communications device
JP2020009433A (en) Routing assembly
JP5893744B2 (en) Backward compatible connectivity for high data rate applications
US20120213469A1 (en) Optical backplane interconnection system and communication device
TWI437426B (en) Rack server system
TW201711290A (en) Wire to board connectors suitable for use in bypass routing assemblies
US20230074672A1 (en) High-speed data transfers through storage device connectors
US11805592B2 (en) Circuit board assembly and electronic device
WO2012028064A1 (en) Connection structure between bare chip and printed circuit board, printed circuit board and communication equipment
US10571984B2 (en) Communication node with digital plane interface
JP2019505043A (en) Integrated routing assembly and system using the same
WO2014146231A1 (en) Backboard, plug-in frame, and network device
CN201327640Y (en) Structure for interconnection between hyper-transmission bus interface boards
US8953337B2 (en) Communication apparatus with removable circuit boards
KR100338774B1 (en) Socket for mounting a memory module boards in printed circuit board
WO2016105901A1 (en) Midplane interconnect system with conductor twist mitigation
WO2012095047A2 (en) Interconnection board and server system
WO2022242190A1 (en) Electronic assembly, switch, and computer system
WO2013185305A1 (en) Connector and server
WO2015081506A1 (en) Interconnection system for communications device
US8144697B2 (en) System and method for networking computing clusters
CN216981939U (en) Switching equipment interconnection architecture, switching equipment and data center
WO2023093096A1 (en) Quadrature system architecture and network device
CN216647351U (en) High-speed backboard interconnection system
CN117333348B (en) Circuit board of graphic processor and server system

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21940632

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21940632

Country of ref document: EP

Kind code of ref document: A1