CN108183872B - Switch system and construction method thereof - Google Patents
Switch system and construction method thereof Download PDFInfo
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- CN108183872B CN108183872B CN201711440497.9A CN201711440497A CN108183872B CN 108183872 B CN108183872 B CN 108183872B CN 201711440497 A CN201711440497 A CN 201711440497A CN 108183872 B CN108183872 B CN 108183872B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L49/00—Packet switching elements
- H04L49/10—Packet switching elements characterised by the switching fabric construction
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L49/00—Packet switching elements
- H04L49/15—Interconnection of switching modules
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L49/00—Packet switching elements
- H04L49/40—Constructional details, e.g. power supply, mechanical construction or backplane
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Abstract
The invention provides a construction method of a switch system and the switch system. The construction method of the switch system comprises the following steps: providing a plurality of switch main boards, wherein each switch main board comprises a plurality of switch chips; connecting a plurality of switch chips on each switch mainboard to be used as a-dimensional connection; the plurality of switch main boards are arranged on a back board, and a plurality of switch chips on the plurality of switch main boards are subjected to b-dimensional connection and c-dimensional connection through the back board to form the silicon unit switch with the a x b x c mode, wherein a is more than or equal to 2, b is more than or equal to 2, and c is more than or equal to 2. A3D torus topological structure is adopted inside a silicon unit switch of the switch system, and 3 dimensionality interconnections are realized through PCBs. The technology saves the cost of the optical fiber and the copper cable, has short transmission distance and has better reliability than the optical fiber and the copper cable.
Description
Technical Field
The present invention relates generally to the field of computer technology, and more particularly, to a switch and a method of constructing the same.
Background
In a specific application process of an HPC (High Performance Computing), in processes of cluster building, parallel operation, collaborative simulation, and the like, the Performance of the HPC has strict requirements on the bandwidth, delay, topology, and the like of a system. Especially, the computing power of HPC ranges from P level to E level, and the number of super computing cores ranges from hundreds of thousands to millions, which poses a serious challenge to the aspects of scale, scalability, cost, energy consumption, reliability and the like of the network switching system. Therefore, in the process of building a very large computing system, designing a large network switching system which simultaneously considers multi-dimensional factors such as topology, heat dissipation, density and the like becomes a major technical difficulty which needs to be solved urgently.
At present, there are two main methods for constructing a large-scale exchange system in the market: the switch formed by a single switch chip builds a large-scale network switching system through a copper cable or an optical fiber; and a large-scale switch represented by a fat-tree topological structure to form a large-scale network switching system.
The switch formed by single switching chip builds large network switching system through copper cable or optical fiber. This system design requires a large number of switches to build the network and switch interconnections require a large number of copper cables and optical fibers. The number of switches results in an excessively large floor space of the machine room, and a large number of copper cables and optical fibers are expensive to interconnect and complicated to arrange.
A large scale switch system represented by a fat-tree topology structure applied to a data center. The fat-tree topology structure has the defects of insufficient expansibility, poor fault tolerance of a routing protocol, high cost, limited network scale and the like. This type of switch is limited by port heat dissipation and system air duct design, and cannot give good consideration to density and heat dissipation. Therefore, the existing switches have various disadvantages and shortcomings, and cannot meet the requirement of the E-level computation for the network switching system.
Disclosure of Invention
The present invention provides a switch system and a method for constructing the same, which can solve the above problems.
According to an aspect of the present invention, there is provided a method of constructing a switch system, including: providing a plurality of switch main boards, wherein each switch main board comprises a plurality of switch chips; connecting a plurality of switch chips on each switch mainboard to be used as a-dimensional connection; the plurality of switch main boards are arranged on a back board, and a plurality of switch chips on the plurality of switch main boards are subjected to b-dimensional connection and c-dimensional connection through the back board to form the silicon unit switch with the a x b x c mode, wherein a is more than or equal to 2, b is more than or equal to 2, and c is more than or equal to 2.
Preferably, when each of the switch boards includes 2 switch chips on both ends thereof, the 2 switch chips on each of the switch boards are interconnected as a-dimensional connection.
Preferably, when the plurality of switch main boards includes 6 switch main boards, the 6 switch main boards are arranged on the backplane in a parallel manner; interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring and a second ring through a backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a third ring and a fourth ring through the backboard to be connected as a c-dimension; and connecting the first ring with the second ring and the third ring with the fourth ring as a b-dimensional connection.
Preferably, connecting the first ring with the second ring and the third ring with the fourth ring as a b-dimensional connection further comprises: connecting each of the three switch chips of the first ring with a respective one of the three switch chips of the second ring through the backplane; and connecting each of the three switch chips of the third ring with a respective one of the three switch chips of the fourth ring as a b-dimensional connection through the backplane to form the silicon cell switch in a 2 x 3 mode.
Preferably, when the plurality of switch main boards includes 9 switch main boards, the 9 switch main boards are arranged on the backplane in a parallel manner; interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring, a second ring and a third ring through the backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a fourth ring, a fifth ring and a sixth ring through the backboard to be connected in a c-dimension; and connecting the first ring with the second ring and the third ring, respectively, connecting the second ring with the third ring, connecting the fourth ring with the fifth ring and the sixth ring, and connecting the fifth ring with the sixth ring as a b-dimensional connection through the back plate.
Preferably, connecting the first ring to the second ring and the third ring, respectively, connecting the second ring to the third ring, connecting the fourth ring to the fifth ring and the sixth ring, and connecting the fifth ring to the sixth ring as a b-dimensional connection further comprises: connecting, by the backplane, each of the three switch chips of the first ring with a respective one of the three switch chips of the second ring and with a respective one of the three switch chips of the third ring; connecting each of the three switch chips of the second ring with a respective one of the three switch chips of the third ring through the backplane; and connecting each of the three switch chips of the fourth ring with a respective one of the three switch chips of the fifth ring and with a respective one of the three switch chips of the sixth ring through the backplane; and connecting each of the three switch chips of the fifth ring with a corresponding one of the three switch chips of the sixth ring as a b-dimensional connection through the backplane to form the silicon cell switch of a 2 × 3 × 3 mode.
Preferably, when each of the switch boards includes 3 or more switch chips, the 3 or more switch chips on each of the switch boards are connected as a ring as an a-dimensional connection.
Preferably, the a-dimensional connections, the b-dimensional connections, and the c-dimensional connections are wired connections within the PCB rather than fiber optic or copper cable connections.
Preferably, the plurality of switch boards and the backplane that complete the a-dimensional connection, the b-dimensional connection, and the c-dimensional connection are encapsulated to form the silicon unit switch.
Preferably, a plurality of the silicon unit switches are externally connected in X dimension, Y dimension and Z dimension in a similar manner to the a dimension, the b dimension and the c dimension to form an X XYXZ mode switch, wherein X ≧ 1, Y ≧ 1 and Z ≧ 2.
Preferably, when X is 1 and Y is 1, the switch is a 4-dimensional switch system.
Preferably, when X ═ 1 or Y ═ 1, the switch is a 5-dimensional switch system.
Preferably, when the X is more than or equal to 2, the Y is more than or equal to 2, and the Z is more than or equal to 2, the switch is a 6-dimensional switch system.
Preferably, any two dimensions of the X-dimension connection, the Y-dimension connection, and the Z-dimension connection are copper cable interfaces, and the remaining one dimension is a fiber interface.
According to another aspect of the present invention, there is provided a switch system including: a silicon cell switch of a x b x c mode, wherein a is greater than or equal to 2, b is greater than or equal to 2, and c is greater than or equal to 2, the silicon cell switch comprising: a switch chip; a plurality of switch boards, wherein each switch board comprises a plurality of switch chips; the back plate, a plurality of exchange mainboard settings are on the back plate, wherein, a plurality of switch chips on every exchange mainboard are in carry out a dimension and connect on the switch mainboard, a plurality of switch chips on a plurality of switch mainboards are in carry out b dimension and connect and c dimension on the back plate and connect.
The silicon unit switch provided by the invention adopts a 3D torus topological structure inside, and 3-dimensional interconnection is realized through a PCB. The technology saves the cost of the optical fiber and the copper cable, has short transmission distance and has better reliability than the optical fiber and the copper cable. Half of the external ports adopt 400Gbps copper cables, and the high-density connector and the customized outgoing line mode of the copper cable outgoing line have low cost, high density and small implementation difficulty; in addition, the copper cable basically has no power consumption, heat dissipation is not needed, and the difficulty of heat dissipation design is greatly reduced. The interconnection mode of the invention is flexible and changeable, supports the construction of 6D torus switching network topology, has high regularity, is convenient for wiring implementation, and has good expansibility and excellent fault tolerance. The method is easy to construct a large-scale network switching system, and can meet the requirements of E-level super computing on the network switching system.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method of constructing a switch system according to an embodiment of the present invention;
FIG. 2 is a diagram of a 3D topology of a silicon cell switch, according to an embodiment of the invention;
FIG. 3 is a diagram of the actual connection of a silicon cell switch according to an embodiment of the present invention;
FIG. 4 is a diagram of the actual connection of a silicon cell switch according to another embodiment of the present invention; and
fig. 5 is a 6-dimensional port allocation diagram for a switch system according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The method for interconnecting the silicon unit switch from inside to outside designed by the method has the advantages of high reliability, good expansibility, fault tolerance, low cost, low power consumption and the like, is easy to construct a large-scale network switching system, and can meet the requirement of E-level calculation on the network switching system.
Fig. 1 is a flowchart of a method of constructing a switch system according to an embodiment of the present invention. Hereinafter, a construction method of the switch system will be described with reference to fig. 1.
Referring to fig. 1, a method 100 of constructing a switch system according to an embodiment of the present invention includes: in step 102, providing a plurality of switch boards, wherein each switch board comprises a plurality of switch chips; in step 104, connecting a plurality of switch chips on each switch motherboard as a-dimensional connections; in step 106, a plurality of switch motherboards are disposed on the backplane, and a plurality of switch chips on the switch motherboards are connected in b dimension and c dimension through the backplane to form a silicon cell switch in a × b × c mode, where a is greater than or equal to 2, b is greater than or equal to 2, and c is greater than or equal to 2.
The silicon unit switch provided by the invention adopts a 3D Torus (3dimensional Torus, namely, a 3-dimensional ring network) topological structure inside, and 3-dimensional interconnection is realized through a PCB (Printed Circuit Board, Chinese name is Printed Circuit Board, also called Printed Circuit Board). The technology saves the cost of the optical fiber and the copper cable, has short transmission distance and has better reliability than the optical fiber and the copper cable.
Hereinafter, a construction method of the switch system will be described in detail with reference to fig. 1. The method 100 for constructing a switch system includes: in step 102, a plurality of switch boards are provided, wherein each switch board includes a plurality of switch chips.
In step 104, a plurality of switch chips on each switch board are connected as a-dimensional connections. When each switch board includes 2 switch chips on both ends thereof, the 2 switch chips on each switch board are interconnected as a-dimensional connection. In another embodiment, when each switch board includes more than 3 switch chips, the more than 3 switch chips on each switch board are connected as a ring as the a-dimensional connection.
In step 106, a plurality of switch motherboards are disposed on the backplane, and a plurality of switch chips on the switch motherboards are connected in b dimension and c dimension through the backplane to form a silicon cell switch in a × b × c mode, where a is greater than or equal to 2, b is greater than or equal to 2, and c is greater than or equal to 2. In one embodiment, when each switch board includes 2 switch chips on both ends thereof, the 2 switch chips on each switch board are interconnected as a-dimensional connections. When the plurality of switching main boards comprise 6 switching main boards, arranging the 6 switching main boards on the back board in a parallel mode; interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring and a second ring through a backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a third ring and a fourth ring through the backboard to be connected as a c-dimension; and connecting the first ring with the second ring and the third ring with the fourth ring as a b-dimensional connection. Specifically, connecting the first ring with the second ring and the third ring with the fourth ring as a b-dimensional connection further comprises: connecting each of the three switch chips of the first ring with a respective one of the three switch chips of the second ring through the backplane; and connecting each of the three switch chips of the third ring with a corresponding one of the three switch chips of the fourth ring as a b-dimensional connection through the backplane to form a 2 x 3 mode silicon cell switch.
In another embodiment, when the plurality of switch motherboards includes 9 switch motherboards, the 9 switch motherboards are arranged on the backplane in a parallel manner; interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring, a second ring and a third ring through a backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a fourth ring, a fifth ring and a sixth ring through the backboard to be connected as a c-dimension; and connecting the first ring with the second ring and the third ring, connecting the second ring with the third ring, connecting the fourth ring with the fifth ring and the sixth ring, and connecting the fifth ring with the sixth ring as a b-dimensional connection through the back plate. Specifically, connecting the first ring to the second ring and the third ring, respectively, connecting the second ring to the third ring, connecting the fourth ring to the fifth ring and the sixth ring, and connecting the fifth ring to the sixth ring as a b-dimensional connection further comprises: connecting each of the three switch chips of the first ring with a respective one of the three switch chips of the second ring and with a respective one of the three switch chips of the third ring through the backplane; connecting each of the three switch chips of the second ring with a respective one of the three switch chips of the third ring through the backplane; and connecting each of the three switch chips of the fourth ring with a respective one of the three switch chips of the fifth ring and with a respective one of the three switch chips of the sixth ring through the backplane; and connecting each of the three switch chips of the fifth ring with a corresponding one of the three switch chips of the sixth ring as a b-dimensional connection through the backplane to form a 2 × 3 × 3 mode silicon cell switch.
In the above embodiments, the a-dimensional, b-dimensional, and c-dimensional connections are wiring connections within the PCB rather than optical fiber connections or copper cable connections. And packaging the plurality of switching main boards and the plurality of switching back boards which finish the a-dimension connection, the b-dimension connection and the c-dimension connection to form the silicon unit switch. And carrying out external X-dimension connection, Y-dimension connection and Z-dimension connection of the silicon unit switches by a plurality of silicon unit switches in a similar manner to the a-dimension connection, the b-dimension connection and the c-dimension connection to form the switch of an X multiplied by Y multiplied by Z mode, wherein X is more than or equal to 1, Y is more than or equal to 1, and Z is more than or equal to 2. In the first embodiment, when X is 1 and Y is 1, the switch is a 4-dimensional switch system. In the second embodiment, when X ═ 1 or Y ═ 1, the switch is a 5-dimensional switch system. In a third embodiment, the switch is a 6-dimensional switch system when X ≧ 2, Y ≧ 2, and Z ≧ 2. Any two dimensions of the X-dimension connection, the Y-dimension connection and the Z-dimension connection are copper cable interfaces, and the remaining one dimension is an optical fiber interface.
Fig. 2 is a diagram of a 3D topology of a silicon cell switch, according to an embodiment of the invention. Fig. 3 is a diagram of an actual connection of a silicon cell switch according to an embodiment of the present invention. Fig. 4 is a diagram of an actual connection of a silicon cell switch according to another embodiment of the present invention. Fig. 5 is a 6-dimensional port allocation diagram for a switch system according to an embodiment of the invention. Hereinafter, a method of constructing the silicon cell switch system will be illustrated with reference to fig. 2 to 5.
The invention provides a design method of a silicon unit switch for constructing a 6D torus topological structure switching system. The silicon unit switch constructs a 6D torus topological structure network switching system, firstly, internal 3D torus interconnection is completed, secondly, external 3D torus interconnection is completed, and accordingly 6D torus topology is constructed.
(1) 3D torus interconnection method in silicon unit switch
The silicon unit switch designed by the method is internally based on a 3D torus topological structure, and has 3 a/b/c dimensions (a, b and c respectively represent 3 dimensions in the silicon unit switch). The basic unit formed by the 3D torus interconnection of a/b/c is called a silicon-element routing network, i.e. a silicon-element switch.
By using the method, the 3 dimensions of a/b/c of the silicon unit switch are interconnected, and can be designed into a 3 multiplied by 2, 3 multiplied by 4 multiplied by 3 and other a multiplied by b multiplied by c (a is more than or equal to 2, b is more than or equal to 2, and c is more than or equal to 2) modes, and the silicon unit switch takes the topological structure of 2 multiplied by 3 as an example, regardless of an interconnection mode.
The silicon unit switch comprises 6 switch main boards, wherein each switch main board is provided with 2 switch chips, and the total number of the switch chips is 12. The 3-dimensional 2 x 3 interconnection of a/b/c in 3D Torus is completed by a PCB, 1 dimension is completed by a mainboard PCB, and 2 dimensions are completed by a backboard PCB. The technology saves the cost of the optical fiber and the copper cable, has short transmission distance and has better reliability than the optical fiber and the copper cable.
The 12 exchange chips are numbered from 1 to 12. The 12 switching chips are interconnected through the PCB to form a 3-dimensional topological structure. Fig. 2 shows a 3D torus topology diagram of the silicon cell switch.
Fig. 3 shows a 2 x 3D torus topology of silicon switches, the actual way of interconnection in a/b/c 3 dimensions. Wherein, the solid straight line with an arrow is a dimension; the virtual broken line with an arrow is a dimension b; the solid arc with arrow is the c dimension. In the interconnection method, the backboard PCB realizes the interconnection of two dimensions. The interconnection method is not limited to the mode of the silicon unit switch, and the 2 x 3 topology can be realized by taking the actual wiring space of the PCB of the backboard as the standard. In another example, FIG. 4 shows a 2X 3D torus topology of silicon switches, the actual way of interconnection in a/b/c 3 dimensions.
(2) Interconnection method of external 3D torus of silicon unit switch
On the basis of 3 dimensions of internal 3Dtorusa/b/c, the silicon unit switch can be expanded into a 4D/5D/6D torus structure network switching system through three dimensions (X, Y and Z respectively represent 3 dimensions outside the silicon unit switch) of external 3D torus X/Y/Z of a 400Gbps copper cable and 100Gbps (100 Gbits per second), namely, 100 Gbits per second) QSFP28 interface optical fiber, wherein QSFP28 is an optical interface supporting 100Gbps transmission.
When the silicon unit exchanger forms a 6D torus, the X/Y/Z3-dimensional interconnection method can also be designed into a plurality of interconnection modes X multiplied by Y multiplied by Z (X is more than or equal to 2, Y is more than or equal to 2, and Z is more than or equal to 2).
Taking this silicon unit switch motherboard as an example, each switch chip has an interface with external X/Y/Z3 dimensions in addition to an interface with internal a/b/c 3 dimensions, and a port allocation diagram with 6 dimensions (see fig. 5):
in X/Y/Z3 dimensions, two dimensions of Y and Z are 400Gbps copper cable interfaces; the X dimension is a QSFP28 fiber optic interface at 100 Gbps. Compared with an optical fiber interface, the 400Gbps copper cable is low in cost, high in density, easy to implement and free of power consumption.
In summary, the invention provides a design method of a silicon unit switch for constructing a 6D torus topological structure switching system. The interconnection mode of the method is flexible and changeable, and various types of silicon switches can be designed according to the method to construct various types of 6D torus topology network switching systems. The method uses PCB interconnection in a/b/c 3 dimensions of the internal 3D torus; when constructing X/Y/Z3 dimensions of 6D torus, 400Gbps copper cables and 100Gbps QSFP28 interface optical fibers are used for interconnection. The silicon unit switch designed by the method integrates the advantages of excellent bandwidth performance, reliability, expansibility, fault tolerance, low cost, low power consumption and the like.
Fig. 3 is a block diagram of a silicon cell switch according to an embodiment of the present invention. Hereinafter, the switch system will be described with reference to fig. 3.
Referring to fig. 3, a switch system according to an embodiment of the present invention includes: the silicon unit switch of the a x b x c mode, wherein a is more than or equal to 2, b is more than or equal to 2, and c is more than or equal to 2, the silicon unit switch comprises: switch chips 1-12; a plurality of switch boards, wherein each switch board comprises a plurality of switch chips; the back plate, a plurality of exchange mainboard setting are on the back plate, and wherein, a dimension is connected on the switch mainboard to a plurality of switch chips on every exchange mainboard, and a plurality of switch chips on a plurality of switch mainboards carry out b dimension and connect with c dimension on the back plate.
Other configurations regarding the switch system are the same as in the above construction method of the switch system, and therefore, are not described in detail here.
The silicon unit switch provided by the invention adopts a 3D torus topological structure inside, and 3-dimensional interconnection is realized through a PCB. The technology saves the cost of the optical fiber and the copper cable, has short transmission distance and has better reliability than the optical fiber and the copper cable. Half of the external ports adopt 400Gbps copper cables, and the high-density connector and the customized outgoing line mode of the copper cable outgoing line have low cost, high density and small implementation difficulty; in addition, the copper cable basically has no power consumption, heat dissipation is not needed, and the difficulty of heat dissipation design is greatly reduced. The interconnection mode of the invention is flexible and changeable, supports the construction of 6D torus switching network topology, has high regularity, is convenient for wiring implementation, and has good expansibility and excellent fault tolerance. The method is easy to construct a large-scale network switching system, and can meet the requirements of E-level super computing on the network switching system.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. A method of constructing a switch system, comprising:
providing a plurality of switch main boards, wherein each switch main board comprises a plurality of switch chips;
connecting a plurality of switch chips on each switch mainboard to be used as a-dimensional connection;
arranging the plurality of switching main boards on a back board, and performing b-dimensional connection and c-dimensional connection on a plurality of switch chips on the plurality of switching main boards through the back board to form a silicon unit switch with an a x b x c mode, wherein a is more than or equal to 2, b is more than or equal to 2, and c is more than or equal to 2;
interconnecting the 2 switch chips on each switch motherboard as an a-dimensional connection when the each switch motherboard includes 2 switch chips on both ends thereof;
when the plurality of switching main boards comprise 6 switching main boards, arranging the 6 switching main boards on the back board in a parallel mode;
interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring and a second ring through a backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a third ring and a fourth ring through the backboard to be connected as a c-dimension; and
connecting the first ring with the second ring and the third ring with the fourth ring as a b-dimensional connection.
2. The method of constructing a switch system according to claim 1, wherein connecting the first ring with the second ring and connecting the third ring with the fourth ring as a b-dimensional connection further comprises:
connecting each of the three switch chips of the first ring with a respective one of the three switch chips of the second ring through the backplane; and
connecting each of the three switch chips of the third ring with a respective one of the three switch chips of the fourth ring as a b-dimensional connection through the backplane to form the silicon cell switch in a 2 x 3 mode.
3. The method according to claim 1, wherein when the plurality of switch boards includes 9 switch boards, the 9 switch boards are arranged on the backplane in a parallel manner;
interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring, a second ring and a third ring through the backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a fourth ring, a fifth ring and a sixth ring through the backboard to be connected in a c-dimension; and
the first ring is connected to the second ring and the third ring, respectively, the second ring is connected to the third ring, the fourth ring is connected to the fifth ring and the sixth ring, and the fifth ring is connected to the sixth ring as a b-dimensional connection.
4. The method of constructing a switch system according to claim 3, wherein connecting the first ring to the second ring and the third ring, respectively, connecting the second ring to the third ring, connecting the fourth ring to the fifth ring and the sixth ring, and connecting the fifth ring and the sixth ring as a b-dimensional connection further comprises:
connecting, by the backplane, each of the three switch chips of the first ring with a respective one of the three switch chips of the second ring and with a respective one of the three switch chips of the third ring;
connecting each of the three switch chips of the second ring with a respective one of the three switch chips of the third ring through the backplane; and
connecting each of the three switch chips of the fourth ring with a respective one of the three switch chips of the fifth ring and with a respective one of the three switch chips of the sixth ring through the backplane; and
connecting each of the three switch chips of the fifth ring with a corresponding one of the three switch chips of the sixth ring as a b-dimensional connection through the backplane to form the silicon cell switch of a 2 × 3 × 3 mode.
5. The method according to claim 1, wherein when each of the switch boards includes 3 or more switch chips, the 3 or more switch chips on each of the switch boards are connected as a ring as an a-dimensional connection.
6. The method of constructing a switch system according to claim 1, wherein the a-dimensional connection, the b-dimensional connection, and the c-dimensional connection are wiring connections within a PCB instead of optical fiber connections or copper cable connections.
7. The method of constructing a switch system according to claim 1, wherein the plurality of switch boards and the backplane on which the a-dimensional connection, the b-dimensional connection, and the c-dimensional connection are completed are packaged to form the silicon cell switch.
8. The method of claim 1, wherein a plurality of the silicon switches are externally connected in X, Y and Z dimensions in a similar manner to the a, b and c dimensions to form an X X Y X Z-mode switch, wherein X ≧ 1, Y ≧ 1 and Z ≧ 2.
9. The method of constructing a switch system according to claim 8, wherein when X is 1 and Y is equal to 1, the switch is a 4-dimensional switch system.
10. The method according to claim 8, wherein the switch is a 5-dimensional switch system when the X or Y is 1.
11. The method of claim 8, wherein the switch is a 6-dimensional switch system when X ≧ 2, Y ≧ 2, and Z ≧ 2.
12. The method of constructing a switch system according to claim 8, wherein any two dimensions of the X-dimensional connection, the Y-dimensional connection, and the Z-dimensional connection are copper cable interfaces, and the remaining one dimension is a fiber interface.
13. A switch system, comprising: a silicon cell switch of a x b x c mode, wherein a is greater than or equal to 2, b is greater than or equal to 2, and c is greater than or equal to 2, the silicon cell switch comprising:
a switch chip;
a plurality of switch boards, wherein each switch board comprises a plurality of switch chips;
a backplane on which the plurality of switch motherboards are disposed,
wherein the switch chips on each switch motherboard are connected in a-dimension on the switch motherboard, and the switch chips on the switch motherboards are connected in b-dimension and c-dimension on the backplane,
when said each switch board includes 2 switch chips on both ends thereof, interconnecting said 2 switch chips on said each switch board as an a-dimensional connection,
when the plurality of switching main boards comprise 6 switching main boards, arranging the 6 switching main boards on the back board in a parallel mode;
interconnecting the switch chips respectively positioned on one ends of the three adjacent switch main boards into a first ring and a second ring through a backboard, and interconnecting the switch chips positioned on the other ends of the three adjacent switch main boards into a third ring and a fourth ring through the backboard to be connected as a c-dimension; and
connecting the first ring with the second ring and the third ring with the fourth ring as a b-dimensional connection.
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| CN201711440497.9A CN108183872B (en) | 2017-12-27 | 2017-12-27 | Switch system and construction method thereof |
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| CN201711440497.9A CN108183872B (en) | 2017-12-27 | 2017-12-27 | Switch system and construction method thereof |
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| CN113840453A (en) * | 2021-09-28 | 2021-12-24 | 杭州云合智网技术有限公司 | Mainboard structure of switch |
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| CN105281917A (en) * | 2014-07-21 | 2016-01-27 | 中兴通讯股份有限公司 | Backplane structure and centralized switching device |
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| US7486619B2 (en) * | 2004-03-04 | 2009-02-03 | International Business Machines Corporation | Multidimensional switch network |
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