WO2014061942A2

WO2014061942A2 - Method for forming organic pattern

Info

Publication number: WO2014061942A2
Application number: PCT/KR2013/009091
Authority: WO
Inventors: 이준혁; 김동준; 안현철; 함호완; 한정우; 김근태
Original assignee: 주식회사 제이앤드제이 캐미칼
Priority date: 2012-10-16
Filing date: 2013-10-11
Publication date: 2014-04-24
Also published as: KR101979762B1; WO2014061942A3; KR20140048647A

Abstract

The present invention provides a method for forming an organic pattern. The method for forming an organic pattern according to one embodiment of the present invention includes the steps of: forming a donor film and an organic layer on a first substrate; arranging a second substrate so that the second substrate corresponds to the first substrate; and heating the first substrate in order to sublimate a material forming the organic layer so as to form an organic pattern layer on the second substrate, wherein the position on the first substrate where the organic layer is formed corresponds to the position on the second substrate where the organic pattern layer is formed.

Description

Organic pattern formation method

The present invention relates to a method of forming an organic pattern.

Recently, ORGANIC LIGHT EMITTING DISPLAY DEVICE, one of the display devices, has been spotlighted as a next-generation display due to its excellent characteristics such as self-luminous, low power consumption, and excellent visibility compared to liquid crystal display devices. have.

The display requires basic pixels of red, green, and blue, which are the three primary colors of light, to achieve full color. Through the mixing of the light emitted from these pixels, colors of the desired image are realized. The pixel formation technique refers to a method of forming red, green, and blue basic pixels, and requires a very sophisticated printing technique.

Conventionally, a fine metal mask (FMM), a laser induced thermal imaging (LITI), or the like using a deposition method is used as a pixel formation method. The above methods have advantages, but in the case of the micromask method, the pattern precision may be inferior, and in the case of the laser transfer method, there are problems such as interfacial compatibility between the donor film and the substrate and proper particle control method in a large area process.

The problem to be solved by the present invention is to provide an organic pattern forming method which is excellent in pattern precision and simplifies the process.

The organic pattern forming method according to the embodiment of the present invention comprises the steps of forming a donor film and an organic layer on the first substrate, arranging a second substrate to correspond to the first substrate and applying heat to the first substrate Forming an organic pattern layer on the second substrate by subliming the material forming the organic layer, wherein the position on the first substrate on which the organic layer is formed and the position on the second substrate on which the organic pattern layer are formed are Correspond to each other.

The material for forming the organic layer to be sublimated by applying heat to the first substrate may go straight to form the organic pattern layer on the second substrate.

The number of organic layer forming portions on the first substrate on which the organic layer is formed may be the same as the number of organic pattern layer forming portions on the second substrate on which the organic pattern layer is formed.

The disposing of the second substrate may include aligning the first substrate and the second substrate to be spaced apart by a micro unit distance.

The method may further include forming a plurality of pattern portions on the donor film, and the organic layer may be formed on the plurality of pattern portions.

The plurality of pattern portions may be formed at positions corresponding to the pixel areas of the second substrate, and the plurality of pattern portions may form recesses in the donor film.

The organic pattern forming method may further include forming a pixel defining layer on the second substrate, and the pixel defining layer may be formed to have openings corresponding to the plurality of pattern portions.

The organic pattern layer may be formed in the opening.

Forming the organic layer may use a solution process.

The organic layer may include at least one of a first organic layer formed of a red organic material, a second organic layer formed of a blue organic material, and a third organic layer formed of a green organic material.

The material forming the first organic layer, the second organic layer, and the third organic layer may be simultaneously sublimed to form the organic pattern layer on the second substrate.

The organic pattern forming method may further include forming a pixel electrode and a hole transport layer on the second substrate, and the organic pattern layer may be deposited on the hole transport layer.

The donor film may be formed of polyimide or polystyrene.

Subsequently, the material forming the organic layer may be sublimed to form the organic pattern layer on the second substrate in a vacuum state.

The applying of heat to the first substrate may include disposing a heating source under the first substrate, and an area of the heating source and an area of the first substrate may be the same.

Heat may be applied to the first substrate in a state in which the heating source, the first substrate, and the second substrate are oriented parallel to the direction of gravity.

Subsequently, the material forming the organic layer may be sublimed to form the organic pattern layer on the second substrate without using a mask.

As described above, according to the exemplary embodiment of the present invention, an organic pattern layer may be simultaneously formed by applying heat after forming an organic layer having different colors on one substrate.

In addition, since the substrate including the organic layer and the substrate on which the organic pattern layer is formed are brought into close contact with each other in micro units, the organic material forming the organic layer by applying heat is sublimated to form an organic pattern layer, thereby improving pattern accuracy.

1 to 13 are a perspective view and a cross-sectional view showing an organic pattern forming method according to an embodiment of the present invention.

14 to 17 are diagrams showing experimental examples in which an organic pattern was formed using an organic pattern forming method according to an embodiment of the present invention.

18 and 19 are perspective views illustrating a method of forming an organic pattern according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the present invention to those skilled in the art.

In the drawings, the thicknesses of layers and regions are exaggerated for clarity. In addition, where a layer is said to be "on" another layer or substrate, it may be formed directly on the other layer or substrate, or a third layer may be interposed therebetween. Portions denoted by like reference numerals denote like elements throughout the specification.

1 to 13 are a perspective view, a layout, and a cross-sectional view showing an organic pattern forming method according to an embodiment of the present invention.

FIG. 1 is a perspective view of a pattern formed using a roller 1300 having a protruding shape on a surface thereof, and FIG. 2 is a perspective view of a pattern 1400P formed on a donor film 1200. 3 illustrates a perspective view of forming a pattern using a flat plate having protrusions PSP formed on a surface thereof.

Referring to FIG. 1, a donor film 1200 is formed on a first substrate 1100. The first substrate 1100 may be formed of glass or plastic having high conductivity. The donor film 1200 may be formed of a thermally durable polyimide resin, a polystyrene resin, a polyethylene resin, or an organic / inorganic copolymer. Here, the first substrate 1100 may be formed of a material having good heat transfer as well as indium tin oxide (ITO). For example, the first substrate 1100 may be formed of copper, nickel, aluminum, tungsten, molybdenum, titanium, graphene, or the like.

1 and 2, the pattern unit 1400P is formed on the donor film 1200 by using a roller 1300 having a plurality of protruding shapes formed on a surface thereof. The pattern portion 1400P may include a plurality of recesses 1400 on the donor film 1200. The roller 1300 presses the upper surface of the donor film 1200 and sequentially passes through the first row, the second row,... The recesses 1400 of the N-th row (N is a natural number) may be formed. The plurality of recesses 1400 formed as described above may have a matrix form.

Referring to FIG. 3, instead of the method of using the roller 1300 as in the embodiment of FIG. 1, the flat plate 1350 having a plurality of protrusions PSP formed on the surface is pressed against the donor film 1200 at a time to form the pattern portion 1400P. ) May be formed. When the flat plate 1350 illustrated in FIG. 3 is vertically disposed on the upper surface of the donor film 1200 and pressed, the pattern portion 1400P may be simultaneously formed as shown in FIG. 2.

However, instead of using the roller 1300 or the flat plate 1350 as in the above-described embodiment, the pattern portion 1400P may be formed through a photo process.

4 to 6, an organic material is formed on the pattern portion 1400P formed on the donor film 1200 using a solution process. In the present exemplary embodiment, a red organic material is formed in the first row of grooves among the plurality of recesses 1400 formed in the donor film 1200, and sequentially, the recesses 1400 of N + 3 rows (N is a natural number). It can form a red organic material.

Subsequently, the green organic material may be sequentially formed in the recess 1400 of the next row after the red organic material is formed, and the blue organic material may be sequentially formed in the recess 1400 of the next row after the green organic material is formed. . In this way, the RGB organic layer 1500 may be formed on the entire donor film 1200 on the first substrate 1100. However, the present invention is not limited to the order and method of forming the organic material described in this embodiment, and the order of red, green, and blue may be changed, and instead of the imprinting method used in this embodiment, an inkjet printing method and an electrospray (Electro— It is possible to form the organic layer 1500 in the pattern portion 1400P through various methods such as spraying or stamping. In addition, although the red, green, and blue organic materials are formed in the plurality of recesses 1400 in the present embodiment, it is also possible to form only one color of the organic materials in the plurality of recesses 1400.

The donor film 1200 and the first substrate 1100 including the pattern portion 1400P on which the organic layer 1500 is formed thus constitute the pattern forming substrate 1000.

Referring to FIG. 7, the organic light emitting panel 100 is disposed on the donor film 1200 in which the organic material is formed in the pattern unit 1400P. In the organic light emitting panel 100, a thin film layer 200 including a thin film transistor is formed on the second substrate 110, and the organic light emitting device 70 including a pixel electrode is formed on the thin film layer 200 including the thin film transistor. Formed. A hole transport layer or the like may be formed on the pixel electrode. Here, the pattern forming substrate 1000 and the organic light emitting panel 100 may be aligned such that the distance between the donor film 1200 and the organic light emitting panel 100 is a micro unit. Here, micro units can refer to a range of several micrometers to thousands of micrometers. In detail, in the present embodiment, the distance between the donor film 1200 and the organic light emitting panel 100 may be 0 to 5 cm. As such, the distance between the donor film 1200 and the organic light emitting panel 100 may be larger than a micro unit, but as the distance increases, the heating temperature of the subsequent process may increase, and the organic material may be patterned at a desired position in the subsequent process. The accuracy for forming can be inferior. Therefore, the distance between the donor film 1200 and the organic light emitting panel 100 preferably has a range of 0.01 μm to 5000 μm. However, in another embodiment, the donor film 1200 and the organic light emitting panel 100 may contact each other without being spaced apart.

The heating source HS is disposed on a surface opposite to the surface of the first substrate 1100 on which the donor film 1200 is formed. Heat is applied to the pattern forming substrate 1000 using the heating source HS. Heat is transferred to the donor film 1200 through the first substrate 1100 to which heat is applied, and the organic material constituting the organic layer 1500 formed on the pattern portion 1400P of the donor film 1200 is sublimed. The sublimed organic material is deposited on the organic light emitting diode 70 of the organic light emitting panel 100.

The organic layer 1500 formed on the donor film 1200 includes a red organic layer 1500R, a green organic layer 1500G, and a blue organic layer 1500B. In the present embodiment, the heating source HS substantially heats the entire surface of the pattern forming substrate 1000 so that heat is simultaneously transferred to the red organic layer 1500R, the green organic layer 1500G, and the blue organic layer 1500B. Can be. In this case, an area of the heating source HS and an area of the first substrate 1100 of the pattern forming substrate may be substantially the same. Accordingly, the red organic material, the green organic material, and the blue organic material constituting the red organic layer 1500R, the green organic layer 1500G, and the blue organic layer 1500B may be simultaneously sublimed and deposited on the organic light emitting panel 100. .

The organic material deposited on the organic light emitting panel 100 forms an organic light emitting layer as an organic pattern layer.

In the present exemplary embodiment, the forming of the organic pattern layer on the organic light emitting panel 100 by subliming the material forming the organic layer 1500 may be performed in a vacuum state. Here, the vacuum state may be formed using a vacuum pump, and may include a range of about 10 ⁻⁴ torr to 10 ⁻⁸ torr which is generally regarded as a high vacuum condition.

In the present exemplary embodiment, the organic material of the pattern forming substrate 1000 is sublimed in a state where the donor film 1200 and the organic light emitting panel 100 are spaced apart and aligned at a micro unit distance, and thus, the organic light emitting panel 100 is sublimed to a desired position on the organic light emitting panel 100. An organic light emitting layer is formed as an organic pattern layer. Therefore, unlike the related art, an organic light emitting layer can be formed without using a mask, and an organic light emitting layer having high uniformity can be formed.

Unlike a fine metal mask (FMM) and a laser induced thermal imaging (LITI) method using a deposition method using a conventional pixel formation method, the distance between the pattern forming substrate and the organic light emitting panel is different as in the present embodiment. A method of subliming an organic material by applying heat in a state having a micro-distance distance to form an organic pattern layer may be defined as a micro evaporation array (MEA) process. In the micro-evaporation array process, since the organic material is sublimed and deposited on a face-to-face in a state in which the pattern forming substrate 1000 and the organic light emitting panel 100 are separated by micro units, the microevaporation array process is entirely formed on the organic light emitting panel 100. An organic pattern layer is formed. Unlike the laser transfer method, the microevaporation array process does not require a photothermal conversion layer because no laser is used.

Since the organic material is linearly sublimated, the position of the organic layer 1500 formed on the pattern forming substrate 1000 and the position of the organic emission layer 720 may correspond to each other as shown in FIG. 9. In detail, the number of organic layer forming parts on which the organic layer 1500 illustrated in FIG. 7 is formed may be the same as the number of organic pattern layer forming parts on which the organic emission layer 720 illustrated in FIG. 9 is formed. In this case, the organic material is linearly sublimed, and the organic layer 1500 formed of the organic material is transferred one to one on the organic light emitting panel 100 facing the pattern forming substrate 1000 to form the organic light emitting layer 720. Means that. In fact, the organic material may be transferred from the pattern forming substrate 1000 to the organic light emitting display panel 100 through free electron motion, and the free electron motion means that molecules constituting the organic material do not collide with other molecules and proceed. .

The heat applied to sublimate the organic material may be about 150 degrees Celsius, but is not limited thereto, and may be lower or higher.

The present embodiment can be applied to a cassette system in which a plurality of devices capable of performing a microevaporation array process in one chamber are arranged. By applying the same vacuum state in one chamber to perform a plurality of micro-evaporation processes at the same time, it is possible to improve the process yield and reduce the process time.

FIG. 8 is a modified embodiment of the embodiment of FIG. 7. The microevaporation array process is performed in a state in which the heating source HS, the pattern forming substrate 1000, and the organic light emitting display panel 100 are placed in parallel with the gravity direction. Can be performed.

Referring to FIG. 9, an organic light emitting layer 720 including a red organic light emitting layer 720R, a green organic light emitting layer 720G, and a blue organic light emitting layer 720B on the organic light emitting display panel 100 by a microevaporation array process. Is formed. The organic emission layer 720 may be formed in a matrix form.

Hereinafter, the organic light emitting panel 100 described with reference to FIG. 9 will be described in detail with reference to FIGS. 10 to 13.

10 is a layout view illustrating an organic light emitting panel 100 according to an exemplary embodiment of the present invention, and FIGS. 11 to 13 are cross-sectional views taken along the cutting line X-X of FIG. 10.

Referring to FIG. 10, the switching thin film transistor 10, the driving thin film transistor 20, the power storage device 80, and the organic light emitting device 70 are included in each pixel on the second substrate 110. The organic light emitting panel 100 further includes a gate line 151 arranged along one direction, a data line 171 and a common power line 172 that are insulated from and cross the gate line 151. Here, one pixel may be defined as a boundary between the gate line 151, the data line 171, and the common power line 172.

The organic light emitting diode 70 includes a pixel electrode 710, an organic emission layer 720 formed on the pixel electrode 710, and a common electrode 730 (shown in FIG. 12) formed on the organic emission layer 720. do. Here, the pixel electrode 710 is a positive electrode which is a hole injection electrode, and the common electrode 730 is a negative electrode which is an electron injection electrode. However, the present invention is not necessarily limited thereto, and the pixel electrode 710 may be a cathode and the common electrode 730 may be an anode according to a driving method of the organic light emitting panel 100. Holes and electrons are injected into the organic emission layer 720 from the pixel electrode 710 and the common electrode 730, respectively. When the exciton, which is a combination of the injected hole and the electron, falls from the excited state to the ground state, light emission occurs.

The switching thin film transistor 10 includes a switching semiconductor layer 131, a switching gate electrode 152, a switching source electrode 173, and a switching drain electrode 174, and the driving thin film transistor 20 includes the driving semiconductor layer 132. ), A driving gate electrode 155, a driving source electrode 176, and a driving drain electrode 177.

The power storage device 80 includes a first storage electrode 158 and a second storage electrode 178 disposed with the gate insulating layer 140 interposed therebetween.

The switching thin film transistor 10 is used as a switching element for selecting a pixel to emit light. The switching gate electrode 152 is connected to the gate line 151. The switching source electrode 173 is connected to the data line 171. The switching drain electrode 174 is spaced apart from the switching source electrode 173 and is connected to the first sustain electrode 158.

The driving thin film transistor 20 applies driving power to the pixel electrode 710 for emitting the organic light emitting layer 720 of the organic light emitting element 70 in the selected pixel. The driving gate electrode 155 is connected to the first sustain electrode 158. The driving source electrode 176 and the second storage electrode 178 are connected to the common power line 172, respectively. The driving drain electrode 177 is connected to the pixel electrode 710 of the organic light emitting diode 70 through the contact hole 182.

With this structure, the switching thin film transistor 10 operates by a gate voltage applied to the gate line 151 to transfer a data voltage applied to the data line 171 to the driving thin film transistor 20. . The voltage corresponding to the difference between the common voltage applied to the driving thin film transistor 20 from the common power supply line 172 and the data voltage transferred from the switching thin film transistor 10 is stored in the power storage device 80, and the power storage device 80 The current corresponding to the voltage stored in the) flows through the driving thin film transistor 20 to the organic light emitting device 70 to emit light.

Hereinafter, the structure of the organic light emitting panel 100 according to the exemplary embodiment of the present invention will be described in detail with reference to FIG. 10. FIG. 10 illustrates the organic light emitting display panel 100 mainly around the driving thin film transistor 2, the organic light emitting element 70, and the power storage element 80.

Hereinafter, the structure of the thin film transistor with the driving thin film transistor 20 will be described in detail. In addition, the switching thin film transistor 10 will be briefly described only with respect to the driving thin film transistor.

In the present embodiment, the second substrate 110 is formed of an insulating substrate. The buffer layer 120 is formed on the second substrate 110. The buffer layer 120 serves to prevent infiltration of impurities and planarize the surface, and may be formed of various materials capable of performing such a role.

The driving semiconductor layer 132 is formed on the buffer layer 120. The driving semiconductor layer 132 is formed of a polycrystalline silicon film. In addition, the driving semiconductor layer 132 may include a channel region 135 that is not doped with impurities, and a source region 136 and a drain region 137 formed by p + doping to both sides of the channel region 135. At this time, the ionic material to be doped is a P-type impurity such as boron (B), and mainly B2H6 is used. Here, such impurities vary depending on the type of thin film transistor.

In the exemplary embodiment of the present invention, a thin film transistor having a PMOS structure using P-type impurities is used as the driving thin film transistor 20, but is not limited thereto. Therefore, both the NMOS structure or the CMOS structure thin film transistor may be used as the driving thin film transistor 20.

Further, in one embodiment of the present invention, the driving thin film transistor 20 is a polycrystalline thin film transistor including a polysilicon film, but the switching thin film transistor 10 may be a polycrystalline thin film transistor or an amorphous thin film transistor including an amorphous silicon film.

A gate insulating layer 140 formed of silicon nitride (SiNx) or silicon oxide (SiO 2) is formed on the driving semiconductor layer 132. A gate wiring including the driving gate electrode 155 is formed on the gate insulating layer 140. The gate wiring further includes a gate line 151, a first storage electrode 158, and other wirings. In addition, the driving gate electrode 155 may be formed to overlap at least a portion of the driving semiconductor layer 132, particularly the channel region 135.

An interlayer insulating layer 160 covering the driving gate electrode 155 is formed on the gate insulating layer 140. The gate insulating layer 140 and the interlayer insulating layer 160 have contact holes that expose the source region 136 and the drain region 137 of the driving semiconductor layer 132. Similar to the gate insulating film 140, the interlayer insulating film 160 is made of silicon nitride (SiNx), silicon oxide (SiO 2), or the like.

The data line including the driving source electrode 176 and the driving drain electrode 177 is formed on the interlayer insulating layer 160. The data line further includes a data line 171, a common power supply line 172, a second storage electrode 178, and other wirings. The driving source electrode 176 and the driving drain electrode 177 are connected to the source region 136 and the drain region 137 of the driving semiconductor layer 132 through contact holes, respectively.

As such, the driving thin film transistor 20 including the driving semiconductor layer 132, the driving gate electrode 155, the driving source electrode 176, and the driving drain electrode 177 is formed. The configuration of the driving thin film transistor 20 is not limited to the above-described example, and may be variously modified to a known configuration that can be implemented by those skilled in the art.

The planarization layer 180 covering the

data lines

172, 176, 177, and 178 is formed on the interlayer insulating layer 160. The planarization layer 180 serves to remove the level difference and planarize in order to increase the luminous efficiency of the organic light emitting element to be formed thereon. In addition, the planarization layer 180 has a contact hole 182 exposing a part of the drain electrode 177.

The pixel electrode 710 is formed on the planarization layer 180 as one component of the organic light emitting diode. The pixel electrode 710 is connected to the drain electrode 177 through the contact hole 182 of the planarization layer 180.

In addition, a pixel defining layer 190 having an opening exposing the pixel electrode 710 is formed on the planarization layer 180. That is, the pixel electrode 710 is disposed to correspond to the opening of the pixel defining layer 190.

The pixel defining layer 190 may be made of a resin such as polyacrylates and polyimides.

Referring to FIG. 12, an organic emission layer 720 is formed on the pixel electrode 710 in the opening of the pixel defining layer 190. In the present exemplary embodiment, the organic emission layer 720 is formed on the pixel electrode 710 by subliming the organic material of the organic layer 1500 formed on the pattern forming substrate 1000 using the microevaporation array process described with reference to FIGS. 7 to 9. Can be formed. Here, when the pattern forming substrate 1000 and the organic light emitting panel 100 are faced to each other, the organic layer 1500 may be disposed to correspond to the opening of the pixel defining layer 190. Although not shown, first, a hole injection layer and a hole transport layer may be formed on the pixel electrode 710, and an organic emission layer 720 may be formed on the hole transport layer.

Referring to FIG. 13, a common electrode 730 is formed on the pixel defining layer 190 and the organic emission layer 720. Although not illustrated, an electron transport layer and an electron injection layer may be formed on the organic emission layer 720, and a common electrode 730 may be formed on the electron injection layer. In the present embodiment, the micro-evaporation array process is described as being applied to the organic light emitting layer 720. However, the micro-evaporation array process according to the present embodiment forms a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer. It is also possible to apply. As such, the organic light emitting layer, the hole injection layer, the hole transport layer, the electron transport layer, or the electron injection layer to which the microevaporation array process according to the present embodiment can be applied may be represented as an organic pattern layer.

As such, the organic light emitting diode 70 including the pixel electrode 710, the hole transport layer, the organic emission layer 720, the electron transport layer, and the common electrode 730 is formed.

An encapsulation member is formed on the common electrode 730 to form an organic light emitting display device including the organic light emitting panel 100. The sealing member serves to protect the organic light emitting element 70.

One of the pixel electrode 710 and the common electrode 730 may be formed of a transparent conductive material, and the other may be formed of a transflective or reflective conductive material. According to the types of materials forming the pixel electrode 710 and the common electrode 730, the organic light emitting diode display may be a top emission type, a bottom emission type, or a double-sided emission type.

Until now, the micro-evaporation array process according to the embodiment of the present invention has been described with reference to the case of forming the organic light emitting layer of the organic light emitting diode display. However, when the color filter of the liquid crystal display is formed, It can be applied to the case of forming a wide range of organic patterns, such as when forming or when forming a light emitting layer of an organic photovoltaic (OPV). The organic light emitting layer described above may be a color filter layer in the case of a liquid crystal display.

[[ 실험예Experimental Example ]]

With the method shown in Figures 14 to 17, it was tested whether the organic pattern is actually formed by the micro-evaporation array process according to one embodiment of the present invention.

In FIG. 14, tris- (8-hydroxy quinoline) or polyvinylcabazole (PVK) using chloroform (CHCl3) as a solvent using the spin coating method under the same conditions. The mixed organic material was deposited on an ITO substrate 1 to form an organic thin film 2. Experimental example in which the organic thin film 2 was deposited at room temperature (about 25 degrees Celsius) for 10 minutes was performed.

In FIG. 15, the edge portion of the organic thin film 2 is removed to form the edge pattern portion P. FIG. Here, the edge pattern portion P may be formed using an edge bead remover (EBR), and remain on the edge portion of the substrate 1 after spin coating through a process of forming the edge pattern portion P. Residuals can be removed.

In FIG. 16, the polyimide tape 3 was formed in the edge part of the organic thin film 2 removed. The polyimide tape 3 may be formed in the edge pattern portion P. FIG. The thickness of the polyimide tape 3 can be adjusted to set the distance between the ITO substrate 1 and the corresponding organic pattern forming substrate 4 (shown in FIG. 17) in micro units.

In FIG. 17, the heating source HS is disposed on the lower surface of the substrate 1, and the organic pattern forming substrate 4 is disposed at a position facing the organic thin film 2. Another polyimide tape 5 was formed on the organic pattern forming substrate 4 so as to overlap the polyimide tape 3. The two polyimide tapes 3 and 5 meshed with each other to set the distance between the organic thin film 3 and the organic pattern forming substrate 4 in micrometers of 120 um or 180 um. Here, the polyimide tape 5 formed on the organic pattern formation substrate 4 can be omitted.

The organic material forming the organic thin film 2 is heated by heating the substrate 1 through the heating source HS, and the organic thin film 2 receives the heat to form the organic thin film 2 by a micro-evaporation array process. (4) is deposited. This process was carried out in the chamber, and the pressure in the chamber was performed at high vacuum at 3.5 * 10 ^-5 torr.

As a result, in the experimental example, an organic material was deposited on the organic pattern formation substrate 4.

As described in the experimental example, when the organic thin film is heated in a high vacuum state, it may be confirmed that the organic material may be deposited on the organic pattern forming substrate spaced apart from the organic thin film by micro units.

18 and 19, unlike the exemplary embodiment described with reference to FIGS. 1 and 2, a plurality of recesses 2400 are formed in the donor film 2200 in a stripe shape. Pressing and passing the upper surface of the donor film 2200 using a roller 2300 having a protruding portion in a stripe shape to form a pattern portion 2400P including a plurality of concave portions 2400 in a stripe shape. With the first column, second column,... The recesses 2400 of the N-th row (N is a natural number) may be formed. Except for this difference, the subsequent processes of FIGS. 3 to 8 proceed in the same manner, and as a result, an organic light emitting layer having a stripe shape rather than a matrix shape can be formed.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Claims

Forming a donor film and an organic layer on the first substrate,

Disposing a second substrate so as to correspond to the first substrate; and

Applying heat to the first substrate to sublime a material forming the organic layer to form an organic pattern layer on the second substrate,

And a position on the first substrate on which the organic layer is formed and a position on the second substrate on which the organic pattern layer is formed correspond to each other.
In claim 1,

The material for forming the organic layer to be sublimated by applying heat to the first substrate is to go straight to form the organic pattern layer on the second substrate.
In claim 2,

And an organic pattern forming portion on the first substrate on which the organic layer is formed and an organic pattern forming portion on the second substrate on which the organic pattern layer is formed.
In claim 3,

The disposing of the second substrate may include arranging the first substrate and the second substrate to be spaced apart by a micro unit distance.
In claim 1,

And forming a plurality of pattern portions in the donor film, wherein the organic layer is formed in the plurality of pattern portions.
In claim 5,

And the plurality of pattern portions are formed at positions corresponding to the pixel regions of the second substrate, and the plurality of pattern portions form recesses in the donor film.
In claim 6,

Forming a pixel defining layer on the second substrate;

And the pixel defining layer is formed to have openings corresponding to the plurality of pattern portions.
In claim 7,

The organic pattern forming method of forming the organic pattern layer in the opening.
In claim 1,

Forming the organic layer is an organic pattern forming method using a solution process.
In claim 9,

The organic layer may include at least one of a first organic layer formed of a red organic material, a second organic layer formed of a blue organic material, and a third organic layer formed of a green organic material.
In claim 10,

And a material forming the first organic layer, the second organic layer, and the third organic layer at the same time to form the organic pattern layer on the second substrate.
In claim 1,

Forming a pixel electrode and a hole transport layer on the second substrate;

The organic pattern forming method of depositing the organic pattern layer on the hole transport layer.
In claim 1,

The donor film may be formed of polyimide (Polyimide) or polystyrene (Polystyrene).
In claim 1,

And forming the organic pattern layer on the second substrate by subliming the material forming the organic layer.
In claim 1,

And applying heat to the first substrate comprises arranging a heating source under the first substrate, wherein an area of the heating source and an area of the first substrate are the same.
The method of claim 15,

And heating the first substrate in a state in which the heating source, the first substrate, and the second substrate are placed in parallel with a gravity direction.
In claim 1,

And forming the organic pattern layer on the second substrate by subliming the material forming the organic layer, using the mask without using a mask.