WO2014050039A1 - Organic electroluminescent display apparatus and method for manufacturing same - Google Patents

Organic electroluminescent display apparatus and method for manufacturing same Download PDF

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Publication number
WO2014050039A1
WO2014050039A1 PCT/JP2013/005547 JP2013005547W WO2014050039A1 WO 2014050039 A1 WO2014050039 A1 WO 2014050039A1 JP 2013005547 W JP2013005547 W JP 2013005547W WO 2014050039 A1 WO2014050039 A1 WO 2014050039A1
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substrate
organic
sealing
sealing material
display device
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PCT/JP2013/005547
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French (fr)
Japanese (ja)
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亨 妹尾
剛 平瀬
有希 安田
岡本　哲也
通 園田
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シャープ株式会社
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to an organic electroluminescence display device and a manufacturing method thereof, and more particularly to an organic electroluminescence display device provided with a sealing substrate facing an element substrate and a manufacturing method thereof.
  • the organic EL display device manufactured by bonding the element substrate and the sealing substrate in a vacuum atmosphere via a frame-shaped sealing material, the element substrate and the sealing substrate are sealed.
  • the stop substrate is bonded and released to atmospheric pressure, gas enters the sealing material from the outside due to the pressure difference between the inside and outside of the frame-shaped sealing material sandwiched between the element substrate and the sealing substrate.
  • bubbles may be generated inside the sealing material.
  • the present invention has been made in view of the above points, and an object thereof is to suppress the generation of bubbles inside the sealing material due to a pressure difference between the inside and the outside of the frame-shaped sealing material. .
  • the present invention provides a high sealing material that surrounds an organic electroluminescent element and surrounds a sealing material that adheres the element substrate and the sealing substrate to the element substrate or the sealing substrate.
  • a lower outer protective wall is provided in a frame shape.
  • an organic electroluminescence display device includes an element substrate provided with an organic electroluminescence element, a sealing substrate provided facing the element substrate, the element substrate, and the sealing substrate.
  • An inner protective wall that is provided in a frame shape on the element substrate or the sealing substrate and is formed lower than the height of the sealing material may be provided between the sealing material and the organic electroluminescence element.
  • the dry sheet may be provided on the bottom surface of the recess formed in the sealing substrate.
  • the outer protective wall is lower than the height of the sealing material so as to surround the sealing material that surrounds the organic electroluminescent element and adheres the element substrate and the sealing substrate to the element substrate or the sealing substrate.
  • Is provided in a frame shape it is possible to suppress the generation of bubbles inside the seal material due to the pressure difference between the inside and the outside of the frame shape seal material.
  • the organic EL display device 50a is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other and between the element substrate 20 and the sealing substrate 30. And a sealing material 25 for bonding the element substrate 20 and the sealing substrate 30 to each other.
  • a display area for displaying an image is defined in an inner portion of the sealing material 25, and a plurality of pixels are arranged in a matrix in the display area.
  • a sub-pixel for performing red gradation display, a sub-pixel for performing green gradation display, and a sub-pixel for performing blue gradation display are adjacent to each other. It is arranged.
  • the element substrate 20 is provided in a frame shape so as to surround the base substrate 10 such as a glass substrate, the organic EL element 11 provided on the base substrate 10, and the organic EL element 11.
  • the inner protective wall 21b and the outer protective wall 21a provided in a frame shape so as to surround the inner protective wall 21b are provided.
  • a carrier blocking layer for blocking the flow of carriers such as holes and electrons may be inserted between the first electrode and the second electrode as necessary.
  • the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may be omitted as appropriate.
  • gate lines, source lines, power supply lines, TFTs, capacitors, and the like for driving each subpixel are provided between the base substrate 10 and the interlayer insulating film.
  • the outer protective wall 21a and the inner protective wall 21b are provided so as to extend in parallel with each other so that the sealing material 25 is disposed therebetween.
  • the outer protective wall 21a and the inner protective wall 21b are made of, for example, a single layer film or a laminated film such as a silicon oxide film, a silicon nitride film, an acrylic resin film, or a metal film, as shown in FIGS. It is lower than the height of the material 25 (for example, about 12 ⁇ m to 13 ⁇ m), for example, about 2 ⁇ m to 3 ⁇ m.
  • the outer protective wall 21a and the inner protective wall 21b each having a rectangular cross section are illustrated, but the outer protective wall 21a and the inner protective wall 21b are as shown in FIG.
  • a protective wall 21c in which the upper corner in the cross-sectional view is formed in an arc shape and the cross-section is formed in a substantially rectangular shape as shown in FIG.
  • a protective wall 21d formed in a trapezoidal shape, as shown in FIG. 5C may be a protective wall 21e formed in a trapezoidal cross section obtained by inverting the protective wall 21d up and down in the drawing.
  • the sealing material 25 is made of, for example, an ultraviolet curable epoxy resin.
  • the sealing material 25 is disposed by, for example, a dispenser method between the outer protective wall 21a and the inner protective wall 21b of the element substrate 20 on which the outer protective wall 21a and the inner protective wall 21b are formed in the protective wall forming step. .
  • the element substrate 20 on which the sealing material 25 is disposed and the sealing substrate 30 such as a glass substrate are bonded together in a reduced pressure atmosphere of, for example, about 1 kPa to 30 kPa, and then the reduced pressure atmosphere.
  • the outer surfaces of the element substrate 20 and the sealing substrate 30 are pressurized.
  • the sealing material 25 is cured by irradiating the sealing material 25 sandwiched between the element substrate 20 and the sealing substrate 30 with ultraviolet light.
  • the organic EL display device 50a of this embodiment can be manufactured.
  • the element substrate 20 and the sealing substrate surround the organic EL element 11 with respect to the element substrate 20 in the protective wall forming step. Since the frame-shaped outer protective wall 21a lower than the height of the sealing material 25 is formed outside the sealing material 25 that bonds the 30 to each other, the element substrate 20 and the sealing substrate 30 are interposed via the sealing material 25 in the bonding process. After bonding in a reduced pressure atmosphere, the portion exposed to the outside of the sealing material 25 is only the outer side surface of the portion higher than the outer protective wall 21a of the sealing material 25.
  • the outer protective wall 21a lower than the sealing material is formed in a frame shape between the sealing material 24 and the organic EL element 11 with respect to the element substrate 20. Since the height of the portion exposed to the outside of the sealing material 25 is reduced, the contact portion between the sealing substrate 30 and the sealing material 25 and the contact portion between the outer protective wall 21a and the sealing material 25 are provided. Can be increased. Thereby, since the adhesive force of the sealing material 25 and the sealing substrate 30 etc. can be improved, the inflow of the bubble to the organic EL element 11 through the sealing material 25 can be suppressed.
  • the inner protective wall that is lower than the height of the sealing material 25 between the sealing material 25 and the organic electroluminescent element 11 with respect to the element substrate 20. Since 21b is provided in a frame shape, deterioration of the organic EL element 11 due to the volatile component of the sealing material 25 can be suppressed.
  • the outer protective wall 21a and the inner protective wall 21b are provided to the element substrate 20 so as to extend in parallel with each other.
  • the sealing material 25 By arranging the sealing material 25 between the wall 21a and the inner protective wall 21b, the arrangement of the sealing material 25 can be facilitated.
  • the organic EL display device 50a in which the outer protective wall 21a and the inner protective wall 21b are formed on the element substrate 20 and the sealing material 25 is disposed and the manufacturing method thereof are exemplified.
  • FIG. 7 is a cross-sectional view of the organic EL display device 50c of this embodiment.
  • the same portions as those in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the organic EL display device 50c is provided in a frame shape between the element substrate 20 and the sealing substrate 30a provided so as to face each other, and between the element substrate 20 and the sealing substrate 30a. And a sealing material 25 for bonding the substrate 20 and the sealing substrate 30a to each other.
  • the sealing substrate 30a is formed of, for example, a glass substrate in which a concave portion C having a length of about 50 mm, a width of about 100 mm, and a depth of about 0.3 mm is formed on the surface. Then, as shown in FIG. 7, a dry sheet 31 that adsorbs moisture having a thickness of about 0.1 mm to 0.3 mm is attached to the bottom surface B of the recess C of the sealing substrate 30.
  • the organic EL display device 50c of the present embodiment prepares a sealing substrate 30a in which, for example, the concave portion C is formed on the surface and the dry sheet 31 is pasted on the bottom surface B of the concave portion C in the bonding step of the first embodiment. By doing so, it can be manufactured.
  • the element substrate 20 and the sealing substrate 30a are surrounded by the organic EL element 11 with respect to the element substrate 20, as in the first embodiment.
  • the outer protective wall 21a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the sealing material 25 bonded to each other, the sealing material 25 of the sealing material 25 due to a pressure difference between the inside and the outside of the frame-shaped sealing material 25 Generation of bubbles inside can be suppressed.
  • the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed.
  • the production yield of the organic EL display device 50c can be improved.
  • the dry sheet 31 is provided on the bottom surface B of the recess C formed in the sealing substrate 30a. Can be suppressed.
  • FIG. 8 is a cross-sectional view of the organic EL display device 50d of this embodiment.
  • the organic EL display devices 50a, 50b, and 50c in which the organic EL element 11 is exposed in the region surrounded by the element substrate 20, the sealing substrates 30 and 30a, and the sealing material 25 are illustrated.
  • the organic EL display device 50d in which the organic EL element 11 is not exposed in the region surrounded by the element substrate 20b, the sealing substrate 30, and the sealing material 25 is illustrated.
  • the organic EL display device 50d is provided in a frame shape between the element substrate 20b and the sealing substrate 30 provided so as to face each other, and between the element substrate 20b and the sealing substrate 30. And a sealing material 25 for bonding the substrate 20b and the sealing substrate 30 to each other.
  • the element substrate 20 b includes a base substrate 10 such as a glass substrate, an organic EL element 11 provided on the base substrate 10, a protective film 12 provided so as to cover the organic EL element 11, An inner protective wall 21b provided in a frame shape so as to surround the organic EL element 11 and an outer protective wall 21a provided in a frame shape so as to surround the inner protective wall 21b are provided.
  • the organic EL display 11 in the element substrate manufacturing process of the first embodiment, after the organic EL element 11 is formed, the organic EL display 11 is covered with, for example, silicon nitride or oxide so as to cover the organic EL element 11. It can be manufactured by forming a protective film 12 by forming a thin film of silicon, silicon oxynitride, aluminum oxide or the like with a thickness of about 100 nm using an evaporation mask.
  • the element substrate 20b and the sealing substrate 30 are surrounded by the organic EL element 11 with respect to the element substrate 20b. Since the outer protective wall 21a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the sealing material 25 bonded to each other, the sealing material 25 of the sealing material 25 due to a pressure difference between the inside and the outside of the frame-shaped sealing material 25 is provided. Generation of bubbles inside can be suppressed. Thereby, since the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed. The production yield of the organic EL display device 50d can be improved.
  • the organic EL display device 50 e is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other, and between the element substrate 20 and the sealing substrate 30.
  • the moisture adsorption resin 26 is, for example, an ultraviolet curable epoxy resin in which a powder such as calcium oxide having excellent moisture absorption characteristics is dispersed.
  • the organic EL display device 50e is disposed after the moisture adsorption resin 26 is disposed inside the inner protective wall 21b by, for example, a dispenser method. It can be manufactured by bonding the element substrate 20 and the sealing substrate 30 in a reduced pressure atmosphere of about 1 Pa.
  • the outer protective wall 32a and the inner protective wall 32b are formed.
  • the ultraviolet curable sealing material 25 is disposed between the outer protective wall 32a and the inner protective wall 32b of the sealing substrate 30 on which the outer protective wall 32a and the inner protective wall 32b are formed, for example, by a dispenser method. Can be manufactured.
  • the organic EL display device 50 g is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other, and between the element substrate 20 and the sealing substrate 30.
  • a sealing material 25 that bonds the substrate 20 and the sealing substrate 30 to each other, and a moisture adsorption resin 26 filled in a region surrounded by the element substrate 20, the sealing substrate 30, and the sealing material 25 are provided.
  • an outer protective wall 32 a is provided on the sealing substrate 30 in a frame shape so as to surround the sealing material 25.
  • the organic EL display device 50g in which only the outer protective wall 32a is provided on the sealing substrate 30 is illustrated as the protective wall.
  • only the outer protective wall 21a is provided on the element substrate 20.
  • the present invention can also be applied to a manufactured organic EL display device.
  • the organic EL element 11 is surrounded with respect to the element substrate 20 or the sealing substrate 30 as in the first embodiment. Since the outer protective wall 21a or 32a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the sealing material 25 that bonds the element substrate 20 and the sealing substrate 30 to each other, the frame-shaped sealing material 25 It is possible to suppress the generation of bubbles inside the sealing material 25 due to the pressure difference between the inside and the outside. Thereby, since the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed. The production yield of the organic EL display devices 50e, 50f and 50g can be improved.
  • the organic EL display devices 50e, 50f, and 50g provided with the moisture adsorption resin 26 are respectively illustrated.
  • the organic EL display provided with not only the moisture adsorption resin 26 but also the protective film 12 is provided.
  • the display device 50h is illustrated.
  • the region surrounded by the element substrate 20b, the sealing substrate 30 and the sealing material 25 is filled with the moisture adsorption resin 26, and the element substrate 20b is filled with the organic EL. Since the protective film 12 covering the element 11 is provided, the deterioration of the organic EL element 11 can be further suppressed.
  • the organic EL display device in which the outer protective wall and the inner protective wall are provided on the same substrate is illustrated.
  • the outer protective wall and the inner protective wall are provided on different substrates.
  • the present invention can also be applied to organic EL display devices.
  • an organic EL display device using a glass substrate as the base substrate and the sealing substrate is illustrated.
  • the present invention uses a plastic substrate, a metal plate, or the like as the base substrate and the sealing substrate.
  • the present invention can also be applied to conventional organic EL display devices.

Abstract

The present invention is provided with: an element substrate (20) that is provided with an organic EL element (11); a sealing substrate (30) that is provided to face the element substrate (20); a seal material (25), which is provided in a frame shape between the element substrate (20) and the sealing substrate (30), and which bonds the element substrate (20) and the sealing substrate (30) to each other by surrounding the organic EL element (11); and an outer protection wall (21a), which is provided in a frame shape on the element substrate (20) or the sealing substrate (30), and which is formed lower than the height of the seal material (25), said outer protection wall surrounding the seal material (25).

Description

有機エレクトロルミネセンス表示装置及びその製造方法Organic electroluminescent display device and manufacturing method thereof
　本発明は、有機エレクトロルミネセンス表示装置及びその製造方法に関し、特に、素子基板に対向して封止基板が設けられた有機エレクトロルミネセンス表示装置及びその製造方法に関するものである。 The present invention relates to an organic electroluminescence display device and a manufacturing method thereof, and more particularly to an organic electroluminescence display device provided with a sealing substrate facing an element substrate and a manufacturing method thereof.
　有機エレクトロルミネセンス（electroluminescence、以下、「ＥＬ」とも称する）素子を有する有機ＥＬ表示装置では、酸素や水分による有機ＥＬ素子の劣化を抑制するために、有機ＥＬ素子が形成された素子基板に対向するように封止基板が設けられ、素子基板及び封止基板がシール材を介して周端部で互いに接着された封止構造が提案されている。 In an organic EL display device having an organic electroluminescence (hereinafter, also referred to as “EL”) element, it faces an element substrate on which the organic EL element is formed in order to suppress deterioration of the organic EL element due to oxygen or moisture. Thus, there has been proposed a sealing structure in which a sealing substrate is provided and the element substrate and the sealing substrate are bonded to each other at a peripheral end portion via a sealing material.
　例えば、特許文献１には、有機ＥＬ素子が設けられた素子基板と、素子基板に対向するように設けられた封止基板と、素子基板及び封止基板を封止するように設けられたシール材とを備え、シール材の揮発成分の一部に起因する有機ＥＬ素子の劣化を抑制するために、シール材の内周に沿って保護層が設けられ、素子基板及び封止基板をシール材により封止する際の内圧の影響を抑制するために、シール材の一部に外部に繋がる開口部が設けられた有機ＥＬ表示装置が開示されている。 For example, Patent Document 1 discloses an element substrate provided with an organic EL element, a sealing substrate provided so as to face the element substrate, and a seal provided so as to seal the element substrate and the sealing substrate. And a protective layer is provided along the inner periphery of the sealing material to suppress the deterioration of the organic EL element due to a part of the volatile component of the sealing material. In order to suppress the influence of the internal pressure at the time of sealing, an organic EL display device in which an opening connected to the outside is provided in a part of the sealing material is disclosed.
特開２００４－３１９１０３号公報JP 2004-319103 A
　ところで、有機ＥＬ素子を雰囲気中の水分から保護するために、素子基板及び封止基板を枠状のシール材を介して真空雰囲気で貼り合わせて製造された有機ＥＬ表示装置では、素子基板及び封止基板を貼り合わせ後に大気圧に開放する際に、素子基板及び封止基板に挟まれた枠状のシール材の内側及び外側の圧力差に起因して、シール材にその外側から気体が浸入して、シール材の内部に気泡が発生するおそれがある。 Incidentally, in order to protect the organic EL element from moisture in the atmosphere, in the organic EL display device manufactured by bonding the element substrate and the sealing substrate in a vacuum atmosphere via a frame-shaped sealing material, the element substrate and the sealing substrate are sealed. When the stop substrate is bonded and released to atmospheric pressure, gas enters the sealing material from the outside due to the pressure difference between the inside and outside of the frame-shaped sealing material sandwiched between the element substrate and the sealing substrate. As a result, bubbles may be generated inside the sealing material.
　以下に、真空雰囲気で貼り合わせて製造された有機ＥＬ表示装置において、シール材の内部に気泡が発生するに当たり考えられるメカニズムを説明する。ここで、図１３は、有機ＥＬ表示装置を構成する素子基板１２０及び封止基板１３０の間に配置するシール材１２５に働く力を示す模式図である。そして、シール材１２５と空気との間の界面に働く表面張力をγLとし、封止基板１３０と空気との間の界面に働く表面張力をγSとし、シール材１２５と封止基板１３０との間の界面に働く表面張力をγLSとし、封止基板１３０に対するシール材１２５の接触角をθとし、シール材１２５の内側及び外側の圧力差をΔＰとし、シール材１２５の外周をＬＯとすると、シール材１２５の幅方向（図中横方向）の力のつり合いは、下記の式となる。 Hereinafter, in the organic EL display device manufactured by bonding in a vacuum atmosphere, a mechanism that is considered when bubbles are generated inside the sealing material will be described. Here, FIG. 13 is a schematic diagram showing the force acting on the sealing material 125 disposed between the element substrate 120 and the sealing substrate 130 constituting the organic EL display device. The surface tension acting on the interface between the sealing material 125 and the air is γ L , the surface tension acting on the interface between the sealing substrate 130 and the air is γ S , and the sealing material 125 and the sealing substrate 130 are The surface tension acting on the interface between the sealing material 125 is γ LS , the contact angle of the sealing material 125 with respect to the sealing substrate 130 is θ, the pressure difference between the inside and the outside of the sealing material 125 is ΔP, and the outer periphery of the sealing material 125 is L O. Then, the balance of the force in the width direction (lateral direction in the figure) of the sealing material 125 is expressed by the following formula.
　γS＋γL×ｃｏｓθ＝γLS＋ΔＰ×ＬＯ
　ここで、圧力差ΔＰが大きくなると、接触角θが小さくなることにより、力のつり合いが保持されるものの、圧力差ΔＰがある閾値を超えると、シール材１２５のメニスカスが保持されなくなるので、シール材１２５に気泡が入り込むと考えられる。さらに、外周ＬＯは、素子基板１２０及び封止基板１３０の間隔が広くなるに伴って大きくなるので、外周ＬＯが大きくなることにより、上記と同様に、シール材１２５のメニスカスが保持されなくなり、シール材１２５に気泡が入り込み易くなると考えられる。 γ S + γ L × cos θ = γ LS + ΔP × L O
Here, when the pressure difference ΔP increases, the contact angle θ decreases, so that the balance of force is maintained. However, when the pressure difference ΔP exceeds a certain threshold value, the meniscus of the sealing material 125 is not retained. It is considered that bubbles enter the material 125. Further, the outer peripheral L O, since increases with the distance between the device substrate 120 and the sealing substrate 130 is widened by the outer peripheral L O increases, similarly to the above, the meniscus of the sealing member 125 is no longer retained It is considered that bubbles easily enter the sealing material 125.
　したがって、特に、封止基板の内側表面に乾燥シートを貼り付ける場合などの素子基板及び封止基板の間隔が比較的大きくなる封止構造では、上述したように、シール材に気泡が入り込み易くなるので、最悪の場合、気泡がシール材を通り越して有機ＥＬ素子に流入することにより、有機ＥＬ素子を瞬時に劣化させ、製造歩留まりを低下させてしまう。また、気泡が有機ＥＬ素子に流入しなくても、シール材の内部に気泡が発生した状態で素子基板及び封止基板が貼り合わせられると、シール材の密閉に有効な幅が狭くなるので、有機ＥＬ素子が十分に密閉できなくなる。そうなると、気泡に含まれる多量の酸素や水分が有機ＥＬ素子に徐々に流入してしまうので、有機ＥＬ素子が劣化し、有機ＥＬ素子の信頼性が保持できなくなる。 Therefore, in particular, in a sealing structure in which the distance between the element substrate and the sealing substrate is relatively large, such as when a dry sheet is attached to the inner surface of the sealing substrate, air bubbles easily enter the sealing material as described above. Therefore, in the worst case, when the bubbles pass through the sealing material and flow into the organic EL element, the organic EL element is instantly deteriorated and the manufacturing yield is lowered. In addition, even if bubbles do not flow into the organic EL element, if the element substrate and the sealing substrate are bonded together in a state where bubbles are generated inside the sealing material, the effective width for sealing the sealing material becomes narrow, The organic EL element cannot be sealed sufficiently. If so, a large amount of oxygen and moisture contained in the bubbles gradually flow into the organic EL element, so that the organic EL element deteriorates and the reliability of the organic EL element cannot be maintained.
　本発明は、かかる点に鑑みてなされたものであり、その目的とするところは、枠状のシール材の内側及び外側の圧力差によるシール材の内部での気泡の発生を抑制することにある。 The present invention has been made in view of the above points, and an object thereof is to suppress the generation of bubbles inside the sealing material due to a pressure difference between the inside and the outside of the frame-shaped sealing material. .
　上記目的を達成するために、本発明は、素子基板又は封止基板に対して、有機エレクトロルミネセンス素子を囲んで素子基板及び封止基板を互いに接着するシール材を囲むようにシール材の高さよりも低い外側保護壁を枠状に設けるようにしたものである。 In order to achieve the above-described object, the present invention provides a high sealing material that surrounds an organic electroluminescent element and surrounds a sealing material that adheres the element substrate and the sealing substrate to the element substrate or the sealing substrate. A lower outer protective wall is provided in a frame shape.
　具体的に本発明に係る有機エレクトロルミネセンス表示装置は、有機エレクトロルミネセンス素子が設けられた素子基板と、上記素子基板に対向して設けられた封止基板と、上記素子基板及び封止基板の間に枠状に設けられ、上記有機エレクトロルミネセンス素子を囲んで該素子基板及び封止基板を互いに接着するシール材と、上記素子基板又は封止基板に枠状に設けられ、上記シール材を囲んで該シール材の高さよりも低く形成された外側保護壁とを備えている。 Specifically, an organic electroluminescence display device according to the present invention includes an element substrate provided with an organic electroluminescence element, a sealing substrate provided facing the element substrate, the element substrate, and the sealing substrate. A sealing material that is provided in a frame shape, surrounds the organic electroluminescence element, and bonds the element substrate and the sealing substrate to each other; and a sealing material that is provided in a frame shape on the element substrate or the sealing substrate, and the sealing material And an outer protective wall formed lower than the height of the sealing material.
　上記素子基板又は封止基板に枠状に設けられ、上記シール材及び有機エレクトロルミネセンス素子の間に該シール材の高さよりも低く形成された内側保護壁を備えていてもよい。 An inner protective wall that is provided in a frame shape on the element substrate or the sealing substrate and is formed lower than the height of the sealing material may be provided between the sealing material and the organic electroluminescence element.
　上記封止基板の上記素子基板に対向する表面には、水分を吸着する乾燥シートが設けられていてもよい。 A dry sheet that adsorbs moisture may be provided on the surface of the sealing substrate facing the element substrate.
　上記乾燥シートは、上記封止基板に形成された凹部の底面に設けられていてもよい。 The dry sheet may be provided on the bottom surface of the recess formed in the sealing substrate.
　上記素子基板、封止基板及びシール材に囲まれた領域には、水分を吸着する樹脂が充填されていてもよい。 The region surrounded by the element substrate, the sealing substrate, and the sealing material may be filled with a resin that adsorbs moisture.
　上記素子基板には、上記有機エレクトロルミネセンス素子を覆って該有機エレクトロルミネセンス素子の劣化を抑制する保護膜が設けられていてもよい。 The element substrate may be provided with a protective film that covers the organic electroluminescent element and suppresses deterioration of the organic electroluminescent element.
　また、本発明に係る有機エレクトロルミネセンス表示装置の製造方法は、有機エレクトロルミネセンス素子が設けられた素子基板と、上記素子基板に対向して設けられた封止基板と、上記素子基板及び封止基板の間に枠状に設けられ、上記有機エレクトロルミネセンス素子を囲んで該素子基板及び封止基板を互いに接着するシール材とを備えた有機エレクトロルミネセンス表示装置を製造する方法であって、上記素子基板及び封止基板の一方の基板の周端部に上記シール材よりも外側で該シール材の高さよりも低い枠状の外側保護壁を形成する保護壁形成工程と、上記外側保護壁が形成された一方の基板、及び該外側保護壁が形成されていない他方の基板を上記シール材を介して減圧雰囲気で貼り合わせ後に、該減圧雰囲気を開放する貼り合わせ工程とを備える。 The organic electroluminescence display device manufacturing method according to the present invention includes an element substrate provided with an organic electroluminescence element, a sealing substrate provided facing the element substrate, the element substrate, and a sealing substrate. A method of manufacturing an organic electroluminescence display device comprising a sealing material provided in a frame shape between a stationary substrate and surrounding the organic electroluminescence element to adhere the element substrate and the sealing substrate to each other A protective wall forming step of forming a frame-shaped outer protective wall at a peripheral end portion of one of the element substrate and the sealing substrate outside the sealing material and lower than a height of the sealing material; and the outer protection One substrate on which a wall is formed and the other substrate on which the outer protective wall is not formed are bonded to each other in a reduced pressure atmosphere through the sealing material, and then the reduced pressure atmosphere is released. And a Align process.
　本発明によれば、素子基板又は封止基板に対して、有機エレクトロルミネセンス素子を囲んで素子基板及び封止基板を互いに接着するシール材を囲むようにシール材の高さよりも低い外側保護壁が枠状に設けられているので、枠状のシール材の内側及び外側の圧力差によるシール材の内部での気泡の発生を抑制することができる。 According to the present invention, the outer protective wall is lower than the height of the sealing material so as to surround the sealing material that surrounds the organic electroluminescent element and adheres the element substrate and the sealing substrate to the element substrate or the sealing substrate. Is provided in a frame shape, it is possible to suppress the generation of bubbles inside the seal material due to the pressure difference between the inside and the outside of the frame shape seal material.
図１は、実施形態１に係る有機ＥＬ表示装置の断面図である。FIG. 1 is a cross-sectional view of the organic EL display device according to the first embodiment. 図２は、図１中の領域Ａを拡大した断面図である。2 is an enlarged cross-sectional view of a region A in FIG. 図３は、実施形態１に係る有機ＥＬ表示装置を構成する外側保護壁、内側保護壁及びシール材を示す平面図である。FIG. 3 is a plan view showing an outer protective wall, an inner protective wall, and a sealing material that constitute the organic EL display device according to the first embodiment. 図４は、実施形態１に係る有機ＥＬ表示装置の変形例の断面図である。FIG. 4 is a cross-sectional view of a modification of the organic EL display device according to the first embodiment. 図５は、実施形態１に係る有機ＥＬ表示装置を構成する外側保護壁及び内側保護壁の変形例を示す断面図である。FIG. 5 is a cross-sectional view showing a modification of the outer protective wall and the inner protective wall constituting the organic EL display device according to the first embodiment. 図６は、実施形態１に係る有機ＥＬ表示装置の製造方法を示す断面図である。FIG. 6 is a cross-sectional view illustrating the method for manufacturing the organic EL display device according to the first embodiment. 図７は、実施形態２に係る有機ＥＬ表示装置の断面図である。FIG. 7 is a cross-sectional view of the organic EL display device according to the second embodiment. 図８は、実施形態３に係る有機ＥＬ表示装置の断面図である。FIG. 8 is a cross-sectional view of the organic EL display device according to the third embodiment. 図９は、実施形態４に係る有機ＥＬ表示装置の断面図である。FIG. 9 is a cross-sectional view of the organic EL display device according to the fourth embodiment. 図１０は、実施形態４に係る有機ＥＬ表示装置の第１の変形例の断面図である。FIG. 10 is a cross-sectional view of a first modification of the organic EL display device according to the fourth embodiment. 図１１は、実施形態４に係る有機ＥＬ表示装置の第２の変形例の断面図である。FIG. 11 is a cross-sectional view of a second modification of the organic EL display device according to the fourth embodiment. 図１２は、実施形態５に係る有機ＥＬ表示装置の断面図である。FIG. 12 is a cross-sectional view of the organic EL display device according to the fifth embodiment. 図１３は、従来の有機ＥＬ表示装置を構成する基板間に配置するシール材に働く力を示す模式図である。FIG. 13 is a schematic diagram showing a force acting on a sealing material arranged between substrates constituting a conventional organic EL display device.
　以下、本発明の実施形態を図面に基づいて詳細に説明する。なお、本発明は、以下の各実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.
　《発明の実施形態１》
　図１～図６は、本発明に係る有機ＥＬ表示装置及びその製造方法の実施形態１を示している。ここで、図１は、本実施形態の有機ＥＬ表示装置５０ａの断面図である。また、図２は、図１中の領域Ａを拡大した断面図である。また、図３は、有機ＥＬ表示装置５０ａを構成する外側保護壁２１ａ、内側保護壁２１ｂ及びシール材２５を示す平面図である。また、図４は、有機ＥＬ表示装置５０ａの変形例の有機ＥＬ表示装置５０ｂの断面図である。また、図５（ａ）～図５（ｃ）は、外側保護壁２１ａ及び内側保護壁２１ｂの変形例を示す断面図である。 Embodiment 1 of the Invention
1 to 6 show Embodiment 1 of an organic EL display device and a manufacturing method thereof according to the present invention. Here, FIG. 1 is a cross-sectional view of the organic EL display device 50a of the present embodiment. FIG. 2 is an enlarged cross-sectional view of region A in FIG. FIG. 3 is a plan view showing the outer protective wall 21a, the inner protective wall 21b, and the sealing material 25 constituting the organic EL display device 50a. FIG. 4 is a cross-sectional view of an organic EL display device 50b which is a modification of the organic EL display device 50a. FIGS. 5A to 5C are sectional views showing modifications of the outer protective wall 21a and the inner protective wall 21b.
　有機ＥＬ表示装置５０ａは、図１及び図２に示すように、互いに対向するように設けられた素子基板２０及び封止基板３０と、素子基板２０及び封止基板３０の間に枠状に設けられ、素子基板２０及び封止基板３０を互いに接着するシール材２５とを備えている。ここで、有機ＥＬ表示装置５０ａでは、シール材２５の内側の部分に画像表示を行う表示領域が規定され、その表示領域には、複数の画素がマトリクス状に配置されている。そして、各画素では、例えば、赤色の階調表示を行うためのサブ画素、緑色の階調表示を行うためのサブ画素、及び青色の階調表示を行うためのサブ画素が互いに隣り合うように配列されている。 As shown in FIGS. 1 and 2, the organic EL display device 50a is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other and between the element substrate 20 and the sealing substrate 30. And a sealing material 25 for bonding the element substrate 20 and the sealing substrate 30 to each other. Here, in the organic EL display device 50a, a display area for displaying an image is defined in an inner portion of the sealing material 25, and a plurality of pixels are arranged in a matrix in the display area. In each pixel, for example, a sub-pixel for performing red gradation display, a sub-pixel for performing green gradation display, and a sub-pixel for performing blue gradation display are adjacent to each other. It is arranged.
　素子基板２０は、図１及び図２に示すように、ガラス基板などのベース基板１０と、ベース基板１０に設けられた有機ＥＬ素子１１と、有機ＥＬ素子１１を囲むように枠状に設けられた内側保護壁２１ｂと、内側保護壁２１ｂを囲むように枠状に設けられた外側保護壁２１ａとを備えている。 As shown in FIGS. 1 and 2, the element substrate 20 is provided in a frame shape so as to surround the base substrate 10 such as a glass substrate, the organic EL element 11 provided on the base substrate 10, and the organic EL element 11. The inner protective wall 21b and the outer protective wall 21a provided in a frame shape so as to surround the inner protective wall 21b are provided.
　有機ＥＬ素子１１は、例えば、ベース基板１０に層間絶縁膜などを介して各サブ画素に陽極としてそれぞれ設けられた複数の第１電極と、各第１電極の端縁部を覆うように格子状に設けられたエッジカバーと、各第１電極及びエッジカバーを覆うように順に設けられた正孔注入層及び正孔輸送層と、正孔輸送層上に各サブ画素にそれぞれ設けられた複数の発光層と、各発光層を覆うように順に設けられた電子輸送層及び電子注入層と、電子注入層を覆うように陰極として設けられた第２電極とを備えている。ここで、第１電極及び第２電極の間には、必要に応じて正孔や電子といったキャリアの流れをせき止めるためのキャリアブロッキング層が挿入されていてもよい。また、正孔注入層、正孔輸送層、電子輸送層及び電子注入層は、適宜省略されていてもよい。また、ベース基板１０及び層間絶縁膜の間には、各サブ画素を駆動するためのゲート線、ソース線、電源線、ＴＦＴ及びキャパシタなどが設けられている。 The organic EL element 11 has, for example, a plurality of first electrodes provided as anodes in each subpixel via an interlayer insulating film on the base substrate 10 and a lattice shape so as to cover the edge of each first electrode. An edge cover provided on the hole, a hole injection layer and a hole transport layer provided in order so as to cover each first electrode and the edge cover, and a plurality of each provided on each subpixel on the hole transport layer A light emitting layer, an electron transport layer and an electron injection layer provided in order so as to cover each light emitting layer, and a second electrode provided as a cathode so as to cover the electron injection layer are provided. Here, a carrier blocking layer for blocking the flow of carriers such as holes and electrons may be inserted between the first electrode and the second electrode as necessary. In addition, the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may be omitted as appropriate. Further, between the base substrate 10 and the interlayer insulating film, gate lines, source lines, power supply lines, TFTs, capacitors, and the like for driving each subpixel are provided.
　外側保護壁２１ａ及び内側保護壁２１ｂは、図１～図３に示すように、それらの間にシール材２５が配置するように、互いに並行に延びるように設けられている。また、外側保護壁２１ａ及び内側保護壁２１ｂは、例えば、酸化シリコン膜、窒化シリコン膜、アクリル樹脂膜、金属膜などの単層膜又は積層膜により、図１及び図２に示すように、シール材２５の高さ（例えば、１２μｍ～１３μｍ程度）よりも低く、例えば、２μｍ～３μｍ程度に形成されている。 As shown in FIGS. 1 to 3, the outer protective wall 21a and the inner protective wall 21b are provided so as to extend in parallel with each other so that the sealing material 25 is disposed therebetween. Further, the outer protective wall 21a and the inner protective wall 21b are made of, for example, a single layer film or a laminated film such as a silicon oxide film, a silicon nitride film, an acrylic resin film, or a metal film, as shown in FIGS. It is lower than the height of the material 25 (for example, about 12 μm to 13 μm), for example, about 2 μm to 3 μm.
　なお、本実施形態では、シール材２５に隣り合って外側保護壁２１ａ及び内側保護壁２１ｂが設けられた有機ＥＬ表示装置５０ａを例示したが、内側保護壁２１ｂを省略して、例えば、図４に示すように、シール材２５に隣り合って外側保護壁２１ａだけが設けられた有機ＥＬ表示装置５０ｂであってもよい。 In the present embodiment, the organic EL display device 50a in which the outer protective wall 21a and the inner protective wall 21b are provided adjacent to the sealing material 25 is illustrated, but the inner protective wall 21b is omitted, for example, FIG. As shown in FIG. 5, the organic EL display device 50b in which only the outer protective wall 21a is provided adjacent to the sealing material 25 may be used.
　また、本実施形態では、横断面が矩形状にそれぞれ形成された外側保護壁２１ａ及び内側保護壁２１ｂを例示したが、外側保護壁２１ａ及び内側保護壁２１ｂは、図５（ａ）に示すように、横断面の図中上側の角部が円弧状に形成された横断面が略矩形状に形成された保護壁２１ｃ、図５（ｂ）に示すように、横断面が等脚台形などの台形状に形成された保護壁２１ｄ、図５（ｃ）に示すように、保護壁２１ｄを図中上下で反転させた横断面が台形状に形成された保護壁２１ｅなどであってもよい。 Further, in the present embodiment, the outer protective wall 21a and the inner protective wall 21b each having a rectangular cross section are illustrated, but the outer protective wall 21a and the inner protective wall 21b are as shown in FIG. In addition, a protective wall 21c in which the upper corner in the cross-sectional view is formed in an arc shape and the cross-section is formed in a substantially rectangular shape, as shown in FIG. A protective wall 21d formed in a trapezoidal shape, as shown in FIG. 5C, may be a protective wall 21e formed in a trapezoidal cross section obtained by inverting the protective wall 21d up and down in the drawing.
　封止基板３０は、例えば、ガラス基板などにより形成されている。 The sealing substrate 30 is formed of, for example, a glass substrate.
　シール材２５は、例えば、紫外線硬化型のエポキシ樹脂などにより形成されている。 The sealing material 25 is made of, for example, an ultraviolet curable epoxy resin.
　次に、本実施形態の有機ＥＬ表示装置５０ａの製造方法について説明する。ここで、図６は、有機ＥＬ表示装置５０ａの製造方法を示す断面図である。なお、本実施形態の有機ＥＬ表示装置５０ａの製造方法は、素子基板作製工程、保護壁形成工程及び貼り合わせ工程を備える。 Next, a method for manufacturing the organic EL display device 50a of this embodiment will be described. Here, FIG. 6 is a cross-sectional view illustrating a method of manufacturing the organic EL display device 50a. In addition, the manufacturing method of the organic EL display device 50a of this embodiment includes an element substrate manufacturing process, a protective wall forming process, and a bonding process.
　＜素子基板作製工程＞
　例えば、ガラス基板などのベース基板１０の表面に、周知の方法を用いて、層間絶縁膜、第１電極、エッジカバー、正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層及び第２電極などを形成することにより、有機ＥＬ素子１１を形成して、素子基板２０を作製する。 <Element substrate manufacturing process>
For example, an interlayer insulating film, a first electrode, an edge cover, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection are formed on the surface of the base substrate 10 such as a glass substrate using a known method. The organic EL element 11 is formed by forming a layer, a second electrode, and the like, and the element substrate 20 is manufactured.
　＜保護壁形成工程＞
　上記素子基板作製工程に作製された素子基板２０の表面の周端部に、例えば、蒸着法により、酸化シリコン膜、窒化シリコン膜、ポリアクリレート膜などを蒸着マスクを用いて成膜することにより、外側保護壁２１ａ及び内側保護壁２１ｂを形成する。 <Protective wall formation process>
By forming a silicon oxide film, a silicon nitride film, a polyacrylate film, or the like on the peripheral edge portion of the surface of the element substrate 20 manufactured in the element substrate manufacturing process by using a vapor deposition method, for example, The outer protective wall 21a and the inner protective wall 21b are formed.
　＜貼り合わせ工程＞
　まず、上記保護壁形成工程で外側保護壁２１ａ及び内側保護壁２１ｂが形成された素子基板２０の外側保護壁２１ａ及び内側保護壁２１ｂの間に、例えば、ディスペンサ方式により、シール材２５を配置する。 <Lamination process>
First, the sealing material 25 is disposed by, for example, a dispenser method between the outer protective wall 21a and the inner protective wall 21b of the element substrate 20 on which the outer protective wall 21a and the inner protective wall 21b are formed in the protective wall forming step. .
　続いて、シール材２５が配置された素子基板２０とガラス基板などの封止基板３０とを、図６に示すように、例えば、１ｋＰａ～３０ｋＰａ程度の減圧雰囲気で貼り合わせた後に、その減圧雰囲気を開放することにより、素子基板２０及び封止基板３０の外側の表面を加圧する。 Subsequently, as shown in FIG. 6, the element substrate 20 on which the sealing material 25 is disposed and the sealing substrate 30 such as a glass substrate are bonded together in a reduced pressure atmosphere of, for example, about 1 kPa to 30 kPa, and then the reduced pressure atmosphere. , The outer surfaces of the element substrate 20 and the sealing substrate 30 are pressurized.
　さらに、素子基板２０及び封止基板３０に挟まれたシール材２５に紫外光を照射することにより、シール材２５を硬化させる。 Furthermore, the sealing material 25 is cured by irradiating the sealing material 25 sandwiched between the element substrate 20 and the sealing substrate 30 with ultraviolet light.
　以上のようにして、本実施形態の有機ＥＬ表示装置５０ａを製造することができる。 As described above, the organic EL display device 50a of this embodiment can be manufactured.
　以上説明したように、本実施形態の有機ＥＬ表示装置５０ａ及びその製造方法によれば、保護壁形成工程において、素子基板２０に対して、有機ＥＬ素子１１を囲んで素子基板２０及び封止基板３０を互いに接着するシール材２５の外側でシール材２５の高さよりも低い枠状の外側保護壁２１ａを形成するので、貼り合わせ工程において、素子基板２０及び封止基板３０をシール材２５を介して減圧雰囲気で貼り合わせ後に、シール材２５の外部に露出する部分がシール材２５の外側保護壁２１ａよりも高い部分の外側の側面だけになる。そのため、貼り合わせ工程において、素子基板２０及び封止基板３０を減圧雰囲気で貼り合わせ後に減圧雰囲気を開放する際に、シール材２５の内側及び外側の圧力差に起因して、シール材２５にその外側から気体Ｇが浸入しようとしても、シール材２５の外部に露出する部分の高さが低いので、シール材２５に対する気体Ｇの浸入を抑制することができると共に、シール材２５における気泡の発生を抑制することができる。これにより、枠状のシール材２５の内側及び外側の圧力差によるシール材２５の内部での気泡の発生を抑制することができるので、有機ＥＬ素子１１を確実に密閉することができることにより有機ＥＬ素子１１の信頼性を確保することができ、さらには、有機ＥＬ素子１１の気泡の流入を抑制することができることにより、有機ＥＬ表示装置５０ａの製造歩留まりを向上させることができる。 As described above, according to the organic EL display device 50a and the manufacturing method thereof according to the present embodiment, the element substrate 20 and the sealing substrate surround the organic EL element 11 with respect to the element substrate 20 in the protective wall forming step. Since the frame-shaped outer protective wall 21a lower than the height of the sealing material 25 is formed outside the sealing material 25 that bonds the 30 to each other, the element substrate 20 and the sealing substrate 30 are interposed via the sealing material 25 in the bonding process. After bonding in a reduced pressure atmosphere, the portion exposed to the outside of the sealing material 25 is only the outer side surface of the portion higher than the outer protective wall 21a of the sealing material 25. Therefore, in the bonding step, when the reduced pressure atmosphere is released after the element substrate 20 and the sealing substrate 30 are bonded in a reduced pressure atmosphere, due to the pressure difference between the inner side and the outer side of the sealing material 25, Even if the gas G tries to enter from the outside, since the height of the portion exposed to the outside of the sealing material 25 is low, the gas G can be prevented from entering the sealing material 25 and the generation of bubbles in the sealing material 25 can be prevented. Can be suppressed. Thereby, since generation | occurrence | production of the bubble by the inside of the sealing material 25 by the pressure difference of the inner side of the frame-shaped sealing material 25 and an outer side can be suppressed, organic EL element 11 can be sealed reliably and organic EL element can be sealed. The reliability of the element 11 can be ensured, and furthermore, the production yield of the organic EL display device 50a can be improved by suppressing the inflow of bubbles of the organic EL element 11.
　また、本実施形態の有機ＥＬ表示装置５０ａ及びその製造方法によれば、素子基板２０に対して、シール材２４及び有機ＥＬ素子１１の間にシール材よりも低い外側保護壁２１ａが枠状に設けられているので、シール材２５の外部に露出する部分の高さを低くしながら、封止基板３０とシール材２５との接触部分、及び外側保護壁２１ａとシール材２５との接触部分を増やすことができる。これにより、シール材２５と封止基板３０等との付着力を高めることができるので、シール材２５を介する有機ＥＬ素子１１への気泡の流入を抑制することができる。 Further, according to the organic EL display device 50a and the manufacturing method thereof of the present embodiment, the outer protective wall 21a lower than the sealing material is formed in a frame shape between the sealing material 24 and the organic EL element 11 with respect to the element substrate 20. Since the height of the portion exposed to the outside of the sealing material 25 is reduced, the contact portion between the sealing substrate 30 and the sealing material 25 and the contact portion between the outer protective wall 21a and the sealing material 25 are provided. Can be increased. Thereby, since the adhesive force of the sealing material 25 and the sealing substrate 30 etc. can be improved, the inflow of the bubble to the organic EL element 11 through the sealing material 25 can be suppressed.
　また、本実施形態の有機ＥＬ表示装置５０ａ及びその製造方法によれば、素子基板２０に対して、シール材２５及び有機エレクトロルミネセンス素子１１の間にシール材２５の高さよりも低い内側保護壁２１ｂが枠状に設けられているので、シール材２５の揮発成分に起因する有機ＥＬ素子１１の劣化を抑制することができる。 In addition, according to the organic EL display device 50a and the manufacturing method thereof of the present embodiment, the inner protective wall that is lower than the height of the sealing material 25 between the sealing material 25 and the organic electroluminescent element 11 with respect to the element substrate 20. Since 21b is provided in a frame shape, deterioration of the organic EL element 11 due to the volatile component of the sealing material 25 can be suppressed.
　また、本実施形態の有機ＥＬ表示装置５０ａ及びその製造方法によれば、素子基板２０に対して、外側保護壁２１ａ及び内側保護壁２１ｂが互いに並行に延びるように設けられているので、外側保護壁２１ａ及び内側保護壁２１ｂの間にシール材２５を配置することにより、シール材２５の配置を容易にすることができる。 Further, according to the organic EL display device 50a and the manufacturing method thereof of the present embodiment, the outer protective wall 21a and the inner protective wall 21b are provided to the element substrate 20 so as to extend in parallel with each other. By arranging the sealing material 25 between the wall 21a and the inner protective wall 21b, the arrangement of the sealing material 25 can be facilitated.
　なお、本実施形態では、素子基板２０に対して、外側保護壁２１ａ及び内側保護壁２１ｂを形成すると共に、シール材２５を配置する有機ＥＬ表示装置５０ａ及びその製造方法を例示したが、本発明は、封止基板３０に対して、外側保護壁及び内側保護壁を形成すると共に、シール材を配置する有機ＥＬ表示装置及びその製造方法にも適用することができる。 In the present embodiment, the organic EL display device 50a in which the outer protective wall 21a and the inner protective wall 21b are formed on the element substrate 20 and the sealing material 25 is disposed and the manufacturing method thereof are exemplified. Can be applied to an organic EL display device in which an outer protective wall and an inner protective wall are formed on the sealing substrate 30 and a sealing material is disposed, and a manufacturing method thereof.
　《発明の実施形態２》
　図７は、本実施形態の有機ＥＬ表示装置５０ｃの断面図である。なお、以下の各実施形態において、図１～図６と同じ部分については同じ符号を付して、その詳細な説明を省略する。 << Embodiment 2 of the Invention >>
FIG. 7 is a cross-sectional view of the organic EL display device 50c of this embodiment. In the following embodiments, the same portions as those in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.
　上記実施形態１では、平板状に形成された封止基板３０を備えた有機ＥＬ表示装置５０ａ及び５０ｂを例示したが、本実施形態では、一方の表面に凹部Ｃが形成された封止基板３０ａを備えた有機ＥＬ表示装置５０ｃを例示する。 In the first embodiment, the organic EL display devices 50a and 50b including the sealing substrate 30 formed in a flat plate shape are illustrated. However, in the present embodiment, the sealing substrate 30a in which the concave portion C is formed on one surface. An organic EL display device 50c including the above is illustrated.
　有機ＥＬ表示装置５０ｃは、図７に示すように、互いに対向するように設けられた素子基板２０及び封止基板３０ａと、素子基板２０及び封止基板３０ａの間に枠状に設けられ、素子基板２０及び封止基板３０ａを互いに接着するシール材２５とを備えている。 As shown in FIG. 7, the organic EL display device 50c is provided in a frame shape between the element substrate 20 and the sealing substrate 30a provided so as to face each other, and between the element substrate 20 and the sealing substrate 30a. And a sealing material 25 for bonding the substrate 20 and the sealing substrate 30a to each other.
　封止基板３０ａは、例えば、表面に縦５０ｍｍ程度、横１００ｍｍ程度、深さ０．３ｍｍ程度の凹部Ｃが形成されたガラス基板などにより形成されている。そして、封止基板３０の凹部Ｃの底面Ｂには、図７に示すように、例えば、厚さ０．１ｍｍ～０．３ｍｍ程度の水分を吸着する乾燥シート３１が取り付けられている。 The sealing substrate 30a is formed of, for example, a glass substrate in which a concave portion C having a length of about 50 mm, a width of about 100 mm, and a depth of about 0.3 mm is formed on the surface. Then, as shown in FIG. 7, a dry sheet 31 that adsorbs moisture having a thickness of about 0.1 mm to 0.3 mm is attached to the bottom surface B of the recess C of the sealing substrate 30.
　乾燥シート３１は、例えば、吸湿特性に優れた酸化カルシウムなどの粉末が分散された樹脂製のシートである。 The dry sheet 31 is, for example, a resin sheet in which a powder such as calcium oxide having excellent moisture absorption characteristics is dispersed.
　本実施形態の有機ＥＬ表示装置５０ｃは、上記実施形態１の貼り合わせ工程において、例えば、表面に凹部Ｃが形成され、凹部Ｃの底面Ｂに乾燥シート３１を貼り付けた封止基板３０ａを準備することにより、製造することができる。 The organic EL display device 50c of the present embodiment prepares a sealing substrate 30a in which, for example, the concave portion C is formed on the surface and the dry sheet 31 is pasted on the bottom surface B of the concave portion C in the bonding step of the first embodiment. By doing so, it can be manufactured.
　以上説明したように、本実施形態の有機ＥＬ表示装置５０ｃによれば、上記実施形態１と同様に、素子基板２０に対して、有機ＥＬ素子１１を囲んで素子基板２０及び封止基板３０ａを互いに接着するシール材２５を囲むようにシール材２５の高さよりも低い外側保護壁２１ａが枠状に設けられているので、枠状のシール材２５の内側及び外側の圧力差によるシール材２５の内部での気泡の発生を抑制することができる。これにより、有機ＥＬ素子１１を確実に密閉することができるので、有機ＥＬ素子１１の信頼性を確保することができ、さらには、有機ＥＬ素子１１の気泡の流入を抑制することができることにより、有機ＥＬ表示装置５０ｃの製造歩留まりを向上させることができる。 As described above, according to the organic EL display device 50c of the present embodiment, the element substrate 20 and the sealing substrate 30a are surrounded by the organic EL element 11 with respect to the element substrate 20, as in the first embodiment. Since the outer protective wall 21a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the sealing material 25 bonded to each other, the sealing material 25 of the sealing material 25 due to a pressure difference between the inside and the outside of the frame-shaped sealing material 25 Generation of bubbles inside can be suppressed. Thereby, since the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed. The production yield of the organic EL display device 50c can be improved.
　また、本実施形態の有機ＥＬ表示装置５０ｃによれば、封止基板３０ａの素子基板２０側の表面に水分を吸着する乾燥シート３１が設けられているので、水分に起因する有機ＥＬ素子１１の劣化を抑制することができる。 Further, according to the organic EL display device 50c of the present embodiment, since the dry sheet 31 that adsorbs moisture is provided on the surface of the sealing substrate 30a on the element substrate 20 side, the organic EL element 11 caused by moisture is provided. Deterioration can be suppressed.
　また、本実施形態の有機ＥＬ表示装置５０ｃによれば、乾燥シート３１が封止基板３０ａに形成された凹部Ｃの底面Ｂに設けられているので、乾燥シート３１を配置することによる装置厚さの増加を抑制することができる。 Further, according to the organic EL display device 50c of the present embodiment, the dry sheet 31 is provided on the bottom surface B of the recess C formed in the sealing substrate 30a. Can be suppressed.
　《発明の実施形態３》
　図８は、本実施形態の有機ＥＬ表示装置５０ｄの断面図である。 << Embodiment 3 of the Invention >>
FIG. 8 is a cross-sectional view of the organic EL display device 50d of this embodiment.
　上記実施形態１及び２では、素子基板２０、封止基板３０及び３０ａ、並びにシール材２５に囲まれた領域において、有機ＥＬ素子１１が露出した有機ＥＬ表示装置５０ａ、５０ｂ及び５０ｃをそれぞれ例示したが、本実施形態では、素子基板２０ｂ、封止基板３０及びシール材２５に囲まれた領域において、有機ＥＬ素子１１が露出しない有機ＥＬ表示装置５０ｄを例示する。 In the first and second embodiments, the organic EL display devices 50a, 50b, and 50c in which the organic EL element 11 is exposed in the region surrounded by the element substrate 20, the sealing substrates 30 and 30a, and the sealing material 25 are illustrated. However, in the present embodiment, the organic EL display device 50d in which the organic EL element 11 is not exposed in the region surrounded by the element substrate 20b, the sealing substrate 30, and the sealing material 25 is illustrated.
　有機ＥＬ表示装置５０ｄは、図８に示すように、互いに対向するように設けられた素子基板２０ｂ及び封止基板３０と、素子基板２０ｂ及び封止基板３０の間に枠状に設けられ、素子基板２０ｂ及び封止基板３０を互いに接着するシール材２５とを備えている。 As shown in FIG. 8, the organic EL display device 50d is provided in a frame shape between the element substrate 20b and the sealing substrate 30 provided so as to face each other, and between the element substrate 20b and the sealing substrate 30. And a sealing material 25 for bonding the substrate 20b and the sealing substrate 30 to each other.
　素子基板２０ｂは、図８に示すように、ガラス基板などのベース基板１０と、ベース基板１０に設けられた有機ＥＬ素子１１と、有機ＥＬ素子１１を覆うように設けられた保護膜１２と、有機ＥＬ素子１１を囲むように枠状に設けられた内側保護壁２１ｂと、内側保護壁２１ｂを囲むように枠状に設けられた外側保護壁２１ａとを備えている。 As shown in FIG. 8, the element substrate 20 b includes a base substrate 10 such as a glass substrate, an organic EL element 11 provided on the base substrate 10, a protective film 12 provided so as to cover the organic EL element 11, An inner protective wall 21b provided in a frame shape so as to surround the organic EL element 11 and an outer protective wall 21a provided in a frame shape so as to surround the inner protective wall 21b are provided.
　本実施形態の有機ＥＬ表示装置５０ｄは、上記実施形態１の素子基板作製工程において、有機ＥＬ素子１１を形成した後に、有機ＥＬ素子１１を覆うように、例えば、蒸着法により、窒化シリコン、酸化シリコン、酸窒化シリコン、酸化アルミニウムなどの薄膜を蒸着マスクを用いて厚さ１００ｎｍ程度で成膜して、保護膜１２を形成することにより、製造することができる。 In the organic EL display device 50d of the present embodiment, in the element substrate manufacturing process of the first embodiment, after the organic EL element 11 is formed, the organic EL display 11 is covered with, for example, silicon nitride or oxide so as to cover the organic EL element 11. It can be manufactured by forming a protective film 12 by forming a thin film of silicon, silicon oxynitride, aluminum oxide or the like with a thickness of about 100 nm using an evaporation mask.
　以上説明したように、本実施形態の有機ＥＬ表示装置５０ｄによれば、上記実施形態１と同様に、素子基板２０ｂに対して、有機ＥＬ素子１１を囲んで素子基板２０ｂ及び封止基板３０を互いに接着するシール材２５を囲むようにシール材２５の高さよりも低い外側保護壁２１ａが枠状に設けられているので、枠状のシール材２５の内側及び外側の圧力差によるシール材２５の内部での気泡の発生を抑制することができる。これにより、有機ＥＬ素子１１を確実に密閉することができるので、有機ＥＬ素子１１の信頼性を確保することができ、さらには、有機ＥＬ素子１１の気泡の流入を抑制することができることにより、有機ＥＬ表示装置５０ｄの製造歩留まりを向上させることができる。 As described above, according to the organic EL display device 50d of the present embodiment, as in the first embodiment, the element substrate 20b and the sealing substrate 30 are surrounded by the organic EL element 11 with respect to the element substrate 20b. Since the outer protective wall 21a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the sealing material 25 bonded to each other, the sealing material 25 of the sealing material 25 due to a pressure difference between the inside and the outside of the frame-shaped sealing material 25 is provided. Generation of bubbles inside can be suppressed. Thereby, since the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed. The production yield of the organic EL display device 50d can be improved.
　また、本実施形態の有機ＥＬ表示装置５０ｄによれば、素子基板２０ｂに有機ＥＬ素子１１を覆う保護膜１２が設けられているので、有機ＥＬ素子１１の劣化を抑制することができる。 Further, according to the organic EL display device 50d of the present embodiment, since the protective film 12 covering the organic EL element 11 is provided on the element substrate 20b, the deterioration of the organic EL element 11 can be suppressed.
　《発明の実施形態４》
　図９～図１１は、本発明に係る有機ＥＬ表示装置の実施形態４を示している。ここで、図９は、本実施形態の有機ＥＬ表示装置５０ｅの断面図である。また、図１０は、有機ＥＬ表示装置５０ｅの第１の変形例の有機ＥＬ表示装置５０ｆを示す断面図である。また、図１１は、有機ＥＬ表示装置５０ｅの第２の変形例の有機ＥＬ表示装置５０ｇを示す断面図である。 << Embodiment 4 of the Invention >>
9 to 11 show Embodiment 4 of the organic EL display device according to the present invention. Here, FIG. 9 is a cross-sectional view of the organic EL display device 50e of the present embodiment. FIG. 10 is a cross-sectional view showing an organic EL display device 50f of a first modification of the organic EL display device 50e. FIG. 11 is a cross-sectional view showing an organic EL display device 50g of a second modification of the organic EL display device 50e.
　上記各実施形態では、素子基板２０及び２０ａ、封止基板３０及び３０ａ、並びにシール材２５に囲まれた領域に空間が形成された有機ＥＬ表示装置５０ａ、５０ｂ、５０ｃ及び５０ｄをそれぞれ例示したが、本実施形態では、素子基板２０、封止基板３０及びシール材２５に囲まれた領域に水分吸着樹脂２６が充填された有機ＥＬ表示装置５０ｅ、５０ｆ及び５０ｇをそれぞれ例示する。 In each of the above embodiments, the organic EL display devices 50a, 50b, 50c, and 50d in which spaces are formed in regions surrounded by the element substrates 20 and 20a, the sealing substrates 30 and 30a, and the sealing material 25 are illustrated. In the present embodiment, organic EL display devices 50e, 50f, and 50g in which a region surrounded by the element substrate 20, the sealing substrate 30, and the sealing material 25 are filled with the moisture adsorption resin 26 are illustrated.
　有機ＥＬ表示装置５０ｅは、図９に示すように、互いに対向するように設けられた素子基板２０及び封止基板３０と、素子基板２０及び封止基板３０の間に枠状に設けられ、素子基板２０及び封止基板３０を互いに接着するシール材２５と、素子基板２０、内側保護壁２１ｂ、封止基板３０及びシール材２５に囲まれた領域に充填された水分吸着樹脂２６とを備えている。 As shown in FIG. 9, the organic EL display device 50 e is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other, and between the element substrate 20 and the sealing substrate 30. A sealing material 25 for bonding the substrate 20 and the sealing substrate 30 to each other; and a moisture adsorption resin 26 filled in a region surrounded by the element substrate 20, the inner protective wall 21 b, the sealing substrate 30 and the sealing material 25. Yes.
　水分吸着樹脂２６は、例えば、吸湿特性に優れた酸化カルシウムなどの粉末が分散された紫外線硬化型のエポキシ樹脂などである。 The moisture adsorption resin 26 is, for example, an ultraviolet curable epoxy resin in which a powder such as calcium oxide having excellent moisture absorption characteristics is dispersed.
　有機ＥＬ表示装置５０ｅは、上記実施形態１の貼り合わせ工程において、シール材２５を配置する際に、内側保護壁２１ｂの内側に、例えば、ディスペンサ方式により、水分吸着樹脂２６を配置した後に、０．１Ｐａ程度の減圧雰囲気で素子基板２０及び封止基板３０を貼り合わせることにより、製造することができる。 When the sealing material 25 is disposed in the bonding process of the first embodiment, the organic EL display device 50e is disposed after the moisture adsorption resin 26 is disposed inside the inner protective wall 21b by, for example, a dispenser method. It can be manufactured by bonding the element substrate 20 and the sealing substrate 30 in a reduced pressure atmosphere of about 1 Pa.
　有機ＥＬ表示装置５０ｆは、図１０に示すように、互いに対向するように設けられた素子基板２０及び封止基板３０と、素子基板２０及び封止基板３０の間に枠状に設けられ、素子基板２０及び封止基板３０を互いに接着するシール材２５と、素子基板２０、後述する内側保護壁３２ｂ、封止基板３０及びシール材２５に囲まれた領域に充填された水分吸着樹脂２６とを備えている。ここで、封止基板３０には、図１０に示すように、素子基板２０側の有機ＥＬ素子１１を囲むように内側保護壁３２ｂが枠状に設けられ、内側保護壁３２ｂを囲むように外側保護壁３２ａが枠状に設けられている。また、外側保護壁３２ａ及び内側保護壁３２ｂは、それらの間にシール材２５が配置するように、互いに並行に延びるように設けられている。また、外側保護壁３２ａ及び内側保護壁３２ｂは、例えば、酸化シリコン膜、窒化シリコン膜、アクリル樹脂膜、金属膜などの単層膜又は積層膜により、図１０に示すように、シール材２５の高さ（例えば、１２μｍ～１３μｍ程度）よりも低く、例えば、２μｍ～３μｍ程度に形成されている。そして、有機ＥＬ表示装置５０ｆは、上記実施形態１の保護壁形成工程において、素子基板２０の表面の周端部に外側保護壁２１ａ及び内側保護壁２１ｂを形成するのでなく、封止基板３０の表面の周端部に、例えば、蒸着法により、酸化シリコン膜、窒化シリコン膜、ポリアクリレート膜などを蒸着マスクを用いて成膜することにより、外側保護壁３２ａ及び内側保護壁３２ｂを形成し、同貼り合わせ工程において、外側保護壁３２ａ及び内側保護壁３２ｂが形成された封止基板３０の外側保護壁３２ａ及び内側保護壁３２ｂの間に、例えば、ディスペンサ方式により、紫外線硬化型のシール材２５を配置することにより、製造することができる。 As shown in FIG. 10, the organic EL display device 50 f is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other, and between the element substrate 20 and the sealing substrate 30. A sealing material 25 for bonding the substrate 20 and the sealing substrate 30 to each other, and a moisture adsorption resin 26 filled in a region surrounded by the element substrate 20, an inner protective wall 32 b to be described later, the sealing substrate 30 and the sealing material 25. I have. Here, as shown in FIG. 10, the sealing substrate 30 is provided with an inner protective wall 32b in a frame shape so as to surround the organic EL element 11 on the element substrate 20 side, and on the outer side so as to surround the inner protective wall 32b. The protective wall 32a is provided in a frame shape. In addition, the outer protective wall 32a and the inner protective wall 32b are provided so as to extend in parallel with each other so that the sealing material 25 is disposed therebetween. Further, the outer protective wall 32a and the inner protective wall 32b are made of, for example, a single layer film or a laminated film such as a silicon oxide film, a silicon nitride film, an acrylic resin film, or a metal film, as shown in FIG. It is lower than the height (for example, about 12 μm to 13 μm), for example, about 2 μm to 3 μm. The organic EL display device 50f does not form the outer protective wall 21a and the inner protective wall 21b at the peripheral edge portion of the surface of the element substrate 20 in the protective wall forming step of the first embodiment. By forming a silicon oxide film, a silicon nitride film, a polyacrylate film, or the like on the peripheral edge of the surface by using a vapor deposition mask, for example, by vapor deposition, the outer protective wall 32a and the inner protective wall 32b are formed. In the bonding step, the ultraviolet curable sealing material 25 is disposed between the outer protective wall 32a and the inner protective wall 32b of the sealing substrate 30 on which the outer protective wall 32a and the inner protective wall 32b are formed, for example, by a dispenser method. Can be manufactured.
　有機ＥＬ表示装置５０ｇは、図１１に示すように、互いに対向するように設けられた素子基板２０及び封止基板３０と、素子基板２０及び封止基板３０の間に枠状に設けられ、素子基板２０及び封止基板３０を互いに接着するシール材２５と、素子基板２０、封止基板３０及びシール材２５に囲まれた領域に充填された水分吸着樹脂２６とを備えている。ここで、封止基板３０には、図１１に示すように、シール材２５を囲むように外側保護壁３２ａが枠状に設けられている。 As shown in FIG. 11, the organic EL display device 50 g is provided in a frame shape between the element substrate 20 and the sealing substrate 30 provided so as to face each other, and between the element substrate 20 and the sealing substrate 30. A sealing material 25 that bonds the substrate 20 and the sealing substrate 30 to each other, and a moisture adsorption resin 26 filled in a region surrounded by the element substrate 20, the sealing substrate 30, and the sealing material 25 are provided. Here, as shown in FIG. 11, an outer protective wall 32 a is provided on the sealing substrate 30 in a frame shape so as to surround the sealing material 25.
　なお、本実施形態では、素子基板２０及び封止基板３０の間に水分吸着樹脂２６が設けられた有機ＥＬ表示装置５０ｅ、５０ｇ及び５０ｇをそれぞれ例示したが、本発明は、素子基板２０及び上記実施形態２の封止基板３０ａの間に水分吸着樹脂２６が設けられた有機ＥＬ表示装置にも適用することができる。 In the present embodiment, the organic EL display devices 50e, 50g, and 50g in which the moisture adsorption resin 26 is provided between the element substrate 20 and the sealing substrate 30 are illustrated, respectively. The present invention can also be applied to an organic EL display device in which a moisture adsorption resin 26 is provided between the sealing substrates 30a of the second embodiment.
　また、本実施形態では、保護壁として、封止基板３０に外側保護壁３２ａだけが設けられた有機ＥＬ表示装置５０ｇを例示したが、本発明は、素子基板２０に外側保護壁２１ａだけが設けられた有機ＥＬ表示装置にも適用することができる。 In this embodiment, the organic EL display device 50g in which only the outer protective wall 32a is provided on the sealing substrate 30 is illustrated as the protective wall. However, in the present embodiment, only the outer protective wall 21a is provided on the element substrate 20. The present invention can also be applied to a manufactured organic EL display device.
　以上説明したように、本実施形態の有機ＥＬ表示装置５０ｅ、５０ｆ及び５０ｇによれば、上記実施形態１と同様に、素子基板２０又は封止基板３０に対して、有機ＥＬ素子１１を囲んで素子基板２０及び封止基板３０を互いに接着するシール材２５を囲むようにシール材２５の高さよりも低い外側保護壁２１ａ又は３２ａが枠状に設けられているので、枠状のシール材２５の内側及び外側の圧力差によるシール材２５の内部での気泡の発生を抑制することができる。これにより、有機ＥＬ素子１１を確実に密閉することができるので、有機ＥＬ素子１１の信頼性を確保することができ、さらには、有機ＥＬ素子１１の気泡の流入を抑制することができることにより、有機ＥＬ表示装置５０ｅ、５０ｆ及び５０ｇの製造歩留まりを向上させることができる。 As described above, according to the organic EL display devices 50e, 50f, and 50g of the present embodiment, the organic EL element 11 is surrounded with respect to the element substrate 20 or the sealing substrate 30 as in the first embodiment. Since the outer protective wall 21a or 32a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the sealing material 25 that bonds the element substrate 20 and the sealing substrate 30 to each other, the frame-shaped sealing material 25 It is possible to suppress the generation of bubbles inside the sealing material 25 due to the pressure difference between the inside and the outside. Thereby, since the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed. The production yield of the organic EL display devices 50e, 50f and 50g can be improved.
　また、本実施形態の有機ＥＬ表示装置５０ｅ、５０ｆ及び５０ｇによれば、素子基板２０、封止基板３０及びシール材２５に囲まれた領域に水分吸着樹脂２６が充填されているので、水分に起因する有機ＥＬ素子１１の劣化を抑制することができる。 Further, according to the organic EL display devices 50e, 50f, and 50g of the present embodiment, the region surrounded by the element substrate 20, the sealing substrate 30, and the sealing material 25 is filled with the moisture adsorption resin 26, so The resulting deterioration of the organic EL element 11 can be suppressed.
　《発明の実施形態５》
　図１２は、本実施形態の有機ＥＬ表示装置５０ｈの断面図である。 << Embodiment 5 of the Invention >>
FIG. 12 is a cross-sectional view of the organic EL display device 50h of this embodiment.
　上記実施形態４では、水分吸着樹脂２６が設けられた有機ＥＬ表示装置５０ｅ、５０ｆ及び５０ｇをそれぞれ例示したが、本実施形態では、水分吸着樹脂２６だけでなく保護膜１２も設けられた有機ＥＬ表示装置５０ｈを例示する。 In the fourth embodiment, the organic EL display devices 50e, 50f, and 50g provided with the moisture adsorption resin 26 are respectively illustrated. However, in this embodiment, the organic EL display provided with not only the moisture adsorption resin 26 but also the protective film 12 is provided. The display device 50h is illustrated.
　有機ＥＬ表示装置５０ｈは、図１２に示すように、互いに対向するように設けられた素子基板２０ｂ及び封止基板３０と、素子基板２０ｂ及び封止基板３０の間に枠状に設けられ、素子基板２０ｂ及び封止基板３０を互いに接着するシール材２５と、素子基板２０ｂ、内側保護壁２１ｂ、封止基板３０及びシール材２５に囲まれた領域に充填された水分吸着樹脂２６とを備えている。 As shown in FIG. 12, the organic EL display device 50h is provided in a frame shape between the element substrate 20b and the sealing substrate 30 provided so as to face each other, and between the element substrate 20b and the sealing substrate 30. A sealing material 25 for bonding the substrate 20b and the sealing substrate 30 to each other, and a moisture adsorption resin 26 filled in a region surrounded by the element substrate 20b, the inner protective wall 21b, and the sealing substrate 30 and the sealing material 25 are provided. Yes.
　本実施形態の有機ＥＬ表示装置５０ｈによれば、上記実施形態１と同様に、素子基板２０ｂに対して、有機ＥＬ素子１１を囲んで素子基板２０ｂ及び封止基板３０を互いに接着するシール材２５を囲むようにシール材２５の高さよりも低い外側保護壁２１ａが枠状に設けられているので、枠状のシール材２５の内側及び外側の圧力差によるシール材２５の内部での気泡の発生を抑制することができる。これにより、有機ＥＬ素子１１を確実に密閉することができるので、有機ＥＬ素子１１の信頼性を確保することができ、さらには、有機ＥＬ素子１１の気泡の流入を抑制することができることにより、有機ＥＬ表示装置５０ｈの製造歩留まりを向上させることができる。 According to the organic EL display device 50h of the present embodiment, as in the first embodiment, the sealing material 25 that surrounds the organic EL element 11 and adheres the element substrate 20b and the sealing substrate 30 to the element substrate 20b. Since the outer protective wall 21a lower than the height of the sealing material 25 is provided in a frame shape so as to surround the air bubble, bubbles are generated inside the sealing material 25 due to a pressure difference between the inside and the outside of the frame-shaped sealing material 25 Can be suppressed. Thereby, since the organic EL element 11 can be reliably sealed, the reliability of the organic EL element 11 can be secured, and furthermore, the inflow of bubbles of the organic EL element 11 can be suppressed. The production yield of the organic EL display device 50h can be improved.
　また、本実施形態の有機ＥＬ表示装置５０ｈによれば、素子基板２０ｂ、封止基板３０及びシール材２５に囲まれた領域に水分吸着樹脂２６が充填されていると共に、素子基板２０ｂに有機ＥＬ素子１１を覆う保護膜１２が設けられているので、有機ＥＬ素子１１の劣化をいっそう抑制することができる。 Further, according to the organic EL display device 50h of the present embodiment, the region surrounded by the element substrate 20b, the sealing substrate 30 and the sealing material 25 is filled with the moisture adsorption resin 26, and the element substrate 20b is filled with the organic EL. Since the protective film 12 covering the element 11 is provided, the deterioration of the organic EL element 11 can be further suppressed.
　なお、上記各実施形態では、外側保護壁及び内側保護壁が同一の基板に設けられた有機ＥＬ表示装置を例示したが、本発明は、外側保護壁及び内側保護壁が互いに異なる基板に設けられた有機ＥＬ表示装置にも適用することができる。 In each of the above embodiments, the organic EL display device in which the outer protective wall and the inner protective wall are provided on the same substrate is illustrated. However, in the present invention, the outer protective wall and the inner protective wall are provided on different substrates. The present invention can also be applied to organic EL display devices.
　また、上記各実施形態では、ベース基板及び封止基板として、ガラス基板を用いた有機ＥＬ表示装置を例示したが、本発明は、ベース基板及び封止基板として、プラスチック基板や金属板などを用いた有機ＥＬ表示装置にも適用することができる。 In each of the above embodiments, an organic EL display device using a glass substrate as the base substrate and the sealing substrate is illustrated. However, the present invention uses a plastic substrate, a metal plate, or the like as the base substrate and the sealing substrate. The present invention can also be applied to conventional organic EL display devices.
　以上説明したように、本発明は、枠状のシール材２５の内側及び外側の圧力差によるシール材２５の内部での気泡の発生を抑制することができるので、素子基板及び封止基板を減圧雰囲気（真空雰囲気）で貼り合わせることにより製造される有機ＥＬ表示装置について有用である。 As described above, the present invention can suppress the generation of bubbles in the sealing material 25 due to the pressure difference between the inside and the outside of the frame-shaped sealing material 25, so that the element substrate and the sealing substrate are decompressed. This is useful for organic EL display devices manufactured by bonding in an atmosphere (vacuum atmosphere).
Ｂ　　　底面
Ｃ　　　凹部
１１　　有機ＥＬ素子
１２　　保護膜
２０，２０ｂ　　素子基板
２１ａ，３２ａ　　外側保護壁
２１ｂ，３２ｂ　　内側保護壁
２５　　シール材
２６　　水分吸着樹脂
３０，３０ａ　　　封止基板
３１　　乾燥シート
５０ａ～５０ｈ　　有機ＥＬ表示装置 B Bottom C Recess 11 Organic EL element 12 Protective film 20, 20b Element substrate 21a, 32a Outer protective wall 21b, 32b Inner protective wall 25 Sealing material 26 Moisture adsorption resin 30, 30a Sealing substrate 31 Dry sheets 50a-50h Organic EL display apparatus

Claims (7)

  1. 　有機エレクトロルミネセンス素子が設けられた素子基板と、
    　上記素子基板に対向して設けられた封止基板と、
    　上記素子基板及び封止基板の間に枠状に設けられ、上記有機エレクトロルミネセンス素子を囲んで該素子基板及び封止基板を互いに接着するシール材と、
    　上記素子基板又は封止基板に枠状に設けられ、上記シール材を囲んで該シール材の高さよりも低く形成された外側保護壁とを備えている、有機エレクトロルミネセンス表示装置。     An element substrate provided with an organic electroluminescence element;
    A sealing substrate provided facing the element substrate;
    A sealing material provided in a frame shape between the element substrate and the sealing substrate, surrounding the organic electroluminescence element, and bonding the element substrate and the sealing substrate to each other;
    An organic electroluminescence display device comprising: an outer protective wall provided in a frame shape on the element substrate or the sealing substrate and surrounding the sealing material and formed lower than the height of the sealing material.
  2. 　上記素子基板又は封止基板に枠状に設けられ、上記シール材及び有機エレクトロルミネセンス素子の間に該シール材の高さよりも低く形成された内側保護壁を備えている、請求項１に記載の有機エレクトロルミネセンス表示装置。 2. The inner protection wall is provided on the element substrate or the sealing substrate in a frame shape, and includes an inner protective wall formed between the sealing material and the organic electroluminescent element and lower than the height of the sealing material. Organic electroluminescence display device.
  3. 　上記封止基板の上記素子基板に対向する表面には、水分を吸着する乾燥シートが設けられている、請求項１又は２に記載の有機エレクトロルミネセンス表示装置。 The organic electroluminescence display device according to claim 1, wherein a dry sheet that adsorbs moisture is provided on a surface of the sealing substrate facing the element substrate.
  4. 　上記乾燥シートは、上記封止基板に形成された凹部の底面に設けられている、請求項３に記載の有機エレクトロルミネセンス表示装置。 The organic electroluminescence display device according to claim 3, wherein the dry sheet is provided on a bottom surface of a recess formed in the sealing substrate.
  5. 　上記素子基板、封止基板及びシール材に囲まれた領域には、水分を吸着する樹脂が充填されている、請求項１又は２に記載の有機エレクトロルミネセンス表示装置。 The organic electroluminescence display device according to claim 1 or 2, wherein a region surrounded by the element substrate, the sealing substrate, and the sealing material is filled with a resin that adsorbs moisture.
  6. 　上記素子基板には、上記有機エレクトロルミネセンス素子を覆って該有機エレクトロルミネセンス素子の劣化を抑制する保護膜が設けられている、請求項１～５の何れか１つに記載の有機エレクトロルミネセンス表示装置。 6. The organic electroluminescent device according to claim 1, wherein a protective film that covers the organic electroluminescent device and suppresses deterioration of the organic electroluminescent device is provided on the device substrate. Sense display device.
  7. 　有機エレクトロルミネセンス素子が設けられた素子基板と、
    　上記素子基板に対向して設けられた封止基板と、
    　上記素子基板及び封止基板の間に枠状に設けられ、上記有機エレクトロルミネセンス素子を囲んで該素子基板及び封止基板を互いに接着するシール材とを備えた有機エレクトロルミネセンス表示装置を製造する方法であって、
    　上記素子基板及び封止基板の一方の基板の周端部に上記シール材よりも外側で該シール材の高さよりも低い枠状の外側保護壁を形成する保護壁形成工程と、
    　上記外側保護壁が形成された一方の基板、及び該外側保護壁が形成されていない他方の基板を上記シール材を介して減圧雰囲気で貼り合わせ後に、該減圧雰囲気を開放する貼り合わせ工程とを備える、有機エレクトロルミネセンス表示装置の製造方法。     An element substrate provided with an organic electroluminescence element;
    A sealing substrate provided facing the element substrate;
    An organic electroluminescence display device comprising a sealing material provided in a frame shape between the element substrate and the sealing substrate and surrounding the organic electroluminescence element and bonding the element substrate and the sealing substrate to each other is manufactured. A way to
    A protective wall forming step of forming a frame-shaped outer protective wall on the peripheral edge of one of the element substrate and the sealing substrate outside the sealing material and lower than the height of the sealing material;
    A bonding step of releasing the reduced-pressure atmosphere after bonding the one substrate on which the outer protective wall is formed and the other substrate on which the outer protective wall is not formed in the reduced-pressure atmosphere through the sealing material; A method for manufacturing an organic electroluminescence display device.
PCT/JP2013/005547 2012-09-26 2013-09-20 Organic electroluminescent display apparatus and method for manufacturing same WO2014050039A1 (en)

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