WO2014044242A1 - Ruban adhésif structural à activation thermique - Google Patents

Ruban adhésif structural à activation thermique Download PDF

Info

Publication number
WO2014044242A1
WO2014044242A1 PCT/DE2013/000530 DE2013000530W WO2014044242A1 WO 2014044242 A1 WO2014044242 A1 WO 2014044242A1 DE 2013000530 W DE2013000530 W DE 2013000530W WO 2014044242 A1 WO2014044242 A1 WO 2014044242A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
adhesive
activatable
structural adhesive
adhesive strip
Prior art date
Application number
PCT/DE2013/000530
Other languages
German (de)
English (en)
Inventor
Hansjörg Ander
Marcus BRETSCHNEIDER
Oliver Kühl
Original Assignee
Lohmann Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohmann Gmbh & Co. Kg filed Critical Lohmann Gmbh & Co. Kg
Priority to DE112013004635.0T priority Critical patent/DE112013004635A5/de
Publication of WO2014044242A1 publication Critical patent/WO2014044242A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/048—Joining glass to metal by means of an interlayer consisting of an adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Definitions

  • the present invention is a heat-activated structural adhesive tape with improved resistance to moisture infiltration.
  • Reactive pressure-sensitive adhesive tapes are adhesive tapes made of reactive adhesives that undergo a solid, almost insoluble structural bond under the influence of temperature and pressure.
  • structural adhesive tape describes a tape which has no adhesive strength at room temperature, this is achieved only after the heat activation and to such an extent that the adhesive itself is finally an integral part of the new structure due to the absence of adhesive at room temperature Depending on the heat sensitivity of the material to be bonded, such a tape can not be used in every application.
  • Adhesive tapes on the other hand, have adhesive strength at room temperature, but can not be hardened subsequently and have hitherto been able to meet the high adhesive strength requirements of, for example, the known structural liquid adhesives
  • the reactive semistructural pressure-sensitive adhesive tape described in the present invention now combines the advantages of pressure-sensitive adhesive tapes with those of the structural adhesives.
  • Heat-activated films, films or tapes in general have long been known both from industrial applications and from the literature.
  • adhesive systems either thermoplastic, heat-activated systems or heat-activatable elastomer / reactive component systems are used.
  • the tape consists of a heat-activatable, epoxy-based adhesive layer, which is located on a release liner.
  • the adhesive tape is already in the non-activated state slightly pressure-sensitive, and can be treated during processing as a normal pressure-sensitive adhesive tape.
  • Stamped parts can be produced from the adhesive tape, which can be pre-applied to the respective parts to be bonded.
  • the adhesive tape can be produced in a thickness of 300 to 1500 ⁇ m, depending on the thickness tolerances which may have to be compensated in the respective application.
  • the adhesive contains, in addition to the components typical for a structural epoxy-based adhesive tape, an epoxy silane, which acts as a coupling agent between the glass and the adhesive. This coupling effectively reduces the moisture infiltration and thereby causes a much higher residual holding force after a wet heat storage.
  • JP 2012046738 A describes a heat-curable adhesive film which can be used in a wide variety of applications as a patented adhesive technology, where the adhesive is an epoxy-functional acrylate copolymer with, inter alia, acrylic rubber microparticles in a core-shell rubber component.
  • JP 08157793 A claims an epoxy-modified "acrylic foam" equipped on one side with a nonwoven fabric which is impregnated with an epoxy-modified acrylate pressure-sensitive adhesive The entire construction is used as a heat-curable double-sided adhesive tape in the fastening of trim strips
  • EP 311370 Bl describes a thermosetting epoxy resin adhesive for making a prepreg in which the adhesive is reinforced with fibers
  • EP 899106 B1 describes a method and composition for bonding components to glass, including attaching a mirror to a windshield so disgusting by means of a thermosetting, heat- or radiation-curable acrylic ester-epoxy resin mixture.
  • the adhesive tape according to the invention is constructed as follows: heat-activated adhesive layer, release liner.
  • the thickness of 300 to 1500 ⁇ is achieved by a solvent-free UV tape polymerization of the adhesive.
  • Support materials such as e.g. Films or fabrics are omitted in the preferred application here, but their use is quite conceivable for other possible applications.
  • the necessary thickness of the overall system is essentially determined by possible thickness tolerances in the application. Thus, e.g. To compensate for the variations in thickness of a substrate to be bonded such as a disc curvature or the substrates to be bonded or seeks to adapt as fully as possible to curved / curved surfaces, thereby causing an optimal adhesive wetting of the parts to be bonded. In this way, no weak point in the composite arises.
  • the reactive adhesive system described here which is expediently usable here, exhibits slightly pressure-sensitive adhesive properties even in the non-activated state, which entails the advantages of processing as in the case of a "normal" pressure-sensitive adhesive tape, before a structural connection is finally produced by heat activation.
  • a reactive pressure-sensitive adhesive tape based on epoxy resin which is distinguished by the following properties, is preferred for the intended use because of its high ultimate strength and very good adhesion to metal or glass.
  • an oxygen atom together with two carbon atoms forms a three-membered ring, a sterically very unfavorable arrangement, very unstable and thus highly reactive.
  • the epoxide components and the crosslinker are present directly next to one another. They are mixed together during the manufacture of the adhesive. In order to allow the crosslinker to react, it requires high temperatures above about 130 ° C.
  • the individual known epoxy-functional components with a crosslinking agent in the form of a latent amine hardener preferably a Dicyanpolyamid and more preferably a dicyandiamide crosslinked to a macromolecule.
  • Dicyandiamide is very well suited as a crosslinker because of its tetrafunctionality. This reaction takes place only from a temperature of about 160 ° C., at room temperature dicyandiamide shows virtually no reactivity towards epoxy resins.
  • Further suitable latent amine hardeners are, for example, diaminodiphenylsulfone or mixtures of dicyandiamide and diaminodiphenylsulfone.
  • an accelerator / catalyst for epoxy resins is added, which is tailored in its mode of action exactly on the crosslinker.
  • Known catalysts for epoxy adhesives are, for example, 2,6 or 2,4-isomers of toluene-bis-dimethylurea and mixtures thereof, but other known thermally-initiated catalyst systems are also conceivable.
  • the initiator system used according to the invention is a substance mixture of two different substances, namely 25% of bis (2,6-dimethoxybenzoyl) -2,4, 4-trimethyl-pentylphosphine oxide and 75% of 1-hydroxycyclohexyl-phenyl-ketone.
  • UV-active initiators have the great advantage that they decompose into their radicals even at room temperature. These radicals then start radical polymerization, using acrylates and epoxi-functional acrylates as monomers. The reaction is stopped at a certain degree of conversion (20 to 50%) and there is a pre-thickened acrylate prepolymer.
  • Such an epoxy-functional, pre-thickened acrylate prepolymer forms the essential component of the adhesive system according to the invention, which is thus produced by partial polymerization of a mixture of various components without solvent.
  • the epoxy-functional acrylate prepolymer provides for its tackiness in this system and is responsible for the fact that the adhesive system according to the invention in the non-activated state is slightly pressure-sensitive. It is finally incorporated after curing in the structural composite and is then no longer sticky.
  • Epoxy is less viscous than most adhesives, so it will flow out of crevices and joints if it is not mixed with a thickener or filler. Fillers usually have no chemical effect on the mixture, they simply make the epoxy just thicker, the amount of filler used varies depending on the application.
  • colloidal silica, polymers, hollow microspheres, phyllosilicates, fiber materials, mica, Betonit, kaolin, wollastonite, alumina, metal powder, pigments and dyes, silicones, waxes or stearates are used as thickeners.
  • the pre-thickened epoxy-functional acrylate prepolymer is present in the finished adhesive solution in a proportion of 20 to 80%, preferably in a proportion of 40 to 60%.
  • Tackifiers in the form of solid, liquid or so-called "semi-solid", ie highly viscous, resins are also added to the mixture
  • One of the resins used is an unmodified epoxy resin with a softening point between 55 and 65 ° C., good solubility This resin contributes significantly to the good final strength of the adhesive system and its level of adhesive formulation is from 1 to 50%, preferably from 10 to 30%.
  • a resin added in an amount of 10 to 40%, preferably 15 to 25% in the form of a silicone rubber is for impact modification.
  • the silicone rubber particles used have an organic shell structure, which has reactive groups (they are called "core-shell” particles), they have a very good resistance to high temperatures up to 200 ° C. and to ozone and UV ,
  • the component that distinguishes this invention from other structural adhesive tapes is silane modification.
  • Epoxi- or aminosilanes come into question, they are able to bind with your epoxy or amino group to the KJebstoffmatrix, and to couple with your silane group to the glass, so that the infiltration of the glass by water at a To effectively prevent damp heat storage.
  • the adhesive solution contains a silane-based coupling agent in an amount of one to 5%.
  • the adhesive system according to the invention moreover contains further adjuvants usually added in the production of adhesives, for example a reactive diluent in an amount of 2 to 20%, preferably of 5 to 10% and a thermal crosslinker in an amount of 2 to 20%, preferably of 3 to 5%. Further added are 2 to 10%, preferably 3 to 5% of a catalyst acting as an accelerator and 0.5 to 3% of a UV initiator for the radical polymerization and thus the film formation of the acrylate polymer.
  • the adhesive solution may in principle contain other adjuvants commonly used in the production of adhesives or adhesive tapes, such as plasticizers, rheology additives, surface-active substances, wetting and dispersing additives, defoamers, UV stabilizers or antioxidants.
  • the finished adhesive tape is a 100% solids system which has been brought from the viscous state of an adhesive film by radical polymerization of the acrylate polymer from the viscous state.
  • the most important test criterion for proving the excellent suitability of the strip for the exemplary application mentioned is the measurement of torsional strength before and after aging tests.
  • the following aging tests were carried out with the tape according to the invention:
  • the heating of the adhesive tape takes place in this exemplary application of gluing a mirror base on the window of a vehicle in a few seconds by induction.
  • the composite is loadable after a short time and no longer slips, so attachments such. Vehicle mirror according to the described "cleavage" test held without slipping.A complete curing and loading is possible after about 24 h.
  • composition and structure of the tape have been exemplified for the application mentioned, but there are quite a variety of other applications conceivable.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Ruban adhésif structural à activation thermique, à base d'un acrylate à fonction époxy, présentant une résistance améliorée à l'infiltration d'humidité et par conséquent particulièrement approprié par exemple au collage de pièces à rapporter sur la vitre d'un véhicule.
PCT/DE2013/000530 2012-09-21 2013-09-18 Ruban adhésif structural à activation thermique WO2014044242A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112013004635.0T DE112013004635A5 (de) 2012-09-21 2013-09-18 Hitzeaktivierbares strukturelles Haftklebeband

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012018630.4 2012-09-21
DE102012018630.4A DE102012018630A1 (de) 2012-09-21 2012-09-21 Hitzeaktivierbares strukturelles Haftklebeband

Publications (1)

Publication Number Publication Date
WO2014044242A1 true WO2014044242A1 (fr) 2014-03-27

Family

ID=49679263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2013/000530 WO2014044242A1 (fr) 2012-09-21 2013-09-18 Ruban adhésif structural à activation thermique

Country Status (2)

Country Link
DE (2) DE102012018630A1 (fr)
WO (1) WO2014044242A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015115717A1 (de) 2015-09-17 2017-03-23 Lohmann Gmbh & Co. Kg Asymmetrische Klebefolie mit einer Kraftentkopplungsfunktion

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113429923A (zh) 2015-06-04 2021-09-24 3M创新有限公司 将硬件粘结到车辆玻璃的方法
DE102015122438A1 (de) 2015-12-21 2017-06-22 Lohmann Gmbh & Co. Kg Hitzeaktivierbares Klebeband

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60215087A (ja) * 1984-04-10 1985-10-28 Nissan Motor Co Ltd 車両用インサイドミラ−取付用接着剤
EP0311370B1 (fr) 1987-10-08 1995-01-04 Minnesota Mining And Manufacturing Company Adhésif à base d'une résine époxyde modifiée par un composé phénolique
JPH08157793A (ja) 1994-12-09 1996-06-18 Daihatsu Motor Co Ltd 熱硬化性両面接着テープ及びそれを用いた自動車の付属物取付け構造体
US5587236A (en) 1991-10-09 1996-12-24 Donnelly Corporation Interior rear view mirror mounting system utilizing one-package structural adhesive
WO1997012009A1 (fr) * 1995-09-29 1997-04-03 Minnesota Mining And Manufacturing Company Composition thermodurcissable
WO1999001520A1 (fr) * 1997-07-01 1999-01-14 Minnesota Mining And Manufacturing Company Compositions adhesives presentant une durabilite dans des conditions d'humidite elevee
EP0828648B1 (fr) 1995-06-02 1999-08-04 Minnesota Mining And Manufacturing Company Procede et appareil pour faire adherer un objet sur une surface de verre
EP0971011A2 (fr) * 1998-07-06 2000-01-12 Lintec Corporation Composition adhésive et feuille adhésive
WO2000071632A1 (fr) * 1999-05-20 2000-11-30 3M Innovative Properties Company Composition de colle ou de mastic et structure collee ainsi realisee
EP0899106B1 (fr) 1997-08-27 2004-11-10 NEC Corporation Dispositif électrostatique d'enregistrement à jet d'encre
JP2012046738A (ja) 2010-07-29 2012-03-08 Dainippon Printing Co Ltd 接着組成物および熱硬化性接着シートの製造方法
DE102011008191A1 (de) * 2011-01-10 2012-07-12 Lohmann Gmbh & Co. Kg Hitzeaktivierbares strukturelles Haftklebeband mit Gewebeträger

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050081993A1 (en) * 2003-10-16 2005-04-21 Ilkka Steven J. Method of bonding glass
DE202011104393U1 (de) * 2011-06-29 2012-02-13 Lohmann Gmbh & Co. Kg Reaktives Klebebandpolymerisat

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60215087A (ja) * 1984-04-10 1985-10-28 Nissan Motor Co Ltd 車両用インサイドミラ−取付用接着剤
EP0311370B1 (fr) 1987-10-08 1995-01-04 Minnesota Mining And Manufacturing Company Adhésif à base d'une résine époxyde modifiée par un composé phénolique
US5587236A (en) 1991-10-09 1996-12-24 Donnelly Corporation Interior rear view mirror mounting system utilizing one-package structural adhesive
JPH08157793A (ja) 1994-12-09 1996-06-18 Daihatsu Motor Co Ltd 熱硬化性両面接着テープ及びそれを用いた自動車の付属物取付け構造体
EP0828648B1 (fr) 1995-06-02 1999-08-04 Minnesota Mining And Manufacturing Company Procede et appareil pour faire adherer un objet sur une surface de verre
WO1997012009A1 (fr) * 1995-09-29 1997-04-03 Minnesota Mining And Manufacturing Company Composition thermodurcissable
WO1999001520A1 (fr) * 1997-07-01 1999-01-14 Minnesota Mining And Manufacturing Company Compositions adhesives presentant une durabilite dans des conditions d'humidite elevee
EP0899106B1 (fr) 1997-08-27 2004-11-10 NEC Corporation Dispositif électrostatique d'enregistrement à jet d'encre
EP0971011A2 (fr) * 1998-07-06 2000-01-12 Lintec Corporation Composition adhésive et feuille adhésive
WO2000071632A1 (fr) * 1999-05-20 2000-11-30 3M Innovative Properties Company Composition de colle ou de mastic et structure collee ainsi realisee
JP2012046738A (ja) 2010-07-29 2012-03-08 Dainippon Printing Co Ltd 接着組成物および熱硬化性接着シートの製造方法
DE102011008191A1 (de) * 2011-01-10 2012-07-12 Lohmann Gmbh & Co. Kg Hitzeaktivierbares strukturelles Haftklebeband mit Gewebeträger

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015115717A1 (de) 2015-09-17 2017-03-23 Lohmann Gmbh & Co. Kg Asymmetrische Klebefolie mit einer Kraftentkopplungsfunktion
DE102015115717B4 (de) 2015-09-17 2022-12-08 Lohmann Gmbh & Co. Kg Asymmetrische Klebefolie mit einer Kraftentkopplungsfunktion und Verwendung

Also Published As

Publication number Publication date
DE112013004635A5 (de) 2015-07-09
DE102012018630A1 (de) 2014-03-27

Similar Documents

Publication Publication Date Title
EP0354498B1 (fr) Colle fusible réactive
EP0591307B1 (fr) Colle a fusion reactive
DE69927289T2 (de) Hochfeste epoxidharzklebstoffe und deren verwendung
WO2000037554A1 (fr) Compositions de resine epoxy resistantes aux chocs
EP2748217B1 (fr) Durcisseur pour compositions durcissant à l'humidité
WO2007054112A1 (fr) Substances adhesives, d'etancheite, et de revetement contenant des particules de verre en tant que matiere de charge
EP2128210B1 (fr) Composition d'agent adhésif contenant de la résine époxyde
WO2004081076A1 (fr) Composition de resine epoxy polymere
EP3137566B1 (fr) Procédé pour réaliser un collage sur des surfaces sensibles aux perméats
DE102013209827A1 (de) Hitzebeständiges Klebeband
DE102011008191A1 (de) Hitzeaktivierbares strukturelles Haftklebeband mit Gewebeträger
KR20200071070A (ko) 접착제 조성물
KR20170088896A (ko) 에폭시 접착제, 자동차 부재, 및 그의 제조 방법
EP3394191B1 (fr) Bande adhésive activable à la chaleur
WO2014044242A1 (fr) Ruban adhésif structural à activation thermique
EP2288580B1 (fr) Composition d'adhésif contenant un aminosilane secondaire aromatique
DE4006442A1 (de) Verfahren zur vorbereitung einer substratoberflaeche fuer die verklebung mit aktivierbaren klebstoffen durch aufbringen einer einen aktivator enthaltenden schicht auf die substratoberflaeche
EP3460019B1 (fr) Adhésif époxy thermodurcissable monocomposant à adhérence améliorée
WO2007073827A1 (fr) Adhesif structurel a elasticite accrue
WO2017103080A1 (fr) Article adhésif autoporteur pour collages structuraux
EP1078965B1 (fr) Feuille adhésive thermo-activable et procédé pour la préparation d'assemblages structurels
DE102008026613A1 (de) Verfahren zur Herstellung einer Blechstruktur aus miteinander verklebten Blechbauteilen
EP0000418A1 (fr) Procédé de collage de matériaux
DE102017129487B4 (de) Epoxidharzmischung, deren Verwendung und Verfahren zur Herstellung einer Epoxidharzmischung
EP0518067A2 (fr) Adhésif thermofusible réactif

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13798232

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1120130046350

Country of ref document: DE

Ref document number: 112013004635

Country of ref document: DE

REG Reference to national code

Ref country code: DE

Ref legal event code: R225

Ref document number: 112013004635

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13798232

Country of ref document: EP

Kind code of ref document: A1