WO2014034197A1 - Connector and flexible wiring board - Google Patents
Connector and flexible wiring board Download PDFInfo
- Publication number
- WO2014034197A1 WO2014034197A1 PCT/JP2013/064266 JP2013064266W WO2014034197A1 WO 2014034197 A1 WO2014034197 A1 WO 2014034197A1 JP 2013064266 W JP2013064266 W JP 2013064266W WO 2014034197 A1 WO2014034197 A1 WO 2014034197A1
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- WIPO (PCT)
- Prior art keywords
- connector
- resin layer
- flexible substrate
- resin
- flexible
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Definitions
- the present invention relates to a connector and a flexible wiring board.
- Flexible wiring boards are composed of base materials such as polyimide, conductor materials, adhesives and coverlays, and are incorporated into mobile phones, video cameras and laptop computers in recent years as electronic devices become lighter and thinner. Yes. Since a flexible wiring board has low rigidity, it is generally mounted in a state where a reinforcing member (reinforcing plate) is attached to a mounting portion of an electronic component and a connector portion (for example, Patent Document 1).
- a reinforcing member reinforcing plate
- a metal plate such as a polyester film, a stainless steel plate and an aluminum plate, ceramics, and a glass cloth base epoxy resin laminated plate are used.
- a thick polyimide film excellent in punching workability, heat resistance and workability has become the mainstream of the connector reinforcing plate.
- a reinforcement board is affixed on the base material on the surface side opposite to the wiring terminal arrange
- Patent Document 1 and Non-Patent Document 1 that have a polyethylene terephthalate film or a polyimide film as a reinforcing plate sometimes cannot be smoothly inserted into the mating connector.
- an object of the present invention is to provide a connector having a smooth insertion property and a flexible wiring board having the connector.
- the present invention relates to a connector on the plug-in side that is used to connect the wiring by plugging into the connector on the mating side.
- the connector according to the present invention is flexible on the side opposite to the flexible base, the wiring terminal disposed on one side of the flexible base, and the wiring terminal of the flexible base.
- the end of the resin layer on the distal end side of the connector may have a surface forming a convex curved surface that curves from the facing surface toward the flexible substrate.
- the end of the resin layer on the distal end side of the connector has a surface forming a convex curved surface that curves from the facing surface facing the flexible substrate toward the flexible substrate.
- the resin layer may further contain an inorganic filler.
- the inorganic filler may be silica particles, for example.
- the content of the inorganic filler in the resin layer may be 30 to 70% by volume with respect to the volume of the resin layer.
- the flexible substrate may be a polyester substrate or a polyimide substrate.
- the thickness of the flexible substrate may be 75 ⁇ m or less.
- the initial tensile elastic modulus at 25 ° C. of the resin layer may be 0.3 to 3.0 GPa.
- the resin layer may have a thickness of 50 to 500 ⁇ m.
- the present invention also relates to a flexible wiring board comprising the above connector, a circuit flexible substrate, and a circuit provided on the circuit flexible substrate and connected to a wiring terminal of the connector.
- the flexible substrate for the connector and the flexible substrate for the circuit may be the same substrate, or the flexible substrate for the connector and another flexible substrate for the circuit It may be connected.
- FIG. 2 is an end view taken along the line II-II ′ of the connector shown in FIG. 1. It is an end view which shows the modification of the shape of a resin layer. It is an end view which shows other embodiment of a connector. It is an end view which shows other embodiment of a connector. It is an end view which shows other embodiment of a connector. It is an end view which shows other embodiment of a connector. It is process drawing which shows one Embodiment of the manufacturing method of a connector. It is a schematic explanatory drawing which shows the method of the durability test of a connector. It is an optical microscope photograph of the section of a connector. It is a scanning electron micrograph of the cross section of a resin layer.
- FIG. 1 is a schematic diagram showing an embodiment of a connector.
- FIG. 2 is an end view taken along the line II-II ′ of FIG.
- a connector 10 shown in FIGS. 1 and 2 includes a flexible substrate 2, a wiring terminal 1 disposed on one surface side of the flexible substrate 2, and a wiring terminal 1 of the flexible substrate 2. Is composed of a resin layer 3 disposed on the end of the flexible substrate 2 on the opposite surface side. The rigidity of the flexible substrate 2 is increased in the portion in contact with the resin layer 3 as compared with the case where the resin layer 3 is not formed.
- the connector 10 is a plug-in side connector that is used to connect a wiring by being plugged into a mating connector. By inserting the tip of the connector 10 into the mating connector, for example, a state in which transmission is possible by mechanical and electrical (electronic) connection is obtained. The connector 10 can be safely and easily detached and attached as necessary.
- FIG. 2 shows the circuit flexible substrate 52 and the circuit 51 provided on the circuit flexible substrate 52 together with the connector 10.
- the circuit 51 is connected to the wiring terminal 1 of the connector 10.
- the flexible wiring board 100 is configured by the connector 10, the circuit flexible substrate 52, and the circuit 51.
- the connector flexible substrate 2 and the circuit flexible substrate 52 may be the same single substrate or may be separate substrates connected to each other.
- the flexible substrate 2 is not particularly limited as long as it exhibits a foldable flexibility. From the viewpoint of toughness, the flexible substrate 2 is a polyester substrate (polyester film) or a polyimide substrate (polyimide film). The polyimide base material (polyimide film) may be sufficient from the point of toughness and heat resistance. The thickness of the flexible substrate 2 may be 75 ⁇ m or less from the viewpoint of bendability. The thickness of the flexible substrate 2 may be 10 ⁇ m or more.
- the wiring terminal 1 is a conductor layer formed from a conductor such as metal, for example.
- the thickness of the wiring terminal 1 may be 5 to 40 ⁇ m.
- the resin layer 3 usually contains a cured product of the curable resin composition as a resin. Details of the curable resin composition used to form the resin layer 3 will be described later.
- the resin layer 3 has a facing surface 6 facing the flexible substrate 2 as a surface located on the opposite side of the surface in contact with the flexible substrate 2.
- An end 3 a of the resin layer 3 on the distal end side of the connector 10 (side of the portion to be inserted into the mating connector) is curved from the facing surface 6 toward the flexible substrate 2 and directed toward the outside of the resin layer 3. It has the surface 7 which forms the convex curved surface which is convex. Since the surface 7 of the end portion 3a of the resin layer 3 forms a convex curved surface, the resistance at the time of inserting into the mating connector is reduced, and a smooth insertion property is obtained.
- the end of the resin layer 3 opposite to the tip of the connector 10 also has a surface curved from the facing surface 6 toward the flexible substrate 2 to form a convex curved surface.
- the surface of the end opposite to the tip of the connector 10 does not have to form a convex curved surface.
- the edge part of the resin layer 3 of the side side of the connector 10 may have the surface which curves toward the flexible base material 2 from the opposing surface 6, and forms the convex curve.
- the surface of the end portion 3a of the resin layer 3 (the surface of the portion that is not in contact with the flexible base material 2) only needs to form a convex curved surface.
- the edge part 3a of the resin layer 3 may have the surface which forms the plane which follows the perpendicular of the main surface of a flexible base material like embodiment of FIG. (A), (b) of FIG. 3 is an end view which shows the modification of the shape of a resin layer.
- the entire side surface of the end portion 3a of the resin layer 3 on the distal end side of the connector forms a convex curved surface.
- the thickness of the resin layer 3 may be 50 to 500 ⁇ m, 70 to 300 ⁇ m, or 75 to 200 ⁇ m. When the thickness of the resin layer 3 is within these ranges, the resin layer can be easily formed. In addition, since the resin layer 3 is not easily bent, particularly excellent connector shape retention is obtained.
- the length of the resin layer 3 in the connector insertion direction may be, for example, 3 to 30 mm.
- the resin layer 3 may be provided over the entire width direction of the flexible base material, or may be provided only in a partial region in the width direction as long as necessary rigidity is obtained.
- the initial tensile elastic modulus at 25 ° C. of the resin layer 3 may be 0.3 to 3.0 GPa, 0.5 to 2.5 GPa, or 1.0 to 2.2 GPa. When the initial tensile elastic modulus of the resin layer 3 is within these ranges, cracks in the resin layer 3 are unlikely to occur, and a further excellent insertion property can be obtained.
- the initial tensile elastic modulus at 25 ° C. of the resin layer 3 is obtained from the maximum value of the tangential slope of the stress-displacement curve obtained when a tensile stress is applied to the strip-shaped resin layer at a tension speed of 50 mm / min. Can do.
- the strip-shaped resin layer can be prepared, for example, by cutting out from a plate-shaped resin layer formed by curing a curable resin composition described below. Details of the method of measuring the initial tensile elastic modulus will be described in detail in Examples described later.
- the initial tensile elastic modulus within the above numerical range can be achieved, for example, by a resin layer further containing an inorganic filler in addition to the resin.
- the inorganic filler in the resin layer 3 may be composed of one kind of particle or may be composed of a combination of two or more kinds of particles.
- the average particle size of the inorganic filler may be 1 to 100 ⁇ m, 1 to 50 ⁇ m, 1 to 20 ⁇ m, or 1.5 to 10 ⁇ m.
- the inorganic filler may be a mixture of plural kinds of fillers having different average particle diameters. Thereby, the space filling rate by an inorganic filler can be raised.
- the average particle diameter of the inorganic filler is an arithmetic average of the particle diameters (maximum diameters) of the plurality of inorganic fillers observed by observing the resin layer 3 with a scanning electron microscope (Scanning Electron Microscope), for example, at a magnification of 1000 times. .
- the number of inorganic fillers whose particle diameter is measured to determine the average particle diameter is, for example, 50 or more.
- the content of the inorganic filler in the resin layer 3 is 30 to 70% by volume, 40 to 65% by volume, or 50 to 65% by volume with respect to the volume of the resin layer 3 in terms of the strength of the resin layer and the initial tensile elastic modulus. There may be.
- the content of the inorganic filler in the resin layer 3 is 40 to 85% by mass, 45 to 80% by mass, or 50 to 80% by mass with respect to the mass of the resin layer 3 in terms of the strength of the resin layer and the initial tensile elastic modulus. %.
- the inorganic filler may contain silica particles.
- the silica particles are not particularly limited, and may be, for example, spherical silica, crushed silica refined by pulverization, dry silica, or wet silica.
- the surface of the resin layer 3 becomes smooth, and a smooth insertion property is obtained. In addition, more excellent wear resistance and crack resistance can be obtained.
- the spherical silica particles can be obtained, for example, by a sol-gel method.
- the average particle size of the spherical silica particles may be 0.05 to 50 ⁇ m, 0.1 to 50 ⁇ m, 0.2 to 30 ⁇ m, or 0.5 to 20 ⁇ m.
- the spherical silica particles only need to have a substantially spherical shape (see JIS Z2500: 2000), and are not necessarily spherical.
- the ratio (DL) / (DS) of the major axis (DL) and minor axis (DS) of the particles may be 1.0 to 1.2. .
- spherical silica particles examples include MSR-2212, MSR-SC3, MSR-SC4, MSR-3512, MSR-FC208 (above, trade name, manufactured by Tatsumori Co., Ltd.), Excelica (trade name, manufactured by Tokuyama Corporation), SO-E1.
- Silica particles may be surface-treated.
- Examples of the surface treating agent used for surface treating silica particles include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and 3-glycidoxypropylmethyldimethoxy.
- Silane 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimeth Sisilane, n-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane triethoxysilane, n-2- (aminoethyl) -3-aminopropyltrimethoxysilane, n-2- (aminoethyl) -3-aminopropyltrimethoxys
- Resin layer 3 may contain fumed silica as an inorganic filler.
- the fumed silica may be used to control the printability of a liquid composition to be described later used for forming the resin layer 3.
- Commercially available fumed silica includes hydrophilic silica such as Aerosil 50, 90G, 130, 200, 300, and 380, and R972, R972CF, R972V, R974, R9765, R140, RX50, NAX50, NX90G, RX200, RX300. , R812, R8200, and R200H, etc., and hydrophobic silica (trade name, Nippon Aerosil Co., Ltd.).
- FIG. 4 is an end view showing another embodiment of the connector.
- the flexible substrate 2 of the connector 10 shown in FIG. 4 includes a flexible substrate 40 and a cover film 41 provided on the main surface of the flexible substrate 40 on the resin layer 3 side.
- the cover film 41 can function as, for example, a film for protecting the wiring terminal 1 or a solder resist.
- the cover film 41 may be provided on the main surface of the flexible substrate 40 on the wiring terminal 1 side, or may be provided on both surfaces of the flexible substrate 40.
- the same base material as the flexible base material 2 can be used as the flexible substrate 40.
- the cover film 41 can be formed using various thermosetting or photosensitive resin films.
- resin film used for forming the cover film 41 for example, Nikaflex CTSV, CISV, CISA, CKSE, CISG, CKSG (above, Nikkan Kogyo Co., Ltd. trade name), Piralux PC1000 (above , DuPont Co., Ltd., trade names), Raytec FR-7025, FR-7038, FR-7050, FZ-2520G, FZ-2525G, FZ-2530G, FZ-2535G (above, trade names made by Hitachi Chemical Co., Ltd.) It is done.
- FIG. 5 is also an end view showing another embodiment of the connector.
- the flexible base 2 of the connector shown in FIG. 5 is composed of a flexible substrate 40, a non-wiring metal layer 42 and a cover film 41 provided in this order on the main surface of the flexible substrate 40 on the resin layer 3 side.
- the flexible base 2 is composed of a flexible substrate 40 and a non-wiring metal layer 42 provided on the main surface of the flexible substrate 40 on the resin layer 3 side, and has a cover film 41. You don't have to.
- the step of providing the wiring terminal 1 on one surface side of the flexible base material 2 and the resin layer 3 on the surface side opposite to the wiring terminal 1 of the flexible base material 2 are formed. And a process including the steps.
- the wiring terminal 1 may be provided before the resin layer 3 is formed, or may be provided after the resin layer 3 is formed.
- the resin layer 3 can be formed by, for example, a method including a step of applying a curable resin composition and, if necessary, a liquid composition (liquid ink) containing an inorganic filler to a flexible substrate.
- a liquid composition liquid ink
- a rigid resin layer can be formed by a simple process.
- the thickness of the resin layer can be easily and precisely controlled by a method such as printing. Therefore, products with different thickness specifications can be efficiently manufactured.
- a resin layer can be formed very efficiently at any position on the flexible substrate without manual operation. Furthermore, a resin layer excellent in reflow resistance can be formed.
- FIG. 7 is a process diagram showing an embodiment of a method for forming the resin layer 3 using the liquid composition 5.
- a liquid composition 5 containing a curable resin composition and a metal mask 4 having an opening 4a are prepared (see FIG. 7A).
- the liquid composition 5 may contain a solvent in which the curable resin composition is dissolved or dispersed.
- the liquid composition 5 is filled in the opening 4a of the metal mask 4 and printed on the flexible substrate 2 (see FIG. 7B).
- the method of applying the liquid composition can be appropriately selected from screen printing, bar coater and the like in addition to printing using a metal mask.
- the solvent is removed from the coated liquid composition 5 by a method such as heating to form an uncured resin layer 3 (see FIG. 7C).
- a method such as heating to form an uncured resin layer 3 (see FIG. 7C).
- the resin layer 3 containing a cured product of the curable resin composition as a resin is formed.
- Curing of the curable resin composition can be performed, for example, by heating or light irradiation.
- the metal mask 4 can be removed, for example, after application of the curable resin composition. According to the method in which the liquid composition is applied and cured, it is possible to easily form a resin layer having an end portion on which a convex curved surface is formed.
- the solvent removal (drying) and curing temperature may be 50 to 250 ° C., 80 to 200 ° C., or 100 to 190 ° C.
- the resin layer 3 can be disposed on the end portion of the flexible base material 2 by punching the flexible base material 2 (see FIG. 7D).
- the liquid composition 5 may contain, for example, a curable resin composition, the above-described inorganic filler, and a solvent.
- a curable resin composition is comprised from components other than a solvent and an inorganic filler among the liquid compositions 5, for example, contains the curable resin hardened
- the curable resin includes, for example, one kind or two or more kinds of epoxy resins.
- a thermoplastic resin contains 1 type, or 2 or more types of acrylic resins (polymer of an acrylic monomer), for example.
- the epoxy resin is, for example, a polyglycidyl ether obtained by reacting a polyhydric phenol such as bisphenol A, a novolac type phenol resin and an orthocresol novolac type phenol resin, or a polyhydric alcohol such as 1,4-butanediol and epichlorohydrin.
- Polyglycidyl esters obtained by reacting polybasic acids such as phthalic acid and hexahydrophthalic acid with epichlorohydrin, N-glycidyl derivatives of compounds having amino groups, amide groups, or heterocyclic nitrogen bases, and alicyclic rings Selected from the formula epoxy resins. Since it has high compatibility with the acrylic resin, a biphenyl aralkyl type epoxy resin can be selected.
- the curable resin may contain an epoxy resin curing agent.
- the curing agent can be selected from, for example, dicyandiamide, diaminodiphenylmethane, diaminodiphenylsulfone, phthalic anhydride, pyromellitic anhydride, and polyfunctional phenols (phenolic resins) such as phenol novolac and cresol novolac.
- the phenol resin may contain a phenol type, bisphenol A type, cresol novolac type, or aminotriazine novolac type phenol resin.
- One or both of the cresol novolak type and aminotriazine novolak type phenol resins can be selected from the viewpoint of compatibility with the acrylic resin.
- the aminotriazine novolac type phenolic resin has a structural unit represented by the following structural formula (I).
- R represents a hydrogen atom or a methyl group
- n represents an integer of 1 to 30.
- the curable resin may contain a high molecular weight component for the purpose of improving the heat resistance of the resin layer.
- the molecular weight of the component constituting the curable resin is usually 3000 or less.
- the curable resin may contain an accelerator for the purpose of accelerating the curing reaction.
- an accelerator for the purpose of accelerating the curing reaction.
- the kind and compounding quantity of an accelerator are not specifically limited. For example, one or more selected from imidazole compounds, organophosphorus compounds, tertiary amines, quaternary ammonium salts and the like are used.
- the acrylic resin is generally a copolymer containing a polymerizable monomer containing two or more acrylic monomers having an acrylic group or a methacryl group as a monomer unit.
- the acrylic resin can be manufactured at low cost by selecting various combinations from commercially available acrylic monomers according to desired properties.
- the acrylic resin is excellent in that it can easily dry the printed liquid composition because it has good solubility in a low-boiling ketone solvent.
- the acrylic monomer used for producing the acrylic resin is not particularly limited.
- the acrylic resin include acrylonitrile, methyl acrylate, ethyl acrylate, n-propyl acrylate, i-propyl acrylate, n-butyl acrylate, i-butyl acrylate, t-butyl acrylate, pentyl acrylate, N-hexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, dodecyl acrylate, octadecyl acrylate, butoxyethyl acrylate, phenyl acrylate, benzyl acrylate, naphthyl acrylate, cyclohexyl acrylate, isobornyl acrylate , Norbornylmethyl acrylate, tricycloacrylate [5.2.1.
- dec-8-yl (dicyclopentanyl acrylate), tricycloacrylate [5.2.1. O2,6 ] dec-4-methyl, adamantyl acrylate, isobornyl acrylate, norbornyl acrylate, tricyclohexyl acrylate [5.2.1. O 2,6 ] dec-8-yl, tricyclohexyl acrylate [5.2.1.
- O2,6 dec-8-yl (dicyclopentanyl methacrylate) and tricyclomethacrylate [5.2.1.
- One or two or more acrylic monomers selected from methacrylic acid esters such as O 2,6 ] deca 4-methyl are included as monomer units.
- the acrylic monomer constituting the acrylic resin may contain a monomer having a functional group.
- the monomer having a functional group includes at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, and an epoxy group, and at least one polymerizable carbon-carbon 2. It may have a double bond.
- Specific examples of the monomer having a functional group include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, and itaconic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, and 2-hydroxypropyl acrylate.
- Hydroxyl group-containing monomers such as 2-hydroxypropyl methacrylate and N-methylol methacrylamide, (o-, m-, p-) hydroxystyrene, acid anhydride group-containing monomers such as maleic anhydride, diethylaminoacrylate Amino group-containing monomers such as ethyl and diethylaminoethyl methacrylate, and glycidyl acrylate, glycidyl ⁇ -ethyl acrylate, glycidyl ⁇ -n-propyl acrylate, 3,4-epoxybutyl acrylate, methacrylic acid-3, 4-epoxybutyl Acrylic acid-4,5-epoxypentyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, acrylic acid-3-methyl-4-epoxybutyl, methacrylate-3-methyl- 3,4-epoxybutyl
- the acrylic resin When the acrylic resin has a glycidyl group, the heat resistance of the resin layer is further improved. Therefore, the acrylic resin may contain glycidyl methacrylate or glycidyl acrylate as a monomer unit. Based on the amount of all polymerizable monomers constituting the acrylic resin, the content of glycidyl methacrylate or glycidyl acrylate may be 0.5 to 10% by mass, 1 to 8% by mass, or 2 to 5% by mass. Good.
- the acrylic resin may contain alkyl acrylate as a monomer from the viewpoint of adhesiveness between the flexible substrate and the resin layer.
- the alkyl group of the alkyl acrylate may have 1 to 12 or 2 to 10 carbon atoms. Based on the amount of all polymerizable monomers constituting the acrylic resin, the content of the alkyl acrylate may be 50 to 99% by mass, 60 to 98% by mass, or 70 to 96% by mass.
- the alkyl acrylate is selected from, for example, ethyl acrylate and butyl acrylate.
- the acrylic resin may contain acrylonitrile or methacrylonitrile as a monomer unit from the viewpoint of toughness and adhesiveness. Based on the amount of all polymerizable monomers constituting the acrylic resin, the content of acrylonitrile or methacrylonitrile may be 0.5 to 10% by mass, 1 to 8% by mass, or 2 to 5% by mass. Good.
- the acrylic resin may further contain another monomer copolymerized with the acrylic monomer.
- Other monomers include, for example, 4-vinylpyridine, 2-vinylpyridine, ⁇ -methylstyrene, ⁇ -ethylstyrene, ⁇ -fluorostyrene, ⁇ -chlorostyrene, ⁇ -bromostyrene, fluorostyrene, chlorostyrene, bromostyrene , Aromatic vinyl compounds such as methylstyrene, methoxystyrene and styrene, and N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, Ni-propylmaleimide, N-butylmaleimide, Ni-butylmaleimide , Nt-butylmaleimide, N-laurylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide, and other N-
- the weight average molecular weight of the acrylic resin may be 150,000 to 1.8 million, 400,000 to 1.5 million, or 500,000 to 1.4 million.
- the weight average molecular weight of the acrylic resin is 150,000 or more, the viscosity of the liquid composition is high and the liquid composition can exhibit thixotropy.
- the weight average molecular weight of the acrylic resin is 1.8 million or less, the solubility in a solvent is improved, and the concentration of solid content in the liquid composition is easily increased.
- concentration of the solid content of the liquid composition is high, it is less necessary to consider the control of the film thickness of the coated liquid composition and the reduction of the film pressure due to drying shrinkage.
- the glass transition temperature (Tg) of the acrylic resin may be ⁇ 50 to 100 ° C., ⁇ 45 to 20 ° C., or ⁇ 40 ° C. to 5 ° C.
- Tg of the acrylic resin composed of n kinds of monomers can be calculated by the following calculation formula (FOX formula).
- Tg (° C.) ⁇ 1 / (W 1 / Tg 1 + W 2 / Tg 2 +... + W i / Tg i +... + W n / Tg n ) ⁇ -273
- Tg i (K) shows a glass transition temperature of the homopolymer of each monomer
- W i represents the weight fraction of each monomer
- W 1 + W 2 + ... + W i + ... W n 1.
- thermoplastic resin for example, acrylic resin
- the curable resin for example, epoxy resin
- the curing agent for example, phenol resin
- the thermoplastic resin content is 40 to 90% by weight, 50 to 85% by weight. %, Or 60 to 80% by weight.
- the total of the glycidyl group of the acrylic resin and the epoxy group of the epoxy resin and the amount of the hydroxyl group of the phenol resin may be substantially equivalent.
- the liquid composition 5 can be prepared, for example, by a method in which each component constituting the curable resin composition and, if necessary, a solvent are mixed and stirred.
- the liquid composition 5 may be prepared using a slurry obtained by dispersing the inorganic filler in an organic solvent containing a surface treating agent in advance.
- the liquid composition can also be obtained by preparing in advance a mixture of components of a curable resin composition containing a curable resin, and mixing this mixture with an inorganic filler slurry.
- the solvent used for dissolving or dispersing the curable resin composition and the inorganic filler is selected from ketone solvents such as methyl ethyl ketone and cyclohexanone. From the viewpoint of printability, cyclohexanone can be selected.
- Production Examples 2-7 A liquid composition was obtained in the same manner as in Production Example 1 except that the materials shown in Tables 1 and 2 were used in the mixing ratios shown in the table.
- the acrylic resin compounding amount, the epoxy resin compounding amount, and the phenol resin compounding amount shown in Tables 1 and 2 are ratios based on the total amount of the acrylic resin, the epoxy resin, and the phenol resin.
- the weight average molecular weight of the acrylic resin was converted from a calibration curve using standard polystyrene by gel permeation chromatography (GPC).
- GPC gel permeation chromatography
- Silica particles F05-12 crushed silica, trade name manufactured by Fukushima Ceramics Co., Ltd.
- SO-25R spherical silica, trade name manufactured by Admatechs Co., Ltd. 5.
- Surface treatment agent (silane coupling agent) KBM573 N-phenyl-3-aminopropyltrimethoxysilane, trade name manufactured by Shin-Etsu Silicon Co., Ltd.
- the liquid composition was applied to a release-treated PET (polyethylene terephthalate) film using a bar coater so that the thickness after drying was 125 ⁇ m.
- the applied liquid composition was dried by heating at 130 ° C. for 10 minutes, and then cured by heating at 185 ° C. for 30 minutes.
- the release-treated PET film After removing the release-treated PET film, the cured product was punched out to a width of 10 mm and a length of 100 mm to obtain a test piece.
- This test piece was subjected to a tensile test using an EZ tester (Autograph EZ-S manufactured by Shimadzu Corporation) at a tensile speed of 50 mm / min to obtain a stress-displacement curve.
- Initial tensile elastic modulus (Pa) maximum value of slope of tangent line of stress-displacement curve (N / m) ⁇ [displacement (m) / cross-sectional area of cured product (m 2 )]
- Example 1 A copper foil of a polyimide substrate (thickness 25 ⁇ m) / copper foil (thickness 18 ⁇ m) laminate (Espanex, trade name, manufactured by Nippon Steel Chemical Co., Ltd.) was processed by photolithography to form a wiring terminal pattern. .
- the liquid composition of Production Example 1 was printed on the surface of the polyimide substrate opposite to the wiring terminals using a metal mask.
- the printed liquid composition is dried by heating at 130 ° C. for 10 minutes, and further cured by heating at 185 ° C. for 60 minutes to form a resin layer having a length of 30 mm from the end of the polyimide substrate and a thickness of 75 ⁇ m.
- a connector test piece (width 10 mm, length 100 mm) having a resin layer was obtained.
- the edge part of the resin layer which has a substantially rectangular main surface had the surface which forms the convex curve which curves toward the polyimide base material from the opposing surface which opposes a polyimide base material.
- Examples 2-12 A connector having a resin layer in the same manner as in Example 1 except that the liquid composition of each production example was used and the thickness of the polyimide base material or the thickness of the resin layer was changed as shown in Tables 3 and 4.
- a test piece was prepared. In any of the test pieces, the end portion of the resin layer had a surface forming a convex curved surface that curves toward the polyimide base material from the facing surface facing the polyimide base material.
- Comparative Example 1 Similar to the example, a wiring terminal pattern was formed on a polyimide substrate (thickness 50 ⁇ m).
- a polyimide film (UPILEX 75S, Ube Industries, Ltd. product name) with a thickness of 75 ⁇ m via a 30 ⁇ m thickness adhesive film (Hybon 10-850, product name, manufactured by Hitachi Chemical Co., Ltd.) on the surface opposite to the wiring terminal of the polyimide substrate.
- the end of the polyimide film affixed to the polyimide substrate has a facing surface facing the polyimide substrate and a side surface along the perpendicular of the polyimide substrate, and the facing surface and the side surface intersect at a right angle. It was.
- FIG. 8 is a schematic explanatory view showing a method of a durability test of the connector.
- test piece 10 After inserting about 10 mm of the test piece 10 into the gap in the direction A parallel to the aluminum plate, the operation of pulling out was repeated up to 30 times. The abnormality of the test piece 10 was visually observed, and the number of times until an abnormality such as peeling, cracking, or bending occurred was recorded.
- the liquid composition was applied to a polyimide film (Upilex 50S, Ube Industries, Ltd. product name) using a bar coater so that the thickness after drying was 125 ⁇ m.
- the applied liquid composition was dried by heating at 130 ° C. for 10 minutes and then cured by heating at 185 ° C. for 30 minutes to obtain a sample for adhesion evaluation.
- 10 grids of 2 mm width were cut with a cutter knife, and 10 grids with a width of 2 mm were made so as to intersect at right angles.
- Cellotape registered trademark
- FIG. 9 is a photomicrograph of the cross section of the connector produced in Example 1. Microscopic observation also confirmed that the end of the resin layer 3 has a surface that forms a convex curved surface that curves toward the polyimide substrate 2 from the facing surface that faces the polyimide substrate.
- FIG. 10 is a scanning micrograph (10,000 magnifications) of the resin layer of the connector produced in Example 1. It was confirmed that spherical silica particles were contained in the resin layer.
- SYMBOLS 1 Wiring terminal, 2 ... Flexible base material, 3 ... Resin layer, 3a ... End part of resin layer 3, 4 ... Metal mask, 4a ... Opening part, 5 ... Liquid composition, 6 ... Opposite surface, 7 ... Surface forming convex curved surface, 10 ... connector, 20 ... digital micrometer, 21 ... spindle, 22 ... anvil, 31, 32 ... aluminum plate, 40 ... flexible substrate, 41 ... cover film, 42 ... non-wiring metal layer, 51 ... Circuit, 52 ... Flexible substrate for circuit, 100 ... Flexible wiring board.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Tg(℃)={1/(W1/Tg1+W2/Tg2+…+Wi/Tgi+…+Wn/Tgn)}-273
上記FOX式において、Tgi(K)は、各モノマーのホモポリマーのガラス転移温度を示し、Wiは、各モノマーの質量分率を示し、W1+W2+…+Wi+…Wn=1である。 The glass transition temperature (Tg) of the acrylic resin may be −50 to 100 ° C., −45 to 20 ° C., or −40 ° C. to 5 ° C. Tg of the acrylic resin composed of n kinds of monomers can be calculated by the following calculation formula (FOX formula).
Tg (° C.) = {1 / (W 1 / Tg 1 + W 2 / Tg 2 +... + W i / Tg i +... + W n / Tg n )}-273
In the FOX equation, Tg i (K) shows a glass transition temperature of the homopolymer of each monomer, W i represents the weight fraction of each monomer, W 1 + W 2 + ... + W i + ... W n = 1.
Tg={1/(0.05/319+0.05/498+0.85/251+0.05/219)}-273=-14.7℃ For example, the glass transition temperature (Tg) of an acrylic resin obtained by copolymerizing 5% by mass of glycidyl methacrylate, 5% by mass of acrylonitrile, 85% by mass of ethyl acrylate, and 5% by mass of butyl acrylate is as follows: Is calculated as follows.
Tg = {1 / (0.05 / 319 + 0.05 / 498 + 0.85 / 251 + 0.05 / 219)}-273 = −14.7 ° C.
シクロヘキサノン129gにN-フェニル-3-アミノプロピルトリメトキシシラン(KBM573、信越シリコ-ン株式会社製商品名)3.0gを溶解したのち、球状シリカ粒子としてアドマファインSO-25R(アドマテック株式会社製商品名)300gを撹拌しながら加え、全量を加えた後さらに室温で1時間撹拌した。エポキシ樹脂としてNC-3000H(日本化薬株式会社製商品名)のシクロヘキサノン溶液(固形分50質量%)27.6g、フェノール樹脂としてLA-3018(大日本インキ株式会社製商品名)のプロピレングリコールモノメチルエーテル溶液(固形分60質量%)18.7g、2-エチル-4-メチルイミダゾール(2E4MZ、四国化成株式会社製商品名)0.42gを加えて、さらに30分撹拌したのち、アクリル樹脂としてグリシジルメタクリレート、アクリロニトリル、エチルアクリレート及びブチルアクリレート共重合体(重量平均分子量61万、エポキシ当量2869)のシクロヘキサノン溶液(固形分24.9質量%)301gを加えてボールミルで12時間撹拌混合し、液状組成物を得た。 Production Example 1
After dissolving 3.0 g of N-phenyl-3-aminopropyltrimethoxysilane (KBM573, trade name manufactured by Shin-Etsu Silicon Co., Ltd.) in 129 g of cyclohexanone, Admafine SO-25R (product of Admatech Co., Ltd.) is used as spherical silica particles. Name) 300 g was added with stirring, and after adding the entire amount, the mixture was further stirred at room temperature for 1 hour. 27.6 g of cyclohexanone solution (solid content 50 mass%) of NC-3000H (trade name, manufactured by Nippon Kayaku Co., Ltd.) as an epoxy resin, and propylene glycol monomethyl of LA-3018 (trade name, manufactured by Dainippon Ink Co., Ltd.) as a phenol resin After adding 18.7 g of ether solution (solid content 60% by mass) and 0.42 g of 2-ethyl-4-methylimidazole (2E4MZ, trade name, manufactured by Shikoku Kasei Co., Ltd.), the mixture was further stirred for 30 minutes, and then glycidyl as an acrylic resin. Add 301 g of a cyclohexanone solution (solid content 24.9% by mass) of a copolymer of methacrylate, acrylonitrile, ethyl acrylate and butyl acrylate (weight average molecular weight 610,000, epoxy equivalent 2869) and stir and mix in a ball mill for 12 hours to obtain a liquid composition Got.
表1及び2に示す各材料を、表に示される配合比で用いたこと以外は製造例1と同様にして、液状組成物を得た。表1及び2に示すアクリル樹脂配合量、エポキシ樹脂配合量及びフェノール樹脂配合量は、アクリル樹脂、エポキシ樹脂及びフェノール樹脂の合計量を基準とする比率である。 Production Examples 2-7
A liquid composition was obtained in the same manner as in Production Example 1 except that the materials shown in Tables 1 and 2 were used in the mixing ratios shown in the table. The acrylic resin compounding amount, the epoxy resin compounding amount, and the phenol resin compounding amount shown in Tables 1 and 2 are ratios based on the total amount of the acrylic resin, the epoxy resin, and the phenol resin.
装置:(ポンプ:L-2130型[株式会社日立ハイテクノロジーズ製])、
(検出器:L-2490型RI[株式会社日立ハイテクノロジーズ製])、
(カラムオーブン:L-2350[株式会社日立ハイテクノロジーズ製])
カラム:Gelpack GL-A100M(日立化成工業株式会社製商品名)
カラムサイズ:10.7mmI.D×300mm
溶離液:テトラヒドロフラン
試料濃度:10mg/2mL
注入量:200μL
流量:2.05mL/分
測定温度:25℃ The weight average molecular weight of the acrylic resin was converted from a calibration curve using standard polystyrene by gel permeation chromatography (GPC). A calibration curve was prepared by approximating with a cubic equation using a standard polystyrene 5-sample set (PStQuick MP-H, PStQuick B [trade name, manufactured by Tosoh Corporation]). The GPC conditions are shown below.
Equipment: (Pump: L-2130 type [manufactured by Hitachi High-Technologies Corporation]),
(Detector: L-2490 type RI [manufactured by Hitachi High-Technologies Corporation]),
(Column oven: L-2350 [manufactured by Hitachi High-Technologies Corporation])
Column: Gelpack GL-A100M (trade name, manufactured by Hitachi Chemical Co., Ltd.)
Column size: 10.7 mmI. D x 300mm
Eluent: Tetrahydrofuran Sample concentration: 10 mg / 2 mL
Injection volume: 200 μL
Flow rate: 2.05 mL / min Measurement temperature: 25 ° C
1.アクリル樹脂
・GMA/AN/EA/BA:グリシジルメタクリレート、アクリロニトリル、エチルアクリレート及びブチルアクリレートの共重合体
2.エポキシ樹脂
・NC-3000H:ビフェニルアラルキル型エポキシ樹脂(日本化薬株式会社製商品名、エポキシ当量290)
3.フェノール樹脂
・LA-3018:アミノトリアジンノボラック型フェノール樹脂(大日本インキ株式会社製商品名、水酸基当量151、窒素含有量18%)
4.シリカ粒子
・F05-12:破砕シリカ、福島窯業株式会社製商品名
・SO-25R:球状シリカ、アドマテックス株式会社製商品名
5.表面処理剤(シランカップリング剤)
・KBM573:N-フェニル-3-アミノプロピルトリメトキシシラン、信越シリコ-ン株式会社製商品名 Details of each material shown in Table 1 and Table 2 are as follows.
1. 1. Acrylic resin / GMA / AN / EA / BA: copolymer of glycidyl methacrylate, acrylonitrile, ethyl acrylate and butyl acrylate Epoxy resin / NC-3000H: Biphenyl aralkyl type epoxy resin (trade name, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 290)
3. Phenolic resin / LA-3018: Aminotriazine novolac type phenolic resin (Dainippon Ink Co., Ltd., trade name, hydroxyl group equivalent 151, nitrogen content 18%)
4). Silica particles F05-12: crushed silica, trade name manufactured by Fukushima Ceramics Co., Ltd. SO-25R: spherical silica, trade name manufactured by Admatechs Co., Ltd. 5. Surface treatment agent (silane coupling agent)
KBM573: N-phenyl-3-aminopropyltrimethoxysilane, trade name manufactured by Shin-Etsu Silicon Co., Ltd.
離型処理PET(ポリエチレンテレフタレート)フィルムに、乾燥後の厚みが125μmになるようにバーコーターを用いて液状組成物を塗布した。塗布された液状組成物を130℃で10分間の加熱により乾燥した後、185℃で30分間の加熱により硬化させた。離型処理PETフィルムをはがしてから、硬化物を幅10mm、長さ100mmに打ち抜いて、試験片を得た。この試験片をEZテスター(株式会社島津製作所製オートグラフEZ-S)を用いて引張り速度50mm/分で長手方向に引っ張る引張試験を行い、応力-変位曲線を得た。応力負荷を開始してから立ち上がり初期における、応力-変位曲線の接線の傾きの最大値を求め、その値から下記式に従って初期引張り弾性率を求めた。
初期引張り弾性率(Pa)=応力-変位曲線の接線の傾きの最大値(N/m)×[変位(m)/硬化物の断面積(m2)] (Mechanical properties of the resin layer)
The liquid composition was applied to a release-treated PET (polyethylene terephthalate) film using a bar coater so that the thickness after drying was 125 μm. The applied liquid composition was dried by heating at 130 ° C. for 10 minutes, and then cured by heating at 185 ° C. for 30 minutes. After removing the release-treated PET film, the cured product was punched out to a width of 10 mm and a length of 100 mm to obtain a test piece. This test piece was subjected to a tensile test using an EZ tester (Autograph EZ-S manufactured by Shimadzu Corporation) at a tensile speed of 50 mm / min to obtain a stress-displacement curve. The maximum value of the tangential slope of the stress-displacement curve at the initial rise after the stress load was started was determined, and the initial tensile elastic modulus was determined from the value according to the following formula.
Initial tensile elastic modulus (Pa) = maximum value of slope of tangent line of stress-displacement curve (N / m) × [displacement (m) / cross-sectional area of cured product (m 2 )]
ポリイミド基材(厚み25μm)/銅箔(厚み18μm)の積層体(エスパネックス、新日鐵化学株式会社製商品名)の銅箔を、フォトリソグラフィーにより加工して、配線端子のパターンを形成した。ポリイミド基材の配線端子とは反対側の面に、メタルマスクを用いて製造例1の液状組成物を印刷した。印刷された液状組成物を130℃で10分の加熱により乾燥した後、さらに185℃で60分の加熱により硬化して、ポリイミド基材の端部からの長さ30mm、厚み75μmの樹脂層を形成させて、樹脂層を有するコネクタの試験片(幅10mm、長さ100mm)を得た。略矩形の主面を有する樹脂層の端部は、ポリイミド基材と対向する対向面からポリイミド基材に向けて湾曲する凸曲面を形成する表面を有していた。 Example 1
A copper foil of a polyimide substrate (thickness 25 μm) / copper foil (thickness 18 μm) laminate (Espanex, trade name, manufactured by Nippon Steel Chemical Co., Ltd.) was processed by photolithography to form a wiring terminal pattern. . The liquid composition of Production Example 1 was printed on the surface of the polyimide substrate opposite to the wiring terminals using a metal mask. The printed liquid composition is dried by heating at 130 ° C. for 10 minutes, and further cured by heating at 185 ° C. for 60 minutes to form a resin layer having a length of 30 mm from the end of the polyimide substrate and a thickness of 75 μm. Thus, a connector test piece (
各製造例の液状組成物を用い、ポリイミド基材の厚み、又は樹脂層の厚みを表3及び表4に示すように変更したこと以外は、実施例1と同様にして、樹脂層を有するコネクタの試験片を作製した。いずれの試験片においても、樹脂層の端部が、ポリイミド基材と対向する対向面からポリイミド基材に向けて湾曲する凸曲面を形成する表面を有していた。 Examples 2-12
A connector having a resin layer in the same manner as in Example 1 except that the liquid composition of each production example was used and the thickness of the polyimide base material or the thickness of the resin layer was changed as shown in Tables 3 and 4. A test piece was prepared. In any of the test pieces, the end portion of the resin layer had a surface forming a convex curved surface that curves toward the polyimide base material from the facing surface facing the polyimide base material.
実施例と同様に、ポリイミド基材(厚み50μm)上に配線端子のパターンを形成した。ポリイミド基材の配線端子とは反対側の面に厚み30μmの接着フィルム(ハイボン10-850、日立化成株式会社製商品名)を介して厚み75μmのポリイミドフィルム(ユーピレックス75S、宇部興産株式会社製品名)を貼り付け、幅10mm、長さ100mmの短冊状に切り出し、比較用のコネクタの試験片を得た。ポリイミド基材に貼り付けられたポリイミドフィルムの端部は、ポリイミド基材と対向する対向面と、ポリイミド基材の垂線に沿う側面とを有しており、対向面と側面とが直角に交わっていた。 Comparative Example 1
Similar to the example, a wiring terminal pattern was formed on a polyimide substrate (thickness 50 μm). A polyimide film (UPILEX 75S, Ube Industries, Ltd. product name) with a thickness of 75 μm via a 30 μm thickness adhesive film (Hybon 10-850, product name, manufactured by Hitachi Chemical Co., Ltd.) on the surface opposite to the wiring terminal of the polyimide substrate. ) Was cut out into a strip shape having a width of 10 mm and a length of 100 mm to obtain a test piece of a connector for comparison. The end of the polyimide film affixed to the polyimide substrate has a facing surface facing the polyimide substrate and a side surface along the perpendicular of the polyimide substrate, and the facing surface and the side surface intersect at a right angle. It was.
(折り曲げ性)
幅10mmの試験片の端部を天秤に押し付けることにより、端部から490mN(50gf)の荷重を加えた。荷重が加えられたときに、試験片が屈曲しなかった場合を「A」、試験片が屈曲したり、樹脂層が破断した場合を「C」と判定した。 (Evaluation)
(Bendability)
A load of 490 mN (50 gf) was applied from the end by pressing the end of a 10 mm wide test piece against the balance. When a load was applied, the case where the test piece did not bend was determined as “A”, and the case where the test piece was bent or the resin layer was broken was determined as “C”.
コネクタの試験片を2枚の金網の間に挟み、1.2m/分の速度で移動させながら、基板表面温度の最高温度が260℃で、その温度が10秒間維持される加熱プロファイルのコンベア型リフロー試験により、試験片を3回処理した。処理後、外観の目視によりポリイミド基材/樹脂層間のふくれ及びはがれの有無を確認した。ふくれ及びはがれが発生しなかった場合を「A」、ふくれ及び/又ははがれが発生した場合を「C」と判定した。 (Reflow resistance)
A conveyor type with a heating profile in which the maximum temperature of the substrate surface is 260 ° C. and the temperature is maintained for 10 seconds while the test piece of the connector is sandwiched between two wire meshes and moved at a speed of 1.2 m / min. The test piece was processed three times by the reflow test. After the treatment, the presence or absence of blistering and peeling between the polyimide base material / resin layer was confirmed by visual inspection. The case where no blistering and peeling occurred was determined as “A”, and the case where blistering and / or peeling occurred was determined as “C”.
図8は、コネクタの耐久性試験の方法を示す概略説明図である。デジタルマイクロメータ20(株式会社ミツトヨ製MDC-25SB)の測定部分であるスピンドル21、アンビル22それぞれに接着剤で固定された厚さ1mmの鏡面仕上げアルミニウム板31,32を、抜き差し耐久性評価用の治具として用いた。対向する2枚のアルミニウム板31,32の隙間を、デジタルマイクロメータ20により、試験片の厚みと同等、-15μm、又は+15μmに設定して、試験を行った。アルミニウム板に対して平行な向きAで隙間に試験片10を約10mm挿入した後、引き抜く操作を最大30回繰り返した。試験片10の異常を目視により観察し、剥がれ、割れ、折れなどの異常が発生するまでの回数を記録した。 (Durability test of connectors)
FIG. 8 is a schematic explanatory view showing a method of a durability test of the connector. The mirror finished
ポリイミドフィルム(ユーピレックス50S、宇部興産株式会社製品名)に、乾燥後の厚みが125μmになるように、液状組成物をバーコーターを用いて塗布した。塗布した液状組成物を130℃で10分間の加熱により乾燥した後、185℃で30分間の加熱により硬化させて、接着性評価用の試料を得た。試料の樹脂層に、カッターナイフにより2mm幅に10本、これと直角に交差するように2mm幅で10本の碁盤目の切り込みを入れた。そこにセロテープ(登録商標)を張った後、これを引き剥がし、樹脂層の剥がれの有無を確認した。剥がれが発生しなかった場合を「A」、剥がれが発生した場合を「C」と判定した。 (Adhesiveness between polyimide substrate and resin layer)
The liquid composition was applied to a polyimide film (Upilex 50S, Ube Industries, Ltd. product name) using a bar coater so that the thickness after drying was 125 μm. The applied liquid composition was dried by heating at 130 ° C. for 10 minutes and then cured by heating at 185 ° C. for 30 minutes to obtain a sample for adhesion evaluation. In the resin layer of the sample, 10 grids of 2 mm width were cut with a cutter knife, and 10 grids with a width of 2 mm were made so as to intersect at right angles. Cellotape (registered trademark) was stretched there, and then peeled off to confirm whether the resin layer was peeled off. The case where peeling did not occur was determined as “A”, and the case where peeling occurred was determined as “C”.
評価結果を表3及び表4に示す。実施例では、いずれポリイミド基材と樹脂層が良好であり、耐リフロー性も問題なかった。コネクタの折り曲げ性に関して、いずれの実施例でも490mN(50gf)の荷重に対して試験片が屈曲することはなかった。
コネクタの耐久性試験に関して、実施例では試験片の滑らかな抜き差しが可能であり、30回の抜き差しを行っても異常の発生は観察されなかった。比較例の場合、試験片の抜き差しの抵抗が強く、隙間が試験片と同等(173μm)又は-15μm(158μm)のときに、30回未満の抜き差しの時点で異常の発生が観察された。 (result)
The evaluation results are shown in Tables 3 and 4. In Examples, the polyimide base material and the resin layer were good, and there was no problem with reflow resistance. Regarding the bendability of the connector, in any of the examples, the test piece did not bend against a load of 490 mN (50 gf).
Regarding the durability test of the connector, in the example, the test piece could be smoothly inserted and removed, and no abnormality was observed even after 30 insertions and removals. In the case of the comparative example, when the resistance of insertion / extraction of the test piece was strong and the gap was equal to that of the test piece (173 μm) or −15 μm (158 μm), the occurrence of abnormality was observed at the time of insertion / removal less than 30 times.
Claims (9)
- 相手側のコネクタに差し込まれて配線を接続するために用いられる差し込み側のコネクタであって、
可撓性基材と、
前記可撓性基材の一方の面側に配置された配線端子と、
前記可撓性基材の前記配線端子とは反対の面側で前記可撓性基材の端部上に配置され、前記可撓性基材と対向する対向面を有する、樹脂を含む樹脂層と、
を備え、
前記樹脂層の当該コネクタの先端側の端部が、前記対向面から前記可撓性基材に向かって湾曲する凸曲面を形成している表面を有する、コネクタ。 A connector on the plug-in side that is used to connect the wiring by plugging into the connector on the mating side,
A flexible substrate;
A wiring terminal disposed on one surface side of the flexible substrate;
A resin layer containing a resin, which is disposed on an end portion of the flexible substrate on a surface opposite to the wiring terminal of the flexible substrate, and has a facing surface facing the flexible substrate. When,
With
The connector which has the surface in which the edge part of the front end side of the said connector of the said resin layer forms the convex curve which curves toward the said flexible base material from the said opposing surface. - 前記樹脂層が、無機フィラーを更に含む、請求項1に記載のコネクタ。 The connector according to claim 1, wherein the resin layer further contains an inorganic filler.
- 前記無機フィラーが、シリカ粒子である、請求項2に記載のコネクタ。 The connector according to claim 2, wherein the inorganic filler is silica particles.
- 前記樹脂層における前記無機フィラーの含有量が、前記樹脂層の体積に対して30~70体積%である、請求項2又は3に記載のコネクタ。 4. The connector according to claim 2, wherein the content of the inorganic filler in the resin layer is 30 to 70% by volume with respect to the volume of the resin layer.
- 前記可撓性基材が、ポリエステル基材又はポリイミド基材である、請求項1~4のいずれか一項に記載のコネクタ。 The connector according to any one of claims 1 to 4, wherein the flexible substrate is a polyester substrate or a polyimide substrate.
- 前記可撓性基材の厚みが、75μm以下である、請求項1~5のいずれか一項に記載のコネクタ。 The connector according to any one of claims 1 to 5, wherein the flexible substrate has a thickness of 75 µm or less.
- 前記樹脂層の25℃における初期引張り弾性率が、0.3~3.0GPaである、請求項1~6のいずれか一項に記載のコネクタ。 The connector according to any one of claims 1 to 6, wherein an initial tensile elastic modulus at 25 ° C of the resin layer is 0.3 to 3.0 GPa.
- 前記樹脂層の厚みが、50~500μmである、請求項1~7のいずれか一項に記載のコネクタ。 The connector according to any one of claims 1 to 7, wherein the resin layer has a thickness of 50 to 500 µm.
- 請求項1~8のいずれか一項に記載のコネクタと、
回路用可撓性基材と、
前記回路用可撓性基材上に設けられ、前記コネクタの配線端子に接続された回路と、
を備え、
前記コネクタの可撓性基材と前記回路用可撓性基材とが同一の1枚の基材である、又は、前記コネクタの可撓性基材と別の前記回路用可撓性基材とが連結されている、フレキシブル配線板。 A connector according to any one of claims 1 to 8,
A flexible substrate for circuits;
A circuit provided on the flexible substrate for the circuit and connected to a wiring terminal of the connector;
With
The flexible substrate for the connector and the flexible substrate for circuit are the same substrate, or the flexible substrate for circuit different from the flexible substrate for the connector And a flexible wiring board.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020157000322A KR102190760B1 (en) | 2012-08-29 | 2013-05-22 | Connector and flexible wiring board |
CN201380042026.6A CN104521069B (en) | 2012-08-29 | 2013-05-22 | connector and flexible wiring board |
JP2014532836A JP6444734B2 (en) | 2012-08-29 | 2013-05-22 | Connectors and flexible wiring boards |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2012/071865 | 2012-08-29 | ||
PCT/JP2012/071865 WO2014033859A1 (en) | 2012-08-29 | 2012-08-29 | Connector and flexible wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014034197A1 true WO2014034197A1 (en) | 2014-03-06 |
Family
ID=50182709
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/071865 WO2014033859A1 (en) | 2012-08-29 | 2012-08-29 | Connector and flexible wiring board |
PCT/JP2013/064266 WO2014034197A1 (en) | 2012-08-29 | 2013-05-22 | Connector and flexible wiring board |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/071865 WO2014033859A1 (en) | 2012-08-29 | 2012-08-29 | Connector and flexible wiring board |
Country Status (4)
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JP (2) | JP6444734B2 (en) |
KR (1) | KR102190760B1 (en) |
CN (1) | CN104521069B (en) |
WO (2) | WO2014033859A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016004818A (en) * | 2014-06-13 | 2016-01-12 | 日立化成株式会社 | Resin composition for printing and printed wiring board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109587932A (en) * | 2018-12-06 | 2019-04-05 | 李建波 | A kind of novel reinforcement steel disc and its processing technology |
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- 2013-05-22 KR KR1020157000322A patent/KR102190760B1/en active IP Right Grant
- 2013-05-22 CN CN201380042026.6A patent/CN104521069B/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
KR20150048104A (en) | 2015-05-06 |
JP6444734B2 (en) | 2018-12-26 |
CN104521069A (en) | 2015-04-15 |
CN104521069B (en) | 2017-02-22 |
JPWO2014034197A1 (en) | 2016-08-08 |
KR102190760B1 (en) | 2020-12-14 |
JP2017201708A (en) | 2017-11-09 |
JP6481716B2 (en) | 2019-03-13 |
WO2014033859A1 (en) | 2014-03-06 |
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