WO2014033824A1 - Solder printing machine - Google Patents

Solder printing machine Download PDF

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Publication number
WO2014033824A1
WO2014033824A1 PCT/JP2012/071635 JP2012071635W WO2014033824A1 WO 2014033824 A1 WO2014033824 A1 WO 2014033824A1 JP 2012071635 W JP2012071635 W JP 2012071635W WO 2014033824 A1 WO2014033824 A1 WO 2014033824A1
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WO
WIPO (PCT)
Prior art keywords
solder
supplied
cream
door
printing
Prior art date
Application number
PCT/JP2012/071635
Other languages
French (fr)
Japanese (ja)
Inventor
加藤 光昭
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2012/071635 priority Critical patent/WO2014033824A1/en
Priority to JP2014532605A priority patent/JP5938102B2/en
Publication of WO2014033824A1 publication Critical patent/WO2014033824A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder

Definitions

  • the present invention relates to a solder printer that prints cream solder on a substrate or the like.
  • the electrical circuit is roughly manufactured by mounting electrical components on a substrate such as a printed wiring board. At that time, in order to fix the electrical component to the substrate in a state where electrical connection is ensured, cream solder (solder paste) is printed on the substrate in a pattern corresponding to the electrical circuit prior to mounting.
  • a solder printer is used, for example, in the printing. Printing with a solder printer is generally performed by bringing a substrate into close contact with the lower surface of a screen (mask) in which small openings corresponding to the solder printing pattern are formed, and then applying squeegee to the screen while cream solder is supplied on the screen. Is done by moving along. Examples of solder printers that perform such printing include those described in the following patent documents, and the solder printer can detect the amount of solder supplied on the screen. Yes.
  • the present inventor has obtained knowledge that, in a solder printer equipped with a solder amount detector, the utility of the solder printer can be improved by using the amount of solder detected by the solder amount detector. .
  • the present invention is based on the knowledge, and an object thereof is to provide a highly practical solder printer.
  • the solder printing machine of the present invention determines whether or not cream solder has been additionally supplied based on the result of the solder amount detector provided therein, and has determined that cream solder has been additionally supplied.
  • the appropriateness of the additionally supplied cream solder based on the information about the type of solder to be supplied and the information obtained by itself, that is, the information for recognizing the type of cream solder actually supplied Configured to certify.
  • the solder printer of the present invention for example, even if the solder printer is such that the supply of cream solder is performed manually by the operator, the printer itself has actually supplied additional cream solder. It is also possible to recognize whether or not the additionally supplied cream solder is appropriate. Since such recognition is possible, the solder printer of the present invention is highly practical.
  • solder printer of this invention is not limited to the following Example, It can be set as the thing of the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
  • the solder printer of the embodiment whose appearance is shown in FIG. 1 (hereinafter sometimes simply referred to as “printer”) is cream solder (hereinafter simply referred to as “solder”) in a predetermined pattern on a substrate such as a printed wiring board. For example, it is arranged on an electric circuit production line.
  • FIG. 2 shows a state in which the exterior panel constituting the housing of the printing press is removed, that is, the internal structure of the printing press.
  • the printing machine has been transported by the frame 10 serving as a housing, the conveyor-type substrate transport device 12 fixedly disposed on the base portion of the frame 10, and the substrate transport device 12.
  • a substrate lifting device 14 that lifts and lowers the substrate at a set position, a screen frame 18 that is held on the frame 10 so that the position of the substrate can be adjusted, a squeegee device 22 having a pair of squeegees 20, and a squeegee device 20
  • the squeegee moving device 24 is configured to move the squeegee 20 along the screen 16 by moving the squeegee 20 to the position.
  • the squeegee device 22 is attached to a movable beam 26 of the squeegee moving device 24.
  • the squeegee moving device 24 moves the squeegee device 22 back and forth by moving the movable beam 26 back and forth.
  • the squeegee device 22 includes a squeegee lifting device 28 that lifts and lowers each of the pair of squeegees 20 individually.
  • the printing press also includes a cleaning device 30 that has a nonwoven fabric or the like and cleans the lower surface of the screen 16.
  • the substrate is carried in by the substrate transport device 12 so as to pass through an opening (see FIG. 1) provided in the exterior panel, and is stopped at the set position. At this position, the substrate is raised by the substrate lifting device 14 and brought into close contact with the lower surface of the screen 16.
  • one of the pair of squeegees 20 is lowered by the squeegee lifting device 28 until the tip is in contact with the upper surface of the screen 16, and then the squeegee 20 lowered by the squeegee moving device 22 is moved back and forth. Is moved in one direction. That is, a predetermined printing operation is performed.
  • the squeegee 20 is moved rearward.
  • the squeegee 20 is moved forward.
  • the solder is supplied on the upper surface of the screen 16, and a plurality of openings are formed in the screen 16 in a pattern set according to the substrate.
  • the solder passes through the openings and is printed on the substrate.
  • the board on which the solder is printed is lowered by the board lifting / lowering device 14 and carried out of the printing machine by the board conveying device 12.
  • a control device 32 mainly composed of a computer.
  • the printing press has an operation panel 34 having a display (see FIG. 1), and the operation panel 34 is connected to the control device 32.
  • the printing machine includes a barcode reader 36 as a device for inputting information related to solder described later, and the barcode reader 36 is also connected to the control device 32.
  • FIG. 3A shows a state in which the movement of the squeegee 20 is stopped in the printing operation
  • FIG. 3B shows a state in which the squeegee 20 that has been performing the printing operation is raised.
  • the solder roll 40 has a shape shown in FIG. 3C, that is, a generally cylindrical shape.
  • the printing machine includes a solder sensor 50 disposed between a pair of squeegees 20 in order to measure the diameter of the solder roll 40, specifically, the diameter.
  • the solder sensor 50 detects an optical characteristic (for example, a color) of an object existing directly below itself, and can identify whether the object is the screen 16 or solder. Has been. As shown in FIG. 3C, by moving the solder sensor 50 back and forth at a predetermined speed by the squeegee moving device 24, the solder sensor 50 scans the screen 16 and measures the diameter of the solder roll 40. To do.
  • solder roll diameter depends on the amount of solder supplied on the screen 16 (hereinafter may be referred to as “solder amount”), Based on the solder roll diameter, it is possible to detect the amount of solder.
  • This printing machine has a function of detecting the amount of solder based on the diameter of the solder roll, and the solder sensor 50 functions as a solder amount detector.
  • the additional supply of solder is performed manually by the operator of the printing press.
  • the printing press includes a door 60 as a part of the housing, that is, a part of the exterior panel, and the additional supply of solder is performed with the door 60 opened. .
  • the additional supplied solder is taken out from the container in an appropriate amount and placed on the screen 16.
  • predetermined kneading is performed. More specifically, the adjustment of the solder, that is, the preparation of the solder roll 40 is performed by repeatedly performing the same operation as the printing operation by the pair of squeegees 20.
  • the additional solder supply work should be performed when solder printing is not performed by the printer. Therefore, in this printing press, as shown in FIG. 1, a door sensor 62 for detecting whether the door 60 is in an open state or a closed state, and for preventing the door 60 from being opened. Each of the door lock mechanisms 64 is provided, and the additional solder supply operation is performed when printing is performed. In other words, the printing is performed when the door 60 is opened. Is prevented. The door can be locked manually by the door lock release switch 66 of the operation panel 34.
  • the printing machine has a function of performing two recognition processes, that is, two confirmation processes (verify) in connection with the additional supply of solder.
  • One of the two recognition processes is a process for recognizing whether or not additional solder is actually supplied, and the other is a process for recognizing whether or not the additionally supplied solder is appropriate. is there.
  • These two recognition processes are performed by executing the additional solder supply management program shown in the flowchart of FIG.
  • the control device 32 is configured to have a functional unit as shown in FIG. That is, each functional unit shown in FIG. 5 is realized.
  • the two recognition processes will be described with reference to FIGS. 4 and 5 along the flowchart of the program.
  • step 1 (hereinafter abbreviated as “S1”, the same applies to other steps), whether there is an instruction to additionally supply solder, or a door It is determined whether or not 60 release operations have been performed.
  • the control device 32 includes a work management unit 70 that manages printing work.
  • This work management unit 70 manages the timing of additional supply of solder by grasping the number of printed boards. Yes.
  • the instruction to additionally supply the solder is issued from the work management unit 70, and the instruction is displayed on the operation panel 34, so that the operator performs the additional supply work of the solder.
  • the door 60 release operation is issued when the door lock release switch 66 of the operation panel 34 is operated. This operation is performed by the operator when additional solder is supplied regardless of the instruction from the work management unit 70.
  • the above instruction and operation can be interpreted as a command indicating that the door 60 should be allowed to open in relation to the additional supply of solder.
  • the instruction that additional solder should be supplied or the fact that there has been a door lock release operation is input to the solder detection control unit 72 that controls the detection of the amount of solder.
  • the solder detection control unit 72 considers that additional solder is supplied if there is such an instruction or operation, and in S2, prior to unlocking the door 60 by the door lock mechanism 64, at that time
  • the solder sensor 50 is measured by the solder sensor 50 as the solder roll diameter (pre-addition solder roll diameter) ⁇ B before the solder is additionally supplied. That is, the amount of solder is detected by controlling the squeegee device 22 using the above-described command to allow the door 60 to be opened as a trigger.
  • the solder detection control unit 72 After measuring the solder roll diameter ⁇ B , the solder detection control unit 72 sends an instruction to the door lock control unit 74 in S3, and the door lock control unit 74 receiving the instruction sends the door lock mechanism 64 to the door lock mechanism 64. The release is executed.
  • the door 60 is opened by the operator, and after the additional supply operation is completed, the door 60 is closed again by the operator.
  • the solder detection control unit 72 detects such an operation of the door 60 using the door sensor 62, and if it is determined in S4 that the door 60 has been changed from the open state to the closed state, Assuming that printing is resumed, an instruction to lock the door 60 is sent to the door lock control unit 74 in S5. Upon receiving this instruction, the door lock control unit 74 causes the door lock mechanism 64 to lock the door 60. Thereafter, the solder detection control unit 72, in S6, again, the roll diameter of the solder at the time, as the solder roll diameter (add after the solder roll diameter) phi A after the solder is additionally supplied to the solder sensor 50 Let me measure.
  • the solder detection control unit 72 measures the diameter of the solder roll before and after the additional supply of solder in relation to the opening and closing of the door 60 that is inevitably performed when the additional supply of solder is performed. It is configured. That is, depending on whether the door 60 is opened or closed, the solder amount is detected twice before and after the additional supply of solder. With this configuration, in the present printing machine, it is possible to reliably grasp the amount of solder before and after the operation even though the additional supply of solder is performed manually by the operator.
  • the pre-addition solder roll diameter ⁇ B and the post-addition solder roll diameter ⁇ A measured by the solder sensor 50 are compared by the solder addition determination unit 76 in S7.
  • the roll diameter difference [Delta] [phi minus roll diameter phi B solder before adding the additional post solder roll diameter phi A is, it is determined whether or not larger than the threshold value [Delta] [phi TH is greater, and the solder is additionally supplied When it is determined that the solder is small, it is determined that no additional solder is supplied. By making this determination, the printing press has a function of recognizing whether or not additional solder is actually supplied.
  • a bar code 92 is attached to the container 90 in which the solder is accommodated, and the ID of the additionally supplied solder is the bar attached to the container 90 in which the solder is accommodated. It is obtained by reading the code 92 with the barcode reader 36. That is, the barcode 92 is an identifier for the solder attached to the additionally supplied solder container 90, and the barcode reader 36 functions as an identifier reader for reading the identifier.
  • the result read by the barcode reader 36 is sent to the actual supply solder recognition information acquisition unit 78.
  • the actual supply solder recognition information acquisition unit 78 determines the actual supply solder recognition information acquisition unit 78. Information for recognizing actual supply solder, which is information for recognizing the type, is obtained.
  • solder information that is information on the solder that is appropriate for the current printing operation, that is, information on the type of solder to be supplied, is stored in the appropriate solder information storage unit 80. This information is stored by being input from the operation panel 34, or stored based on information existing in the print program for the print job.
  • the information is compared with the appropriate solder information.
  • This comparison is performed by the additional solder suitability certification unit 82.
  • the additional solder suitability determination unit 82 determines whether the solder type indicated by the actual supply solder recognition information matches the solder type indicated by the appropriate solder information, and is additionally supplied. Appropriateness of solder is certified. As a result of this certification, the printing press has a function of recognizing whether or not the additionally supplied solder is appropriate. If it is determined to be appropriate, the printing operation is allowed in S12. That is, the control device 32 accepts an operation performed on the operation panel 34 in order to resume printing.
  • the printing operation is prohibited in S13. That is, the control device 32 does not accept an operation performed on the operation panel 34 in order to resume printing.
  • the prohibition of the printing operation is performed by the operation prohibiting unit 84.
  • the work prohibition unit 84 issues a warning to the operator via the operation panel 34 that the additionally supplied solder type does not match the appropriate solder type.
  • the additional solder supply management program is repeatedly executed every time printing is resumed.
  • the printing machine of the said Example is for printing cream solder on a board
  • this invention is not specifically limited, The printing machine which prints cream solder using a screen Widely applicable to.
  • the solder amount is detected based on the solder roll diameter, but in the present invention, the specific method for detecting the solder amount is not particularly limited.
  • the printing press of the present invention may be configured to detect the amount of solder by, for example, measuring the weight of solder supplied on the screen.
  • the actual supply solder recognition information is obtained by reading the barcode attached to the container.
  • the identifier is not particularly limited.
  • the printing press of the present invention may be configured to obtain the actual supply solder recognition information based on information input by the operator to the operation panel or the like, instead of reading the identifier.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)

Abstract

A solder printing machine is configured to: determine whether a solder paste has been additionally supplied, on the basis of results from a solder-quantity detector (50) provided therein (76); and when determined that the solder paste was additionally supplied, verify the appropriateness of the additionally supplied solder paste, on the basis of information (80) about the type of solder which should be supplied, and information (78) acquired by the solder printing machine itself and used for verifying the type of solder paste actually supplied (82). Consequently, even for solder printing machines for which the operator performs the supply of solder paste manually, it is possible for the printing machine itself to verify whether a solder paste has actually been additionally supplied, and verify whether the additionally supplied solder paste is appropriate. As a result, it is possible to improve the utility of solder printing machines.

Description

はんだ印刷機Solder printing machine
 本発明は、クリームはんだを、基板等に印刷するはんだ印刷機に関する。 The present invention relates to a solder printer that prints cream solder on a substrate or the like.
 電気回路の製造は、大まかには、プリント配線板等の基板に電気部品を装着することによって行われる。その際、電気的接続を確保した状態で電気部品を基板に固定するため、装着に先立って、クリームはんだ(はんだペースト)が、基板に、電気回路に応じたパターンで印刷される。はんだ印刷機は、例えば、その印刷において用いられる。はんだ印刷機による印刷は、一般に、はんだの印刷パターンに応じた小さな開口が形成されたスクリーン(マスク)の下面に基板を密着させ、そのスクリーン上にクリームはんだが供給された状態において、スキージをスクリーンに沿って移動させることによって行われる。そのような印刷を行うはんだ印刷機には、例えば、下記特許文献に記載されたようなものが存在し、そのはんだ印刷機では、スクリーン上に供給されているはんだの量を検出可能とされている。 The electrical circuit is roughly manufactured by mounting electrical components on a substrate such as a printed wiring board. At that time, in order to fix the electrical component to the substrate in a state where electrical connection is ensured, cream solder (solder paste) is printed on the substrate in a pattern corresponding to the electrical circuit prior to mounting. A solder printer is used, for example, in the printing. Printing with a solder printer is generally performed by bringing a substrate into close contact with the lower surface of a screen (mask) in which small openings corresponding to the solder printing pattern are formed, and then applying squeegee to the screen while cream solder is supplied on the screen. Is done by moving along. Examples of solder printers that perform such printing include those described in the following patent documents, and the solder printer can detect the amount of solder supplied on the screen. Yes.
特開2008-74054号公報JP 2008-74054 A
発明の解決しようとする課題Problems to be Solved by the Invention
 スクリーン上に供給されているはんだの量を検出することは、印刷作業において有意義である。本発明者は、はんだ量検出器を備えたはんだ印刷機において、そのはんだ量検出器によって検出されたはんだ量を利用することで、はんだ印刷機の実用性を向上させ得るとの知見を得た。本発明は、その知見に基づくものであり、実用性の高いはんだ印刷機を提供することを課題とする。 Detecting the amount of solder supplied on the screen is meaningful in printing operations. The present inventor has obtained knowledge that, in a solder printer equipped with a solder amount detector, the utility of the solder printer can be improved by using the amount of solder detected by the solder amount detector. . The present invention is based on the knowledge, and an object thereof is to provide a highly practical solder printer.
 上記課題を解決するために、本発明のはんだ印刷機は、自身が備えるはんだ量検出器の結果に基づき、クリームはんだが追加供給されたか否かを判断し、クリームはんだが追加供給されたと判断した場合に、供給されるべきはんだの種別についての情報と、自身が入手した情報、つまり、実際に供給されたクリームはんだの種別を認識するための情報とに基づき、追加供給されたクリームはんだの適否を認定するように構成される。 In order to solve the above problems, the solder printing machine of the present invention determines whether or not cream solder has been additionally supplied based on the result of the solder amount detector provided therein, and has determined that cream solder has been additionally supplied. The appropriateness of the additionally supplied cream solder based on the information about the type of solder to be supplied and the information obtained by itself, that is, the information for recognizing the type of cream solder actually supplied Configured to certify.
 本発明のはんだ印刷機によれば、例えば、クリームはんだの供給がオペレータの手作業にて行われるようなはんだ印刷機であっても、印刷機自体が、実際にクリームはんだが追加供給されたか否かを認識することが可能であり、また、その追加供給されたクリームはんだが適正なものであるか否かを認識することが可能である。それらの認識が可能なことで、本発明のはんだ印刷機は、実用性の高いものとなる。 According to the solder printer of the present invention, for example, even if the solder printer is such that the supply of cream solder is performed manually by the operator, the printer itself has actually supplied additional cream solder. It is also possible to recognize whether or not the additionally supplied cream solder is appropriate. Since such recognition is possible, the solder printer of the present invention is highly practical.
実施例のはんだ印刷機の外観を示す斜視図である。It is a perspective view which shows the external appearance of the solder printer of an Example. 実施例のはんだ印刷機の内部構造を示す斜視図である。It is a perspective view which shows the internal structure of the solder printer of an Example. 実施例のはんだ印刷機において存在するはんだロールとそのはんだロールの径の測定について説明するための模式図である。It is a schematic diagram for demonstrating the measurement of the diameter of the solder roll which exists in the solder printer of an Example, and the solder roll. 実施例のはんだ印刷機の制御装置において実行されるはんだ追加供給管理プログラムを示すフローチャートである。It is a flowchart which shows the solder additional supply management program performed in the control apparatus of the solder printer of an Example. 図4のはんだ追加供給管理プログラムによって実現される制御装置の機能構成を示すブロック図である。It is a block diagram which shows the function structure of the control apparatus implement | achieved by the solder additional supply management program of FIG. クリームはんだが収容されている容器に付されたバーコードをバーコードリーダによって読み取る様子を示す図である。It is a figure which shows a mode that the barcode attached to the container in which cream solder is accommodated is read with a barcode reader.
 以下、本発明の代表的な実施形態を、実施例として、図を参照しつつ詳しく説明する。なお、本発明のはんだ印刷機は、下記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様のものとすることが可能である。 Hereinafter, typical embodiments of the present invention will be described in detail with reference to the drawings as examples. In addition, the solder printer of this invention is not limited to the following Example, It can be set as the thing of the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
≪はんだ印刷機のハード構成および印刷動作≫
 図1に外観を示す実施例のはんだ印刷機(以下、単に「印刷機」という場合ある)は、プリント配線板等の基板に、所定のパターンでクリームはんだ(以下、単に、「はんだ」と言う場合がある)を印刷するものであり、例えば、電気回路製造ラインに配置される。図2には、当該印刷機のハウジングを構成する外装パネルを外した状態、つまり、印刷機の内部構造を示す。
≪Hardware configuration and printing operation of solder printing machine≫
The solder printer of the embodiment whose appearance is shown in FIG. 1 (hereinafter sometimes simply referred to as “printer”) is cream solder (hereinafter simply referred to as “solder”) in a predetermined pattern on a substrate such as a printed wiring board. For example, it is arranged on an electric circuit production line. FIG. 2 shows a state in which the exterior panel constituting the housing of the printing press is removed, that is, the internal structure of the printing press.
 図2から解るように、印刷機は、躯体となるフレーム10と、フレーム10のベースの部分に固定して配設されたコンベア型の基板搬送装置12と、基板搬送装置12によって搬送されてきた基板を設定位置において昇降させる基板昇降装置14と、フレーム10に位置調整可能に保持されてスクリーン16が嵌められるスクリーン枠18と、1対のスキージ20を有するスキージ装置22と、スキージ装置20を前後に移動させることによってスキージ20をスクリーン16に沿って移動させるスキージ移動装置24とを含んで構成されている。スキージ装置22は、スキージ移動装置24が有する可動ビーム26に取り付けられており、スキージ移動装置24は、その可動ビーム26を前後に移動させることでスキージ装置22を前後に移動させる。スキージ装置22は、1対のスキージ20の各々を個別に昇降させるスキージ昇降装置28を有している。なお、印刷機は、詳細な説明を省略するが、不織布等を有してスクリーン16の下面を清浄するためのクリーニング装置30をも備えている。 As can be seen from FIG. 2, the printing machine has been transported by the frame 10 serving as a housing, the conveyor-type substrate transport device 12 fixedly disposed on the base portion of the frame 10, and the substrate transport device 12. A substrate lifting device 14 that lifts and lowers the substrate at a set position, a screen frame 18 that is held on the frame 10 so that the position of the substrate can be adjusted, a squeegee device 22 having a pair of squeegees 20, and a squeegee device 20 The squeegee moving device 24 is configured to move the squeegee 20 along the screen 16 by moving the squeegee 20 to the position. The squeegee device 22 is attached to a movable beam 26 of the squeegee moving device 24. The squeegee moving device 24 moves the squeegee device 22 back and forth by moving the movable beam 26 back and forth. The squeegee device 22 includes a squeegee lifting device 28 that lifts and lowers each of the pair of squeegees 20 individually. Although not described in detail, the printing press also includes a cleaning device 30 that has a nonwoven fabric or the like and cleans the lower surface of the screen 16.
 この印刷機による印刷作業について説明する。まず、基板が、基板搬送装置12によって、外装パネルに設けられた開口(図1参照)を通過するようにして搬入され、設定位置において停止させられる。この位置において、基板は、基板昇降装置14によって、上昇させられ、スクリーン16の下面に密着させられる。この状態で、スキージ昇降装置28によって、1対のスキージ20の一方が、先端がスクリーン16の上面に接するまで下降させられ、次いで、スキージ移動装置22によって、下降させられているスキージ20が、前後方向における一方向に移動させられる。つまり、所定の印刷動作が行われるのである。詳しく言えば、下降させられているスキージが20が前方側のものであるときには、後方に向かって移動させられ、後方側のものであるときには、前方に向かって移動させられる。はんだは、スクリーン16の上面上に供給されており、スクリーン16には、複数の開口が、基板に応じて設定されたパターンで形成されている。スキージ20の前方または後方への移動によって、はんだがそれらの開口を通過して基板上に印刷される。はんだが印刷された基板は、基板昇降装置14によって下降させられ、基板搬送装置12によって、当該印刷機から搬出される。 The printing work by this printing machine will be explained. First, the substrate is carried in by the substrate transport device 12 so as to pass through an opening (see FIG. 1) provided in the exterior panel, and is stopped at the set position. At this position, the substrate is raised by the substrate lifting device 14 and brought into close contact with the lower surface of the screen 16. In this state, one of the pair of squeegees 20 is lowered by the squeegee lifting device 28 until the tip is in contact with the upper surface of the screen 16, and then the squeegee 20 lowered by the squeegee moving device 22 is moved back and forth. Is moved in one direction. That is, a predetermined printing operation is performed. Specifically, when the squeegee being lowered 20 is the front side, the squeegee 20 is moved rearward. When the squeegee 20 is the rear side, the squeegee 20 is moved forward. The solder is supplied on the upper surface of the screen 16, and a plurality of openings are formed in the screen 16 in a pattern set according to the substrate. As the squeegee 20 moves forward or backward, the solder passes through the openings and is printed on the substrate. The board on which the solder is printed is lowered by the board lifting / lowering device 14 and carried out of the printing machine by the board conveying device 12.
 上記印刷作業を始めとする本印刷機に関する種々の制御は、コンピュータを主体として構成された制御装置32によって行われる。また、その制御に関する入出力端末として、本印刷機は、ディスプレイを有する操作パネル34を有しており(図1参照)、操作パネル34は、制御装置32に繋げられている。操作パネル34には、当該印刷機の種々の状態,オペレータに対する指示および警告が表示されるとともに、当該印刷機に対してオペレータが行う種々の指令が入力可能とされている。さらに、印刷機は、後述のはんだに関する情報を入力するためのデバイスとして、バーコードリーダ36を備えており、そのバーコードリーダ36も制御装置32に繋げられている。 Various controls related to the printing press including the above printing operation are performed by a control device 32 mainly composed of a computer. Further, as an input / output terminal related to the control, the printing press has an operation panel 34 having a display (see FIG. 1), and the operation panel 34 is connected to the control device 32. On the operation panel 34, various states of the printing press, instructions and warnings for the operator are displayed, and various commands issued by the operator to the printing press can be input. Further, the printing machine includes a barcode reader 36 as a device for inputting information related to solder described later, and the barcode reader 36 is also connected to the control device 32.
≪はんだ量の検出≫
 1対のスキージ20の各々による印刷動作は、交互に行われるため、図3に示すように、スクリーン16上に供給されているはんだは、1対のスキージ20の間に、ロール形状で、つまり、はんだロール40として存在する。詳しく言えば、図3(a)は、印刷動作においてスキージ20の移動を停止した状態、図3(b)は、印刷動作を行っていたスキージ20を上昇させた状態を、それぞれ示しており、スキージ20を上昇させた後には、はんだロール40は、図3(c)に示す形状、つまり、概して円柱形状となる。
≪Solder amount detection≫
Since the printing operation by each of the pair of squeegees 20 is performed alternately, as shown in FIG. 3, the solder supplied on the screen 16 is in a roll shape between the pair of squeegees 20, that is, The solder roll 40 exists. Specifically, FIG. 3A shows a state in which the movement of the squeegee 20 is stopped in the printing operation, and FIG. 3B shows a state in which the squeegee 20 that has been performing the printing operation is raised. After the squeegee 20 is raised, the solder roll 40 has a shape shown in FIG. 3C, that is, a generally cylindrical shape.
 本印刷機は、はんだロール40の径、詳しく言えば、直径を測定するために、1対のスキージ20の間に配設されたはんだセンサ50を備えている。はんだセンサ50は、自身の真直ぐ下の部分に存在する物体の光学的特性(例えば、色等)を検出するものであり、その物体がスクリーン16であるかはんだであるかを識別可能なものとされている。図3(c)に示すように、このはんだセンサ50をスキージ移動装置24によって所定の速度で前後に移動させることにより、はんだセンサ50は、スクリーン16上を走査し、はんだロール40の径を測定する。はんだロール40の径(以下、「はんだロール径」と言う場合がある)は、スクリーン16上に供給されているはんだの量(以下、「はんだ量」と言う場合がある)に依存するため、はんだロール径に基づくことにより、はんだ量を検出することが可能である。本印刷機は、はんだロール径に基づいてはんだ量を検出する機能を備えており、はんだセンサ50は、はんだ量検出器として機能するものとされている。 The printing machine includes a solder sensor 50 disposed between a pair of squeegees 20 in order to measure the diameter of the solder roll 40, specifically, the diameter. The solder sensor 50 detects an optical characteristic (for example, a color) of an object existing directly below itself, and can identify whether the object is the screen 16 or solder. Has been. As shown in FIG. 3C, by moving the solder sensor 50 back and forth at a predetermined speed by the squeegee moving device 24, the solder sensor 50 scans the screen 16 and measures the diameter of the solder roll 40. To do. Since the diameter of the solder roll 40 (hereinafter may be referred to as “solder roll diameter”) depends on the amount of solder supplied on the screen 16 (hereinafter may be referred to as “solder amount”), Based on the solder roll diameter, it is possible to detect the amount of solder. This printing machine has a function of detecting the amount of solder based on the diameter of the solder roll, and the solder sensor 50 functions as a solder amount detector.
≪はんだの追加供給作業≫
 本印刷機では、はんだの追加供給は、当該印刷機のオペレータによる手作業にて行われる。印刷機は、図1に示すように、ハウジングの一部、つまり、外装パネルの一部として、扉60を備えており、はんだの追加供給の作業は、その扉60を開けた状態で行われる。詳しく説明すれば、追加供給されるはんだを、容器から適量だけ取り出して、スクリーン16上に載せ置くようにして行われる。はんだが追加供給された場合には、所定の練合せを行う。具体的に説明すれば、1対のスキージ20による上記印刷動作と同じ動作を繰り返し行うことで、はんだの調整が、つまり、はんだロール40の調製が行われるのである。
≪Additional solder supply work≫
In this printing press, the additional supply of solder is performed manually by the operator of the printing press. As shown in FIG. 1, the printing press includes a door 60 as a part of the housing, that is, a part of the exterior panel, and the additional supply of solder is performed with the door 60 opened. . More specifically, the additional supplied solder is taken out from the container in an appropriate amount and placed on the screen 16. When additional solder is supplied, predetermined kneading is performed. More specifically, the adjustment of the solder, that is, the preparation of the solder roll 40 is performed by repeatedly performing the same operation as the printing operation by the pair of squeegees 20.
 はんだの追加供給の作業は、当該印刷機によるはんだの印刷が行われていないときに行われるべきである。そのため、本印刷機には、図1に示すように、扉60が開状態にあるか閉状態にあるかを検出するための扉センサ62、および、扉60が開けられることを禁止するための扉ロック機構64が、それぞれ設けられており、印刷が行われているときにはんだの追加供給の作業が行われることが、逆に言えば、扉60が開いているときに印刷が行われることが、防止されている。なお、扉のロックは、操作パネル34の扉ロック解除スイッチ66によって、手動で解除することも可能である。 The additional solder supply work should be performed when solder printing is not performed by the printer. Therefore, in this printing press, as shown in FIG. 1, a door sensor 62 for detecting whether the door 60 is in an open state or a closed state, and for preventing the door 60 from being opened. Each of the door lock mechanisms 64 is provided, and the additional solder supply operation is performed when printing is performed. In other words, the printing is performed when the door 60 is opened. Is prevented. The door can be locked manually by the door lock release switch 66 of the operation panel 34.
≪はんだの追加供給に関連する2つの認識処理≫
 本印刷機は、はんだの追加供給に関連して、2つの認識処理、すなわち、2つの確認処理(ベリファイ)を行う機能を有している。2つの認識処理の1つは、実際にはんだが追加供給されたか否かを認識する処理であり、もう1つは、追加供給されたはんだが適正なものであるか否かを認識する処理である。それら2つの認識処理は、図4にフローチャートを示すはんだ追加供給管理プログラムが制御装置32において実行されることによって行われる。そして、そのプログラムが実行されることによって、制御装置32は、図5に示すような機能部を有するように構成されることになる。つまり、図5に示す各機能部が実現されるのである。以下に、それら図4,図5を参照しつつ、当該プログラムのフローチャートに沿って、上記2つの認識処理について説明する。
≪Two recognition processes related to additional supply of solder≫
The printing machine has a function of performing two recognition processes, that is, two confirmation processes (verify) in connection with the additional supply of solder. One of the two recognition processes is a process for recognizing whether or not additional solder is actually supplied, and the other is a process for recognizing whether or not the additionally supplied solder is appropriate. is there. These two recognition processes are performed by executing the additional solder supply management program shown in the flowchart of FIG. When the program is executed, the control device 32 is configured to have a functional unit as shown in FIG. That is, each functional unit shown in FIG. 5 is realized. Hereinafter, the two recognition processes will be described with reference to FIGS. 4 and 5 along the flowchart of the program.
 はんだ追加供給管理プログラムに従う処理では、まず、ステップ1(以下、「S1」と略す。他のステップも同様である。)において、はんだを追加供給すべき旨の指示があったか否か、若しくは、扉60の解除操作があったか否かが判断される。制御装置32は、印刷作業の管理を行う作業管理部70を有しており、この作業管理部70は、印刷された基板の枚数を把握することによって、はんだの追加供給のタイミングを管理している。上述のはんだを追加供給すべき旨の指示は、作業管理部70から発せられ、その指示が操作パネル34に表示されることで、オペレータは、はんだの追加供給の作業を実行することになる。一方、扉60の解除操作は、操作パネル34の扉ロック解除スイッチ66が操作された場合に発せられる。この操作は、上記作業管理部70の指示とは関係なくはんだを追加供給するような場合に、オペレータによって行われる。ちなみに、上記指示,操作は、はんだの追加供給に関連して、扉60を開けることを許容すべき旨の指令と解釈することができる。 In the processing in accordance with the additional solder supply management program, first, in step 1 (hereinafter abbreviated as “S1”, the same applies to other steps), whether there is an instruction to additionally supply solder, or a door It is determined whether or not 60 release operations have been performed. The control device 32 includes a work management unit 70 that manages printing work. This work management unit 70 manages the timing of additional supply of solder by grasping the number of printed boards. Yes. The instruction to additionally supply the solder is issued from the work management unit 70, and the instruction is displayed on the operation panel 34, so that the operator performs the additional supply work of the solder. On the other hand, the door 60 release operation is issued when the door lock release switch 66 of the operation panel 34 is operated. This operation is performed by the operator when additional solder is supplied regardless of the instruction from the work management unit 70. Incidentally, the above instruction and operation can be interpreted as a command indicating that the door 60 should be allowed to open in relation to the additional supply of solder.
 はんだを追加供給すべき旨の指示、若しくは、扉ロックの解除操作があった事実は、はんだ量の検出に関する制御を司るはんだ検出制御部72に入力される。はんだ検出制御部72は、それらの指示,操作があった場合には、はんだが追加供給されるものとみなして、扉ロック機構64による扉60のロックの解除に先立って、S2において、その時点でのはんだのロール径を、はんだが追加供給される前のはんだロール径(追加前はんだロール径)φBとして、はんだセンサ50に測定させる。つまり、上述した扉60を開けることを許容すべき旨の指令をトリガとして、スキージ装置22を制御することによって、はんだ量の検出を行わせるのである。はんだ検出制御部72は、はんだロール径φBの測定の後に、S3において、扉ロック制御部74に指示を送り、その指示を受けた扉ロック制御部74は、扉ロック機構64に、扉ロックの解除を実行させる。 The instruction that additional solder should be supplied or the fact that there has been a door lock release operation is input to the solder detection control unit 72 that controls the detection of the amount of solder. The solder detection control unit 72 considers that additional solder is supplied if there is such an instruction or operation, and in S2, prior to unlocking the door 60 by the door lock mechanism 64, at that time The solder sensor 50 is measured by the solder sensor 50 as the solder roll diameter (pre-addition solder roll diameter) φ B before the solder is additionally supplied. That is, the amount of solder is detected by controlling the squeegee device 22 using the above-described command to allow the door 60 to be opened as a trigger. After measuring the solder roll diameter φ B , the solder detection control unit 72 sends an instruction to the door lock control unit 74 in S3, and the door lock control unit 74 receiving the instruction sends the door lock mechanism 64 to the door lock mechanism 64. The release is executed.
 はんだの追加供給の際には、扉60がオペレータによって開けられ、追加供給の作業が終了した後に、扉60は、オペレータによって再び閉められる。はんだ検出制御部72は、このような扉60の動作を、扉センサ62を利用して検出しており、S4において、扉60が開状態から閉状態になったと判断した場合には、はんだの印刷が再開されるとみなして、S5において、扉ロック制御部74に扉60をロックする旨の指示を送る。この指示を受けた扉ロック制御部74は、扉ロック機構64に扉60をロックさせる。その後、はんだ検出制御部72は、S6において、再度、その時点でのはんだのロール径を、はんだが追加供給された後のはんだロール径(追加後はんだロール径)φAとして、はんだセンサ50に測定させる。 In the case of additional supply of solder, the door 60 is opened by the operator, and after the additional supply operation is completed, the door 60 is closed again by the operator. The solder detection control unit 72 detects such an operation of the door 60 using the door sensor 62, and if it is determined in S4 that the door 60 has been changed from the open state to the closed state, Assuming that printing is resumed, an instruction to lock the door 60 is sent to the door lock control unit 74 in S5. Upon receiving this instruction, the door lock control unit 74 causes the door lock mechanism 64 to lock the door 60. Thereafter, the solder detection control unit 72, in S6, again, the roll diameter of the solder at the time, as the solder roll diameter (add after the solder roll diameter) phi A after the solder is additionally supplied to the solder sensor 50 Let me measure.
 上述したように、はんだ検出制御部72は、はんだの追加供給の際に必然的に行われる扉60の開閉に関連して、はんだの追加供給前,追加供給後のはんだロール径を測定するように構成されている。つまり、扉60の開閉に依存して、はんだの追加供給の前後の2回のはんだ量の検出が行われるように構成されているのである。この構成により、本印刷機では、はんだの追加供給がオペレータの手作業によって行われるものであるにも拘わらず、確実に、その作業の前後のはんだ量を把握することが可能とされている。 As described above, the solder detection control unit 72 measures the diameter of the solder roll before and after the additional supply of solder in relation to the opening and closing of the door 60 that is inevitably performed when the additional supply of solder is performed. It is configured. That is, depending on whether the door 60 is opened or closed, the solder amount is detected twice before and after the additional supply of solder. With this configuration, in the present printing machine, it is possible to reliably grasp the amount of solder before and after the operation even though the additional supply of solder is performed manually by the operator.
 はんだセンサ50によって測定された追加前はんだロール径φBおよび追加後はんだロール径φAは、S7において、はんだ追加判断部76によって比較される。詳しく言えば、追加後はんだロール径φAから追加前はんだロール径φB引いたロール径差Δφが、閾値ΔφTHよりも大きいか否かが判断され、大きい場合に、はんだが追加供給されたと判断され、小さい場合に、はんだが追加供給されていないと判断される。この判断が行われることで、本印刷機は、実際にはんだが追加供給されたか否かを認識する機能を有しているのである。はんだが追加供給されていない場合は、S8において、未だはんだが追加供給されていない旨の警告が、操作パネル34を介して、オペレータに発せられる。一方、S7においてはんだが実際に供給されたと判断された場合には、S9において、追加したはんだのIDを読み取る旨の指示が、操作パネル34を介して、オペレータに発せられる。 The pre-addition solder roll diameter φ B and the post-addition solder roll diameter φ A measured by the solder sensor 50 are compared by the solder addition determination unit 76 in S7. In detail, the roll diameter difference [Delta] [phi minus roll diameter phi B solder before adding the additional post solder roll diameter phi A is, it is determined whether or not larger than the threshold value [Delta] [phi TH is greater, and the solder is additionally supplied When it is determined that the solder is small, it is determined that no additional solder is supplied. By making this determination, the printing press has a function of recognizing whether or not additional solder is actually supplied. If additional solder is not supplied, a warning that additional solder has not been supplied is issued to the operator via the operation panel 34 in S8. On the other hand, if it is determined in S7 that the solder has actually been supplied, an instruction to read the added solder ID is issued to the operator via the operation panel 34 in S9.
 図6に示すように、はんだが収容されている容器90には、バーコード92が付されており、追加供給されたはんだのIDは、そのはんだが収容されていた容器90に付されたバーコード92をバーコードリーダ36によって読み取ることによって取得される。つまり、バーコード92は、追加供給されたはんだの容器90に付されたそのはんだについての識別子であり、バーコードリーダ36は、その識別子を読み取るための識別子読取器として機能する。そして、バーコードリーダ36による読み取り結果は、実供給はんだ認識用情報入手部78に送られ、S10において、その読み取り結果から、実供給はんだ認識用情報入手部78によって、実際に供給されたはんだの種別を認識するための情報である実供給はんだ認識用情報が入手される。 As shown in FIG. 6, a bar code 92 is attached to the container 90 in which the solder is accommodated, and the ID of the additionally supplied solder is the bar attached to the container 90 in which the solder is accommodated. It is obtained by reading the code 92 with the barcode reader 36. That is, the barcode 92 is an identifier for the solder attached to the additionally supplied solder container 90, and the barcode reader 36 functions as an identifier reader for reading the identifier. The result read by the barcode reader 36 is sent to the actual supply solder recognition information acquisition unit 78. In S10, the actual supply solder recognition information acquisition unit 78 determines the actual supply solder recognition information acquisition unit 78. Information for recognizing actual supply solder, which is information for recognizing the type, is obtained.
 一方、現在行っている印刷作業に対して適正なはんだについての情報、つまり、供給されるべきはんだの種別についての情報である適正はんだ情報は、適正はんだ情報記憶部80に記憶されている。この情報は、操作パネル34から入力されることによって記憶される、若しくは、当該印刷作業についての印刷プログラムの中に存在する情報に基づいて記憶される。 On the other hand, appropriate solder information that is information on the solder that is appropriate for the current printing operation, that is, information on the type of solder to be supplied, is stored in the appropriate solder information storage unit 80. This information is stored by being input from the operation panel 34, or stored based on information existing in the print program for the print job.
 実供給はんだ認識用情報の入手の後、S11において、その情報と上記適正はんだ情報とが比較される。この比較は、追加はんだ適否認定部82によって行われる。具体的には、追加はんだ適否認定部82によって、実供給はんだ認識用情報が示すはんだ種別が、適正はんだ情報が示すはんだの種別と一致しているか否かが判定されることで、追加供給されたはんだの適否が認定される。この認定が行われることで、本印刷機は、追加供給されたはんだが適正なものであるか否かを認識する機能を有しているのである。適正であると認定された場合には、S12において、印刷作業が許容される。つまり、制御装置32は、印刷を再開するために操作パネル34に行われる操作を受け付けるのである。 After obtaining the actual supply solder recognition information, in S11, the information is compared with the appropriate solder information. This comparison is performed by the additional solder suitability certification unit 82. Specifically, the additional solder suitability determination unit 82 determines whether the solder type indicated by the actual supply solder recognition information matches the solder type indicated by the appropriate solder information, and is additionally supplied. Appropriateness of solder is certified. As a result of this certification, the printing press has a function of recognizing whether or not the additionally supplied solder is appropriate. If it is determined to be appropriate, the printing operation is allowed in S12. That is, the control device 32 accepts an operation performed on the operation panel 34 in order to resume printing.
 一方、S11において追加供給されたはんだが適正ではない、すなわち、不適と認定された場合には、S13において、印刷作業が禁止される。つまり、制御装置32は、印刷を再開するために操作パネル34に行われる操作を受け付けないようにするのである。この印刷作業の禁止は、作業禁止部84によって行われる。さらに、S14において、作業禁止部84は、作業禁止に引き続き、追加供給されたはんだの種別が適正なはんだの種別と不一致である旨の警告を、操作パネル34を介して、オペレータに行う。 On the other hand, if the additionally supplied solder is not appropriate in S11, that is, if it is recognized as inappropriate, the printing operation is prohibited in S13. That is, the control device 32 does not accept an operation performed on the operation panel 34 in order to resume printing. The prohibition of the printing operation is performed by the operation prohibiting unit 84. Further, in S14, following the work prohibition, the work prohibition unit 84 issues a warning to the operator via the operation panel 34 that the additionally supplied solder type does not match the appropriate solder type.
 上記追加供給されたはんだが適正なものであるか否かを認識する機能、および、追加供給されたはんだが不適と認定された場合の処置を実行する機能により、不適なはんだによる印刷作業が未然に防止されることになる。なお、はんだ追加供給管理プログラムは、印刷が再開される都度、繰り返し実行される。 The function of recognizing whether or not the additional supplied solder is appropriate, and the function of performing the action when the additional supplied solder is found to be inappropriate, prevent the printing work with the inappropriate solder. Will be prevented. The additional solder supply management program is repeatedly executed every time printing is resumed.
≪変形例≫
 上記実施例の印刷機は、基板にクリームはんだを印刷するためのものであるが、本発明は、印刷対象物が特に限定されるものではなく、スクリーンを利用してクリームはんだを印刷する印刷機に対して広く適用できる。また、上記実施例の印刷機では、はんだロール径に基づいてはんだ量を検出するように構成されていたが、本発明では、はんだ量の検出の具体的な手法については、特に限定されない。本発明の印刷機は、例えば、スクリーン上に供給されているはんだの重量を測定することによって、はんだ量を検出するように構成されてもよい。
≪Modification≫
Although the printing machine of the said Example is for printing cream solder on a board | substrate, this invention is not specifically limited, The printing machine which prints cream solder using a screen Widely applicable to. Further, in the printing press of the above embodiment, the solder amount is detected based on the solder roll diameter, but in the present invention, the specific method for detecting the solder amount is not particularly limited. The printing press of the present invention may be configured to detect the amount of solder by, for example, measuring the weight of solder supplied on the screen.
 上記実施例の印刷機では、実供給はんだ認識用情報を、容器に付されたバーコードを読み取ることによって入手するように構成されていたが、識別子は特に限定されず、例えば、QRコード(登録商標)等であってもよい。また、本発明の印刷機は、識別子を読み取るのではなく、操作パネル等へオペレータが入力する情報に基づいて、実供給はんだ認識情報を入手するように構成されてもよい。 In the printing machine of the above embodiment, the actual supply solder recognition information is obtained by reading the barcode attached to the container. However, the identifier is not particularly limited. For example, the QR code (registration) Trademark) or the like. Further, the printing press of the present invention may be configured to obtain the actual supply solder recognition information based on information input by the operator to the operation panel or the like, instead of reading the identifier.
 16:スクリーン  20:スキージ  22:スキージ装置  32:制御装置  34:操作パネル  36:バーコードリーダ(識別子読取器)  40:はんだロール  50:はんだセンサ(はんだ量検出器)  60:扉  64:扉ロック機構  72:はんだ検出制御部  76:はんだ追加判断部  78:実供給はんだ認識用情報入手部  80:適正はんだ情報記憶部  82:追加はんだ適否認定部  84:作業禁止部  90:容器  92:バーコード(識別子)
                                                                                
16: Screen 20: Squeegee 22: Squeegee device 32: Control device 34: Operation panel 36: Bar code reader (identifier reader) 40: Solder roll 50: Solder sensor (solder amount detector) 60: Door 64: Door lock mechanism 72: Solder detection control unit 76: Solder addition determination unit 78: Information acquisition unit for recognition of actual supply solder 80: Appropriate solder information storage unit 82: Additional solder suitability certification unit 84: Work prohibition unit 90: Container 92: Bar code (identifier) )

Claims (5)

  1.  スクリーン上に供給されているクリームはんだをスキージを利用して基板に印刷するはんだ印刷機であって、
     スクリーン上に供給されているクリームはんだの量を検出するためのはんだ量検出器を備え、
     当該はんだ印刷機の制御を司る制御装置が、
     供給されるべきクリームはんだの種別についての情報である適正はんだ情報を記憶するはんだ情報記憶部と、
     実際に供給されたクリームはんだの種別を認識するための実供給はんだ認識用情報を入手する実供給はんだ認識用情報入手部と、
     はんだ量検出器による検出結果に基づいて、クリームはんだが追加供給されたか否かを判断するはんだ追加判断部と、
     そのはんだ追加判断部によってクリームはんだが追加供給されたと判断された場合において、前記適正はんだ情報と前記実供給はんだ認識用情報とに基づいて、追加供給されたクリームはんだの適否を認定する追加はんだ適否認定部と
     を有することを特徴とするはんだ印刷機。
    A solder printing machine that prints cream solder supplied on a screen onto a substrate using a squeegee,
    Equipped with a solder amount detector to detect the amount of cream solder being supplied on the screen,
    A control device that controls the solder printing machine
    A solder information storage unit for storing appropriate solder information which is information about the type of cream solder to be supplied;
    An actual supply solder recognition information obtaining unit for obtaining actual supply solder recognition information for recognizing the type of cream solder actually supplied;
    Based on the detection result by the solder amount detector, a solder addition determining unit that determines whether or not cream solder is additionally supplied;
    When it is determined by the additional solder determination unit that cream solder has been additionally supplied, additional solder propriety for certifying the appropriateness of the additionally supplied cream solder based on the appropriate solder information and the actual supply solder recognition information A solder printing machine characterized by having a certified part.
  2.  当該はんだ印刷機が、ハウジングの一部として設けられて開閉する扉と、その扉が開かないようにロックする扉ロック機構とを備えるとともに、その扉が開けられた状態において、オペレータによってクリームはんだが追加供給されるように構成されており、
     前記制御装置が、
     前記扉を開けることを許容すべき旨の指令をトリガとして、前記扉ロック機構による前記扉のロックの解除に先立って、前記はんだ量検出器にはんだ量の検出を行わせるとともに、その後、当該はんだ印刷機によるクリームはんだの印刷が再開される場合に、前記はんだ量検出器にはんだ量の検出を行わせるはんだ検出制御部を有し、
     前記はんだ追加判断部が、前記2回の検出によって検出されたはんだ量に基づいて、クリームはんだが追加供給されたか否かを判断するように構成された請求項1に記載のはんだ印刷機。
    The solder printer includes a door that is provided as a part of the housing and opens and closes, and a door lock mechanism that locks the door so that the door is not opened. It is configured to be supplied additionally,
    The control device is
    Prior to unlocking the door by the door lock mechanism, the solder amount detector detects the amount of solder using a command to allow opening of the door as a trigger, and then the solder When the printing of the cream solder by the printing machine is resumed, it has a solder detection control unit that causes the solder amount detector to detect the solder amount,
    The solder printer according to claim 1, wherein the solder addition determination unit is configured to determine whether or not additional cream solder is supplied based on the amount of solder detected by the two detections.
  3.  当該はんだ印刷機が、追加供給されたクリームはんだの容器に付されたそのクリームはんだについての識別子を読み取るための識別子読取器を備え、
     前記実供給はんだ認識用情報入手部が、その識別子読取器による読取の結果に基づいて、前記実供給はんだ認識用情報を入手するように構成された請求項1または請求項2に記載のはんだ印刷機。
    The solder printer comprises an identifier reader for reading an identifier for the cream solder affixed to the additionally supplied cream solder container;
    The solder printing according to claim 1 or 2, wherein the actual supply solder recognition information acquisition unit is configured to acquire the actual supply solder recognition information based on a result of reading by the identifier reader. Machine.
  4.  当該はんだ印刷機において、スクリーン上に供給されているクリームはんだがロール形状をなすはんだロールとして存在し、
     前記はんだ量検出器が、そのはんだロールの径を測定するように構成された請求項1ないし請求項3のいずれか1つに記載のはんだ印刷機。
    In the solder printing machine, the cream solder supplied on the screen exists as a solder roll having a roll shape,
    The solder printer according to any one of claims 1 to 3, wherein the solder amount detector is configured to measure a diameter of the solder roll.
  5.  前記制御装置が、
     前記追加はんだ適否認定部によって、追加供給されたクリームはんだが不適と認定された場合に、当該はんだ印刷機による印刷作業を禁止する作業禁止部を有する請求項1ないし請求項4のいずれか1つに記載のはんだ印刷機。
                                                                                    
    The control device is
    5. The apparatus according to claim 1, further comprising an operation prohibiting unit that prohibits a printing operation by the solder printer when the additionally supplied cream solder is recognized as inappropriate by the additional solder suitability determining unit. Solder printer as described in.
PCT/JP2012/071635 2012-08-28 2012-08-28 Solder printing machine WO2014033824A1 (en)

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JPWO2020217442A1 (en) * 2019-04-26 2020-10-29

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JPH01291937A (en) * 1988-05-20 1989-11-24 Pilot Corp:The Screen printing method
JPH04146144A (en) * 1990-10-08 1992-05-20 Matsushita Electric Ind Co Ltd Screen printer
JPH07205403A (en) * 1994-01-25 1995-08-08 Furukawa Electric Co Ltd:The Cream solder printing machine
JPH11320823A (en) * 1998-05-21 1999-11-24 Matsushita Electric Ind Co Ltd Screen printing method and device therefor
JP2008207392A (en) * 2007-02-23 2008-09-11 Hitachi High-Tech Instruments Co Ltd Screen printing machine

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JPH01291937A (en) * 1988-05-20 1989-11-24 Pilot Corp:The Screen printing method
JPH04146144A (en) * 1990-10-08 1992-05-20 Matsushita Electric Ind Co Ltd Screen printer
JPH07205403A (en) * 1994-01-25 1995-08-08 Furukawa Electric Co Ltd:The Cream solder printing machine
JPH11320823A (en) * 1998-05-21 1999-11-24 Matsushita Electric Ind Co Ltd Screen printing method and device therefor
JP2008207392A (en) * 2007-02-23 2008-09-11 Hitachi High-Tech Instruments Co Ltd Screen printing machine

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020217442A1 (en) * 2019-04-26 2020-10-29
JP7165261B2 (en) 2019-04-26 2022-11-02 株式会社Fuji PRINTING DEVICE, CLEANING UNIT AND METHOD FOR CONTROLLING PRINTING DEVICE

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