WO2014032322A1 - 一种直下式背光模组及其led封装件 - Google Patents

一种直下式背光模组及其led封装件 Download PDF

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Publication number
WO2014032322A1
WO2014032322A1 PCT/CN2012/081052 CN2012081052W WO2014032322A1 WO 2014032322 A1 WO2014032322 A1 WO 2014032322A1 CN 2012081052 W CN2012081052 W CN 2012081052W WO 2014032322 A1 WO2014032322 A1 WO 2014032322A1
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Prior art keywords
backlight module
direct
base
led
support
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English (en)
French (fr)
Inventor
俞刚
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/642,549 priority Critical patent/US20140063785A1/en
Publication of WO2014032322A1 publication Critical patent/WO2014032322A1/zh
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
    • G09F13/0409—Arrangements for homogeneous illumination of the display surface, e.g. using a layer having a non-uniform transparency
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses

Definitions

  • the invention relates to a direct-type backlight module and an LED package thereof.
  • the application is filed on August 31, 2012, and the application number is 201210318012.X.
  • the priority of the Chinese Patent Application the entire contents of which are hereby incorporated by reference.
  • the present invention relates to the field of liquid crystal panel manufacturing, and in particular to a direct type backlight module and an LED package thereof. Background technique
  • the direct type backlight module includes: a back plate 91 , an LED chip 92 mounted on the back plate 91 , and a back plate 91 .
  • Adjacent side diffusion plate 93 Adjacent side diffusion plate 93.
  • the LED chip 92 needs to be assembled with a package member 94 for controlling the light output of the LED, and the diffusion plate 93 needs to be equipped with a support member 95 for supporting and fixing.
  • the technical problem to be solved by the present invention is to provide a direct type backlight module and an LED package thereof, which do not need to separately support the diffusion structure on the back plate of the backlight module, thereby reducing the processing time and processing cost of the back plate. , further reducing the cost of the backlight module.
  • an LED package for a direct type backlight module including:
  • the support portion is extended from the surface of the base for supporting the diffusion plate of the backlight module.
  • the support portion is integrally formed on the base.
  • the support portion includes a support rod whose one end portion is connected to the base and whose diameter is tapered and narrowed.
  • the base comprises a cover that is hollow inside, and the cover is hemispherical.
  • the invention also discloses a direct type backlight module, comprising a back plate and a diffusion plate, wherein the back plate is provided with a plurality of LED chips, wherein the direct type backlight module further comprises a plurality of LED packages.
  • One ends of the plurality of LED packages are respectively disposed on the plurality of LED chips, and the opposite ends of the plurality of LED packages support and fix the diffusion plate.
  • the any one of the LED packages comprises: a base mounted on the LED chip and a support portion extending from a surface of the base, the end of the support portion abutting on the diffusion plate .
  • the support portion includes a support rod whose one end portion is connected to the base and whose diameter is tapered and narrowed.
  • the support portion is integrally formed on the base.
  • the direct type backlight module and the LED package provided by the invention have the following beneficial effects: Since the LED package comprises a support portion disposed on the base, the base can package the LED chip provided on the backlight module back plate The support portion can fix the diffusion plate of the backlight module on the adjacent side of the back plate, and the support structure is not separately installed on the back plate of the backlight module, thereby reducing the processing time and processing cost of the back plate, and further reducing the backlight module. cost.
  • FIG. 1 is a schematic structural view of an LED package for a direct type backlight module according to an embodiment of the present invention
  • FIG. 2 is a partial schematic structural view of a direct type backlight module according to an embodiment of the present invention
  • FIG. 3 is a partial structural schematic view of a direct type backlight module in the prior art. detailed description
  • An embodiment of the present invention provides an LED package for a direct type backlight module, comprising: a base 1 disposed on an LED chip of a backlight of the backlight module;
  • the support portion 2 is extended from the surface of the base 1 for supporting and fixing the diffusion plate of the backlight module.
  • the LED package of the above structure is used for packaging the LED chip on the backplane, and the installation of the support portion 2 is also achieved while the light source is installed, and the support of the diffusion plate is synchronously realized. LED seal of the structure
  • the assembly can avoid the corresponding positioning holes for fixing the support portion 2 on the back plate, reduce the man-hour and processing cost of processing the back plate, and further reduce the cost of manufacturing the backlight module.
  • the structure of the LED package for the direct type backlight module of the present invention will be specifically described below.
  • the base 1 is provided in the present embodiment as a hollow cover which is hemispherical.
  • the base 1 can cover the position of the LED chip on the back plate, and the cover of the LED chip by the base 1 can achieve the purpose of controlling the amount of light emitted by the LED.
  • the support portion 2 is a support structure integrally formed on the base 1, and is extended from the outer surface of the base 1.
  • the support portion 2 serves to support the diffusion plate on the adjacent side of the back plate in the backlight module. Since the support portion 2 is connected to the base 1, the process of installing the above-described light source is equivalent to the process of fixing the support portion 2. That is to say, the LED assembly of the structure can simultaneously package the LED and fix the diffusion plate.
  • the support portion 2 is a support rod whose one end portion is connected to the outer surface of the base 1 and whose diameter is tapered and narrowed.
  • the smaller diameter end of the support rod is a support point for supporting the diffusion plate.
  • the support portion 2 may be set to other common shapes, such as a cylinder, a square column, a truncated cone, a square table, etc.
  • the base 1 is not limited to the above-described hollow hemispherical embodiment, which may be The shape, number and arrangement of the LED chips are adaptively adjusted.
  • the present invention also discloses a direct type backlight module, which comprises a back plate 3, a plurality of LED chips 4 disposed on the back plate 3, and a diffusion plate 5, wherein the direct type backlight module further includes The plurality of LED packages have one end of the plurality of LED packages correspondingly disposed on the plurality of LED chips 4, and the opposite ends of the plurality of LED packages support the fixed diffusion plate 5 on the adjacent side of the back plate 3.
  • each of the LED packages comprises: a base 1 mounted on the LED chip 4 and a support portion 2 extending from a surface of the base 1 , the end of the support portion 2 abutting on the diffuser plate 5 .
  • the direct type backlight module of the invention realizes the assembly of the LED and the synchronous assembly of the diffusion plate support, and achieves the purpose of mounting the support portion 2 while completing the installation of the light source.
  • the direct-type backlight module of the structure can avoid the corresponding positioning holes for fixing the support portion 2 on the backboard 3, reduce the man-hour and processing cost of the processing backplane, and further reduce the cost of manufacturing the backlight module.
  • Embodiment of the direct type backlight module of the present invention and the above-mentioned LED package for the direct type backlight module The implementation of the components is the same, and will not be described here.
  • the direct-type backlight module and the LED package thereof embodying the invention have the following beneficial effects: Since the LED package includes a support portion disposed on the base, the base can encapsulate the LED chip provided on the back panel of the backlight module.
  • the support portion can fix the diffusion plate of the backlight module on the adjacent side of the back plate, and does not need to separately support the support structure to support the diffusion plate, thereby reducing the processing time and processing cost of the back plate, and further reducing the cost of the backlight module.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Description

一种直下式背光模组及其 LED封装件 本申请要求于 2012年 8月 31日提交中国专利局、申请号为 201210318012.X 、 发明名称为 "一种直下式背光模组及其 LED封装件" 的中国专利申请的优先 权， 上述专利的全部内容通过引用结合在本申请中。 技术领域
本发明涉及液晶面板制造领域， 尤其涉及一种直下式背光模组及其 LED封 装件。 背景技术
如图 3 所示， 为现有技术中的直下式背光模组的局部结构示意图， 该直下 式背光模组包括： 背板 91、 装设在背板 91上的 LED芯片 92以及位于背板 91 邻侧的扩散板 93。其中， LED芯片 92需要装配封装件 94用于控制 LED的出光， 扩散板 93需要装配支撑件 95进行支撑固定。
也就是说， 在上述结构的直下式背光模组的装配过程中， 需要分别在背板 上完成封装件 94和支撑件 95装配的两个工序， 不但延长了装配工时， 而且还 要在背板 91上开设用以配合固定支撑杆 95的定位孔， 增加了背板 91的制作费 用， 不利于成本节约。 发明内容
本发明所要解决的技术问题在于， 提供一种直下式背光模组及其 LED封装 件， 无需在背光模组的背板上单独装配支撑结构支撑扩散板， 减少了背板的加 工工时及加工费用， 进一步降低背光模组的成本。
为了解决上述技术问题， 本发明的实施例提供了一种用于直下式背光模组 的 LED封装件， 包括：
装设在所述直下式背光模组的背板具有的 LED芯片上的底座；
支撑部， 自所述底座的表面延伸设置用于对所述背光模组的扩散板支撑固 定。
优选的， 所述支撑部一体成型在所述底座上。 优选的， 所述支撑部包括一端部连接在所述底座上且直径渐缩收窄的支撑 杆。
优选的， 所述底座包括内部设置中空的罩盖， 所述罩盖呈半球状。
本发明还公开了一种直下式背光模组， 包括背板和扩散板， 所述背板上设 有多个 LED芯片， 其特征在于， 所述直下式背光模组还包括多个 LED封装件， 所述多个 LED封装件的一端分别对应盖设在所述多个 LED芯片上， 所述多个 LED封装件相对的另一端支撑固定所述扩散板。
优选的，所述任一个 LED封装件包括： 装设在所述 LED芯片上的底座和自 所述底座的表面延伸设置的支撑部， 所述支撑部的端头抵顶在所述扩散板上。
优选的， 所述支撑部包括一端部连接在所述底座上且直径渐缩收窄的支撑 杆。
优选的， 所述支撑部一体成型在所述底座上。
本发明所提供的直下式背光模组及其 LED封装件， 具有如下有益效果： 由 于 LED封装件包括了设置在底座上的支撑部， 底座可对背光模组背板上具有的 LED 芯片进行封装， 支撑部可将背光模组的扩散板固定在背板的邻侧， 无需在 背光模组的背板上单独装配支撑结构， 减少了背板的加工工时及加工费用， 进 一步降低背光模组的成本。 附图说明
图 1是本发明实施例用于直下式背光模组的 LED封装件的结构示意图； 图 2是本发明实施例直下式背光模组的局部结构示意图；
图 3是现有技术中的直下式背光模组的局部结构示意图。 具体实施方式
下面参考附图对本发明的优选实施例进行描述。
本发明实施例提供了一种用于直下式背光模组的 LED封装件， 包括： 底座 1 , 装设在背光模组的背板具有的 LED芯片上；
支撑部 2, 自底座 1的表面延伸设置用于对背光模组的扩散板支撑固定。 上述结构的 LED封装件用于封装背板上 LED芯片，在完成光源安装的同时， 也达到了安装支撑部 2的目的， 同步实现了对扩散板的支撑。 该结构的 LED封 装件可避免在背板上开设相应的用于固定支撑部 2的定位孔， 减少加工背板的 工时及加工费用， 使制造背光模组的成本进一步降低。 以下具体说明本发明用 于直下式背光模组 LED封装件的结构。
参见图 1 , 底座 1 在本实施例中设置为一中空的罩盖， 呈半球状。 在装配 LED封装件时， 底座 1可以遮盖在背板上具有 LED芯片的位置， 通过底座 1对 LED芯片的遮盖能够达到控制 LED出光量的目的。
支撑部 2是一体成型在底座 1上的支撑结构， 其自底座 1的外表面延伸设 置， 支撑部 2的作用是对背光模组中位于背板邻侧的扩散板进行支撑。 由于支 撑部 2接连在底座 1上， 实施上述安装光源的过程也相当于实施支撑部 2固定 的过程。也就是说，该结构的 LED装配件能够同时实现对 LED的封装以及对扩 散板的固定。
在支撑部 2的一个优选实施方式中：
支撑部 2是一端部连接在底座 1外表面且直径渐缩收窄的支撑杆， 支撑杆 较小直径的端头便是对扩散板进行支撑的支撑点。 多个同样结构的 LED封装件 安装在相应的 LED芯片的外周时， 由于底座 1和支撑杆的尺寸设置相同， 多个 相同高度支撑杆的端头便可在同一平面上， 同时实现对扩散板的支撑。
支撑部 2 的其他实施方式中， 其可以设置为其他常见的形状， 如圆柱、 方 柱、 圆台及方台等； 同样， 底座 1 也不限定在上述中空的半球状的实施方式， 其可以根据 LED芯片的形状、 数量及排布方式适应性调整。
如图 2所示， 本发明还公开了一种直下式背光模组， 包括背板 3、 设置在背 板 3上的多个 LED芯片 4以及扩散板 5,其中，直下式背光模组还包括多个 LED 封装件，多个 LED封装件的一端分别对应盖设在多个 LED芯片 4上，多个 LED 封装件相对的另一端支撑固定扩散板 5在背板 3的邻侧。
优选的实施方式中，每个 LED封装件均包括： 装设在 LED芯片 4上的底座 1和自底座 1的表面延伸设置的支撑部 2, 支撑部 2的端头抵顶在扩散板 5上。
本发明的直下式背光模组， 实现了对 LED的封装以及对扩散板支撑的同步 装配， 在完成光源安装的同时， 也达到了安装支撑部 2 的目的。 该结构的直下 式背光模组可避免在背板 3上开设相应的用于固定支撑部 2的定位孔， 减少加 工背板的工时及加工费用， 使制造背光模组的成本进一步降低。
本发明的直下式背光模组的实施方式与上述用于直下式背光模组 LED封装 件的实施方式相同， 此处不再赘述。
实施本发明的直下式背光模组及其 LED封装件， 具有如下有益效果： 由于 LED封装件包括了设置在底座上的支撑部， 底座可对背光模组背板上具有的 LED 芯片进行封装， 支撑部可将背光模组的扩散板固定在背板的邻侧， 无需单 独装配支撑结构支撑扩散板， 减少了背板的加工工时及加工费用， 进一步降低 背光模组的成本。

Claims

权 利 要 求
1、 一种用于直下式背光模组的 LED封装件， 其中， 包括：
装设在所述直下式背光模组的背板具有的 LED芯片上的底座；
支撑部， 自所述底座的表面延伸设置用于对所述背光模组的扩散板支撑固 定。
2、 如权利要求 1所述的用于直下式背光模组的 LED封装件， 其中， 所述 支撑部包括一端部连接在所述底座上的支撑杆。
3、 如权利要求 2所述的用于直下式背光模组的 LED封装件， 其中， 所述 支撑杆的直径渐缩收窄。
4、 如权利要求 2所述的用于直下式背光模组的 LED封装件， 其中， 所述 支撑杆一体成型在所述底座上。
5、 如权利要求 1所述的用于直下式背光模组的 LED封装件， 其中， 所述 支撑部一体成型在所述底座上。
6、 如权利要求 1所述的用于直下式背光模组的 LED封装件， 其中， 所述 底座包括内部设置中空的罩盖， 所述罩盖呈半球状。
7、 一种直下式背光模组， 包括背板和扩散板， 所述背板上设有多个 LED 芯片， 其中， 所述直下式背光模组还包括多个 LED封装件， 所述多个 LED封装 件的一端分别对应盖设在所述多个 LED芯片上，所述多个 LED封装件相对的另 一端支撑固定所述扩散板。
8、 如权利要求 7所述的直下式背光模组， 其中， 所述任一个 LED封装件 包括： 装设在所述 LED芯片上的底座和自所述底座的表面延伸设置的支撑部， 所述支撑部的端头抵顶在所述扩散板上。
9、 如权利要求 8所述的直下式背光模组， 其中， 所述支撑部包括一端部连 接在所述底座上且直径渐缩收窄的支撑杆。
10、 如权利要求 9所述的直下式背光模组， 其中， 所述支撑杆一体成型在 所述底座上。
11、 如权利要求 8所述的直下式背光模组， 其中， 所述支撑部一体成型在 所述底座上。
12、 如权利要求 8所述的直下式背光模组， 其中， 所述底座包括内部设置 中空的罩盖， 所述罩盖呈半球状。
13、一种直下式背光模组， 包括背板和扩散板， 所述背板上设有 LED芯片， 其中， 所述直下式背光模组还包括 LED封装件， 所述 LED封装件包括：
装设在所述 LED芯片上的底座和自所述底座的表面延伸设置的支撑部， 所 述支撑部的端头抵顶在所述扩散板上。
14、 如权利要求 13所述的直下式背光模组， 其中， 所述支撑部包括一端部 连接在所述底座上的支撑杆。
15、 如权利要求 14所述的直下式背光模组， 其中， 所述支撑杆的直径渐缩 收窄。
16、 如权利要求 15所述的直下式背光模组， 其中， 所述支撑杆一体成型在 所述底座上。
17、 如权利要求 13所述的直下式背光模组， 其中， 所述支撑部一体成型在 所述底座上。
18、 如权利要求 13所述的直下式背光模组， 其中， 所述底座包括内部设置 中空的罩盖， 所述罩盖呈半球状。
PCT/CN2012/081052 2012-08-31 2012-09-06 一种直下式背光模组及其led封装件 Ceased WO2014032322A1 (zh)

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