WO2014024807A3 - Curable silicone composition and cured product thereof - Google Patents

Curable silicone composition and cured product thereof Download PDF

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Publication number
WO2014024807A3
WO2014024807A3 PCT/JP2013/071087 JP2013071087W WO2014024807A3 WO 2014024807 A3 WO2014024807 A3 WO 2014024807A3 JP 2013071087 W JP2013071087 W JP 2013071087W WO 2014024807 A3 WO2014024807 A3 WO 2014024807A3
Authority
WO
WIPO (PCT)
Prior art keywords
cured product
curable silicone
content
component
silicone composition
Prior art date
Application number
PCT/JP2013/071087
Other languages
French (fr)
Other versions
WO2014024807A2 (en
Inventor
Hiroji Enami
Toyohiko Fujisawa
Original Assignee
Dow Corning Toray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co., Ltd. filed Critical Dow Corning Toray Co., Ltd.
Priority to DE201311003995 priority Critical patent/DE112013003995T5/en
Publication of WO2014024807A2 publication Critical patent/WO2014024807A2/en
Publication of WO2014024807A3 publication Critical patent/WO2014024807A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invnetion relates to a curable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: RaSiO(4-a)/2 (in the formula, R is a halogen-substituted or unsubstituted monovalent hydrocarbon group, but from 0.1 to 2.1 mol% of the groups represented by R are alkenyl groups, and "a" is a number from 1.9 to 2.4); (B) an organopolysiloxane having an average of 2 silicon-bonded hydrogen atoms in a molecule, in an amount such that silicon-bonded hydrogen atoms in component (B) is from 0.1 to 3.0 moles relative to 1 mole of alkenyl groups in component (A); and (C) a platinum-based catalyst, wherein a content of component (C) is an amount such that a content of platinum atoms is from 10 to 100 ppm, in terms of mass units, relative to the present composition, and a content of each of sodium and potassium in the present composition is 3 ppm or less, in terms of mass units, relative to the present composition. The curable silicone composition forms a cured product having excellent heat resistance, and a cured product having excellent heat resistance.
PCT/JP2013/071087 2012-08-10 2013-07-29 Curable silicone composition and cured product thereof WO2014024807A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE201311003995 DE112013003995T5 (en) 2012-08-10 2013-07-29 Curable silicone composition and cured product thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012178613A JP6157073B2 (en) 2012-08-10 2012-08-10 Curable silicone composition and cured product thereof
JP2012-178613 2012-08-10

Publications (2)

Publication Number Publication Date
WO2014024807A2 WO2014024807A2 (en) 2014-02-13
WO2014024807A3 true WO2014024807A3 (en) 2014-04-03

Family

ID=48998663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/071087 WO2014024807A2 (en) 2012-08-10 2013-07-29 Curable silicone composition and cured product thereof

Country Status (4)

Country Link
JP (1) JP6157073B2 (en)
DE (1) DE112013003995T5 (en)
TW (1) TWI600716B (en)
WO (1) WO2014024807A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017094618A1 (en) 2015-11-30 2018-09-13 東レ株式会社 RESIN COMPOSITION, SHEET-LIKE MOLDED BODY, LIGHT-EMITTING DEVICE USING SAME, AND METHOD FOR PRODUCING THE SAME
WO2019240123A1 (en) 2018-06-12 2019-12-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Flame-retardant polyorganosiloxane composition, flame-retardant cured product, and optical member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040265599A1 (en) * 2001-10-03 2004-12-30 Yoshito Ushio Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59122558A (en) * 1982-12-29 1984-07-16 Toray Silicone Co Ltd Organopolysiloxane composition for coating of semiconductor element
JPS62181357A (en) * 1986-02-06 1987-08-08 Dow Corning Kk Polysiloxane gel composition
JPS6448859A (en) * 1987-08-19 1989-02-23 Shinetsu Chemical Co Silicone composition for impregnation of electronic component
JP2714729B2 (en) * 1991-06-18 1998-02-16 信越化学工業株式会社 Silicone composition for impregnating electronic parts and cured product thereof
US5283308A (en) * 1992-10-05 1994-02-01 Dow Corning Corporation Neutralization of polyorganosiloxanes using triorganosilanes and curable compositions containing said polyorganosiloxanes
JPH07300560A (en) * 1994-05-02 1995-11-14 Shin Etsu Chem Co Ltd Silicon composition
JP4565487B2 (en) * 2001-10-03 2010-10-20 東レ・ダウコーニング株式会社 Cross-linked silicone adhesive sheet and method for producing the same
JP2010106223A (en) * 2008-10-31 2010-05-13 Dow Corning Toray Co Ltd Sealing/filling agent for electric/electronic component and electric/electronic component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040265599A1 (en) * 2001-10-03 2004-12-30 Yoshito Ushio Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device

Also Published As

Publication number Publication date
TW201406866A (en) 2014-02-16
WO2014024807A2 (en) 2014-02-13
JP6157073B2 (en) 2017-07-05
JP2014034679A (en) 2014-02-24
TWI600716B (en) 2017-10-01
DE112013003995T5 (en) 2015-05-07

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