WO2014019444A1 - 一种电场强度的调节方法及系统 - Google Patents

一种电场强度的调节方法及系统 Download PDF

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Publication number
WO2014019444A1
WO2014019444A1 PCT/CN2013/079237 CN2013079237W WO2014019444A1 WO 2014019444 A1 WO2014019444 A1 WO 2014019444A1 CN 2013079237 W CN2013079237 W CN 2013079237W WO 2014019444 A1 WO2014019444 A1 WO 2014019444A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
capacitor plate
group
electric field
generated
Prior art date
Application number
PCT/CN2013/079237
Other languages
English (en)
French (fr)
Inventor
阳光
李琦
Original Assignee
北京联想软件有限公司
联想(北京)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201210268867.6A external-priority patent/CN103577003A/zh
Priority claimed from CN201210345544.2A external-priority patent/CN103677068B/zh
Application filed by 北京联想软件有限公司, 联想(北京)有限公司 filed Critical 北京联想软件有限公司
Priority to US14/348,256 priority Critical patent/US9494630B2/en
Publication of WO2014019444A1 publication Critical patent/WO2014019444A1/zh

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605Measuring capacitance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes

Definitions

  • the present application relates to the field of electric field detection, and in particular to a method and system for adjusting electric field strength.
  • Capacitance gap detection technology provides 3D input for the next generation touch, and the electric field generates an electric field to cover the detected object, thereby detecting the large separation between the detected object and the capacitor plate.
  • the existing capacitor plate set is fixedly arranged, and the intensity of the generated electric field is fixed, that is, the coverage of the generated electric field is limited, and the detected object at the electric field coverage cannot be effectively distanced. Detection.
  • the area of the touch positioning unit of the non-contact input device using the capacitive space gap detecting technology is increased, and when the total area of the capacitive screen is constant, the number of touch positioning units is reduced. Further, the accuracy of detection of the operating position by the non-contact input device is drastically lowered.
  • the technical problem to be solved by the present application is to provide a method for enhancing the electric field strength, which can adjust the electric field intensity generated by the capacitor plate to improve the detection accuracy of the object to be detected.
  • This application also provides an electric field strength adjustment system to ensure the implementation and application of the above method in practice.
  • the present application discloses a method for adjusting electric field strength, including:
  • the detecting capacitor threshold generated by the detecting capacitor plate group reaches a preset threshold value, including:
  • the changing the connection relationship between the capacitor plates in the capacitor plate group includes:
  • the detection capacitance generated by the second capacitor 1 ⁇ 4 ⁇ group in the vector direction can cover the object to be measured.
  • An electric field strength adjustment system comprising:
  • detecting unit configured to detect whether the threshold of the detection capacitance generated by the capacitor plate group reaches a preset probability of “Hi”;
  • an adjusting unit configured to: when the detecting unit detects that the detection capacitance threshold generated by the panel group reaches a preset threshold, change a relative position or a connection relationship between the capacitor plates in the capacitor group, and adjust The electric field strength generated by the capacitor group.
  • the detecting unit comprises:
  • a determining subunit configured to determine, when the detecting capacitance generated by the capacitor plate group cannot cover the detected object in the vector direction, determining that a threshold of a detection capacitance generated by the capacitor plate group reaches a preset threshold value.
  • the adjusting unit comprises:
  • the first adjusting subunit is configured to change an overall shape of the capacitor plate group such that the capacitor group forms a curvature in the vector direction.
  • the unit includes:
  • a second adjustment subunit configured to select at least two capacitor plates in the capacitor group; associate each selected capacitor plate group to form a second capacitor plate group; the second capacitor
  • the detection capacitance generated by the plate group in the vector direction can cover the object to be measured.
  • the ignition plate has at least two layers; the two layers of capacitor plates have a gap therebetween; and the two layers of capacitor plates each have a plurality of touch positioning units; The touch positioning units of one of the two layers of capacitive plates are staggered with respect to the touch positioning unit of another layer.
  • the touch positioning unit phase of one of the two layers of capacitor plates includes:
  • the two layers of electricity are respectively the first board and the second board
  • the first capacitor plate has the same distribution as the touch positioning unit of the second capacitor plate
  • the second capacitor plate is offset from the first capacitor plate by a first distance along a first direction, and is offset from the first circuit board by a second distance along a second direction;
  • the second direction is vertical.
  • the first distance is equal to the second distance.
  • the first distance is smaller than a length of the touch positioning unit along the first direction; and the second distance is smaller than a length of the touch positioning unit along the second direction.
  • the touch positioning unit is a diamond or a rectangle.
  • the two layers of capacitor plates have an isolation layer therebetween.
  • a protective layer is disposed above the two-layer capacitor plate.
  • the capacitor plate further includes: a third capacitor plate; a gap between the third capacitor and the second capacitor plate;
  • the third capacitor plate has the same distribution as the touch positioning unit of the first capacitor side and the second capacitor plate;
  • the third capacitor plate is offset from the second capacitor plate by a first distance along the first direction, and is offset from the second circuit board by a second distance along the second direction;
  • the second direction is vertical.
  • the first distance is equal to the second distance.
  • a method for adjusting the electric field strength is disclosed.
  • the threshold value of the detection capacitance generated by the detecting capacitor plate group reaches a preset threshold value
  • the capacitance between the capacitor plates in the capacitor plate group is changed.
  • the relative position or connection relationship adjusts the electric field strength generated by the capacitor plate group.
  • Applying the method for adjusting the electric field strength provided by the present application when the electric field intensity generated by the current capacitor 1 ⁇ 4 ⁇ group cannot cover the detected object, By changing the relative position or connection relationship between the respective capacitor plates, the electric field strength generated by the capacitor plate group is increased, so that the electric field intensity generated by the capacitor plate group can continue to cover the detected object, thereby contributing to the detected object. Detection accuracy.
  • Embodiment 1 is a flow chart of Embodiment 1 of a method for adjusting electric field strength according to the present application
  • Embodiment 2 is a further flow chart of Embodiment 1 of a method for adjusting electric field strength according to the present application;
  • Embodiment 3 is a flow chart of Embodiment 2 of a method for adjusting electric field strength according to the present application;
  • FIG. 4 is still another flow chart of Embodiment 1 of a method for adjusting electric field strength according to the present application
  • Embodiment 3 is a first schematic diagram of Embodiment 3 of a method for adjusting electric field strength according to the present application
  • Embodiment 6 is a second schematic diagram of Embodiment 3 of a method for adjusting electric field strength according to the present application.
  • FIG. 7 is a third schematic diagram of Embodiment 3 of a method for adjusting electric field strength according to the present application.
  • FIG. 8 is a first schematic view of a fourth embodiment of a method for adjusting electric field strength according to the present application.
  • FIG. 9 is a second schematic view of a fourth embodiment of a method for adjusting electric field strength according to the present application.
  • FIG. 10 is a third schematic diagram of Embodiment 4 of a method for adjusting electric field strength according to the present application.
  • Figure 11 is a schematic structural view of Embodiment 1 of an electric field strength adjusting system of the present application.
  • Figure 12 is a schematic view showing the structure of a second embodiment of an electric field strength adjusting system of the present application.
  • FIG. 13 is an electrical implementation of an electric field strength adjustment system of the present application A schematic diagram of the structure of the first example.
  • Figure 14 is a plan view showing the first embodiment of the electric field strength adjusting system of the present application.
  • 15 is a schematic diagram of one mode of staggered distribution of touch positioning units of an electric field intensity adjustment system of the present application
  • Figure 16 is a schematic view showing the second embodiment of the electric field strength adjusting system of the present application.
  • 17 is a schematic diagram of an embodiment 3 of an electric field strength adjusting system of the present application.
  • FIG. 18 is a schematic diagram showing the length of a rectangular touch positioning unit in the third embodiment of the electric field strength adjusting system of the present application.
  • FIG. 19 is a schematic diagram showing the length of a diamond-shaped touch positioning unit in Embodiment 3 of an electric field strength adjusting system of the present application;
  • 20 is a schematic diagram of an embodiment 4 of an electric field strength adjusting system of the present application.
  • Figure 21 is a schematic view showing the fifth embodiment of the electric field strength adjusting system of the present application.
  • 22 is a schematic diagram of an embodiment 6 of an electric field strength adjusting system of the present application.
  • Figure 23 is a schematic view showing the seventh embodiment of the electric field strength adjusting system of the present application.
  • Figure 24 is a schematic view showing an eighth embodiment of the electric power intensity adjustment system of the present application.
  • Figure 25 is a schematic view showing an electric ninth embodiment of an electric field strength adjusting system of the present application.
  • 26 is a schematic diagram of an electric tenth embodiment of an electric field strength adjusting system of the present application. detailed description
  • This application can be used in a variety of general purpose or special purpose computing device environments or configurations.
  • personal computer server computer, handheld device or portable device, tablet device, multi-processor device, distributed computing environment including any of the above devices or devices, and the like.
  • FIG. 1 a method flow diagram of a method for adjusting electric field strength according to the present application is shown, which includes:
  • Step S101 When detecting the threshold value of the detection capacitance generated by the capacitor plate group reaches a critical value, step S102 is performed;
  • the application of the capacitor plate group generates an electric field to cover the measured object, thereby detecting the distance between the measured object and the electric plate, when the distance between the detected object and the electric plate group is far away, more than electricity » When the coverage of the board group is reached, it is impossible to complete the detected object and electricity at this time! Detection of the distance between groups.
  • the present application provides a method for detecting whether a threshold value of a detection capacitance generated by a capacitor plate group reaches a critical value.
  • the execution process is as shown in FIG. 2, and includes:
  • Step S201 determining a vector direction of the detected object relative to the panel
  • Step S202 determining whether the detection capacitance generated by the capacitor group can cover the detected object in the vector direction, and if not, executing step S203;
  • Step S203 determining that the detection capacitance threshold generated by the capacitor group reaches a preset state
  • step S102 is performed.
  • Step S102 changing a relative position or a connection relationship between the respective capacitors 3 ⁇ 4 in the capacitor group;
  • the relative position between the capacitor plates in the changing capacitor group includes:
  • the curvature is a convex curvature of the entire capacitor plate formed by each of the capacitor plates in the capacitor group, and the capacitance of the capacitor generated by the capacitor plate group having a certain curvature at this time Greater than the detection capacitance generated by the initial capacitor 3 ⁇ 4 group.
  • the present application provides an example for how to change the relative position between the capacitor plates in the capacitor plate group, as follows:
  • FIG. 5 is an electric group including a capacitor la, an electric device 2a, an electric 3a, and an electric device; when the detecting capacitance generated by the electric group cannot cover the measured object
  • the overall shape of the capacitor group after changing the position is as shown in FIG. 6.
  • the capacitance of the capacitor ⁇ group after changing the overall shape is greater than the intensity of the detection capacitance generated by the initial capacitor plate group in the vector direction relative to the object to be measured.
  • Step S301 Presetting at least two groups of electrical groups; wherein the maximum capacitance of the detecting capacitors generated by each of the groups is different; [98] Step S302: determining whether the current detection threshold of the detected capacitance relative to the detected object reaches a preset threshold; if yes, step S303;
  • Step S303 Switch the current board group to the first board group; the maximum capacitance of the first generating group generating detecting capacitor is greater than the maximum intensity of the detecting capacitor generated by the current capacitor board group.
  • the board la, the electric ⁇ 3 ⁇ 4! 2a, the electric ⁇ 3a and the electric board 4a constitute the current capacitor plate, and the detection capacitance is generated to cover the object to be measured;
  • the capacitor plate lb, the capacitor plate 2b, the capacitor H 3b and the capacitor 4b are the first capacitor group 3 ⁇ 4, in the process of generating electric field coverage of the detected object by the current capacitor plate group, the first electricity
  • the board group is a spare capacitor plate group, and no detection capacitance is generated.
  • the detection capacitance generated by the current capacitor plate group reaches a preset threshold value, and when the detection object cannot be covered, the current capacitor plate group is stopped to generate a detection capacitance.
  • a capacitor 1 ⁇ 4 ⁇ group generates a detection capacitor to perform electric field coverage on the object to be measured.
  • the concave curvature is formed between the electric board 2b and the electric motor 3b in the first electric group, and the capacitance between the capacitor plates is increased due to the existence of the concave curvature. Induction, thereby increasing the electric field strength generated by the overall capacitive plate set.
  • Step S401 selecting at least two capacitor plates in the capacitor plate group
  • Step S402 Associate the selected capacitors 3 ⁇ 4 to form a second capacitor plate group; the detection capacitance generated by the second capacitor plate group in the vector direction can cover the object to be measured.
  • the electric board lc, the electric board 2c, the electric board 3c and the capacitor board 4c form a capacitor plate group, and the detecting capacitor generates electric field coverage for the object A to be tested.
  • the detection capacitance generated by the capacitor group reaches a preset threshold and cannot cover the electric field of the measured object, the connection relationship between the capacitor plate lc, the capacitor plate 2c, the electric plate 3c and the electric plate 4c is changed; [109]
  • One of the changes can be seen in Fig. 9.
  • the change in the connection relationship between the capacitors 3 ⁇ 4 in Fig. 9 causes the new capacitor plate group to be formed to produce a concave curvature. This principle changes the capacitance poles as described above. The execution of the relative positions between the plates is consistent.
  • FIG. 10 Another implementation can be seen in FIG. 10, and a plurality of electric devices can be placed for different objects to be tested.
  • the respective positions are different, such as For a certain object A, select the electric device 3 ⁇ 4 ld, the capacitor plate 2d, the capacitor plate 3d and the capacitor plate 4d to form a capacitor ⁇ E a, which can generate the detection capacitance to the electric field coverage of the object A to be measured.
  • Step S103 Adjust the intensity generated by the capacitor 3 ⁇ 4 group.
  • the adjustment of the electric field intensity generated by the capacitor plate group can be achieved, so that the detected object can be detected better, and the detection precision and the precise detection distance can be obtained.
  • an electric field strength adjusting system which system may include:
  • the detecting unit 501 is configured to detect whether the threshold of the detection capacitance generated by the capacitor plate group reaches a preset threshold value
  • the adjusting unit 502 is configured to change the relative position between the capacitor plates in the capacitor plate group when the detecting unit 501 detects that the detection capacitance threshold generated by the capacitor group reaches a preset threshold. Or a connection relationship that adjusts the electric field strength generated by the capacitor plate set.
  • FIG. 12 A schematic diagram of the structure of the second example, as shown in FIG. 12, wherein:
  • the detecting unit 501 includes:
  • the determining subunit 503 is configured to determine a vector direction of the detected object relative to the set of capacitors
  • the determining sub-unit 504 is configured to determine that the detection capacitance threshold generated by the capacitor plate group reaches a pre-determination when the detecting capacitance generated by the capacitor group cannot cover the detected object in the vector direction. Set the threshold.
  • the adjustment unit 502 includes:
  • the first adjusting subunit 505 is configured to change an overall shape of the capacitor plate group, so that the capacitor plate group forms a curvature in the vector direction.
  • a second adjustment subunit 506 configured to select at least two capacitor plates in the capacitor plate group; associate each selected capacitor plate group to form a second capacitor plate group; The detection capacitance generated by the two capacitor plate groups in the vector direction can cover the object to be measured.
  • the capacitor plate has at least two layers; the two layers of capacitor plates have a gap; and the two layers of capacitor plates each have a plurality of Touching the positioning unit; the touch positioning unit of one of the two layers of capacitive plates is staggered with respect to the touch positioning unit of another layer.
  • Figure 13 is a schematic view showing the first embodiment of the electric power intensity adjusting system of the present application.
  • the device includes at least a capacitor 3 ⁇ 4 101 and a capacitor W 102.
  • both the capacitor plate 101 and the capacitor 102 can have multiple touch positioning units (not shown in FIG. 13).
  • the touch location unit can be of various shapes, such as diamonds, squares, and the like.
  • Figure 14 is a plan view showing a first embodiment of the electric power intensity adjustment system of the present application. As can be seen from Fig. 14, the electric ⁇ 101 and the electric board 102 are staggered.
  • the area of the touch positioning unit must be sufficiently large. This is because the larger the area of the board, the farther the electrical sensing distance is, the non-contact capacitive sensing input can be realized. However, the total area of the capacitor plates is constant. When the area of a single touch positioning unit is increased, the number of touch positioning units on the capacitor plates is reduced. The number of touch positioning units is reduced, resulting in a decrease in the positioning accuracy of the electric power.
  • FIG. 15 is a schematic diagram of a manner in which the touch positioning units are staggered in a first embodiment of an electric field strength adjusting system of the present application.
  • the touch positioning units 311, 312, and 313 are touch positioning units of the upper capacitor plates.
  • the touch positioning units 321, 322, and 323 are touch positioning units of the lower capacitor plates.
  • the touch positioning unit of the upper capacitor plate is staggered with the touch positioning unit of the lower capacitor plate.
  • the midpoint of the touch positioning unit 321 is located between the touch positioning unit 311 and the touch positioning unit 312.
  • the midpoint of the positioning unit 322 is located between the touch positioning unit 312 and the touch positioning unit 313.
  • the position of the touch positioning unit is considered to be the position at which the non-contact input operation is performed. If there is only one layer of the capacitor plate, only the area shown in Fig. 3 can be divided into three small touch areas, that is, the position where only the contactless input operation can be sensed is located at the touch positioning unit 311 or 312 or 313.
  • the two-layer electric power of the staggered distribution in Fig. 3 is employed, when the position of the non-contact input operation is located between the touch positioning units 311 and 312, it can be sensed by the touch positioning unit 321 .
  • the electric board of the electric field intensity adjusting system of the present embodiment improves the detection accuracy for the operating position on the premise of the induction non-contact operation.
  • FIG. 16 is a schematic diagram of an electric second embodiment of an electric field strength adjustment system of the present application.
  • the touch positioning unit of the capacitor plate 401 and the capacitor plate 402 is rectangular.
  • the wiring between the respective touch positioning units on the capacitor 3 ⁇ 4 is not shown in FIG.
  • the capacitive plate 401 has the same score as the touch positioning unit of the capacitor plate 402. Cloth.
  • Capacitor plates 401 are located above capacitor 402 and are staggered with capacitor plates 402.
  • the electric current 401 is shifted by a first distance d1 in the X direction with respect to the electric power, and a second distance d2 is opened in the Y direction.
  • the X direction and the Y direction are perpendicular to each other.
  • dl and d2 are a more common scheme.
  • FIG. 17 is a schematic diagram of a third embodiment of an electric panel of an electric field strength adjustment system of the present application.
  • the connections between the various touch location units on the electrical board 401 are shown in FIG.
  • the first distance is smaller than a length of the touch positioning unit along the first direction; the second distance is less than one Touching the length of the positioning unit along the second direction.
  • FIG. 18 is a schematic view showing the length of a rectangular touch positioning unit in the third embodiment of the electric field strength adjusting system of the present application.
  • the length of the touch positioning unit along the first direction is L1
  • the length along the second direction is L2.
  • the first distance d1 of the second capacitor plate offset from the first capacitor plate in the first direction may be smaller than L1
  • the second capacitor plate is offset from the first capacitor plate in the second direction.
  • the distance d2 can be less than L2.
  • FIG. 19 is a schematic diagram showing the length of the diamond-shaped touch positioning unit in the third embodiment of the electric field strength adjustment system of the present application.
  • the length of the touch positioning unit along the first direction is L3, and the length along the second direction is L4.
  • the first distance d1 of the second capacitor plate that is offset from the first capacitor plate in the first direction may be smaller than L3, and the second electrode is offset from the first circuit board by a second direction.
  • the distance d2 can be less than L4.
  • Figure 20 is a schematic view showing a fourth embodiment of an electric plate of an electric field strength adjusting system of the present application. As shown in FIG. 8, the device includes at least a capacitor plate 101 and electricity.
  • isolation layer 103 between the electrical plate 101 and the electrical plate 102.
  • the isolation layer 103 is disposed to prevent the capacitive plate 101 from coming into contact with the capacitor plate 102, thereby improving the non-contact input device of the present invention. Stability.
  • the device includes at least a capacitor plate 101 and a capacitor plate 102.
  • a protective layer 104 is disposed above the capacitor plate 101. The protective layer The setting of 104 prevents the scratching of the capacitor plate 101 by other objects.
  • Fig. 22 is a schematic view showing the sixth embodiment of the electric board of the electric field strength adjusting system of the present application.
  • the capacitor plate in the system has the following structure: at least a capacitor plate 101 and a capacitor plate 102.
  • a protective layer 104 is disposed above the capacitor plate 101. Capacitor plate 101 and electricity
  • isolation layer 103 between 102.
  • Figure 23 is a schematic view showing the seventh embodiment of the electric field of the electric field strength adjusting system of the present application.
  • the structure of the electrical circuit of the system further includes a power supply; the electrical circuit 105 has a gap with the electrical circuit 102;
  • the capacitor plate 105 has the same distribution as the capacitive positioning unit of the capacitor side 101 and the capacitor plate 102;
  • the capacitor 105 is offset from the capacitor plate 102 by a first distance in a first direction, and is offset from the electric 102 by a second distance in a second direction; the first direction is perpendicular to the second direction.
  • the first distance is equal to the second distance, which is a common implementation.
  • Figure 24 is a schematic diagram of an eighth embodiment of an electric field strength adjusting system of the present application.
  • the device includes a capacitor plate 101, a capacitor plate 102, and an electric device 105.
  • a protective layer 104 is disposed above the electric 101.
  • the protective layer 104 is disposed to prevent scratching of the capacitor plate 101 by other objects.
  • Figure 25 is a schematic view showing an electric ninth embodiment of an electric field strength adjusting system of the present application.
  • the device includes a capacitor plate 101, a capacitor plate 102, and a capacitor machine 105.
  • An isolation layer 103 is provided between the capacitor 3 ⁇ 4 101 and the capacitor H 102.
  • An isolation layer 103 is also provided between the capacitor plate 102 and the capacitor plate 105. The isolation layer 103 is placed to prevent adjacent capacitive plates from contacting, improving the stability of the system's non-contact input.
  • Example 26 is an electrical implementation of an electric field strength adjustment system of the present application A schematic diagram of Example 10. As shown in FIG. 26, the device includes a capacitor plate 101, a capacitor plate 102, and a capacitor machine 105. An isolation layer 103 is provided between the capacitor 3 ⁇ 4 101 and the capacitor H 102. An isolation layer 103 is also provided between the capacitor plate 102 and the capacitor plate 105. A protective layer 104 is disposed above the capacitor plate 101.
  • an isolation layer may be disposed between adjacent two capacitor plates, and a protective layer may be disposed above the outermost capacitor 3 ⁇ 4.
  • the present application provides a non-contact input device, and the structure of the device can be referred to FIG.
  • the apparatus includes at least an electric board 101 and an electric board 102.
  • both the capacitor 101 and the capacitor 102 can have multiple touch positioning units (not shown in FIG. 13).
  • the touch positioning unit may be in various shapes such as a diamond shape, a square shape, or the like.
  • FIG. 14 A top view of the non-contact input device embodiment 1 of the present application can be referred to FIG. As can be seen from Fig. 14, the electric ⁇ 101 and the electric ⁇ 102 are staggered.
  • the area of the touch positioning unit must be sufficiently large. This is because the larger the area of the board, the farther the electrical sensing distance is, the non-contact capacitive sensing input can be realized.
  • the total area of the capacitor plates is constant. When the area of a single touch positioning unit is increased, the number of touch positioning units on the capacitor plates is reduced. The number of touch positioning units is reduced, resulting in a decrease in the positioning accuracy of the electric power.
  • FIG. 15 A schematic diagram of one way of staggering the touch positioning units of the two capacitor plates of the present application can be referred to FIG.
  • the touch positioning units 311, 312, and 313 are touch positioning units of the upper capacitor plates.
  • the touch positioning units 321, 322, and 323 are touch positioning units of the lower capacitor plates.
  • the touch positioning unit of the upper capacitor plate and The touch positioning unit of the lower layer of the electric board is staggered.
  • the midpoint of the touch positioning unit 321 is located between the touch positioning unit 311 and the touch positioning unit 312, and the midpoint of the touch positioning unit 322 is located in the touch positioning. Between the unit 312 and the touch positioning unit 313.
  • the position of the touch positioning unit is considered to be the position at which the non-contact input operation is performed. If there is only one layer of capacitive plates, only the area shown in FIG. 3 can be divided into three small touch areas, that is, the position where only the contactless input operation can be sensed is located at the touch positioning unit 311 or 312 or 313.
  • the two-layer capacitive plates of the staggered distribution in FIG. 15 are employed, when the position of the non-contact input operation is located between the touch positioning units 311 and 312, they can be sensed by the touch positioning unit 321.
  • the non-contact input device of the present embodiment improves the detection accuracy for the operation position on the premise of sensing the non-contact operation.
  • FIG. 4 A schematic diagram of the non-contact input device embodiment 2 of the present application can be referred to FIG.
  • the touch positioning unit of the capacitor 401 and the capacitor 402 is rectangular.
  • the wiring between the respective touch positioning units on the capacitor 3 ⁇ 4 is not shown in FIG.
  • the capacitor 401 has the same distribution as the touch positioning unit of the capacitor 402.
  • the capacitor plate 401 is located above the capacitor 3 ⁇ 4 402 and is staggered with the capacitor plate 402.
  • the electric 401 is shifted by a first distance d1 in the X direction with respect to the electric motor 402, and a second distance d2 is opened in the Y direction.
  • the X direction and the Y direction are perpendicular to each other.
  • dl and d2 are a more common scheme.
  • FIG. 16 A schematic diagram of the capacitor plate of Embodiment 2 of the non-contact input device of the present application can be referred to FIG. The connection between the respective touch locating units on the capacitor 401 is shown in FIG.
  • the first distance is smaller than a length of the touch positioning unit along the first direction; the second distance is less than one Touching the length of the positioning unit along the second direction.
  • FIG. 18 A schematic diagram of the length of the capacitor 3 ⁇ 4 rectangular touch positioning unit of the contactless input device embodiment 2 of the present application can be referred to FIG. 18.
  • the length of the touch positioning unit along the first direction is L1
  • the length along the second direction is L2.
  • the first distance d1 of the second capacitor plate that is offset from the first capacitor plate in the first direction may be smaller than L1
  • the second capacitor plate is offset from the first capacitor plate by a second direction.
  • distance D2 can be smaller than L2.
  • FIG. 19 A schematic diagram of the length of the capacitive plate diamond touch positioning unit of the non-contact input device embodiment 2 of the present application can be referred to FIG.
  • the length of the touch positioning unit in the first direction is L3, and the length in the second direction is L4.
  • the first distance d1 of the second capacitor plate offset from the first capacitor plate in the first direction may be less than L3, and the second capacitor plate is offset from the first capacitor plate in the second direction.
  • the distance d2 can be less than L4.
  • FIG. 20 A schematic diagram of the non-contact input device embodiment 2 of the present application can be referred to FIG.
  • the device includes at least a capacitor plate 101 and a capacitor plate 102.
  • an isolation layer 103 is provided between the capacitor 101 and the capacitor H 102. The arrangement of the isolation layer 103 prevents the capacitor plate 101 from coming into contact with the capacitor plate 102, improving the stability of the non-contact input device of the present invention.
  • FIG. 21 A schematic diagram of the non-contact input device embodiment 3 of the present application can be referred to FIG.
  • the device includes at least a capacitor plate 101 and a capacitor plate 102.
  • a protective layer 104 is disposed above the capacitor plate 101.
  • the protective layer 104 is disposed to prevent scratching of the capacitor plate 101 by other objects.
  • FIG. 22 A schematic diagram of the non-contact input device embodiment 4 of the present application can be referred to Fig. 22.
  • the apparatus includes at least a capacitor plate 101 and a board 102.
  • a protective layer 104 is disposed above the capacitor plate 101.
  • An isolation layer 103 is disposed between the capacitor plate 101 and the capacitor plate 102.
  • FIG. 23 A schematic diagram of the non-contact input device embodiment 5 of the present application can be referred to FIG.
  • the device further includes a capacitor plate 105; the capacitor plate 105 and the battery
  • the capacitance machine H 105 has the same distribution as the capacitive side 101 and the touch positioning unit of the capacitor 102;
  • the capacitor 105 is offset from the capacitor plate 102 by a first distance in a first direction, and is offset from the electric 102 by a second distance in a second direction; the first direction is perpendicular to the second direction.
  • the first distance is equal to the second distance, which is a common implementation.
  • FIG. 24 A schematic diagram of the non-contact input device embodiment 6 of the present application can be referred to FIG.
  • the device includes a capacitor plate 101, a capacitor plate 102, and a capacitor plate 105.
  • a protective layer 104 is disposed above the electric 101.
  • the protective layer 104 is disposed to prevent scratching of the capacitor plate 101 by other objects.
  • FIG. 25 A schematic diagram of the non-contact input device embodiment 7 of the present application can be referred to FIG.
  • the device includes a capacitor plate 101, a capacitor plate 102, and a capacitor plate 105.
  • An isolation layer 103 is also provided between the capacitors 102 and the capacitor plates 105.
  • the isolation layer 103 is disposed to prevent adjacent capacitive plates from contacting, improving the stability of the non-contact input device of the present application.
  • FIG. 26 A schematic diagram of the non-contact input device embodiment 8 of the present application can be referred to FIG.
  • the device includes a capacitor plate 101, a capacitor plate 102, and a capacitor plate 105.
  • An isolation layer 103 is also provided between the capacitors 102 and the capacitor plates 105.
  • a protective layer 104 is disposed above the capacitor plate 101.
  • an isolation layer may be disposed between adjacent two capacitor plates, and a protective layer may be disposed on the outermost capacitor plate.
  • the invention also discloses an electronic device.
  • the electronic device includes a contactless input device in the present solution.
  • the present application can be implemented by means of software plus a necessary general hardware platform. Based on such understanding, the technical solution of the present application, which is essential or contributes to the prior art, may be embodied in the form of a software product, which may be stored in a storage medium such as a ROM/RAM or a disk. , an optical disk, etc., includes instructions for causing a computer device (which may be a personal computer, server, or network device, etc.) to perform the methods described in various embodiments of the present application or portions of the embodiments.
  • a computer device which may be a personal computer, server, or network device, etc.

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Abstract

本申请提供了一种电场强度的调节方法,包括:检测电容极板组产生的探测电容阈值达到预设临界值时,改变所述电容极板组中各个电容极板之间的相对位置或连接关系,调节所述电容极板组产生的电场强度。应用本申请提供的电场强度调节方法,当电容极板组产生的电场强度不能对被检测物体进行覆盖时,通过改变各个电之间的相对位置或连接关系,增大电容极板组产生的电场强度,使电容极板组产生的电场强度能够继续对被检测物体进行覆盖。

Description

一种电场强度的调节方法及系统
[01] 本申请要求于 2012年 7 月 30 日提交中国专利局、 申请号为 201210268867.6, 发明名称为 "一种非接触式输入装置及电子设备" 以及 2012年 9月 17日提交中国专利局、申清号为 201210345544.2、 发明名称为 "一种电场强度的调节方法及系统" 的中国专利申请的 优先权, 其全部内容通过引用结合在本申请中。
技术领域
[02] 本申请涉及电场检测领域, 特别涉及一种电场强度的调节方法 及系统。
背景技术
[03] 电容隔空检测技术为下一代 touch提供 3D输入,通过电 板 产生电场对被检测物体进行覆盖, 从而检测被检测物体与电容极板 之间的 ]ί巨离。
[04] 现有的电容极板组是固定设置的, 其产生的电场的强度是固定 的, 即产生电场的覆盖范围有限, 对处于电场覆盖范围之夕卜的被检 测物体不能进行有效的距离检测。
[05] 同时, 现有技术中的应用电容隔空检测技术的非接触式输入装 置的触摸定位单元的面积增大, 在电容屏的总面积一定的情况下, 导致触摸定位单元的个数减少, 进而导致非接触式输入装置对于操 作位置的检测精度急剧下降。
发明内容
[06] 本申请所要解决的技术问题是提供一种电场强度的增强方法, 能够对电容极板产生的电场强度进行调节, 提升对被检测物体的检 测精度。
[07] 本申清还提供了一种电场强度的调节系统, 用以保证上述方法 在实际中的实现及应用。 [08] 为了解决上述问题, 本申请公开了一种电场强度的调节方法, 包括:
[09] 检测电容 ¾ 组产生的探测电容阈值达到预设临界值时,
[10] 改变所述电容 组中各个电容 ¾!之间的相对位置或连接关 系,
[11] 调节所述电容 ¾ 组产生的电场强度。
[12] 上述的方法, 可选的, 所述检测电容极板组产生的探测电容阈 值达到预设临界值包括:
[13] 确定被检测物体相对所述电 »板组的矢量方向;
[14] 当所述电容极板组产生的探测电容在所述矢量方向上不能覆盖 所述被检测物体时, 判定所述电容极板组产生的探测电容阈值达到
Figure imgf000004_0001
[15] 上述的方法, 可选的, 所述改变电容极板组中各个电容极板之 间的相对位置包括:
[16] 改变所述电容极板组的整体形状, 使所述电容极板组在所述矢 量方向上形成曲度。
[17] 上述的方法, 可选的, 在执行所述方法前, 还包括:
[18] 预设至少两组电^ ϋ组; 其中各个电^ *板组所产生探测电 容的最大电容不同。
[19] 上述的方法, 可选的, 还包括:
[20] 当检测到当前电 ¾ 板组相对被检测物体产生的探测电容阈值 达到预设临^ Hi时,
[21] 将所述当前电 板组切换为第一电容极板组; 所述第一极板 组产生探测电容的最大电容大于当前电容¾ 组产生探测电容的最 大电容。
[22] 上述的方法, 可选的, 所述改变电容极板组中各个电容极板之 间的连接关系包括:
[23] 在所述电容 ¾ 组中选取至少两个电容 ¼ [24] 对选取的各个电容 ¾ 进行关联, 组成第二电容极板组;
[25] 所述第二电容 ¼^组在所述矢量方向上产生的探测电容能够覆 盖被测物体。
[26] 一种电场强度的调节系统, 包括:
[27] 检测单元, 用于检测电容极板组产生的探测电容阈值是否达到 预设临 ^Hi;
[28] 调节单元, 用于当所述检测单元检测电 板组产生的探测电 容阈值达到预设临界值时, 改变所述电容 ¾ 组中各个电容极板之 间的相对位置或连接关系, 调节所述电容^ ϋ组产生的电场强度。
[29] 上述的系统, 可选的, 所述检测单元包括:
[30] 确定子单元, 用于确定被检测物体相对所述电容极板组的矢量 方向;
[31] 判定子单元, 用于当所述电容极板组产生的探测电容在所述矢 量方向不能覆盖所述被检测物体时, 判定所述电容极板组产生的探 测电容阈值达到预设临界值。
[32] 上述的系统, 可选的, 所述調节单元包括:
[33] 第一调节子单元, 用于改变所述电容极板组的整体形状, 使所 述电容¾ 组在所述矢量方向上形成曲度。
[34] 上述的系统, 可选的, 所述蜩节单元包括:
[35] 第二调节子单元, 用于在所述电容 ¾ 组中选取至少两个电容 极板; 对选取的各个电容极板组进行关联, 组成第二电容极板组; 所述第二电容极板组在所述矢量方向上产生的探测电容能够覆盖被 测物体。
[36] 上述的系统中, 可选地, 所述点燃极板至少为两层; 所述两层 电容极板之间具有间隙; 所述两层电容极板均具有多个触摸定位单 元; 所述两层电容极板的其中一层的所述触摸定位单元相对于另一 层的所述触摸定位单元交错分布。
[37] 可选的, 所述两层电容极板的其中一层的所述触摸定位单元相 对于另一层的所述触摸定位单元交错分布, 包括:
[38] 所述两层电 ^分别为第一电 板和第二电
[39] 所述第一电容极板与所述第二电容极板的触摸定位单元的分布 相同;
[40] 所述第二电容极板沿第一方向与所述第一电容极板错开第一距 离, 沿第二方向与所述第一电 »板错开第二距离; 所述第一方向 与所述第二方向垂直。
[41] 可选的, 所述第一距离与所述第二距离相等。
[42] 可选的, 所述第一距离小于一个所述触摸定位单元沿所述第一 方向的长度; 所述第二距离小于一个所述触摸定位单元沿所述第二 方向的长度。
[43] 可选的, 所述触摸定位单元为菱形或矩形。
[44] 可选的, 所述两层电容极板之间具有隔离层。
[45] 可选的, 所述两层电容极板的上方设置有保护层。
[46] 可选的, 所述电容极板还包括: 第三电容极板; 所述第三电容 ^^与所述第二电容极板之间具有间隙;
[47] 所述第三电容极板与所述第一电容侧和所述第二电容极板的触 摸定位单元的分布相同;
[48] 所述第三电容极板沿第一方向与所述第二电容极板错开第一距 离, 沿第二方向与所述第二电 »板错开第二距离; 所述第一方向 与所述第二方向垂直。
[49] 可选的, 所述第一距离与所述第二距离相等。
[50] 与现有技^ M目比, 本申请包括以下优点:
[51] 在本申请中公开了一种电场强度的调节方法, 当检测电容极板 组产生的探测电容阈值达到预设临界值时, 改变所述电容极板组中 各个电容¼ ^之间的相对位置或连接关系, 调节所述电容极板组产 生的电场强度。 应用。 应用本申请提供的电场强度的调节方法, 当 当前电容¼ ^组产生的电场强度不能对被检测物体进行覆盖时, 通 过改变各个电容极板之间的相对位置或连接关系, 增大电容极板组 产生的电场强度, 使电容极板组产生的电场强度能够继续对被检测 物体进行覆盖, 从而提成对被检测物体的检测精度。
附图说明
[52] 图 1是本申请的一种电场强度的调节方法实施例一的流程图;
[53] 图 2是本申请的一种电场强度的调节方法实施例一的又一流程 图;
[54] 图 3是本申请的一种电场强度的调节方法实施例二的流程图;
[55] 图 4是本申请的一种电场强度的调节方法实施例一的又一流程 图;
[56] 图 5为本申请的一种电场强度的调节方法实施例三的第一示意 图;
[57] 图 6为本申请的一种电场强度的调节方法实施例三的第二示意 图;
[58] 图 7为本申请的一种电场强度的调节方法实施例三的第三示意 图;
[59] 图 8为本申请的一种电场强度的调节方法的实施例四的第一示 意图;
[60] 图 9为本申请的一种电场强度的调节方法的实施例四的第二示 意图;
[61] 图 10 为本申请的一种电场强度的调节方法的实施例四的第三 示意图;
[62] 图 11 为本申请的一种电场强度的调节系统的实施例一的结构 示意图;
[63] 图 12 为本申请的一种电场强度的调节系统的实施例二的结构 示意图。
[64] 图 13 为本申请的一种电场强度的调节系统的电 的实施 例一的结构示意图。
[65] 图 14 为本申请的一种电场强度的调节系统的电 的实施 例一的俯视图;
[66] 图 15 为本申请的一种电场强度的调节系统的电 的实施 例一的触摸定位单元交错分布的一种方式的示意图;
[67] 图 16 为本申请的一种电场强度的调节系统的电 的实施 例二的示意图;
[68] 图 17 为本申请的一种电场强度的调节系统的电 的实施 例三的示意图;
[69] 图 18 为本申请的一种电场强度的调节系统的电 的实施 例三中矩形触摸定位单元的长度示意图;
[70] 图 19 为本申请的一种电场强度的调节系统的电 的实施 例三中菱形触摸定位单元的长度示意图;
[71] 图 20 为本申请的一种电场强度的调节系统的电 的实施 例四的示意图;
[72] 图 21 为本申请的一种电场强度的调节系统的电 的实施 例五的示意图;
[73] 图 22 为本申请的一种电场强度的调节系统的电 的实施 例六的示意图;
[74] 图 23 为本申请的一种电场强度的调节系统的电 的实施 例七的示意图;
[75] 图 24 为本申请的一种电场强度的调节系统的电 的实施 例八的示意图;
[76] 图 25 为本申请的一种电场强度的调节系统的电 的实施 例九的示意图。
[77] 图 26 为本申请的一种电场强度的调节系统的电 的实施 例十的示意图。 具体实施方式
[78] 下面将结合本申请实施例中的附图, 对本申请实施例中的技术 方案进行清楚、 完整地描述, 显然, 所描述的实施例仅仅是本申请 一部分实施例, 而不是全部的实施例。 基于本申请中的实施例, 本 实施例, 都属于本申请保护的范围。
[79] 本申请可用于众多通用或专用的计算装置环境或配置中。例如: 个人计算机、服务器计算机、 手持设备或便携式设备、 平板型设备、 多处理器装置、 包括以上任何装置或设备的分布式计算环境等等。
[80]
[81] 参考图 1, 示出了本申请一种电场强度的调节方法的方法流程 图, 包括:
[82] 步骤 S101:检测电容极板组产生的探测电容阈值达到与临界值 时, 执行步骤 S 102;
[83] 应用电容极板组产生电场对被测物体进行覆盖, 从而检测被测 物体与电 板之间的距离时, 当被检测物体距离电»板组之间 的距离很远, 超过电 »板组的覆盖范围时, 此时不能艮好的完成 被检测物体与电 ¾!组之间距离的检测。
[84] 本申请中提供了一种检测电容极板组产生的探测电容阈值是否 达到临界值的方法, 其执行过程如图 2所示, 包括:
[85] 步骤 S201: 确定被检测物体相对所述电 板组的矢量方向;
[86] 步骤 S202: 判断电容 ¼^组产生的探测电容在所述矢量方向上 是否能够覆盖被检测物体, 如果否, 执行步骤 S203;
[87] 步骤 S203: 判定所述电容 ¾ 组产生的探测电容阈值达到预设 临
[88] 电容极板组产生探测电容对被测物体进行覆盖时, 由于电容极 板组的摆放位置及方向等因素, 电容极板组与被测物体之间存在一 矢量方向, 在所述矢量方向上电容极板组产生的探测电容可能并不 是电容极板组所能产生的最大电容, 当所述电容极板组在所述矢量 方向上产生的探测电容阈值达到临界值, 即不能对被测物体进行覆 盖时, 即执行步骤 S102。
[89] 步骤 S102: 改变所述电容 ¾ 组中各个电容 ¾ 之间的相对位 置或连接关系;
[90] 当电容极板组在所述矢量方向上, 产生的探测电容不能对被测 物体进行覆盖时, 可以通过改变所述电容¼ ^组中各个电容极板之 间的相对位置或连接关系来增大电容极板组产生的电容强度。
[91] 其中, 所述改变电容 ¾ 组中各个电容极板之间的相对位置包 括 ··
[92] 改变所述电容 ¼^ a的整体形状, 使所述电容极板组在所述矢 量方向上形成曲度。
[93] 所述曲度为所述电容 ¾ 组中各个电容极板所形成的整体电容 极板向下凹出一定曲度, 此时具有一定曲度的电容极板组所产生的 探测电容强度大于初始电容 ¾ 组所产生的探测电容。
[94] 针对如何改变电容极板组中各个电容极板之间的相对位置这一 实施过程, 本申请提供了一实例对其进行描述, 如下:
[95] 参见图 5, 图 5为一电 组, 所述电 组中包括电容 la, 电 ^ ! 2a, 电 3a和电^¾ 4a; 当电 组 产生的探测电容不能对被测物体进行覆盖时, 改变各个电容极板组 之间的相对位置, 改变位置后的电容 ¾ 组整体形状如图 6所示, 此时, 电容极板 2a和电容极板 3a之间存在一向下凹的曲度, 由于 该曲度的存在, 改变整体形状后的电容^ ϋ组在相对被测物体的矢 量方向上产生的探测电容的强度大于初始电容极板组所产生的探测 电容强度。
[96] 本申请中提供的电场强度的调节方法, 在改变各个电容极板之 间相对位置这一执行过程的基础上, 提供了电场强度的调节方法的 另一实施过程, 如本申请实施例提供的图 3所示, 包括:
[97] 步骤 S301: 预设至少两组电^ ϋ组; 其中各个电^ ϋ组所 述产生探测电容的最大电容不同; [98] 步骤 S302: 判断当前电^ 组相对被检测物体产生的探测电 容阈值是否达到预设临界值; 如果是, 执行步骤 S303;
[99] 步骤 S303: 将所述当前电 板组切换为第一电^ *板组; 所 述第一 ί 组产生探测电容的最大电容大于当前电容极板组产生探 测电容的最大强度。
[100] 参见图 7, 设置有两组电 板组, 其中:
[101] 电 板 la, 电 ^¾! 2a, 电^ ϋ 3a和电^ *板 4a组成当 前电容极板, 产生探测电容对被测物体进行电场覆盖;
[102] 电容极板 lb, 电容极板 2b, 电容机 H 3b和电容 4b为第 一电容 ¾ 组, 在当前电容极板组产生探测电容对被测物体进行电 场覆盖的过程中, 第一电 板组为备用电容极板组, 不产生探测 电容, 当前电容极板组产生的探测电容达到预设临界值, 不能继续 对探测物体进行覆盖时, 停止当前电容极板组产生探测电容, 启用 第一电容¼^组产生探测电容对被测物体进行电场覆盖。
[103] 由图 7可知, 第一电 ^fe 组中电 板 2b和电^ ϋ 3b之 间形成一下凹曲度, 由于该下凹曲度的存在, 增大了电容极板之间 的电容感应, 从而增大了整体电容极板组产生的电场强度。
[104]
[105] 所述改变电容极板组中各个电容极板之间的连接关系包括, 如 本申请实施例图 4所示:
[106] 步骤 S401: 在所述电容极板组中选取至少两个电容极板;
[107] 步骤 S402: 对选取的各个电容 ¾ 进行关联, 组成第二电容极 板组; 所述第二电容极板组在所述矢量方向产生的探测电容能够覆 盖被测物体。
[108] 参见本申请实施例提供的图 8, 电^ *板 lc, 电 板 2c, 电 板 3c和电容极板 4c,组成一电容极板组,产生探测电容对被测 试物体 A进行电场覆盖; 当电容 组产生的探测电容达到预设临 界值, 不能对被测物体进行电场覆盖时, 改变电容极板 lc, 电容极 板 2c, 电^ *板 3c和电 板 4c之间的连接关系; [109] 其中一种改变可参见图 9, 图 9中各个电容 ¾ 之间的连接关 系的改变, 使得形成的新的电容极板组产生一下凹曲度, 这一原理 如上述改变各个电容极板之间的相对位置的执行过程相一致。
[110] 另一中实现方式可参见图 10, 针对不同的被测试物体可摆放多 个电^ ϋ, 图 10中, 从电^ Id至电^ ϋ 13d, 各自的摆 放位置不同, 如针对某一被测物体 A, 选择其中电 ¾ ld, 电容 极板 2d, 电容极板 3d和电容极板 4d组成一电容^ E a, 即可产 生探测电容对被测物体 A进行电场覆盖。
[111] 当更换一被测物体 Al, 而该被测物体相对电 板 Id, 电容 2d,电^ ϋ 3d和电 4d组成的电 且 a距离较远, 电容 ¾ 组 a产生的探测电容不能对被测物体 A1进行覆盖时, 重 新选取电容极板, 如选取电容机 H l0d, 电容 ¼^! 7d, 电容¾ 8(1 及电容极板 13d,组成第二电容 ¾!组;对被测物体 A1进行电场覆 盖。
[112] 步骤 S103: 调节所述电容 ¾ 组产生的强度。
[113] 通过以上各种实现方式, 可以达到对电容极板组产生的电场强 度的调节作用, 从而能够更好的被测物体进行探测, 获得更高的探 测精度和精准的探测距离。
[114] 与图 1所示一种电场强度的调节方法相对应, 参见图 11, 本申 请还提供一种电场强度的调节系统, 该系统可以包括:
[115] 检测单元 501和调节单元 502;
[116] 其中:
[117] 所述检测单元 501用于检测电容极板组产生的探测电容阈值是 否达到预设临界值;
[118] 所述调节单元 502用于当所述检测单元 501检测电容 ¼ ^组产 生的探测电容阈值达到预设临界值时, 改变所述电容极板组中各个 电容极板之间的相对位置或连接关系, 调节所述电容极板组产生的 电场强度。
[119] 在图 11的 上,本申请还提供了一种电场强度调节系统实施 例二的结构示意图, 如图 12所示, 其中:
[120] 检测单元 501包括:
[121] 确定子单元 503和判定子单元 504;
[122] 所述确定子单元 503用于确定被检测物体相对所述电容 ¾ 组 的矢量方向;
[123] 所述判定子单元 504用于当所述电容 ¾ 组产生的探测电容在 所述矢量方向上不能覆盖所述被检测物体时, 判定所述电容极板组 产生的探测电容阈值达到预设临界值。
[124] 调节单元 502包括:
[125] 第一调节子单元 505, 用于改变所述电容极板组的整体形状, 使所述电容极板组在所述矢量方向上形成曲度。
[126] 第二调节子单元 506, 用于在所述电容极板组中选取至少两个 电容极板; 对选取的各个电容极板组进行关联, 组成第二电容极板 组; 所述第二电容极板组在所述矢量方向上产生的探测电容能够覆 盖被测物体。
[127] 本申请一实施例所提供的电场强度调节系统中, 所述电容极板 至少为两层; 所述两层电容极板之间具有间隙; 所述两层电容极板 均具有多个触摸定位单元; 所述两层电容极板的其中一层的所述触 摸定位单元相对于另一层的所述触摸定位单元交错分布。
[128] 图 13 为本申请的一种电场强度的调节系统的电 的实施 例一的示意图。如图 13所示, 该装置至少包括电容 ¾ 101和电容 W 102。 图 13中, 电容机 ¾ 101和电容 102之间具有一定间 隙。 需要说明的是, 电容极板 101和电容 102上均可以具有多 个触摸定位单元(图 13中未示出)。 所述触摸定位单元可以是各种 形状, 例如菱形, 正方形等等。
[129] 图 14 为本申请的一种电场强度的调节系统的电 的实施 例一的俯视图。 由图 14可以看出, 电^ ϋ 101与电^ *板 102之 间是交错分布的。
[130] 下面对本实施例的原理进行详细说明。 [131] 首先, 作为非接触式输入装置, 其触摸定位单元的面积必须足 够大。 这是因为电^ *板面积越大, 电 的感应距离才越远, 才能够实现非接触式的电容感应输入。 但是, 电容极板的总面积是 一定的, 当单个触摸定位单元的面积增大后, 电容极板上所具有的 触摸定位单元的个数就会减少。 触摸定位单元的个数减少, 导致电 »^的定位精度下降。
[132] 如果在原有的电容极板下方增加一层新的电容极板, 这两个电 在进行电容感应输入的过程中, 不会相互影响。 不仅如此, 当两层电容极板交错分布时, 还能够提高非接触式输入装置的定位 精度。
[133] 图 15 为本申请的一种电场强度的调节系统的电»板实施例 一的触摸定位单元交错分布的一种方式的示意图。 图 15中,触摸定 位单元 311、 312和 313为上层的电容极板的触摸定位单元。 触摸定 位单元 321、 322和 323为下层的电容极板的触摸定位单元。上层的 电容极板的触摸定位单元与下层的电容极板的触摸定位单元交错分 布, 在图 3中表现为, 触摸定位单元 321的中点位于触摸定位单元 311和触摸定位单元 312之间, 触摸定位单元 322的中点位于触摸 定位单元 312和触摸定位单元 313之间。 按照一种比较简单的电容 感应方法, 即哪个触摸定位单元感应到的电容值最大, 就将该触摸 定位单元的位置认为是执行非接触式输入操作的位置。 如果只具有 一层电容极板时, 只能将图 3所示区域分割成 3个小的触摸区域, 即只能感应到非接触式输入操作的位置位于触摸定位单元 311 或 312或 313。 当采用图 3中的交错分布的两层电^ ^, 当非接触 式输入操作的位置位于触摸定位单元 311与 312之间时, 就可以被 触摸定位单元 321感应到。
[134] 因此, 本实施例的电场强度的调节系统的电 »板在感应非接 触式操作的前提下, 提高了对于操作位置的检测精度。
[135] 图 16 为本申请的一种电场强度的调节系统的电 实施例 二的示意图。电容极板 401与电容极板 402的触摸定位单元为矩形。 电容 ¾ 上各个触摸定位单元之间的连线在图 4中未示出。 本实施 例中, 电容极板 401与电容极板 402的触摸定位单元具有相同的分 布。 电容极板 401位于电容 402的上方, 与电容极板 402交错 分布。 如图 16中, 电 ¾ 401相对于电 ¾ 402沿 X方向错 开第一距离 dl, 沿 Y方向从开第二距离 d2。 并且, X方向与 Y方 向相互垂直。 其中, dl与 d2相等是一种较常用的方案。
[136] 图 17 为本申请的一种电场强度的调节系统的电»板实施例 三的示意图。图 17中示出了电 »板 401上的各个触摸定位单元之 间的连线。
[137] 实际应用中, 两层电容 ¾ 交错分布时, 比较常见的方案是所 述第一距离小于一个所述触摸定位单元沿所述第一方向的长度; 所 述第二距离小于一个所述触摸定位单元沿所述第二方向的长度。
[138] 图 18 为本申请的一种电场强度的调节系统的电^ ¼板的实施 例三中矩形触摸定位单元的长度示意图。 图 18中,触摸定位单元沿 所述第一方向的长度为 Ll, 沿所述第二方向的长度为 L2。 这种情 况下, 所述第二电容极板沿第一方向与所述第一电容极板错开的第 一距离 dl可以小于 Ll, 沿第二方向与所述第一电容极板错开的第 二距离 d2可以小于 L2。
[139] 图 19 为本申请的一种电场强度的调节系统的电»板的实施 例三中菱形触摸定位单元的长度示意图。 图 19中,触摸定位单元沿 所述第一方向的长度为 L3, 沿所述第二方向的长度为 L4。 这种情 况下, 所述第二电容极板沿第一方向与所述第一电容极板错开的第 一距离 dl可以小于 L3, 沿第二方向与所述第一电»板错开的第 二距离 d2可以小于 L4。
[140] 图 20 为本本申请的一种电场强度的调节系统的电»板的实 施例四的示意图。 如图 8所示, 该装置至少包括电容极板 101和电
102„ 图 20中, 电 ¾ 板 101和电 ¾ 板 102之间具有隔离 层 103。 隔离层 103的设置可以防止电容极板 101与电容极板 102 相接触, 提高本发明的非接触式输入装置的稳定性。
[141] 图 21 为本申请的一种电场强度的调节系统的电 的实施 例五的示意图。如图 21所示, 该装置至少包括电容极板 101和电容 极板 102。 图 9中, 电容极板 101上方设置有保护层 104。 保护层 104的设置可以防止其他物体对电容极板 101的划伤。
[142] 根据本申请的一种电场强度的调节系统的电容极板的实施例四 和实施例五, 可以得到新的实施例六。 图 22为本申请的一种电场强 度的调节系统的电 板的实施例六的示意图。如图 22所示, 该系 统中的电容极板的结构为: 至少包括电容极板 101和电容极板 102。 图 9中, 电容极板 101上方设置有保护层 104。 电容极板 101和电
102之间具有隔离层 103。
[143] 图 23 为本申请的一种电场强度的调节系统的电 的实施 例七的示意图。如图 23所示, 该系统的电 ¾ 板的结构中还包括电 ¾ 105; 所述电^ ϋ 105与电^ ϋ 102之间具有间隙;
[144] 所述电容极板 105与所述电容侧 101和所述电容极板 102的触 摸定位单元的分布相同;
[145] 所述电容 105沿第一方向与所述电容极板 102错开第一距 离, 沿第二方向与所述电 102错开第二距离; 所述第一方向 与所述第二方向垂直。 其中, 所述第一距离与所述第二距离相等是 比较常见的一种实现方式。
[146] 本实施例中, 由于增加了一层电容极板 105, 并且该电容极板 105与电 102交错分布, 可以进一步提高本系统非接触式输 入的定位精度。
[147] 图 24 为本本申请的一种电场强度的调节系统的电 的实 施例八的示意图。 如图 24所示, 该装置包括电容极板 101、 电容极 板 102和电^ 105。 图 24中, 电 101上方设置有保护层 104。 保护层 104的设置可以防止其他物体对电容极板 101的划伤。
[148] 图 25 为本申请的一种电场强度的调节系统的电 的实施 例九的示意图。 如图 25所示, 该装置包括电容极板 101、 电容极板 102和电容机 ¾ 105。电容 ¾ 101和电容机 H 102之间具有隔离层 103。 电容极板 102和电容极板 105之间也具有隔离层 103。 隔离层 103 的设置可以防止相邻的电容极板相接触, 提高本系统的非接触 式输入的稳定性。
[149] 图 26 为本申请的一种电场强度的调节系统的电 的实施 例十的示意图。 如图 26所示, 该装置包括电容极板 101、 电容极板 102和电容机 ¾ 105。电容 ¾ 101和电容机 H 102之间具有隔离层 103。 电容极板 102和电容极板 105之间也具有隔离层 103。 电容极 板 101上方设置有保护层 104。
[150] 可以看出, 本系统的非接触式输入具有的交错分布的电^ *板 越多, 其定位性能可以越精确。 并且, 相邻的两层电容极板之间均 可以设置隔离层, 最外层的电容 ¾ 上方都可以设置保护层。
[151] 本申请提供一种的非接触式输入装置, 该装置的结构图可以参 考图 13。 该装置至少包括电^ *板 101和电^ *板 102。 图 13中, 电容机 101和电容 ¾ 102之间具有一定间隙。 需要说明的是, 电容 101和电容 102上均可以具有多个触摸定位单元(图 13 中未示出)。 所述触摸定位单元可以是各种形状, 例如菱形, 正 方形等等。
[152] 本申请的非接触式输入装置实施例 1的俯视图可以参考图 14。 由图 14可以看出,电^ ϋ 101与电^ ϋ 102之间是交错分布的。
[153] 下面对本实施例的原理进行详细说明。
[154] 首先, 作为非接触式输入装置, 其触摸定位单元的面积必须足 够大。 这是因为电^ *板面积越大, 电 的感应距离才越远, 才能够实现非接触式的电容感应输入。 但是, 电容极板的总面积是 一定的, 当单个触摸定位单元的面积增大后, 电容极板上所具有的 触摸定位单元的个数就会减少。 触摸定位单元的个数减少, 导致电 »^的定位精度下降。
[155] 如果在原有的电容极板下方增加一层新的电容极板, 这两个电 在进行电容感应输入的过程中, 不会相互影响。 不仅如此, 当两层电容极板交错分布时, 还能够提高非接触式输入装置的定位 精度。
[156] 本申请的两电容极板的触摸定位单元交错分布的一种方式的示 意图可以参考图 15。 图 15中, 触摸定位单元 311、 312和 313为上 层的电容极板的触摸定位单元。触摸定位单元 321、 322和 323为下 层的电容极板的触摸定位单元。 上层的电容极板的触摸定位单元与 下层的电^ *板的触摸定位单元交错分布,在图 15中表现为,触摸 定位单元 321的中点位于触摸定位单元 311和触摸定位单元 312之 间, 触摸定位单元 322的中点位于触摸定位单元 312和触摸定位单 元 313之间。 按照一种比较简单的电容感应方法, 即哪个触摸定位 单元感应到的电容值最大, 就将该触摸定位单元的位置认为是执行 非接触式输入操作的位置。 如果只具有一层电容极板时, 只能将图 3所示区域分割成 3个小的触摸区域, 即只能感应到非接触式输入 操作的位置位于触摸定位单元 311或 312或 313。 当采用图 15中的 交错分布的两层电容极板后, 当非接触式输入操作的位置位于触摸 定位单元 311与 312之间时, 就可以被触摸定位单元 321感应到。
[157] 因此, 本实施例的非接触式输入装置, 在感应非接触式操作的 前提下, 提高了对于操作位置的检测精度。
[158] 本申请的非接触式输入装置实施例 2的示意图可以参考图 16。 电容 401与电容 402的触摸定位单元为矩形。 电容 ¾ 上 各个触摸定位单元之间的连线在图 4中未示出。 本实施例中, 电容 401与电容 402的触摸定位单元具有相同的分布。 电容极 板 401位于电容¾ 402的上方, 与电容极板 402交错分布。 如图 4中,电 401相对于电^ ϋ 402沿 X方向错开第一距离 dl, 沿 Y方向从开第二距离 d2。 并且, X方向与 Y方向相互垂直。 其 中, dl与 d2相等是一种较常用的方案。
[159] 本申请的非接触式输入装置实施例 2的电容极板的示意图可以 参考图 17。 图 17中示出了电容 ¾ 401上的各个触摸定位单元之 间的连线。
[160] 实际应用中, 两层电容 ¾ 交错分布时, 比较常见的方案是所 述第一距离小于一个所述触摸定位单元沿所述第一方向的长度; 所 述第二距离小于一个所述触摸定位单元沿所述第二方向的长度。
[161] 本申请的非接触式输入装置实施例 2的电容 ¾ 矩形触摸定位 单元的长度示意图可以参考图 18。 图 18中, 触摸定位单元沿所述 第一方向的长度为 Ll, 沿所述第二方向的长度为 L2。 这种情况下, 所述第二电容极板沿第一方向与所述第一电容极板错开的第一距离 dl 可以小于 Ll, 沿第二方向与所述第一电容极板错开的第二距离 d2可以小于 L2。
[162] 本申请的非接触式输入装置实施例 2的电容极板菱形触摸定位 单元的长度示意图可以参考图 19。 图 19中, 触摸定位单元沿所述 第一方向的长度为 L3, 沿所述第二方向的长度为 L4。 这种情况下, 所述第二电容极板沿第一方向与所述第一电容极板错开的第一距离 dl 可以小于 L3, 沿第二方向与所述第一电容极板错开的第二距离 d2可以小于 L4。
[163] 本申请的非接触式输入装置实施例 2的示意图可以参考图 20。 如图 20所示, 该装置至少包括电容极板 101和电容极板 102。 图 20 中, 电容机 101和电容机 H 102之间具有隔离层 103。 隔离层 103 的设置可以防止电容极板 101与电容极板 102相接触, 提高本发明 的非接触式输入装置的稳定性。
[164] 本申请的非接触式输入装置实施例 3的示意图可以参考图 21。 如图 21所示, 该装置至少包括电容极板 101和电容极板 102。 图 9 中, 电容极板 101上方设置有保护层 104。 保护层 104的设置可以 防止其他物体对电容极板 101的划伤。
[165] 根据本本申请的非接触式输入装置实施例 2和实施例 3, 可以 得到新的实施例 4。 本申请的非接触式输入装置实施例 4的示意图 可以参考图 22。 如图 22所示, 该装置至少包括电容极板 101和电 板 102。 图 22中, 电容极板 101上方设置有保护层 104。 电容 极板 101和电容极板 102之间具有隔离层 103。
[166] 本申请的非接触式输入装置实施例 5的示意图可以参考图 23。 如图 23所示, 该装置还包括电容极板 105; 所述电容极板 105与电
102之间具有间隙;
[167] 所述电容机 H 105与所述电容侧 101和所述电容 102的触 摸定位单元的分布相同;
[168] 所述电容 105沿第一方向与所述电容极板 102错开第一距 离, 沿第二方向与所述电 102错开第二距离; 所述第一方向 与所述第二方向垂直。 其中, 所述第一距离与所述第二距离相等是 比较常见的一种实现方式。 [169] 本实施例中, 由于增加了一层电容极板 105, 并且该电容极板 105与电容极板 102交错分布, 可以进一步提高本申请的非接触式 输入装置的定位精度。
[170] 本申请的非接触式输入装置实施例 6的示意图可以参考图 24。 如图 24所示, 该装置包括电容极板 101、 电容极板 102和电容极板 105。 图 24中, 电 101上方设置有保护层 104。 保护层 104 的设置可以防止其他物体对电容极板 101的划伤。
[171] 本申请的非接触式输入装置实施例 7的示意图可以参考图 25。 如图 25所示, 该装置包括电容极板 101、 电容极板 102和电容极板 105。 电^ ϋ 101和电 102之间具有隔离层 103。 电^¾ 102和电容极板 105之间也具有隔离层 103。隔离层 103的设置可以 防止相邻的电容极板相接触, 提高本申请的非接触式输入装置的稳 定性。
[172] 本申请的非接触式输入装置实施例 8的示意图可以参考图 26。 如图 26所示, 该装置包括电容极板 101、 电容极板 102和电容极板 105。 电^ ϋ 101和电 102之间具有隔离层 103。 电^¾ 102和电容极板 105之间也具有隔离层 103。电容极板 101上方设置 有保护层 104。
[173] 可以看出, 本申请的非接触式输入装置具有的交错分布的电容 越多, 其定位性能可以越精确。 并且, 相邻的两层电容极板之 间均可以设置隔离层, 最外层的电容极板上方都可以设置保护层。
[174] 本发明还公开了一种电子设备。 所述电子设备包括本方案中的 非接触式输入装置。
[175] 需要说明的是, 本说明书中的各个实施例均采用递进的方式描 述, 每个实施例重点说明的都是与其他实施例的不同之处, 各个实 施例之间相同相似的部分互相参见即可。 对于装置类实施例而言, 由于其与方法实施例基本相似, 所以描述的比较简单, 相关之处参 见方法实施例的部分说明即可。
[176] 最后, 还需要说明的是, 在本文中, 诸如第一和第二等之类的 关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开 来, 而不一定要求或者暗示这些实体或操作之间存在任何这种实际 的关系或者顺序。 而且, 术语 "包括"、 "包含" 或者其任何其他变 体意在涵盖非排他性的包含, 从而使得包括一系列要素的过程、 方 法、 物品或者设备不仅包括那些要素, 而且还包括没有明确列出的 其他要素, 或者是还包括为这种过程、 方法、 物品或者设备所固有 的要素。 在没有更多限制的情况下, 由语句 "包括一个…… " 限定 的要素, 并不排除在包括所述要素的过程、 方法、 物品或者设备中 还存在另外的相同要素。
[177] 为了描述的方便, 描述以上装置时以功能分为各种单元分别描 述。 当然, 在实施本申请时可以把各单元的功能在同一个或多个软 件和 /或硬件中实现。
[178] 通过以上的实施方式的描述可知, 本领域的技术人员可以清楚 地了解到本申请可借助软件加必需的通用硬件平台的方式来实现。 基于这样的理解, 本申请的技术方案本质上或者说对现有技术做出 贡献的部分可以以软件产品的形式体现出来, 该计算机软件产品可 以存储在存储介质中, 如 ROM/RAM、 磁碟、 光盘等, 包括若干指 令用以使得一台计算机设备(可以是个人计算机, 服务器, 或者网 络设备等 )执行本申请各个实施例或者实施例的某些部分所述的方 法。
[179] 以上对本申请所提供的一种电场强度的调节方法及系统进行了 详细介绍, 本文中应用了具体个例对本申请的原理及实施方式进行 了阐述, 以上实施例的说明只是用于帮助理解本申请的方法及其核 心思想; 同时, 对于本领域的一般技术人员, 依据本申请的思想, 在具体实施方式及应用范围上均会有改变之处, 综上所述, 本说明 书内容不应理解为对本申请的 P艮制。

Claims

权 利 要 求
1、 一种电场强度的调节方法, 其特征在于, 包括:
检测电容 ¾ 组产生的探测电容阈值达到预设临界值时, 改变所述电容极板组中各个电容极板之间的相对位置或连接 关系,
调节所述电容极板组产生的电场强度。
2、 根据权利要求 1所述的方法, 其特征在于, 所述检测电容 极板组产生的探测电容阈值达到预设临界值包括:
确定被检测物体相对所述电容 ¾ 组的矢量方向;
当所述电容极板组产生的探测电容在所述矢量方向上不能覆 盖所述被检测物体时,判定所述电容极板组产生的探测电容阈值达 到预设临^ Hi。
3、 根据权利要求 2所述的方法, 其特征在于, 所述改变电容 W 中各个电 板之间的相对位置包括:
改变所述电容极板组的整体形状,使所述电容 ¾ 组在所述矢 量方向上形成曲度。
4、 根据权利要求 1所述的方法, 其特征在于, 在执行所述方 法前, 还包括:
预设至少两组电容¾ 组; 其中各个电容极板组所产生探测电 容的最大电容不同。
5、 根据权利要求 4所述的方法, 其特征在于, 还包括: 当检测到当前电容极板组相对被检测物体产生的探测电容阈 值达到预设临 时,
将所述当前电 组切换为第一电 »板组; 所述第一极板 组产生探测电容的最大电容大于当前电容极板组产生探测电容的 最大电容。
6、 根据权利要求 2所述的方法, 其特征在于, 所述改变电容 极^且中各个电 板之间的连接关系包括: 在所述电容极板组中选取至少两个电容极板;
对选取的各个电容 ¾ 进行关联, 组成第二电容 ¾!组; 所述第二电容极板组在所述矢量方向上产生的探测电容能够 覆盖被测物体。
7、 一种电场强度的调节系统, 其特征在于, 包括:
检测单元, 用于检测电容 ¾ 组产生的探测电容阈值是否达到 预设临 ^Hi;
调节单元, 用于当所述检测单元检测电容极板组产生的探测电 容阈值达到预设临^ Hi时, 改变所述电 »板组中各个电 »板之 间的相对位置或连接关系, 调节所述电容 组产生的电场强度。
8、 根据权利要求 7所述的系统, 其特征在于, 所述检测单元 包括:
确定子单元, 用于确定被检测物体相对所述电容极板组的矢量 方向;
判定子单元, 用于当所述电容极板组产生的探测电容在所述矢 量方向不能覆盖所述被检测物体时, 判定所述电容 ¾ 组产生的探 测电容阈值达到预设临界值。
9、 根据权利要求 8所述的系统, 其特征在于, 所述调节单元 包括:
第一调节子单元, 用于改变所述电容极板组的整体形状, 使所 述电容极板组在所述矢量方向上形成曲度。
10、 根据权利要求 8所述的系统, 其特征在于, 所述调节单元 包括:
第二调节子单元, 用于在所述电容¾ 组中选取至少两个电容 极板; 对选取的各个电容极板组进行关联, 组成第二电容 ¾!组; 所述第二电容极板组在所述矢量方向上产生的探测电容能够覆盖 被测物体。
11、 根据权利要求 7所述的系统, 其特征在于, 所述电容¼^ 至少为两层; 所述两层电容极板之间具有间隙; 所述两层电容极板 均具有多个触摸定位单元; 所述两层电容极板的其中一层的所述触 摸定位单元相对于另一层的所述触摸定位单元交错分布。
12、 根据权利要求 7所述的系统, 其特征在于, 所述两层电容 极板的其中一层的所述触摸定位单元相对于另一层的所述触摸定 位单元交错分布, 包括:
所述两层电容极板分别为第一电容 ¾ 和第二电容极板; 所述第一电容极板与所述第二电容极板的触摸定位单元的分 布相同;
所述第二电容极板沿第一方向与所述第一电容极板错开第一 距离, 沿第二方向与所述第一电^ ϋ错开第二距离; 所述第一方 向与所述第二方向垂直。
13、 根据权利要求 12所述的系统, 其特征在于, 所述第一距 离与所述第二距离相等。
14、 根据权利要求 12所述的系统, 其特征在于, 所述第一距 离小于一个所述触摸定位单元沿所述第一方向的长度; 所述第二距 离小于一个所述触摸定位单元沿所述第二方向的长度。
15、 根据权利要求 11-14任一项所述的系统, 其特征在于, 所 述触摸定位单元为菱形或矩形。
16、 根据权利要求 11-14任一项所述的系统, 其特征在于, 所 述两层电^ ϋ之间具有隔离层。
17、 根据权利要求 11-14任一项所述的系统, 其特征在于, 所 述两层电容极板的上方设置有保护层。
18、 根据权利要求 12所述的系统, 其特征在于, 所述电 » 板还包括: 第三电容极板; 所述第三电容极板与所述第二电容极板 之间具有间隙;
所述第三电容极板与所述第一电容侧和所述第二电容极板的 触摸定位单元的分布相同;
所述第三电容极板沿第一方向与所述第二电容极板错开第一 距离, 沿第二方向与所述第二电^ 错开第二距离; 所述第一方 向与所述第二方向垂直。
19、 根据权利要求 18所述的系统, 其特征在于, 所述第一距 离与所述第二距离相等。
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CN101608928A (zh) * 2009-07-14 2009-12-23 重庆理工大学 一种基于广义电容器进行待测物理量检测的方法及检测系统
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GB2595079B (en) * 2018-11-30 2023-02-08 Sightglass Vision Inc Light scattering lens for treating myopia and eyeglasses containing the same

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